Optical engine module and methods for forming the same

Abstract

The photonic engine module may include a backplane, fiber array units attached to the backplane, a photonic engine die attached to the backplane adjacent to the fiber array units, and a socket attached to the backplane and connected to the photonic engine die. Methods of forming the photonic engine module may include attaching the fiber array units to the backplane, attaching the photonic engine die to the backplane adjacent to the fiber array units, and attaching the backplane to the socket, such that the fiber array units and the photonic engine die are located between the backplane and the socket.

Description

Prior Technology

[0001] A fiber optic array unit (FAU) is an optical element used in optical systems and devices. A FAU can manipulate and / or guide optical signals transmitted through one or more optical fibers.

[0002] A fiber optic array unit may include connectors for multi-fiber push-on / pull-off (MPO) units, or one or more optical fiber ports that can serve as optical signal input / output (I / O) interfaces. These fiber optic ports can be arranged in a linear or two-dimensional array. Each fiber optic array unit may also include a fiber holder (fiber receptacle) for each fiber optic port. The fiber holder (fiber receptacle) securely holds the fiber to maintain precise alignment and minimize signal loss.

[0003] An optical engine (OE) is a component in an optical fiber system that manages and manipulates optical signals. An OE can comprise a combination of optical elements, such as lenses, mirrors, and prisms, arranged to efficiently couple light between various optical fibers and other optical components. The role of an OE can include aligning and focusing the light beam to maximize the efficiency of optical transmission, thereby minimizing losses and ensuring optimal performance of the optical fiber network. OEs can be used in various configurations, including single-fiber or multi-fiber arrangements, depending on the specific requirements of the system. Simple Explanation of the Diagram

[0004] The best understanding of the various forms disclosed herein can be obtained from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the various feature components are not drawn to scale. In fact, for clarity, the dimensions of the various feature components can be arbitrarily increased or decreased. Figure 1A is a vertical cross-sectional view of a photonic engine (photonic engine) module according to one or more embodiments. Figure 1B is a perspective view of a photonic engine module according to one or more embodiments. Figure 1C is a perspective view of the photonic engine chip and socket of a photonic engine module according to one or more embodiments. Figure 2A is a vertical cross-sectional view of an intermediate structure including a fiber optic array unit according to one or more embodiments. Figure 2B is a perspective view of an intermediate structure including a back panel according to one or more embodiments. Figure 2C is a vertical cross-sectional view of an intermediate structure including a photonic engine die according to one or more embodiments. Figure 2D is a vertical cross-sectional view of an intermediate structure including a socket according to one or more embodiments. Figure 3 is a flowchart illustrating a method for forming a photonic engine module according to one or more embodiments. Figure 4 is a vertical cross-sectional view of a photonic engine module having a first alternative design according to one or more embodiments. Figure 5A is a vertical cross-sectional view of an intermediate structure including a fiber array unit in a first alternative design of a photonic engine module according to one or more embodiments. Figure 5B is a vertical cross-sectional view of an intermediate structure including a backplate in a first alternative design of a photonic engine module according to one or more embodiments. Figure 5C is a vertical cross-sectional view of an intermediate structure including a photonic engine die in a first alternative design of a photonic engine module according to one or more embodiments. Figure 5D is a vertical cross-sectional view of an intermediate structure including a socket in a first alternative design of a photonic engine module according to one or more embodiments. Figure 6 is a vertical cross-sectional view of a photonic engine module having a second alternative design according to one or more embodiments. Figure 7A is a vertical cross-sectional view of an intermediate structure including a fiber array unit in a second alternative design of a photonic engine module according to one or more embodiments. Figure 7B is a vertical cross-sectional view of an intermediate structure including a backplate in a second alternative design of a photonic engine module according to one or more embodiments. Figure 7C is a vertical cross-sectional view of an intermediate structure including a photonic engine die in a first alternative design of a photonic engine module according to one or more embodiments. Figure 7D is a vertical cross-sectional view of an intermediate structure including a socket in a second alternative design of a photonic engine module according to one or more embodiments. Figure 8 is a vertical cross-sectional view of a photonic engine module having a third alternative design according to one or more embodiments. Figure 9A is a vertical cross-sectional view of an intermediate structure including a general socket on a fiber array unit in a third alternative design of a photonic engine module according to one or more embodiments. Figure 9B is a vertical cross-sectional view of an intermediate structure including a backplate in a third alternative design of a photonic engine module according to one or more embodiments. Figure 9C is a vertical cross-sectional view of an intermediate structure including a photonic engine die in a third alternative design of a photonic engine module according to one or more embodiments. Figure 9D is a vertical cross-sectional view of the intermediate structure including the socket in a third alternative design of the photonic engine module according to one or more embodiments. Figure 10 is a vertical cross-sectional view of a photonic engine module having a fourth alternative design according to one or more embodiments. Figure 11 is an exploded perspective view of a photonic engine module having a fifth alternative design according to one or more embodiments. Figure 12 is a vertical cross-sectional view of a packaging module according to one or more embodiments. Figure 13 is a vertical cross-sectional view of a packaging structure including a packaging module according to one or more embodiments. Figure 14 is a vertical cross-sectional view of a packaging module having a first alternative design according to one or more embodiments. Figure 15 is a vertical cross-sectional view of a packaging structure having a first alternative design according to one or more embodiments. Figure 16 is a vertical cross-sectional view of a packaging module having a second alternative design according to one or more embodiments. Figure 17 is a vertical cross-sectional view of a packaging structure having a second alternative design according to one or more embodiments. Implementation

[0005] The following disclosure provides numerous different embodiments or illustrations to implement various features of the invention. The specific examples of components and configurations described below are for the purpose of simplifying this disclosure. These are, of course, merely illustrative and are not intended to be limiting. For example, the dimensions of elements are not limited to the ranges or values ​​disclosed, but may depend on process conditions and / or the characteristics required by the apparatus. Furthermore, in the following description, the formation of a first feature on or above a second feature includes embodiments where the first and second features are in direct contact, as well as embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. For simplicity and clarity, various features may be drawn at any scale.

[0006] Furthermore, spatially relative terms such as "below," "below," "lower," "above," and "upper" may be used herein to facilitate the description of the relationship between one element or feature shown in the figure and another (other) element or feature. These spatially relative terms are also intended to encompass different orientations of the device during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein can be interpreted accordingly.

[0007] Figures 1A to 1C are various views of an optical engine (OE) module 100 according to one or more embodiments. Figure 1A is a vertical cross-sectional view of the optical engine module 100 according to one or more embodiments. Figure 1B is a perspective view of the optical engine module 100 according to one or more embodiments. Figure 1C is a perspective view of the optical engine die (OE die) 130 and socket 140 of the optical engine module 100 according to one or more embodiments.

[0008] As shown in Figure 1A, the photonic engine module 100 may include a backplate 110, a fiber array unit 120 attached to the backplate 110, a photonic engine die 130 attached to the backplate 110 adjacent to the fiber array unit 120, and a socket 140 (e.g., a socket interposer) attached to the backplate 110 and connected to the photonic engine die 130.

[0009] The photonic engine module 100 may include a compact assembly of optical components designed to perform specific functions related to the manipulation, transmission, and / or detection of light. The photonic engine module 100 is commonly found in various optical systems and devices, including imaging systems, displays, optical communication systems, and sensors. The photonic engine module 100 is typically used in the field of co-packaged optics (CPOs).

[0010] The optical elements of the photonic engine module 100 may be included in the fiber array unit 120 and the photonic engine die 130. In particular, the photonic engine module 100 may include a light source (not shown). The light source may include, for example, a laser diode, a light-emitting diode (LED), etc. The light source can generate an initial beam of light, which is manipulated and guided by the optical system in the photonic engine module 100.

[0011] The optical elements of the photonic engine module 100 may also include one or more optical lenses, optical mirrors, optical filters, and beam splitters. Optical lenses can focus, collimate, or diverge the light beam. Optical mirrors can be used to redirect or fold the light path within the module, enabling a compact and efficient optical design. Optical filters (e.g., bandpass filters, notch filters, polarizing filters, etc.) can selectively transmit or block light of specific wavelengths or polarization states. Beam splitters can split the light beam in the photonic engine module 100 into multiple beams or combine multiple beams into one beam, for example, for use in interferometry or laser projection systems.

[0012] The optical elements of the photonic engine module 100 may also include one or more optical waveguides, optical fibers, and photodetectors. Optical waveguides can guide light within the photonic engine module 100 and can be used for beam steering, coupling light between different components, or long-distance light transmission. Optical fibers can also be used to transmit light within the photonic engine module 100. Photodetectors (e.g., photodiodes, photocrystals, etc.) can be used to convert optical signals into electrical signals (or vice versa) and to detect and measure light intensity, wavelength, or polarization within the photonic engine module 100.

[0013] The photonic engine module 100 may also include control electronics (not shown), such as a light source driver, signal processing circuitry for the photodetector, and a feedback mechanism for controlling the optical elements. The control electronics of the photonic engine module 100 may also include a microcontroller or digital signal processor to provide intelligence and control functions for the module, enabling automation, optimization, or integration with other systems.

[0014] As further shown in Figure 1A, the back plate 110 may have a substantially hollow cuboid shape. The back plate 110 may include a plate portion 110a and a sidewall portion 110b projecting downward from the plate portion 110a. The plate portion 110a and the sidewall portion 110b may be integrally formed as a single unit, or they may be formed separately and connected, for example, through an adhesive (e.g., epoxy adhesive, silicone adhesive, etc.).

[0015] The back panel 110 may have a closed design, wherein the side wall portion 110b is substantially closed around the perimeter of the back panel 110, but includes one or more openings. Alternatively, the back panel 110 may have an open design, wherein the side wall portion 110b may include a post formed at the corner of the plate portion 110a of the back panel 110.

[0016] The backplate 110 may have a width W110 in the x-direction, ranging from 1 mm to 20 mm. The backplate 110 may have a length L110 in the y-direction (see Figure 1B), ranging from 1 mm to 30 mm. The backplate 110 may have a height H110 in the z-direction, ranging from 0.5 mm to 5.0 mm. Other dimensions are also within the scope of this disclosure.

[0017] The backplate 110 may be formed of a metallic material (e.g., aluminum, steel, etc.), a plastic material (e.g., high-density polyethylene (HDPE)), or a ceramic material. Other suitable materials are also within the scope of this disclosure. The backplate 110 may be formed, for example, by machining, stamping, molding (e.g., injection molding). In at least one embodiment, the backplate 110 may be integrally formed as a single-piece structure via an injection molding process. Other methods of forming the backplate 110 are also within the scope of this disclosure.

[0018] The fiber optic array unit 120 may be located inside the backplane 110. The fiber optic array unit 120 may be made of materials such as SiO2, silicon, quartz glass, or ceramic materials (e.g., alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), etc.). Polymer materials such as epoxy resin and polyimide may be used as adhesives or bonding materials in the fiber optic array unit 120.

[0019] The fiber optic array unit 120 can be used to transmit optical signals to and from the optical chip 130 within the photonic engine module 100. For example, the fiber optic array unit 120 may include a fiber connection port 125 and one or more front-side mirrors (not shown) for guiding (redirecting) and / or manipulating optical signals from the fiber connection port 125. The front-side mirrors may include high-quality reflective surfaces that can be positioned at a specific angle within the fiber optic array unit 120. The front-side mirrors can be used to perform optical processing such as beam steering, signal routing, or distribution.

