Cover opening and closing equipment

TWI935442BActive Publication Date: 2026-08-11KING YUAN ELECTRONICS
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Patent Information

Application Number
TW113128580
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2026-08-11
Estimated Expiration
2044-07-30

AI Technical Summary

Technical Problem

Existing burn-in testing processes face challenges in improving the accuracy of component testing while reducing operational costs and enhancing versatility for various test sockets.

Method used

A cover-opening device with a guide structure and a moving device that drives the guide in a single direction, incorporating a bendable driving portion and telescopic arm to control the opening and closing of test sockets, including clamshell and Z-type sockets, to facilitate accurate wafer placement and retrieval.

Benefits of technology

The device improves the success rate of wafer placement and retrieval, reduces operational costs by automating the cover-opening process, and enhances versatility across different test socket types.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Patent Text Reader

Abstract

A cover-opening device includes a base plate, a guide structure, at least one test socket, and a moving device. The guide structure extends at least partially along a first direction. The test socket includes a bottom, a cover, a locking portion, and a bendable actuating portion. The bottom is disposed on the base plate and configured to accommodate a wafer. The cover is resiliently pivotally connected to the bottom and configured to cover the bottom. The locking portion is disposed on the bottom and configured to latch the cover. The bendable actuating portion has opposing first and second ends, the first end being pivotally connected to the bottom and mechanically connected to the locking portion, and the second end being movably connected to the guide structure. The moving device is configured to connect to and actuate the second end relative to the guide structure along the first direction, causing the first end to rotate relative to the bottom, thereby causing the locking portion to latch or release the cover.
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Description

[Technical Field]

[0001] The present invention relates to a switch cover device, and more particularly to a switch cover device that facilitates the placement or retrieval of a wafer during burn-in testing. [Previous Technology]

[0002] With the increasing demand for electronic devices, the quality of various components in these devices has naturally received high attention from the industry. In addition to improving the manufacturing technology of components, the quality testing of components has also become increasingly important.

[0003] For example, the purpose of pre-burn-in testing is to provide the test object (DUT) with a high-temperature, high-voltage, and high-current environment, so that the DUT with a short lifespan can exhibit its due characteristics earlier during the pre-burn-in process. Therefore, how to improve the accuracy of operation and reduce testing costs during pre-burn-in testing is undoubtedly an important issue of great concern to the industry. [Summary of the Invention]

[0004] One of the objectives of this invention is to provide a cover-opening device that can improve the success rate of cover opening and closing, thereby reducing the operating cost of testing.

[0005] Another object of the present invention is to provide a switch cover device that is applicable to various test sockets, such as clam-shaped test sockets and Z-shaped test sockets, so as to improve versatility.

[0006] Another object of the present invention is to provide a cover opening and closing device, wherein the moving device drives the guide of the test seat in a single direction to complete the opening and closing action of the cover, thereby reducing the complexity and freedom of the opening and closing action of the cover.

[0007] According to one embodiment of the present invention, a cover switch device includes a base plate, a guide structure, at least one test socket, and a moving device. The guide structure extends at least partially along a first direction. The test socket includes a bottom, a cover, a locking portion, and a bendable driving portion. The bottom is disposed on the base plate and configured to accommodate a wafer. The cover is resiliently pivotally connected to the bottom and configured to cover the bottom. The locking portion is disposed on the bottom and configured to snap onto the cover. The bendable driving portion has a first end and a second end opposite to each other, the first end being pivotally connected to the bottom and mechanically connected to the locking portion, and the second end being movably connected to the guide structure. The moving device is configured to connect to and drive the second end to move relative to the guide structure along the first direction, so that the first end rotates relative to the bottom, thereby causing the locking portion to snap onto or release the cover.

[0008] In one or more embodiments of the present invention, the aforementioned bendable driving part includes a rotating shaft, a first connecting rod, a second connecting rod, and a guide member. The rotating shaft defines a first end and extends along a second direction, the second direction being perpendicular to the first direction. The rotating shaft is connected to one end of the first connecting rod. One end of the second connecting rod is rotatably connected to the other end of the first connecting rod. The guide member defines a second end and connects to the other end of the second connecting rod.

[0009] In one or more embodiments of the present invention, the guide structure described above includes an upper track and a lower track. The upper track extends along a first direction. The lower track is at least partially parallel to the upper track and defines a gap therebetween with the upper track, through which the guide member at least partially passes.

