Heat transfer structure and heat transfer system and method of forming the same

Abstract

This disclosure describes a heat conduction system for multi-region shock cooling of a semiconductor device. The heat conduction system includes a first die and a second die located on a substrate, a heat conduction structure, and a controller. The heat conduction structure includes a first compartment disposed above the first die, a second compartment disposed above the second die and spaced apart from the first compartment, a first inlet pipe connected to the first compartment and configured to supply a first liquid coolant to the first compartment, and a second inlet pipe connected to the second compartment and configured to supply a second liquid coolant to the second compartment. The controller is configured to control a first flow rate of the first liquid coolant based on the temperature of the first die and to control a second flow rate of the second liquid coolant based on the temperature of the second die.

Description

Heat conduction structure, heat conduction system and forming method thereof Embodiments of the present invention relate to semiconductor technology, and more particularly to a heat conduction structure, a heat conduction system, and a method for forming the same. As semiconductor technology advances, the demand for higher storage capacity, faster processing systems, higher performance, and lower costs continues to increase. To meet these demands, the semiconductor industry continues to shrink the size of semiconductor devices, such as metal oxide semiconductor field effect transistors (MOSFETs), including planar MOSFETs, fin field effect transistors (FinFETs), gate-all-around field effect transistors (GAAFETs), complementary field effect transistors (CFETs), nanosheet transistors, nanowire transistors, multi-bridge channel transistors, nanoribbon transistors, and other transistors with similar structures. Furthermore, multiple dies can be packaged on a substrate to improve device performance. This miniaturization increases the complexity of semiconductor manufacturing and packaging processes, and also makes semiconductor device testing more difficult. In some embodiments, a heat transfer system includes a first die and a second die positioned on a substrate, a heat transfer structure, and a controller. The heat transfer structure includes a first compartment disposed above the first die, a second compartment disposed above the second die and separated from the first compartment, a first inlet pipe connected to the first compartment and configured to supply a first liquid coolant to the first compartment, and a second inlet pipe connected to the second compartment and configured to supply a second liquid coolant to the second compartment. The controller is configured to control a first flow rate of the first liquid coolant based on a temperature of the first die and a second flow rate of the second liquid coolant based on a temperature of the second die. In other embodiments, the heat-conducting structure includes a first compartment disposed above a first die, a first inlet tube connected to the first compartment and configured to supply a first liquid coolant to the first compartment, a second compartment disposed above a second die and separated from the first compartment, and a second inlet tube connected to the second compartment and configured to supply a second liquid coolant to the second compartment. In yet other embodiments, a method for forming a heat-conducting structure system includes placing a heat-conducting structure on a substrate. The substrate includes a first die and a second die. The heat-conducting structure includes a first compartment located above the first die and a second compartment located above the second die. The method further includes obtaining a first temperature of the first die, cooling the first die in the first compartment with a first liquid coolant at a first flow rate based on the first temperature, obtaining a second temperature of the second die, and cooling the first die in the second compartment with a second liquid coolant at a second flow rate based on the second temperature. The second flow rate is different from the first flow rate. The following disclosure provides many embodiments or examples for implementing different elements of the subject matter provided. Specific examples of each element and its configuration are described below to simplify the description of the embodiments of the present invention. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. For example, if the description refers to a first element formed on a second element, it may include an embodiment in which the first and second elements are in direct contact, and it may also include an embodiment in which an additional element is formed between the first and second elements so that they are not in direct contact. In addition, the embodiments of the present invention may repeat reference numbers and / or letters in various examples. Such repetition is for the purpose of simplicity and clarity, and is not intended to indicate the relationship between the different embodiments and / or configurations discussed. Furthermore, spatially relative terms such as "below," "beneath," "lower," "above," "upper," and similar terms may be used to facilitate describing the relationship between one component or parts and another component or parts in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation, as well as the orientations depicted in the drawings. When the device is rotated 90 degrees or otherwise, the spatially relative adjectives used herein will be interpreted based on the resulting orientation. It should be noted that terms such as "one embodiment," "one implementation," "an exemplary embodiment," and "exemplary" mentioned in the specification indicate that the described embodiment may include specific components, structures, or characteristics, but not every embodiment necessarily includes the specific components, structures, or characteristics. In addition, these terms do not necessarily refer to the same embodiment. In addition, it should be understood by those with ordinary skill in the art to which this disclosure relates that when a specific component, structure, or characteristic is described in one embodiment, these components, structures, or characteristics can be applied to other embodiments (whether or not explicitly described). It should be understood that the terms and expressions in this document are for descriptive purposes only and are not intended to limit the present invention. Therefore, the terms and expressions in the specification should be interpreted by those having ordinary knowledge in the technical field based on the teachings of this document. In some embodiments, the terms "about" and "substantially" can mean within 20% of a given value or range (e.g., ±1%, ±2%, ±3%, ±4%, ±5%, ±10%, ±20%). These values ​​are provided for illustration only and are not intended to limit the present invention. The terms "about" and "substantially" can refer to percentages of values ​​that would be interpreted by one of ordinary skill in the art based on the teachings herein. As the demand for lower power consumption, higher performance, and smaller semiconductor devices increases, the size of semiconductor devices continues to shrink. Furthermore, multiple dies (including various devices), such as logic dies and memory dies, can be packaged on a substrate to improve device performance. The continued scaling of device sizes and the increasing demand for device performance may require various process improvements, which can present various challenges. For example, semiconductor devices generate heat during operation, which can increase the temperature of the die within the semiconductor device. A microchannel cooling plate or heat sink can be placed on the semiconductor device to remove heat and reduce the temperature of the die. However, different dies within a semiconductor device on the same substrate may generate different amounts of heat and operate within different preferred temperature ranges. For example, a logic die may generate more heat