[0020] The fiber array unit 120 may also include one or more actuators (not shown) to control the position of the front reflector. The actuators allow for precise adjustment of the reflector angle, thereby enabling dynamic control of the optical path.

[0021] The fiber optic array unit 120 may be enclosed within a housing (not shown) that provides mechanical protection and ensures proper alignment and fixation of the various parts of the fiber optic array unit 120. The fiber optic array unit 120 may also include a microcontroller or microprocessor (not shown) for controlling the operation of the fiber optic array unit 120. In particular, the microcontroller or microprocessor can control actuators to allow remote and / or automatic control of the position of the front-side reflector. This is particularly useful in dynamic optics systems.

[0022] The fiber optic array unit 120 with a front-side reflector can be used, for example, in optical switching systems to redirect optical signals to different paths. The fiber optic array unit 120 can also be used in optical test and measurement systems to adjust beam direction for testing and alignment. The fiber optic array unit 120 can also be used in laser systems to control the beam path in various applications such as laser cutting and medical surgery. The fiber optic array unit 120 can also be used in optical communication systems to manage signal direction in optical networks or for beamforming of optical antennas.

[0023] As shown in Figure 1A, the fiber array unit 120 may include a fiber optic port 125 on its back side 120s. Optical signals may be input to and output from the photonic engine module 100 via the fiber optic port 125. The back side 120s of the fiber array unit 120 may be exposed to the outside of the backplate 110. In at least one embodiment, the back side 120s of the fiber array unit 120 may be substantially aligned with the outer surface of the sidewall portion 110b of the backplate 110. In at least one embodiment, the sidewall portion 110b of the backplate 110 may include an opening 111, and the back side 120s of the fiber array unit 120 may be exposed to the outside of the backplate 110 through the opening 111.

[0024] Fiber optic port 125 can be configured to detachably receive a multi-fiber push-on / pull-off (MPO) unit 50. The MPO unit 50 can be connected to one or more fibers in an optical transmission line. Fiber optic array unit 120 may also include an optical path 126. Fiber optic port 125 can be substantially aligned with the optical path 126 in the fiber optic array unit 126. Inserting the MPO unit 50 into fiber optic port 125 couples fiber optics to the optical path 126 in the fiber optic array unit 120.

[0025] In at least one embodiment, the photonic engine module 100 may include a fiber array unit holder 128. The fiber array unit holder 128 secures the fiber array unit 120 to the backplane 110. The fiber array unit holder 128 allows the fiber array unit 120 to be detached from the photonic engine die 130.

[0026] The fiber optic array unit support 128 may have a substantially L-shaped cross-section. Other shapes are also within the scope of this disclosure. The fiber optic array unit support 128 may be formed of, for example, polymers, plastics, ceramics, etc. Other materials are also within the scope of this disclosure.

[0027] A first end 128a of the fiber optic array unit bracket 128 may be attached to the fiber optic array unit 120. In at least one embodiment, the first end 128a of the fiber optic array unit bracket 128 may be detachably connected to the fiber optic array unit 120 via one or more guide pins 22. The guide pins 22 may be formed on the upper surface 122 of the fiber optic array unit 120 and protrude into an opening in the first end 128a of the fiber optic array unit bracket 128. The guide pins 22 allow the fiber optic array unit 128 to be easily detached from the fiber optic array unit bracket 128. The first end 128a of the fiber optic array unit bracket 128 may also be selectively or additionally attached to the upper surface of the fiber optic array unit 120 via an adhesive (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.).

[0028] The second end 128b of the fiber optic array unit bracket 128 may be located in a recessed portion 112 of the plate portion 110a of the backplate 110. The second end 128b of the fiber optic array unit bracket 128 may also be attached to the surface of the recessed portion 112 via an adhesive (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.). In at least one embodiment, the second end 128b of the fiber optic array unit bracket 128 may be attached to the surface of the recessed portion 112 via an optical gel (e.g., silicone) (not shown).

[0029] The second end 128b can also be attached to the photon engine die 130 via the adhesive layer 160. The adhesive layer 160 may include optical gel, epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure.

[0030] As further shown in Figure 1A, the photonic engine die 130 may be located adjacent to the fiber array unit 120 and the fiber array unit support 128. The photonic engine die 130 may be separated from the fiber array unit 120 by a small gap of less than about 5 mm in length to provide a substantially compact design. In at least one embodiment, the photonic engine die 130 may contact the fiber array unit 120. The bottom surface of the photonic engine die 130 may be separated from the bottom surface of the fiber array unit 120 by a distance L1. The distance L1 may not be limited to any particular value, but may be used in manufacturing to ensure proper alignment of the fiber array unit 120 and the photonic engine die 130.

[0031] The photon engine die 130 may also include a substantially cubic shape. The photon engine die 130 may be attached to the plate portion 110a of the backplate 110 via an adhesive layer 162. The adhesive layer 162 may include epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure.

[0032] The photonic engine die 130 may include one or more support structure layers 131. The support structure 131 may include, for example, bulk silicon or other suitable materials. The photonic engine die 130 may also include photonic engine circuitry 132 within the support structure 131. The photonic engine circuitry 132 may include, for example, one or more electronically integrated circuits (EICs) and one or more photonic integrated circuits (PICs).

[0033] In at least one embodiment, the photonic engine circuit 132 may include various optical elements, such as light sources (e.g., laser diodes, light-emitting diodes (LEDs), etc.), optical lenses, optical mirrors, optical filters and beam splitters, optical waveguides, optical fibers, photodetectors, control electronics (e.g., light source driving circuits, photodetector signal processing circuits, feedback control circuits), microcontrollers, digital signal processors (DSPs), etc. The photonic engine circuit 132 may be connected to electrical wiring 134 (e.g., metal traces, metal vias, etc.) and optical path 136. Optical path 136 may constitute an optical input / output (I / O) and may be coupled to one or more photonic integrated circuits in the photonic engine circuit 132. Optical path 136 may include, for example, optical waveguides, optical fibers, etc. Optical path 136 may be substantially aligned with optical path 126 in the fiber optic array unit 120.

[0034] The photon engine circuit 132 can receive optical signals on the optical path 136, convert the optical signals into electrical signals, and transmit the electrical signals through the electrical wiring 134. The photon engine circuit 132 can receive electrical signals on the electrical wiring 134, convert the electrical signals into optical signals, and transmit the optical signals through the optical path 136.

[0035] The photonic engine die 130 may also include a plurality of connector contacts 138 projecting from the bottom surface of the photonic engine die 130. The connector contacts 138 may be formed of a conductive material, such as gold, copper, or other suitable metallic material. In at least one embodiment, the connector contacts 138 may be included in a connector contact array 138A (see FIG. 1C). The connector contact array 138A may be a 2x2 array of connector contacts 138 on the bottom surface of the photonic engine die 130.

[0036] The connector contact windows 138 may include fewer than about 20,000 in number, with a contact window density of less than about 50 contact windows per square millimeter, and a contact window spacing (in the x and y directions) of less than about 200 micrometers. The connector contact windows 138 may be electrically coupled to the photonic engine circuitry 132 via electrical wiring 134.

[0037] As shown in FIG1A, the socket 140 may include an upper surface 140s1 facing the backplate 110. The upper surface 140s1 may include one or more guide pins 142. In at least one embodiment, the guide pins 142 may be located at at least all four (4) corners of the socket 140. The guide pins 142 may be integrally formed with the body of the socket 140. The guide pins 142 may be inserted into openings 113 formed at the bottom of the sidewall portion 110b of the backplate 110. The guide pins 142 may help to properly align the backplate 110 with the socket 140. The photon engine module 100 may include a fastening mechanism (not shown), such as a latch or socket fixing screw, to securely attach the backplate 110 to the socket 140.

[0038] The receptacle 140 can be configured to allow fine-pitch attachment. The receptacle 140 may include a pin-type receptacle 140 utilizing probes, microelectromechanical (MEMS) pins, etc. In particular, the receptacle 140 may include a plurality of connector pins 144 in its upper surface 140s1. The connector pins 144 may protrude upward from the upper surface 140s1 of the receptacle 140 toward the photon engine die 130. The connector pins 144 may be formed of the same material as the connector contact window 138. In particular, the connector pins 144 may be formed of a conductive material, such as gold, copper, or other suitable metallic material. In at least one embodiment, the connector pins 144 may be included in a connector pin array 144A (see FIG. 1C). The connector pin array 144A may be a 2x2 array of connector pins 144 on the upper surface 140s1 of the receptacle 140.

[0039] Connector pins 144 can contact connector contact windows 138 of the photonic engine chip 130 to electrically couple the photonic engine chip 130 to the socket 140. A robust coupling between the photonic engine chip 130 and the socket 140 is maintained by compression of the connector pins 144 by the connector pads 138. Connector pins 144 can detachably contact connector contact windows 138, allowing the photonic engine chip 130 to be detachably connected to the socket 140.

[0040] Connector pins 144 may have a low profile, with a height of less than about 1 mm. Connector pins 144 may have a number, shape, and arrangement corresponding to the number, shape, and arrangement of connector contact windows 138. In particular, connector pins 144 may include fewer than about 20,000 pins, a density of less than about 50 apertures per square millimeter, and an aperture pitch of less than about 200 micrometers.

[0041] The upper surface 140s1 of the socket 140 may have a substantially flat shape. The width of the socket 140 in the x-direction may be substantially the same as the width W110 of the backplate 110 (e.g., in the range of 1 mm to 20 mm). The length of the socket 140 in the y-direction may be substantially the same as the length L110 of the backplate 110 (see FIG. 1B). In at least one embodiment, the length of the socket 140 in the y-direction may be greater than the length L110 of the backplate 110. In at least one embodiment, the length of the socket 140 in the y-direction may be in the range of 1 mm to 50 mm. The height of the socket 140 in the z-direction may be less than the height H110 of the backplate 110. In at least one embodiment, the height of the socket 140 (including the height of the lead pin 142) may be less than 50% of the height H110 of the backplate 110. In at least one embodiment, the height of the socket 140 may be less than 5 mm.

[0042] The socket 140 may have a structure similar to an interposer. In at least one embodiment, the socket 140 may include one or more dielectric layers (e.g., a silicon dioxide layer). The socket 140 may include one or more interconnect structures 146 formed in the dielectric layers. The interconnect structures 146 may be formed of one or more layers of metal, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, Cr, Ni, Sn, Ti, Ta, Au, TiN, TaN, WN, etc.). The interconnect structures 146 may include, for example, multiple metal traces (e.g., copper traces) and metal vias (e.g., copper vias). The interconnect structures 146 may be electrically coupled to connector pins 144.

[0043] The socket 140 may also include a plurality of contact pads 148 formed on the lower surface 140s2 of the socket 140. The contact pads 148 may also include one or more layers of metal, metal alloy, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, Cr, Ni, Sn, Ti, Ta, Au, TiN, TaN, WN, etc.). A ball-grid array (BGA) including a plurality of solder balls 150 may be formed on the contact pads 148 on the lower surface 140s2.

[0044] The interconnect structure 146 can electrically couple the connector pins 144 to the contact pads 148 and the ball grid array on the lower surface 140s2 of the socket 140. Therefore, the photonic engine die 130 can be electrically coupled to the ball grid array through the connector contact window 138 of the photonic engine die 130 and the connector pins 144 of the socket 140.

