Transfer machine, substrate processing apparatus, substrate processing method, semiconductor device manufacturing method and substrate processing procedure

Abstract

A transfer machine includes: (a) an end effector capable of holding a corresponding substrate; and (b) a substrate detector having: (b1) a light-emitting section having a first end that emits reference light from a first optical fiber; (b2) a light-receiving section having a second end that is substantially opposite to the first end, receiving reference light reflected from the back or surface of a transparent corresponding substrate and guiding it to a second optical fiber; (b3) a plate that, when viewed from the light-emitting section and the light-receiving section, expands on the opposite side of the corresponding substrate between the vicinity of the first end and the vicinity of the second end; and (b4) a wall that prevents direct incidence of reference light from the first end to the second end. The substrate detector is capable of optically detecting the corresponding substrate in at least one of the states of an inserted retainer and a state of holding the corresponding substrate.

Description

Technical Field

[0001] This invention relates to a transfer machine, a substrate processing apparatus, a substrate processing method, and a method and procedure for manufacturing a semiconductor device. Prior Technology

[0002] The transfer of substrates to be processed inside a semiconductor manufacturing apparatus is performed by a substrate transfer machine. Multiple substrate transfer plates are provided to enable the transfer of multiple substrates to be processed simultaneously within the substrate transfer machine. Sometimes, substrate detection sensors are provided on each substrate transfer plate for the purpose of detecting whether a substrate to be processed is present on the substrate transfer plate. (For example, Japanese Patent Application Publication No. 2000-138280) [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2000-138280 Summary of the Invention

[0004] [The problem the invention aims to solve]

[0005] When the substrate detection sensor is a transmissive fiber optic sensor, if the substrate is visually transparent, there is a possibility of incorrect detection due to the inability to block light.

[0006] This invention provides a technology that can detect substrates even on transparent substrates. [Technical means to solve the problem]

[0007] According to one embodiment of the present invention, a technology is provided, comprising: (a) An end effector configured to hold a corresponding substrate after being inserted into a holding member that houses multiple substrates in a multilayer structure without contacting the substrate; and (b) A substrate detector, which is disposed at a specific relative position relative to the end effector. The substrate detector has: (b1) A light-emitting section, which is formed in the shape of a rod and has a first end that emits reference light from the first optical fiber; (b2) A light-receiving portion, which is formed in the shape of a rod and has a second end that is substantially opposite to the first end, receives the reference light reflected from the back or surface of the transparent corresponding substrate and guides it to the second optical fiber; (b3) A plate, when viewed from the light-projecting portion and the light-receiving portion, expands on the opposite side of the corresponding substrate, between the vicinity of the first end and the vicinity of the second end; and (b4) A wall that prevents the reference light from directly incident from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one of the states of being inserted into the holder and holding the corresponding substrate. [Effects of the Invention]

[0008] According to the present invention, even transparent substrates can be inspected. Simple Explanation of the Diagram

[0009] [Figure 1] is a perspective view of a substrate processing apparatus preferably used in an embodiment of the present invention. [Figure 2] is a schematic perspective view of a transfer machine preferably used in an embodiment of the present invention, illustrating the transfer of a vessel to a boat performed by the transfer machine. [Figure 3] is a diagram showing the configuration of the end effector and the substrate detector preferred in an embodiment of the present invention. [Figure 4] is a diagram illustrating the configuration range of the light-receiving portion of the substrate detector preferably used in an embodiment of the present invention. [Figure 5] is a schematic structural diagram of the controller of a substrate processing apparatus preferred for use in an embodiment of the present invention. [Figure 6] is a flowchart illustrating the substrate processing steps applicable in an embodiment of the present invention. [Figure 7] is a cross-sectional view showing a substrate detector in another embodiment of the present invention. [Figure 8] is a perspective view showing a substrate detector in another embodiment of the present invention. Implementation

[0010] The following description will primarily refer to Figures 1 to 6 to illustrate one aspect of the present invention. It should be noted that the figures used in the following description are schematic, and the dimensional relationships and ratios of the elements shown may not correspond to reality. Furthermore, the dimensional relationships and ratios of the elements may not be consistent among the multiple figures. Unless otherwise specified in the specification, each element is not limited to one and may exist in multiples.

[0011] (Overview of the substrate processing apparatus) The substrate processing apparatus described in this embodiment is used in the manufacturing process of semiconductor devices. Therefore, processing (heat treatment) is performed on the substrate, which will become the processed object, by heating it with a heater while the substrate is housed in the processing chamber. More specifically, it is a vertical substrate processing apparatus that processes multiple substrates simultaneously while they are stacked vertically at predetermined intervals.

[0012] The substrate used as a substrate processing apparatus to process objects includes, for example, a semiconductor wafer substrate (hereinafter simply referred to as "wafer") into which a semiconductor device (semiconductor element) is incorporated. Furthermore, the heat treatment performed by the substrate processing apparatus includes, for example, oxidation, diffusion, annealing, reflow soldering, hot pressing, film formation based on thermal CVD (Chemical Vapor Deposition) reaction, and film quality improvement (treatment: purification) processes.

[0013] (1) Structure of the substrate processing device Figure 1 illustrates the overall apparatus. Figure 1 shows the main parts of the substrate processing apparatus.

[0014] The substrate processing apparatus 1 includes a housing 13. A wafer cassette (holding member) 21, which serves as a sealed substrate container, is moved into or out of the substrate processing apparatus 1 by an in-process transfer device (not shown).

[0015] A sub-shell 28 is located in the lower rear part of the housing 13 in the front-rear direction. On the front wall 29 of the sub-shell 28, a pair of wafer loading / unloading outlets 32 are arranged vertically in two layers for moving the wafer 31 into and out of the sub-shell 28. Wafer cassette openers 26 are respectively provided for the upper and lower wafer loading / unloading outlets 32.