and operate within a preferred temperature range of approximately 85°C to approximately 105°C. A memory die may generate less heat and operate within a preferred temperature range of approximately 65°C to approximately 90°C. If a single microchannel cooling plate or heat sink is used for all dies on the same substrate, different dies may operate at the same temperature, which may not be within the preferred temperature range of each die. Consequently, dies operating outside their preferred temperature range may result in reduced device performance, and testing time for all dies in the semiconductor device may increase. Furthermore, a thermal interface material may be required between the die and the microchannel cooling plate or heat sink for heat conduction. The quality and performance of the thermal interface material may limit the cooling capacity of the microchannel cooling plate and heat sink. Various embodiments disclosed herein provide a multi-zone impingement cooling system for a semiconductor device or semiconductor package and methods for forming the same. In some embodiments, the heat transfer system may include a semiconductor device, a heat transfer structure located on the semiconductor device, and a controller configured to control the temperature of the semiconductor device using the heat transfer structure. The semiconductor device may include a first die and a second die located on a substrate. The heat transfer structure may include a first compartment located above the first die and a second compartment located above the second die and separated from the first compartment. A first inlet pipe may be connected to the first compartment and configured to inject a first liquid coolant into the first compartment. A second inlet pipe may be connected to the second compartment and configured to inject a second liquid coolant into the second compartment. The controller may be configured to control a first flow rate of the first liquid coolant based on the temperature of the first die and a second flow rate of the second liquid coolant based on the temperature of the second die. Through multi-zone impingement cooling, the temperatures of the first and second dies can be individually controlled, which can improve device performance of each die and reduce semiconductor device testing time. Furthermore, by directly impinging the first die and the second die with the liquid coolant without using a thermal interface material, the heat transfer efficiency of the heat conduction structure can be improved, and the cooling capacity of the heat conduction system can be enhanced. Figures 1, 2, 5, 6, 12, and 13 illustrate partial cross-sectional views of a heat transfer system 100 with multi-zone impingement cooling for semiconductor devices, according to some embodiments of the present disclosure. Figures 3, 4, 7 through 11 illustrate partial top views of the heat transfer system 100 with multi-zone impingement cooling for semiconductor devices, according to some embodiments of the present disclosure. In some embodiments, as shown in Figures 1 through 13, the heat transfer system 100 may include a semiconductor device 101, a heat transfer structure 103, and a controller 130. In some embodiments, the heat transfer system 100 may be configured to test the semiconductor device 101, which is cooled by the heat transfer structure 103, during a test process. In some embodiments, the semiconductor device 101 and the heat transfer structure 103 may be packaged together in a semiconductor package. Unless otherwise noted, the discussion of elements of the semiconductor device 101 and the heat transfer structure 103 with the same annotations in Figures 1 through 13 applies to each other. Like reference numbers generally indicate identical, functionally similar, and / or structurally similar elements. In some embodiments, semiconductor device 101 may include dies 110-1 through 110-7, as shown in Figures 1 through 13. In some embodiments, each of dies 110-1 through 110-7 may be a logic die, a high bandwidth memory (HBM) die, or other suitable die. In some embodiments, each of dies 110-1 and 110-3 through 110-7 may be an HBM die, while die 110-2 may be a logic die. Although Figures 1 through 13 illustrate semiconductor device 101 as having seven dies, semiconductor device 101 may have any number of dies. Furthermore, semiconductor device 101 may be included in a semiconductor package. Referring to Figures 1 to 13 , semiconductor device 101 may further include external connectors 102 , a substrate 104 , conductive connectors 106 , and an interposer 108 . In some embodiments, external connectors 102 may be disposed on the bottom side of substrate 104 . In some embodiments, external connectors 102 may include ball grid array (BGA) connectors, solder balls, metal pillars, controlled collapse chip connection (C4) bumps, microbumps, or other suitable connectors. In some embodiments, external connectors 102 may include conductive materials such as solder, copper, aluminum, gold, nickel, silver, palladium, tin, and combinations thereof. In some embodiments, external connectors 102 may include solder-free conductive materials. In some embodiments, external connectors 102 may be used to physically and electrically connect substrate 104 to other external devices, packages, connection components, and the like. In some embodiments, substrate 104 may include a printed circuit board (PCB). In some embodiments, substrate 104 may include electrical connectors (not shown) formed on opposing sides of substrate 104. The electrical connectors on opposing sides may be electrically coupled to each other via metal lines and vias (not shown) within substrate 104. The electrical connectors, metal lines, and vias on substrate 104 may electrically connect a single component on one side of substrate 104 to another component on the opposing side of substrate 104. For example, substrate 104 may electrically connect dies 110-1 through 110-7 to external components via external connectors 102 on the bottom side of substrate 104 via interposer 108 and conductive connectors 106 on the top side of substrate 104. In some embodiments, substrate 104 may provide mechanical support for components packaged on substrate 104, such as dies 110-1 through 110-7, conductive connectors 106, interposer 108, and / or thermally conductive structure 103. In some embodiments, the conductive connector 106 may be disposed on the top side of the substrate 104. In some embodiments, the conductive connector 106 may include a C4 bump, a microbump, a BGA connector, a solder ball, a metal pillar, or other suitable connector. In some embodiments, the external connector 102 and the conductive connector 106 may include the same connector or different connectors. In some embodiments, the conductive connector 106 may include a conductive material, such as solder, copper, aluminum, gold, nickel, silver, palladium, tin, and combinations thereof. In some embodiments, the conductive connector 106 may include a solderless conductive material. In some embodiments, the external connector 102 and the conductive connector 106 may include the same conductive material or different conductive materials. In some embodiments, the conductive connector 106 may be used to physically and electrically connect the dies 110-1 to 110-7 to the substrate 104 through the interposer 108. In some embodiments, interposer 108 can bond dies 110-1 through 110-7 to conductive connectors 106 on substrate 104. In some embodiments, interposer 108 can provide electrical connection routing, power distribution, and other suitable functions. For example, interposer 108 can electrically connect dies 110-1 through 110-7 to conductive connectors 106 and subsequently to external components on the bottom side of substrate 104. In some embodiments, interposer 108 can include redistribution circuit structures, vias, conductive connectors, and other suitable components, which are not shown in detail for clarity. In some embodiments, as shown in Figures 1 through 4 , the heat-conducting structure 103 may include an impingement compartment 112, a seal 114, an inlet nozzle 116, an outlet nozzle 118, a manifold 126, an