Electronic package and manufacturing method thereof

Abstract

An electronic package and its manufacturing method are disclosed. The electronic package includes a carrier structure, an electronic component, a bridging element, a cover layer, and a photonic element. The carrier structure has opposing first and second surfaces. The electronic component is disposed on the second surface of the carrier structure and electrically connected to the carrier structure. The bridging element is disposed on the second surface of the carrier structure and electrically connected to the carrier structure. The cover layer covers the electronic component and the bridging element. The photonic element is disposed on one surface of the cover layer and electrically connected to the bridging element. In the electronic package and its manufacturing method, the photonic element is disposed after the cover layer is formed and polished to avoid the cover layer covering the photonic element, thereby avoiding contamination or damage to the light emitter and light receiver of the photonic element.

Description

[Technical Field]

[0001] This invention relates to a packaging structure, and more particularly to an electronic package and its manufacturing method. [Previous Technology]

[0002] With the ever-increasing demand for data network bandwidth, the shortcomings of traditional copper data channels, such as signal attenuation and crosstalk caused by radiated electromagnetic energy, have gradually become apparent. Optical communication has been regarded as the successor to copper links. Especially in the 21st century, the evolution of technologies such as the post-PC era, mobile communications, and artificial intelligence has driven changes in lifestyles such as mobile internet access, online shopping, video streaming, and online gaming. The increased bandwidth demand stimulated by this has finally reached the point where copper cables are no longer sufficient.

[0003] Furthermore, high-performance computing (HPC) technology is becoming increasingly important and widely used in modern life, such as in medical technology development like cancer drug development, or in the automatic sensing and detection computing of self-driving cars. As a result of these applications in the aforementioned technological fields, data center traffic is also increasing.

[0004] To improve data network bandwidth and address the demand pressure of data centers, silicon photonics solutions combining various advanced packaging technologies have emerged.

[0005] Currently, optical communication within data centers primarily relies on pluggable devices as fiber optic connection interfaces to achieve photoelectric or electro-optical conversion between the transmitter and receiver. Within the data center architecture, almost all switches, routers, and nodes require pluggable devices. For large data centers, the required number of pluggable devices is enormous, placing a heavy burden on the system and increasing transmission latency and power consumption. More importantly, if future transmission rate requirements reach 1.6Tb / s, 3.2Tb / s, or even higher, pluggable devices will also be performance-limited. Therefore, how to utilize optical communication principles and how to modify the packaging structure to improve transmission bandwidth are pressing issues that the industry needs to address. [Summary of the Invention]

[0006] To solve the above problems, the present invention provides an electronic package comprising a carrier structure, an electronic component, a bridging element, a covering layer, and a photonic element. The carrier structure has a first surface and a second surface opposite to each other. The electronic component is disposed on the second surface of the carrier structure and electrically connected to the carrier structure. The bridging element is disposed on the second surface of the carrier structure and electrically connected to the carrier structure. The covering layer covers the electronic component and the bridging element. The photonic element is disposed on one surface of the covering layer and electrically connected to the bridging element.

[0007] The present invention further provides a method for manufacturing an electronic package, comprising: placing a carrier structure on a carrier, wherein the carrier structure has opposing first and second surfaces; disposing an electronic component on the second surface of the carrier structure to electrically connect the carrier structure; disposing a bridging element on the second surface of the carrier structure to electrically connect the carrier structure; forming a covering layer to cover the electronic component and the bridging element; and disposing a photonic element on one surface of the covering layer to electrically connect the bridging element.

[0008] The electronic package and manufacturing method of the present invention are to place the photonic element after the formation and polishing of the coating layer is completed, so as to avoid the coating layer covering the photonic element, thereby avoiding contamination or damage to the light emitter and light receiver of the photonic element. [Simplified Explanation of the Diagram]

[0009] Figures 1 to 6 are cross-sectional schematic diagrams of the electronic package and its manufacturing method of the present invention.

Implementation Method

[0010] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0011] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "above," "below," "one," "first," and "second" used in this specification are only for the convenience of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0012] Figures 1 to 6 are cross-sectional schematic diagrams of the manufacturing method of an electronic package according to an embodiment of the present invention.

[0013] First, as shown in FIG1, the support structure 11 is placed on the support member 14. Specifically, the support structure 11 has a first surface 11a and a second surface 11b opposite to each other. A plurality of conductors 12 are provided on the first surface 11a. Each conductor 12 is, for example, a conductive post or a conductive bump. The support structure 11 is placed on the support member 14 by means of the conductors 12 and adhesive 13.

[0014] The carrier structure 11 may be a packaging substrate, an interposer, or a circuit structure, which includes at least one insulating layer 111 and at least one circuit layer 112 bonded to the at least one insulating layer 111. For example, the material forming the circuit layer 112 is copper, while the material forming the insulating layer 111 may be polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials.

[0015] Due to the requirements of reducing line width, line spacing and thickness in product applications, the bearing structure 11 can be a coreless packaging substrate, interposer or circuit structure.

