Wiring devices

Abstract

The wiring device (2) includes: a substrate (50) on which electronic components are mounted; a cylindrical terminal (52) disposed on the substrate (50) for outputting DC power; and heat dissipation components (71, 72) configured to surround at least a portion of the terminal (52).

Description

Wiring device The present disclosure relates to a wiring device, and more particularly to a wiring device having a USB (Universal Serial Bus) terminal and supplying DC power. Conventionally, a USB socket is well-known as a wiring device for supplying DC power to electronic devices such as smartphones, tablet terminals, and notebook computers. Wiring devices such as USB sockets include a substrate on which electronic components are mounted and terminals for outputting DC power. The electronic components include a power conversion component for converting AC power into DC power and an output circuit component for outputting DC power from the terminals. Electronic components such as power conversion components generate heat during operation. Conventionally, the influence of this heat generation has not been a major problem. However, in recent years, the high output and miniaturization of wiring devices have advanced, and the heat generation density, which is defined as the output per unit volume, has increased significantly. With the increase in the heat generation density of the wiring device for supplying DC power, there is a strong demand for improving heat dissipation. For example, Japanese Patent Laid-Open Publication No. 2008-137444 discloses a heat dissipation structure that includes a heat transfer portion for transferring heat generated from electronic components mounted on a substrate to a heat dissipation portion. The heat dissipation structure disclosed in Japanese Patent Laid-Open Publication No. 2008-137444 includes a first heat transfer portion that transfers heat generated from the electronic components to the back side of the substrate, and a second heat transfer portion that extends from the back side of the substrate to the front side and transfers the heat transferred to the back side of the substrate to the heat dissipation portion through the periphery of the substrate. As a result of the inventors' study of this case, it became clear that as the heat generation density of the wiring device for supplying DC power increases, the temperature of the terminal for outputting DC power rises during the operation of the wiring device. It is speculated that this is due to the heat generation of the terminal itself and the heat transferred from heat generating components such as other electronic components. From the viewpoint of enabling the wiring device to operate normally, it is required to improve the heat dissipation of the terminal and reduce the temperature of the terminal. In the prior art including the heat dissipation structure disclosed in Japanese Patent Laid-Open Publication No. 2008-137444, the improvement of the heat dissipation of the terminal for outputting DC power has not been fully considered, and there is still a great deal of room for improvement. A wiring device according to an aspect of the present disclosure includes a substrate, a terminal, and a heat dissipation member. The substrate mounts electronic components; the terminal is cylindrical and is provided on the substrate to output DC power; the heat dissipation member is arranged to surround at least a part of the cylindrical outer peripheral surface of the terminal. According to the present disclosure, a wiring device with excellent heat dissipation of the terminal can be provided. [Specific embodiments] Hereinafter, with reference to the drawings, an example of an embodiment of the wiring device of the present disclosure will be described in detail. In addition, a form in which constituent elements of a plurality of embodiments and modification examples described below are selectively combined is included in the scope of the present disclosure. [First Embodiment] With reference to FIGS. 1 to 6, the wiring device 2 of the first embodiment will be described in detail. FIG. 1 is a perspective view of the socket 1 using the wiring device 2. As shown in FIG. 1, the socket 1 is a wiring device including two wiring devices 2 and one power socket device 3, and is provided on the wall 100 of a building. The socket 1 includes a frame-shaped decorative plate 4 formed with an opening 4a, and the front surfaces 2a, 3a of the wiring device 2 and the power socket device 3 are exposed from the opening 4a of the decorative plate 4. The decorative plate 4 is a rectangular frame-shaped plate when viewed from the front, and covers the construction hole formed in the wall 100, the mounting frame provided around the construction hole, etc. so that they cannot be seen. The socket 1 includes, for example, a frame-shaped metal plate fixed to the mounting frame. The decorative plate 4 is fixed to the metal plate, for example, by hooking claws formed on its back surface into the holes of the metal plate. The socket 1 is arranged in a state where the wiring device 2 and the power socket device 3 are inserted into the construction hole formed in the wall 100. On the front surface of the socket 1 arranged along the wall surface, only the front surfaces 2a, 3a of the wiring device 2 and the power socket device 3 are exposed from the opening 4a of the decorative plate 4. Details will be described later. The wiring device 2 includes a substrate on which electronic components are mounted and a cylindrical terminal 52 (see FIG. 4) that outputs DC power, and has a heat dissipation path for dissipating the heat of the terminal 52 to the inside of the device, the outside of the device, or both. In the example shown in FIG. 1, the socket 1 is arranged on the wall 100 such that two wiring devices 2 are arranged adjacent to each other, and the wiring device 2 and the power socket device 3 are arranged in the vertical direction. The two wiring devices 2 are arranged above the power socket device 3. In the socket having the wiring device 2, such an arrangement is not particularly limited. Also, the number of wiring devices 2 is not particularly limited. Furthermore, the socket 1 having the wiring device 2 may include a fiber optic socket, a LAN socket, a telephone line socket, etc. instead of the power socket device 3, or may only include the wiring device 2. In this specification, for convenience of explanation, terms indicating the front-back, up-down, and left-right directions are used for the socket 1, the wiring device 2, and each constituent element of the wiring device 2. The front-back direction refers to the direction in which the connector is plugged into and unplugged from the wiring device 2, and is the same as the axial direction of the cylindrical terminal 52 described later. The up-down direction is the direction along the vertical direction, and the left-right direction is the direction orthogonal to the up-down direction and the front-back direction. Also, left and right refer to the left and right when viewing the wiring device 2 from the front. An example of the wiring device 2 is a USB socket device. The USB socket device is a device that can connect to the USB connector 102, includes a power conversion component that converts AC power into DC power, and supplies the DC power to an electronic device 101 such as a smartphone. In FIG. 1, the USB connector 102 of the cable 103 extending from the electronic device 101 is connected to the wiring device 2. In the present embodiment, the wiring device 2 is described as a USB socket device. In addition, the power socket device 3 is a general socket device that outputs AC power of 100V or 200V. In front of the socket 1, the connection ports 2b of the two wiring devices 2 and the connection port 3b of the power socket device 3 are arranged in the vertical direction. The USB in this specification includes various generations (specifications of transmission speeds) of USB such as USB1.0, USB1.1, USB2.0, USB3.0, USB3.1, USB3.2, USB4, etc. Also, the