[0010] In one or more embodiments of the present invention, the above-described guiding structure further includes a plurality of sensing units. The sensing units are distributed along a first direction on one of the upper track and the lower track, and the sensing units are respectively configured to sense the guiding element.

[0011] In one or more embodiments of the present invention, the above-described guide structure further includes a plurality of positioning portions. The positioning portions are distributed along a first direction on the lower rail, and are elastically connected to the lower rail and configured to provide positioning for the guide member.

[0012] In one or more embodiments of the present invention, the above-described moving device includes a main body and a telescopic arm. The main body is configured to move at least partially along a first direction and a second direction. The telescopic arm is connected to the main body and configured to extend and retract along a third direction to connect to or disconnect from the guide. The first direction, the second direction, and the third direction are perpendicular to each other.

[0013] In one or more embodiments of the present invention, the telescopic arm described above is further configured to push the cover so that the cover covers the bottom.

[0014] According to one embodiment of the present invention, a switch cover device includes a base plate, a guide structure, a support structure, at least one test seat, and a moving device. The guide structure extends at least partially along a first direction. The support structure is at least partially parallel to the guide structure and configured to move at least partially toward the guide structure. The test seat is located between the guide structure and the support structure. The test seat includes a bottom, a first cover, a second cover, and a driving portion. The bottom is disposed on the base plate and configured to accommodate a wafer. The first cover is pivotally connected to the bottom and configured to cover the bottom. The second cover is pivotally connected to the first cover. The driving portion includes a body, a first guide member, and a second guide member. The body is pivotally connected to the second cover, and the first and second guide members are disposed on opposite sides of the body. The first guide member is movably connected to the guide structure, and the second guide member is movably connected to the support structure after the support structure moves at least partially toward the guide structure. The moving device is configured to connect to the first guide member and drive the driving portion to move relative to the guide structure along the first direction.

[0015] In one or more embodiments of the present invention, the above-described support structure includes a bracket and a support member. The support member is movably connected to the bracket and configured to move closer to or further away from the guide structure relative to the bracket. When the support member moves closer to the guide structure relative to the bracket, the second guide member can support and move on the support member.

[0016] In one or more embodiments of the present invention, a first angle is formed between the first cover and the bottom, and a second angle is formed between the second cover and the first cover, with the first angle and the second angle facing away from each other.

[0017] In one or more embodiments of the present invention, the above-described guiding structure includes an upper track and a lower track. The upper track extends along a first direction. The lower track is at least partially parallel to the upper track and defines a gap therebetween with the upper track, and the first guiding member at least partially passes through the gap.

[0018] In one or more embodiments of the present invention, the above-described moving device includes a main body and a telescopic arm. The main body is configured to move at least partially along a first direction and a second direction. The telescopic arm is connected to the main body and configured to extend and retract along a third direction to connect to or disconnect from the first guide member. The first direction, the second direction, and the third direction are perpendicular to each other.

[0019] The above-described embodiments of the present invention have at least the following advantages: the cover-opening device is applicable to system-level testing or final testing of wafers, and the moving device moves in a single direction, thus controlling the opening and closing action of the cover-opening device, thereby reducing the complexity and freedom of the cover-opening action. Furthermore, the cover-opening device can easily and accurately open and close the test sockets (including clamshell test sockets and Z-type test sockets), which helps to improve the success rate of placing or picking up wafers using the cover-opening device. In addition, the cover-opening device can replace manual cover-opening, thereby reducing the operating costs of pre-burn-in testing.

Implementation Method

[0021] Several embodiments of the present invention will be disclosed below with reference to the drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and elements will be shown in a simple schematic manner in the drawings, and in all drawings, the same reference numerals will be used to denote the same or similar elements. And, where feasible, features of different embodiments can be used interchangeably.

[0022] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, meanings that are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as having the meaning consistent with the relevant field of this invention. Unless specifically defined, these terms will not be interpreted as having idealized or overly formal meanings.

