Integrated circuit package capable of independently assembling passive device and manufacturing method thereof

Abstract

This invention provides an integrated circuit package capable of independently mounting passive components and a method for manufacturing the same. The integrated circuit package capable of independently mounting passive components includes: an integrated circuit for mounting on a circuit board; and a heat dissipation structure, independently manufactured, having: a first plate disposed on the integrated circuit and in thermal contact with it; and a cavity located on one side of the first plate, the cavity having at least one opening for mounting the passive component; wherein the passive component is inserted into the cavity through the opening of the heat dissipation structure during assembly and is electrically connected to the circuit board or the integrated circuit through an electrical conductor of the passive component; wherein heat generated by the integrated circuit is dissipated through the heat dissipation structure.

Description

[Technical Field]

[0001] This invention relates to an integrated circuit package for independently assembling passive components and its manufacturing method, particularly to an integrated circuit package for independently assembling passive components where the heat dissipation structure is independently manufactured and the passive components can be independently assembled, and its manufacturing method. [Previous Technology]

[0002] As shown in Figure 1, US Patent 11770916 discloses an inductor structure 1, in which a metal strip 3 made of a high thermal conductivity material is wrapped around the outer portion of the inductor. This metal strip 3 is designed to enhance thermal conductivity between the inductor and the integrated circuit chip, thereby improving heat dissipation efficiency. The metal strip 3 can be made of high thermal conductivity materials such as copper, silver, or aluminum, and its width can be adjusted as needed to ensure effective thermal connection with the underlying integrated circuit chip.

[0003] However, this prior art has some obvious drawbacks. First, the metal strip 3 is installed by wrapping the inductor after the inductor is manufactured. Since the metal strip 3 needs to be precisely bent to fit the shape of the inductor, it is difficult to ensure a perfect fit between the metal strip 3 and the inductor surface during the manufacturing process. Especially at the bends, it is difficult to achieve a precise 90-degree bend, which leads to uneven or excessive gaps between the metal strip 3 and the inductor, thus affecting the heat conduction efficiency.

[0004] Secondly, a thermal interface material (TIM) is needed to connect the metal strip 3 to the inductor. Since the thermal conductivity of TIM is relatively low (typically 1 to 2 W / mK), and there is a gap between the start and end points of the metal strip 3, this further increases the thermal resistance and weakens the overall heat transfer efficiency. Furthermore, because the metal strip 3 mainly wraps around the side of the inductor, heat needs to be transferred along a longer path. This lengthens the heat transfer path from the integrated circuit chip to the heat sink, increasing the thermal resistance and thus affecting the heat dissipation effect.

[0005] In addition, if you want to change the inductor supplier or use inductors of different specifications and sizes, you often need to redevelop or customize a new metal strip 3, which lacks manufacturing flexibility, and the process is complicated and costly.

[0006] In view of the shortcomings of the prior art, the present invention provides a design for an integrated circuit package that can independently assemble passive components, which can greatly improve heat dissipation and manufacturing flexibility through a simple manufacturing process. [Summary of the Invention]

[0007] From one perspective, the present invention provides an integrated circuit package in which a passive component can be independently mounted, comprising: an integrated circuit for mounting on a circuit board; and a heat dissipation structure, which is independently manufactured and has: a first plate disposed on the integrated circuit and in thermal contact with the integrated circuit; and a cavity located on one side of the first plate, the cavity having an opening for mounting a passive component; wherein the passive component is inserted into the cavity through the opening of the heat dissipation structure during assembly and is electrically connected to the circuit board or the integrated circuit through an electrical conductor of the passive component; wherein the heat generated by the integrated circuit is propagated through the heat dissipation structure.

[0008] From another perspective, the present invention provides a method for manufacturing an integrated circuit package in which passive components can be independently assembled, comprising: mounting an integrated circuit on a circuit board; pre-manufacturing a heat dissipation structure having a first plate and a cavity, the cavity being located on one side of the first plate and having at least one opening; mounting the heat dissipation structure onto the integrated circuit, so that the first plate and the integrated circuit make thermal contact; inserting at least one passive component into the cavity through the at least one opening of the cavity, and electrically connecting the circuit board or the integrated circuit through one of the electrical conductors of the passive component.

[0009] In one embodiment, the passive element includes an inductor.

[0010] In one embodiment, the material of the heat dissipation structure is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc or stainless steel.

[0011] In one embodiment, the process of forming the heat dissipation structure includes: casting, milling, turning, stamping or forging.

[0012] In one embodiment, the material of the heat dissipation structure is a non-metallic material, including aluminum nitride, silicon carbide or graphite.

[0013] In one embodiment, the first plate is bonded to the top surface of the integrated circuit through a thermal interface material.

[0014] In one embodiment, the passive element may be inserted into the cavity through the at least one opening or removed from the cavity through the at least one opening.

[0015] In one embodiment, the upper surface of the passive element is flush or substantially flush with the top surface of the heat dissipation structure, so that the passive element and the heat dissipation structure are simultaneously in contact with one of the external heat sinks.

[0016] In one embodiment, the heat dissipation structure further includes a first plate and at least one second plate, which are connected to each other by one or more metal pillars, so that the plurality of passive components are stacked on the first plate and the at least one second plate to accommodate the plurality of passive components or improve heat dissipation efficiency.

[0017] In one embodiment, the passive component is further connected to the circuit board through a heat-conducting pillar, wherein the heat-conducting pillar is made of a formable metal, including copper, silver, gold or aluminum.

[0018] Compared with the prior art, the present invention has obvious advantages. First, in the manufacturing process, since the heat dissipation structure of the present invention is made "independently" and a gap is reserved to accommodate inductors of various brands or standard sizes, it is not necessary to redesign the entire heat dissipation metal part when replacing the inductor, which simplifies the development process of different inductor designs and different electrical specifications.