[0016] The wafer cassette opener 26 includes a mounting stage 33 for holding a wafer cassette 21 and an opening / closing mechanism 34 for opening and closing the cover of the wafer cassette 21. The wafer cassette opener 26 is configured to open and close the wafer inlet / outlet of the wafer cassette 21 by opening and closing the cover of the wafer cassette 21 placed on the mounting stage 33 using the opening / closing mechanism 34.

[0017] The sub-housing 28 forms a hermetically sealed transfer chamber (loading chamber, loading area) 35 relative to the space where the wafer cassette opener 26 is located. A transfer machine 36 is provided in the front region of the transfer chamber 35. The transfer machine 36 has a plurality of end effectors 37 for holding wafers 31. The end effectors 37 are capable of linear movement in the horizontal direction, rotation in the horizontal direction, or lifting and lowering in the vertical direction. The transfer machine 36 is configured to load and remove wafers 31 relative to a boat 38, which serves as a substrate holder. The end effectors 37 are also called substrate grippers, wafer carriers, hands, chucks, forks, or tweezers, and five are arranged in a direction perpendicular to the surface of the wafer 31 being gripped.

[0018] A vertically oriented processing furnace 12 is disposed above the transfer chamber 35. The processing furnace 12 forms a processing chamber 14 inside, and the lower end of the furnace opening of the processing chamber 14 is open and closed by a furnace gate (not shown). The processing chamber 14 performs heat treatment on the wafer 31 held in the boat 38.

[0019] A boat lifting mechanism 42 for raising and lowering the boat 38 is provided on the side of the sub-shell 28. A sealing cover 44, serving as a cover, is horizontally mounted on the lifting platform of the boat lifting mechanism 42. The sealing cover 44 vertically supports the boat 38 and can airtightly seal the furnace opening while the boat 38 is being loaded into the processing furnace 12. The transfer chamber 35 is adjacent to the processing chamber 14, and wafers 31 are moved in and out between the transfer chamber 35 and the processing chamber 14 for each boat 38. The boat 38 is configured to hold multiple wafers 31 (e.g., 50 to 175 wafers or less) at predetermined intervals in a horizontal position with their centers aligned. As shown in FIG2, the boat 38 has pillars 38a to 38c that serve as pillars for holding the wafers 31. Slots (grooves) for holding the wafers 31 are provided on the pillars 38a to 38c. The spacing of the slots, i.e. the spacing of the wafers 31 held in the boat dish, is usually different from the spacing of the wafers 31 held in the wafer box 21, and can be less than 6 mm.

[0020] On the side of the sealing cover 44 opposite to the processing chamber 14, a rotation mechanism 46 is provided to rotate the boat 38 about a central axis corresponding to the center of the wafer 31. The rotation axis of the rotation mechanism 46 passes through the sealing cover 44 and is connected to the boat 38. The rotation mechanism 46 is configured to rotate the wafer 31 by rotating the boat 38.

[0021] Figure 2 illustrates a structural example of the transfer machine. Figure 2 shows the state during the transfer of wafer 31 to boat 38 by transfer machine 36. That is, the end actuator 37 of transfer machine 36 is opposite to the support pillars 38a and 38c of boat 38.

[0022] The transfer machine 36 includes a guide 360 ​​arranged along the vertical direction (Z-axis direction), a Z-axis drive unit 361, a Y-axis rotation drive unit 362, an X-axis drive unit 363, and a V-axis drive unit 364. Each drive unit 361 to 364 can also be referred to as a drive system.

[0023] Z-axis drive unit 361 is provided at the lower or upper end of guide member 360 so that assembly part 360a can move along guide member 360 in the vertical direction (Z-axis direction, vertical direction).

[0024] The Y-axis rotation drive unit 362 is supported in a manner where the X-axis of the X-axis drive unit 363 is orthogonal to the Y-axis. Furthermore, to allow it to rotate clockwise or counterclockwise in the horizontal direction (around the Y-axis), the upper surface of the mounting unit 360a is itself configured to be rotatable in the Y-axis direction. Since the wafer cassette 21 is typically positioned between the direction of the boat 38 and the opposite direction when viewed from the Y-axis, a rotation range of approximately 180 degrees is sufficient.

[0025] The X-axis drive unit 363 supports the V-axis drive unit 364 and is integrally provided with or inside the Y-axis rotation drive unit 362 in order to move it back and forth in the horizontal direction (X-axis direction). Furthermore, the direction in which the X-axis moves by protruding from the Y-axis rotation drive unit 362 in order to allow the end effector 37 to enter the boat 38 or the wafer cassette 21 is defined as "forward".

[0026] The V-axis drive unit 364 is located on the X-axis drive unit 363, horizontally supports five end actuators 37, and their spacing can be adjusted (changed) in the Z-axis direction. Each end actuator 37 is mounted on the V-axis drive unit 364 via a corresponding mounting part 39. The V-axis drive unit 364 and the mounting parts 39 constitute a variable-pitch mechanism.

[0027] After the end effector 37 is inserted without contacting the wafer 31, it can hold the corresponding wafer 31. In this way, the transfer machine 36 can use the end effector 37 to remove the wafer 31 from the wafer cassette 21 and load it into the carrier 38. Furthermore, after the wafer 31 has undergone arbitrary processing in the furnace 12, the transfer machine 36 can use the end effector 37 to remove (unload) the wafer 31 from the carrier 38 and load it into the wafer cassette 21.

