Substrate separation device

Abstract

This invention provides a substrate separation apparatus capable of accurately separating bonded substrates. The substrate separation apparatus 1 of one embodiment includes: a holding unit 10 for holding a bonded substrate S formed by bonding a pair of substrates; a rotation drive unit 122 for rotating the holding unit 10; a nozzle 30 for separating the bonded substrate S by ejecting fluid toward the outer periphery of the rotating bonded substrate S; a nozzle moving unit 40 for moving the nozzle 30; an imaging unit for capturing an image of the outer peripheral surface CS of the bonded substrate S held by the holding unit 10; and a control device 100 for controlling the nozzle moving unit 40. Furthermore, the control device 100 controls the height adjustment mechanism 43 of the nozzle moving unit 40 to align the height position of the nozzle 30 with the position of the separation surface RS of the bonded substrate S detected based on the image captured by the camera 431.

Description

Substrate separation device The present invention relates to a substrate separation device. In the manufacturing process of a three-dimensional semiconductor device, by using a technique for separating a bonded substrate formed by bonding two substrates, a layer formed on one substrate is replicated onto the other substrate, thereby forming a uniform thin film. As a technique for separating such substrates, the following technique has been proposed: the front and back surfaces of the bonded substrate are adsorbed and held in a manner of being clamped by a pair of holding parts (holders), and while rotating it, high-pressure water (water jet) is supplied from a nozzle toward a separation surface exposed at the outer periphery of the bonded substrate, thereby separating the bonded substrate by utilizing the wedge effect of the fluid. [Prior art documents] [Patent documents] [Patent document 1] Japanese Patent Laid-Open No. 11-005064 [Problems to be solved by the invention] In order to uniformly separate the bonded substrate, it is necessary to always correctly bring the fluid into contact with the separation surface. If the fluid detaches from the separation surface, the separation process based on the wedge effect cannot be performed, and the progress of the separation process within the surface of the bonded substrate will vary, resulting in defects such as cracks or notches. Therefore, it is required to accurately detect the separation surface in a direction orthogonal to the surface of the bonded substrate. The present invention is made to solve the above-described problems, and an object thereof is to provide a substrate separation device capable of accurately separating a bonded substrate. [Means for solving the problems] The substrate separation device according to an embodiment of the present invention is characterized by having: a holding part that holds a bonded substrate formed by bonding a pair of substrates; a rotation driving part that rotates the holding part; a nozzle that separates the bonded substrate by ejecting a fluid toward the outer periphery of the rotating bonded substrate; a nozzle moving part that moves the nozzle; an imaging part that captures an image of the outer peripheral surface of the bonded substrate held by the holding part; and a control device that controls the nozzle moving part. The control device controls the nozzle moving part so that the height position of the nozzle is aligned with the position of the separation surface of the bonded substrate detected based on the image captured by the imaging part. [Effects of the invention] By the embodiment of the present invention, the separation of the bonded substrate can be accurately performed. The substrate separation device of the embodiment will be described with reference to the drawings. Furthermore, the drawings are schematic diagrams, and dimensions, ratios, etc. of each part include parts exaggerated for easy understanding. As shown in FIG. 1, the substrate separation device 1 is a device that separates the bonded substrate S by ejecting a fluid from the nozzle 30. In FIG. 1, the holding part 210 and the placing part 220 located in the foreground are omitted. Furthermore, in the following description, the direction along the rotation axis of the bonded substrate S is set as the Z direction, in the plane perpendicular thereto, the direction in which the nozzle 30 ejects the fluid is set as the Y direction, and the direction orthogonal thereto is set as the X direction. The rotation plane of the bonded substrate S is parallel to the XY plane. In the present embodiment, the Z direction is the vertical direction and the XY direction is the horizontal direction, but the installation direction of the substrate separation device 1 is not limited thereto. [Bonded Substrate] The bonded substrate S is a circular substrate formed by bonding the first substrate Sa and the second substrate Sb. The first substrate Sa has a bonding surface Sa1, a surface Sa2 on the opposite side thereof, and an outer peripheral surface Sa3 connecting the bonding surface Sa1 and the surface Sa2. The second substrate Sb has a bonding surface Sb1, a surface Sb2 on the opposite side thereof, and an outer peripheral surface Sb3 connecting the bonding surface Sa1 and the surface Sa2. That is, the bonded substrate S has a first surface Sa2 and a second surface Sb2, which are a pair of circular surfaces and are on the opposite sides of the first substrate Sa and the second substrate Sb. Hereinafter, the surface Sa2 is set as the first surface of the bonded substrate S, and the surface Sb2 is set as the second surface of the bonded substrate S. In addition, as shown in FIG. 14(a), the surface obtained by observing the concave portion formed by bonding the first substrate Sa and the second substrate Sb from the outer peripheral surface CS side of the bonded substrate S is called the separation surface RS. The outer peripheral surface CS of the bonded substrate S is composed of the outer peripheral surface Sa3 of the first substrate Sa, the separation surface RS, and the outer peripheral surface Sb3 of the second substrate Sb. The first substrate Sa is, for example, a substrate having a porous layer formed on the surface of a semiconductor wafer and further having a single crystal Si layer formed thereon. The second substrate Sb is, for example, a substrate having a single crystal Si layer formed on the surface of a semiconductor wafer. By bonding such a first substrate Sa and a second substrate Sb with an insulating layer formed on the first substrate Sa or the second substrate Sb, a bonded substrate S is formed. Furthermore, in the following description, even for the bonded substrate S in which the first substrate Sa and the second substrate Sb are separated, as long as the bonding surfaces Sa1 and Sb1 are in a state of overlapping, it is also set as the bonded substrate S. [Substrate Separation Device] The substrate separation device 1 separates the first substrate Sa of the bonded substrate S from the porous layer and forms a multilayer single crystal Si layer on the second substrate Sb. As shown in FIG. 1, the substrate separation device 1 has a holding part 10, a positioning part 20, a nozzle 30, a nozzle moving part 40, and a control device 100. [Holding Unit] The holding unit 10 holds both surfaces (Sa2 and Sb2) of the bonded substrate S and rotates it. The holding unit 10 includes a first holder 110 and a second holder 120. (First Holding Unit) The first holder 110 includes a first holding portion 111 and a support mechanism 112. The first holding portion 111 is a circular plate body with a diameter smaller than the diameter of the surface of the bonded substrate S. The support mechanism 112 is connected to the center of the surface of the first holding portion 111 via a support shaft in the Z direction, and supports the first holding portion 111 so that it can rotate with its center as the rotation center Ct. In this embodiment, the