[0019] Secondly, the heat dissipation structure of the present invention can be designed as a flat or multi-layered extended metal part that fits the top surface of the IC to effectively guide the heat generated by the IC to the external heat dissipation path (such as Heat Sink, mechanical housing, etc.).

[0020] In addition, if the inductor also generates heat, the heat dissipation structure of the present invention can simultaneously contact the upper surface or side of the inductor to further conduct heat out; or the tolerance can be compensated by thermally conductive adhesive (TIM, Solder) to improve heat transfer efficiency.

[0021] Furthermore, the heat dissipation structure of the present invention can be in the form of a single layer, a double layer, or an extension both vertically and horizontally, and can even stack a second or third layer of passive components.

[0022] In summary, the present invention overcomes the shortcomings of prior art in terms of manufacturing difficulty, heat conduction path, thermal resistance, and heat dissipation efficiency, simplifying the manufacturing process and increasing flexibility. Through innovative structural design and manufacturing methods, the present invention provides a more effective heat dissipation solution, manufacturing process, and manufacturing flexibility, particularly suitable for high power density and high heat electronic components, improving the reliability and performance of devices.

[0023] The following detailed description of specific embodiments will make it easier to understand the purpose, technical content, features and effects of the present invention.

Implementation Method

[0040] The drawings in this invention are all schematic and are mainly intended to show the interrelationship between the components of the electronic components. The shapes and sizes are not drawn to scale.

[0041] Figures 2A and 2B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package capable of independently mounting passive components according to the present invention. As shown in Figure 2A, the integrated circuit package 10 capable of independently mounting passive components includes an integrated circuit 101 and a heat dissipation structure 102. The integrated circuit 101 is mounted on a circuit board 11. The heat dissipation structure 102 is independently manufactured and has a first plate 1021 and a cavity 1022. The first plate 1021 is disposed on the integrated circuit 101 and is in thermal contact with the integrated circuit 101. The cavity 1022 is located on the other side of the first plate 1021 opposite to the integrated circuit 101, and the cavity 1022 has at least one opening for mounting a passive component 12.

[0042] As further shown in Figure 2A, the cavity 1022 in the independently mountable passive component integrated circuit package 10 includes an opening that provides space for mounting the passive component 12. In actual assembly, the passive component 12 can be inserted through the opening of the cavity 1022 and mounted on top of the first-layer plate 1021. The electrical conductor 121 of the passive component 12 extends to the circuit board 11 to complete the electrical connection with the circuit board 11. Alternatively, the electrical conductor 121 can also be optionally directly connected to the electrical terminals of the integrated circuit 101.

[0043] As shown in Figure 2B, the first plate 1021 of the heat dissipation structure 102 directly contacts the top surface of the integrated circuit 101 to absorb the heat generated by the integrated circuit 101. This heat is transferred to the cavity 1022 via the metal material of the heat dissipation structure 102 and further dispersed through thermal contact with the passive component 12. This design not only improves heat dissipation performance but also simplifies the replacement process of the passive component 12, meeting the requirements of different applications for inductance parameters.

[0044] In addition, Figures 2A and 2B also show another electronic component 13, which is optionally mounted on the circuit board 11 and electrically or mechanically integrated with the integrated circuit 101 or the passive component 12. This modular design allows for flexible configuration of different components according to application requirements, further enhancing the applicability and functional flexibility of the integrated circuit package.

[0045] In one embodiment, the passive element 12 is an inductor.

[0046] In one embodiment, the heat dissipation structure 102 is made of a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc or stainless steel.

[0047] In one embodiment, the process of forming the heat dissipation structure 102 includes: casting, milling, turning, stamping or forging.

[0048] In one embodiment, the heat dissipation structure 102 is made of a non-metallic material, including aluminum nitride, silicon carbide or graphite.

[0049] In one embodiment, the first plate 1021 is bonded to the top surface of the integrated circuit 101 through a thermal interface material.

[0050] In one embodiment, the passive element 12 may be inserted into the cavity 1022 through the opening or removed from the cavity 1022 through the opening.

[0051] It should be noted that thermal interface material (TIM) is a common material in electronic devices, primarily used to fill the gaps between heat-generating components and heat dissipation structures. Because the contact surfaces between heat-generating components (such as integrated circuits and power semiconductor devices) and heat dissipation structures are usually not perfectly flat, air gaps are generated between these irregular surfaces, leading to reduced heat conduction efficiency. Thermal interface materials are used to fill these gaps, reduce thermal resistance, and allow heat to be transferred more effectively from the heat-generating components to the heat dissipation structure. There are various types of thermal interface materials, including common ones such as thermally conductive adhesives, thermally conductive pads, thermally conductive tapes, thermally conductive gels, thermally conductive phase change materials, and metal-based thermal interface materials. The thermal conductivity of thermal interface materials is approximately 1 to 2 W / m·K.

[0052] Figures 3A, 3B and 3C respectively show a front sectional view, a side sectional view and a perspective view of another embodiment of an integrated circuit package 20 for independently assembling passive components according to the present invention.

[0053] As shown in Figure 3A, the integrated circuit package 20, which can be independently assembled with passive components, includes an integrated circuit 201 and a heat dissipation structure 202. The integrated circuit 201 is used to mount on the circuit board 11 and generate electrical signals and heat.

[0054] The heat dissipation structure 202 is manufactured independently and has a first plate 2021 and a cavity 2022. The first plate 2021 is disposed on the top surface of the integrated circuit 201 and makes thermal contact with the integrated circuit 201 through a layer of thermal interface material (not shown in the figure). The cavity 2022 is located on the other side of the first plate 2021 and has at least one opening for mounting the passive component 12.

