Method for repairing electronic device with light emitting member

Abstract

This invention provides a method for repairing an electronic device, comprising providing an electronic device including a circuit board, a first electronic component, and a light-emitting element, wherein the circuit board has an upper surface and a lower surface, the first electronic component is disposed on the upper surface, and the light-emitting element is disposed on the lower surface. Next, the first electronic component is removed from the upper surface, and a second electronic component is provided to replace the removed first electronic component, and the second electronic component is fixed to the upper surface. The light-emitting element includes a light-transmitting portion, and during the step of fixing the second electronic component, the second electronic component is heated to reduce the amount of oxygen in contact with the light-transmitting portion.

Description

Maintenance Method for Electronic Device The present invention relates to a maintenance method and a maintenance device. More specifically, the present invention relates to a maintenance method and a maintenance device for an electronic device. Solid-state light-emitting elements, such as light-emitting diodes (LEDs), have good optoelectronic characteristics, such as low power consumption, low heat generation, long operating life, impact resistance, small size, short response time, and the ability to emit colored light within a specific wavelength range. Therefore, they are suitable for applications in household appliances, indicator lights of instruments, and backlights of displays. With the progress of optoelectronic technology, the progress of solid-state light-emitting elements in terms of luminous efficiency, service life, and brightness has enabled them to be used as pixels of displays. Therefore, the importance of the maintenance technology for displays with solid-state light-emitting elements as pixels is gradually increasing. The present invention provides a maintenance method for an electronic device, including providing an electronic device, where the electronic device includes a circuit board, a first electronic component, and a light-emitting component. The circuit board has an upper surface and a lower surface. The first electronic component is disposed on the upper surface, and the light-emitting component is disposed on the lower surface. Then, the first electronic component is removed from the upper surface, a second electronic component is provided to replace the removed first electronic component, and the second electronic component is fixed on the upper surface. The light-emitting component includes a light-transmitting portion, and in the step of fixing the second electronic component, the second electronic component is heated and the amount of oxygen in contact with the light-transmitting portion of the light-emitting component is reduced. The present application provides a maintenance device for maintaining an electronic device. The maintenance device includes a housing, a gas controller, and a connecting pipe. The housing includes an accommodating space, a plurality of wall surfaces, and a perforation. The wall surfaces surround the accommodating space. The perforation is formed on one of the aforementioned wall surfaces and communicates with the accommodating space. The connecting pipe connects the gas controller and the perforation. The following describes the maintenance method and the maintenance device for the electronic device of the present invention. However, it can be easily understood that the present invention provides many suitable inventive concepts that can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific manner and are not intended to limit the scope of the present invention. Please refer to FIG. 1 and FIG. 3. FIG. 3 shows a top view of a maintenance device M according to an embodiment of the present invention, and FIG. 1 shows a sectional view taken along the dashed line AA' in FIG. 3. As shown in FIG. 1, the maintenance device M includes a housing 100, a gas controller 200, and a connecting pipe 300 connecting the housing 100 and the gas controller 200. The housing 100 may include a bottom 110 and a plurality of walls 120, wherein the plurality of walls 120 are connected to the edge of the bottom 110 and extend in a direction away from the bottom 110. The area surrounded by the plurality of walls 120 and the bottom 110 forms an accommodation space 130 having an opening. One of the plurality of walls 120 has a perforation 140, the perforation 140 communicates with the accommodation space 130, and the connecting pipe 300 is connected to the housing 100 through the perforation 140. The gas controller 200 can extract the air in the accommodation space 130 or supply other gases into the accommodation space 130 through the connecting pipe 300 and the perforation 140. For example, the gas controller 200 can be a pump or a gas supplier. FIG. 2 shows a three-dimensional schematic view of the housing 100 in FIG. 1. As shown in FIGS. 2 to 3, the plurality of walls 120A to 120D form a closed accommodation space 130. The housing 100 further includes a positioning groove 150 and a plurality of connection holes 160. The positioning groove 150 is located at the opening of the accommodation space 130 and is connected to the accommodation space 130, wherein the depth D1 of the positioning groove 150 is less than the depth D2 of the accommodation space 130 (as shown in FIG. 1) for accommodating an electronic device E (as shown in FIG. 4A). The plurality of connection holes 160 are located on the plurality of walls 120A to 120D and at the corners of the accommodation space 130 for connecting with fixing elements (as shown in FIG. 4A) to fix the electronic device E. The following describes the steps of using the foregoing maintenance device M to maintain an electronic device E. Please refer to FIGS. 4A and 4B. FIG. 4A shows a top view of the structure after fixing the electronic device to the housing in an embodiment of the present invention, and FIG. 4B shows a sectional view taken along the dashed line BB' in FIG. 4A. First, the user can use a fixing element F to fix the electronic device E to be maintained to the housing 100. Specifically, the fixing element F can be connected to the connection hole 160 of the maintenance device M, and a part of the fixing element F can contact the electronic device E