[0023] Please refer to Figure 1. Figure 1 is a perspective view illustrating a switch cover device 100 according to an embodiment of the present invention. In this embodiment, as shown in Figure 1, a switch cover device 100 includes a base plate 110, a guide structure 120, and at least one test socket 130. In a preferred embodiment, the base plate 110 may be a test circuit board, such as a pre-burn-in circuit board. The guide structure 120 extends at least partially along a first direction D1. For example, the guide structure 120 may be disposed on the base plate 110, or the base plate 110 and the guide structure 120 may be respectively disposed on a frame. The test socket 130 includes a bottom 131, a cover portion 132, a locking portion 133, and a bendable driving portion 134, and the test socket 130 is also referred to as a "clamshell test socket". The bottom 131 is disposed on the base plate 110 and configured to accommodate a chip (not shown), and the chip may be a packaged finished IC or a bare die, etc. A cover portion 132 is resiliently pivotally connected to a bottom portion 131 and configured to cover the bottom portion 131. As shown in Figure 1, the cover portion 132 covers the bottom portion 131 to hold a wafer therein. A locking portion 133 is disposed on the bottom portion 131 and configured to latch the cover portion 132. As shown in Figure 1, the locking portion 133 latches the cover portion 132 to maintain the cover portion 132 covering the bottom portion 131. A bendable drive portion 134 has opposing first ends 134a and second ends 134b. The first end 134a is pivotally connected to the bottom portion 131 and mechanically connected to the locking portion 133, and is configured to drive the locking portion 133 to latch or release the cover portion 132. The second end 134b is movably connected to the guide structure 120 along a first direction D1. In a preferred embodiment, the bottom 131 may be a probe holder with multiple test probes for testing the wafer, while the cover 132 may include temperature control elements such as a heater or a fan for controlling the wafer burn-in temperature.

[0024] More specifically, as shown in Figure 1, the bendable drive unit 134 includes a pivot 1341, a first connecting rod 1342, a second connecting rod 1343, and a guide member 1344. The pivot 1341 defines the aforementioned first end 134a and extends along a second direction D2, which is perpendicular to the first direction D1. The pivot 1341 is connected to one end of the first connecting rod 1342. One end of the second connecting rod 1343 is rotatably connected to the other end of the first connecting rod 1342. The guide member 1344 defines the aforementioned second end 134b and connects to the other end of the second connecting rod 1343.

[0025] Please refer to Figure 2. Figure 2 is a side view of the cover switch device 100 as shown in Figure 1, wherein the telescopic arm 142 of the moving device 140 extends downward and connects to the guide member 1344. In this embodiment, as shown in Figure 2, the cover switch device 100 further includes the moving device 140 (the moving device 140 is not shown in Figure 1 for the sake of simplicity). The moving device 140 is configured to connect to and drive the guide member 1344 (i.e., the second end 134b) to move relative to the guide structure 120 in a first direction D1, so that the pivot 1341 (i.e., the first end 134a) rotates relative to the bottom 131, thereby driving the locking part 133 to engage or disengage the cover part 132.

[0026] More specifically, as shown in Figure 2, the moving device 140 includes a main body 141 and a telescopic arm 142. The main body 141 is configured to move at least partially along a first direction D1 and a second direction D2, both of which are substantially horizontal. The telescopic arm 142 is connected to the main body 141 and configured to extend and retract along a third direction D3 to connect to or disconnect from the guide 1344 of the bendable drive unit 134. As shown in Figure 2, the telescopic arm 142 extends downward and connects to the guide 1344. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other, and the third direction D3 is substantially vertical. Depending on the actual situation, the main body 141 of the moving device 140 may also move along the third direction D3.

[0027] Further, as shown in Figure 2, the guide structure 120 includes an upper rail 121 and a lower rail 122. The upper rail 121 extends along a first direction D1, and the lower rail 122 is at least partially parallel to the upper rail 121, defining a gap G therebetween. The guide member 1344, constrained by the upper rail 121 and the lower rail 122, at least partially passes through the gap G. Driven by the telescopic arm 142, the guide member 1344 moves along the first direction D1 through the gap G between the upper rail 121 and the lower rail 122.

[0028] Please refer to Figures 3 to 5. Figures 3 to 5 are schematic diagrams illustrating the opening of the cover 132 relative to the bottom 131 in Figure 2. For the sake of simplicity, the main body 141 of the moving device 140 is not shown in Figures 3 to 5. As shown in Figure 3, when the telescopic arm 142 continuously drives the guide 1344 to move along the first direction D1 in the gap G, the guide 1344 drives the second link 1343 to move, and causes the first link 1342, together with the rotating shaft 1341, to rotate relative to the bottom 131. As shown in Figure 4, when the guide 1344 reaches the target position P, the rotating shaft 1341 rotates relative to the bottom 131 by a certain angle, and the locking part 133 releases the cover 132, and the cover 132 also elastically opens relative to the bottom 131. In fact, the locking part 133 can easily engage or disengage the cover 132 by utilizing the specific shapes of the pivot 1341 and the locking part 133, along with various mechanical components. This will not be elaborated upon here. As shown in Figure 5, the cover 132 is fully open relative to the bottom 131. In this state, the chip can be placed on the bottom 131 or removed from it. At this point, as shown in Figure 5, the telescopic arm 142 has retracted upwards and disengaged from the guide 1344.