[0028] The transfer machine 36 also includes a pair of sensor rods 50 located on both sides of the Y-axis rotation drive unit 362 and a forward / backward drive unit 365 that moves the sensor rods 50 in the X-axis direction.

[0029] The sensor rod 50 extends upward along both sides of the rotation drive unit 362 along the Y-axis to approximately the same height as one of the end effectors 37, and is bent at approximately a right angle relative to the X-axis direction drive unit 363 in the opposite direction to the mounting direction of the end effector 37, i.e., behind the X-axis. The sensor rod 50 holds the fiber optic sensor 51, which serves as a measurement sensor.

[0030] A light-transmitting or light-receiving section of an optical fiber sensor 51 is mounted at the front end of a pair of sensor rods 50. The optical fiber sensor 51 is a pair of transmissive sensors, one transmitting light and the other receiving the light, and can be configured such that the optical path (optical axis) formed between the light-transmitting and light-receiving sections is parallel to the tangent of the wafer 31. By detecting the interruption of the optical path, the optical fiber sensor 51 performs normal / abnormal measurements such as counting the number of wafers 31 loaded in the wafer cassette 21 and the carrier 38 or detecting wafer protrusion.

[0031] The forward and backward drive unit 365 is disposed on both sides of the Y-axis rotation drive unit 362, and supports the sensor rod 50 in such a way that the sensor rod 50 can move along the X-axis direction between the protruding position and the retracted position.

[0032] In the transfer unit 36, five substrate detectors 60 are provided corresponding to five end effectors 37. Each substrate detector 60 is arranged in a specific relative position with respect to the corresponding end effector 37. Each substrate detector 60 is configured to optically detect the corresponding wafer 31 in at least one of the following states: when the corresponding end effector 37 is inserted between wafers 31 held on the boat 38 or wafer cassette 21, and when the end effector 37 holds the corresponding wafer 31.

[0033] The substrate detector 60 will be described using Figures 3 and 4. Figure 3 shows the state in which the end effector 37 holds the corresponding wafer 31.

[0034] The substrate detector 60 includes a support arm 61, a light-emitting section 62, a light-receiving section 63, and a separator 64, which serve as fixing components. The substrate detector 60 consists of a pair of reflective sensors, namely the light-emitting section 62 and the light-receiving section 63, which are composed of fiber optic sensors. The substrate detector 60 is provided separately from each end effector 37.

[0035] The support arm 61 is threadedly fastened to one side of the mounting portion 39 of the end actuation portion 37. The support arm 61 extends parallel to the length direction of the end actuation portion 37, bends and extends in the tangential direction of the placed wafer 31, and forms the front end portion 611.

[0036] A rod-shaped light-emitting portion 62 and a light-receiving portion 63 are provided at the front end 611 of the support arm 61. The light-emitting portion 62 and the light-receiving portion 63 are each inserted into a through hole provided at the front end 611 and fixed by screws 612 and 613 (see Figure 8) (threaded fastening). Furthermore, the light-emitting portion 62 and the light-receiving portion 63 are arranged substantially parallel to each other. The axis (central axis) of the light-emitting portion 62 and the light-receiving portion 63 points approximately in the direction of the center of the wafer 31 supported on the end actuation unit 37 (approximately in the radial direction). The front ends of the light-emitting portion 62 and the light-receiving portion 63 are positioned laterally away from the side edge of the end actuation unit 37. Moreover, the optical axis of the light-emitting portion 62 and the light-receiving portion 63 is located inside the outer contour of the wafer 31 supported on the end actuation unit 37.

[0037] The first end 621 of the light-emitting section 62 emits reference light from the first optical fiber 623. The first end 621 has a reflector 622 that reflects the reference light from the first optical fiber 623 in a direction orthogonal to the longitudinal direction of the light-emitting section 62. This allows the reference light from the optical fiber 623 to illuminate the wafer 31. The second end 631 of the light-receiving section 63 receives reference light reflected from the back or surface of the wafer 31 and guides it to the second optical fiber 633. The second end 631 has a reflector 632 that reflects and guides reference light from a direction orthogonal to the longitudinal direction of the light-receiving section 63 to the second optical fiber 633. This allows the optical fiber 623 to receive reference light reflected from the wafer 31. The first end 621 and the second end 631 have small holes (e.g., approximately 0.5 mm in diameter) on their sides, through which light can enter and exit.

[0038] The light-projecting part 62 has a sheath 624 that houses a reflector 622 and a portion of an optical fiber 623, and a fixing part 625 that houses the other portion of the optical fiber 623. The fixing part 625 is connected to the sheath 624 and has a larger diameter than the sheath 624. The light-receiving part 63 has a sheath 634 (see Figure 8) that houses a reflector 632 and a portion of an optical fiber 633, and a fixing part 635 (see Figure 8) that houses the other portion of the optical fiber 633. The fixing part 635 is connected to the sheath 634 and has a larger diameter than the sheath 634.

[0039] The sheaths 624 and 634 and the fixing parts 625 and 635 are, for example, metal tubes, in which the optical fibers 623 and 633 are sealed with adhesive. The fixing parts 625 and 635 have the strength to withstand threaded fastening. Due to their large diameter, they are easy to fix and position.

[0040] The separator 64 engages with the recess of the front end 611 of the support arm 61 and is secured by screws 614 and 615 (see Figure 8) (threaded fastening). The separator 64 extends from the front end 611 toward the center of the wafer 31 supported on the end actuation unit 37. The separator 64 is preferably constructed by treating with a black alumina film or by applying a black coating. For example, in this case, the reflectivity is about 0.1%. This reduces the reflection of reference light.