terminal shape of the USB is not particularly limited, and any of A terminal, B terminal, C terminal, mini USB, micro USB, etc. can be used. Also, in the example shown in FIG. 1, the socket 1 including the wiring device 2 is provided on the wall 100, and the wiring device 2 can also be provided on furniture such as a table, shelf, counter, bed, etc., on a vehicle such as an automobile, an airplane, a railway vehicle, etc. FIG. 2 is a perspective view showing the appearance of the wiring device 2. FIG. 3 is an exploded perspective view of the wiring device 2. FIG. 4 is an exploded perspective view of the parts around the terminal 52 of the wiring device 2. As shown in FIGS. 2 and 3, the wiring device 2 includes a first housing 10, a second housing 20, and a third housing 30 as housings that form the external shape of the device. The wiring device 2 has an external shape that is approximately rectangular parallelepiped, and is formed such that the length in the vertical direction < the length in the left - right direction < the length in the front - rear direction. In addition, the size relationship of the lengths of the external shape of the wiring device 2 is not limited to this. The size relationship of the lengths of the external shape of the wiring device 2 can be appropriately set according to, for example, the shape and number of the terminals 52 included in the wiring device 2. The first housing 10 is fixed to the second housing 20 and the third housing 30 by a snap - fit structure 60. Thereby, the three housings are integrated to form an internal space that houses a substrate on which electronic components are mounted and the terminals 52. The snap - fit structure 60 is composed of a pair of fixing pieces 12 formed on the first housing 10, protrusions 21, 31 formed on the outer surfaces of the second housing 20 and the third housing 30 respectively, and the openings 13 of the fixing pieces 12 into which the protrusions are inserted. The second housing 20 and the third housing 30 are assembled along the vertical direction, and the first housing 10 is arranged to sandwich the front ends of the second housing 20 and the third housing 30 from both the left and right sides. Also, the ends (rear ends) of the second housing 20 and the third housing 30 on the side opposite to the first housing 10 are fixed to each other using screws (not shown in the figure). An opening, i.e., a connection port 2b, into which a USB connector 102 (refer to FIG. 1) can be inserted is formed in the first housing 10. The front surface 10a of the first housing 10 serves as the front surface 2a of the wiring device 2 of the socket 1. That is, the wiring device 2 is fixed to the mounting frame of the socket 1 such that the front surface 10a of the first housing 10 having the connection port 2b is exposed from the opening 4a of the decorative plate 4. In addition, the second housing 20 and the third housing 30 are disposed inside the wall 100 and are not disposed in a place where a user's hand can touch in a normal use state. The outer surfaces of the second housing 20 and the third housing 30 are exposed to the outside of the device inside the wall 100, and the heat conducted to the second housing 20 and the third housing 30 can be released from the outside. As shown in FIG. 3, the wiring device 2 includes a first substrate 40 on which electronic components including power conversion components for converting AC power into DC power are mounted, a second substrate 50 on which electronic components including output circuit components for outputting DC power are mounted, and a cylindrical terminal 52 for outputting DC power. The first substrate 40 has a printed circuit board 41 and electronic components including power conversion components disposed on the printed circuit board 41. The second substrate 50 has a printed circuit board 51 and electronic components including output circuit components disposed on the printed circuit board 51. The terminal 52 is a USB terminal and is disposed on the printed circuit board 51 of the second substrate 50. In the present embodiment, the first housing 10 surrounds the second substrate 50, and the second housing 20 and the third housing 30 surround the first substrate 40. In addition, a part of the first substrate 40 may extend into the first housing 10. Also, a part of the second substrate 50 may extend into the second housing 20 and the third housing 30. As shown in FIGS. 3 and 4, the wiring device 2 further includes heat dissipation members 71, 72 configured to surround at least a part of the cylindrical outer peripheral surface of the terminal 52. The heat dissipation members 71, 72 are each made of a metal plate material. The heat dissipation member 71 is disposed above the terminal 52, and the heat dissipation member 72 is disposed below the terminal 52. Also, as shown in FIG. 4, the heat dissipation member 71 has a first region 73 facing the upper surface 52a of the terminal 52 and a second region 74 substantially perpendicular to the first region 73. Also, the heat dissipation member 72 has a first region 75 facing the lower surface 52b of the terminal 52 and a second region 76 substantially perpendicular to the first region 75. Details will be described later. The heat of the terminal 52 is transferred to the second regions 74, 76 via the first regions 73, 75. The heat dissipation members 71 and 72 are fixed to the terminal 52 by being sandwiched therebetween in the vertical direction by a pair of fixing members 90. Also, in the present embodiment, the second regions 74 and 76 abut against the front surface 10a of the first housing 10. Thereby, a heat dissipation path is formed from the heat source, that is, the terminal 52, via the heat dissipation members 71 and 72 to the first housing 10. As the wiring device 2 has higher output and smaller size, the heat generation density of the device has increased significantly. By providing the heat dissipation members 71 and 72 configured to surround at least a part of the terminal 52, the heat dissipation performance of the terminal 52 can be improved. Also, as shown in FIG. 4, the wiring device 2 further includes heat transfer members 81 interposed between the upper surface 52a of the terminal 52 and the heat dissipation member 71, and heat transfer members 82 interposed between the lower surface 52b of the terminal 52 and the heat dissipation member 72. Details will be described later. The heat transfer members 81 and 82 are elastic bodies having a higher thermal conductivity than ordinary resins and being compressible. When the heat dissipation members 71 and 72 are sandwiched between the fixing members 90, the heat transfer members 81 and 82 are pressed in the vertical direction. Therefore, the heat transfer members 81 and 82 are compressed and strongly adhered to the surfaces of the terminal 52 and the heat dissipation members 71 and 72. As a result, heat conduction between the terminal 52 and the heat dissipation members 71 and 72 can be promoted, and the heat dissipation performance of the terminal 52 is further improved. Hereinafter, each component of the wiring device 2 will be described in detail with appropriate reference to FIGS. 3 to 6. FIG. 5 is a sectional view of the wiring device 2 in the front-rear direction, which is a sectional view taken along line AA in FIG. 2. Also, FIG. 6 is a sectional view of the wiring device 2 in the left-right direction, which is a sectional view taken along line BB in FIG. 2. In addition, FIGS. 5 and 6 are enlarged views showing the periphery of the terminal 52. Also, in FIG. 6, the region of the first region 75 where the heat dissipation member 72 is disposed is shown by a dashed line. [First Substrate] As shown in FIG. 3, the first substrate 40 is a printed wiring board including electronic components disposed on the printed board 41, and is disposed in the internal space surrounded by the second housing 20 and the third housing 30 such that the substrate surface is perpendicular to the vertical