Dressing structural part, conditioning assembly, and manufacturing method thereof

Abstract

This invention discloses a grinding structure, a dressing assembly, and a method for manufacturing the dressing assembly. The grinding structure includes a porous metal structure, multiple abrasive particles, and metal solder. The multiple abrasive particles are dispersedly embedded in the porous metal structure, with each abrasive particle partially exposed. The metal solder fills and penetrates into the porous metal structure and bonds with both the porous metal structure and the multiple abrasive particles. The materials constituting the porous metal structure and the materials constituting the metal solder have at least one of the same constituent elements.

Description

[Technical Field]

[0001] This invention relates to a grinding structure, a dressing component, and a method for manufacturing the dressing component, and particularly to a grinding structure, a dressing component, and a method for manufacturing the dressing component suitable for dressing polishing pads. [Previous Technology]

[0002] In chemical-mechanical polishing (CMP) processes or high-precision polishing processes, polishing pads are typically used in conjunction with polishing slurries to polish the surfaces of workpieces such as semiconductor wafers, optical components, or glass. Generally, the surface of the polishing pad is dressed using a conditioner. The conditioner uses its abrasive layer to remove waste material remaining on the polishing pad during polishing and restores the roughness of the polishing pad to maintain stable polishing quality.

[0003] In the existing process of manufacturing the polishing layer, multiple polishing particles are fixed to the working surface of a substrate using brazing filler metals through high-temperature hard soldering. However, due to the boiling and vaporization of the solder at high temperatures (approximately 1000 °C), the polishing particles are affected by the boiling of the solder and constantly move or flip, resulting in inconsistent heights of the polishing particles fixed on the working surface, affecting product quality and efficiency. In addition, during the cooling process of high-temperature hard soldering, the different coefficients of thermal expansion of the materials (i.e., polishing particles, solder, and substrate) can easily cause the solder to crack, leading to the detachment of polishing particles and accidental scratching of the wafer during the polishing pad preparation process.

[0004] In addition, in the prior art, polymers such as epoxy resin are used to bond abrasive particles to a substrate. However, the epoxy resin, the substrate (material such as stainless steel), and the abrasive particles (such as diamond) are composed of different materials and have low compatibility. Therefore, during the bonding process or during the polishing process after bonding, insufficient bonding force is easily generated, causing the abrasive particles to fall off, affecting the polishing quality and reducing the service life of the dresser. [Summary of the Invention]

[0005] The technical problem to be solved by the present invention is to provide a grinding structure, a dressing component, and a method for manufacturing the dressing component in view of the shortcomings of the prior art. The grinding components can be fixed at a consistent height on the working surface, and the structural strength can be enhanced and the service life extended.

[0006] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a grinding structure, which includes a porous metal structure, multiple abrasive particles, and metal solder. The multiple abrasive particles are dispersedly embedded in the porous metal structure, with each abrasive particle partially exposed. The metal solder fills and penetrates into the porous metal structure and combines with the porous metal structure and the multiple abrasive particles. The material constituting the porous metal structure and the material constituting the metal solder have at least one of the same constituent elements.

[0007] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a trimming component, which includes a base and a grinding structure, wherein the grinding structure is disposed on the base.

[0008] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a trimming component, which includes: embedding a plurality of abrasive particles on one surface of a porous metal structure, with each abrasive particle partially exposed on the surface; setting a metal solder on another surface of the porous metal structure; performing a brazing process to melt the metal solder at high temperature, so that the metal solder penetrates into the porous metal structure and combines with the porous metal structure and the plurality of abrasive particles to form a trimming structure.

[0009] One of the beneficial effects of the present invention is that the grinding structure, trimming component, and manufacturing method of the trimming component provided by the present invention can, through the technical solutions of "filling and penetrating the metal porous structure with metal solder and combining with the metal porous structure and multiple grinding particles" and "the material constituting the metal porous structure and the material constituting the metal solder having at least one of the same constituent elements", not only can the height of the grinding particles fixed on the metal porous structure be kept consistent, but also the cracks generated after hard soldering can be avoided, and the structural strength of the grinding structure can be strengthened and the service life extended.

[0010] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0019] The following specific embodiments illustrate the implementation of the "grinding structure, dressing assembly, and method for manufacturing the dressing assembly" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this invention are only simple schematic illustrations and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.

[0020] [Example]

[0021] Referring to Figure 1, Figure 1 is a schematic diagram of the grinding structure of the present invention. The present invention provides a grinding structure M, which includes: a porous metal structure 1, a plurality of grinding particles 2, and a metal solder 3. The plurality of grinding particles 2 are dispersedly embedded in the porous metal structure 1. Each grinding particle 2 is partially exposed.