[0041] The separator 64 includes a plate 641 disposed below the light-projecting portion 62 and the light-receiving portion 63, a wall 642 disposed between the light-projecting portion 62 and the light-receiving portion 63, and a fixing portion 643 fixed to the arm 61. The plate 641 is configured to expand from near the first end 621 to near the second end 631 on the opposite side (in this case, below) of the wafer 31 being inspected when viewed from the light-projecting portion 62 and the light-receiving portion 63. The wall 642 is provided on the surface of the plate 641 on the wafer 31 side of the object being inspected, preventing (blocking) reference light from the first end 621 from directly incident on the second end 631. Therefore, the wall 642 has a predetermined height higher than the height of the axis of the light-projecting portion 62 and the axis of the light-receiving portion 63. Additionally, the wall 642 has a predetermined width.

[0042] The support arm 61 fixes the positions of the first end 621 of the light-emitting part 62 and the second end 631 of the light-receiving part 63 relative to the plate 641 or the wall 642. In this way, the spacing (sensor pitch) between the light-emitting part 62b and the light-receiving part 63b can be optimized.

[0043] The functions of plate 641 and wall 642, and the arrangement range of light-receiving part 63, will be explained using Figure 4. Figure 4 shows the arrangement of the uppermost plate 641a, wall 642a, light-emitting part 62a, and light-receiving part 63a of the substrate detector 60, and the lower plates 641b, wall 642b, light-emitting part 62b, and light-receiving part 63b. The arrangement range of light-receiving part 63 with the position of light-emitting part 62 relative to wall 642 fixed will be explained.

[0044] At the top layer, there is no plate 641 above wafer 31a. Therefore, reference light from the projection section 62a is only reflected by wafer 31a and can be incident on the light receiving section 63a. Light from the reference light from the projection section 62a that exceeds the wall 642a can be incident on the light receiving section 63a. The light receiving section 63a can be configured at position P3.

[0045] The upper plate 641a blocks the reference light from the lower projection section 62b. The upper wall 642a blocks the direct incident reference light from the upper projection section 62a onto the light-receiving section 63a. The reference light from the lower projection section 62b is reflected at the lower surface of the wafer 31a and the lower surface of the upper plate 641a.

[0046] In a layer lower than the top layer, for example, the layer below the top layer, there is a plate 641a above the wafer 31b. Therefore, reference light from the projection section 62b can be reflected by the plate 641a and incident on the light receiving section 63a, in addition to the wafer 31b.

[0047] Let Y be the distance (height) from the axis of the lower light-emitting part 62b and the light-receiving part 63b to the lower surface of the wafer 31b located thereon. Let H be the distance (height) from the axis of the light-emitting part 62b and the light-receiving part 63b to the lower surface of the upper plate 641a. Let X be the distance from the axis of the light-emitting part 62b and the light-receiving part 63b to the side of the lower wall 642b. Let V be half the length (width) of the wall 642 in the direction orthogonal to the axis of the light-emitting part 62 and the axis of the light-receiving part 63b, and let h be the height from the axis of the light-emitting part 62 and the light-receiving part 63 to the upper surface of the wall 642.

[0048] Using the line connecting the axis of the light-emitting section 62b and the light-receiving section 63b as a reference, the angle at which the reference light from the light-emitting section 62b passes over the wall 642b is defined as α. The angle at which the reference light from the light-emitting section 62b is reflected from the lower surface of the wafer 31b and passes over the wall 642b is defined as β. The angle at which the reference light from the light-emitting section 62b is reflected from the lower surface of the upper plate 641a at the center of the width of the wall 642b is defined as θ. Here, the relationship between α, β, and θ is as follows. 0°<α<β<θ<90°

[0049] If we define the range (effective range: the distance between position P1 and position P2) where wafer 31b is detected but the upper board 641a is not detected as A, then A is as follows. Y / tanβ <A<H / tanθ tanθ = Y / (X+V) tanβ = h / (XA) Therefore, YX / (Y+h) <A<H(X+V) / Y

[0050] Furthermore, the area between position P2 and position P3 is the range where wafer 31b and the upper plate 641a are detected, while the area between position P3 and position P4 is the range where only the upper plate 641a is detected.

[0051] The light projected from the first end 621 expands at a certain angle (the same applies to the light received). The aperture angle (half-value angle), which represents the angle of expansion, is preferably 2 to 60 degrees. A larger aperture angle is more preferable so that the accuracy of the angle when assembling the substrate detector 60 does not become too strict. Furthermore, the expression of a numerical range such as "2 to 60 degrees" in this specification indicates that the lower and upper limits are included in this range. Thus, for example, "2 to 60 degrees" means "more than 2 degrees and less than 60 degrees". The same applies to other numerical ranges.

[0052] The light-emitting part 62 and the light-receiving part 63 (the base ends of a pair of optical fibers 623 and 633) are connected to the amplification part 40 (see Figure 5). The amplification part 40 has a built-in light source (e.g., a light-emitting diode), a photodetector (e.g., a photodiode), and a detection circuit.

[0053] Light emitted from the light source built into the amplification section 40 is incident on the base end of the optical fiber 623, propagates within the optical fiber 623, and is incident on the reflector 622 from its front end face, exiting from the first end 621. When the emitted light (reference light) is reflected by the wafer 31 of the object being detected, the reflected light is incident on the second end 631, and thus on the front end face of the optical fiber 633. Therefore, the light-emitting section 62 and the light-receiving section 63 are fixed to the front end 611 of the support arm 61 in such a way that the exit surface (hole) of the first end 621 and the incident surface (hole) of the second end 631 are oriented in approximately the same direction. The incident light is propagated within the optical fiber 633 and reaches the photodetector built into the amplification section 40.