support shaft is connected to a drive source that rotates a second holding portion 121 described later via a pulley and a timing belt, and rotates synchronously with the second holding portion 121. In this embodiment, the surface of the first holding portion 111 fixed to the support mechanism 112 faces upward, and the opposite surface faces downward. Furthermore, although not shown, suction holes that open on the surface in contact with the bonded substrate S are formed in the first holding portion 111. By connecting an exhaust device to the suction holes, one surface (the surface Sa2 of the first substrate Sa) of the bonded substrate S can be suction-held using negative pressure. (Second Holder) The second holder 120 includes a second holding portion 121, a rotation drive portion 122, and a loading / unloading drive portion 123. The second holding portion 121 is a circular plate body with the same diameter as the first holding portion 111. The rotation drive portion 122 rotates the bonded substrate S. The drive shaft in the Z direction of the rotation drive portion 122 is connected to the center of the second holding portion 121, and supports the second holding portion 121 so that it can rotate. The rotation drive portion 122 has a motor that rotates the second holding portion 121 as a drive source. The drive shaft is the rotation shaft of the motor, and the second holding portion 121 rotates around the rotation center Ct by the operation of the motor. In this embodiment, the surface of the second holding portion 121 mounted on the rotation drive portion 122 faces downward, and the opposite surface faces upward and faces the first holding portion 111. That is, the first holding portion 111 and the second holding portion 121 are arranged to face each other separately with the rotation center Ct being the same. Furthermore, although not shown, suction holes that open on the surface in contact with the bonded substrate S are formed in the second holding portion 121. By connecting an exhaust device to the suction holes, the other surface (the surface Sb2 of the second substrate Sb) of the bonded substrate S can be suction-held using negative pressure. The loading and unloading drive unit 123 holds the bonded substrate S in the holding unit 10. The loading and unloading drive unit 123 moves the second holding unit 121 in a direction of contacting / separating from the first holding unit 111. The loading and unloading drive unit 123 has a cylinder as a drive source. The bonded substrate S is inserted between the separated first holding unit 111 and second holding unit 121, and the loading and unloading drive unit 123 can clamp and hold the bonded substrate S between the first holding unit 111 and the second holding unit 121 by bringing the second holding unit 121 closer to the first holding unit 111. [Positioning Unit] The positioning unit 20 positions the central axis Cs of the bonded substrate S on the central axis Ct based on the holding unit 10 (refer to FIGS. 2 and 3). That is, the central axis Cs of the bonded substrate S disposed between the first holder 110 and the second holder 120 is aligned with the central axes Ct of the first holder 110 and the second holder 120. The positioning unit 20 has a gripping portion 210, a placing portion 220, an axial drive portion 230, and an opening / closing drive portion 240 (refer to FIG. 1). (Gripping Portion) The gripping portion 210 grips the outer periphery of the bonded substrate S. The outer periphery of the bonded substrate S is the side surface of the outer edge along the circumference. A plurality of gripping portions 210 are arranged at equal intervals at positions surrounding the holding unit 10, that is, at positions along the outer periphery of the bonded substrate S held by the holding unit 10. The gripping portions 210 of the present embodiment are four upright pins. (Placing Portion) The placing portion 220 places the bonded substrate S. The placing portion 220 has a placing surface for supporting the bonded substrate S and is provided with the respective gripping portions 210. Four placing portions 220 are provided corresponding to the gripping portions 210 one by one. In the present embodiment, the placing portion 220 is used to place the surface of the bonded substrate S held by the second holder 120, that is, the surface Sb2 of the second substrate Sb. (Axial Drive Portion) The axial drive portion 230 moves the gripping portion 210 and the placing portion 220 in an axial direction parallel to the rotation axis of the holding unit 10. The axial drive portion 230 has a support column portion 231, a biasing portion 232, and an absorbing portion 233. The support column portion 231 is a member that supports the gripping portion 210 and the placing portion 220 at the front end and stands upright. The biasing portion 232 is configured to be movable in the axial direction by a drive mechanism such as a cam rotated by using a cylinder, for example. The absorbing portion 233 is interposed between the biasing portion 232 and the support column portion 231, transmits the movement of the biasing portion 232 to the support column portion 231, and absorbs the vibration at the time of separation of the bonded substrate S. The absorbing portion 233 may be any component that can absorb the vibration at the time of separation, and thus, for example, a compression spring, a leaf spring, an elastic body of rubber or resin, a cylinder, etc. can be used. (Opening and Closing Driving Unit) The opening and closing driving unit 240 moves the holding unit 210 and the placement unit 220 between a closed position where the holding unit 210 is in contact with the outer periphery of the bonding substrate S and an open position away from the outer periphery of the bonding substrate S. The position of the holding unit 210 is set such that the center Cs of the bonding substrate S is positioned at the rotation center Ct by being in the closed position. The opening and closing driving unit 240 has an arm 241 that moves in the radial direction of the bonding substrate S (the centripetal direction and the centrifugal direction with respect to the rotation center Ct), for example, by a driving mechanism such as a cam rotated by a cylinder (not shown). A support column portion 231 is connected to the arm 241 so as to be movable in the axial direction. (Nozzle) The nozzle 30 separates the bonding substrate S into a substrate Sa and a substrate Sb by ejecting a fluid toward the outer periphery of the rotating bonding substrate S. The nozzle 30 of the present embodiment ejects a fluid toward the outer periphery of the bonding substrate S held and rotated by the holding unit 10. The nozzle 30 of the present embodiment is an ejection device that injects a high-pressure fluid toward an object. The nozzle 30 is connected via a pipe, a valve, etc. to a supply device 31 including a pump that supplies a high-pressure fluid. The nozzle 30 is configured to be able to eject a high-pressure fluid, i.e., water (e.g., water spray), has a very small aperture diameter (0.1 mm to 1 mm), and the wall thickness at the tip of the nozzle 30 has a thickness capable of withstanding high-pressure water (1 cm to 5 cm). In addition, due to the inclination of the hole axis of the fluid ejection hole provided in the nozzle 30 or the inclination of the nozzle 30 itself, etc., the fluid may be ejected from the nozzle 30 at a specified inclination. That is, the fluid may be ejected from the nozzle 30 at an angle θ° with respect to the horizontal direction. As shown in FIG. 3, the axis of the nozzle 30 is provided on the extension line of the radius of the positioned bonding substrate S, and the ejection port at the tip of the nozzle 30 faces the outer periphery of the bonding substrate S. Therefore, the nozzle 30 ejects the fluid in a direction parallel to the rotation plane of the bonding substrate S and toward the center Cs. Among them, the holding unit 210 is provided at a position that does not overlap with