inlet plumbing pipe 120, a control valve 122, an outlet pipe 124, and a liquid coolant 128. In some embodiments, the heat-conducting structure 103 may be placed on the semiconductor device 101 to cool the dies 110-1 through 110-7. In some embodiments, the liquid coolant 128 may be delivered to the impingement compartment 112 above the dies 110-1 through 110-7 via the control valve 122, the inlet pipe 120, and the inlet nozzle 116. The liquid coolant 128 may pass through the outlet nozzle 118 and the outlet pipe 124 to remove heat generated by the dies 110-1 through 110-7. In some embodiments, the liquid coolant 128 may include water, liquid nitrogen, or other suitable liquid coolants. In some embodiments, the manifold 126 may provide physical support and connect to the inlet tube 120 and the outlet tube 124. In some embodiments, the manifold 126 may include metal, plastic, or other suitable materials. In some embodiments, each impingement compartment 112 may be positioned above each die 110 - 1 to 110 - 7 . In some embodiments, the impingement compartment 112 may hold liquid coolant 128 between the die 110 - 1 to 110 - 7 and the inlet nozzle 116 and the outlet nozzle 118 . In some embodiments, the impingement compartment 112 may have a space 112s above the top surface of the die 110 - 1 to 110 - 7 along the Z-axis to hold the liquid coolant 128 . In some embodiments, the space 112s may range from approximately 0.5 millimeters (mm) to approximately 2 mm. In some embodiments, the impingement compartment 112 may have different spaces 112s above different dies depending on the amount of heat generated by the die 110 - 1 to 110 - 7 . If the space 112s is less than approximately 0.5 mm, the heat generated by the die 110 - 1 to 110 - 7 may not be effectively removed, and the die 110 - 1 to 110 - 7 may not operate within its preferred temperature range. If the interval 112s is greater than about 2 mm, the heat conduction efficiency may not be further improved, but the manufacturing cost may increase. In some embodiments, a seal 114 may surround each impingement compartment 112 to seal the liquid coolant 128 between the corresponding impingement compartment 112 and the dies 110 - 1 to 110 - 7 . In some embodiments, the seal 114 may be removable. In some embodiments, the seal 114 may comprise rubber or other suitable materials. In some embodiments, the controller 130 may control a motor (not shown) in the heat-conducting structure 103 to move the heat-conducting structure 103 toward the semiconductor device 101 , exerting a force on the seal 114 and sealing the liquid coolant 128 within the impingement compartment 112 , thereby preventing leakage of the liquid coolant 128 . In some embodiments, the inlet nozzle 116 and the outlet nozzle 118 may be positioned within the impingement chamber 112 above the dies 110-1 to 110-7. The controller 130 may control the inlet nozzle 116 to inject the liquid coolant 128 directly onto the top surfaces of the dies 110-1 to 110-7. The controller 130 may control an additional control valve (not shown) on the outlet pipe 124 to remove the liquid coolant 128 from the impingement chamber 112 through the outlet nozzle 118 and the outlet pipe 124. In some embodiments, along the Z-axis, the distance 112d between the top surfaces of the dies 110-1 to 110-7 and the inlet nozzle 116 and the outlet nozzle 118 may be between approximately 0.1 mm and approximately 2 mm. If the distance 112d is less than approximately 0.1 mm, heat generated by the dies 110-1 to 110-7 may not be effectively removed, and the dies 110-1 to 110-7 may not operate within their preferred temperature range. If the distance 112d is greater than approximately 2 mm, heat transfer efficiency may not be further improved, but manufacturing costs may increase. In some embodiments, the ratio between the distance 112d and the spacing 112s may be between approximately 0.5 and approximately 1 to balance the pressure drop and flow uniformity of the liquid coolant 128. If the ratio is less than approximately 0.5, the pressure drop may increase, which may require a larger pump to circulate the liquid coolant 128 and may reduce the structural reliability of the heat-conducting structure 103. If the ratio is greater than approximately 1, the injection of the liquid coolant 128 may be uneven, which may limit the cooling capacity of the liquid coolant 128. In some embodiments, the inlet nozzle 116 and the outlet nozzle 118 above different dies may have different distances 112d depending on the heat generated by the dies 110-1 to 110-7. In some embodiments, the distances 112d between the inlet nozzle 116 and the outlet nozzle 118 in the same impingement compartment 112 can be individually controlled. In some embodiments, the size of the inlet nozzle 116 and the outlet nozzle 118 may depend on the physical design of the heat-conducting structure 103. In some embodiments, the length of the inlet nozzle 116 and the outlet nozzle 118 can be between about 0.1 mm and about 1 mm. In some embodiments, the diameter of the inlet nozzle 116 and the outlet nozzle 118 can be between about 0.1 mm and about 1 mm. In some embodiments, the distance between the inlet nozzle 116 and the outlet nozzle 118 (which may be referred to herein as the "inlet / outlet pitch") can be between about 0.5 mm and about 2 mm to balance the pressure drop of the liquid and the flow uniformity. In some embodiments, the ratio between the inlet / outlet pitch and the diameter can be between about 2 and about 5. If the ratio is less than about 2, the pressure drop of the liquid coolant 128 may increase. If the ratio is greater than about 5, the flow uniformity of the liquid coolant 128 may decrease and the thermal resistance of the heat-conductive structure 103 may increase. In some embodiments, each impingement compartment 112 may be connected to a single inlet pipe 120. The inlet pipe 120 may deliver liquid coolant 128 to each impingement compartment 112. In some embodiments, each inlet pipe 120 may have a single control valve 122 to control the flow rate of the liquid coolant 128. In some embodiments, a controller 130 may be connected to the semiconductor device 101 and the heat-conducting structure 103 to control the operation and temperature of the dies 110-1 to 110-7. An embodiment of the controller 130 is described in detail in FIG. 15. In some embodiments, each of the dies 110-1 to 110-7 may include a temperature sensor (not shown), and the controller 130 may obtain the temperature of the dies 110-1 to 110-7 from the temperature sensor. In some embodiments, the controller 130 may control the flow rate of the liquid coolant 128 in the inlet pipe 120 using the control valve 122. In some embodiments, the controller 130 may adjust the flow rate in each inlet pipe 120 based on the temperature of each die 110-1 to 110-7. For example, die 110-1 may have a first temperature and die 110-2 may have a second temperature different from the first temperature. Based on the first temperature of die 110-1 and the second temperature of die 110-2 and the preferred temperature range, controller 130 may adjust a first flow rate of liquid coolant 128 supplied to die 110-1 and a second flow rate of liquid coolant 128 supplied to die 110-2. In some embodiments, the first flow rate may be different from the second flow rate. In some embodiments, as shown in FIG. 1 , each impingement compartment 112 can be connected to a single outlet tube 124. The outlet tube 124 can remove liquid coolant 128 from each impingement compartment 112. In some embodiments, as shown in FIG. 2 , all impingement compartments 112 can be connected to a single outlet tube 124 to remove liquid coolant 128. In some embodiments, as shown in FIG. 3 , the inlet tube 120 can be arranged parallel to the outlet tube 124. The inlet tube 120 can extend on a first side (e.g., the right side) of the baseplate 104, and the outlet tube 124 can extend on a second side (e.g., the left side) of the baseplate 104, opposite the first side. In some embodiments, as shown in FIG. 4 , the inlet tube 120 can be arranged perpendicular to the outlet tube 124. The inlet tube 120 can extend on a first side (e.g., the right side) of the