direction. The first substrate 40 includes a power supply circuit for converting the alternating current power supplied from the system power supply into direct current power and outputting it to the terminal 52 of the second substrate 50. The power supply circuit is constituted by electrically connecting power conversion components with wirings formed on the surface and inside of the printed board 41. A terminal (not shown in the figure) connected to the system power supply is provided on the first substrate 40. Also, an insertion hole (not shown in the figure) for a cable connected to the system power supply is formed in at least one of the second housing 20 and the third housing 30. The first substrate 40 includes semiconductor elements 42 (refer to FIG. 5), transformers 43, common-mode coils 44, electrolytic capacitors 45, etc. as generalized power conversion components constituting the power circuit. The semiconductor elements 42 include, for example, switching elements, diodes, transistors, etc. When the power circuit operates, at least a part of the power conversion components generates heat, especially the semiconductor elements 42 and the transformers 43 generate a large amount of heat. Therefore, the heat generated from the power conversion components such as the semiconductor elements 42 and the transformers 43 is easily transferred to the terminal 52 by radiation, convection, and heat conduction through the printed circuit board 41, etc. In this embodiment, the transformers 43, common-mode coils 44, and electrolytic capacitors 45 are arranged on the upper surface of the printed circuit board 41, and a plurality of semiconductor elements 42 are arranged on the lower surface of the printed circuit board 41. In addition, the arrangement of each electronic component is not limited to this. [Second Substrate] As shown in FIG. 3, the second substrate 50 is a printed wiring board including terminals 52 arranged on the printed circuit board 51, and is arranged in the internal space of the first housing 10. The second substrate 50 is electrically connected to the first substrate 40 and includes an output circuit for outputting the DC power converted by the power circuit of the first substrate 40 from the terminal 52. In this embodiment, the second substrate 50 is arranged perpendicular to the first substrate 40. The first substrate 40 and the second substrate 50 may also have protrusions and openings for inserting the protrusions, and are fixed to each other, for example. On the second substrate 50, electronic components such as terminals 52 and electrolytic capacitors (not shown in the figure) are arranged on the front surface of the printed circuit board 51. In this embodiment, the number of terminals 52 is one, and the number of terminals 52 is not particularly limited, and may also be two or more. The terminal 52 is arranged, for example, at the central portion of the front surface of the printed circuit board 51. The terminal 52 can be connected to the USB terminal of the USB connector 102. The terminal 52 has a flat surface, that is, an upper surface 52a and a lower surface 52b, and is integrally formed in a flat cylindrical shape. In addition, the shape and type of the USB terminal are not particularly limited. The terminal 52 is arranged in a state where the USB connector 102 can be inserted and removed through the connection port 2b formed in the first housing 10. Furthermore, the second substrate 50 may also arrange an insulating member (not shown in the figure) on at least a part of the front surface of the printed circuit board 51. The insulating member insulates the electronic components arranged on the printed circuit board 51 from other components such as the heat dissipation members 71 and 72. The insulating member can use an insulating sheet made of materials such as PET (polyethylene terephthalate) and polyimide, for example. [First housing] As shown in FIG. 3, the first housing 10 is a housing located at the power output side end of the terminal 52 and houses the second substrate 50. As described above, the front surface 10a of the first housing 10 having the connection port 2b serves as the front surface 2a of the wiring device 2 exposed to the front of the socket 1. The connection port 2b is a long hole extending in the left-right direction and is formed at the center in the left-right direction and the up-down direction on the front surface 10a of the first housing 10 facing the front of the wiring device 2. The first housing 10 is approximately rectangular when viewed from the front, and the length in the left-right direction is longer than the length in the up-down direction. The two end portions in the left-right direction of the first housing 10 are shaped such that they are recessed compared to the central portion in the left-right direction of the front surface 10a, and projections 11 that fit into the mounting frame of the socket 1 are formed in the recessed portions. The material of the first housing 10 can be appropriately changed according to the output current value, usage, operating environment, etc. of the wiring device 2. For example, when the output current value of the wiring device 2 is large and heat dissipation of the terminal 52 is emphasized, the first housing 10 can also be made of metal. As described above, when the second regions 74 and 76 of the heat dissipation members 71 and 72 abut against the front surface 10a of the first housing 10, the heat of the terminal 52 is transferred to the first housing 10 via the second regions 74 and 76. Therefore, by forming the first housing 10 of metal, the heat of the terminal 52 is further diffused to the first housing 10, and the temperature of the terminal 52 is reduced. As a result, failures of the wiring device 2 and the like can be suppressed. On the other hand, the front surface 10a of the first housing 10 is a part that can be touched by the user. Therefore, by forming the first housing 10 of resin, heat transfer from the terminal 52 and the first substrate 40 to the first housing 10 can be suppressed. As a result, the temperature of the first housing 10 is reduced and safety is improved. The resin constituting the first housing 10 is not particularly limited, and examples include urea resin, melamine resin, and ABS resin. Also, the first housing 10 can also be composed of two or more members. For example, the first housing 10 can also be composed of a first member that forms the front surface 2a of the wiring device 2 and a second member that connects the first member and forms the internal space for housing the second substrate 50. Also, when the second member is a resin member with excellent heat insulation properties, the first member can also be a metal member. Alternatively, the second member can be a metal member and the first member can be a resin member. The first housing 10 has fixing pieces 12 that constitute the snap structure 60. The fixing pieces 12 are plate-like portions extending rearward from the left and right end portions of the first housing 10, and one is formed at each of the left and right end portions. The left and right fixing pieces 12 have the same shape and the same size and are formed to sandwich the second housing 20 and the third housing 30 from the left and right. The fixing pieces 12 abut against the outer surfaces of the second housing 20 and the third housing 30 and press the outer surfaces from the left and right using the elasticity of the material. Two openings 13 are formed in each fixing piece 12 for the projections 21 and 31 on the outer surface to be respectively fitted into. [Second Housing and Third Housing] As shown in FIG. 3, the second housing 20 and the third housing 30 are housings that accommodate and mount the first substrate 40 including electronic components such as power conversion components, and different from the first housing 10, they are not exposed to the front of the socket 1. The second housing 20 and the third housing 30 may also be made of resin, and preferably made of metal. In