the extension line of the axis of the nozzle 30. (Nozzle Moving Unit) As shown in FIGS. 4 and 5, the nozzle moving unit 40 changes the ejection direction of the fluid of the nozzle 30 between a first direction along the tangent of the outer periphery of the bonding substrate S and a second direction toward the central axis Cs of the bonding substrate S. The orientations of the first direction and the second direction are parallel. That is, the nozzle 30 changes its position from the separation start position [a] in FIG. 4 to the central separation position [b] without changing the ejection orientation of the fluid, thereby ejecting the fluid in two directions. The nozzle moving unit 40 of the present embodiment can move the nozzle 30 in the direction along the outer periphery of the bonding substrate S. The nozzle moving unit 40 has a contact / separation mechanism 41, a position adjustment mechanism 42, and a height adjustment mechanism 43. (Contact / Separation Mechanism) The contact / separation mechanism 41 moves the nozzle 30 between a standby position where the nozzle outlet is separated from the outer periphery of the bonded substrate S and an ejection position where it approaches the outer periphery and can separate the bonded substrate S by ejecting a fluid. That is, the nozzle 30 is moved in the Y direction by the contact / separation mechanism 41. The contact / separation mechanism 41 can use, for example, a ball screw mechanism driven by a servo motor. (Position Adjustment Mechanism) The position adjustment mechanism 42 moves the nozzle 30 between a separation start position [a] along the tangent to the outer periphery of the bonded substrate S held and rotated by the holding portion 10 and a center separation position [b] away from the center axis Cs of the bonded substrate S. That is, the nozzle 30 is moved in the X direction by the position adjustment mechanism 42. The position adjustment mechanism 42 can use, for example, a ball screw mechanism driven by a servo motor. As shown in FIG. 4, by the contact / separation mechanism 41 and the position adjustment mechanism 42, the nozzle 30 can move from the separation start position [a] to the center separation position [b] along an arc trajectory. Thereby, the fluid ejected from the nozzle 30 is blown onto a partial area of the outer periphery of the bonded substrate S shown as Ra in FIG. 4. The so-called partial area is an area including an arc with a central angle of 90 degrees on the outer periphery of the bonded substrate S. Furthermore, since the bonded substrate S rotates at least during the separation of the outer periphery, even if the fluid is ejected onto a partial area of the outer periphery, the ejected fluid can reach the entire circumference. Moreover, as the separated portion of the bonded substrate S shown by the hatching in FIG. 4 expands, the fluid also reaches the central portion of the bonded substrate S from the gap between the first substrate Sa and the second substrate Sb. When the bonded substrate S is separated at the center, as shown in FIG. 5, the nozzle 30 is located at the center separation position [b]. Before the separation of the bonded substrate S starts and after the separation is completed, the nozzle 30 is moved to a standby position [c] separated from the outer periphery of the bonded substrate S by the contact / separation mechanism 41 and the position adjustment mechanism 42. The interval d between the nozzle outlet of the nozzle 30 positioned in the first direction and the outer periphery of the bonded substrate S is the same as the interval d between the nozzle outlet of the nozzle 30 positioned in the second direction and the outer periphery of the bonded substrate S. Thereby, the nozzle outlets of the nozzle 30 in the first direction and the nozzle 30 in the second direction can be made as close as possible to the outer periphery of the bonded substrate S. (Height adjustment mechanism) The height adjustment mechanism 43 moves the nozzle 30 in the height direction (Z-axis direction). The height adjustment mechanism 43 can use, for example, a cylinder. That is, the nozzle 30 is moved in the Z direction by the height adjustment mechanism 43. The separation surface RS of the rotating bonded substrate S is slightly moved up and down in height due to the holding condition or deflection of the bonded substrate S. In addition, when the fluid is ejected from the nozzle 30 at a prescribed inclination, when moving the nozzle 30 in the Z-axis direction, in order to make the fluid (hereinafter referred to as the ejected fluid) correctly touch the separation surface RS, it is necessary to adjust the height of the nozzle 30 in the up and down direction in consideration of the inclination of the fluid ejected from the nozzle 30. The height adjustment mechanism 43 includes a camera 431 as an imaging unit, and moves the nozzle 30 in the height direction based on the detection result of the camera 431. The camera 431 can use a camera with a depth of field of 35 μm to 50 μm. As shown in FIG. 4, the camera 431 is located at a position 90° relative to the axis of the nozzle 30 and on the extension line of the diameter of the bonded substrate S. In the XY plane, the axis of the nozzle 30 coincides with the ejection direction of the ejected fluid ejected from the nozzle 30. The installation position of the camera 431 can be on a fixed stand, or can be installed on a lifting workbench, etc., so as to be adjustable according to the height of the bonded substrate S held by the holding unit 10. In order to suppress the influence of water droplets during shooting, it is ideal for the camera 431 to maintain a certain distance from the ejected fluid. Near the camera 431, a lamp 433 as an irradiation unit is provided parallel to the optical axis of the camera 431, and the irradiation light from the lamp 433 is irradiated in a direction orthogonal to the ejected fluid. The camera 431 detects the position of the ejected fluid by detecting the reflected light (regular reflection light) that is regularly reflected on the surface of the ejected fluid of the irradiated irradiation light. In addition, the camera 431 is installed at a position where it can photograph the outer peripheral surface CS including the separation surface RS of the bonded substrate S to be carried in. When the bonded substrate S is carried in and held by the holding unit 10, the focal position of the camera 431 is located on the separation surface RS of the bonded substrate S. As the camera 431, it can be a camera that only photographs a point on the outer peripheral surface CS of the stopped bonded substrate S, but preferably a camera that can photograph the entire circumference of the outer peripheral surface CS of the bonded substrate S rotating at a low speed at a prescribed angular interval or continuously. That is, the outer peripheral surface CS of the bonded substrate S held by the holding unit 10 may not be held at the same height due to reasons such as the dimensional accuracy of the holding unit 10 or the bonded substrate S, and it is conceivable that there will be a slight offset in the circumferential direction. Therefore, in the case of performing the separation operation while rotating the bonded substrate S, by adjusting the height of the nozzle 30 according to the rotation angle and height of the bonded substrate S, the fluid can be reliably ejected onto the separation surface RS. [Control Device] The control device 100 is a device that controls the substrate separation device 1, and controls the operations of the holding unit 10, the positioning unit 20, the nozzle 30, and the nozzle moving unit 40. The control device 100 can be realized, for example, by a dedicated electronic circuit or a computer operating according to a prescribed program. More specifically, the control device 100 controls the rotation and movement of the second holding unit 121 by controlling the rotation driving unit 122 and the loading and unloading driving unit 123. In