baseplate 104, and the outlet tube 124 can extend on a second side (e.g., the bottom side) of the baseplate 104, adjacent to the first side. In some embodiments, as shown in Figures 5 to 11 , the heat transfer structure 103 may further include an evacuation pipe 132. In some embodiments, each impingement compartment 112 may be connected to a single evacuation pipe 132. The evacuation pipe 132 may draw air from the impingement compartment 112, reducing the pressure within the impingement compartment 112 and thereby lowering the boiling point of the liquid coolant 128 within the impingement compartment 112. In some embodiments, when the pressure within the impingement compartment 112 is low, heat generated from the dies 110-1 to 110-7 may be removed through both the liquid phase and the vapor phase of the liquid coolant 128. In some embodiments, the controller 130 may utilize the evacuation pipe 132 to adjust the pressure within the impingement compartment 112 to improve heat transfer efficiency. In some embodiments, as shown in Figures 5, 7, and 8, the exhaust pipe 132 may be arranged parallel to and adjacent to the inlet pipe 120. In some embodiments, as shown in Figures 5 and 7, the outlet pipe 124 may be arranged parallel to the inlet pipe 120. The inlet pipe 120 and the exhaust pipe 132 may extend on a first side (e.g., the right side) of the substrate 104, and the outlet pipe 124 may extend on a second side (e.g., the left side) of the substrate 104, the second side being opposite to the first side. In some embodiments, as shown in Figure 8, the outlet pipe 124 may be arranged perpendicular to the inlet pipe 120. The inlet pipe 120 and the exhaust pipe 132 may extend above the first side (e.g., the right side) of the substrate 104, and the outlet pipe 124 may extend above the second side (e.g., the bottom side) of the substrate 104, the second side being adjacent to the first side. In some embodiments, as shown in Figures 9 and 10 , the exhaust pipe 132 may be arranged parallel to and adjacent to the outlet pipe 124. In some embodiments, as shown in Figure 9 , the inlet pipe 120 may be arranged parallel to the outlet pipe 124. The inlet pipe 120 may extend on a first side (e.g., the right side) of the substrate 104, and the outlet pipe 124 and the exhaust pipe 132 may extend on a second side (e.g., the left side) of the substrate 104, the second side being opposite to the first side. In some embodiments, as shown in Figure 10 , the inlet pipe 120 may be arranged perpendicular to the outlet pipe 124. The inlet pipe 120 may extend on a first side (e.g., the right side) of the substrate 104, and the outlet pipe 124 and the exhaust pipe 132 may extend on a second side (e.g., the bottom side) of the substrate 104, the second side being adjacent to the first side. In some embodiments, as shown in FIG. 11 , the extraction tube 132 may be arranged perpendicular to the inlet tube 120 and the outlet tube 124. As shown in FIG. 11 , the inlet tube 120 may extend on a first side (e.g., the right side) of the substrate 104, the outlet tube 124 may extend on a second side (e.g., the left side) of the substrate 104, the second side opposite the first side, and the extraction tube 132 may extend on a third side (e.g., the bottom side) of the substrate 104, the third side adjacent to the first and second sides. In some embodiments, the extraction tube 132 may be combined with the inlet tube 120. Thus, the inlet tube 120 may first be used to evacuate the air in the impingement chamber 112 and then be used to deliver the liquid coolant 128 to the impingement chamber 112. In some embodiments, the extraction tube 132 may be combined with the outlet tube 124. Thus, the outlet tube 124 may first be used to evacuate the air in the impingement chamber 112 and then be used to remove the liquid coolant 128 from the impingement chamber 112. In some embodiments, as shown in Figures 12 and 13 , the heat-conducting structure 103 may further include a housing structure 136 positioned above the manifold 126 and springs 134 connecting the housing structure 136 to the manifold 126. In some embodiments, as shown in Figure 12 , each of the dies 110-1 through 110-7 may have a single manifold 126 disposed thereon. Each manifold 126 may be connected to the housing structure 136 via a single spring 134. The springs 134 on the manifolds 126 can apply an appropriate force to each manifold 126 to improve the seal between the impingement compartment 112 and the dies 110-1 through 110-7, thereby preventing leakage of the liquid coolant 128. In some embodiments, as shown in Figure 13 , the housing structure 136 may include additional structure (e.g., a foot or cover) extending around the manifold 126. In some embodiments, the additional structure may support and protect the manifold 126, the inlet tube 120, and the outlet tube 124. In some embodiments, the additional structures may or may not be in contact with the semiconductor device 101. In some embodiments, one of the manifolds 126 may be disposed over a local hot spot of the dies 110-1 to 110-7 to improve heat transfer efficiency. FIG. 14 illustrates a flow chart of a method 1400 for forming multi-zone impingement cooling of a semiconductor device 101 according to some embodiments of the present disclosure. The method 1400 may not be limited to the semiconductor device 101 and may be applicable to other devices that benefit from multi-zone impingement cooling. Additional operations may be performed between the various operations of the method 1400 and may be omitted for the sake of brevity and clarity of description. Additional operations may be provided before, during and / or after the method 1400; one or more of these additional operations are briefly described herein. In addition, not all of the operations provided are required to implement the present disclosure. In addition, some operations may be performed simultaneously or in an order different from that shown in FIG. 14. In some embodiments, one or more other operations may be performed in addition to or in place of the operations currently described. For illustrative purposes, the operations shown in FIG. 14 will be described below with reference to the embodiments shown in FIG. 1 to FIG. 13. Referring to FIG. 14 , method 1400 begins at operation 1410 and a process of placing a heat-conducting structure including a first shock chamber and a second shock chamber on a substrate including a first die and a second die. The first chamber may be placed above the first die, while the second chamber may be placed above the second die. For example, as shown in FIG. 1 through FIG. 13 , controller 130 may control a motor (not shown) in heat-conducting structure 103 to move and place heat-conducting structure 103 on substrate 104. Substrate 104 may include dies 110 - 1 through 110 - 7. Heat-conducting structure 103 may include shock chambers 112, each of which may be placed above each of dies 110 - 1 through 110 - 7. In some embodiments, heat-conducting structure 103 may be placed on semiconductor device 101 during testing of semiconductor device 101 by a motor controlled by controller 130. For example, controller 130 can control a pick and place (PnP) arm (not shown) to place semiconductor device 101 into a test socket (not shown). Controller 130 can control a motor to move heat-conducting structure 103 to the test socket and place heat-conducting structure 103 on semiconductor device 101. Force can be applied to heat-conducting structure 103 to prevent leakage of liquid coolant 128. Controller 130 can open control valve 122 and deliver liquid coolant 128 to impingement chamber 112 above each of dies 110-1 through 110-7. After semiconductor device 101 begins operation or testing, dies 110-1 through 110-7 may generate heat. In some embodiments, heat-conducting structure 103 and semiconductor device 101 may be encapsulated in a semiconductor package, and heat-conducting structure 103 may be placed on top of semiconductor device 101. Referring to FIG. 14 , in operation 1420 , a first temperature on a first die is obtained. For example, as shown in FIG. 1 through FIG. 13 , controller 130 may obtain the temperature of die 110 - 1 . In