order to dissipate the heat conducted from the heat source to the outside of the device with good efficiency, the second housing 20 and the third housing 30 should preferably be made of a metal material with high thermal conductivity. The metal constituting the second housing 20 and the third housing 30 is not particularly limited, and from the viewpoints of thermal conductivity, light weight, workability, etc., aluminum or an aluminum alloy is preferred. The second housing 20 and the third housing 30 are formed into a bottomed cylindrical shape by being arranged opposite to each other and assembled in the vertical direction to sandwich the first substrate 40. [Heat Dissipation Members] As shown in FIGS. 4 to 6, the heat dissipation members 71, 72 are arranged to surround at least a part of the cylindrical outer peripheral surface of the terminal 52. More specifically, the heat dissipation member 71 is arranged above the terminal 52 and is arranged to surround a part of the upper surface 52a of the terminal 52. Also, the heat dissipation member 72 is arranged below the terminal 52 and is arranged to surround a part of the lower surface 52b of the terminal 52. The heat dissipation members 71, 72 have the function of diffusing the heat of the terminal 52 to the inside or the outside of the device, or both. In this embodiment, the heat dissipation members 71, 72 are each composed of a single sheet of plate material and have the same shape. The heat dissipation members 71, 72 are fixed to the terminal 52 by being sandwiched between a pair of fixing members 90 in the vertical direction by the first regions 73, 75. In addition, from the viewpoint of improving the heat dissipation performance of the terminal 52, the heat dissipation members 71, 72 should preferably be arranged on both sides of the terminal 52, or may be arranged on only one side of the terminal 52. In order to dissipate the heat of the terminal 52 with good efficiency, the heat dissipation members 71, 72 are made of a metal material with high thermal conductivity. The metal constituting the heat dissipation members 71, 72 is not particularly limited, and from the viewpoints of thermal conductivity, light weight, workability, etc., copper, a copper alloy, aluminum or an aluminum alloy is preferred. The heat dissipation members 71, 72 have first regions 73, 75 facing the surface of the terminal 52, and second regions 74, 76 connected to the first regions 73, 75 and extending in a direction away from the terminal 52. That is, the first region 73 faces the upper surface 52a of the terminal 52, and the first region 75 faces the lower surface 52b of the terminal 52. Also, in this embodiment, the second regions 74, 76 are configured to be approximately perpendicular to the first regions 73, 75. The first regions 73 and 75 have the function of transferring the heat of the terminal 52 to the second regions 74 and 76. The first regions 73 and 75 are regions that are bent from one end in the vertical direction of the second regions 74 and 76 toward the rear side (the side of the second substrate 50) and extend, facing the surface of the terminal 52. The first regions 73 and 75 can also be formed by bending one end in the vertical direction of the second regions 74 and 76 toward the rear side over the entire width in the left-right direction. In the present embodiment, the first regions 73 and 75 are formed by bending one end in the vertical direction of the second regions 74 and 76 toward the rear side in a part of the left-right direction. That is, the length of the first regions 73 and 75 in the left-right direction is smaller than the length of the second regions 74 and 76 in the left-right direction. The first regions 73 and 75 are fixed so as not to move in the left-right direction by being inserted into the opening 93 and the recess 94 provided in a fixing member 90 described later. Further, the end portions (rear end portions) on the side of the second substrate 50 of the first regions 73 and 75 abut against a step 95 provided in the fixing member 90 described later. Thereby, movement of the first regions 73 and 75 toward the rear side can be suppressed. The length of the first regions 73 and 75 in the left-right direction may also be different in the front-rear direction. In the present embodiment, it is constant in the front-rear direction. Also, it is preferable that the length of the first regions 73 and 75 in the left-right direction is equal to or greater than the length of the upper surface 52a and the lower surface 52b of the terminal 52 in the left-right direction. At this time, the area of the first regions 73 and 75 facing the surface of the terminal 52 can be sufficiently ensured. As a result, heat conduction between the terminal 52 and the heat dissipation members 71 and 72 is promoted, and the heat dissipation property of the terminal 52 is further improved. It is preferable that the length of the first regions 73 and 75 in the front-rear direction is 20% or more of the length of the upper surface 52a and the lower surface 52b of the terminal 52 in the front-rear direction, more preferably 40%, and even more preferably 60% or more. At this time, the area of the first regions 73 and 75 facing the surface of the terminal 52 can be sufficiently ensured, and the heat dissipation property of the terminal 52 is further improved. On the other hand, when the length of the first regions 73 and 75 in the front-rear direction is too long, the first regions 73 and 75 may contact the second substrate 50, and there is a possibility of short circuit or the like. Therefore, it is preferable that the length of the first regions 73 and 75 in the front-rear direction is 90% or less of the length of the upper surface 52a and the lower surface 52b of the terminal 52 in the front-rear direction. Therefore, an example of the suitable range of the length of the first regions 73 and 75 in the front-rear direction is 20% or more and 90% or less of the length of the upper surface 52a and the lower surface 52b of the terminal 52 in the front-rear direction, more preferably 40% or more and 90% or less, and even more preferably 60% or more and 90% or less. In the present embodiment, the thickness of the first regions 73 and 75 is approximately uniform in the plane. The thickness of the first regions 73 and 75 can be appropriately changed according to the size of the terminal 52, the output current value of the terminal 52, etc. The thickness of the first regions 73 and 75 is, for example, 0.3 mm or more and 3 mm or less. As described above, the second regions 74 and 76 are approximately perpendicular to the first regions 73 and 75 and are regions that do not face the surface of the terminal 52. The second regions 74 and 76 have the function of dissipating the heat transmitted from the surface of the terminal 52 to the first regions 73 and 75 to the inside or outside of the device, or both. Therefore, the larger the area of the second regions 74 and 76, the greater the contact area between the second regions 74 and 76 and the air inside the first housing 10 or the first housing 10, and the more the heat dissipation through the second regions 74 and 76 is promoted. From the viewpoint of improving the heat dissipation performance of the terminal 52, the area of the second regions 74 and 76 is preferably 100% or more of the area of the upper surface 52a or the lower surface 52b of the terminal 52, more preferably 120% or more, and still more preferably 150% or more. The second regions 74 and 76 each include protruding regions 77 and 78 that protrude toward the center in the vertical direction more than the first regions 73 and 75 in the vertical direction. The protruding regions 77 and 78 are respectively arranged on both sides in the left-right direction of the second regions 74 and 76. By providing the protruding regions 77 and 78, the area of the second regions 74 and 76 is increased. As a result, the heat dissipation through the second regions 74 and 76 is further promoted, and the heat dissipation