[0045] With this configuration, socket 140 provides input / output (I / O) functionality, allowing photonic engine module 100 to be mounted on a substrate (e.g., a package substrate, interposer, redistributable layer (RDL) structure) and to transmit and receive data from the substrate via a ball grid array. Socket 140 allows components of photonic engine module 110, including backplane 110, fiber array unit 120, and photonic engine die 130, to be detachably connected to the substrate. Socket 140 allows easy replacement of photonic engine die 130 without affecting the functionality of other dies on the substrate (e.g., application-specific integrated circuit dies).

[0046] It should be noted that there are other ways to detachably connect the photonic engine die 130 to the socket 140. Specifically, a connector pin array, including multiple connector pins, can be formed on the bottom surface of the photonic engine die 130. The connector pins 138 may include, for example, probes, microelectromechanical system (MEMS) pins, spring pins, etc. An array of connector pin openings, including multiple connector pins, can be formed on the upper surface 140s1 of the socket 140. The connector pins can be inserted into the connector pin openings to detachably couple the photonic engine die 130 to the socket 140.

[0047] In at least one embodiment, the receptacle 140 may have a structure and function substantially similar to that of a central processing unit (CPU) receptacle. The receptacle 140 may include, for example, a retaining clip that applies a constant force that must be overcome when the connector pin 138 of the photonic engine die 130 is inserted. The receptacle 140 may include a zero insertion force (ZIF) receptacle. The receptacle 140 may also include a pin grid array (PGA) type receptacle or a land grid array (LGA) type receptacle. In embodiments where the photonic engine module 100 includes a latch, the latch can be closed to secure the backplate 110 to the receptacle 140 after the connector contact window 138 is positioned on the connector pin 144. This helps maintain the compressive force of the connector contact window 138 on the connector pin 144, thereby providing good connection and mechanical stability between the connector contact window 138 and the connector pin 144.

[0048] Figures 2A to 2D illustrate various intermediate structures that can be formed in the method of fabricating the photonic engine module 100 according to one or more embodiments. Figure 2A is a vertical cross-sectional view of an intermediate structure including a fiber array unit 120 according to one or more embodiments. It should be noted that various components can be positioned or placed in the method using an electromechanical pick-and-place (PnP) machine.

[0049] In the method of fabricating the photonic engine module 100, a fiber optic array unit bracket 128 can be positioned above the fiber optic array unit 120, such that the lead pins 22 are substantially aligned with the openings in the fiber optic array unit bracket 128. A first end 128a of the fiber optic array unit bracket 128 can be separated from the front side 121 of the fiber optic array unit 120 by a first distance D1 in the x-direction. The first end 128a of the fiber optic array unit bracket 128 can be separated from the back side 120s of the fiber optic array unit 120 by a second distance D2 in the x-direction. The first distance D1 can be less than the second distance D2. In at least one embodiment, the first distance D1 can be less than 20% of the second distance D2.

[0050] Next, the first end 128a of the fiber array unit support 128 can be bonded to the upper surface 122 of the fiber array unit 120 via an adhesive layer. Therefore, the fiber array unit support 128 can be attached to the fiber array unit 120 without the use of an adhesive layer.

[0051] An adhesive layer (not shown) (e.g., epoxy adhesive, silicone adhesive, etc.) may be additionally or alternatively applied to the first end 128a of the fiber array unit holder 128 and / or the upper surface 122 of the fiber array unit 120. The first end 128a of the fiber array unit holder 128 may then contact the upper surface 122 of the fiber array unit 120 through the adhesive layer. The fiber array unit holder 128 may then be clamped onto the fiber array unit 120 until the adhesive layer cures.

[0052] Figure 2B is a vertical cross-sectional view of an intermediate structure including a backplate 110 according to one or more embodiments. As shown in Figure 2B, a fiber array unit 120 attached to a fiber array unit bracket 128 can be inserted into the backplate 110. In particular, the fiber array unit 120 can be inserted into an opening 111 in the sidewall portion 110b of the backplate 110.

[0053] Fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 is substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. Specifically, fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 is exposed to the outside of backplate 110 through opening 111. In at least one embodiment, the upper surface 122 of fiber optic array unit 120 can contact the upper surface of opening 111.

[0054] An optional adhesive layer (not shown) (e.g., epoxy resin adhesive, silicone resin adhesive, etc.) may be applied to the upper surface of the fiber array unit holder 128 and / or the recessed portion 112 in the plate portion 110a of the backplate 110. When the fiber array unit 120 is inserted into the opening 111, the fiber array unit holder 128 may be inserted into the recessed portion 112 in the plate portion 110a of the backplate 110 (see FIG. 1A). Subsequently, the fiber array unit holder 128 and / or the fiber array unit 120 may be clamped onto the backplate 110 until the adhesive layer cures.

[0055] Figure 2C is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 according to one or more embodiments. As shown in Figure 2C, adhesive layers 160 and 162 can be coated onto the upper surface of the photonic engine die 130. Adhesive layers 160 and 162 can be formed as a single layer. Adhesive layers 160 and 162 can be formed from the same material and have substantially the same curing rate.

[0056] The thickness of adhesive layer 160 can be substantially the same as the thickness of adhesive layer 162. The bottom surface 110a-S of the plate portion 110a of the backplate 110 can be substantially coplanar with the bottom surface of the second end 128b of the fiber array unit support 128. Next, the photonic engine die 130 can be pressed into position on the bottom surface 110a-S of the plate portion 110a. Then, the photonic engine die 130 can be clamped onto the backplate 110 until adhesive layers 160 and 162 are cured. Therefore, the second end 128b of the fiber array unit support 128 can be attached to the photonic engine die 130 through adhesive layer 160. The bottom surface 110a-S of the plate portion 110a can be attached to the photonic engine die 130 through adhesive layer 162.

[0057] The photonic engine die 130 can be attached to the board portion 110a and the fiber array unit support 128, making it substantially coplanar with the fiber array unit 120. In particular, the optical path 136 of the photonic engine die 130 can be substantially aligned with the optical path 126 in the fiber array unit 120 (e.g., see FIG. 1A). This can be achieved, for example, by visual inspection to ensure that the distance between the bottom surface of the photonic engine die 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L1 (see FIG. 1A).

[0058] Figure 2D is a vertical cross-sectional view of an intermediate structure including a socket 140 according to one or more embodiments. As shown in Figure 2D, after adhesive layers 160 and 162 have cured, a backplate 110 including an attached photonic engine die 130 can be connected (e.g., detachably connected) to the socket 140. First, the backplate 110 can be positioned above the socket 140 such that the lead pins 142 on the upper surface 140s1 of the socket 140 are substantially aligned with the opening 113 in the sidewall portion 110b of the backplate 110. By aligning the lead pins 142 with the opening 113, it is ensured that the connector contact window 138 on the photonic engine die 130 engages with the connector pin 144 in the upper surface 140s1 of the socket 140. The backplate 110 can then be firmly pressed onto the socket 140, so that the connector contact window 138 contacts the connector pin 144, and the photonic engine die 130 is electrically coupled to the socket 140. The backplate 110 can then be securely attached to the socket 140 using fastening mechanisms (not shown) such as latches or socket fixing screws.

[0059] Figure 3 is a flowchart of a method for forming a photonic engine module 100 according to one or more embodiments. Step 310 of the method may include attaching fiber array units to a backplane. Step 320 may include attaching a photonic engine die to a backplane adjacent to the fiber array units. Step 330 may include attaching the backplane to a receptacle such that the fiber array units and the photonic engine die are located between the backplane and the receptacle.

[0060] Figure 4 is a vertical cross-sectional view of a photonic engine module 100 having a first alternative design according to one or more embodiments. As shown in Figure 4, the photonic engine module 100 having the first alternative design can be substantially the same as the photonic engine modules 100 in Figures 1A to 1C. However, the first alternative design can differ from the photonic engine modules 100 in Figures 1A to 1C because the first alternative design may include a microlens socket 428.

[0061] The microlens socket 428 may be located between the fiber array unit bracket 128 and the photonic engine die 130. Similar to the designs in Figures 1A to 1C, the fiber array unit bracket 128 may be located in a recess 112 of the plate portion 110a of the backplane 110. Alternatively, the fiber array unit bracket 128 may be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110. In either case, the fiber array unit bracket 128 may be attached using an adhesive layer (not shown) such as glue, optical gel, epoxy adhesive, silicone adhesive, etc.

[0062] The microlens socket 428 may have a shape substantially corresponding to the shape of the fiber array unit support 128. In at least one embodiment, the microlens socket 428 may be substantially L-shaped. The microlens socket 428 may be made of the same material as the fiber array unit support 128 (e.g., polymer, plastic, ceramic, etc.). Other materials may also be considered within the scope of this disclosure.

[0063] The microlens socket 428 may have a first end 428a between the fiber array unit 120 and the photonic engine die 130. The microlens socket 428 may have a second end 428b between the fiber array unit support 128 and the photonic engine die 130. The second end 428b may be substantially aligned with the second end 128b of the fiber array unit support 128. The second end 428b may be attached to the photonic engine die 130 through the adhesive layer 163. The photonic engine die 130 may also be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110 through the adhesive layer 164. The thickness of the adhesive layer 164 may be greater than the thickness of the adhesive layer 163. In particular, the thickness of the adhesive layer 164 may be substantially equal to the combined thickness of the microlens socket 428 and the adhesive layer 163. Each of adhesive layers 163 and 164 may include an optical gel (e.g., silicone), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure.

[0064] Microlens socket 428 may include a microlens 421 at its first end 428a. The microlens 421 may be formed of a light-transmitting material (e.g., fused silica, sapphire, germanium, zinc selenide, calcium fluoride, and magnesium fluoride) attached to the first end 428a of the microlens socket 428 (e.g., through an adhesive layer). The microlens 421 may be positioned substantially aligned with the optical path 126 in the fiber array unit 120 and the optical path 136 in the photonic engine die 130. Optical elements other than the microlens 421 may be alternatively or additionally included in the microlens socket 428. The microlens 421 may collimate, diverge, or focus a light beam into the optical path 136.

[0065] The microlens socket 428 may include one or more leads 422 to ensure that the microlens socket 428 is correctly positioned on the fiber array unit bracket 128. The leads 422 may be inserted into one or more recesses in the fiber array unit bracket 128. The size of the microlens socket 428 may be smaller than the size of the fiber array unit bracket 128.

[0066] Figures 5A to 5D illustrate various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 having a first alternative design, according to one or more embodiments. It should be noted that in this method, various components can be positioned or placed using an electromechanical pick-and-place machine.

[0067] Figure 5A is a vertical cross-sectional view of an intermediate structure including a fiber array unit 120 in a first alternative design of a photonic engine module 100 according to one or more embodiments.

[0068] Similar to the designs in Figures 1A to 1C, in the first alternative design, the fiber array unit support 128 can be attached (e.g., via an adhesive layer (not shown)) or detachably connected (e.g., via lead pins (not shown)) to the fiber array unit 120. Next, a microlens socket 428 can be positioned below the fiber array unit support 128. Specifically, the lead pins 422 of the microlens socket 428 can be substantially aligned with the recessed portion of the fiber array unit support 128. An optional adhesive layer (e.g., epoxy adhesive, silicone adhesive) can be applied to the upper surface of the microlens socket 428.

[0069] Next, the second end 428b of the microlens socket 428 can be pressed against the bottom side of the fiber array unit support 128. The lead pin 422 on the microlens socket 428 can be inserted into the recessed portion of the fiber array unit support 128. The microlens 421 of the first end 428a of the microlens socket 428 can be positioned to be substantially aligned with the optical path 126 of the fiber array unit 120.