some embodiments, die 110 - 1 may include a temperature sensor (not shown) to measure the temperature of die 110 - 1 during operation. In some embodiments, controller 130 may obtain the temperature of die 110 - 1 from the temperature sensor. In some embodiments, the temperature sensor may measure the temperature distribution and the distribution of local hot spots on the top surface of die 110 - 1 , and controller 130 may obtain the temperature distribution. In some embodiments, controller 130 does not directly obtain the temperature of die 110 - 1 , but instead obtains the power level of die 110 - 1 and generates the temperature of die 110 - 1 based on the power level. Referring to FIG. 14 , in operation 1430 , a first die is cooled in a first compartment using a first liquid coolant at a first flow rate based on a first temperature. For example, as shown in FIG. 1 through FIG. 13 , die 110 - 1 may be cooled by liquid coolant 128 in impingement compartment 112 disposed thereover. Based on the temperature of die 110 - 1 , controller 130 may control a first flow rate of liquid coolant 128 delivered to die 110 - 1 using control valve 122 . Liquid coolant 128 in impingement compartment 112 may remove heat generated by die 110 - 1 during operation or testing and maintain the temperature of die 110 - 1 at a preferred temperature or preferred temperature range. For example, a logic die may operate within a preferred temperature range of approximately 85°C to approximately 105°C. A memory die may operate within a preferred temperature range of approximately 65°C to approximately 90°C. In some embodiments, as shown in Figures 5 through 11 , the heat transfer structure 103 may further include an exhaust pipe 132, and the impingement chambers 112 located above the die 110-1 may be connected to a single exhaust pipe 132. The exhaust pipe 132 can evacuate the air in the impingement chambers 112, reducing the pressure therein and thereby lowering the boiling point of the liquid coolant 128 therein. In some embodiments, when the pressure in the impingement chambers 112 is low, heat generated from the die 110-1 can be removed through both the liquid and vapor phases of the liquid coolant 128. In some embodiments, the controller 130 can adjust the pressure in the impingement chambers 112 using the exhaust pipe 132 to improve heat transfer efficiency. In some embodiments, as shown in Figures 1 through 13 , the spacing 112s of the impingement chambers 112 and the distance 112d between the top surfaces of the dies 110-1 through 110-7 and the inlet nozzle 116 and outlet nozzle 118 can be adjusted to further improve heat transfer efficiency. Referring to FIG. 14 , in operation 1440 , a second temperature on the second die is obtained. For example, as shown in FIG. 1 through FIG. 13 , controller 130 may obtain the temperature of die 110 - 2 . In some embodiments, die 110 - 2 may include a temperature sensor (not shown) to measure the temperature of die 110 - 2 during operation. In some embodiments, controller 130 may obtain the temperature of die 110 - 2 from the temperature sensor. In some embodiments, the temperature sensor may measure the temperature distribution and the distribution of local hot spots on the top surface of die 110 - 2 , and controller 130 may obtain the temperature distribution. In some embodiments, controller 130 does not directly obtain the temperature of die 110 - 2 , but instead obtains the power level of die 110 - 2 and generates the temperature of die 110 - 2 based on the power level. Referring to FIG. 14 , in operation 1450 , a second die is cooled in a second compartment using a second liquid coolant at a second flow rate based on a second temperature. For example, as shown in FIG. 1 through FIG. 13 , die 110 - 2 may be cooled by liquid coolant 128 in impingement compartment 112 disposed thereover. Based on the temperature of die 110 - 2 , controller 130 may control the second flow rate of liquid coolant 128 delivered to die 110 - 2 using control valve 122 . Liquid coolant 128 in impingement compartment 112 may remove heat generated by die 110 - 2 during operation or testing and maintain the temperature of die 110 - 2 at a preferred temperature or preferred temperature range. For example, a logic die may operate within a preferred temperature range of approximately 85°C to approximately 105°C. A memory die may operate within a preferred temperature range of approximately 65°C to approximately 90°C. In some embodiments, die 110 - 1 may be a memory die and die 110 - 2 may be a logic die. The preferred temperature ranges for die 110-1 and die 110-2 can be different. Therefore, the second flow rate of the liquid coolant 128 delivered to die 110-2 can be different from the first flow rate of the liquid coolant 128 delivered to die 110-1. In some embodiments, to further reduce the temperature of die 110-2 after reaching the maximum flow rate of the liquid coolant 128 delivered to die 110-2, the controller 130 can continuously adjust the first flow rate of the liquid coolant 128 delivered to die 110-1. Lowering the temperature of adjacent die 110-1 can further reduce the temperature of die 110-2. Similarly, after reaching the maximum flow rate of the liquid coolant 128 delivered to die 110-1, the temperature of die 110-1 can be further reduced. In some embodiments, similar to die 110-1, as shown in Figures 5 through 11, the impingement chamber 112 located above die 110-2 can be connected to a single exhaust pipe 132 to improve heat transfer efficiency. In some embodiments, as shown in Figures 1 through 13, the spacing 112s of the impingement chamber 112 and the distance 112d between the top surfaces of the dies 110-1 through 110-7 and the inlet nozzle 116 and outlet nozzle 118 can be adjusted to further improve heat transfer efficiency. In some embodiments, the temperature of the dies 110-1 through 110-7 can be actively controlled during testing or operational processes by adjusting the control valve 122, spacing 112s, and distance 112d. By individually controlling the temperature of the dies 110-1 through 110-7 within their respective preferred temperature ranges, device performance of the dies 110-1 through 110-7 can be improved and testing time of the semiconductor device 101 can be reduced. In some embodiments, after testing semiconductor device 101, control valve 122 can be closed. Liquid coolant 128 remaining in impingement compartment 112 can be removed via a vacuum operation. Heat-conductive structure 103 can be lifted from semiconductor device 101, and semiconductor device 101 can be removed from the test socket for further processing. For the sake of clarity, these operations are not described in detail. FIG. 15 illustrates an exemplary computer system 1500 in which various embodiments of the present disclosure may be implemented, according to some embodiments. Computer system 1500 may be any known computer capable of performing the functions and operations described herein. For example, but not limited to, computer system 1500 may control heat transfer structure 103 to implement multi-zone impingement cooling of die 110 during testing of semiconductor device 101. Computer system 1500 may be an example of controller 130, for example, for performing one or more operations of method 1400, which describes an exemplary method for implementing multi-zone impingement cooling of die 110-1 through 110-7 during testing of a semiconductor device. Computer system 1500 includes one or more processors (also known as central processing units or CPUs), such as processor 1504. Processor 1504 is connected to a communication infrastructure or bus 1506. Computer system 1500 also includes input / output devices 1503, such as a monitor, keyboard, and pointing device, that communicate with communication infrastructure or bus 1506 via input / output interface 1502. System control tools can receive instructions via input / output devices 1503 to implement the functions and operations described herein, such as method 1400 in FIG. 14. Computer system 1500 also includes primary or main memory 1508, such as random access memory (RAM). Main memory 1508 may include one or more levels of cache. Main memory 1508 