[0029] Furthermore, as shown in Figures 1-5, the guide structure 120 further includes a plurality of sensing units 123. The sensing units 123 are distributed along the lower track 122 in the first direction D1, and each sensing unit 123 is configured to sense the guide member 1344. As shown in Figures 4-5, the sensing units 123 correspond to the target position P. Therefore, when the guide member 1344 reaches the target position P, the user can know from the signal of the sensing unit 123 that the cover 132 should be able to be elastically opened relative to the bottom 131. In addition, in practical applications, the sensing units 123 can also be distributed along the upper track 121 in the first direction D1 according to the actual situation.

[0030] Furthermore, as shown in Figures 1-3, the guide structure 120 further includes a plurality of positioning portions 124. The positioning portions 124 are distributed along the lower rail 122 in the first direction D1, and the positioning portions 124 are elastically connected to the lower rail 122 and configured to provide positioning for the guide member 1344. Specifically, as shown in Figures 2-3, the positioning portions 124 are at least partially aligned with the sensing unit 123, and the positioning portions 124 also correspond to the target position P and have a recessed surface 124S. Therefore, as shown in Figures 4-5, when the guide member 1344 reaches the target position P, the guide member 1344 will press against the recessed surface 124S of the positioning portion 124 (the positioning portion 124 is blocked by the second link 1343 and the guide member 1344 in Figures 4-5, so please refer to Figures 1-3) and be limited by the recessed surface 124S, thereby improving the accuracy of the operation of the cover opening and closing device 100.

[0031] Please refer to Figures 6 and 7. Figures 6 and 7 are schematic diagrams illustrating the process of the cover 132 covering the bottom 131 as shown in Figure 5. In actual operation, after the wafer has been placed on the bottom 131 or removed from the bottom 131, as shown in Figure 6, the telescopic arm 142 of the moving device 140 is further configured to push the cover 132, so that the cover 132 rotates relative to the bottom 131 to cover the bottom 131, until the locking part 133 latches the cover 132, as shown in Figure 7. At this time, the telescopic arm 142 drives the guide 1344 to move in the opposite direction in the gap G, and the shape of the test socket 130 is as shown in Figure 2, until the bendable driving part 134 returns to the initial shape, as shown in Figure 1, and the operation process of placing the wafer in the test socket 130 or removing the wafer from the test socket 130 is also completed.

[0032] Please refer to Figure 8. Figure 8 is a perspective view illustrating a switch cover device 100' according to another embodiment of the present invention. Unlike the above embodiments, in this embodiment, as shown in Figure 8, the switch cover device 100' further includes a support structure 150, and the appearance of the test seat 130Z is also different from that of the test seat 130 in the above embodiments.

[0033] First, in this embodiment, as shown in Figure 8, the support structure 150 is at least partially parallel to the guide structure 120. For example, the support structure 150 may be disposed on the base plate 110 or the frame described above. The support structure 150 is configured to move at least partially toward the guide structure 120, while the test seat 130Z is located between the guide structure 120 and the support structure 150.

[0034] Specifically, the support structure 150 includes a bracket 151 and a support member 152. The bracket 151 is connected to the base plate 110 or the aforementioned frame, while the support member 152 is movably connected to the bracket 151 and configured to move closer to or further away from the guide structure 120 relative to the bracket 151 along the second direction D2. In fact, the movement of the support member 152 relative to the bracket 151 can be easily accomplished by equipping it with guide rails, various mechanical parts, and / or various telescopic components, which will not be elaborated here.