[0055] As shown in Figure 3B, the electrical conductor 121 of the passive element 12 extends to the integrated circuit 201 to complete the electrical connection. This design allows the passive element 12 to effectively conduct heat and electrical signals while the electrical conductor 121 is in contact with the integrated circuit 201. In addition, the cavity 2022 is designed to accommodate passive elements 12 of different sizes, providing a high degree of assembly flexibility.

[0056] As shown in Figure 3C, the three-dimensional schematic diagram of the integrated circuit package 20 clearly shows the relative configuration of the heat dissipation structure 202 and the integrated circuit 201. The first plate 2021 of the heat dissipation structure 202 provides a wide and stable thermal contact area, ensuring that the heat generated by the integrated circuit 201 is effectively guided to the structure around the cavity 2022 and finally further dissipated by an external heat sink (not shown).

[0057] Furthermore, the electronic component 13 shown in Figure 3C can optionally be mounted on the circuit board 11 and electrically connected to the integrated circuit 201 or the passive component 12. This modular design further enhances the flexibility and applicability of the system design.

[0058] The design features in the above embodiments include: First, the heat dissipation structure 202 is manufactured independently and has a cavity 2022, which can adapt to various passive component specifications; Second, the first plate 2021 contacts the integrated circuit 201 through the thermal interface material, effectively improving heat dissipation efficiency; Third, the electrical conductor 121 of the passive component 12 is connected to the integrated circuit 201, providing reliable electrical performance; Fourth, the modular structure design allows for multi-layer assembly or component replacement to meet different application requirements.

[0059] FIG4 shows a front cross-sectional view of another embodiment of the independently mountable passive component integrated circuit package 30 according to the present invention. As shown in FIG4, the independently mountable passive component integrated circuit package 30 includes an integrated circuit 301 and a heat dissipation structure 302. The integrated circuit 301 is mounted on the circuit board 11 and electrically connected to the circuit board 11.

[0060] The heat dissipation structure 302 is manufactured independently and has a first plate 3021 and a cavity 3022. The first plate 3021 is disposed on the integrated circuit 301 and is in close contact with the top surface of the integrated circuit 301 through a layer of thermal interface material (not shown) to effectively conduct heat. The cavity 3022 is located above the first plate 3021 and forms a space for accommodating the passive component 12. The cavity 3022 has at least one opening, allowing the passive component 12 to be inserted into or removed from the cavity 3022 through the opening.

[0061] The electrical conductor 121 of the passive component 12 passes through the side of the first plate 3021 of the heat dissipation structure 302 and extends to the circuit board 11 to complete the electrical connection with the circuit board 11.

[0062] The heat dissipation structure 302 in this embodiment differs from the heat dissipation structure 202. Above the first plate 3021 is a completely open cavity, without any other parts of the heat dissipation structure 202, making it more adaptable to passive components 12 of different specifications. The size and shape of the first plate 3021 of this heat dissipation structure 302 can be adjusted according to application requirements to accommodate more types of passive components, such as inductors, capacitors, or other electronic components. Furthermore, the design of the cavity 3022 better supports the disassembly and assembly of the passive components 12, providing convenient maintenance and replacement. Moreover, the heat dissipation structure 302 is connected to the circuit board 11, allowing the heat generated by the integrated circuit 301 to be dissipated to the circuit board 11 through more conduction paths, achieving better heat dissipation.

[0063] As shown in Figure 4, another electronic component 13 is optionally disposed on the circuit board 11 and operates in cooperation with the integrated circuit 301 or the passive component 12. The layout of this electronic component 13, combined with the modular design of the heat dissipation structure 302, makes the overall package structure more flexible in functional design.

[0064] FIG5 shows a front cross-sectional view of another embodiment of an integrated circuit package 40 capable of independently mounting passive components according to the present invention. As shown in FIG5, the integrated circuit package 40 capable of independently mounting passive components includes an integrated circuit 401 and a heat dissipation structure 402. The integrated circuit 401 is mounted on a circuit board 11 and electrically connected to the circuit board 11.

[0065] The heat dissipation structure 402 is manufactured independently and has a first plate 4021 and a cavity 4022. The first plate 4021 is disposed on the top surface of the integrated circuit 401 and is in close contact with the integrated circuit 401 through a layer of thermal interface material (not shown) to effectively conduct heat. The cavity 4022 is located above the first plate 4021 and has at least one opening for accommodating the passive component 12. The design of this opening allows the passive component 12 to be inserted into or removed from the cavity 4022, achieving greater assembly and maintenance flexibility.

[0066] The electrical conductor 121 of the passive component 12 extends through the side of the first plate 4021 of the heat dissipation structure 402 and to the circuit board 11 to complete the electrical connection with the circuit board 11. This design not only ensures stable electrical performance, but also conducts heat out of the passive component 12 through the upper surface of the heat dissipation structure 402, achieving more efficient heat dissipation performance.

[0067] As further shown in Figure 5, the heat dissipation structure 402 is connected to the circuit board 11, forming an additional heat conduction path. When the integrated circuit 401 generates heat, this heat can be conducted to the cavity 4022 via the first plate 4021 or directly to the circuit board 11 through the heat dissipation structure 402. This design significantly enhances the dispersion and heat dissipation effect, helping to improve the stability and lifespan of the integrated circuit package 40.

[0068] The modular design of this embodiment further enhances the application flexibility and versatility of the heat dissipation structure 402. The cavity 4022 of the heat dissipation structure 402 can be adjusted in shape and size according to application requirements to accommodate passive components 12 of different specifications, such as inductors or capacitors. In addition, the detachable design of the cavity 4022 allows users to flexibly replace the passive components 12 according to actual needs, further improving maintenance efficiency.