addition, the control device 100 controls the movement of the holding unit 210 and the placement unit 220 by controlling the axial driving unit 230 and the opening and closing driving unit 240. Furthermore, the control device 100 controls the ejection of fluid from the nozzle 30 by controlling the supply device 31, and controls the movement of the nozzle 30 by controlling the contact / separation mechanism 41 and the position adjustment mechanism 42 provided in the nozzle moving unit 40. Next, the alignment of the position of the nozzle 30 with the separation surface RS of the bonded substrate S will be described. (1) Calculation of the movement amount of the nozzle 30 based on the inclination of the ejected fluid The control device 100 detects the inclination of the fluid ejected from the nozzle 30 based on the image captured by the camera 431. Based on the detected inclination of the ejected fluid and the distance from the ejection port of the nozzle 30 to an arbitrary processing position where the ejected fluid is supplied on the separation surface RS, the nozzle moving unit 40 is controlled so that the height position of the nozzle 30 aligns with the height position of the separation surface RS. Therefore, as shown in FIG. 6, the control device 100 has a photography processing unit 101, and the photography processing unit 101 executes the photography timing of the camera 431, the rotation control of the bonded substrate S, the movement control of the nozzle 30, and the like. Before the bonded substrate S is loaded, the photography processing unit 101 moves the nozzle 30 to a position where the ejected fluid can be photographed by the camera 431, and photographs the ejected fluid. The captured image is stored in the image storage unit 102a in the storage unit 102. The inclination detection unit 103 detects the inclination of the ejected fluid based on the captured image, and stores the detected inclination in the inclination storage unit 102b. The calculation unit 104 calculates the movement amount of the nozzle 30 based on the detected inclination of the ejected fluid and the distance from the ejection port of the nozzle 30 to an arbitrary processing position on the separation surface RS, so that the height position of the nozzle 30 aligns with the height of the separation surface RS. That is, the movement amount of the nozzle 30 in the height direction is calculated to position the nozzle 30 at the position where the ejected fluid ejected from the nozzle 30 touches the separation surface RS. (2) Height correction control based on the change in the height of the separation surface The control device 100 corrects the calculated movement amount of the nozzle 30 using the correction amount based on the height of the separation surface RS that moves up and down according to the rotation of the bonded substrate S, and controls the movement of the nozzle 30 in the height direction. In order to calculate the correction amount of the height of the separation surface RS that moves up and down based on the rotation of the bonding substrate S, the imaging processing unit 101 captures the outer peripheral surface CS of the bonding substrate S held and rotated by the holding unit 10 more than once in a state before the ejection of the fluid. The storage unit 102 has a separation surface height storage unit 102c that stores the rotation angle of the bonding substrate S at the time of imaging in association with the position of the separation surface RS of the bonding substrate S detected from the image captured by the camera 431. The separation surface height detection unit 105 detects the change in the position of the separation surface RS of the bonding substrate S with a specific position of the bonding substrate S as a reference. For example, when the bonding substrate S is a semiconductor wafer, the notch position is used as a reference. With the notch position as a reference, the change amount of the height of the separation surface RS of the bonding substrate S is detected in association with the separation angle from the notch position. In order to detect the change amount of the height of the separation surface RS of the bonding substrate S, it is necessary to detect the height position of the separation surface RS for more than one full rotation amount, but by using the notch position as a reference, it is possible to easily determine the amount of one full rotation of the rotating bonding substrate S. The control device 100 has an arithmetic unit 104 that calculates the movement amount of the nozzle 30 based on the height of the separation surface RS and the rotation angle of the bonding substrate S with reference to the values stored in the separation surface height storage unit 102c. The arithmetic unit 104 refers to the inclination of the ejected fluid stored in the inclination storage unit 102b and calculates the movement amount of the nozzle 30 based on the inclination of the ejected fluid and the distance from the ejection port of the nozzle 30 to an arbitrary processing position on the separation surface RS. The nozzle height correction unit 106 calculates the correction amount of the height of the nozzle 30 based on the change in the height of the separation surface RS. The nozzle height correction unit 106 outputs a control signal to the nozzle movement unit 40 based on the movement amount of the nozzle 30 calculated by the arithmetic unit 104 and the calculated correction amount of the height of the nozzle 30. The control device 100 has a separation state determination unit 107 that determines the separation state based on the image captured by the camera 431. The separation state determination unit 107 determines the progress of the separation process by comparing the reference images in each stage of the separation state pre-stored in the storage unit 102 with the captured image based on the camera 431. More specifically, when the separation process is performed, the fluid invades the bonding surfaces Sa1 and Sb2 of the first substrate Sa and the second substrate Sb, and the recess between the first substrate Sa and the second substrate Sb becomes larger, that is, the separation surface RS becomes larger. Therefore, by comparing the reference image in the separation stage of the outer peripheral portion of the bonded substrate S with the captured image based on the camera 431, if the images are the same, it can be determined that the outer peripheral portion is separated. In addition, a method of calculating the distance between the two substrates in the bonded substrate S based on the captured image and determining the degree of separation or the completion of separation when the preset threshold is exceeded can also be adopted. Based on this determination result, the control device 100 can control the movement of the nozzle 30, or the injection time and intensity of the ejected fluid ejected from the nozzle 30. [Operation] Based on FIGS. 1 to 6, the operation of the substrate separation device 1 as described above will be described with reference to the flowchart of FIG. 7 and the explanatory diagrams of FIGS. 8(A) to 8(H). Furthermore, Ph1 in FIGS. 8(A) to 8(H) is the reference position of the lower surface of the first holder 110, and Ph2 is the transfer position that becomes the position of the lower surface of the placement unit 220 when the bonded substrate S is transferred between the placement unit 220 and the robotic arm M. Ps1 is the separation position that becomes the height position of the lower surface of the second substrate Sb when the bonded substrate S is separated by ejecting the fluid from the nozzle 30 while being clamped by the first holder 110 and the second holder 120 and rotated. Ps2 is the receiving position that becomes the position of the upper surface of the placement unit 220 when the positioning unit 20 receives the bonded substrate S from the holding unit 10. First, before the substrate separation device 1 loads the bonded substrate S, it detects the inclination