[0035] Please refer to Figure 9. Figure 9 is a perspective view of the switch cover device 100' as shown in Figure 8, wherein the telescopic arm 142 of the moving device 140 extends downward and connects to the first guide member 1372. In this embodiment, as shown in Figure 9, the test socket 130Z includes a bottom 131, a first cover 135, a second cover 136, and a driving part 137, and the test socket 130Z is also referred to as a "Z-type test socket". The bottom 131 is disposed on the base plate 110 and is configured to accommodate a wafer (not shown). The first cover 135 is pivotally connected to the bottom 131 and is configured to cover the bottom 131. The second cover 136 is pivotally connected to the first cover 135. The driving unit 137 includes a body 1371, a first guide member 1372, and a second guide member 1373. The body 1371 is pivotally connected to the second cover 136. The first guide member 1372 and the second guide member 1373 are disposed on opposite sides of the body 1371. The first guide member 1372 is movably connected to the guide structure 120. The second guide member 1373 is movably connected to the support structure 150 after the support structure 150 moves at least partially toward the guide structure 120. As shown in Figure 9, the telescopic arm 142 of the moving device 140 extends downward along the third direction D3 and is connected to the first guide member 1372.

[0036] Please refer to Figure 10. Figure 10 is a perspective view of the switch cover device 100' as shown in Figure 9, wherein the support member 152 moves relative to the bracket 151 to approach the guide structure 120 and support the second guide member 1373. In this embodiment, as shown in Figure 10, when the telescopic arm 142 drives the first guide member 1372 of the driving part 137 to move along the first direction D1 in the gap G of the guide structure 120, the second cover part 136 of the test seat 130Z rotates relative to the first cover part 135, and the second guide member 1373 of the driving part 137 also moves upward accordingly. When the first guide member 1372 reaches the target position P, the second guide member 1373 is also slightly higher than the support member 152. At this time, the support member 152 is close to the guide structure 120 relative to the bracket 151 and is at least partially located below the second guide member 1373, which can be supported on the support member 152.

[0037] Please refer to Figure 11. Figure 11 is a perspective view of the cover opening and closing device 100' shown in Figure 10, wherein the telescopic arm 142 drives the first guide member 1372 to move in the opposite direction. In this embodiment, as shown in Figure 11, after the second guide member 1373 of the driving part 137 is supported on the support member 152, the telescopic arm 142 of the moving device 140 drives the first guide member 1372 (the first guide member 1372 is covered by the second cover part 136 in Figure 11, so please refer to Figures 9 and 10) to move in the opposite direction and leave the target position P. Since the second guide member 1373 is supported by the support member 152, the first cover part 135 rotates relative to the bottom 131 to expose the bottom 131. In this case, the wafer can be placed on the bottom 131 or removed from the bottom 131.

[0038] Furthermore, as shown in Figure 11, a first included angle θ1 is formed between the first cover portion 135 and the bottom portion 131, and a second included angle θ2 is formed between the second cover portion 136 and the first cover portion 135, while the first included angle θ1 and the second included angle θ2 are opposite to each other.

[0039] Subsequently, in actual operation, after the wafer has been placed on the bottom 131 or removed from the bottom 131, the telescopic arm 142 of the moving device 140 moves the first guide 1372 to return the test socket 130Z to the state shown in Figure 10. At this time, the support 152 moves away from the guide structure 120 relative to the bracket 151 along the second direction D2, so that the second guide 1373 of the driving part 137 is no longer supported on the support 152. Then, the telescopic arm 142 of the moving device 140 moves the first guide 1372 in the opposite direction again to return the test socket 130Z to the state shown in Figure 9, and the operation of placing the wafer in the test socket 130Z or removing the wafer from the test socket 130Z is also completed.

[0040] In summary, the technical solution disclosed in the above embodiments of the present invention has at least the following advantages: the cover-opening device is applicable to system-level testing or final testing of wafers, and the moving device moves in a single direction, thus controlling the opening and closing action of the cover-opening device, thereby reducing the complexity and degree of freedom of the cover-opening action. Furthermore, the cover-opening device can easily and accurately open and close the test sockets (including clamshell test sockets and Z-type test sockets), which helps to improve the success rate of placing or picking up wafers using the cover-opening device. In addition, the cover-opening device can replace manual cover-opening, thereby reducing the operating cost of testing.