[0069] Figure 6 shows a front cross-sectional view of another embodiment of an integrated circuit package 50 for independently assembling passive components according to the present invention.

[0070] As shown in Figure 6, the integrated circuit package 50, which can be independently assembled with passive components, includes an integrated circuit 501 and a heat dissipation structure 502. The integrated circuit 501 is mounted on the circuit board 11 and is electrically connected to the circuit board 11.

[0071] The heat dissipation structure 502 is manufactured independently and has a first plate 5021 and a cavity 5022. The first plate 5021 is disposed on top of the integrated circuit 501 and is in thermal contact with the integrated circuit 501 through a thermal interface material (not shown). The cavity 5022 is located above the first plate 5021 and has at least one opening for accommodating the passive component 12. This design allows the passive component 12 to be loaded or removed from the opening of the cavity 5022 to meet different application requirements.

[0072] The electrical conductor 121 of the passive component 12 passes through the first plate 5021 of the heat dissipation structure 502 and extends to the circuit board 11 to complete the electrical connection with the circuit board 11.

[0073] The design of the heat dissipation structure 502 enhances the overall thermal conductivity of the package. When the integrated circuit 501 generates heat, this heat can be transferred upwards to the passive component 12 and the area around the cavity 5022 via the first plate 5021, and can also be diffused outwards to the external environment through the sidewalls of the heat dissipation structure 502. In addition, the direct contact between the heat dissipation structure 502 and the circuit board 11 provides an additional heat conduction path, effectively improving heat dissipation efficiency and ensuring stable system operation.

[0074] The modular design in this embodiment allows the heat dissipation structure 502 to be adjusted according to application requirements to accommodate passive components 12 of different sizes and specifications. The open design of the cavity 5022 also supports the rapid replacement and maintenance of the passive components 12, further enhancing the flexibility and convenience of the system.

[0075] Figures 7A and 7B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 60 capable of independently mounting passive components according to the present invention. As shown in Figures 7A and 7B, the integrated circuit package 60 capable of independently mounting passive components includes an integrated circuit 601 and a heat dissipation structure 602. The integrated circuit 601 is mounted on a circuit board 11.

[0076] The heat dissipation structure 602 is manufactured independently and has a first plate 6021 and a cavity 6022. The first plate 6021 is disposed on the integrated circuit 601 and is in thermal contact with the top surface of the integrated circuit 601 through a layer of thermal interface material (not shown in the figure). The cavity 6022 is located above the first plate 6021, accommodates a plurality of passive components 12, and has at least one opening, allowing the passive components 12 to be inserted or removed from the cavity through the opening, so as to achieve greater assembly flexibility.

[0077] The passive component 12 includes an electrical conductor 121 that extends beyond the outer side of the first plate of the heat dissipation structure 602 and is connected to the heat-conducting pillar 14, thereby extending to the circuit board 11 to complete the electrical connection. The upper surface of the passive component 12 is substantially flush with the top surface of the heat dissipation structure 602, allowing the passive component 12 to contact an external heat sink (not shown in the figure) to further enhance heat dissipation efficiency.

[0078] The heat-conducting pillar 14 is disposed between the passive component 12 and the circuit board 11. Its material is a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, it also forms an additional heat conduction path from the integrated circuit 601 to the circuit board 11, then to the passive component 12 and the heat dissipation structure 602, significantly improving heat dissipation efficiency. Simultaneously, the modular design of the heat-conducting pillar 14 allows for adjustments to its number and layout according to the application requirements of different passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0079] The electronic component 13 is mounted on the circuit board 11 and is electrically connected to the circuit board 11 through the electrical conductor 131.

[0080] The embodiments shown in Figures 7A and 7B have the following features compared to other embodiments: First, the modular design of the heat dissipation structure 602 allows for the insertion and removal of multiple passive components 12; Second, the arrangement of the heat-conducting pillars 14 provides a flexible electrical, mechanical connection and heat dissipation solution.

[0081] Figures 8A and 8B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 70 for independently assembling passive components according to the present invention.

[0082] As shown in Figures 8A and 8B, the integrated circuit package 70, which can be independently assembled with passive components, includes two integrated circuits 701 and a heat dissipation structure 702. Both integrated circuits 701 are mounted on the circuit board 11.

[0083] The heat dissipation structure 702 is manufactured independently and includes a first plate 7021 and a cavity 7022. The first plate 7021 is disposed on the integrated circuit 701 and makes thermal contact with the top surface of the integrated circuit 701 through a thermal interface material (not shown in the figure). In this embodiment, the cavity 7022 is located above the first plate 7021 and has an opening to accommodate two passive components 12. Both passive components 72 can be inserted into or removed through the opening of the cavity 7022 to meet different application requirements.

[0084] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11 through the outside of the side of the first plate 7021 of the heat dissipation structure 702 and connected to the heat-conducting pillar 14 to complete the electrical connection. At the same time, the electrical conductor 121 ensures stable electrical performance between the passive component 12 and the circuit board 11.

[0085] The heat-conducting pillar 14 is disposed between the passive component 12 and the circuit board 11. Its material is a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, it also forms an additional heat conduction path from the integrated circuit 701 to the circuit board 11, then to the passive component 12 and the heat dissipation structure 702, significantly improving heat dissipation efficiency. Furthermore, the modular design of the heat-conducting pillar 14 allows for adjustments to its number and layout according to the application requirements of different passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0086] The electronic component 13 is mounted on the circuit board 11 and is electrically connected to the circuit board 11 through the electrical conductor 131.