of the ejected fluid (S101). FIG. 9 is a flowchart showing the process of detecting the inclination of the ejected fluid in S101. In order to detect the inclination of the ejected fluid, the imaging processing unit 101 moves the nozzle 30 to the imaging position (S201). As shown in FIG. 10, the imaging position is the position where the ejected fluid overlaps with the focal position of the camera 431. After the nozzle 30 moves, the imaging processing unit 101 captures the fluid ejected from the nozzle 30 by the camera 431 (S202, S203). FIG. 11(a) is an explanatory diagram showing the case of reflected light from the surface of the ejected fluid. As shown in FIG. 11(a), the irradiated light from the lamp 433 indicated by the black arrow, which is irradiated onto the central portion of the ejected fluid, is specularly reflected, but the irradiated light diffuses in the peripheral portion. For example, in the case of an ejected fluid of Φ100 μm, the irradiated light is specularly reflected at about 20 μm from the central portion. Therefore, when the ejected fluid irradiated by the lamp 433 is photographed by the camera 431, as shown in the captured image of FIG. 11(b), the central portion appears bright (high brightness) and linearly, and the peripheral portion becomes a dark (low brightness) image. That is, by irradiating the ejected fluid with the lamp 433, an image with a clear contrast between the central portion and the peripheral portion can be photographed. The photographed image is stored in the image storage unit 102a (S204). Next, the tilt detection unit 103 detects the tilt based on the photographed image (S205). The tilt detection unit 103 detects the tilt of the ejected fluid based on the captured image stored in the image storage unit 102a, and stores the detected tilt in the tilt storage unit 102b (S206). As shown in FIGS. 11(a) and 11(b), since the central portion of the ejected fluid appears linearly, if the tilt angle of the straight line is detected, the tilt of the ejected fluid can be detected. As described above, since the contrast between the central portion and the peripheral portion of the captured image of the ejected fluid is clear, the tilt can be correctly detected. By going through the above S201 to S206, the step (S101) of detecting the tilt of the ejected fluid is completed. At this time, the second holder 120 is located at a position separated from the first holder 110 (FIG. 8(A)). In addition, the holding portion 210 and the mounting portion 220 are located at the transfer position Ph2 and are in the open position. The robotic arm M of the transfer device moves in the bonding substrate S and mounts the bonding substrate S on the mounting portion 220 (FIG. 8(B), step S102). The bonding substrate S is lifted by the lifting of the holding portion 210 (FIG. 8(C)), and then the second holder 120 is lifted to contact the lower surface of the second substrate Sb, and the bonding substrate S is slightly separated from the mounting portion 220 by lifting the bonding substrate S (FIG. 8(D), step S103). As shown in FIG. 3, the outer periphery of the bonded substrate S is gripped by moving the gripping portion 210 to the closed position, and the central axis Cs of the bonded substrate S is positioned on the central axis Ct ((E) in FIG. 8, step S104). Thereafter, the gripping portion 210 moves to the open position ((F) in FIG. 8), and together with the placing portion 220, retracts to the transfer position Ph2 ((G) in FIG. 8, step S105). Then, the second holder 120 ascends, causing the bonded substrate S to contact the first holder 110 and be held in a clamped manner, positioning the bonded substrate S at the separation position Ps1, and performing suction holding by the negative pressure of the suction holes ((H) in FIG. 8, step S106). In this state, by rotating the second holder 120, the bonded substrate S is rotated together with the first holder 110 (rotation step: step S107). When the bonded substrate S is held and rotated by the holding portion 10, due to the holding condition or flexure of the bonded substrate S, the height of the separation surface RS located on the side surface of the bonded substrate S may sometimes move slightly up and down. FIG. 12 is a graph showing the height of the separation surface RS with respect to the rotation angle. In FIG. 12, between the rotation angles of 200 degrees to 400 degrees, 600 degrees to 800 degrees, 800 degrees to 1000 degrees, and 1200 degrees to 1400 degrees, the rotation angles represented by the straight lines extending in the longitudinal axis direction are the rotation angles at which notches appear in the rotation of the bonded substrate S for more than one rotation. That is, the displacement of the height between the notch at a certain rotation angle and the next appearing notch (between the straight lines) can be determined as the displacement of the height for one rotation. As shown in FIG. 12, every time the bonded substrate S rotates one circle, the height of the separation surface RS is displaced within ±150 μm with the reference height being 0. The control device 100 corrects the position of the nozzle 30 based on the displacement of the height of the separation surface RS, and controls so that the ejected fluid does not separate from the separation surface RS. FIG. 13 is a flowchart showing the process for determining the height of the nozzle 30 based on the change in the separation surface height. When the bonded substrate S is held by the first holder 110 and the second holder 120, the imaging processing unit 101 rotates the bonded substrate S while photographing the outer peripheral surface CS for one round by the camera 431 (S301). As the bonded substrate S rotates, the height of the separation surface RS moves up and down. By adjusting the focal length of the camera 431 or the position of the camera 431, even if the separation surface RS moves up and down, the separation surface RS does not go out of the viewing angle of the camera 431. FIG. 14(b) is an explanatory diagram showing the case of reflected light from the bonded substrate S. As shown in FIG. 14(b), among the irradiation lights from the lamp 433, on the outer peripheral surface CS of the bonded substrate S indicated by the black arrow, the irradiation light is specularly reflected at the portion where the illumination light is perpendicularly incident, but the irradiation light is diffused at the curved surface portion where the outer peripheral surface CS of the bonded substrate S is connected to the surface Sa2. Therefore, when photographing the bonded substrate S irradiated by the lamp 433, as in the captured image of FIG. 14(c), the central portions of the outer peripheral surface Sa3 of the first substrate Sa and the outer peripheral surface Sb3 of the second substrate Sb in the outer peripheral surface CS of the bonded substrate S become specular reflection surfaces where the irradiation light is specularly reflected, and specularly reflected light is detected and becomes a bright (high-brightness) image. In contrast, the central portion including the separation surface RS between the first substrate Sa and the second substrate Sb becomes a dark (low-brightness) image. That is, by irradiating the outer peripheral surface CS of the bonded substrate S with the lamp 433, an image with a clear contrast between the outer peripheral surface Sa3 of the first substrate Sa and the outer peripheral surface Sb3 of the second substrate Sb and the central portion sandwiched between the two can be photographed. The photographed image is stored in the image storage unit 102a (S302). Next, the separation surface height detection unit 105 detects the change in the height of the separation surface RS based on the photographed image (S303). The separation surface height detection unit 105 detects the separation surface RS between two specular reflection surfaces. Specifically, a region with a width of several μm starting from the center between two linear regions where