[0054] The detection circuit built into the amplification unit 40 determines the presence or absence of a substrate (including a transparent substrate) during the threshold processing of the light-receiving level. The threshold can be common to all substrate detectors. In other words, since the risk of false detection is low, adjustment for each substrate detector is not required.

[0055] As shown in Figure 5, the controller 210, which serves as the control unit (control mechanism), is configured as a computer equipped with a CPU (Central Processing Unit) 212, RAM (Random Access Memory) 214, a memory device 216, and I / O ports 218. The RAM 214, memory device 216, and I / O ports 218 are configured to exchange data with the CPU 212 via an internal bus 220. An input / output device 222, such as a touch panel, is connected to the controller 210.

[0056] The memory device 216 is composed of, for example, flash memory or an HDD (Hard Disk Drive). Within the memory device 216, control programs that control the operation of the board processing apparatus and program formulas that describe the order and conditions of the board processing described later are stored in a readable manner. The program formulas are combinations that cause the controller 210 to execute each step of the board processing process described later and obtain a predetermined result, and function as a program. Hereinafter, the program formulas and control programs will be collectively referred to as programs. When the term "program" is used in this specification, there may be cases where only the program formula is included, cases where only the control program is included, or cases where both are included. RAM 214 is configured as a memory area (working area) that temporarily stores programs and data read by the CPU 212.

[0057] I / O port 218 is connected to the aforementioned transfer machine 36, rotating mechanism 46, boat lift 42, and enlargement unit 40.

[0058] CPU 212 is configured to read and execute a control program from memory device 216, and to read a program formula from memory device 216 based on input of operation instructions from input / output device 222. CPU 212 is configured to control the wafer transfer operation performed by control transfer machine 36, the rotation and rotation speed adjustment operation of boat 38 performed by rotation mechanism 46, the lifting operation of boat 38 performed by boat lift machine 42, and the substrate detection operation performed by amplification unit 40 in accordance with the contents of the read program formula.

[0059] The controller 210 is configured by installing the aforementioned program stored in the external memory device 224 onto a computer. The external memory device 224 is, for example, a magnetic disk such as a magnetic tape, floppy disk, or hard disk; an optical disk such as a CD or DVD; an optical disk such as an MO; or a semiconductor memory such as a USB memory or memory card. The memory device 216 and the external memory device 224 constitute a computer-readable recording medium. Hereinafter, they will be collectively referred to as recording media. When the term "recording media" is used in this specification, there may be a case that includes only the memory device 216, a case that includes only the external memory device 224, or a case that includes both. Furthermore, the program can also be provided to the computer without using the external memory device 224, but using communication means such as the Internet or a dedicated line.

[0060] (2) Substrate processing process Using a substrate processing apparatus 1, which is a semiconductor manufacturing device, a summary of the substrate processing steps for processing substrates will be described. This substrate processing step is, for example, a step used in manufacturing a semiconductor device. Furthermore, in the following description, the operation and processing of each part constituting the substrate processing apparatus 1 are controlled by a controller 210.

[0061] (Substrate handling process: S10) If the wafer cell 21 is supplied to the substrate processing apparatus 1, it is transferred to the mounting stage 33.

[0062] Regarding the wafer cassette 21 placed on the mounting stage 33, its open side end face is pressed against the edge of the wafer loading / unloading outlet 32 ​​in the front wall 29 of the sub-cassette 28, and the cover is removed through the opening / closing mechanism 34, thereby opening the wafer loading / unloading entrance.

[0063] If wafer cassette 21 is opened via wafer cassette opener 26, the sensor rod 50 of transfer machine 36 moves to the protruding position (closer to wafer cassette 21) via forward / backward drive unit 365. Then, the sensor rod 50 moves up and down at a fixed speed via Z-axis drive unit 361, measuring wafers 31 via fiber optic sensor 51, thereby sequentially detecting wafers 31 within wafer cassette 21. After the measurement operation is completed, the sensor rod 50 returns to the retracted position.

[0064] Then, the forward, upward, and backward movements of the end effector 37, the rotation and spacing changes of the Y-axis rotation drive 362, and the forward, downward, and backward movements of the end effector 37 are repeated sequentially. In this way, the wafer 31 is picked up from the wafer cassette 21 through the wafer loading / unloading outlet 32 ​​and loaded into the carrier 38. The output (status) of the substrate detector 60 when the end effector 37 is inserted into the wafer cassette 21 is stored. During the transport process, the output of the substrate detector 60 is monitored, and if there is a change in the output, an anomaly is determined, the transport is stopped, and an alarm is issued. This allows for the detection of substrate falling and shifting during the transport process.

[0065] After loading is completed, the lower end of the processing furnace 12, which has been closed by the furnace gate, is opened through the furnace gate. Then, the boat 38 holding the wafer 31 is lifted by the boat lift 42 through the sealing cover 44 and moved from the transfer chamber 35 into the processing furnace 12 (loading).

[0066] (Film forming process: S20) After loading, the wafer 31 is heat-treated in the processing chamber 14 inside the processing furnace 12.

[0067] (Substrate removal process: S30) Next, the boat 38 carrying the heat-treated wafer 31 is moved from the processing chamber 14 to the transfer chamber 35 (boat unloading). Then, the boat 38 cools the heat-treated wafer 31.

[0068] After cooling, the sensor rod 50 of the transfer machine 36 moves to the protruding position via the forward / backward drive unit 365. Then, the sensor rod 50 moves up and down via the Z-axis drive unit 361, using the fiber optic sensor 51 to perform measurement operations on the wafer 31. When the measurement is completed, the sensor rod 50 returns to the storage position.