[0070] As shown in Figure 5A, the length L2 of the fiber optic array unit bracket 128 in the x-direction can be in the range of 3 mm to 6 mm. The length of the fiber optic array unit bracket 128 in the y-direction can also be in the range of 3 mm to 18 mm. The combined height Hc of the fiber optic array unit 120 and the fiber optic array unit bracket 128 in the z-direction can be in the range of 0.5 mm to 1 mm.

[0071] Figure 5B is a vertical cross-sectional view of an intermediate structure including a backplate 110 in a first alternative design of the photonic engine module 100 according to one or more embodiments. Optional adhesive layers (e.g., optical gel, epoxy adhesive, silicone adhesive, etc.) can be applied to the upper surface of the recessed portion 112 or the fiber array unit support 128. Then, a fiber array unit 120 having an attachment for the fiber array unit support 128 and an attachment for the microlens socket 428 can be inserted into the recessed portion 112. The fiber array unit 120 can also be inserted into an opening 111 in the sidewall portion 110b of the backplate 110 (see, for example, Figure 1B).

[0072] Fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 can be substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. When fiber optic array unit 120 is inserted into opening 111, fiber optic array unit support 128 can be pressed into recessed portion 112 in the bottom surface 110a-S of plate portion 110a of backplate 110. Subsequently, fiber optic array unit support 128 and / or fiber optic array unit 120 can be clamped onto backplate 110 until an optional adhesive layer (if applicable) cures.

[0073] Figure 5C is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 in a first alternative design of a photonic engine module 100 according to one or more embodiments. As shown in Figure 5C, adhesive layers 163 and 164 can be coated on the upper surface of the photonic engine die 130. The photonic engine die 130 is then pressed into position on the bottom surface of the microlens socket 428. The photonic engine die 130 is then clamped onto the microlens socket 428 until adhesive layers 163 and 164 are cured. Therefore, the second end 428b of the microlens socket 428 can be attached to the photonic engine die 130 via adhesive layer 163. The photonic engine die 130 can be attached to the microlens socket 428 to be substantially coplanar with the fiber array unit 120.

[0074] Figure 5D is a vertical cross-sectional view of an intermediate structure including a socket 140 in a first alternative design of a photonic engine module 100 according to one or more embodiments. As shown in Figure 5D, after adhesive layers 163 and 164 have cured, a backplate 110 including the photonic engine die 130 can be attached to the socket 140. The backplate 110 can be positioned above the socket 140 such that the lead pins 142 on the upper surface 140s1 of the socket 140 are substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the socket 140 such that the connector contact window 138 firmly contacts the connector pins 144, and the photonic engine die 130 is electrically coupled to the socket 140. The backplate 110 can then be securely attached to the socket 140 using a fastening mechanism (not shown) such as a latch or socket fixing screws.

[0075] Figure 6 is a vertical cross-sectional view of a photonic engine module 100 having a second alternative design according to one or more embodiments. As shown in Figure 6, the photonic engine module 100 having the second alternative design can be substantially the same as the photonic engine module 100 in Figures 1A to 1C. However, the second alternative design can differ from the photonic engine module 100 in Figures 1A to 1C because the second alternative design can omit the fiber array unit support 128.

[0076] In the second alternative design, the fiber array unit 120 may include an upper fiber array unit portion 120U (e.g., an upper optical unit) and a lower fiber array unit portion 120L (e.g., a lower optical unit). Both the upper fiber array unit portion 120U and the lower fiber array unit portion 120L may be formed in an opening 111 in the sidewall portion 110b of the backplate 110. In the second alternative design, the upper wall of the opening 111 may also form the bottom surface 110a-S of the plate portion 110a of the backplate 110.

[0077] The upper portion 120U of the fiber array unit can be detachably connected to the lower portion 120L of the fiber array unit via one or more lead pins 642. The fiber array unit 120 can be easily damaged during the assembly process, and the detachable feature helps to allow the fiber array unit 120 to be easily replaced.

[0078] The lead pin 642 may be formed on the lower portion 120L of the fiber array unit and inserted into an opening in the upper portion 120U of the fiber array unit. Alternatively or additionally, the lead pin 642 may be formed on the upper portion 120U of the fiber array unit and inserted into an opening in the lower portion 120L of the fiber array unit.

[0079] Optical path 126 can extend from the fiber optic port 125 on the back side 120s of the fiber optic array unit 120 to the interface (e.g., gap interface) with the photonic engine die 130. The fiber optic array unit 120 may also include one or more optical elements in the optical path 126. Specifically, the fiber optic array unit 120 may include an upper optical mirror 627U (e.g., a reflector) in the upper portion 120U of the fiber optic array unit and a lower optical mirror 627L (e.g., a reflector) and an optional lens 621 (e.g., a microlens) in the lower portion 120L of the fiber optic array unit. The optical mirror 627L can be configured to guide optical signals from the upper portion 120U of the fiber optic array unit to the photonic engine die 130, and to guide optical signals from the photonic engine die 130 to the upper portion 120U of the fiber optic array unit.

[0080] The fiber optic connection portion 125 may be located in the upper portion 120U of the fiber optic array unit, and the optical path 126 may extend sequentially from the fiber optic connection portion 125 to the upper optical mirror 627U, the lower optical mirror 627L, and the lens 621. The optical path 126 through the microlens 621 from the lower optical mirror 627L may be substantially aligned with the optical path 136 of the photonic engine die 130. The optical path 126 may alternatively or additionally include other optical elements, such as optical lenses, optical mirrors, optical filters and beam splitters, optical waveguides, optical fibers, etc. In particular, at least some portions of the optical path 126 may be formed of optical fiber (e.g., bent optical fiber).

[0081] The fiber array unit 120 can be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110 via an adhesive layer (not shown). The adhesive layer may include optical adhesive (e.g., silicone), or epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure.

[0082] The fiber optic array unit 120 can also be attached to the upper surface of the photonic engine die 130 via an adhesive layer 165. The adhesive layer 165 may include optical adhesive (e.g., silicone), or epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure. The fiber optic array unit 120 may have a height ranging from 0.5 mm to 1.0 mm in the z-direction. The fiber optic array unit 120 may have a width ranging from 3 mm to 8 mm in the x-direction. The fiber optic array unit 120 may have a length ranging from 1 mm to 18 mm in the y-direction.

[0083] Figures 7A to 7D illustrate various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 having a second alternative design, according to one or more embodiments. It should be noted that an electromechanical pick-and-place machine can be used in this method to position or place various components.

[0084] Figure 7A is a vertical cross-sectional view of an intermediate structure of a fiber optic array unit 120 in a photonic engine module 100 including a second alternative design according to one or more embodiments. The fiber optic array unit 120 can be assembled by attaching an upper portion 120U of the fiber optic array unit to a lower portion 120L of the fiber optic array unit. Specifically, the upper portion 120U of the fiber optic array unit can be pressed onto the lower portion 120L of the fiber optic array unit such that the lead pins 642 on the upper surface of the lower portion 120L of the fiber optic array unit are inserted into corresponding openings in the upper portion 120U of the fiber optic array unit.

[0085] An optional adhesive layer (not shown) may be applied alternatively or additionally to the lower portion 120L of the fiber array unit. In this case, the upper portion 120U of the fiber array unit may be pressed onto the adhesive layer. The adhesive layer may then be cured to complete the assembly of the fiber array unit 120.

[0086] Figure 7B is a vertical cross-sectional view of the intermediate structure of the backplate 110 in the photonic engine module 100 including the second alternative design, according to one or more embodiments. An optional adhesive layer (not shown) (e.g., optical adhesive, epoxy adhesive, silicone adhesive, etc.) can be applied to the upper surface of the fiber array unit 120. The fiber array unit 120 can then be inserted into the backplate 110. In particular, the fiber array unit 120 can be inserted into an opening 111 in the sidewall portion 110b of the backplate 110.

[0087] Fiber optic array unit 120 can be inserted into opening 111 such that the back side 120s of fiber optic array unit 120 can be substantially aligned with the outer surface of the sidewall portion 110b of backplate 110. When fiber optic array unit 120 is inserted into opening 111, fiber optic array unit 120 can be attached to the bottom surface 110a-S of plate portion 110a of backplate 110. Fiber optic array unit 120 can then be clamped onto backplate 110 until an optional adhesive layer cures.

[0088] Figure 7C is a vertical cross-sectional view of an intermediate structure of a photonic engine die 130 in a photonic engine module 100 including a first alternative design according to one or more embodiments. As shown in Figure 7C, an adhesive layer 165 can be coated onto the upper surface of the photonic engine die 130. The photonic engine die 130 can then be pressed onto the bottom surface of the fiber array unit 120. The photonic engine die 130 can then be clamped onto the fiber array unit 120 until the adhesive layer 165 cures.

[0089] The photonic engine die 130 can be attached to the fiber array unit 120, making it substantially coplanar with the fiber array unit 120. In particular, the optical path 136 of the photonic engine die 130 can be fabricated to be substantially aligned with the optical path 126 in the fiber array unit 120. For example, this can be satisfied by visual inspection to verify that the distance between the bottom surface of the photonic engine die 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L2.

[0090] Figure 7D is a vertical cross-sectional view of an intermediate structure of a socket 140 in a photonic engine module 100 including a second alternative design according to one or more embodiments. As shown in Figure 7D, after the adhesive layer 165 has cured, a backplate 110 including the photonic engine die 130 can be attached to the socket 140. The backplate 110 can be positioned above the socket 140 such that the lead pins 142 on the upper surface 140s1 of the socket 140 can be substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the socket 140 such that the connector contact window 138 firmly contacts the connector pins 144, and the photonic engine die 130 is electrically coupled to the socket 140. The backplate 110 can then be securely attached to the socket 140 using a fastening mechanism (not shown) such as a latch or socket fixing screws.

[0091] Figure 8 is a vertical cross-sectional view of a photonic engine module 100 having a third alternative design according to one or more embodiments. As shown in Figure 8, the photonic engine module 100 having the third alternative design can be substantially the same as the photonic engine module 100 in Figure 6. However, the third alternative design can differ from the photonic engine module 100 in Figure 6 because the third alternative design may include a general socket 828.

[0092] In the third alternative design, the fiber array unit 120 may be substantially the same as the fiber array unit 120 in the second alternative design. The fiber array unit 120 may be located within an opening 111 in the sidewall portion 110b of the backplane 110. The fiber array unit 120 may be attached to the bottom surface 110a-S of the plate portion 110a of the backplane 110 via an adhesive layer 166. The adhesive layer 166 may include an optical gel (e.g., silicone gel), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are within the scope of this disclosure.

[0093] A general socket 828 may be located between the fiber array unit 120 and the upper surface of the photonic engine die 130. The general socket 828 may be substantially L-shaped. The general socket 828 may be made of the same material as the microlens socket 428 and the same material as the fiber array unit support 128 (e.g., polymer, plastic, ceramic, etc.). Other materials are within the scope of this disclosure.

[0094] A general socket 828 may have a short side located along one end of the lower portion 120L of the fiber array unit and a long side located between the fiber array unit 120 and the photon engine die 130. The general socket 828 may be attached to the photon engine die 130 via an adhesive layer 167. The adhesive layer 167 may include an optical gel (e.g., silicone gel), or an epoxy adhesive, silicone adhesive, etc. Other adhesives are within the scope of this disclosure.

[0095] The long side of the general socket 828 may include one or more lead pins 822 to ensure that the general socket 828 is correctly positioned on the fiber array unit 120. The lead pins 822 may be inserted into one or more recesses in the lower portion 120L of the fiber array unit.