specularly reflected light is detected is detected as the separation surface RS. The separation surface height detection unit 105 can accurately detect the height of the separation surface RS by using a captured image with high contrast. The separation surface height detection unit 105 sends the detected height information of the separation surface RS to the separation surface height storage unit 102c. The separation surface height storage unit 2c stores the height of the separation surface RS detected from the captured image in correspondence with the rotation angle of the bonded substrate S (S304). The arithmetic unit 104 calculates the movement amount of the nozzle 30 based on the relationship between the inclination of the ejected fluid and the distance from the ejection port of the nozzle 30 to an arbitrary processing position on the separation surface RS (S305). Then, the nozzle height correction unit 106 calculates the height correction amount of the nozzle 30 (S306). A control signal is output to the nozzle movement unit 40 based on the movement amount of the nozzle 30 calculated by the arithmetic unit 104 and the calculated height correction amount of the nozzle 30 (S307). By going through the above S301 to S307, the height position of the nozzle 30 is determined. Subsequently, the nozzle 30 moves from the standby position [c] shown in FIG. 4 and is positioned at the separation start position [a] (step 108). Based on the height position determined in S307, the height position of the nozzle 30 is also adjusted. Then, the nozzle 30 sprays a fluid toward the outer periphery of the bonded substrate S (separation step: step S109). Thereby, the separation of the bonded substrate S is started (step S110). The nozzle 30 moves in a manner following the separation surface RS of the bonded substrate S (displacement step: step S111). Here, as described above, as the bonded substrate S rotates or the separation part in the separation surface RS migrates, the distance between the nozzle 30 and the separation surface RS or the height of the separation surface RS changes. By changing the height of the nozzle 30 based on these changes, the ejected fluid ejected from the nozzle 30 correctly touches the separation surface RS, and the separation step is performed. Then, when the separation is performed and the bonding surfaces Sa1 and Sb1 of the part corresponding to the central axis Cs are separated (YES in step S112), the fluid ejection from the nozzle 30 is stopped (step S113). By stopping the rotation of the first holder 110 and the second holder 120, the rotation of the bonded substrate S is stopped (step S114). After that, the negative pressure of the first holder 110 and the second holder 120 is released, the second holder 120 descends to transfer the bonded substrate S to the placement unit 220, the robot arm M of the transfer device pushes up the bonded substrate S from the lower surface side of the bonded substrate S, and the robot arm M carries out the bonded substrate S (refer to (B) of FIG. 8, (A) of FIG. 8, step S115). [Effect] (1) The substrate separation device 1 of the present embodiment has: a holding unit 10 for holding a bonded substrate S formed by bonding a pair of substrates; a rotation driving unit 122 for rotating the holding unit 10; a nozzle 30 for separating the bonded substrate S by spraying a fluid toward the outer periphery of the rotating bonded substrate S; a nozzle moving unit 40 for moving the nozzle 30; an imaging unit for photographing an image of the outer peripheral surface CS of the bonded substrate S held by the holding unit 10; and a control device 100 for controlling the nozzle moving unit 40. Moreover, the control device 100 controls the height adjustment mechanism 43 of the nozzle moving unit 40 so that the height position of the nozzle 30 is aligned with the position of the separation surface RS of the bonded substrate S detected based on the image photographed by the camera 431. Therefore, it is possible to accurately detect the separation surface RS of the bonded substrate S in the height direction, enabling the fluid to always correctly contact the separation surface RS and reliably performing the separation process based on the wedge effect. As a result, the separation within the surface of the bonded substrate S can be carried out uniformly, and a uniform thin film can be formed on the substrate by replicating the layer formed on one of the substrates to the other substrate without generating defects such as cracks or notches in the substrate. (2) The camera 431 captures images of the outer peripheral surface CS of the bonded substrate S held and rotated by the holding unit 10 for more than one full rotation. The control device 100 stores the rotation angle of the bonded substrate S in association with the position of the separation surface RS of the bonded substrate S detected based on the images captured by the camera 431, and controls the height adjustment mechanism 43 of the nozzle moving unit 40 to align the height position of the nozzle 30 with the position of the separation surface RS. Therefore, even when the height of the bonded substrate S slightly varies depending on the rotation angle, it is possible to accurately determine the position of the separation surface RS of the bonded substrate S detected based on the images captured by the camera 431, and the ejected fluid can be accurately aligned with the separation surface RS over the entire outer periphery of the bonded substrate S. (3) The camera 431 captures images of the ejected fluid ejected from the nozzle 30. The control device 100 detects the inclination of the ejected fluid ejected from the nozzle 30 based on the images captured by the camera 431, and controls the height adjustment mechanism 43 of the nozzle moving unit 40 based on the detected inclination of the ejected fluid and the distance from the ejection port of the nozzle 30 to the separation surface RS to align the height position of the nozzle 30 with the height of the separation surface RS. That is, the movement of the nozzle 30 in the height direction is controlled to position the nozzle 30 at the position where the ejected fluid ejected from the nozzle 30 contacts the separation surface RS. Therefore, even if the fluid ejected from the nozzle 30 is inclined, it is possible to control the height adjustment mechanism 43 to align the height position of the nozzle 30 with the separation surface RS so that the fluid can be accurately ejected onto the separation surface RS considering the inclination amount. As a result, not only will the fluid not separate from the separation surface RS and prevent the separation of the bonded substrate S, but also the concern about the ejected fluid colliding with other parts of the bonded substrate S and damaging the substrate can be eliminated. In particular, since the ejected fluid changes to a misty state at locations where the distance from the ejection position of the nozzle 30 increases, it is necessary to bring the nozzle 30 closer to the separation surface RS. However, depending on the location, the distance between the fluid and the processing point based on the nozzle 30 changes, and the inclination angle of the ejected fluid also changes accordingly. Therefore, detecting the inclination of the ejected fluid and appropriately setting the height of the nozzle 30 respectively is extremely effective for performing an appropriate separation operation. (4) There is a lamp 433 that irradiates illumination light in a direction coaxial with the camera 431 for the fluid ejected onto the outer peripheral surface CS of the bonding substrate S or ejected from the nozzle 30. Therefore, the camera 431 can directly capture the reflected light in the coaxial direction where the illumination light from the light irradiation unit touches near the separation surface RS or the fluid ejected from the nozzle 30 and is reflected. Therefore, compared with the case of shooting using scattered light such as natural light