[0087] As shown in Figures 8A and 8B, the heat dissipation structure 702 of this embodiment has a plurality of passive elements 12. The upper surface of the passive element 12 is approximately flush with the top surface of the heat dissipation structure 702, so that it can simultaneously contact an external heat sink (not shown in the figure) to further enhance the heat dissipation performance.

[0088] Figures 9A and 9B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 80 capable of independently assembling passive components according to the present invention.

[0089] As shown in Figures 9A and 9B, the integrated circuit package 80, which can be independently assembled with passive components, includes two integrated circuits 801 and a heat dissipation structure 802. The integrated circuits 801 are mounted on the circuit board 11.

[0090] The heat dissipation structure 802 has a first plate 8021 and a cavity 8022. The first plate 8021, in addition to being in thermal contact with the corresponding two integrated circuits 801, also has two electronic components 13 disposed thereon. The cavity 8022 is disposed on the first plate 8021 of the heat dissipation structure 802 and is used to accommodate multiple passive components 12. The cavity 8022 has at least one opening, allowing the assembly and disassembly of the passive components 12.

[0091] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11 through the outside of the side of the first plate 8021 of the heat dissipation structure 802 and connected to the heat-conducting pillar 14 to complete the electrical connection. At the same time, the electrical conductor 821 ensures stable electrical performance between the passive component 12 and the circuit board 11.

[0092] The heat-conducting pillar 14 is disposed between the passive component 12 and the circuit board 11. Its material is a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, it also forms an additional heat conduction path from the integrated circuit 801 to the circuit board 11, then to the passive component 12 and the heat dissipation structure 802, significantly improving heat dissipation efficiency. Simultaneously, the modular design of the heat-conducting pillar 14 allows for adjustments to its number and layout according to the application requirements of different passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0093] Electronic component 13 is mounted on circuit board 11, and its electrical conductor 131 is connected to circuit board 11 to complete the electrical connection.

[0094] In addition, the electrical conductors 131 of the two electronic components 13 on the first plate 8021 are connected to the circuit board 11 and / or the two electronic components 13 disposed on the circuit board 11 through the outside of the side of the first plate 8021 of the heat dissipation structure 802 and connected to the heat conduction column 14, so as to complete the electrical connection.

[0095] Figures 10A and 10B respectively show front and side cross-sectional views of an integrated circuit package 90 capable of independently mounting passive components according to the present invention, and illustrate its combination with a heat sink 16. As shown in Figures 10A and 10B, the integrated circuit package 90 capable of independently mounting passive components includes an integrated circuit 901 and a heat dissipation structure 902.

[0096] The integrated circuit 901 is mounted on the circuit board 11. The heat dissipation structure 902 is manufactured independently and includes a first plate 9021 and a cavity 9022. The first plate 9021 is disposed on the integrated circuit 901 and is in thermal contact with the integrated circuit 901. The cavity 9022 is located on one side of the first plate 9021 and has at least one opening for mounting the passive component 12.

[0097] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11. Simultaneously, the top 921 of the passive component 12 is substantially flush with the top surface of the heat dissipation structure 902 and is in thermal contact with the heat sink 16 (e.g., but not limited to direct connection or connection through a thermal interface material). The heat sink 16 may be made of a metal or other highly thermally conductive material to rapidly dissipate the heat generated by the integrated circuit 901 and the passive component 12 to the external environment.

[0098] As shown in Figures 10A and 10B, the design of the heat dissipation structure 902 allows for the assembly and disassembly of the passive component 12. Its cavity 9022 provides flexible installation space, suitable for passive components 12 of different shapes or sizes. This design further enhances heat dissipation efficiency and improves the modularity and flexibility of the system.

[0099] In summary, Figures 10A and 10B illustrate how the integrated circuit package 90 of the present invention, by combining with the heat sink 16, can effectively transfer the heat energy of the integrated circuit 901 and the passive component 12 at the same time, thereby achieving the best heat dissipation effect.

[0100] FIG11 shows a cross-sectional schematic diagram of an integrated circuit package 100 for independently assembling passive components according to the present invention. As shown in FIG11, the integrated circuit package 100 includes an integrated circuit 1001 and a heat dissipation structure 1002.

[0101] The integrated circuit 1001 is mounted on the circuit board 11. The heat dissipation structure 1002 is manufactured independently and includes a first plate 10021 and a cavity 10022. The first plate 10021 is disposed on the integrated circuit 1001 and is in thermal contact with the integrated circuit 1001. The cavity 10022 is located on one side of the first plate 10021 and has at least one opening for mounting the passive component 12.

[0102] During assembly, the passive component 12 is connected to the circuit board 11 or integrated circuit 1001 through its electrical conductor 121 and is detachably installed into the cavity 10022 of the heat dissipation structure 1002. This design allows for flexible assembly of the passive component 12 and is suitable for passive components of different sizes or shapes.

[0103] The first plate 10021 of the heat dissipation structure 1002 is attached to the top surface of the integrated circuit 1001, thereby effectively conducting the heat generated by the integrated circuit 1001 to the heat dissipation structure 1002, further improving the overall heat dissipation efficiency.

[0104] As shown in Figure 11, the heat dissipation structure 1002 in this embodiment is designed with flexibility. It not only supports the independent assembly of the passive component 12, but also effectively improves the heat dissipation performance of the integrated circuit 1001 and the overall packaging system through its structural features. The heat dissipation structure 1002 can be thermally connected to the electronic component 13 to further conduct heat energy, either by conducting heat energy to the electronic component 13 or by conducting heat energy out of the electronic component 13. This design greatly enhances the modularity and application flexibility of the integrated circuit package 100, meeting the heat dissipation requirements of modern electronic devices.