[0096] Figures 9A to 9D illustrate various intermediate structures that can be formed in a method of manufacturing a photonic engine module 100 with a third alternative design, according to one or more embodiments. It should be noted that in this method, various components can be positioned or placed using an electromechanical pick-and-place machine.

[0097] Figure 9A is a vertical cross-sectional view of an intermediate structure including a general socket 828 located on a fiber array unit 120 in a third alternative design of the photonic engine module 100 according to one or more embodiments. The general socket 828 may be located below the fiber array unit 120 such that the lead pins 822 are substantially aligned with corresponding openings in the lower portion 120L of the fiber array unit. The general socket 828 can then be pressed onto the lower portion 120L of the fiber array unit such that the lead pins 822 on the general socket 828 are inserted into the corresponding openings in the lower portion 120L of the fiber array unit.

[0098] Figure 9B is a vertical cross-sectional view of an intermediate structure including a backplate 110 in a third alternative design of a photonic engine module 100 according to one or more embodiments. An adhesive layer 166 can be applied to the upper surface of the fiber array unit 120. The fiber array unit 120 can then be inserted into the backplate 110. Specifically, the fiber array unit 120 can be inserted into an opening 111 in the sidewall portion 110b of the backplate 110. When the fiber array unit 120 is inserted into the opening 111, the fiber array unit 120 can be pressed against the adhesive layer 166 on the bottom surface 110a-S of the plate portion 110a of the backplate 110. The fiber array unit 120 can then be clamped onto the backplate 110 until the adhesive layer 166 cures.

[0099] Figure 9C is a vertical cross-sectional view of an intermediate structure including a photonic engine die 130 in a first alternative design of a photonic engine module 100 according to one or more embodiments. As shown in Figure 9C, an adhesive layer 167 can be applied to the upper surface of the photonic engine die 130. The photonic engine die 130 can then be pressed into position on the bottom surface of a general socket 828. The photonic engine die 130 can then be clamped onto the general socket 828 until the adhesive layer 167 cures.

[0100] The photonic engine chip 130 can be attached to a general-purpose socket, making it substantially coplanar with the fiber array unit 120. Specifically, the optical path 136 of the photonic engine chip 130 can be fabricated to be substantially aligned with the optical path 126 in the fiber array unit 120. This can be achieved, for example, by visual inspection to verify that the distance between the bottom surface of the photonic engine chip 130 and the bottom surface of the fiber array unit 120 is set to a specified distance L3.

[0101] Figure 9D is a vertical cross-sectional view of an intermediate structure including a socket 140 in a third alternative design of a photonic engine module 100 according to one or more embodiments. As shown in Figure 9D, after the adhesive layer 167 has cured, a backplate 110 including the photonic engine die 130 can be attached to the socket 140. The backplate 110 can be positioned above the socket 140 such that the lead pins 142 on the upper surface 140s1 of the socket 140 can be substantially aligned with the openings 113 in the sidewall portion 110b of the backplate 110. The backplate 110 can then be firmly pressed onto the socket 140 such that the connector contact window 138 firmly contacts the connector pins 144, and the photonic engine die 130 is electrically coupled to the socket 140. The backplate 110 can then be securely attached to the socket 140 using a fastening mechanism (not shown) such as a latch or socket fixing screws.

[0102] Figure 10 is a vertical cross-sectional view of a photonic engine module 100 having a fourth alternative design according to one or more embodiments. As shown in Figure 10, the photonic engine module 100 having the fourth alternative design can be substantially the same as the photonic engine modules 100 in Figures 1A to 1C. However, the fourth alternative design can differ from the photonic engine modules 100 in Figures 1A to 1C because the fourth alternative design may include a different connection mechanism between the optical chip 130 and the socket 140.

[0103] As shown in Figure 10, the photonic engine die 130 in the fourth alternative design may include multiple connector pins 1038 protruding from the bottom surface of the photonic engine die 130, instead of connector contact windows 138. The connector pins 1038 may be formed in a 2x2 array on the bottom surface of the photonic engine die 130.

[0104] Connector pins 1038 can be formed of conductive materials such as gold, copper, or other suitable metallic materials. Connector pins 1038 may include, for example, probes, microelectromechanical system (MEMS) pins, etc. Connector pins 1038 may include fewer than about 20,000 in number, with a pin density of less than about 50 pins / square millimeter and a pin pitch of less than about 200 micrometers. Connector pins 1038 can be electrically coupled to photonic engine circuitry 132 via electrical wiring 134.

[0105] In the fourth alternative design, the upper surface 140s1 of the socket 140 may include a plurality of connector pin openings 1044 instead of the connector pins 144 shown in the embodiments of Figures 1A to 9D. The connector pin openings 1044 may be formed in a 2x2 array in the upper surface 140s1 of the socket 140.

[0106] The walls of the connector pin opening 1044 may include conductive contact surfaces, such as metallic contact surfaces (e.g., formed of gold, copper, or other suitable metals). Connector pins 1038 of the photonic engine die 130 may be inserted into the connector pin opening 1044 to electrically couple the photonic engine die 130 to the socket 140. Connector pins 1038 may be inserted into the connector pin opening 1044 to detachably connect the photonic engine die 130 to the socket 140.

[0107] Connector pin openings 1044 can be configured to receive connector pins 1038 respectively. Connector pin openings 1044 can have a number, shape, and arrangement corresponding to the number, shape, and arrangement of connector pins 1038. Specifically, connector pin openings 1044 can include fewer than about 20,000 openings, a density of less than about 50 openings / square millimeter, and an opening spacing of less than about 200 micrometers.

[0108] Figure 11 is an exploded perspective view of a photonic engine module 100 having a fifth alternative design according to one or more embodiments. As shown in Figure 11, the photonic engine module 100 having the fifth alternative design can be substantially the same as the photonic engine modules 100 in Figures 1A to 1C. However, the fifth alternative design can differ from the photonic engine modules 100 in Figures 1A to 1C in several respects.

[0109] In particular, as shown in the fifth alternative design, the sidewall portion 110b of the back panel 110 can be formed by four sidewall posts located at the corners of the plate portion 110a of the back panel 110. In the fifth alternative design, the opening 111 can substantially extend between the sidewall posts. Therefore, in the fifth alternative design, the back panel 110 is an open design, compared to the closed designs in Figures 1A to 1C.

[0110] Furthermore, in the fifth alternative design, the microlens socket 428 may include a plurality of microlenses 421 (e.g., three microlenses). The microlenses 42 may be substantially aligned in the y-direction. Although not shown in FIG11, the fiber array unit 120 may include a plurality of optical channels (e.g., three optical channels) aligned in the y-direction, with positions corresponding to the positions of the plurality of microlenses 421, respectively.

[0111] As further shown in Figure 11, the optical die 130 may include a connector pin array 1038A, which includes a plurality of connector pins 1038 (see Figure 10). The socket 140 may also include a connector pin opening array 1044A, which includes a plurality of connector pin openings 1044 (see Figure 10). Therefore, in the fifth alternative design, the optical die 130 can be electrically coupled to the socket 140 by inserting the connector pins 1038 of the connector pin array 1038A into the connector pin openings 1044 of the connector pin opening array 1044A.

[0112] Figure 12 is a vertical cross-sectional view of a packaging module 220 according to one or more embodiments. As shown in Figure 12, the packaging module 220 may include a photonic engine module 100.

[0113] In the packaging module 220, the photon engine module 100 can be mounted on the interposer layer 20. One or more semiconductor dies 145 can also be mounted on the interposer layer 20 adjacent to the photon engine module 100. The interposer layer 20 may include one or more bridging dies 200 (e.g., connection dies, local silicon interconnect (LSI) dies, etc.). The bridging dies 200 can interconnect the semiconductor dies 145 and the photon engine module 100. Therefore, the photon engine module 100 can constitute co-packaged optics (CPO) in the packaging module 220.

[0114] Although the package module 220 is depicted as containing a specific number and arrangement of semiconductor dies, the number and arrangement of semiconductor dies are not limited to any specific number and arrangement. In particular, the package module 220 can contain any number and any arrangement of semiconductor dies, as well as any combination of any number and any arrangement of semiconductor dies.

[0115] Interchange layer 20 is not necessarily limited to any particular material or configuration. Interchange layer 20 may include, for example, organic materials (e.g., dielectric polymers), inorganic materials (e.g., silicon), glass substrates, etc.

[0116] As shown in Figure 12, the intermediate layer 20 can be formed by a molding portion. The intermediate layer 20 may include a lower passivation layer 14. The lower passivation layer 14 may include silicon oxide, silicon nitride, low-k dielectric materials such as carbon-doped oxides, very low dielectric materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials.

[0117] Intermediate layer 20 may also include a molding material layer 227 (e.g., an encapsulation layer) formed on the underlying passivation layer 14. In at least one embodiment, molding material layer 227 may be formed of a curable material that can be cured to form a rigid, solid structure. Molding material layer 227 may include, for example, an epoxy molding compound (EMC). In at least one embodiment, molding material layer 227 may include a polymer material, particularly an epoxy-based polymer material. Other suitable molding materials may be used.

[0118] Intermediate layer 20 may also include one or more local silicon interconnect (LSI) dies 200a, 200b. Molding material layer 227 may be formed around bridging dies 200a, 200b in the x and y directions. In at least one embodiment, bridging dies 200a, 200b may be substantially embedded in molding material layer 227. Bridging dies 200a, 200b may include lower contact windows 250 located on the bottom surface of bridging dies 200a, 200b.

[0119] Bridging dies 200a and 200b may include one or more interconnect structures 204 (e.g., metal traces and metal vias) for interconnecting semiconductor dies 145 in the interconnect package module 220. Specifically, bridging die 200a may include one or more interconnect structures 204 for connecting the first semiconductor die 141 to the second semiconductor die 143. Bridging die 200b may include one or more interconnect structures 204 for connecting the second semiconductor die 143 to the photon engine module 100. The first semiconductor die 141 can be connected to the photon engine module 100 through bridging dies 200a and bridging die 200b.

[0120] In at least one embodiment, multiple interconnect structures 204 in each bridging die 200a, 200b can provide high wiring density die-to-die interconnects via multiple layers of sub-micron metal lines (e.g., copper). The interconnect structures 204 can allow the bridging dies 200a, 200b to adapt to various interconnect architectures (e.g., SoC to SoC, SoC to chiplet, SoC to HBM, etc.). The interconnect structures 204 can include, for example, one or more layers, and can include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the scope of this disclosure.

[0121] Intermediate layer 20 may also integrate additional components, such as stand-alone integrated passive components (IPDs) (not shown). In at least one embodiment, IPDs may be located in a molding material layer 227 beneath one or more semiconductor dies 145 or photonic engine modules 100 to support signal communication.

[0122] Interposer 20 may also include one or more upper redistribution layers (RDL layers) 202a (e.g., metal traces) on the wafer-side surface (e.g., the upper surface) of interposer 20 (e.g., the upper surface of molding material layer 227). Interposer 20 may also include one or more lower redistribution layers 202b on the board-side surface (e.g., the lower surface of interposer 20) (e.g., the lower surface of molding material layer 227).

[0123] Intermediate layer 20 may include one or more upper intermediate bonding pads 251 on the upper surface of the molding material layer 227 and one or more lower intermediate bonding pads 252 on the lower surface of the molding material layer 227. Intermediate layer 20 may also include one or more intermediate through-holes (TIVs) 206 in the molding material layer 227. Intermediate through-holes 206 may connect to the upper intermediate bonding pads 251 and the lower intermediate bonding pads 252.