[0016] In addition, electronic components 15 are disposed on the second surface 11b of the support structure 11 to electrically connect to the support structure 11.

[0017] Electronic component 15 may be an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0018] The electronic component 15 has an active surface 15a and a non-active surface 15b, and the electronic component 15 is bonded to the second surface 11b of the support structure 11 by means of a plurality of first conductive elements 16 in a flip-chip manner, thereby electrically connecting the support structure 11. Each of the first conductive elements 16 may be formed of solder material or a conductive metal material.

[0019] As shown in Figure 2, the bridging element 21 is disposed on the second surface 11b of the bearing structure 11 to electrically connect the bearing structure 11.

[0020] In detail, the bridging element 21 may be an interposer or other circuit structure. The bridging element 21 has a first surface 21a and a second surface 21b opposite to each other, and includes a plurality of second conductive elements 211 disposed on the first surface 21a, a plurality of conductive contacts 212 disposed on the second surface 21b, and a plurality of conductive vias 213 disposed inside the bridging element 21. The plurality of conductive vias 213 electrically connect the plurality of second conductive elements 211 and the plurality of conductive contacts 212.

[0021] Each of the second conductive elements 211 may be formed of solder material or a conductive metal material. Each of the conductive contacts 212 and each of the conductive vias 213 may be made of copper or other conductive materials.

[0022] Then, the plurality of first conductive elements 16 and the plurality of second conductive elements 211 are covered with the first primer 22.

[0023] As shown in Figure 3, a covering layer 31 is formed on the supporting structure 11 to cover the electronic component 15 and the bridging component 21. The material forming the covering layer 31 is an insulating material, such as a polyimide (PI) or epoxy resin encapsulant or encapsulating material. The covering layer 31 can be formed by molding, lamination or coating.

[0024] As shown in FIG4, the coating layer 31 is ground so that one surface of the coating layer 31 (e.g., the upper surface 311 shown in FIG4 and FIG5) is flush with one surface of each conductive contact 212 (e.g., the upper surface 2121 shown in FIG4) and the plurality of conductive contacts 212 are exposed.

[0025] As shown in FIG5, a photonic element 51 is disposed on one surface (e.g., upper surface 311) of the cladding layer 31 to electrically connect to the bridging element 21. For example, the photonic element 51 may be a light emitting die (LED).

[0026] The photonic element 51 has a first surface 51a and a second surface 51b opposite to each other, and is electrically connected to the bridging element 21 via the first surface 51a and a plurality of third conductive elements 52, and the second surface 51b is provided with a plurality of light emitters / light receivers 511. In other words, each element 511 can be a light emitter or a light receiver.

[0027] Each of the third conductive elements 52 may be formed of solder material or a conductive metal material. The plurality of light emitters / receivers 511 may be the emitting end and receiving end of the photonic element 51, respectively.

[0028] Alternatively, the plurality of third conductive elements 52 can be covered with a second primer 53.

[0029] As shown in Figure 6, remove the adhesive 13 and the carrier 14 to complete the electronic package 1.

[0030] The electronic package 1 includes a conductor 12, a carrier structure 11, an electronic component 15, a first conductive element 16, a bridging element 21, a second conductive element 211, a first primer 22, an encapsulation layer 31, a photonic element 51, a third conductive element 52, and a second primer 53.

[0031] The bridging element 21 is electrically connected to the circuit layer 112 of the carrier structure 11 through a plurality of second conductive elements 211, and is electrically connected to the photonic element 51 through a plurality of conductive contacts 212 and a plurality of third conductive elements 52. The circuit layer 112 of the carrier structure 11 is electrically connected to the electronic element 15, the bridging element 21, and the plurality of conductors 12. Therefore, the plurality of conductors 12 are electrically connected to the electronic element 15 through the circuit layer 112 of the carrier structure 11 and the first conductive element 16, and are electrically connected to the photonic element 51 through the circuit layer 112 of the carrier structure 11, the bridging element 21, and the third conductive element 52.

[0032] Since the photonic element 51 is provided with a plurality of light emitters / receivers 511, and the light emitters / receivers 511 must not be contaminated or damaged, a bridging element 21 is provided between the support structure 11 and the photonic element 51 so that the photonic element 51 can be disposed on the cladding layer 31 without being covered by the cladding layer 31, thereby avoiding contamination or damage to the light emitters / receivers 511. Conversely, if the photonic element 51 is directly disposed on the support structure 11 and then molded, the cladding layer 31 will cover the light emitters / receivers 511. When the cladding layer 31 is then ground to remove the cladding layer 31 on the light emitters / receivers 511, the light emitters / receivers 511 will be damaged.

[0033] In summary, the electronic package 1 and its manufacturing method of the present invention utilize the bridging element 21 to elevate the photonic element 51, and after the formation and polishing of the cladding layer 31 are completed, the photonic element 51 is then placed to avoid the cladding layer 31 covering the photonic element 51, thereby avoiding contamination or damage to the light emitter / receiver 511. Furthermore, the electronic package 1 of the present invention can be manufactured using existing semiconductor packaging processes, without the need to develop special processes or purchase special equipment, thus reducing production costs.