or indoor light, a clearer image of the separation surface RS can be obtained, and the alignment accuracy of the nozzle 30 is improved. In addition, since a large amount of irradiation light or reflected light can be obtained by the lamp 433, the accuracy or contrast of the captured image is also improved, and image analysis when detecting the position of the separation surface RS or the fluid ejected from the nozzle 30 becomes easier. (5) The camera 431 shoots the outer peripheral surface CS of the bonding substrate S after the start of separation and before the completion of separation, and the control device 100 determines the separation status based on the image captured by the imaging unit. Therefore, in addition to determining the alignment of the nozzle 30, the camera 431 can also determine the separation status of the bonding substrate S. Based on the determination result, the control device 100 controls the ejection time, intensity, position, etc. of the fluid, whereby the separation process of the bonding substrate S can be implemented more accurately. [Modification Example] The present embodiment can also be applied to the following modification examples. (1) As shown in FIG. 15, in front of the lens of the camera 431, between the camera 431 and the bonding substrate S and closer to the camera 431 side than the ejection port of the nozzle 30, a plate 432 that prevents water droplets from adhering to the camera 431 can be provided. As the plate 432, preferably a transparent glass or plastic plate, etc. By providing such a plate 432 for preventing water droplet adhesion, the adhesion of water droplets to the imaging unit (camera 431) can be prevented. In particular, in the case of determining the separation status based on the image captured by the imaging unit as described above, even when the imaging unit shoots the ejected fluid for the alignment of the nozzle 30 while the bonding substrate S is held by the holding unit 10, water droplets can be prevented from adhering to the imaging unit from the ejected fluid, and the subsequent shooting of the separation surface RS of the bonding substrate S will not be hindered. Furthermore, the plate 432 can be provided integrally with the camera 431 or can be provided as an independent member. (2) When the inclination generated before the ejected fluid reaches the separation surface RS from the front end of the nozzle 30 is almost negligible in the separation operation due to factors such as the shape of the nozzle 30, it is not necessary to detect the inclination angle of the ejected fluid by the image analysis described in the embodiment. In addition, when the inclination angle is obtained in advance by simulation or calculation, the value can be reflected in the correction amount in the height direction between the separation surface RS obtained by the camera 431 and the nozzle 30. In this case, it is also not necessary to detect the inclination angle of the ejected fluid by the image analysis described in the embodiment. (3) When the displacement amount at the rotation angle of the bonding substrate S is almost negligible in the separation operation due to factors such as the thickness, material, and diameter of the bonding substrate S, it is also possible to determine the movement amount of the nozzle 30 by photographing only one point of the bonding substrate S without photographing the outer peripheral surface CS for more than one week. (4) According to the brightness around the separation surface RS, there is no need for the lamp 433 that irradiates illumination light to the outer periphery of the bonding substrate S or the fluid ejected from the nozzle 30. In addition, when it is possible to determine the position of the separation surface RS or the inclination angle of the ejected fluid based on the captured image even without making the illumination light coaxial with the optical axis of the camera 431, the installation position of the lamp 433 can also be appropriately changed. (5) As the camera 431, in addition to using a normal camera that photographs visible light, it is also possible to use a camera that obtains an image of the separation surface RS or the fluid by means of infrared rays, radiation, etc. In addition to using a camera that photographs a still image, it is also possible to use a camera that photographs a dynamic image like a video camera. In addition, the number of cameras 431 is not limited. When multiple parts of the outer peripheral portion of the bonding substrate S are detected, multiple cameras 431 can be provided according to the detection positions. (6) Instead of or in parallel with determining the separation status based on the image captured by the camera 431, it is also possible to determine the progress of the separation of the bonding substrate S according to the time obtained in advance by experiments or simulations, and move the nozzle 30. (7) When determining the separation status, the timing of imaging by the camera 431 is preferably at least one point or multiple points after the start of separation and before the completion of separation, and it is also possible to photograph after the completion of separation. In addition, it is also possible to determine the start and completion of the separation of the bonding substrate S based on the movement position of the nozzle 30, etc., and determine whether the separation operation is completed based on the captured images before and after that. (8) Although the illustrated embodiment rotates the bonding substrate S horizontally, it is also possible to rotate the bonding substrate S vertically by holding the bonding substrate S from the left and right by the holding portion 10. In this case, the nozzle moving portion 40 moves the nozzle 30 in the horizontal direction, that is, in the direction parallel to the rotation center axis of the bonding substrate S, instead of the height direction adjustment described in the embodiment. [Other Embodiments] The present invention is not limited to the above embodiments, and also includes other forms shown above. In addition, the present invention also includes forms that combine all or any combinations of the above embodiments and other forms. Furthermore, within the scope not departing from the scope of the invention, various omissions, substitutions, and changes can be made to these embodiments, and such modifications are also included in the present invention. 1: Substrate separation device 10: Holding part 20: Positioning part 30: Nozzle 31: Supply device 40: Nozzle moving part 41: Contact / separation mechanism 42: Position adjustment mechanism 43: Height adjustment mechanism 100: Control part 101: Photography processing part 102: Storage part 102a: Image storage part 102b: Tilt storage part 102c: Separation surface height storage part 103: Tilt detection part 104: Separation surface height detection part 105: Operation part 106: Nozzle height correction part 107: Separation condition determination part 110: First fixture 111: First holding part 112: Support mechanism 112a: Support shaft 120: Second fixture 121: Second holding part 122: Rotation drive part 122a: Drive shaft 123: Loading / unloading drive part 210: Gripping part 220: Placement part 230: Axial drive part 231: Support column part 232: Biasing part 233: Absorbing part 240: Opening / closing drive part 241: Arm 431: Camera 432: Plate 433: Lamp Cs: Central axis CS: Outer peripheral surface Ct: Rotation center d: Interval Ph1: Reference position Ph2: Handover position Ps1: Separation position Ps2: Receiving position Ra, RS: Separation surface S: Bonded substrate S101, S102, S103, S104, S105, S106, S107, S108, S109, S110, S111, S112, S113, S114, S115, S201, S202, S203, S204, S205, S206, S301, S302, S303, S304, S305, S306, S307: Steps Sa: First substrate Sa1, Sb1: Bonding surface Sa2: First surface Sa3, Sb3: Outer peripheral surface Sb: Second substrate Sb2: Second surface M: Robot arm X, Y, Z: Directions [a]: Separation start position [b]: Central separation