above the electronic device E to fix the electronic device E between the fixing element F and the wall 120 of the maintenance device M, so that the electronic device E is fixed to the housing 100, wherein the fixing element F includes a screw or a rivet. The electronic device E may include a circuit board 400, a first electronic component 500, and at least one light-emitting component 600. The first electronic component 500 may be an integrated circuit (IC), and the light-emitting component 600 may be a light-emitting diode (LED) package having a light-emitting diode die (not shown) and a light-transmitting portion 610. The light-transmitting portion 610 includes a transparent or translucent encapsulating colloid or a material that can be penetrated by the light emitted by the light-emitting diode die. In other embodiments, the light-emitting component 600 includes a light-emitting diode die. The circuit board 400 may have an upper surface 410 and a lower surface 420, where the upper surface 410 faces the lower surface 420, and the first electronic component 500 and the light-emitting component 600 are respectively disposed on the upper surface 410 and the lower surface 420. When the electronic device E is disposed on the cover body 100, the circuit board 400 may shield the opening of the accommodating space 130, and the lower surface 420 of the circuit board 400 faces the accommodating space 130, and the light-emitting component 600 is accommodated in the accommodating space 130. As shown in FIG. 3, the positioning grooves 150 on the cover body 100 have widths W1 and W2. As shown in FIG. 4A, the dimensions of the positioning grooves 150 are substantially the same as those of the circuit board 400 in the electronic device E. For example, the width W1 of the positioning groove 150 is the same as the width of the circuit board 400. Therefore, when the electronic device E is placed on the cover body 100, the circuit board 400 can be directly positioned in the positioning grooves 150, which is beneficial for fixing the electronic device E using the fixing element F. In one embodiment, the position of at least one light-emitting component 600 on the lower surface 420 of the circuit board 400 corresponds to the position of the first electronic component 500 on the upper surface 410 of the circuit board 400. Please refer to FIG. 4C. After the electronic device E is fixed to the cover body 100, the faulty first electronic component 500 can be removed from the upper surface 410 of the circuit board 400. The method of removing the first electronic component 500 includes heating for desoldering or mechanical grinding. Next, as shown in FIG. 4D, a second electronic component 700 is fixed to the upper surface 410 of the circuit board 400 by soldering. The second electronic component 700 is used to replace the aforementioned first electronic component 500. Therefore, the second electronic component 700 is the same as the first electronic component 500, and its installation position will be the same as the position before the first electronic component 500 is removed. When the second electronic component 700 is soldered onto the circuit board 400, the second electronic component 700 will be heated, and this thermal energy will be conducted through the circuit board 400 to the light-emitting component 600 located on the lower surface 420. Therefore, while the second electronic component 700 is being installed, the gas controller 200 can supply an inert gas G into the accommodation space 130 through the connecting pipe 300 and the through hole 140, so that the light-emitting component 600 is surrounded by the inert gas G. Since the surrounding environment of the light-emitting component 600 is filled with the inert gas G, the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting component 600 can be reduced, avoiding color changes in the light-transmitting portion 610 caused by oxidation of the light-transmitting portion 610. For example, the light transmittance of the light-transmitting portion 610 decreases, or the light-transmitting portion 610 turns into a darker color such as yellow, gray, or black (the same hereinafter). In one embodiment, the temperature sensor 8 can be used to sense the temperature between the second electronic component 700 and the circuit board 400. When the measured temperature is greater than a preset temperature (such as 90°C or 25°C), the gas controller 200 can start supplying the inert gas G to continuously surround the light-emitting component 600. After the soldering process of the second electronic component 700 is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the gas controller 200 stops supplying the inert gas G. In one embodiment, when the inert gas G is output from the gas controller 200, the temperature at the junction of the connecting pipe 300 and the gas controller 200 can be less than or equal to 0°C. Please refer to FIG. 5. In another embodiment, when the second electronic component 700 is fixed on the upper surface 410 of the circuit board 400 by soldering, the gas controller 200 can extract the air in the accommodation space 130 through the connecting pipe 300 and the through hole 140 to create a vacuum in the accommodation space 130, reducing the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting component 600, and avoiding the situation of color change caused by oxidation of the light-transmitting portion 610 when the second electronic component 700 is soldered. Similarly, in one embodiment, the temperature sensor 8 can be used to sense the temperature between the second electronic component 700 and the circuit board 400. When the measured temperature is greater than a preset temperature (such as 90°C or 25°C), the gas controller 200 can start extracting the air in the accommodation space 130. After the soldering process of the second electronic component 700 is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the gas controller 200 stops extracting the air in the accommodation space 130. Please refer to FIG. 6. In another embodiment, the electronic device E can replace the first electronic component 500 with the second electronic component 700 when separated from the maintenance device M. It should be noted that when the second electronic component 700 is soldered onto the circuit board 400, the maintenance device M can spray the inert gas G from the opening of the accommodation space 130 and disperse it in the surrounding environment of