[0022] For example, the material constituting the porous metal structure 1 is nickel, iron, copper, titanium, stainless steel, nickel alloy, iron alloy, copper alloy, or titanium alloy. Furthermore, the porous metal structure can be a mesh structure, a foamed structure, a fiber structure, or a fin structure. In a preferred embodiment, the porous metal structure 1 can be nickel or its alloy with a foamed structure, such as foamed nickel (or nickel foam). In other embodiments, the porous metal structure 1 can also be foamed titanium or foamed stainless steel, or it can contain nickel fibers. It should also be noted that in this invention, the porous metal structure 1 can be a single-layer structure or a multi-layer structure; this invention is not limited thereto.

[0023] This invention is not limited to the manufacturing process of the porous metal structure 1. For example, the porous metal structure 1 can be manufactured by powder metallurgy, hot extrusion, molten metal method, electroplating, electrochemical deposition, or casting. The porous metal structure 1 has a plurality of openings 10 on its surface (e.g., the first surface 11 and the second surface 12 in FIG. 1) and inside, and a plurality of abrasive particles 2 are embedded in the plurality of openings 10. This invention does not limit the number of openings 10. For example, the average pore size of the plurality of openings 10 is between 50 μm and 500 μm.

[0024] Furthermore, the plurality of openings 10 are located inside the porous metal structure 1 and on the surface of the porous metal structure 1 (first surface 11 and second surface 12). At least a portion of the plurality of openings 10 are interconnected to form at least one channel. In other words, the channel can extend from the outer surface of the porous metal structure 1 to its interior.

[0025] The metal solder 3 can fill and penetrate into the porous metal structure 1 through the openings 10 and channels, and bond with the porous metal structure 1 and the multiple abrasive particles 2. The material of the metal solder 3 includes metal alloys, preferably, for example, nickel-based alloys (BNi-2). It should also be noted that the metal solder 3 penetrates into the porous metal structure 1 in a molten state, and then cools and solidifies to bond the abrasive particles 2 with the porous metal structure 1. For example, the abrasive particles 2 include single-crystal diamond, polycrystalline diamond, polycrystalline diamond (PCD), CVD diamond, diamond, cubic boron nitride (cBN) particles, silicon carbide particles, or any combination thereof. The form of the metal solder 3 can be solder sheet, solder paste, solder powder, or a mixture of solder powder and resin. The present invention does not limit the form of the metal solder 3.

[0026] In this invention, the material constituting the porous metal structure 1 (foamed nickel) and the material constituting the metal solder 3 (nickel-based alloy) have at least one of the same constituent elements, exhibiting high compatibility and better wettability. Therefore, the metal solder 3 penetrating into the porous metal structure 1 can achieve a better bonding effect with the porous metal structure 1, and their coefficients of thermal expansion are also closer. Furthermore, the metal solder 3 generally contains active metal elements, such as titanium (Ti), chromium (Cr), vanadium (V), zirconium (Zr), molybdenum (Mo), and tungsten (W). In the embodiments of this invention, the metal solder 3 is a BNi-2 nickel-based solder, whose chemical composition includes elements such as nickel (Ni), chromium (Cr), boron (B), and silicon (Si). The metal solder 3 can chemically react with the porous metal structure 1 and the abrasive particles 2 to generate an intermetallic compound (IMC), improving the interfacial bonding force and thereby enhancing the bonding between the material (porous metal structure 1) and the metal solder 3, i.e., chemical bonding.

[0027] It should be noted that in the prior art, the solder can form a mesometallic compound when it combines with the abrasive particles. These mesometallic compounds have high hardness and high brittleness, but due to the large difference in thermal expansion coefficients, they are prone to cracking due to thermal expansion and contraction during the hard soldering process. To solve the defects of the prior art, the abrasive structure M of the present invention incorporates a porous metal structure 1, and selects a metal solder 3 that has at least one of the same constituent elements (similar thermal expansion coefficients) as the porous metal structure 1. This promotes the formation of chemical bonds between the metal solder 3 and the porous metal structure 1, and avoids the metal solder 3 from cracking and causing the abrasive particles 2 to peel off, thereby strengthening the structural strength of the abrasive structure M.

[0028] Furthermore, nickel-based solder has good wettability and adhesion, which can effectively fix the diamond to the porous metal structure 1. At high temperatures, it can form a reliable chemical bond between the metal and the diamond, thereby achieving a strong bond. In addition, nickel-based solder has good corrosion resistance and wear resistance, which can enhance the bonding strength between the diamond and the porous metal structure 1, and can maintain stability over a wide temperature range.

[0029] Furthermore, after the multiple abrasive particles 2 are embedded in the multiple openings 10, they are partially covered by the porous metal structure 1. Specifically, as shown in FIG1, one of the abrasive particles 2 has a maximum cross-sectional area 2A parallel to the first surface 11 of the porous metal structure 1 between it and the opening 10 it is embedded in, and the area 10A of the opening 10 is smaller than the maximum cross-sectional area 2A. Specifically, the widest part of the abrasive particle 2 (i.e., the part with the maximum cross-sectional area 2A) is embedded in the porous metal structure 1, so that the porous metal structure 1 has the effect of covering the abrasive particle 2, thereby strengthening the bonding force between the abrasive particle 2 and the porous metal structure 1.