[0105] FIG12 shows a cross-sectional schematic diagram of an integrated circuit package 110 for independently assembling passive components according to the present invention. As shown in FIG12, the integrated circuit package 110 includes an integrated circuit 1101 and a heat dissipation structure 1102.

[0106] The integrated circuit 1101 is mounted on the circuit board 11 and is used to support the operation of electronic components. The heat dissipation structure 1102 is manufactured independently and includes a first plate 11021, a cavity 11022, and two second plates 11024. The first plate 11021 is disposed on the top surface of the integrated circuit 1101 and is in thermal contact with the integrated circuit 1101 to achieve heat conduction.

[0107] Cavity 11022 is located on one side of the first plate 11021 and has at least one opening for mounting the passive component 12. The passive component 12 is electrically connected to the circuit board 11 or integrated circuit 1101 through its electrical conductor 121. During assembly, the passive component 12 can be inserted into the cavity 11022 through the opening of the heat dissipation structure 1102 and can be selectively removed from the cavity 11022. In a preferred embodiment, the cavity 11022 has three openings, that is, if the cavity 11022 is considered as a cuboid, three of the six planes on the periphery of the cavity 11022 are completely cleared before mounting the passive component 12 to facilitate the placement of the passive component 12 into the cavity 11022.

[0108] In this embodiment, the heat dissipation structure 1102 further includes at least one second plate 11024 (there are two second plates 11024 in this embodiment) compared to the embodiment with only the first plate 11021, so that the plurality of passive components 12 are stacked on the first plate 11021 and at least one second plate 11024 to accommodate the plurality of passive components 12 or improve heat dissipation efficiency.

[0109] The heat dissipation structure 1102 is designed to improve the heat dissipation efficiency of the integrated circuit 1101. Through its thermal contact with the integrated circuit 1101, the heat generated by the operation of the integrated circuit 1101 can be quickly conducted to the heat dissipation structure 1102 and further dispersed to the external environment to reduce the operating temperature.

[0110] The design features of this embodiment lie in the flexible assembly of the passive components 12 and the effective heat conduction capability of the heat dissipation structure 1102. The modular and multi-layer flat design of the heat dissipation structure 1102 can accommodate passive components 12 of different sizes and quantities, improving the assembly efficiency and flexibility of the integrated circuit package 110, and meeting the high standards of heat dissipation performance required by modern electronic devices. In this embodiment, each passive component 12 is electrically connected to the circuit board 11 through its electrical conductor 121.

[0111] Figure 13 shows a cross-sectional schematic diagram of an integrated circuit package 120 for independently assembling passive components according to the present invention. The integrated circuit package 120 includes an integrated circuit 1201 and a heat dissipation structure 1202.

[0112] The integrated circuit 1201 is mounted on the circuit board 11 and electrically connected thereto. The heat dissipation structure 1202 is manufactured independently and includes a first plate 12021 and a cavity 12022. The first plate 12021 is disposed on top of the integrated circuit 1201 and is in thermal contact with the integrated circuit 1201 to achieve effective heat conduction.

[0113] Cavity 12022 is located on one side of the first plate 12021 and has at least one opening suitable for mounting passive component 12. Passive component 12 is electrically connected to circuit board 11 or integrated circuit 1201 through its electrical conductor 121. During assembly, passive component 12 can be inserted into cavity 12022 through opening of heat dissipation structure 1202 and can be selectively removed from cavity 12022.

[0114] Furthermore, the top surface of the heat dissipation structure 1202 contacts the heat sink 16, allowing the heat sink 16 to more effectively dissipate the heat generated during the operation of the integrated circuit 1201 to the external environment. The upper surface of the passive component 12 is flush with or approximately flush with the top surface of the heat dissipation structure 1202, ensuring that both the passive component 12 and the heat dissipation structure 1202 are in contact with the external heat sink 16. This design improves overall heat dissipation efficiency, ensuring stable operation of the integrated circuit 1201 at lower temperatures.

[0115] In this embodiment, the combination of the heat dissipation structure 1202 and the heat sink 16 provides an efficient heat dissipation solution. At the same time, the modular design allows for rapid assembly and maintenance of the passive component 12, adapting to different application requirements and improving the flexibility and reliability of the integrated circuit package 120.

[0116] FIG14 shows a cross-sectional schematic diagram of an integrated circuit package 130 for independently assembling passive components according to the present invention. The integrated circuit package 130 includes an integrated circuit 1301 and a heat dissipation structure 1302.

[0117] The integrated circuit 1301 is mounted on the circuit board 11 and electrically connected to it through an electrical conductor. The heat dissipation structure 1302 is manufactured independently and includes a first plate 13021 and a cavity 13022. The first plate 13021 is disposed on top of the integrated circuit 1301 and is in thermal contact with the integrated circuit 1301 to effectively conduct the heat generated by the integrated circuit 1301.

[0118] Cavity 13022 is located on one side of the first-layer flat plate 13021 and has at least one opening for accommodating passive component 12. Passive component 12 is electrically connected to circuit board 11 or integrated circuit 1301 through its electrical conductor 121. During assembly, passive component 12 can be inserted into cavity 13022 through opening of heat dissipation structure 1302 and can be selectively removed from cavity 13022 for convenient maintenance and replacement.

[0119] Furthermore, the top surface of the heat dissipation structure 1302 contacts the heat sink 16, allowing the heat sink 16 to further dissipate the heat generated during the operation of the integrated circuit 1301 to the external environment. The upper surface of the passive component 12 is flush with or approximately flush with the top surface of the heat dissipation structure 1302, ensuring that both the passive component 12 and the heat dissipation structure 1302 are in contact with the external heat sink 16. This design improves heat dissipation efficiency, ensuring that the integrated circuit 1301 can operate stably at a suitable temperature.