the light-emitting component 600 when the light-emitting component 600 is not accommodated in the accommodation space 130, so as to reduce the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting component 600 and avoid the situation of color change caused by oxidation of the light-transmitting portion 610. In one embodiment, the temperature sensor 8 can be used to sense the temperature between the second electronic component 700 and the circuit board 400. When the measured temperature is greater than a preset temperature (such as 90 °C or 25 °C), the gas controller 200 can start to supply the inert gas G to continuously surround the light-emitting component 600. After the soldering process of the second electronic component 700 is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the gas controller 200 stops supplying the inert gas G. In one embodiment, when the inert gas G is output from the gas controller 200, the temperature at the junction of the connecting pipe 300 and the gas controller 200 can be less than or equal to 0 °C. Please refer to FIG. 7. In another embodiment, when the second electronic component 700 is soldered onto the circuit board 400, the user can use a nozzle N to spray the inert gas G onto the light-emitting component 600, so that the light-emitting component 600 is surrounded by the inert gas G, to reduce the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting component 600 and avoid the situation of color change caused by oxidation of the light-transmitting portion 610. In one embodiment, the temperature sensor 8 can be used to sense the temperature between the second electronic component 700 and the circuit board 400. When the measured temperature is greater than a preset temperature (such as 90 °C or 25 °C), the user can use the nozzle N to spray the inert gas G onto the light-emitting component 600. After the soldering process of the second electronic component 700 is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the user can stop spraying the inert gas G. In one embodiment, when the inert gas G is output from the gas controller 200, the temperature at the junction of the connecting pipe 300 and the gas controller 200 can be less than or equal to 0 °C. Please refer to FIG. 8. In another embodiment, when the second electronic component 700 is soldered onto the circuit board 400, the user can attach a tape 9 to the lower surface 420 of the circuit board 400 to cover the light-emitting component 600, where the tape 9 has a material layer T and an adhesive element H. When the tape 9 covers the light-emitting component 600, the adhesive element H can cover and surround the outer surface of the light-emitting component 600. The tape 9 includes a silicone tape or a photo-dissociable tape. Thereby, the adhesive element H can reduce the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting component 600, and the light-transmitting portion 610 of the light-emitting component 600 can avoid being oxidized and causing color change. In another embodiment, as shown in FIG. 4B, when the step of removing the faulty first electronic component 500 is by heat desoldering, the methods of FIGS. 4C to 8 may be adopted to surround the light-emitting element 600 with an inert gas G, or make the surrounding environment of the light-emitting element 600 in a vacuum state, or isolate the light-emitting element 600 from the air, so as to reduce the amount of oxygen in contact with the light-transmitting portion 610 of the light-emitting element 600 and avoid the color change of the light-transmitting portion 610 caused by the oxidation of the light-transmitting portion 610. Please refer to FIG. 9. In another embodiment, when a user replaces a light-emitting element 600 with a new light-emitting element 600', when the light-emitting element 600' is soldered to the circuit board 400, the user can use a nozzle N to eject an inert gas G onto the light-emitting element 600, so that the new light-emitting element 600' and the surrounding light-emitting elements 600 are surrounded by the inert gas G, so as to reduce the amount of oxygen in contact with the light-transmitting portions 610 of the light-emitting elements 600 and 600' and avoid the situation of color change caused by the oxidation of the light-transmitting portions 610 of the light-emitting elements 600 and 600'. The temperature sensor 8 can be used to sense the temperature between the light-emitting element 600' and the circuit board 400. When the temperature measured by the temperature sensor 8 is greater than a preset temperature (such as 90°C or 25°C), the user can use the nozzle N to eject the inert gas G onto the light-emitting elements 600 and 600'. After the soldering process of the light-emitting element 600' is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the user can stop ejecting the inert gas G. In one embodiment, when the inert gas G is output from a gas controller 200 (not shown in the figure), the temperature at the junction of the connecting pipe 300 and the gas controller 200 is less than or equal to 0°C. Referring to FIG. 10, in another embodiment, the user replaces the light-emitting element 600 with a new light-emitting element 600', and welds the light-emitting element 600' to the circuit board 400 by a heating process. The heating process includes providing a laser source 800 to generate a laser beam 800B to heat the solder (not shown) between the light-emitting element 600' and the circuit board 400, so as to fix and electrically connect the light-emitting element 600' to the circuit board 400. Referring to FIG. 11, in an embodiment, the area where the laser beam 800B is projected on the circuit board 400 is herein referred to as the laser beam area 800A, and the area where the light-emitting element 600' is projected on the circuit board 400 is herein referred to as the light-emitting element area 600A. The laser beam area 800A is larger than the light-emitting element area 600A, and the laser beam area 800A does not cover the light-emitting element 600 adjacent to the light-emitting element 600'. As shown in FIGS. 10 and 11, since the laser beam area 800A is larger than the light-emitting element area 600A, a part of the laser beam 800B directly irradiates the circuit board 400, so that the solder (not shown) between the light-emitting element 600' and the circuit board 400 can be directly heated, and the time of the heating process can be reduced. As shown in FIG. 10, during