[0124] The upper redistribution layer 202a and the lower redistribution layer 202b may include wide spacing and may be interconnected through the interposer via 206 to achieve efficient signal and power transmission. The upper redistribution layer 202a, the lower redistribution layer 202b, the interposer via 206, the upper interposer bonding pad 251, and the lower interposer bonding pad 252 may include, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the scope of this disclosure. With this configuration, the interposer 20 can provide low-loss high-frequency signals in high-speed transmission.

[0125] The packaging module 220 may include a plurality of control collapse die connection bumps (C4 bumps) 121 on the board-side surface of the interposer 20. The C4 bumps 121 may be formed in openings in the lower passivation layer 14 and may contact the lower interposer pad 252 through the openings in the lower passivation layer 14. The C4 bumps 121 may also contact the lower contact windows 250 in the bridging dies 200a and 200b through the openings in the lower passivation layer 14.

[0126] In at least one embodiment, the C4 bump 121 can be formed by forming one or more under-bump metal (UBM) layers (not shown) on the under-bump metal layer, forming contact pads on the under-bump metal layer, and forming solder balls on the contact pads.

[0127] Semiconductor die 145 may be mounted on interposer 20, above one or more bridging dies 200a, 200b. Typically, the thickness of each semiconductor die 145 in the z-direction may be substantially the same. Therefore, each upper surface of the first semiconductor die 141 and the second semiconductor die 143 may be substantially coplanar (e.g., formed in the same xy plane) and collectively referred to as semiconductor die upper surface 140a (upper surface).

[0128] Semiconductor die 145 can be mounted on interposer 20, for example, through microbumps 118. Each microbump 118 may include a copper post and a solder ball on the copper post. Microbumps 118 can (e.g., through the solder ball) be bonded to metal contacts on the die-side surface of interposer 20. In at least one embodiment, microbumps 118 can be bonded to interconnect structures 204 in bridging dies 200a, 200b. In at least one embodiment, microbumps 118 can be bonded to interposer vias 206 in interposer 20. In at least one embodiment, microbumps 118 can be bonded to an upper redistribution layer 202a on the die-side surface of interposer 20. Therefore, semiconductor die 145 can be connected to C4 bump 121 through microbumps 118, upper redistribution layer 202a, interposer via 206, and lower redistribution layer 202b.

[0129] The underfill layer 129 of the package module can be formed (e.g., individually or in connection) under and around each semiconductor die 145. The underfill layer 129 of the package module can also be formed around the microbumps 118. The underfill layer 129 of the package module thus secures each semiconductor die 145 to the interposer layer 20. The underfill layer 129 of the package module can be formed of an epoxy-based polymer material.

[0130] Each of the semiconductor dies 145 may include, for example, a single semiconductor die, a system-on-chip (SOC) die, or a system-on-integrated chips (SoIC) die, and may be implemented via chip-on-wafer-on-substrate (CoWoS) technology or integrated fan-out on substrate (INFO-oS) technology.In particular, each of the semiconductor chips 145 may include, for example, semiconductor chips or chiplets, logic chips (e.g., mobile application processors, microcontrollers, etc.), or memory chips (e.g., high-bandwidth memory (HBM) chips, hybrid memory cubes (HMC), dynamic random access memory (DRAM) chips, wide I / O chips, M-RAM chips, R-RAM chips, inverted AND (NAND) chips, static random access memory (SRAM), etc.), central processing unit (CPU) chips, graphics processing unit (GPU) chips, field-programmable gate array (FPGA) chips, network chips, application-specific integrated circuits (ASICs), etc., for high-performance computing (HPC) applications, artificial intelligence (AI) applications, and 5G cellular network applications. This includes ASIC chips, AI / DNN accelerator chips, coprocessors, accelerators, on-chip memory buffers, high data rate transceiver chips, I / O interface chips, integrated passive device (IPD) chips, power management chips (e.g., power management integrated circuit (PMIC) chips), radio frequency (RF) chips, sensor chips, microelectromechanical systems (MEMS) chips, signal processing chips (e.g., digital signal processing (DSP) chips), front-end chips (e.g., analog front-end (AFE) chips), and monolithic 3D heterogeneous chiplet stacking chips. Other chips are also within the scope of this disclosure.

[0131] In at least one embodiment, the first semiconductor die 141 and the second semiconductor die 143 may include application-specific integrated circuit (ASIC) dies. In particular, the first semiconductor die 141 and the second semiconductor die 143 (e.g., ASIC dies) may be configured to include applications specific to the photon engine module 100.

[0132] The packaging module 220 may further include an upper molding material layer 1227 formed around the semiconductor die 145. The upper molding material layer 1227 may also be formed above and around the bottom filler layer 129 of the packaging module. The upper molding material layer 1227 may have an outer wall substantially aligned with the outer wall of the interposer layer 20.

[0133] In at least one embodiment, an upper molding material layer 1227 may be formed on the sidewalls (inner and outer sidewalls) of each semiconductor die 145. The upper molding material layer 1227 may be formed between and bonded to the sidewalls of each semiconductor die 145. The upper molding material layer 1227 may also be bonded to the wafer side surface of the interposer layer 20 and the bottom filler layer 129 of the package module.

[0134] In at least one embodiment, the upper molding material layer 1227 may be formed of a curable material that can be cured to form a rigid, solid structure. The upper molding material layer 1227 may include, for example, epoxy molding compound (EMC). In at least one embodiment, the upper molding material layer 1227 may include a material substantially similar to the bottom filler layer 129 of the encapsulation module, and / or a material substantially similar to the molding material layer 227 in the interposer layer 20. In at least one embodiment, the upper molding material layer 1227 may include a polymeric material, particularly an epoxy-based polymeric material. Other suitable molding materials are within the scope of this disclosure.

[0135] As further shown in Figure 12, the photonic engine module 100 can be mounted on the interposer layer 20 via solder balls 150 of the ball grid array (BGA) at the bottom of the socket 140. At least a portion of the solder balls 150 can be connected to the interconnect structure 204 in the bridging die 200b. The photonic engine module 100 can be communicatively coupled to the second semiconductor die 143 via the interconnect structure 204 in the bridging die 200b. At least a portion of the solder balls 150 can be connected to the upper bonding pad 251 of the interposer layer. At least a portion of the solder balls 150 can be connected to the upper redistribution layer 202a.

[0136] The bottom fill layer 139 of the package module can be formed below and around the socket 140. The bottom fill layer 139 of the package module can also be formed around the solder ball 150. The bottom fill layer 139 of the package module thus secures the photon engine module 100 to the interposer layer 20. The bottom fill layer 139 of the package module can be formed of an epoxy polymer material or other suitable material.

[0137] Figure 13 is a vertical cross-sectional view of a package structure 1300 including a package module 220 according to one or more embodiments.

[0138] The packaging structure 1300 may include a packaging substrate 710. The packaging substrate 710 may constitute a substrate for a multi-chip module (MCM). The packaging substrate 710 may include a cored or coreless substrate. In at least one embodiment, for example, the packaging substrate 710 may include a core 712, an upper packaging substrate dielectric layer 714 formed on the core 712 (e.g., on a first side or chip side of the packaging substrate 710), and a lower packaging substrate dielectric layer 716 formed on the core 712 (e.g., on a second side or board side of the packaging substrate 710). Specifically, the packaging substrate 710 may include a build-up film substrate such as an Ajinomoto build-up film (ABF) substrate. That is, in at least one embodiment, each of the upper packaging substrate dielectric layer 714 and the lower packaging substrate dielectric layer 716 may be described as an ABF layer.

[0139] Core 712 can help provide rigidity to the encapsulation substrate 710. Core 712 may include, for example, epoxy resins, such as bismaleimide triazine epoxy (BT epoxy) and / or woven glass laminates. Core 712 may alternatively or additionally include organic materials such as polymeric materials. Specifically, core 712 may include dielectric polymeric materials such as polyimide (PI), benzocyclo-butene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of the intended disclosure.

[0140] The core 712 may include one or more vias 712a. The via 712a may extend from the lower surface of the core 712 to the upper surface of the core 712. The via 712a may allow electrical connections between the upper dielectric layer 714 and the lower dielectric layer 716 of the package substrate. The via 712a may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are within the intended disclosure range.

[0141] An upper dielectric layer 714 of the package substrate may be formed on the upper surface of the core 712. The upper dielectric layer 714 may include a plurality of layers, and specifically, may include a multilayer film (e.g., ABF). The upper dielectric layer 714 may also include an organic material such as a polymer material. Specifically, the upper dielectric layer 714 may include a dielectric polymer material such as polyimide (PI), benzocyclobutene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of the intended disclosure.

[0142] The upper dielectric layer 714 of the package substrate may include one or more upper bonding pads 714a on the wafer-side surface of the upper dielectric layer 714. Specifically, the upper bonding pads 714a may be exposed on the wafer-side surface of the upper dielectric layer 714. The upper dielectric layer 714 may also include one or more metal interconnect structures 714b. The metal interconnect structures 714b may be connected to the upper bonding pads 714a and the vias 712a in the core 712. The metal interconnect structures 714b may include metal layers (such as copper traces) and metal vias connecting the metal layers. The upper bonding pads 714a and the metal interconnect structures 714b may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metal materials are within the intended disclosure range.

[0143] An upper passivation layer 710a may be formed on the wafer-side surface of the upper dielectric layer 714 of the package substrate. The upper passivation layer 710a may partially cover the upper bonding pad 714a of the package substrate. The upper passivation layer 710a may include silicon oxide, silicon nitride, low-dielectric materials such as carbon-doped oxides, extremely low-k dielectric materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials.

[0144] A lower dielectric layer 716 of the package substrate may be formed on the lower surface of the core 712. The lower dielectric layer 716 may also comprise a plurality of layers, and specifically, may comprise a multilayer film (e.g., ABF). The lower dielectric layer 716 may also comprise an organic material such as a polymer material. Specifically, the lower dielectric layer 716 may comprise a dielectric polymer material such as polyimide (PI), benzocyclobutene (BCB), or polybenzobisoxazole (PBO). Other suitable dielectric materials are within the scope of the intended disclosure.

[0145] The lower dielectric layer 716 of the package substrate may include one or more lower bonding pads 716a on the side surface of the lower dielectric layer 716. Specifically, the lower bonding pads 716a may be exposed on the side surface of the lower dielectric layer 716. The lower dielectric layer 716 may also include one or more metal interconnect structures 716b. The metal interconnect structures 716b may be connected to the lower bonding pads 716a and the vias 712a in the core 712. The metal interconnect structures 716b may include metal layers (such as copper traces) and metal vias connecting the metal layers. The lower bonding pads 716a and the metal interconnect structures 716b may include, for example, one or more layers and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metal materials are within the intended disclosure range.

[0146] A lower passivation layer 710b of the package substrate may be formed on the side surface of the lower dielectric layer 716 of the package substrate. The lower passivation layer 710b of the package substrate may partially cover the lower bonding pad 716a of the package substrate. The lower passivation layer 710b of the package substrate may include silicon oxide, silicon nitride, low dielectric materials such as carbon-doped oxides, extremely low dielectric materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials.