[0069] Next, the forward, upward, and backward movements of the end effector 37, the rotation and pitch change of the Y-axis rotation drive 362, and the forward, downward, and backward movements of the end effector 37, and the rotation and pitch change of the Y-axis rotation drive 362 are repeated sequentially. In this way, the wafer 31 is picked up from the carrier 38 and transported to the wafer cassette 21 through the wafer loading / unloading outlet 32. Then, the wafer cassette 21 is moved out of the housing 13. During this process, the output of the substrate detector 60 is monitored in the same manner as in the substrate loading process 10.

[0070] According to this method, one or more of the following effects are obtained.

[0071] (a) It can suppress the height of the substrate detector and can handle the transport of narrow-pitch boats.

[0072] (b) It can reliably block reflected light (interference light) from components outside the object wafer, thereby improving detection accuracy.

[0073] (c) Since the substrate detector is a reflective sensor with the light-emitting part arranged at an incident angle of close to 90°, the reflectivity becomes high as shown by the Fresnel formula, and high sensitivity (high S / N) can be achieved compared with the transmissive sensor with orthogonal or oblique optical axes.

[0074] (d) Even if wafer 31 is a visually transparent wafer (allowing almost all visible light to pass through), such as a silicon carbide (SiC) wafer, it can still be inspected.

[0075] (e) Even if the spacing of the end effector is changed, the optical configuration such as the spacing between the light-emitting part and the light-receiving part will not change, so the influence on the operation of the sensor can be eliminated.

[0076] The substrate detector 60 in other embodiments will be described using Figures 7 and 8. Figure 7 shows the substrate detector 60 being inserted between wafers 31 mounted on the wafer cassette 21 or boat 38.

[0077] The structure of the plate 641 of the separator 64 in this embodiment is different from that of the plate 641 in the embodiment shown in FIG4. The other structures of the substrate detector 60 in this embodiment are the same as those in the embodiment.

[0078] The width of the plate 641 is smaller than the distance between the central axes of the light projecting part 62 and the light receiving part 63. The two ends of the plate 641 close to the first end part 621 and the second end part 631 respectively have first and second conical surfaces 644, 645 that taper towards the points (lower ends) of the wafer 31 (the wafer 31 to be detected) farthest from the first end part 621 and the second end part 631. Thereby, the incident light of the reference light from the lower layer can be prevented. The conical surfaces 644, 645 are formed with a chamfer of 30 degrees relative to the horizontal plane, for example. The points (lower ends) of the first end part 621 and the second end part 631 farthest from the corresponding wafer 31 are arranged on substantially the same plane as the surface of the plate 641 on the side opposite to the corresponding wafer 31 (the lower surface of the plate 641). The lower surface of the plate 641 is arranged on substantially the same plane as the lower surface of the corresponding end execution part 37.

[0079] The maximum thickness of the part (front end part) of the substrate detector 60 inserted between the wafers, that is, the sum of the height of the plate 641 and the wall 642 is substantially the same as the outer diameter of the sheath tubes 624, 634, and this is set as H'sub>1. When the end execution part 37 holds the wafer 31, the end execution part 37 and the substrate detector 60 rise towards the wafer 31. The distance (wafer placement height) between the lower end of the substrate detector 60 and the lower surface of the wafer 31 at this time is set as H'sub>2. In addition, the maximum thickness height (height) of the part of the end execution part 37 inserted between the wafers is set as H'sub>3. Here, H'sub>1 < H'sub>2 < H'sub>3. H'sub>1 is, for example, 0.5 to 2 mm, H'sub>2 is, for example, 1 mm to 3 mm or H'sub>1 + 0.2 mm to H'sub>1 + 1.5 mm, and H'sub>3 is, for example, 1.3 to 4 mm or H'sub>2 + 0.3 mm to H'sub>2 + 2 mm.

[0080] In this embodiment, the same effects as those of the above embodiment are also obtained. In addition, the position of the lower surface of the plate 641 in this embodiment is arranged closer to the light projecting part 62 and the light receiving part 63 than the position of the lower surface of the plate 641 in the embodiment shown in FIG. 4, and the part (front end part) of the substrate detector 60 inserted between the wafers is thinned. Thereby, the upper end of the front end part of the substrate detector 60 is set to a height lower than the lower surface of the wafer 31, and contact with the wafer 31 can be avoided. In addition, the lower end of the front end part of the substrate detector 60 is set to a height above the lower end of the end execution part 37, and reduction of the conveyance clearance can be avoided.

[0081] The embodiments of the present invention have been specifically described above, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist thereof. For example, a groove can be provided along the radial direction of the wafer on the lower surface of the plate 641 directly below the wall 642, thereby further reducing the back reflection of the plate 641.

[0082] In the above embodiments, an example of heat treatment using a batch-type substrate processing apparatus that processes multiple substrates at a time was described. The present invention is not limited to the above embodiments; for example, it can also be adapted for heat treatment using a leaf-type substrate processing apparatus that processes one or more substrates at a time. Furthermore, in the above embodiments, an example of forming a film using a substrate processing apparatus with a hot-wall type processing furnace was described. The present invention is not limited to the above embodiments; it can also be adapted for heat treatment using a substrate processing apparatus with a cold-wall type processing furnace.

[0083] When using these substrate processing devices, each process can be performed in the same processing order and processing conditions as in the above embodiments, and the same effects as in the above embodiments can be obtained.