performance of the terminal 52 is further improved. As shown in FIG. 6, the second regions 74 and 76 are preferably provided at positions away from the axial center portion of the terminal 52, that is, on the front side (the front surface 10a side of the first housing 10) of the axial center portion of the terminal 52, in a cross section parallel to the axial direction (front-rear direction) of the terminal 52. Inside the first housing 10, the temperature of the air on the front side away from the second substrate 50 on which the heat-generating electronic components are mounted is lower than the temperature of the air on the rear side (the second substrate 50 side). Therefore, by providing the second regions 74 and 76 on the front side of the axial center portion of the terminal 52, the heat dissipation through the second regions 74 and 76 can be promoted, and the heat dissipation performance of the terminal 52 is further improved. Further, when the second regions 74 and 76 are provided on the rear side of the axial center portion of the terminal 52, the heat of the electronic components included in the second substrate 50 is transmitted to the second regions 74 and 76, and there is a case where the temperature of the terminal 52 increases instead. Therefore, by providing the second regions 74 and 76 on the front side of the axial center portion of the terminal 52, the heat of the electronic components included in the second substrate 50 can be suppressed from being transmitted to the terminal 52 through the second regions 74 and 76. In the present embodiment, as described above, the front surfaces of the second regions 74 and 76 abut against the front surface 10a of the first housing 10. Thereby, the heat of the terminal 52 is dissipated to the outside of the device through the heat dissipation members 71 and 72 and the front surface 10a of the first housing 10. In addition, the front surfaces of the second regions 74 and 76 (the surfaces on the side of the front surface 10a of the first housing 10) may not be in contact with the front surface 10a of the first housing 10. At this time, the heat of the terminal 52 is dissipated to the air inside the first housing 10 through the heat dissipation members 71 and 72. Also, since heat transfer to the first housing 10 can be suppressed when the second regions 74 and 76 are not in contact with the front surface 10a of the first housing 10, the temperature of the front surface 10a of the first housing 10 is reduced. The rear surfaces of the second regions 74 and 76 (the surfaces on the side of the second substrate 50) are in contact with a fixing member 90 described later. That is, the second regions 74 and 76 of the present embodiment are sandwiched between the front surface 10a of the first housing 10 and the fixing member 90. Thereby, the heat dissipation members 71 and 72 can be suppressed from shifting in the front-rear direction. In addition, a heat-resistant and adhesive sheet or the like may be inserted between the second regions 74 and 76 and the fixing member 90. The vertical length of the second regions 74 and 76 is not particularly limited as long as the area of the second regions 74 and 76 can be sufficiently ensured. In the present embodiment, the vertical length of the second regions 74 and 76 is approximately the same as the vertical length of the fixing member 90. Therefore, in the vertical direction, the position of the upper end of the second region 74 is approximately the same as the position of the upper end of the fixing member 90, and the position of the lower end of the second region 76 is approximately the same as the position of the lower end of the fixing member 90. In addition, the vertical length of the second regions 74 and 76 may be greater than the vertical length of the fixing member 90. For example, the second regions 74 and 76 may be in contact with the upper surface or the lower surface of the first housing 10, respectively. At this time, a heat dissipation path is formed from the terminal 52 to the outside of the device through the heat dissipation members 71 and 72 and the upper surface or the lower surface of the first housing 10. Also, the horizontal length of the second regions 74 and 76 is preferably 140% or more of the front-rear length of the terminal 52, more preferably 170% or more, and still more preferably 200% or more. At this time, the area of the second regions 74 and 76 increases, and heat dissipation through the second regions 74 and 76 is promoted. In the present embodiment, the horizontal length of the second regions 74 and 76 is approximately the same as the horizontal length of the fixing member 90, and may also be greater than the horizontal length of the fixing member 90. For example, the second regions 74 and 76 may be in contact with the right surface or the left surface of the first housing 10. At this time, a heat dissipation path is formed from the terminal 52 to the outside of the device through the heat dissipation members 71 and 72 and the right surface or the left surface of the first housing 10. [Heat Transfer Members] As shown in Fig. 4, heat transfer members 81 and 82 are interposed between the surface of terminal 52 and heat dissipation members 71 and 72. More specifically, heat transfer member 81 is interposed between the upper surface 52a of terminal 52 and heat dissipation member 71, and heat transfer member 82 is interposed between the lower surface 52b of terminal 52 and heat dissipation member 72. Heat transfer members 81 and 82 promote heat conduction between terminal 52 and heat dissipation members 71 and 72, contributing to the improvement of the heat dissipation performance of terminal 52. In addition, from the viewpoint of improving the heat dissipation performance of terminal 52, heat transfer members 81 and 82 are preferably arranged on both sides of terminal 52, or may be arranged on only one side of terminal 52. When heat dissipation members 71 and 72 are clamped between a pair of fixing members 90, heat transfer members 81 and 82 are pressed in the vertical direction by heat dissipation members 71 and 72 and fixing members 90. Thereby, heat transfer members 81 and 82 are fixed to terminal 52 and heat dissipation members 71 and 72. Also, heat transfer members 81 and 82 are inserted into the opening 93 provided in the fixing member 90 described later. The size of heat transfer members 81 and 82 is preferably such that it covers the entire area facing the first regions 73 and 75 of the surface of terminal 52 and heat dissipation members 71 and 72. Thereby, heat conduction between terminal 52 and heat dissipation members 71 and 72 can be further promoted, and the heat dissipation performance of terminal 52 is further improved. In the present embodiment, the length of heat transfer members 81 and 82 in the left-right direction is designed to be one circumference larger than the length of the upper surface 52a and the lower surface 52b of terminal 52 in the left-right direction. Also, heat transfer members 81 and 82 extend to the rear side of the first regions 73 and 75. That is, heat transfer members 81 and 82 have regions in contact with the fixing member 90 in addition to the regions in contact with the first regions 73 and 75. Heat transfer members 81 and 82 are preferably made of an elastomer with a higher thermal conductivity than ordinary resin and compressibility. An example of a suitable heat transfer member 81 and 82 is a sheet composed of a flexible resin and a heat conductive filler dispersed in the resin. The thickness of heat transfer members 81 and 82 is, for example, 0.3 mm or more and 2 mm or less. The thickness and size of heat transfer members 81 and 82 can be appropriately changed according to the size of terminal 52 and the output current value of terminal 52, etc. Also, heat transfer members 81 and 82 may have adhesiveness and may be attached to the surface of terminal 52 or the surface of heat dissipation members 71 and 72. At this time, heat transfer members 81 and 82 are easily