[0030] The porous metal structure 1 of the present invention is actually a compressed porous metal structure, which has multiple overlapping pore regions inside (not shown in the figure). Therefore, the porous metal structure 1 (i.e., the compressed structure) has a compressed porosity, which can be called the compressed porosity. The compressed porosity is defined as the volume ratio of the multiple overlapping pore regions to the solid structure (i.e., without pores). In a preferred embodiment of the present invention, the compressed porosity is less than 50%. By designing the porous metal structure 1 to have a compressed porosity of less than 50%, the metal solder 3 can generate capillary action inside the porous metal structure 1. The metal solder 3 can penetrate into the porous metal structure 1 through multiple openings 10 through capillary action and fill the porous metal structure 1. Then, it combines with the abrasive particles 2 and makes the abrasive particles 2 firmly fixed in the porous metal structure 1, ensuring that the abrasive particles 2 will not fall off during the use of the grinding structure 1, and also reducing the cracking of the metal solder 3 due to thermal stress.

[0031] Uncompressed porous metal structures generally have high porosity. Generally, a porous metal structure with 110 PPI (PPI refers to the average number of pores per unit inch) has a porosity of approximately 80% to 95%. When the porosity is too high, it indicates that the porous metal structure has too many pores and the pore size is too large, resulting in an overly sparse internal solid structure. Therefore, if abrasive particles are to be secured within this porous metal structure, the particles tend to fall directly into the interior rather than being secured on its surface. In other words, porous metal structures with excessively high porosity are unsuitable for securing abrasive particles, and the foamed nickel needs to be compressed.

[0032] Taking foamed nickel as an example of a porous metallic structure. Assume that the uncompressed foamed nickel has an initial thickness of 2 mm and an initial porosity Ø of 95%. If the 2 mm thick foamed nickel is compressed to a thickness of only 0.2 mm, the compressible porosity Ø' of the compressed foamed nickel is calculated as follows:

[0033] Initial thickness h = 2 mm;

[0034] The thickness after compression is h'=0.2 mm;

[0035] Assuming the cross-sectional area A of the foamed nickel remains unchanged before and after compression, the volume compression ratio (the volume ratio of uncompressed foamed nickel to compressed foamed nickel) is:

[0036] (V' / V)=(A×h') / (A×h)=(0.2 / 2)=0.1;

[0037] Therefore, the total volume after compression is 10% of the original volume.

[0038] Furthermore, the total volume V of the foamed nickel includes the pore volume Vp and the volume Vs of the solid portion:

[0039] Vp=Ø×V=0.95×V;

[0040] Vs= V‒ Vp = V‒ 0.95V=0.05V;

[0041] As can be seen from the above, the total volume after compression is 10% of the original volume, that is:

[0042] V'=0.1V.

[0043] During the compression process, the volume Vs of the solid portion of the foamed nickel remains unchanged, while the pore volume Vp' after compression is:

[0044] Vp'= V'‒ Vs' = 0.1V‒ 0.05V=0.05V.

[0045] Therefore, the compressible porosity Ø' of the compressed foamed nickel is:

[0046] Ø'=Vp' / V'=0.05V / 0.1V=0.5.

[0047] Therefore, when the thickness of the foamed nickel is reduced from 2 mm to 0.2 mm, the porosity will be reduced to 50%.

[0048] Due to the structural design of the porous metal structure 1, when multiple abrasive particles 2 are secured in the openings 10 of the porous metal structure 1, the height of the exposed portions of the multiple abrasive particles 2 can remain consistent, thereby allowing the porous metal structure 1 to have a grinding surface of equal height. Specifically, the portions of these abrasive particles 2 exposed outside the porous metal structure 1 collectively form a grinding surface, each abrasive particle 2 has a cutting tip 2T, and the vertical height difference between any two cutting tips 2T does not exceed 20 μm.

[0049] Furthermore, in this invention, the flatness of the surface of the porous metal structure 1 must be less than 50 μm. The flatness of the porous metal structure 1 is defined as the average height difference between the 10 highest points on the surface of the porous metal structure 1. When the flatness is greater than 50 μm, after the abrasive particles 2 are embedded in the opening 10, the range covered by the porous metal structure 1 varies too much, making it difficult to control the height of the exposed part of the abrasive particles 2, thus affecting the quality of the abrasive structure M.