[0084] 1: Substrate processing device 12: Processing Furnace 13: Shell 14: Processing Room 21: Wafer Box 26: Wafer Case Opener 28: Subshell 29: Front Wall 31: Wafer 31a~31b: Wafers 32: Wafer in / out 33: Platform 34: Opening and closing mechanism 35: Transfer Chamber 36: Transfer machine 37: Terminal actuator 38: boat 38a~38c: Support pillars 39: Installation Department 40: Enlarged section 42: Boat Elevator 44: Sealing cap 46: Rotating mechanism 50: Sensor rod 51: Fiber Optic Sensor 60: Substrate detector 61: Support arm 62:Light projection department 62a~62b: Light projection part 63: Light-receiving part 63a~63b: Light-receiving parts 64: Separator 210: Controller 212: CPU 214:RAM 216: Memory device 218:I / O port 220: Internal Busbar 222: Input / output devices 224: External Memory Device 360: Guide 360a: Assembly Department 361: Z-axis drive unit 362: Y-axis rotation drive unit 363: X-axis direction drive unit 364: V-axis direction drive unit 365: Forward and Reverse Drive Unit 611: Front end 612: Screw 613: Screw 614: Screws 615: Screws 621: First end 622: Reflector 623: First Fiber Optic 624: Sheath 625: Fixing part 631: Second end 632: Reflector 633: Second fiber optic cable 634: Sheath 635: Fixing part 641: Board 641a~641b: Plate 642:Wall 642a~642b: wall 643: Fixing part 644: First cone-shaped surface 645: Second cone-shaped surface A: Scope H: Distance (Height) H1: Height H2: Wafer placement height H3: Maximum thickness (height) h: height P1~P4: Location S10~S30: Process V: Half of the length (width) X: Distance Y: Distance (Height) α: Angle β: Angle θ: angle

Claims

1. A transfer machine comprising: (a) an end effector configured to hold a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple layers without contacting the substrate; and (b) a substrate detector disposed at a specific relative position relative to the end effector and detached from the end effector, the substrate detector comprising: (b1) a light-emitting portion formed in the shape of a rod having a first end emitting reference light from a first optical fiber; (b2) a light-receiving portion formed in the shape of a rod having a second end substantially opposite to the first end, receiving the reference light reflected by the back or surface of the transparent corresponding substrate and guiding it to a second optical fiber; (b3) a plate extending from the light-emitting portion and the light-receiving portion, on the opposite side from the corresponding substrate, between the vicinity of the first end and the vicinity of the second end; and (b4) a wall disposed on the surface of the plate on the corresponding substrate side, preventing direct incidence of the reference light from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one state, namely, the state in which the holder is inserted and the state in which the corresponding substrate is held; the plate is arranged parallel to the corresponding substrate held by the end actuator, and the points of the first end and the second end furthest from the corresponding substrate are arranged on the same surface of the plate opposite to the corresponding substrate; the lower end of the portion of the substrate detector inserted between the substrates has a height above the lower end of the end actuator.

2. As in request item 1, the transfer machine, wherein, The light-projecting part and the light-receiving part are arranged in approximately parallel configurations, and the width of the plate is smaller than the distance between the central axis of the light-projecting part and the central axis of the light-receiving part.

3. As in request item 1, the transfer machine, wherein, The ends of the plate that are close to the first end and the second end respectively have a first conical surface and a second conical surface that taper toward the point furthest from the corresponding substrate at the first end and the second end respectively.

4. As in request item 1, the transfer machine, wherein, The height of the plate and the wall are the same as the outer diameter of the light-projecting part and the light-receiving part.

5. A transfer machine as requested in any of items 1 to 4, wherein, The end effector is provided in a plurality of such units in a direction perpendicular to the surface of the substrate being held, and the substrate detector is provided separately from the end effector for each of the end effectors.

6. The transfer machine as claimed in claim 5 further includes: a spacing variable mechanism configured to change the spacing of a plurality of the end effectors.

7. As in request item 5, the transfer machine, wherein, The substrate detector also includes a fixing component that fixes and holds the positions of the first end and the second end relative to the plate or the wall.

8. As in request item 5, the transfer machine, wherein, The first end has a first reflector that reflects the reference light from the first optical fiber in a direction orthogonal to the length direction of the light-emitting part. The second end has a second reflector that reflects and guides the reference light from the direction orthogonal to the length direction of the light-receiving part to the second optical fiber.

9. As in request item 8, the transfer machine, wherein, The light-emitting part has a first sheath and a first fixing part. The first sheath houses a portion of the first optical fiber and its first end. The first fixing part is connected to the first sheath and houses another portion of the first optical fiber, which has a larger diameter than the first sheath. The light-receiving part has a second sheath and a second fixing part. The second sheath houses a portion of the second optical fiber and its second end. The second fixing part is connected to the second sheath and houses another portion of the second optical fiber, which has a larger diameter than the second sheath.

10. As in request item 5, the transfer machine, wherein, The light-emitting part and the light-receiving part are arranged in a generally parallel manner. The length direction of the light-emitting part or the light-receiving part is generally consistent with the radial direction of the corresponding substrate. The light-emitting part has a first sheath and a first fixing part. The first sheath houses a portion of the first optical fiber and the first end. The first fixing part is connected to the first sheath and houses another portion of the first optical fiber. The first fixing part has a larger diameter than the first sheath. The light-receiving part has a second sheath and a second fixing part. The second sheath houses a portion of the second optical fiber and the second end. The second fixing part is connected to the second sheath and houses another portion of the second optical fiber. The second fixing part has a larger diameter than the second sheath.