arranged. Alternatively, an adhesive, an adhesive tape, etc. may also be used to attach heat transfer members 81 and 82 to the surface of terminal 52 or the surface of heat dissipation members 71 and 72. The resin constituting the heat transfer members 81 and 82 only needs to be a material with flexibility that can be elastically deformed. Examples include silicone resin, acrylic resin, ethyl ester resin, epoxy resin, etc. The heat conductive filler dispersed in the resin is preferably a filler with insulation and high thermal conductivity. Examples include alumina, aluminum nitride, boron nitride, etc. In addition, the heat transfer members 81 and 82 can be applied to the components well-known in the past. The heat transfer members 81 and 82 are preferably arranged in a state of being compressed in the vertical direction. At this time, they are strongly adhered to the surface of the terminal 52 and the heat dissipation members 71 and 72. As a result, the heat conduction between the terminal 52 and the heat dissipation members 71 and 72 can be promoted, and the heat dissipation performance of the terminal 52 is further improved. In other words, when the heat transfer members 81 and 82 are not arranged, or when the heat transfer members 81 and 82 are arranged in a state of not being compressed in the vertical direction, it is easy to generate a gap between the surface of the terminal 52 and the heat dissipation members 71 and 72. The compression degree (compression rate) of the heat transfer members 81 and 82 is not particularly limited, preferably 10% or more, more preferably 20% or more, and still more preferably 30% or more. The compression rate is calculated by the formula [(thickness in the non-compressed state - thickness in the compressed state) × 100 / thickness in the non-compressed state]. The upper limit of the compression rate is, for example, 90%. In addition, the compression rates of the heat transfer members 81 and 82 can also be different within the plane. For example, the compression rate on the front side (the front surface 10a side of the first housing 10) pressed by the heat dissipation members 71 and 72 can be greater than the compression rate on the rear side (the second substrate 50 side) pressed by the fixing member 90. [Fixing Member] As shown in FIG. 4, the fixing member 90 is respectively arranged on the upper side and the lower side of the terminal 52, and is a member that fixes the heat dissipation members 71 and 72 and the heat transfer members 81 and 82 by sandwiching them from the vertical direction. Screw holes 91 are provided on the left and right sides of the fixing member 90. Also, by inserting the screw 92 through the screw hole 91, the fixing member 90 can be fixed in the vertical direction. In addition, the number of the screw holes 91 provided on the fixing member 90 can be appropriately changed according to the size of the fixing member 90. Moreover, the fixing member 90 can also be fixed in the vertical direction by using an adhesive, an adhesive tape, etc. The fixing member 90 can also be made of metal, and is preferably made of resin. By constituting the fixing member 90 with a resin material, short circuits and the like caused by the contact between the fixing member 90 and the second substrate 50 can be suppressed. The resin constituting the fixing member 90 is not particularly limited. Examples include urea resin, melamine resin, ABS resin, etc. An opening 93 extending in the front-rear direction is provided on the surface of the fixing member 90 on the central side in the vertical direction. Also, recesses 94 recessed outward in the left and right directions are provided on the left and right sides on the front side of the opening 93. Furthermore, a step 95 for the end portions (rear end portions) on the second substrate 50 side of the first regions 73 and 75 to abut against is provided on the rear side of the opening 93. The first regions 73 and 75 of the heat dissipation members 71 and 72 and the heat transfer members 81 and 82 are respectively arranged at the opening 93. More specifically, the first regions 73 and 75 and the heat transfer members 81 and 82 are respectively arranged in a stacked state on the front side of the opening 93, that is, in the region without the step 95. Also, only the heat transfer members 81 and 82 are arranged on the rear side of the opening 93, that is, in the region with the step 95. By changing the depth (vertical length) of the opening 93, the compression rate of the heat transfer members 81 and 82 can be changed. The depth of the opening 93 is approximately the same as the sum of the thicknesses of the first regions 73 and 75 and the heat transfer members 81 and 82 in the compressed state on the front side. Also, the depth of the opening 93 is approximately the same as the thickness of the heat transfer members 81 and 82 in the compressed state on the rear side. Furthermore, the lateral length of the opening 93 is approximately the same as the lateral length of the heat transfer members 81 and 82. Thereby, the opening 93 functions as a guide for restricting the positions of the heat transfer members 81 and 82. The recesses 94 are respectively provided on the left and right sides of the opening 93 and insert the first regions 73 and 75. The vertical length of the recesses 94 is approximately the same as the thickness of the first regions 73 and 75. Thereby, the first regions 73 and 75 are fixed so as not to move in the vertical direction. Also, the front-rear length of the recesses 94 is approximately the same as the front-rear length of the first regions 73 and 75. [Second Embodiment] While referring to FIG. 7, the wiring device 2A of the second embodiment will be described. FIG. 7 is a perspective view of the wiring device 2A and shows a state in which the first housing 10 is removed. Hereinafter, for the structures common to the first embodiment, the same reference numerals will be used and repeated descriptions will be omitted, and mainly the differences from the first embodiment will be described. As shown in FIG. 7, the shapes of the heat dissipation members 71 and 72 of the wiring device 2A are different from those of the wiring device 2 of the first embodiment. More specifically, the heat dissipation members 71 and 72 of the second embodiment have the first regions 73 and 75 facing the surface of the terminal, the second regions 74 and 76 substantially perpendicular to the first regions 73 and 75, and the third regions 79 and 80 covering a part of the outer surface in the vertical direction of the fixing member 90. In addition, the shapes of the first regions 73 and 75 of the second embodiment are the same as the shapes of the first regions 73 and 75 of the first embodiment. As shown in FIG. 7, the second regions 74 and 76 of the second embodiment are configured to cover not only the front side (the front surface 10a side of the first housing 10) of the fixing member 90 but also a part of the right and left sides of the fixing member 90. Therefore, the area of the second regions 74 and 76 can be increased, and heat dissipation through the second regions 74 and 76 can be promoted. As a result, the heat dissipation performance of the terminal 52 can be further improved. Further, as described above, the heat dissipation members 71 and 72 have third regions 79 and 80 that cover a part of the surfaces on the outer sides in the vertical direction of the fixing member 90. Thereby, in addition to passing through the second regions 74 and 76, the heat of the terminal 52 is also dissipated to the air inside the first housing 10 via the third regions 79 and 80. Thereby, the heat dissipation performance of the terminal 52 can be further improved. In addition, the length of the third regions 79 and 80 in the front-rear direction is approximately the same as the length of the first regions 73 and 75 in the front-rear direction, for example. Also, when using the heat dissipation members 71 and 72 of the second embodiment, it is preferable to provide an insulating member (not