[0041] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0020] Figure 1 is a perspective view illustrating a cover switch device according to one embodiment of the present invention. Figure 2 is a side view illustrating the cover switch device according to Figure 1, wherein the telescopic arm of the moving device extends downward and connects to the guide member. Figures 3-5 are schematic diagrams illustrating the process of the cover opening relative to the bottom in Figure 2. Figures 6-7 are schematic diagrams illustrating the process of the cover covering the bottom in Figure 5. Figure 8 is a perspective view illustrating a cover switch device according to another embodiment of the present invention. Figure 9 is a perspective view illustrating the cover switch device according to Figure 8, wherein the telescopic arm of the moving device extends downward and connects to the first guide member. Figure 10 is a perspective view illustrating the cover switch device according to Figure 9, wherein the support member moves relative to the bracket to approach the guide structure and support the second guide member. Figure 11 is a perspective view illustrating the cover switch device according to Figure 10, wherein the telescopic arm drives the first guide member to move in the opposite direction. [Biomaterial Storage]

[0043] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A cover opening / closing device, comprising: a base plate; a guide structure extending at least partially along a first direction; at least one test socket, comprising: a bottom disposed on the base plate and configured to accommodate a wafer; a cover resiliently pivotally connected to the bottom and configured to cover the bottom; a locking portion disposed on the bottom and configured to engage the cover portion; and a bendable drive portion having a first end and a second end opposite to each other, the first end being pivotally connected to the bottom and mechanically connected to the locking portion, the second end being movably connected to the guide structure; and a moving device configured to connect to and drive the second end to move relative to the guide structure along the first direction, such that the first end rotates relative to the bottom, thereby engaging or disengaging the cover portion.

2. The cover opening and closing device as claimed in claim 1, wherein the bendable actuating part comprises: a pivot defining the first end and extending along a second direction perpendicular to the first direction; a first link connected to one end of the pivot; a second link rotatably connected to the other end of the first link; and a guide defining the second end and connected to the other end of the second link.

3. The cover opening and closing device as claimed in claim 2, wherein the guide structure comprises: an upper rail extending along the first direction; and a lower rail, at least partially parallel to the upper rail and defining a gap therebetween with the upper rail. The guide element at least partially traverses the gap.

4. The cover opening and closing device as claimed in claim 3, wherein the guide structure further comprises: a plurality of sensing units distributed along the first direction on one of the upper track and the lower track, the sensing units being respectively configured to sense the guide member.

5. The cover opening and closing device as claimed in claim 3, wherein the guide structure further comprises: a plurality of positioning portions distributed along the lower rail in the first direction, the positioning portions being resiliently connected to the lower rail and configured to provide positioning for the guide member.

6. The cover opening / closing device as claimed in claim 2, wherein the moving device comprises: a body configured to move at least partially along the first direction and the second direction; and a telescopic arm connected to the body and configured to extend and retract along a third direction to connect or disconnect the guide, wherein, The first direction, the second direction, and the third direction are perpendicular to each other.

7. The cover opening and closing device as claimed in claim 6, wherein the telescopic arm is further configured to push the cover so that the cover covers the bottom.

8. A cover opening / closing device, comprising: a base plate; a guide structure extending at least partially along a first direction; a support structure at least partially parallel to the guide structure and configured to move at least partially toward the guide structure; and at least one test socket located between the guide structure and the support structure, the test socket comprising: a bottom disposed on the base plate and configured to receive a wafer; and a first cover pivotally connected to the bottom and configured to cover the bottom. A second cover portion, pivotally connected to the first cover portion; and a driving portion, comprising a body, a first guide member, and a second guide member, the body being pivotally connected to the second cover portion, the first guide member and the second guide member being disposed on opposite sides of the body, the first guide member being movably connected to the guide structure, and the second guide member being movably connected to the support structure after the support structure moves at least partially toward the guide structure; and a moving device configured to connect to the first guide member and drive the driving portion to move relative to the guide structure along the first direction.

9. The cover opening / closing device as claimed in claim 8, wherein the supporting structure comprises: a bracket; and a support member movably connected to the bracket and configured to move closer to or further away from the guide structure relative to the bracket, wherein, When the support member approaches the guide structure relative to the bracket, the second guide member can support and move on the support member.

10. The cover switch device as claimed in claim 8, wherein a first angle is formed between the first cover portion and the bottom, and a second angle is formed between the second cover portion and the first cover portion, the first angle and the second angle being opposite to each other.

11. The cover opening and closing device as claimed in claim 8, wherein the guide structure comprises: an upper rail extending along the first direction; and a lower rail at least partially parallel to the upper rail and defining a gap therebetween with the upper rail. The first guide element at least partially traverses the gap.

12. The cover opening / closing device as claimed in claim 8, wherein the moving device comprises: a body configured to move at least partially along the first direction and a second direction; and a telescopic arm connected to the body and configured to extend and retract along a third direction to connect to or disconnect from the first guide, wherein, The first direction, the second direction, and the third direction are perpendicular to each other.

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