position [c]: Standby position FIG. 1 is a side view showing a substrate separation device according to an embodiment. FIG. 2 is a plan view showing a bonded substrate and a positioning portion when the bonded substrate is carried in. FIG. 3 is a plan view showing the bonded substrate and the positioning portion when the bonded substrate is positioned before the separation step. FIG. 4 is a plan view showing the displacement of the nozzle to the standby position, the separation start position, and the center separation position. FIG. 5 is a plan view showing the bonded substrate, the positioning portion, and the nozzle at the time of center separation of the bonded substrate. FIG. 6 is a block diagram showing the structure of the control device. FIG. 7 is a flowchart showing the sequence of separating the bonded substrate according to the embodiment. FIGS. 8(A) to 8(H) are explanatory views showing the carry-in to the separation step of the bonded substrate according to the embodiment. FIG. 9 is a flowchart showing the process of detecting the tilt of the nozzle. FIG. 10 is a plan view showing the positional relationship between the nozzle and the camera when detecting the tilt of the nozzle. FIG. 11(a) is an explanatory view showing the case of reflected light from the ejected fluid, and FIG. 11(b) is a view showing an example of an image captured by the camera. FIG. 12 is a chart showing the detected height change of the separation surface. FIG. 13 is a flowchart showing the process of determining the height of the nozzle. FIGS. 14(a) is an explanatory view showing the outer peripheral surface and the separation surface observed from the side of the bonded substrate, FIG. 14(b) is an explanatory view showing the case of reflected light from the bonded substrate, and FIG. 14(c) is a view showing an example of an image captured by the camera. FIG. 15 is a schematic view showing the positional relationship of the bonded substrate, the nozzle, and the camera in a modified example. 1: Substrate separation device 10: Holding portion 20: Positioning portion 30: Nozzle 40: Nozzle moving portion 41: Contact / separation mechanism 42: Position adjustment mechanism 43: Height adjustment mechanism 100: Control device 110: First fixture 111: First holding portion 112: Support mechanism 120: Second fixture 121: Second holding portion 122: Rotary drive portion 123: Loading / unloading drive portion 210: Gripping portion 220: Placement portion 230: Axial drive portion 231: Support column portion 232: Biasing portion 233: Absorbing portion 240: Opening / closing drive portion 241: Arm 431: Camera 433: Lamp Ct: Center of rotation S: Bonding substrate Sa: First substrate (substrate) Sa1, Sb1: Bonding surfaces Sa2: First surface (surface) Sb: Second substrate (substrate) Sb2: Second surface (surface / bonding surface) X, Y, Z: Directions

Claims

1. A substrate separation apparatus, characterized by comprising: a holding portion for holding both sides of a bonded substrate formed by bonding a pair of substrates; a rotation drive portion for rotating the holding portion; a nozzle for separating the bonded substrates by ejecting fluid toward the outer periphery of the rotating bonded substrates; a nozzle moving portion for moving the nozzle; an imaging portion for capturing images of the outer periphery of the bonded substrates held by the holding portion and capturing images of the fluid ejected from the nozzle; and a control device for controlling the nozzle moving portion, wherein the control device detects the tilt of the fluid ejected from the nozzle based on the images captured by the imaging portion, and controls the nozzle moving portion based on the detected tilt of the fluid and the distance from the nozzle outlet to the separation surface, so that the height position of the nozzle is aligned with the height of the separation surface.

2. A substrate separation apparatus, characterized by comprising: a holding portion for holding both sides of a bonded substrate formed by bonding a pair of substrates; a rotation drive portion for rotating the holding portion; a nozzle for separating the bonded substrates by ejecting fluid toward the outer periphery of the rotating bonded substrates; a nozzle moving portion for moving the nozzle; an imaging portion for capturing an image of the outer peripheral surface of the bonded substrate held by the holding portion; a control device for controlling the nozzle moving portion; and a light irradiation portion for irradiating illumination light toward the outer periphery of the bonded substrates or the fluid ejected from the nozzle in a direction coaxial with the imaging portion, wherein the control device controls the nozzle moving portion to align the position of the nozzle with the position of the separation surface of the bonded substrates detected based on the image captured by the imaging portion.

3. A substrate separation apparatus, characterized by comprising: a holding portion for holding both sides of a bonded substrate formed by bonding a pair of substrates; a rotation drive portion for rotating the holding portion; a nozzle for separating the bonded substrates by ejecting fluid toward the outer periphery of the rotating bonded substrates; a nozzle moving portion for moving the nozzle; an imaging portion for capturing an image of the outer peripheral surface of the bonded substrates held by the holding portion; and a control device for controlling the nozzle moving portion to align the position of the nozzle with the position of the separation surface of the bonded substrates detected based on the image captured by the imaging portion, wherein... The camera unit takes pictures of the outer peripheral surface of the bonding substrate after separation begins and before separation is completed, and the control device determines the separation status based on the images taken by the camera unit.

4. The substrate separation apparatus as described in any one of claims 1 to 3, wherein, The camera unit takes a picture of the outer peripheral surface of the bonding substrate, which is held and rotated by the holding unit, for more than one revolution. The control device stores the rotation angle of the bonding substrate in association with the position of the separation surface of the bonding substrate detected from the image taken by the camera unit, and controls the nozzle moving unit to align the height position of the nozzle with the position of the separation surface.

5. The substrate separation apparatus as described in claim 2 or 3, wherein, The camera unit captures images of the fluid ejected from the nozzle. The control device detects the tilt of the fluid ejected from the nozzle based on the images captured by the camera unit. Based on the detected tilt of the fluid and the distance from the nozzle outlet to the separation surface, the nozzle moving part is controlled to align the height of the nozzle with the height of the separation surface.

6. The substrate separation apparatus as claimed in claim 1 or 3, comprising a light irradiation unit that irradiates illumination light onto the outer periphery of the bonded substrate or onto fluid ejected from the nozzle in a direction coaxial with the imaging unit.

7. The substrate separation apparatus as described in claim 1 or 2, wherein, The camera unit takes pictures of the outer peripheral surface of the bonding substrate after separation begins and before separation is completed, and the control device determines the separation status based on the images taken by the camera unit.

8. The substrate separation apparatus as claimed in claim 1, wherein, The camera unit captures images of the fluid ejected between the camera unit and the adhesive substrate while the adhesive substrate is held in the holding portion. A plate is included between the camera unit and the adhesive substrate, and further from the nozzle outlet on the adhesive substrate side, to prevent water droplets from adhering to the camera unit.

Images