[0050] Referring to Figure 2, which is a schematic diagram of the trimming assembly of the present invention, the present invention provides a trimming assembly D, which includes a base 4 and a grinding structure M disposed on the base 4. The material of the base material 4 includes stainless steel, metal alloy, ceramic material, or engineering plastic (e.g., polyimide (PI) or polypropylene (PP)). In a preferred embodiment of the present invention, the base material 4 is stainless steel, such as SUS316 or SUS304, all of which contain a certain proportion of nickel. In other words, in the present invention, the material constituting the base 4 (stainless steel) and the material constituting the porous metal structure 1 (foamed nickel) and the metal solder 3 (nickel-based alloy) have at least one of the same constituent elements, and therefore have similar coefficients of thermal expansion, which can enhance the structural stability of the trimming assembly D and reduce the probability of the porous metal structure 1 falling off the base 4. In addition, the trimming assembly D also includes an adhesive 5. The adhesive 5 is disposed between the base 4 and the grinding structure M for bonding the base 4 and the grinding structure M.

[0051] The present invention does not limit the specific size or embodiment of the trimming component D. For example, the trimming component D may be used as a single conditioner; or, in another embodiment, multiple trimming components D may be distributed on a base (not shown) to form a combined conditioner; or, in another embodiment, multiple trimming components D may be arranged around the center of the base to form a combined conditioner. Or, in another embodiment, multiple trimming components D may also be arranged in a matrix on the base to form a combined conditioner.

[0052] The adhesive 5 can be, for example, a metal solder or a polymer adhesive (e.g., epoxy resin). If the adhesive 5 is a metal solder 3, when the metal solder 3 melts, a portion of it will penetrate into the porous metal structure 1 by capillary action, while the other portion will be used to bond the base 4 and the grinding structure M. Furthermore, having the same constituent elements as the base 4, the porous metal structure 1, and the metal solder 3 has the following advantages and benefits:

[0053] (1) The same constituent elements make the metal solder 3 and the base 4 have better compatibility, which helps to achieve more uniform fusion and better welding effect, and reduces the possibility of cracks or crystallization after welding.

[0054] (2) The same constituent elements can promote atomic diffusion at the welding surface between the metal solder 3 and the base 4, thereby enhancing the welding strength and stability.

[0055] On the other hand, if the adhesive 5 is a polymeric adhesive, when an external pressure is applied to bond the polished structural component M to the base 4 through the adhesive 5, the polymeric adhesive process can reduce the occurrence of thermal deformation of the base 4, further enhancing the structural stability of the modified component D. It should also be noted that the melting point of the porous metal structure 1 must be at least 100°C higher than the melting point of the metal solder 3. This prevents the solder 3 from altering the composition ratio when it penetrates the porous metal structure 1, and also ensures that the porous metal structure 1 maintains its original rigidity during the hard soldering process, preventing crack formation.

[0056] Referring to Figures 1, 2, and 7, Figure 7 is a flowchart of steps S1 to S4 of the method for manufacturing the trimming component of the present invention. The present invention provides a method for manufacturing a trimming component, which includes at least steps S1, S2, S3, and S4:

[0057] In step S1, a plurality of abrasive particles 2 are embedded on a surface of a porous metal structure 1, and each abrasive particle 2 is partially exposed on the surface (i.e., the first surface 11).

[0058] In step S2, a metal solder 3 is placed on another surface (i.e., the second surface 12) of the metal porous structure 1.

[0059] In step S3, a brazing process is performed to melt the metal solder 3, so that the metal solder 3 penetrates into the porous metal structure 1 and combines with the porous metal structure 1 and multiple abrasive particles 2 to form an abrasive structure M.

[0060] In step S4, a base 4 and an adhesive 5 are provided, the adhesive 5 being used to bond the base 4 and the grinding structure M.

[0061] Next, referring to Figures 3, 4, and 8, Figures 3 and 4 are schematic diagrams of steps S11 to S15 of the method for manufacturing the trimming component of the present invention, and Figure 8 is a flowchart of steps S11 to S15 of the method for manufacturing the trimming component of the present invention. Step S1, in which multiple abrasive particles 2 are embedded on the surface of the porous metal structure 1, further includes steps S11, S13, and S15:

[0062] In step S11, a plurality of abrasive particles 2 are placed on the surface of the porous metal structure 1.

[0063] In step S13, a rigid platform 6 with multiple grooves 60 is provided to cover multiple abrasive particles 2, so that the multiple abrasive particles 2 are respectively disposed in the multiple grooves 60.

[0064] In step S15, the rigid platform 6 and the porous metal structure 1 are pressed against each other, so that multiple abrasive particles 2 are pressed into the porous metal structure 1 and the porous metal structure 1 is deformed by compression.

[0065] Specifically, in Figure 3, multiple abrasive particles 2 are first laid on the first surface 11 of the porous metal structure 1 (see part K1 in Figure 3). At this time, the porous metal structure 1 is a deformable porous mesh structure (or foamed structure). The material and structural composition details of the porous metal structure 1 have been described above and will not be repeated here. Next, a rigid platform 6 is provided to cover the multiple abrasive particles 2 (see parts K2 and K3 in Figure 3). The multiple abrasive particles 2 are placed on a support member P. The surface of the rigid platform 6 has multiple protrusions 61, and multiple grooves 60 are formed between the multiple protrusions 61. The number of grooves 60 corresponds to the number of multiple abrasive particles 2. The material of the protrusions 61 can be, for example, metal, ceramic, or deformable polymer material. This invention is not limited to these materials.