[0147] An array of ball grids, including a plurality of solder balls 710c, can be formed on the board-side surface of the lower dielectric layer 716 of the package substrate. The solder balls 710c allow the package structure 1300 to be securely mounted on and electrically coupled to a substrate such as a printed circuit board (PCB). The solder balls 710c can contact the lower bonding pads 716a of the package substrate. Therefore, the solder balls 710c can be electrically connected to the upper bonding pads 714a of the package substrate through the metal interconnect structure 716b, the via 712a, and the metal interconnect structure 714b.

[0148] The packaging module 220 can be connected to the packaging substrate 710 through the C4 bump 121 on the side surface of the interposer 20. Specifically, the C4 bump 121 can be bonded (e.g., using reflow soldering, compression bonding, thermoforming, etc.) to the upper bonding pad 714a of the packaging substrate 710.

[0149] Package module 220 can be bonded to backplane 110 via package underfill layer 229. Package underfill layer 229 can be substantially similar to package module underfill layer 129 in package module 220. Package underfill layer 229 can be formed below interposer 20 and surround C4 bump 121. Package underfill layer 229 can also be formed on the sidewall of interposer 20.

[0150] The package structure 1300 may further include a reinforcing ring 730 located on the package substrate 710. The reinforcing ring 730 may be formed of, for example, a metallic material such as aluminum, copper, or stainless steel. The reinforcing ring 730 may be attached to the package structure 1300 through an adhesive layer 760. Specifically, the reinforcing ring 730 may be attached to the upper passivation layer 710a of the package substrate through the adhesive layer 760. The adhesive layer 760 may include epoxy resin adhesive, silicone adhesive, etc. Other adhesives are also within the scope of this disclosure.

[0151] The reinforcing ring 730 can be continuously formed around the entire periphery of the packaging module 220. The reinforcing ring 730 can have a shape substantially similar to the outer shape of the packaging module 220. Specifically, the reinforcing ring 730 can have a substantially rectangular outer shape and a substantially rectangular inner shape. Other suitable shapes of the reinforcing ring 730 can be used.

[0152] The width of the reinforcing ring 730 can be substantially uniform around the entire periphery of the packaging module 220. In at least one embodiment, the width of the reinforcing ring 730 can be greater than the distance between the inner wall of the reinforcing ring and the packaging module 220.

[0153] Figure 14 is a vertical cross-sectional view of a packaging module 220 having a first alternative design in one or more embodiments.

[0154] As shown in Figure 14, the package module 220 with the first alternative design can be substantially similar to the package module 220 in Figure 12. However, in the package module 220 with the first alternative design, the photon engine module 100 can be mounted on the redistribution layer structure 30. The semiconductor die 145 can also be mounted on the redistribution layer structure 30, adjacent to the photon engine module 100. The redistribution layer structure 30 may optionally include one or more bridging dies (not shown), similar to the bridging die 200 in Figure 12. The redistribution layer structure 30 can interconnect the semiconductor die 145 and the photon engine module 100. Therefore, in the package module 220 with the first alternative design, the photon engine module 100 can constitute a common packaged optics (CPO).

[0155] As shown in Figure 14, the redistribution layer structure 30 may include multiple polymer layers 12 and multiple redistribution layers 12a stacked alternately. The disclosure does not limit the number of polymer layers 12 and / or the number of redistribution layers 12a in the redistribution layer structure 30. The redistribution layer structure 30 may alternatively or additionally include a redistribution layer molding layer encapsulating the redistribution layers 12a.

[0156] In at least one embodiment, the polymer layer 12 may include, for example, polyimide (PI), epoxy resin, acrylic resin, phenolic resin, benzocyclobutene (BCB), polybenzoxazole (PBO), or any other suitable polymeric dielectric material. In some embodiments, the redistribution layer 12a may include a conductive material. The conductive material may include metals such as copper, aluminum, nickel, titanium, or combinations thereof. Other suitable conductive materials may also be considered within the scope of this disclosure.

[0157] In at least one embodiment, the redistribution layer 12a may include multiple metal traces (lines) and multiple metal vias connecting these traces. The traces may be located on the polymer layer 12 and may extend along the x-direction (first horizontal direction) and y-direction (second horizontal direction) on the upper surface of the polymer layer 12.

[0158] An upper passivation layer (not shown) may be selectively formed on the grain-side surface of the redistributed circuit layer structure 30. The upper passivation layer may include silicon oxide, silicon nitride, low-dielectric-constant materials such as carbon-doped oxides, very low-dielectric-constant materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials. One or more upper bonding pads (not shown) may also be formed in the upper passivation layer. The upper bonding pads may be connected to the redistributed circuit layer 12a. The upper bonding pads may include, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are also within the scope of this disclosure.

[0159] The lower passivation layer 14 can be formed on the side surface of the redistributed circuit layer structure 30. The lower passivation layer 14 may also include silicon oxide, silicon nitride, low dielectric constant materials such as carbon-doped oxides, extremely low dielectric constant materials such as porous carbon-doped silicon dioxide, combinations thereof, or other suitable materials.

[0160] One or more under-bonding pads (not shown) may be located on the board-side surface of the redistribution layer structure 30. The under-bonding pads may be bonded and electrically connected to the redistribution layer 12a. The under-bonding pads may be located within the under-passivation layer 14. The under-bonding pads may also comprise, for example, one or more layers, and may include metals, metal alloys, and / or other metal-containing compounds (e.g., Cu, Al, Mo, Co, Ru, W, TiN, TaN, WN, etc.). Other suitable metallic materials are also within the scope of this disclosure.

[0161] As further shown in Figure 14, a plurality of C4 bumps 121 can be connected to the redistribution layer 12a on the board-side surface of the redistribution layer structure 30. In at least one embodiment, the C4 bumps 121 may include an under-bump metallization (UBM) layer on the redistribution layer 12a. The C4 bumps 121 may further include contact pads (e.g., copper / nickel contact pads) on the UBM layer and solder balls (e.g., SnAg solder balls) on the contact pads. The C4 bumps 121 can allow the package module 220 to be connected to a substrate, such as a package substrate.

[0162] Semiconductor die 145 (e.g., application-specific integrated circuit die) can be connected to the redistribution layer 12a on the die-side surface of the redistribution layer structure 30. Specifically, semiconductor die 145 can be connected to the redistribution layer 12a via microbumps 118. Photon engine module 100 can be connected to the redistribution layer 12a via solder balls 150. Semiconductor die 145 can be communicatively coupled to photon engine module 100 through redistribution layer structure 30.

[0163] Figure 15 is a vertical cross-sectional view of a package structure 1300 having a first alternative design according to one or more embodiments. The package structure 1300 having the first alternative design may be substantially similar to the package structure 1300 in Figure 13. However, the package structure 1300 having the first alternative design may include a package module 220 having the first alternative design as shown in Figure 14. The above description of the package structure 1300 of Figure 13 is equally applicable to the package structure 1300 having the first alternative design in Figure 15.

[0164] Figure 16 is a vertical cross-sectional view of a packaging module 220 having a second alternative design according to one or more embodiments.

[0165] As shown in Figure 16, the package module 220 with the second alternative design can be substantially similar to the package module 220 in Figure 12. However, in the package module 220 with the second alternative design, the photon engine module 100 can be mounted on the substrate 910. The semiconductor die 145 can also be mounted on the substrate 910, adjacent to the photon engine module 100. The substrate 910 may optionally include one or more bridging dies (not shown), similar to the bridging die 200 in Figure 12. The substrate 910 can interconnect the semiconductor die 145 and the photon engine module 100. Therefore, in the package module 220 with the second alternative design, the photon engine module 100 can constitute a common packaged optics (CPO).

[0166] The substrate 910 may include a cored or coreless substrate. The substrate 910 may have a structure substantially similar to that of the encapsulation substrate 710 in Figures 13 and 15.

[0167] In particular, the substrate 910 may include an upper passivation layer 910a substantially similar to the upper passivation layer 710a of the package substrate, an upper dielectric layer 914 substantially similar to the upper dielectric layer 714 of the package substrate, a core 912 substantially similar to the core 712, a lower dielectric layer 916 substantially similar to the lower dielectric layer 716 of the package substrate, and a lower passivation layer 910b substantially similar to the lower passivation layer 710b of the package substrate. The substrate 910 may also include an upper bonding pad 914a substantially similar to the upper bonding pad 714a of the package substrate, a metal interconnect structure 914b substantially similar to the metal interconnect structure 716b, a through hole 912a substantially similar to the through hole 712a, a lower bonding pad 916a substantially similar to the lower bonding pad 716a of the package substrate, and a metal interconnect structure 916b substantially similar to the metal interconnect structure 716b. In a second alternative design of the packaging module 220, the C4 bump 121 can be connected to the substrate under bonding pad 916a.

[0168] As shown in Figure 16, a semiconductor die 145 (e.g., an application-specific integrated circuit die) can be connected to a substrate upper bonding pad 914a on the die-side surface of the substrate 910. Specifically, the semiconductor die 145 can be connected to the substrate upper bonding pad 914a via microbumps 118. The photon engine module 100 can be connected to the substrate upper bonding pad 914a via solder balls 150. The semiconductor die 145 can be communicatively coupled to the photon engine module 100 through the substrate 910.

[0169] Figure 17 is a vertical cross-sectional view of a package structure 1300 having a second alternative design according to one or more embodiments. The package structure 1300 having the second alternative design may be substantially similar to the package structure 1300 in Figure 13. However, the package structure 1300 having the second alternative design may include the package module 220 having the second alternative design in Figure 16. The above description of the package structure 1300 of Figure 13 is equally applicable to the package structure 1300 having the second alternative design in Figure 17.

[0170] Various embodiments may include a pluggable (e.g., detachable) photonic engine module 100 (e.g., a pluggable photonic engine module assembly) including a socket 140 for optical input / output (I / O). The socket 140 allows the photonic engine module 100 to be detachably connected to a substrate (e.g., a multi-die module substrate). The photonic engine module 100 may also include a photonic engine die 130 and a fiber array unit 120 on a backplane 110. The photonic engine die 130 and the fiber array unit 120 may also be pluggable (e.g., detachably mounted on the backplane 110). A pluggable multi-fiber push-in / pull-out unit 50 may also be detachably connected to the fiber array unit 120. The backplane 110 provides a rigid structure to enhance the physical module when the photonic engine die 130, the fiber array unit 120, or the multi-fiber push-in / pull-out unit 50 is inserted / removed from the pluggable photonic engine module 100.

[0171] The socket 140 and backplane 110 allow the photonic engine die 130 to be combined with the fiber array unit 120 to realize a pluggable photonic engine module solution. This configuration allows for easy replacement of the photonic engine die 130 without affecting the functionality of other dies (e.g., application-specific integrated circuit dies) on the substrate (e.g., a multi-die module substrate). The pluggable photonic engine module 100 provides greater flexibility and convenience in network configuration and maintenance.

[0172] In some cases, the photonic engine chip 130 can be damaged in existing systems, and this damage can affect other chips on the multi-chip module substrate. The photonic engine chip 130 can be connected to other chips (e.g., application-specific integrated circuit chips) via bridging chips (e.g., connecting chips), and the cost of these other chips can be significantly higher than that of the photonic engine chip 130. Therefore, using a pluggable (e.g., detachable) photonic engine chip 130 can reduce manufacturing costs. The manufacturing stability of the photonic engine chip 130 can be lower than that of application-specific integrated circuit chips. Therefore, a detachable design allows for the removal of a defective photonic engine chip 130 and the attachment of a new photonic engine chip 130 in its place. In particular, the fiber array unit 120 may include a pluggable (e.g., detachable) fiber array unit 120 to facilitate the replacement of the damaged photonic engine chip 130. This design helps alleviate concerns that a damaged photonic engine chip can damage other chips (e.g., application-specific integrated circuit chips) on the multi-chip module substrate.