stores control logic (e.g., computer software) and / or data. In some embodiments, control logic (eg, computer software) and / or data may include one or more of the operations described above with respect to method 1400 of FIG. 14 . Computer system 1500 may also include one or more secondary storage devices or memories 1510. Secondary memory 1510 may include, for example, a hard drive 1512 and / or a removable storage device or drive 1514. Removable storage drive 1514 may be a floppy disk drive, a magnetic tape drive, a compact disk drive, an optical storage device, a tape backup device, and / or any other storage device / drive. Removable storage drive 1514 can interact with removable storage unit 1518. Removable storage unit 1518 comprises a computer-usable or computer-readable storage device on which computer software (control logic) and / or data are stored. Removable storage unit 1518 can be a floppy disk, magnetic tape, optical disk, DVD, optical storage disk, and / or any other computer data storage device. Removable storage drive 1514 reads from and / or writes to removable storage unit 1518 in a known manner. In some embodiments, secondary memory 1510 may include means, instruments, or other methods for allowing computer programs and / or other instructions and / or data to be accessed by computer system 1500. Such means, instruments, or other methods may include, for example, a removable storage unit 1522 and an interface 1520. Examples of removable storage unit 1522 and interface 1520 may include a program cartridge and a cartridge interface (e.g., a cartridge interface in a video game device), a removable memory chip (e.g., an erasable programmable read-only memory (EPROM) or a programmable read-only memory (PROM)) and an associated socket, a memory stick and a USB port, a memory card and an associated memory card slot, and / or any other removable storage unit and an associated interface. In some embodiments, the secondary memory 1510, the removable storage unit 1518, and / or the removable storage unit 1522 may include one or more of the operations described above with respect to the method 1400 of FIG. 14 . Computer system 1500 may further include a communication or network interface 1524. Communication interface 1524 enables computer system 1500 to communicate and interact with any combination of remote devices, remote networks, remote entities, and the like (individually and collectively represented by reference numeral 1528). For example, communication interface 1524 may allow computer system 1500 to communicate with remote device 1528 via communication path 1526, which may be wired and / or wireless and may include any combination of a LAN, a WAN, the Internet, and the like. Control logic and / or data may be transferred to and from computer system 1500 via communication path 1526. The operations described in the aforementioned embodiments can be implemented in a variety of configurations and architectures. Therefore, some or all of the operations described in the embodiments herein—e.g., method 1400 in FIG. 14—can be performed in hardware, software, or both. In some embodiments, a tangible apparatus or article of manufacture comprising a tangible computer-usable or readable medium having control logic (software) stored thereon is also referred to herein as a "computer program product" or "program storage device." This includes, but is not limited to, computer system 1500, primary memory 1508, secondary memory 1510, and removable storage units 1518 and 1522, as well as tangible articles of manufacture embodying any combination thereof. When executed by one or more data processing devices (e.g., computer system 1500), this control logic causes such data processing devices to operate as described herein. Various embodiments of the present disclosure provide a multi-zone impingement cooling system for a semiconductor device 101 and methods for forming the same. In some embodiments, the heat transfer system 100 may include a semiconductor device 101, a heat transfer structure 103 located on the semiconductor device 101, and a controller 130 configured to control the temperature of the semiconductor device 101 using the heat transfer structure 103. The semiconductor device 101 may include a first die 110-1 and a second die 110-2 located on a substrate 104. The heat transfer structure 103 may include a first compartment 112 located above the first die 110-1 and a second compartment 112 located above the second die 110-2 and separated from the first compartment 112. A first inlet plumbing pipe 120 may be connected to the first compartment 112 and configured to inject a first liquid coolant 128 into the first compartment 112 and onto the first die 110-1. A second inlet pipe 120 can be connected to the second compartment 112 and configured to inject a second liquid coolant 128 onto the second die 110-2 in the second compartment 112. A controller 130 can be configured to control a first flow rate of the first liquid coolant 128 based on the temperature of the first die 110-1 and a second flow rate of the second liquid coolant 128 based on the temperature of the second die 110-2. Through multi-zone impingement cooling, the temperatures of the first die 110-1 and the second die 110-2 can be individually controlled, which can improve device performance of each die and reduce testing time for the semiconductor device 101. Furthermore, by directly impinging the first die 110-1 and the second die 110-2 with the liquid coolant 128 without using a thermal interface material, the heat transfer efficiency of the heat conducting structure 103 can be improved, thereby enhancing the cooling capacity of the heat conducting system 100. In some embodiments, a heat transfer system includes a first die and a second die positioned on a substrate, a heat transfer structure, and a controller. The heat transfer structure includes a first compartment disposed above the first die, a second compartment disposed above the second die and separated from the first compartment, a first inlet pipe connected to the first compartment and configured to supply a first liquid coolant to the first compartment, and a second inlet pipe connected to the second compartment and configured to supply a second liquid coolant to the second compartment. The controller is configured to control a first flow rate of the first liquid coolant based on a temperature of the first die and a second flow rate of the second liquid coolant based on a temperature of the second die. In some embodiments, the heat conduction system further includes a first valve and a second valve. The first valve is located on the first inlet pipe and is configured to control a first flow rate of the first liquid coolant, and the second valve is located on the second inlet pipe and is configured to control a second flow rate of the second liquid coolant, wherein the second flow rate is different from the first flow rate. In some embodiments, the heat conduction system further includes a first nozzle and a second nozzle. The first nozzle is connected to the first inlet pipe and is configured to inject the first liquid coolant into the first compartment and onto the first die, and the second nozzle is connected to the second inlet pipe and is configured to inject the second liquid coolant into the second compartment and onto the second die. In some embodiments, the heat conduction system further includes a first outlet pipe and a second outlet pipe. The first outlet pipe is connected to the first compartment and is configured to remove the first liquid coolant from the first compartment, and the second outlet pipe is connected to the second compartment and is configured to remove the second liquid coolant from the second compartment. In some embodiments, the first inlet tube is parallel to the first outlet tube, the second inlet tube is parallel to the second outlet tube, the first inlet tube and the second inlet tube extend over a first side of the substrate, and the first outlet tube and the second inlet tube extend over a second side of the substrate, wherein the second side is opposite to the first side. In some embodiments, the first inlet tube is perpendicular