[0066] Furthermore, the present invention is not limited to the forming method of the groove 60 and the protrusion 61. For example, the protrusion 61 can be formed by adding a gasket to the surface of the rigid platform 6, and the recess formed through the gasket forms the groove 60. Alternatively, the protrusion 61 can also be formed by directly machining the groove 60 from the surface of the rigid platform 6, in which case the protrusions on both sides of the groove 60 form the protrusion 61. When the rigid platform 6 covers multiple abrasive particles 2, the multiple abrasive particles 2 are respectively disposed in multiple grooves 60 (each groove 60 can only accommodate one abrasive particle 2).

[0067] In another embodiment, a planar structure (not shown) made of a deformable polymer material can be first provided on the surface of the rigid platform 6, which faces the plurality of abrasive particles 2. When the rigid platform 6 presses the plurality of abrasive particles 2 into the plurality of openings 10 of the porous metal structure 1, the protrusions 61 abut against the plurality of abrasive particles 2 and are compressed. During compression, the abrasive tips 2T of the abrasive particles 2 will squeeze the planar structure, deform it and form a plurality of grooves 60, and the protrusions on both sides of each groove 60 form the protrusions 61.

[0068] Next, in Figure 4, the rigid platform 6 is pressed down, causing the porous metal structure 1 to be compressed. Parts of the multiple abrasive particles 2 are pressed into the multiple openings 10 of the porous metal structure 1, while other parts of the abrasive particles 2 are exposed. In other words, the abrasive particles 2 can be secured using the multiple openings 10 of the porous metal structure 1. The compressed porous metal structure 1 has an overlap porosity of less than 50% and a thickness of less than 2 mm. Furthermore, the height difference between any two abrasive particles 2 does not exceed 20 μm, meaning the multiple abrasive particles 2 are almost of equal height.

[0069] Furthermore, the present invention can adjust the depth of the groove 60 by adjusting the height of the protrusion 61, and the depth of the groove 60 is the part of the plurality of abrasive particles 2 exposed, which is the grinding surface of the trimming component. After the plurality of abrasive particles 2 are set on the first surface 11 of the compressed metal porous structure 1, a layer of metal solder 3 is then placed on the second surface 12 of the compressed metal porous structure 1, and then the metal porous structure 1 is placed in a vacuum furnace for hard soldering process (i.e., Figure 4 shows the solder 3 placed downwards for sintering).

[0070] It should also be noted that the present invention does not limit whether the metal solder 3 is placed on the upper or lower layer of the porous metal structure 1 during the hard soldering process. For example, in Figure 4, the metal solder 3 is placed on the lower layer of the porous metal structure 1 (or abrasive particles 2), but in other embodiments, the metal solder 3 may also be placed on the upper layer of the porous metal structure 1 (or abrasive particles 2) (as shown in Figure 6, where the solder 3 is placed facing upwards for sintering). Whether it is the upper or lower layer, since the porous metal structure 1 is in a vacuum environment in the vacuum furnace, the melted metal solder 3 can penetrate into the interior of the porous metal structure 1 through multiple openings 10 via capillary force.

[0071] Furthermore, the present invention is not limited to the arrangement position of the abrasive particles 2 and the protrusions 61. For example, taking part K2 of FIG3 as an example, the positions of the abrasive particles 2 and the protrusions 61 can be interchanged. That is, the abrasive particles 2 are first placed on the rigid platform 6 (an adhesive material, such as spray adhesive or double-sided tape, can be provided on the surface of the rigid platform 6 so that the abrasive particles 2 can adhere to the surface of the rigid platform 6), and the protrusions 61 can be placed on the first surface 11 of the metal porous structure 1, so that the grooves 60 are formed between the protrusions 61 located in the metal porous structure 1.

[0072] Alternatively, the abrasive particles 2 and the protrusions 61 can be disposed on the same carrier. For example, taking part K2 of FIG3 as an example, the protrusions 61 are disposed on the rigid platform 6, while the abrasive particles 2 are disposed in the grooves 60 between the protrusions 61 (an adhesive material, such as spray adhesive or double-sided tape, can be disposed in the grooves 60 to allow the abrasive particles 2 to adhere to the grooves 60). Or, for example, the protrusions 61 are disposed on the first surface 11 of the porous metal structure 1, while the abrasive particles 2 are disposed in the grooves 60 between the protrusions 61 (an adhesive material can be disposed in the grooves 60).