shown in the figure) that insulates the electronic components disposed on the printed circuit board 51 from the heat dissipation members 71 and 72 on the printed circuit board 51. [Third Embodiment] While referring to FIG. 8, the wiring device 2B of the third embodiment will be described. FIG. 8 is a perspective view of the wiring device 2B, showing a state in which the first housing 10 is removed. Hereinafter, for the structures common to the first and second embodiments, the same reference numerals will be used and repeated descriptions will be omitted, and the differences from the first and second embodiments will be mainly described. As shown in FIG. 8, the wiring device 2B is different from the wiring devices 2 and 2A of the first and second embodiments in that it includes a block-shaped heat dissipation member 110. Also, the wiring device 2B is different from the wiring devices 2 and 2A of the first and second embodiments in that it does not include a fixing member 90. As described above, the heat dissipation member 110 of the third embodiment is block-shaped and has a through hole 111 that extends in the front-rear direction at the central portions in the left-right direction and the up-down direction. The terminal 52 is inserted into the through hole 111. Thereby, the heat dissipation member 110 is held by the terminal 52. Since the heat dissipation member 110 of the third embodiment is block-shaped, its volume is larger than that of the heat dissipation members 71 and 72 of the first and second embodiments. Therefore, the heat dissipation member 110 absorbs more heat of the terminal 52. As a result, the heat dissipation performance of the terminal 52 is further improved. In addition, when using the heat dissipation member 110 of the third embodiment, similar to when using the heat dissipation members 71 and 72 of the second embodiment, it is preferable to provide an insulating member (not shown in the figure) that insulates the electronic components disposed on the printed circuit board 51 from the heat dissipation members 71 and 72 over the entire surface of the printed circuit board 51. In addition, the above-described embodiments can be appropriately designed and changed within the scope that does not impair the purpose of the present disclosure. For example, in the above-described first, second, and third embodiments, the second housing 20 and the third housing 30 separated in the up-down direction are assembled in the up-down direction to form the housing of the wiring device 2, but it is not limited thereto. For example, the housing of the wiring device 2 can also be formed by assembling the second housing 20 and the third housing 30 separated in the left-right direction in the left-right direction. Also, the housing of the wiring device 2 can also be formed by assembling the second housing 20 having a rectangular tube shape and the third housing 30 that closes the rear end opening of the second housing 20 in the front-rear direction. Further, in the above-described first and second embodiments, the heat dissipation members 71 and 72 are arranged such that the first regions 73 and 75 face the upper surface 52a and the lower surface 52b of the terminal 52, or may be arranged to face the right side surface and the left side surface of the terminal 52. At this time, the heat dissipation members 71 and 72 are fixed to the terminal 52 by being sandwiched therebetween by a pair of fixing members 90 in the left-right direction. Further, when the first regions 73 and 75 are arranged to face the right side surface and the left side surface of the terminal 52, from the viewpoint of improving the heat dissipation property of the terminal 52, the right side surface and the left side surface of the terminal 52 are preferably flat surfaces. The present disclosure will be further described with the following embodiments. Structure 1: A wiring device includes: a substrate on which electronic components are mounted; a terminal in a cylindrical shape provided on the substrate for outputting DC power; a heat dissipation member arranged to surround at least a part of the cylindrical outer peripheral surface of the terminal. Structure 2: The wiring device according to Structure 1 further includes: a pair of fixing members for sandwiching the terminal and the heat dissipation member therebetween. Structure 3: The wiring device according to Structure 1 or Structure 2 further includes: a heat transfer member interposed between the terminal and the heat dissipation member; the heat transfer member is arranged in a state of being compressed by the terminal and the heat dissipation member. Structure 4: The wiring device according to any one of Structures 1 to 3, wherein the heat dissipation member has: a first region facing the surface of the terminal; a second region continuous with the first region and extending in a direction away from the terminal. Structure 5: The wiring device according to Structure 4, wherein in a cross section parallel to the axial direction of the terminal, the second region is provided at a position farther from the substrate than the axial center portion of the terminal. Structure 6: The wiring device according to any one of Structures 1 to 5 further includes: a housing for housing the substrate and the terminal; the heat dissipation member abuts against the housing. Structure 7: The wiring device according to any one of Structures 1 to 6, wherein the heat dissipation member is made of metal. Structure 8: The wiring device according to any one of Structures 1 to 7, wherein an insulating member is arranged on at least a part of the surface of the substrate on the side where the terminal is provided. 1: Socket 2: Wiring device 2A: Wiring device 2B: Wiring device 2a: Front surface 2b: Connection port 3: Power socket device 3a: Front surface 3b: Connection port 4: Decorative plate 4a: Opening 10: First housing 10a: Front surface 11: Protrusion 12: Fixed piece 13: Opening 20: Second housing 21: Protrusion 30: Third housing 31: Protrusion 40: First substrate 41: Printed circuit board 42: Semiconductor element 43: Transformer 44 Common mode coil: 45: Electrolytic capacitor 50: Second substrate 51: Printed circuit board 52: Terminal 52a: Upper surface 52b: Lower surface 60: Snap structure 71: Heat dissipation member 72: Heat dissipation member 73: First region 74: Second region 75: First region 76: Second region 77: Protruding region 78: Protruding region 79: Third region 80: Third region 81: Heat transfer member 82: Heat transfer member 90: Fixing member 91: Screw hole 92: Screw 93: Opening 94: Recess 95: Step 100: Wall 101: Electronic appliance 102: USB connector 110: Heat dissipation member 111: Through hole FIG. 1 is a perspective view of a socket using the wiring device of the first embodiment. FIG. 2 is a perspective view showing the appearance of the wiring device of the first embodiment. FIG. 3 is an exploded perspective view of the wiring device of the first embodiment. FIG. 4 is an exploded perspective view of the parts around the terminal of the wiring device of the first embodiment. FIG. 5 is a sectional view taken along line AA in FIG. 2, which is an enlarged view of the periphery of the terminal. FIG. 6 is a sectional view taken along line BB in FIG. 2, which is an enlarged view of the periphery of the terminal. FIG. 7 is a perspective view showing the appearance of the wiring device of the second embodiment, which is an enlarged view of the periphery of the terminal. FIG. 8 is a perspective view showing the appearance of the wiring device of the third embodiment, which is an enlarged view of the periphery of the terminal. 50: Second substrate 51: Printed circuit board 52: Terminal 52a: Upper surface 52b: Lower surface 71: Heat dissipation member 72: Heat dissipation member 73: First region 74: Second region 75: First region 76: Second region 77: Protruding region 78: Protruding region 81: Heat transfer member 82: Heat transfer member 90: Fixing member 91: Screw hole 92: Screw 93: Opening 94: Recess 95: Difference