[0120] The integrated circuit package 130 in this embodiment features a modular design, providing efficient heat dissipation while simplifying the assembly and replacement process of the passive component 12. This design is suitable for a variety of applications requiring high heat dissipation efficiency and flexible assembly.

[0121] Figures 15A, 15C, 15E and 15G are cross-sectional schematic diagrams of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention, and are supplemented by perspective schematic diagrams 15B, 15D, 15F and 15H (where Figures 15B, 15D, 15F and 15H are perspective schematic diagrams corresponding to Figures 15A, 15C, 15E and 15G being front cross-sectional schematic diagrams respectively).

[0122] As shown in Figures 15A and 15B, an integrated circuit 201 and an electronic component 13 are first provided. Both the integrated circuit 201 and the electronic component 13 are mounted on a circuit board 11. The electronic component 13 may also include, for example, an electrical conductor 131 (not shown) suitable for electrical connection with the circuit board 11.

[0123] As shown in Figures 15C and 15D, a heat dissipation structure 202 is independently manufactured, which includes a first plate 2021 and a cavity 2022. The material of the heat dissipation structure 202 can be a metallic material, such as aluminum, copper, aluminum nitride, etc., or a non-metallic material, such as aluminum nitride, silicon carbide, or graphite, etc. The manufacturing process can be, for example, casting, milling, turning, stamping, or forging.

[0124] As shown in Figures 15E and 15F, the heat dissipation structure 202 is installed on the integrated circuit 201, and the first plate 2021 is in thermal contact with the top surface of the integrated circuit 201 to promote the transfer of heat generated by the integrated circuit 201.

[0125] As shown in Figures 15G and 15H, a passive component 22 (such as an inductor) is installed into the cavity 2022 of the heat dissipation structure 202. This step can be performed through the opening of the heat dissipation structure 202, and the electrical conductor 221 of the passive component 22 is electrically connected to the circuit board 11 or the integrated circuit 201.

[0126] A thermal interface material may be coated between the first plate 2021 of the heat dissipation structure 202 and the top surface of the integrated circuit 201 to further improve heat dissipation efficiency. Finally, after the structure 20 is assembled, it may be optionally connected to a heat sink.

[0127] The above description illustrates the implementation details of integrated circuit packaging and its manufacturing method. Each step and material selection can be adjusted according to specific needs to achieve the best heat dissipation and electrical connection effect.

[0128] Figures 16A to 16H are cross-sectional schematic diagrams of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention, wherein Figures 16B, 16D, 16F, and 16H are side cross-sectional schematic diagrams corresponding to the front cross-sectional schematic diagrams of Figures 16A, 16C, 16E, and 16G, respectively. This embodiment provides a method for manufacturing an integrated circuit package 60 capable of independently assembling passive components. The method includes the following steps:

[0129] First, as shown in Figures 16A and 16B, an integrated circuit 601 is provided and mounted on a circuit board 11. The integrated circuit 601 includes two heat-conducting pillars 14 for connection with the passive component 12 during subsequent assembly. An electronic component 13 is also provided on the circuit board 11. The electronic component 13 includes two electrical conductors 131 for electrically connecting the electronic component 13 to the circuit board 11.

[0130] Next, as shown in Figures 16C and 16D, a heat dissipation structure 602 is manufactured independently. The heat dissipation structure 602 includes a first plate 6021 and a cavity 6022. The first plate 6021 is disposed at the bottom of the heat dissipation structure 602 for contacting the integrated circuit 601, and the cavity 6022 is located above the first plate and has at least one opening.

[0131] As shown in Figures 16E and 16F, the heat dissipation structure 602 is assembled above the integrated circuit 601, so that the first plate 6021 of the heat dissipation structure 602 is in thermal contact with the top surface of the integrated circuit 601. At this time, the electronic component 13 still maintains electrical connection with the circuit board 11.

[0132] Finally, as shown in Figures 16G and 16H, the two passive components 12 are installed in the cavity 6022 of the heat dissipation structure 602, and connected to the heat-conducting pillar 14 through the electrical conductor 121 of the passive component 12 to connect the passive component 12 and the circuit board 11.

[0133] This manufacturing method can effectively improve the heat dissipation efficiency of integrated circuit packages and realize the flexible assembly of passive components.

[0134] The present invention has been described above with reference to embodiments. However, the above description is only intended to facilitate understanding of the present invention by those skilled in the art and is not intended to limit the scope of the present invention. Under the same spirit of the present invention, those skilled in the art can conceive of various equivalent changes. For example, the number of passive components provided in the cavity may be different from that shown in the drawings, or the number of electronic components or integrated circuits provided on the circuit board may be different from that shown in the drawings. The scope of the present invention should cover the above and all other equivalent changes. [Simplified Explanation of the Diagram]

[0024] Figure 1 shows a schematic diagram of an inductor structure according to prior art US Patent US11770916.

[0025] Figures 2A and 2B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package for independently assembling passive components according to the present invention.

[0026] Figures 3A, 3B and 3C respectively show a front sectional view, a side sectional view and a perspective view of another embodiment of an integrated circuit package 20 for independently assembling passive components according to the present invention.

[0027] Figure 4 shows a front cross-sectional view of another embodiment of an integrated circuit package 30 for independently assembling passive components according to the present invention.

[0028] Figure 5 shows a front cross-sectional view of another embodiment of an integrated circuit package 40 for independently assembling passive components according to the present invention.

[0029] Figure 6 shows a front cross-sectional view of another embodiment of an integrated circuit package 50 for independently assembling passive components according to the present invention.

[0030] Figures 7A and 7B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 60 capable of independently assembling passive components according to the present invention.