the heating process, a nozzle N is selectively provided to eject an inert gas G onto the light-emitting element 600, so that the new light-emitting element 600' and the surrounding light-emitting elements 600 are surrounded by the inert gas G, so as to reduce the amount of oxygen in contact with the light-transmitting portions 610 of the light-emitting elements 600 and 600', and avoid the oxidation of the light-transmitting portions 610 of the light-emitting elements 600 and 600' resulting in color change. The temperature sensor 8 obtains the temperature between the light-emitting element 600' and the circuit board 400 by means of infrared remote measurement. When the temperature measured by the temperature sensor 8 is greater than a preset temperature (such as 90°C or 25°C), the user can use the nozzle N to eject the inert gas G onto the light-emitting elements 600 and 600'. After the welding process of the light-emitting element 600' is completed, when the temperature measured by the temperature sensor 8 is lower than the preset temperature, the user can stop ejecting the inert gas G. In an embodiment, when the inert gas G is output from the gas controller 200 (not shown), the temperature at the junction of the connecting pipe 300 and the gas controller 200 is less than or equal to 0°C. The features among the foregoing embodiments can be arbitrarily mixed and used as long as they do not violate the inventive spirit or conflict with each other. The present invention further provides a maintenance device for maintaining an electronic device. The foregoing maintenance device includes a housing, a gas controller, and a connecting pipe. The housing includes an accommodation space, a plurality of wall surfaces, and a perforation. The wall surfaces surround the accommodation space. The perforation is formed on one of the foregoing wall surfaces and communicates with the accommodation space. The connecting pipe connects the gas controller and the perforation. Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions, and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the relevant technical field can understand from the disclosed content of the present invention the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future. As long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combinations of each patent application scope and embodiment. Although the present invention has been disclosed above with several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope defined in the appended patent application scope. In addition, each patent application scope constitutes an independent embodiment, and the combinations of various patent application scopes and embodiments are all within the scope of the present invention. 8: Temperature sensor 9: Tape 100: Cover body 110: Bottom 120, 120A, 120B, 120C, 120D: Wall surface 130: Accommodation space 140: Perforation 150: Positioning groove 160: Connection hole 200: Gas controller 300: Connecting pipe 400: Circuit board 410: Upper surface 420: Lower surface 500: First electronic component 600, 600’: Light-emitting element 610: Translucent part 700: Second electronic component AA’, BB’: Dashed line D1: Depth D2: Depth E: Electronic device F: Fixing element G: Inert gas H: Adhesive element M: Maintenance equipment N: Nozzle T: Material layer W1: Width W2: Width FIG. 1 shows a cross-sectional view of a maintenance device according to an embodiment of the present invention. FIG. 2 shows a perspective view of a cover according to an embodiment of the present invention. FIG. 3 shows a top view of a maintenance device according to an embodiment of the present invention. FIG. 4A shows a top view of a structure after an electronic device is fixed to the cover according to an embodiment of the present invention. FIG. 4B shows a cross-sectional view of a structure after an electronic device is fixed to the cover according to an embodiment of the present invention. FIG. 4C shows a cross-sectional view of a structure after a first electronic component is removed from the upper surface of a circuit board according to an embodiment of the present invention. FIG. 4D shows a cross-sectional view of a structure after a second electronic component is disposed on the upper surface of a circuit board and an inert gas is dispersed in the surrounding environment of a light-emitting element according to an embodiment of the present invention. FIG. 5 shows a cross-sectional view of a structure after a second electronic component is disposed on the upper surface of a circuit board and air in the surrounding environment of a light-emitting element is extracted according to another embodiment of the present invention. FIG. 6 shows a cross-sectional view of a structure after a second electronic component is disposed on the upper surface of a circuit board and an inert gas is dispersed in the surrounding environment of a light-emitting element according to another embodiment of the present invention. FIG. 7 shows a cross-sectional view of a structure after a second electronic component is disposed on the upper surface of a circuit board and an inert gas is dispersed in the surrounding environment of a light-emitting element according to another embodiment of the present invention. FIG. 8 shows a cross-sectional view of a structure after a second electronic component is disposed on the upper surface of a circuit board and a material layer is attached to the lower surface of the circuit board using an adhesive element according to another embodiment of the present invention. FIG. 9 shows a cross-sectional view of a structure after a light-emitting element is soldered to a circuit board and an inert gas is dispersed in the surrounding environment of the light-emitting element according to another embodiment of the present invention. FIG. 10 shows a cross-sectional view of a structure after a light-emitting element is heat-soldered to a circuit board using a laser beam and an inert gas is dispersed in the surrounding environment of the light-emitting element according to another embodiment of the present invention. FIG. 11 shows a top view of FIG. 10. 8: Temperature sensor 100: Cover 130: Accommodating space 140: Perforation 160: Connection hole 200: Gas controller 300: Connecting pipe 400: Circuit board 410: Upper surface 420: Lower surface 600: Light-emitting element 610: Light-transmitting part 700: Second electronic component E: Electronic device F: Fixing element G: Inert gas