Claims

1. A wiring device comprising: a substrate on which electronic components are mounted; a terminal, cylindrical in shape, disposed on the substrate and outputting direct current power; a plurality of heat dissipation members configured to surround at least a portion of the cylindrical outer peripheral surface of the terminal; the terminal having a flat surface, i.e., a top surface and a bottom surface; the plurality of heat dissipation members comprising: a first heat dissipation member facing at least a portion of the top surface; and a second heat dissipation member facing at least a portion of the bottom surface.

2. The wiring device of claim 1 further comprises: a pair of fixing members that clamp the terminal and the heat dissipation member therebetween.

3. The wiring device of claim 1 further comprises: a heat transfer member located between the terminal and the heat dissipation member; the heat transfer member is configured in a state of being compressed by the terminal and the heat dissipation member.

4. Wiring equipment as requested in item 1, wherein, The heat dissipation component has: a first region facing the surface of the terminal; and a second region continuous with the first region and extending in a direction away from the terminal.

5. Wiring equipment as requested in item 4, wherein, In a cross-section parallel to the axial direction of the terminal, the second region is located at a position further away from the substrate than the axial center of the terminal.

6. The wiring device of claim 1 further comprises: a housing that houses the substrate and the terminal; and a heat dissipation member that abuts against the housing.

7. Wiring equipment as requested in item 1, wherein, The heat dissipation component is made of metal.

8. Wiring equipment as requested in item 1, wherein, An insulating member is disposed on at least a portion of the side of the substrate on which the terminal is located.

9. Wiring equipment as requested in item 4, wherein, The second region is constructed to be perpendicular to the first region and extends in the vertical direction.

Images