[0073] It should be noted that the present invention does not limit the sequential movement order of the rigid platform 6 and the porous metal structure 1. For example, the present invention can move the rigid platform 6 downward to compress the porous metal structure 1; or it can keep the rigid platform 6 stationary and move the porous metal structure 1 upward to compress the multiple abrasive particles 2 toward the multiple grooves 60 of the rigid platform 6, so that the multiple abrasive particles 2 are pressed into the porous metal structure 1 and the porous metal structure 1 is compressed and deformed. In addition, the present invention does not limit the vertical positional relationship between the rigid platform 6 and the porous metal structure 1. For example, the present invention can reverse the vertical positions of the rigid platform 6 and the porous metal structure 1.

[0074] Next, the subsequent process is shown in Figures 1 and 2. During the hard soldering process, the porous metal structure 1 is in a vacuum environment, and the porous metal structure 1 has been compressed so that its internal overlapping porosity is less than 50%. Therefore, after the metal solder 3 melts, it can penetrate into the interior of the porous metal structure 1 through multiple openings 10 through capillary force and fill the porous metal structure 1. Then, it combines with the abrasive particles 2 and makes the abrasive particles 2 firmly stuck in the porous metal structure 1, ensuring that the abrasive particles 2 will not fall off during the subsequent use of the abrasive structure 1. The porous metal structure 1 can also reduce the cracking of the metal solder 3 due to thermal stress.

[0075] The steps S11 to S15 described above are only one feasible embodiment of embedding multiple abrasive particles 2 into a porous metal structure 1, and are not intended to limit the present invention.

[0076] Next, referring to Figures 5, 6, and 9, Figures 5 and 6 are schematic diagrams of steps S10 to S14 of the method for manufacturing the trimming component of the present invention, and Figure 9 is a flowchart of steps S10 to S14 of the method for manufacturing the trimming component of the present invention. Step S1, in which multiple abrasive particles 2 are embedded on the surface of the porous metal structure 1, further includes steps S10, S12, and S14:

[0077] In step S10, a rigid platform 6 with multiple grooves 60 is provided, and multiple abrasive particles 2 are respectively disposed in the multiple grooves 60.

[0078] In step S12, the porous metal structure 1 is disposed on a plurality of abrasive particles 2.

[0079] In step S14, the rigid platform 6 is pressed against the porous metal structure 1, causing multiple abrasive particles 2 to be embedded in the porous metal structure 1 and the porous metal structure 1 to be deformed by compression.

[0080] Specifically, in Figure 5, multiple abrasive particles 2 are first placed in multiple grooves 60 of the rigid platform 6 (see R1 in Figure 5). Adhesive materials, such as spray adhesive or double-sided tape, can be placed in the grooves 60, allowing the abrasive particles 2 to adhere. Next, a porous metal structure 1 is placed on the multiple abrasive particles 2 (see R2 and R3 in Figure 5). Then, as shown in Figure 6, the porous metal structure 1 is compressed by the bearing P, deforming it and embedding the multiple abrasive particles 2 into the multiple openings 10 of the porous metal structure 1. Similarly, the height difference between any two abrasive particles 2 does not exceed 20 μm, meaning the multiple abrasive particles 2 are almost the same height.

[0081] Specifically, in steps S10 to S14, multiple abrasive particles 2 are first placed in multiple grooves 60 of the multiple rigid platforms 6, and then extruded. Further, the multiple abrasive particles 2 are disposed on the second surface 12 of the porous metal structure 1. Then, a layer of metal solder 3 is placed on the first surface 11 of the porous metal structure 1, and the porous metal structure 1 is placed in a vacuum furnace for a hard soldering process.

[0082] Similarly, the present invention is not limited to the arrangement position of the abrasive particles 2 and the protrusions 61. For example, taking part R2 of FIG5 as an example, the position of the abrasive particles 2 and the protrusions 61 can be arranged on the second surface 12 of the porous metal structure 1, that is, the protrusions 61 are arranged on the second surface 12 of the porous metal structure 1, and the abrasive particles 2 are arranged in the grooves 60 between the protrusions 61 (an adhesive material can be arranged in the grooves 60).

[0083] Alternatively, the abrasive particles 2 and the protrusions 61 can be disposed on different carriers. For example, taking part R2 of FIG5 as an example, the abrasive particles 2 can be disposed on the rigid platform 6 (an adhesive material, such as spray adhesive or double-sided tape, can be disposed on the surface of the rigid platform 6 to allow the abrasive particles 2 to adhere to the surface of the rigid platform 6), while the protrusions 61 can be disposed on the second surface 12 of the porous metal structure 1, so that the grooves 60 are formed in the porous metal structure 1. Or, for example, the abrasive particles 2 can be disposed on the second surface 12 of the porous metal structure 1 (an adhesive material can also be disposed on the second surface 12), while the protrusions 61 can be disposed on the rigid platform 6, so that the grooves 60 are formed between the protrusions 61 located on the rigid platform 6.