11. A substrate processing apparatus comprising: (a) an end-effector configured to hold a corresponding substrate after being inserted into a holding member that houses a plurality of substrates in multiple layers without contacting the substrate; and (b) a substrate detector disposed at a specific relative position relative to the end-effector and separated from the end-effector, the substrate detector comprising: (b1) a light-emitting portion formed in the shape of a rod having a first end emitting reference light from a first optical fiber; (b2) a light-receiving portion formed in the shape of a rod having a second end substantially opposite to the first end, receiving the reference light reflected by the back or surface of the transparent corresponding substrate and guiding it to a second optical fiber; (b3) a plate extending from the light-emitting portion and the light-receiving portion, on the opposite side of the corresponding substrate, between the vicinity of the first end and the vicinity of the second end; and (b4) a wall disposed on the surface of the plate on the side of the corresponding substrate, which prevents the reference light from directly incident from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one state, namely, the state in which the holder is inserted and the state in which the corresponding substrate is held; the plate is arranged parallel to the corresponding substrate held by the end actuator, and the points of the first end and the second end furthest from the corresponding substrate are arranged on the same surface of the plate opposite to the corresponding substrate; the lower end of the portion of the substrate detector inserted between the substrates has a height above the lower end of the end actuator.

12. A substrate processing method, comprising: The process of transferring substrates using a transfer machine; The transfer machine, which performs the process of processing the substrate, comprises: (a) an end effector configured to hold a corresponding substrate after inserting a holding member that houses multiple substrates in a multilayer structure without contacting the substrate; and (b) a substrate detector disposed at a specific relative position relative to the end effector and separated from the end effector, the substrate detector comprising: (b1) a light-emitting portion formed in the shape of a rod having a first end emitting reference light from a first optical fiber; (b2) a light-receiving portion formed in the shape of a rod having a second end substantially opposite to the first end, receiving the reference light reflected by the back or surface of the transparent corresponding substrate and guiding it to a second optical fiber; and (b3) a plate, which, when viewed from the light-emitting portion and the light-receiving portion, is positioned relative to the corresponding substrate. The substrate extends from the vicinity of the first end to the vicinity of the second end on the opposite side of the substrate; and (b4) a wall is provided on the surface of the plate corresponding to the substrate side and prevents the reference light from directly incident from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one state, namely, the state in which the holder is inserted and the state in which the corresponding substrate is held. The plate is arranged parallel to the corresponding substrate held in the end actuation unit, and the points of the first end and the second end furthest from the corresponding substrate are arranged on the same surface of the plate opposite to the corresponding substrate. The lower end of the portion of the substrate detector inserted between the substrates has a height above the lower end of the end actuation unit.

13. The substrate processing method as described in claim 12, wherein, During the process of transporting the substrate, the output of the substrate detector is monitored to detect whether the substrate falls or deviates during transport.

14. A method for manufacturing a semiconductor device, comprising: The process of transferring substrates using a transfer machine; The transfer machine, which performs the process of processing the substrate, comprises: (a) an end effector configured to hold a corresponding substrate after inserting a holding member that houses multiple substrates in a multilayer structure without contacting the substrate; and (b) a substrate detector disposed at a specific relative position relative to the end effector and separated from the end effector, the substrate detector comprising: (b1) a light-emitting portion formed in the shape of a rod having a first end emitting reference light from a first optical fiber; (b2) a light-receiving portion formed in the shape of a rod having a second end substantially opposite to the first end, receiving the reference light reflected by the back or surface of the transparent corresponding substrate and guiding it to a second optical fiber; and (b3) a plate, which, when viewed from the light-emitting portion and the light-receiving portion, is positioned relative to the corresponding substrate. The substrate extends from the vicinity of the first end to the vicinity of the second end on the opposite side of the substrate; and (b4) a wall is provided on the surface of the plate corresponding to the substrate side and prevents the reference light from directly incident from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one state, namely, the state in which the holder is inserted and the state in which the corresponding substrate is held. The plate is arranged parallel to the corresponding substrate held in the end actuation unit, and the points of the first end and the second end furthest from the corresponding substrate are arranged on the same surface of the plate opposite to the corresponding substrate. The lower end of the portion of the substrate detector inserted between the substrates has a height above the lower end of the end actuation unit.

15. A substrate processing program, wherein a computer causes a substrate processing apparatus to perform the following steps: a step of transporting a substrate by a transfer machine; and a step of processing the substrate, the transfer machine comprising: (a) an end effector configured to hold a corresponding substrate after inserting into a holder that houses a plurality of substrates in multiple layers without contacting the substrate; and (b) a substrate detector disposed at a specific relative position relative to the end effector and separated from the end effector, the substrate detector comprising: (b1) a light-emitting portion formed in the shape of a rod having a first end emitting reference light from a first optical fiber; (b2) a light-receiving portion formed in the shape of a rod having a second end substantially opposite to the first end, receiving the reference light reflected by the back or surface of the transparent corresponding substrate and guiding it to a second optical fiber; and (b3) a plate, which, when viewed from the light-emitting portion and the light-receiving portion, is positioned relative to the corresponding substrate. The substrate detector extends from the vicinity of the first end to the vicinity of the second end on the opposite side of the substrate; and (b4) a wall is provided on the surface of the corresponding substrate side of the plate and prevents the reference light from directly incident from the first end to the second end. The substrate detector is configured to optically detect the corresponding substrate in at least one state, namely, the state in which the holder is inserted and the state in which the corresponding substrate is held. The plate is arranged parallel to the corresponding substrate held in the end actuation unit, and the points of the first end and the second end furthest from the corresponding substrate are arranged on the same surface of the plate on the side opposite to the corresponding substrate. The lower end of the portion of the substrate detector inserted between the substrates has a height above the lower end of the end actuation unit.

16. As in request item 1, the transfer machine, wherein, The opposite side of the corresponding substrate of this board is black.

17. As in request item 4, the transfer machine, wherein, The maximum thickness of the portion of the substrate detector inserted between the substrates is 0.5~2mm.

18. As in request item 1, the transfer machine, wherein, Small holes are provided on the sides of the first end and the second end to allow light to enter and exit through them.

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