[0031] Figures 8A and 8B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 70 for independently assembling passive components according to the present invention.

[0032] Figures 9A and 9B respectively show front and side cross-sectional views of an embodiment of an integrated circuit package 80 capable of independently assembling passive components according to the present invention.

[0033] Figures 10A and 10B respectively show front and side cross-sectional views of an integrated circuit package 90 capable of independently assembling passive components according to the present invention.

[0034] Figure 11 shows a cross-sectional schematic diagram of an integrated circuit package 100 for independently assembling passive components according to the present invention.

[0035] Figure 12 shows a cross-sectional schematic diagram of an integrated circuit package 110 for independently assembling passive components according to the present invention.

[0036] Figure 13 shows a cross-sectional schematic diagram of an integrated circuit package 120 for independently assembling passive components according to the present invention.

[0037] Figure 14 shows a cross-sectional schematic diagram of an integrated circuit package 130 of which passive components can be independently assembled according to the present invention.

[0038] Figures 15A, 15C, 15E and 15G are cross-sectional schematic diagrams of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention, and are supplemented by three-dimensional schematic diagrams 15B, 15D, 15F and 15H.

[0039] Figures 16A to 16H are cross-sectional schematic diagrams of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention.

Claims

1. An integrated circuit package capable of independently mounting passive components, comprising: an integrated circuit for mounting on a circuit board; and a heat dissipation structure, which is independently manufactured and has: a first plate disposed on the integrated circuit and in thermal contact with the integrated circuit; and a cavity located on one side of the first plate, the cavity having at least one opening for mounting a passive component; wherein the passive component is inserted into the cavity through the at least one opening of the heat dissipation structure during assembly, and is electrically connected to the circuit board or the integrated circuit through an electrical conductor of the passive component; wherein heat generated by the integrated circuit is dissipated through the heat dissipation structure.

2. An integrated circuit package for independently assembling passive components, as described in claim 1, wherein the passive component includes an inductor.

3. An integrated circuit package for independently assembling passive components, as in claim 1, wherein the material of the heat dissipation structure is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

4. As in claim 3, an integrated circuit package capable of independently mounting passive components, wherein the process for forming the heat dissipation structure includes: Casting, milling, turning, stamping or forging.

5. An integrated circuit package for independently assembling passive components, as in claim 1, wherein the material of the heat dissipation structure is a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

6. An integrated circuit package for independently assembling passive components, as claimed in claim 1, wherein the first plate layer is bonded to the top surface of the integrated circuit through a thermal interface material.

7. An integrated circuit package for independently mountable passive components, as claimed in claim 1, wherein the passive component may be optionally inserted into the cavity through the at least one opening or removed from the cavity through the at least one opening.

8. An integrated circuit package for independently mountable passive components as claimed in claim 1, wherein the upper surface of the passive component is flush or substantially flush with the top surface of the heat dissipation structure, such that the passive component and the heat dissipation structure are simultaneously in contact with an external heat sink.

9. The integrated circuit package of independently mountable passive components as claimed in claim 1, wherein the heat dissipation structure further includes at least one second plate, such that a plurality of the passive components are stacked on the first plate and the at least one second plate to accommodate the plurality of passive components or improve heat dissipation efficiency.

10. An integrated circuit package for independently mountable passive components as claimed in claim 1, wherein the passive component is further connected to the circuit board via a heat-conducting pillar, wherein the heat-conducting pillar is made of a formable metal, including copper, silver, gold or aluminum.

11. A method for manufacturing an integrated circuit package capable of independently assembling passive components, comprising: mounting an integrated circuit on a circuit board; pre-manufacturing a heat dissipation structure having a first plate and a cavity, the cavity being located on one side of the first plate and having at least one opening; mounting the heat dissipation structure onto the integrated circuit, such that the first plate and the integrated circuit make thermal contact; inserting at least one passive component into the cavity through the at least one opening, and electrically connecting the circuit board or the integrated circuit through one of the electrical conductors of the passive component.

12. A method for manufacturing an integrated circuit package of independently assembleable passive components as claimed in claim 11, wherein the passive component includes an inductor.

13. A method for manufacturing an integrated circuit package capable of independently assembling passive components as claimed in claim 11, wherein the material of the heat dissipation structure is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

14. A method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 13, wherein the process for forming the heat dissipation structure includes: Casting, milling, turning, stamping or forging.

15. A method for manufacturing an integrated circuit package capable of independently assembling passive components as claimed in claim 11, wherein the material of the heat dissipation structure is a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

16. A method for manufacturing an integrated circuit package capable of independently assembling passive components as claimed in claim 11, wherein the first plate layer is bonded to the top surface of the integrated circuit through a thermal interface material.

17. A method of manufacturing an integrated circuit package of independently assembleable passive components as claimed in claim 11, wherein the passive component is optionally inserted into the cavity through the at least one opening or removed from the cavity through the at least one opening.

18. A method for manufacturing an integrated circuit package of independently assembleable passive components as claimed in claim 11, wherein the upper surface of the passive component is flush or substantially flush with the top surface of the heat dissipation structure, so that the passive component and the heat dissipation structure are simultaneously in contact with an external heat sink.

19. A method for manufacturing an integrated circuit package of independently assembleable passive components as claimed in claim 11, wherein the heat dissipation structure further includes at least one second plate, such that a plurality of the passive components are stacked on the first plate and the at least one second plate to accommodate the plurality of passive components or improve heat dissipation efficiency.

20. A method for manufacturing an integrated circuit package of independently assembleable passive components as claimed in claim 11, wherein the passive component is further connected to the circuit board via a heat-conducting pillar, wherein the heat-conducting pillar is made of a formable metal, including copper, silver, gold or aluminum.

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