to the first outlet tube, the second inlet tube is perpendicular to the second outlet tube, the first inlet tube and the second inlet tube extend over a first side of the substrate, and the first outlet tube and the second inlet tube extend over a second side of the substrate, wherein the second side is adjacent to the first side. In some embodiments, the heat transfer system further includes a first removable seal and a second removable seal. The first removable seal surrounds the first compartment and is configured to seal a first liquid coolant between the first compartment and the first die, while the second removable seal surrounds the second compartment and is configured to seal a second liquid coolant between the second compartment and the second die. In some embodiments, the heat transfer system further includes a first exhaust pipe and a second exhaust pipe. The first exhaust pipe is connected to the first compartment and is configured to adjust a first pressure in the first compartment, while the second exhaust pipe is connected to the second compartment and is configured to adjust a second pressure in the second compartment. In some embodiments, the first inlet pipe is parallel to the first exhaust pipe, and the second inlet pipe is parallel to the second exhaust pipe. In some embodiments, the first inlet pipe is perpendicular to the first exhaust pipe, and the second inlet pipe is perpendicular to the second exhaust pipe. In some embodiments, the first liquid coolant and the second liquid coolant include water. In some embodiments, the heat transfer system further includes a housing, a first spring connecting the first compartment to the housing structure, and a second spring connecting the second compartment to the housing structure. In some embodiments, the heat-conducting structure includes a first compartment disposed above a first die, a first inlet tube connected to the first compartment and configured to supply a first liquid coolant to the first compartment, a second compartment disposed above a second die and separated from the first compartment, and a second inlet tube connected to the second compartment and configured to supply a second liquid coolant to the second compartment. In some embodiments, the heat-conducting structure further includes a nozzle connected to the first inlet tube and configured to inject the first liquid coolant into the first compartment and onto the first die. The first compartment has a spacing above the first die. The nozzle is separated from the first die by a distance. The ratio of the distance to the spacing is about 0.5 to about 1. In some embodiments, the heat-conducting structure further includes a first nozzle connected to the first inlet tube and configured to inject the first liquid coolant into the first compartment and onto the first die, a first outlet tube connected to the first compartment and configured to remove the first liquid coolant from the first compartment, and a second nozzle connected to the first outlet tube and configured to remove the first liquid coolant. The pitch between the first nozzle and the second nozzle is about 0.5 millimeters (mm) to about 2 mm. In some embodiments, the first nozzle and the second nozzle have a diameter, and the ratio of the diameter to the pitch is about 2 to about 5. In some embodiments, a method for forming a heat-conducting structure system includes placing a heat-conducting structure on a substrate. The substrate includes a first die and a second die. The heat-conducting structure includes a first compartment located above the first die and a second compartment located above the second die. The method further includes obtaining a first temperature of the first die, cooling the first die in the first compartment with a first liquid coolant at a first flow rate based on the first temperature, obtaining a second temperature of the second die, and cooling the first die in the second compartment with a second liquid coolant at a second flow rate based on the second temperature. The second flow rate is different from the first flow rate. In some embodiments, the method further includes controlling the first flow rate with a first valve and controlling the second flow rate with a second valve. In some embodiments, cooling the first die with the first liquid coolant includes opening a first valve on a first inlet pipe connected to the first compartment to deliver the first liquid coolant, injecting the first liquid coolant onto the first die in the first compartment using a first nozzle, and opening a second valve on a first outlet pipe connected to the first compartment to remove the first liquid coolant. In some embodiments, the method further includes moving the heat-conducting structure toward the substrate to seal the first liquid coolant between the first compartment and the first die with a first removable seal, and sealing the second liquid coolant between the second compartment and the second die with a second removable seal. It should be understood that the embodiment section (rather than the abstract of the disclosure section) is intended to explain the claims. The abstract of the disclosure section may set forth one or more, but not all possible embodiments of the present disclosure as contemplated by the inventors, and is therefore not intended to limit the claims in any way. The above overview of several embodiments is provided to facilitate understanding of the present invention by those skilled in the art. Those skilled in the art will appreciate that they can design or modify other processes and structures based on the present invention to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art will also appreciate that such equivalent processes and structures do not depart from the spirit and scope of the present invention, and that various modifications, substitutions, and replacements can be made without departing from the spirit and scope of the present invention. 100: Heat transfer system 101: Semiconductor device 102: External connector 103: Heat transfer structure 104: Substrate 106: Conductive connector 108: Interposer 110, 110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7: Die 112: Compartment 112d: Distance 112s: Spacer 114: Seal 116: Inlet nozzle 118: Outlet nozzle 120: Inlet pipe 122: Control valve 124: Outlet pipe 126: Manifold 128: Liquid coolant 130: Controller 132 : Exhaust pipe 134: Spring 136: Housing structure 1400: Methods 1410, 1420, 1430, 1440, 1450: Operation 1500: Computer system 1502: Input / output interface 1503: Input / output device 1504: Processor 1506: Bus 1508: Main memory 1510: Secondary memory 1512: Hard disk 1514: Removable storage drive 1518: Removable storage unit 1520: Interface 1522: Removable storage unit 1524: Communication interface 1526: Communication path 1528: Remote device Various aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. Figures 1, 2, 5, 6, 12, and 13 are partial cross-sectional views of a heat conduction system with multi-zone impingement cooling of a semiconductor device according to some embodiments of the present disclosure. Figures 3, 4, 7 to 11 are partial top views of a heat conduction system with multi-zone impingement cooling of a semiconductor device according to some embodiments of the present disclosure. Figure 14 is a flow chart of a method for forming multi-zone impingement cooling of a semiconductor device according to some embodiments of the present disclosure. Figure 15 illustrates an exemplary computer system in which various embodiments of the present disclosure can be implemented. Exemplary embodiments will now be described with reference to the accompanying drawings, in which like reference numbers generally indicate identical, functionally similar, and / or structurally similar elements. 100:Heat conduction system 101: Semiconductor Device 102: External connector 103: Heat conduction structure 104:Substrate 106: conductive connector 108:Intermediary layer 110-1, 110-2, 110-3: Grains 112: Impact compartment 112d: Distance 112s: interval 114: Seal 116: Inlet nozzle 118: outlet nozzle 120: Inlet pipe 122: Control valve 124:Export pipe 126: Manifold 128:Liquid coolant 130: Controller