Claims

1. A method for repairing an electronic device with a light-emitting element, comprising: An electronic device is provided, comprising a circuit board, a first electronic component, and a light-emitting element, wherein the circuit board has an upper surface and a lower surface, the first electronic component is disposed on the upper surface, and the light-emitting element is disposed on the lower surface; the first electronic component is removed; a second electronic component is provided to replace the removed first electronic component; and the second electronic component is fixed to the upper surface, wherein the light-emitting element includes a light-transmitting portion, wherein, in the fixing step, the second electronic component is heated and the amount of oxygen in contact with the light-transmitting portion is reduced.

2. A method for repairing an electronic device with a light-emitting element as claimed in claim 1, wherein the method for reducing the amount of oxygen in contact with the light-transmitting part includes extracting air from the environment surrounding the light-emitting element.

3. A method for repairing an electronic device with a light-emitting element as claimed in claim 1, wherein the method for reducing the amount of oxygen in contact with the light-transmitting part includes dispersing an inert gas in the environment surrounding the light-emitting element.

4. A method for repairing an electronic device with a light-emitting element as claimed in claim 1, wherein the method for reducing the amount of oxygen in contact with the light-transmitting part includes covering the light-emitting element with a material layer.

5. A method for repairing an electronic device with a light-emitting element as described in claim 4, wherein the material layer includes silicone.

6. A method for repairing an electronic device with a light-emitting element as claimed in claim 4, wherein the material layer is attached to the lower surface by an adhesive element, and the adhesive element covers the light-emitting element.

7. A method for repairing an electronic device with a light-emitting element as described in claim 1, wherein methods for reducing the amount of oxygen in contact with the light-transmitting part include: A cover is provided, wherein the cover has a receiving space; The circuit board is placed on the cover, and the light-emitting element is placed in the receiving space; And to extract air from the containment space or to provide an inert gas into the containment space.

8. A method for repairing an electronic device with a light-emitting element as claimed in claim 7, wherein when the circuit board is placed on the cover, the circuit board blocks the opening of the receiving space.

9. A method for repairing an electronic device with a light-emitting element as claimed in claim 1, wherein the position of the first electronic element on the upper surface substantially corresponds to the position of the light-emitting element on the lower surface.

10. A method for repairing an electronic device with a light-emitting element as claimed in claim 1, wherein the first electronic element and the second electronic element are of the same type.

Images