[0084] It should also be noted that in the above-mentioned variations, if the head of the abrasive particle 2 (i.e., the cutting tip 2T of the abrasive particle 2 in Figure 2) is first placed against the same plane before the subsequent extrusion step is performed, this type of method can be called the flush-head equal-height method. Alternatively, if the bottom of the abrasive particle 2 is first placed against the same plane (as shown in R1 part of Figure 5: i.e., the cutting tips 2T are initially at different heights) before the subsequent extrusion step is performed, this type of method can be called the level-footing equal-height method.

[0085] Next, the subsequent process is shown in Figures 1 and 2. During the hard soldering process, the porous metal structure 1 is in a vacuum environment, and the porous metal structure 1 has been compressed so that its internal overlapping porosity is less than 50%. Therefore, after the metal solder 3 melts, it can penetrate into the interior of the porous metal structure 1 through multiple openings 10 through capillary force and fill the porous metal structure 1, thereby combining with the abrasive particles 2 to make the abrasive particles 2 firmly stuck in the porous metal structure 1.

[0086] In this invention, when the abrasive particles 2 are pressed into the deformable porous metal structure 1 and secured within the multiple openings 10 of the porous metal structure 1, the porous metal structure 1 can further encapsulate the abrasive particles 2. Furthermore, this invention utilizes a rigid platform 6 with protrusions 61 and grooves 60 to adjust the height of the exposed portions of the abrasive particles 2, ensuring that the heights of the exposed portions of multiple abrasive particles 2 remain consistent, i.e., the vertical height difference between any two cutting tips 2T does not exceed 20 μm.

[0087] Furthermore, during the high-temperature hard soldering process, the molten metal solder 3 combines with the porous metal structure 1 and multiple abrasive particles 2 to form an abrasive structure M. Through the structural design of the porous metal structure 1, the movement or flipping of multiple abrasive particles 2 due to the boiling of the metal solder 3 during the high-temperature soldering process is avoided, which would result in unequal heights of the multiple abrasive particles 2, i.e., an excessively large height difference between the exposed parts of the multiple abrasive particles 2.

[0088] Furthermore, it is worth mentioning that although the examples described above all involve placing the abrasive particles 2 onto the uncompressed porous metal structure 1 before pressing them together, the present invention is not limited to this. In other embodiments, the deformable porous metal structure 1 can be compressed first, and then the abrasive particles 2 can be embedded on it. However, in this case, since the porous metal structure 1 is compressed and no longer elastic, the abrasive particles 2 can be inserted into the porous metal structure 1, causing the porous structure to deform and cover the abrasive particles.

[0089] Please refer to Figure 10, which is a partial frontal microscope photograph of a grinding structure according to an embodiment of the present invention. The microscope photograph in Figure 10 was taken using a Keyence digital microscope (model VHX-2000) at a magnification of 200x. After the finishing component was manufactured, the frontal view was photographed, resulting in the image shown in Figure 10. As can be seen from Figure 10, the porous metal structure 1 itself has multiple interconnected openings 10, and multiple grinding particles 2 are embedded in the openings 10 and fixed therein.

[0090] [Beneficial Effects of the Embodiments]

[0091] The grinding structure M, trimming component D, and manufacturing method of trimming component D provided by the present invention can, through the technical solutions of "metal solder 3 filling and penetrating into the metal porous structure and combining with the metal porous structure and multiple grinding particles" and "the material constituting the metal porous structure and the material constituting the metal solder having the same constituent elements", not only can the height of the grinding particles fixed on the metal porous structure be kept consistent, but also the structural strength of the grinding structure can be strengthened and the service life extended.

[0092] In this invention, the metal solder 3 can form a chemical bond with the abrasive particles 2. The material constituting the base 4 (stainless steel) and the material constituting the porous metal structure 1 (foamed nickel) and the metal solder 3 (nickel-based alloy) have at least one of the same constituent elements, so their coefficients of thermal expansion are consistent, which can enhance the structural stability of the correction component D and reduce the probability of the porous metal structure 1 falling off the base 4.

[0093] Furthermore, the compressibility of the porous metal structure 1 in this invention is less than 50%. Therefore, the metal solder 3 generates capillary action inside the porous metal structure 1. The metal solder 3 can penetrate into the porous metal structure 1 through multiple openings 10 through capillary action and fill the porous metal structure 1. Then, it combines with the abrasive particles 2 to make the abrasive particles 2 firmly fixed in the porous metal structure 1, ensuring that the abrasive particles 2 will not fall off during the subsequent use of the abrasive structure 1, and also reducing the cracking of the metal solder 3 due to thermal stress.

[0094] Furthermore, during the high-temperature soldering process, the molten metal solder 3 combines with the porous metal structure 1 and multiple abrasive particles 2 to form a polishing structure M. Through the structural design of the porous metal structure 1, the exposed portions of the multiple abrasive particles 2 can maintain a consistent height, thereby giving the porous metal structure 1 a polishing surface of equal height. Therefore, the porous metal structure 1 prevents the multiple abrasive particles 2 from moving or flipping due to boiling during the high-temperature soldering process, thus avoiding uneven heights for the multiple abrasive particles 2.