Claims

1. A heat conduction system, comprising: A first grain and a second grain are located on a substrate; A heat conduction structure includes: a first compartment disposed above a first grain; a second compartment disposed above a second grain and spaced apart from the first compartment; a first inlet pipe connected to the first compartment and configured to supply a first liquid coolant to the first compartment; a second inlet pipe connected to the second compartment and configured to supply a second liquid coolant to the second compartment; a first evacuation pipe connected to the first compartment and configured to adjust a first pressure in the first compartment; a second evacuation pipe connected to the second compartment and configured to adjust a second pressure in the second compartment; and a controller configured to control a first flow rate of the first liquid coolant based on the temperature of the first grain and to control a second flow rate of the second liquid coolant based on the temperature of the second grain.

2. The heat transfer system as described in claim 1, further comprising: A first valve is located on the first inlet pipe and configured to control the first flow rate of the first liquid coolant; And a second valve, located on the second inlet pipe and configured to control the second flow rate of the second liquid coolant, wherein the second flow rate is different from the first flow rate.

3. The heat transfer system as described in claim 1 or 2, further comprising: A first nozzle is connected to the first inlet pipe and configured to inject the first liquid coolant into the first compartment and onto the first grain; and a second nozzle is connected to the second inlet pipe and configured to inject the second liquid coolant into the second compartment and onto the second grain.

4. The heat conduction system as described in claim 1, further comprising: A first outlet pipe is connected to the first compartment and configured to remove the first liquid coolant from the first compartment; And a second outlet pipe, connected to the second compartment and configured to remove the second liquid coolant from the second compartment.

5. The heat transfer system as described in claim 4, wherein: The first inlet pipe is parallel to the first outlet pipe; the second inlet pipe is parallel to the second outlet pipe; the first inlet pipe and the second inlet pipe extend above a first side of the substrate; and the first outlet pipe and the second inlet pipe extend above a second side of the substrate, the second side being opposite to the first side.

6. The heat transfer system as described in claim 4, wherein: The first inlet pipe is perpendicular to the first outlet pipe; the second inlet pipe is perpendicular to the second outlet pipe; the first inlet pipe and the second inlet pipe extend above a first side of the substrate; and the first outlet pipe and the second inlet pipe extend above a second side of the substrate, the second side being adjacent to the first side.

7. The heat transfer system as described in claim 1, further comprising: A first removable seal surrounds the first compartment and is configured to seal the first liquid coolant between the first compartment and the first grain; and a second removable seal surrounds the second compartment and is configured to seal the second liquid coolant between the second compartment and the second grain.

8. The heat transfer system as described in claim 1, wherein: The first inlet pipe is parallel to the first exhaust pipe; and the second inlet pipe is parallel to the second exhaust pipe.

9. The heat transfer system as described in claim 1, wherein: The first inlet pipe is perpendicular to the first exhaust pipe; and the second inlet pipe is perpendicular to the second exhaust pipe.

10. The heat conduction system as claimed in claim 1, further comprising a housing structure, a first spring connecting the first compartment to the housing structure, and a second spring connecting the second compartment to the housing structure.

11. A heat-conducting structure, comprising: A first compartment is disposed above a first grain; a first inlet pipe is connected to the first compartment and configured to supply a first liquid coolant to the first compartment; a second compartment is disposed above a second grain and spaced apart from the first compartment; a second inlet pipe is connected to the second compartment and configured to supply a second liquid coolant to the second compartment; A first evacuation pipe is connected to the first compartment and configured to adjust a first pressure in the first compartment; And a second exhaust pipe, connected to the second compartment and configured to adjust a second pressure in the second compartment; And a controller configured to control a first flow rate of the first liquid coolant based on the temperature of the first crystal and a second flow rate of the second liquid coolant based on the temperature of the second crystal.

12. The heat conduction structure as described in claim 11, further comprising: A nozzle is connected to the first inlet pipe and configured to inject the first liquid coolant into the first compartment and onto the first grain, wherein: the first compartment has a space above the first grain, the nozzle is spaced from the first grain by a distance, and the ratio of the distance to the space is 0.5 to 1.

13. The heat conduction structure as described in claim 11, further comprising: A first nozzle is connected to the first inlet pipe and configured to inject the first liquid coolant into the first compartment and onto the first crystal; A first outlet pipe is connected to the first compartment and configured to remove the first liquid coolant from the first compartment; and a second nozzle, connected to the first outlet pipe and configured to remove the first liquid coolant, wherein a pitch between the first nozzle and the second nozzle is 0.5 mm to 2 mm, wherein the first nozzle and the second nozzle have a diameter, and wherein the diameter is in a ratio of 2 to 5 to the pitch.

14. A method for forming a heat conduction system, comprising: A heat-conducting structure is placed on a substrate, wherein: the substrate includes a first grain and a second grain; and the heat-conducting structure includes a first compartment above the first grain and a second compartment above the second grain; a first temperature of the first grain is obtained; based on the first temperature, the first grain is cooled in the first compartment with a first liquid coolant at a first flow rate; a second temperature of the second grain is obtained; based on the second temperature, the first grain is cooled in the second compartment with a second liquid coolant at a second flow rate, wherein the second flow rate is different from the first flow rate; a first pressure in the first compartment is adjusted by means of a first evacuation pipe connected to the first compartment; and a second pressure in the second compartment is adjusted by means of a second evacuation pipe connected to the second compartment.

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