[0034] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

Claims

1. An electronic package, comprising: The load-bearing structure has a first surface and a second surface that are opposite to each other; Electronic components are disposed on the second surface of the support structure and are electrically connected to the support structure; A bridging element is disposed on the second surface of the support structure to electrically connect the support structure, wherein the bridging element is an interposer or other circuit structure; a cladding layer is formed on the second surface of the support structure to cover the electronic component and the bridging element; and a photonic element has opposing first and second surfaces, with the first surface of the photonic element disposed on one surface of the cladding layer and electrically connected to the bridging element, and a plurality of light emitters and a plurality of light receivers are disposed on the second surface of the photonic element.

2. The electronic package as described in claim 1, wherein, The supporting structure is a packaging substrate, interposer, or circuit structure without a core layer.

3. The electronic package as described in claim 1, further comprising: A plurality of conductors are disposed on the first surface of the carrier structure to electrically connect the electronic component through the carrier structure, and to electrically connect the photonic component to the bridging element through the carrier structure.

4. The electronic package as described in claim 3, wherein, The support structure includes at least one insulating layer and at least one circuit layer bonded to the at least one insulating layer, and the at least one circuit layer is electrically connected to the electronic component, the bridging element and the plurality of conductors.

5. The electronic package as described in claim 1, wherein, The electronic component has an active surface and a non-active surface, and the electronic component is electrically connected to the second surface of the carrier structure by means of a plurality of first conductive elements in a flip-chip manner.

6. The electronic package as described in claim 1, wherein, The bridging element has a first surface and a second surface opposite to each other. A plurality of second conductive elements are provided on the first surface of the bridging element, and a plurality of conductive contacts are provided on the second surface of the bridging element. A plurality of conductive vias are provided in the bridging element, and the plurality of conductive vias electrically connect the plurality of second conductive elements and the plurality of conductive contacts.

7. The electronic package as described in claim 6, wherein, The bridging element is electrically connected to the carrier structure through the plurality of second conductive elements, and is electrically connected to the photonic element through the plurality of conductive contacts.

8. The electronic package as described in claim 6, wherein, The surface of the coating layer is flush with one of the surfaces of each of the conductive contacts, thereby exposing the plurality of conductive contacts.

9. The electronic package as described in claim 1, wherein, The photonic element is electrically connected to the bridging element via the first surface and a plurality of third conductive elements.

10. A method for manufacturing an electronic package, comprising: A carrier structure is placed on a carrier member, wherein the carrier structure has opposing first and second surfaces; an electronic component is disposed on the second surface of the carrier structure to electrically connect the carrier structure; a bridging element is disposed on the second surface of the carrier structure to electrically connect the carrier structure, wherein the bridging element is an interposer or other circuit structure; a cladding layer is formed on the second surface of the carrier structure to cover the electronic component and the bridging element; and a photonic element having opposing first and second surfaces is disposed on the first surface of one surface of the cladding layer and electrically connected to the bridging element, wherein a plurality of light emitters and a plurality of light receivers are provided on the second surface of the photonic element.

11. The method for manufacturing an electronic package as described in claim 10, wherein, The supporting structure is a packaging substrate, interposer, or circuit structure without a core layer.

12. The method for manufacturing an electronic package as described in claim 10, wherein, The first surface of the support structure is provided with a plurality of conductors, which are electrically connected to the electronic component through the support structure and electrically connected to the photonic component through the support structure and the bridging element.

13. The method for manufacturing an electronic package as described in claim 12, wherein, The support structure includes at least one insulating layer and at least one circuit layer bonded to the at least one insulating layer, and the at least one circuit layer is electrically connected to the electronic component, the bridging element and the plurality of conductors.

14. The method for manufacturing an electronic package as described in claim 10, wherein, The electronic component has an active surface and a non-active surface, and the electronic component is electrically connected to the second surface of the carrier structure by means of a plurality of first conductive elements in a flip-chip manner.

15. The method for manufacturing an electronic package as described in claim 10, wherein, The bridging element has a first surface and a second surface opposite to each other. A plurality of second conductive elements are provided on the first surface of the bridging element, and a plurality of conductive contacts are provided on the second surface of the bridging element. A plurality of conductive vias are provided in the bridging element, and the plurality of conductive vias electrically connect the plurality of second conductive elements and the plurality of conductive contacts.

16. The method for manufacturing an electronic package as described in claim 15, wherein, The bridging element is electrically connected to the carrier structure through the plurality of second conductive elements, and is electrically connected to the photonic element through the plurality of conductive contacts.

17. The method of manufacturing the electronic package as described in claim 15 further includes: The coating layer is ground so that its surface is flush with the surface of each of the conductive contacts, thus exposing the plurality of conductive contacts.

18. The method for manufacturing an electronic package as described in claim 10, wherein, The photonic element is electrically connected to the bridging element via the first surface and a plurality of third conductive elements.

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