[0173] Referring to Figures 1A to 17, the photonic engine module 100 may include a backplane 110, a fiber array unit 120 attached to the backplane 110, a photonic engine die 130 attached to the backplane 110 adjacent to the fiber array unit 120, and a socket 140 attached to the backplane 110 and connected to the photonic engine die 130.

[0174] In one embodiment, the photonic engine die 130 may include a plurality of connector contact windows 138, and the receptacle 140 may include a plurality of connector pins 144 configured to contact the plurality of connector contact windows 138 to detachably connect the photonic engine die 130 to the receptacle 140. In another embodiment, the plurality of connector pins 144 may include at least one probe or microelectromechanical system (MEMS) pin. In yet another embodiment, the plurality of connector pins 144 may include fewer than about 20,000 pins, a pin density of less than about 50 pins 144 / mm², and a pin pitch of less than about 200 micrometers. In yet another embodiment, the receptacle 140 may include a plurality of solder balls 150 arranged in a ball grid array on the lower surface of the receptacle 140 opposite to the plurality of connector pins 144, and an interconnect structure 146 configured to electrically couple the plurality of connector pins 144 to the ball grid array. In yet another embodiment, the fiber array unit 120 may include a fiber optic port 125 configured to detachably receive a multi-fiber push-in / pull-out unit 50. In an embodiment, the fiber optic port 125 may be substantially aligned with the optical path 126 in the fiber optic array unit 120 and the optical path 136 in the photonic engine die 130. In an embodiment, the fiber optic array unit 120 may include an upper fiber optic array unit portion 120U, which includes the fiber optic port 125 and a first optical mirror 627U configured to guide optical signals along the optical path 126 in the upper fiber optic array unit portion 120U, and a lower fiber optic array unit portion 120L, detachably connected to the upper fiber optic array unit portion 120U, and including a second optical mirror 627L configured to guide optical signals from the upper fiber optic array unit portion 120U to the photonic engine die 130 and vice versa. In an embodiment, the photonic engine module 100 may further include a fiber optic array unit support 128 for securing the fiber optic array unit 120 to the backplane 110. In one embodiment, the photonic engine module 100 may further include an attached microlens socket 428 attached to the fiber array unit bracket 128, such that the microlens 421 of the attached microlens socket 428 can be located between the optical die and the optical path 126 of the fiber array unit 120. In another embodiment, the photonic engine die 130 includes a photonic engine circuit 132 configured to receive optical signals from the fiber array unit 120, convert the optical signals into electrical signals, and transmit the electrical signals to the socket 140; and to receive electrical signals from the socket 140, convert the electrical signals received from the socket 140 into optical signals, and transmit the optical signals from the photonic engine circuit 132 to the fiber array unit 120.

[0175] Referring again to Figures 1A to 17, a method of forming a photonic engine module 100 may include attaching a fiber array unit 120 to a backplane 110, attaching a photonic engine die 130 to a position on the backplane 110 adjacent to the fiber array unit 120, and attaching the backplane 110 to a socket 140, such that the fiber array unit 120 and the photonic engine die 130 can be located between the backplane 110 and the socket 140.

[0176] In an embodiment, the method may further include attaching a fiber array unit bracket 128 to a fiber array unit 120, wherein attaching the fiber array unit 120 to a backplane 110 may include attaching the fiber array unit bracket 128 to the backplane 110. In an embodiment, the fiber array unit 120 may include lead pins 22, and attaching the fiber array unit bracket 128 to the fiber array unit 120 may include inserting the lead pins 22 into openings in the fiber array unit bracket 128. In an embodiment, the method may further include removably attaching a photonic engine die 130 to a receptacle 140. In an embodiment, the photonic engine die 130 may include a plurality of connector contact windows 138, and the receptacle 140 may include a plurality of connector pins 144 configured to contact the plurality of connector contact windows 138, and removably attaching the photonic engine die 130 to the receptacle 140 may include contacting the plurality of connector pins 144 with the plurality of connector contact windows 138 respectively. In one embodiment, the socket 140 may include a plurality of leads 144, and attaching the backplate 110 to the socket 140 may include inserting the plurality of leads 144 into a plurality of openings in the backplate 110.

[0177] Referring again to Figures 1A to 17, the packaging module 220 may include mounting structures 20, 30, and 910, a photonic engine module 100 located on the mounting structures 20, 30, and 910, the photonic engine module 100 may include a backplane 110, a fiber array unit 120 attached to the backplane 110, a photonic engine die 130 attached to the backplane 110 adjacent to the fiber array unit 120, a socket 140 attached to the backplane 110 and connected to the photonic engine die 130, and a semiconductor die 145 mounted on the mounting structures 20, 30, and 910 adjacent to the photonic engine module 100, the semiconductor die 145 being electrically coupled to the photonic engine module 100 through the mounting structures 20, 30, and 910.

[0178] In an embodiment, mounting structures 20, 30, and 910 may include one of a substrate 910, an interposer 20, or a redistribution layer structure 30. In an embodiment, semiconductor die 145 may include application-specific integrated circuit die 145, mounting structures 20, 30, and 910 may include bridging die 200, and the application-specific integrated circuit die 145 may be electrically coupled to the photon engine module 100 through the bridging die 200.

[0179] The foregoing has outlined the features of several embodiments, enabling those skilled in the art to better understand the nature of the invention. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other programs and structures to perform the same purposes and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent constructions should not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made to this document without departing from the spirit and scope of this disclosure.

[0180] 12: Polymer layer 12a: Relayed Line Layer 14: Lower passivation layer 20: Intermediate layer, installation structure 22, 142, 422, 642, 822: Lead pins 30: Relayed circuit layer structure and installation structure 50: Multi-fiber push-in and pull-out unit 100: Photon Engine Module 110: Back panel 110a: Plate section 110a-S: Bottom surface 110b: Sidewall portion 111, 113: Openings 112: Depressed portion 120: Fiber optic array unit 120L: Lower part of fiber optic array unit 120U: Upper part of fiber optic array unit 120s: Back 121: Front side, C4 protrusion 122, 140s1: Upper surface 125: Fiber Optic Connector Port 126, 136: Optical path 128: Fiber optic array unit bracket 128a, 428a: First end 128b, 428b: Second end 129, 139: Bottom filler layer of the packaging module 130: Photon Engine Chip 131: Supporting Structure 132: Photon Engine Circuit 134: Electrical wiring 138: Connector contact window 138A: Connector contact window array 140: Socket 140a: Top surface of semiconductor grain 140s2: Lower surface 141: First semiconductor die 143: Second semiconductor die 144: Connector pins 144A: Connector pin array 145: Semiconductor chips, application-specific integrated circuit chips 146, 204: Internal Wiring Structure 148: Contact pad 150, 710c: Tin balls 160, 162, 163, 164, 165, 166, 167, 760: Adhesive layer 200, 200a, 200b: Bridging grains 202a: Upper Relay Line Layer 202b: Lower Relay Line Layer 206: Perforation of the interlayer 220: Packaging Module 227: Molding material layer 229: Encapsulation bottom filler layer 250: Lower contact window 251: Upper interlayer bonding pad 252: Intermediate layer lower bonding pad 310, 320, 330: Steps 421: Microlens 428: Microlens socket 621: Optional lens 627L: Lower optical mirror, second optical mirror 627U: Upper optical mirror, first optical mirror 710: Packaging substrate 710a: Upper passivation layer 710b: Lower passivation layer 712, 912: Core 712a, 912a: Through holes 714: Upper dielectric layer of the packaging substrate 714a: Upper bonding pad of the package substrate 714b, 716b, 914b: Metal interconnect structure 716: Lower dielectric layer of the packaging substrate 716a: Underside bonding pad of the package substrate 730: Reinforcing Ring 828: Standard socket 910: Substrate and mounting structure 910a: Passivation layer on the upper side of the substrate 910b: Passivation layer on the lower part of the substrate 914: Upper dielectric layer of substrate 914a: Upper bonding pad of substrate 916a: Substrate under-mount bonding pad 1038: Connector pin 1038A: Connector pin array 1044: Connector pin opening 1044A: Connector pin opening array 1227: Upper molding material layer 1300: Package Structure D1: First Distance D2: Second distance H110: Height L1, L2, L3: Distance L110: Length W110: Width

Claims

1. A photonic engine module, comprising: Back panel; An optical fiber array unit attached to the backplane, wherein the optical fiber array unit includes an optical fiber port configured to detachably receive a multi-fiber push-in / pull-out unit; a photonic engine die attached to the backplane adjacent to the optical fiber array unit; and a socket attached to the backplane and connected to the photonic engine die.

2. The photonic engine module as claimed in claim 1, wherein the photonic engine die includes a plurality of connector contact windows, and the receptacle includes a plurality of connector pins configured to contact the plurality of connector contact windows to detachably connect the photonic engine die to the receptacle.

3. The photonic engine module as claimed in claim 2, wherein the plurality of connector pins comprises a number of less than about 20,000, a pin density of less than about 50 pins per square millimeter, and a pin pitch of less than about 200 micrometers.

4. The photonic engine module as described in claim 1, further comprising: A fiber optic array unit bracket is used to fix the fiber optic array unit on the back plate.

5. The photonic engine module as claimed in claim 1, wherein the optical fiber connector is substantially aligned with the optical path length in the optical fiber array unit and the optical path length in the photonic engine die.

6. The photonic engine module as claimed in claim 1, wherein the fiber array unit comprises: The upper portion of the fiber array unit includes the fiber optic connector and a first optical mirror configured to guide an optical signal along the optical path in the upper portion of the fiber array unit; and the lower portion of the fiber array unit is detachably connected to the upper portion of the fiber array unit and includes a second optical mirror configured to guide an optical signal from the upper portion of the fiber array unit to the photonic engine die and to the upper portion of the fiber array unit.

7. The photonic engine module of claim 1, wherein the photonic engine die includes photonic engine circuitry configured to: receive an optical signal from the fiber array unit, convert the optical signal into an electrical signal, and transmit the electrical signal to the socket; and receive an electrical signal from the socket, convert the electrical signal received from the socket into an optical signal, and transmit the optical signal from the photonic engine circuitry to the fiber array unit.

8. A method for forming a photonic engine module, comprising: Attach the fiber array unit to the backplane; The photonic engine die can be detachably attached to the socket; The photonic engine die is attached to the backplane adjacent to the fiber array unit; and the backplane is attached to a socket such that the fiber array unit and the photonic engine die are located between the backplane and the socket.

9. The method of claim 8, wherein the photonic engine die includes a plurality of connector contact windows and the receptacle includes a plurality of connector pins configured to contact the plurality of connector contact windows, and removably attaching the photonic engine die to the receptacle includes contacting the plurality of connector pins to the plurality of connector contact windows respectively.

10. A packaging module, comprising: Installation structure; The photon engine module located on the mounting structure includes: a backplate; A fiber optic array unit, attached to the backplane, wherein the fiber optic array unit includes a fiber optic port configured to detachably receive a multi-fiber push-in / pull-out unit; a photonic engine die, attached to the backplane adjacent to the fiber optic array unit; a socket, attached to the backplane and connected to the photonic engine die; and a semiconductor die, mounted on the mounting structure adjacent to the photonic engine module and electrically coupled to the photonic engine module through the mounting structure.

Images