[0095] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0011] Figure 1 is a schematic diagram of the grinding structure of an embodiment of the present invention.

[0012] Figure 2 is a schematic diagram of the trimming component according to an embodiment of the present invention.

[0013] Figures 3 and 4 are schematic diagrams of steps S11 to S15 of the method for manufacturing the trimming component according to an embodiment of the present invention.

[0014] Figures 5 and 6 are schematic diagrams of steps S10 to S14 of the method for manufacturing the trimming component according to an embodiment of the present invention.

[0015] Figure 7 is a flowchart of steps S1 to S4 of the method for manufacturing the trimming component according to an embodiment of the present invention.

[0016] Figure 8 is a flowchart of steps S11 to S15 of the method for manufacturing the trimming component according to an embodiment of the present invention.

[0017] Figure 9 is a flowchart of steps S10 to S14 of the method for manufacturing the trimming component according to an embodiment of the present invention.

[0018] Figure 10 is a partial frontal microscope photograph of a grinding structure according to an embodiment of the present invention.

Claims

1. A grinding structure, comprising: A porous metal structure, wherein the flatness of the surface of the porous metal structure is less than 50 μm; Multiple abrasive particles are dispersedly embedded on the surface of the porous metal structure, with each abrasive particle partially exposed. And a metal solder, which is molten and penetrates into the porous metal structure, and then cools and solidifies to bond the abrasive particles to the porous metal structure; wherein the material constituting the porous metal structure and the material constituting the metal solder have at least one of the same constituent elements.

2. The grinding structure as described in claim 1, wherein, The metal solder forms an intermetallic compound with the porous metal structure and multiple abrasive particles.

3. The grinding structure as described in claim 1, wherein, The constituent materials of the porous metal structure are nickel, iron, copper, nickel alloy, iron alloy, copper alloy, titanium alloy, foamed nickel, foamed titanium, and foamed stainless steel.

4. The grinding structure as described in claim 1, wherein, The porous metal structure is a compressed structure with a compressibility porosity of less than 50%.

5. The grinding structure as described in claim 1, wherein, The melting point of the porous metal structure is at least 100°C higher than that of the metal solder.

6. A trimming assembly comprising: A base; And a grinding structure as described in any one of claims 1 to 5, disposed on the base.

7. The trimming component as described in claim 6, wherein, The base may be made of stainless steel, metal alloy, ceramic material or engineering plastic.

8. The trimming assembly as claimed in claim 6 further includes an adhesive disposed between the base and the grinding structure, the adhesive being used to bond the base and the grinding structure.

9. The trimming component as described in claim 8, wherein, The adhesive is a metal solder or a polymer adhesive.

10. A method for manufacturing a trimming component, comprising: Step S1: Embedding multiple abrasive particles on one surface of a porous metal structure, with each abrasive particle partially exposed on the surface, and the flatness of the surface of the porous metal structure being less than 50 μm; Step S2: Applying a metal solder to the other surface of the porous metal structure; and Step S3: Performing a hard soldering process to melt the metal solder, allowing the metal solder to penetrate into the porous metal structure and combine with the porous metal structure and the multiple abrasive particles to form an abrasive structure.

11. The method for manufacturing the trimming component as described in claim 10, wherein, Step S1 further includes: Step S11: setting a plurality of the abrasive particles on the surface of the porous metal structure; Step S13: providing a rigid platform with a plurality of grooves to cover the plurality of abrasive particles, such that the plurality of abrasive particles are respectively disposed in the plurality of grooves; and Step S15: pressing the rigid platform against the porous metal structure, such that the plurality of abrasive particles are embedded in the porous metal structure and the porous metal structure is deformed by the compression.

12. The method for manufacturing the trimming component as described in claim 10, wherein, Step S1 further includes: Step S10: providing a rigid platform with multiple grooves, and disposing multiple abrasive particles in the multiple grooves respectively; Step S12: disposing the metal porous structure on the multiple abrasive particles; and Step S14: pressing the rigid platform and the metal porous structure against each other, so that the multiple abrasive particles are embedded in the metal porous structure and the metal porous structure is deformed by compression.

13. The method for manufacturing the trimming component as described in claim 10 further includes: Step S4: Provide a base and an adhesive, the adhesive being used to bond the base to the grinding structure.

14. The method for manufacturing the trimming component as described in claim 10, wherein, The metal solder is made of a nickel-based alloy, and the porous metal structure is a foamed structure made of nickel or a nickel alloy.

15. The method for manufacturing the trimming component as described in claim 10, wherein, The surface and interior of the metal porous structure include multiple openings, and the multiple abrasive particles are embedded in the multiple openings and are covered by the metal porous structure.

Images