Semiconductor Component Testing Equipment and Deformation Estimation Methods

Abstract

The purpose of this invention is to provide a semiconductor device testing apparatus capable of predicting the amount of deformation of a contactor when a terminal of a device under test (DUT) is pressed against a contactor of a contact device. The semiconductor device testing apparatus 1 includes: a holding unit 30 for holding the DUT 100; a probe card 10 having a contactor 12 that contacts a terminal 101 of the DUT 100; a pressing unit 35 including a drive unit 37 that presses the terminal 101 toward the contactor 12 by moving the holding unit 30 in the +Z direction and a lower base 36 supporting the drive unit 37; a support unit 40 that supports the probe card 10 so that the probe card 10 faces the holding unit 30 and supports the lower base 36; and an estimation device 60 that estimates the actual overdrive of the contactor 12 in the Z direction based on the thrust T of the drive unit 37 in the Z direction.

Description

[Technical Field]

[0001] This invention relates to a semiconductor device testing apparatus for testing a device under test (DUT) and a method for estimating the deformation of a contactor pressing a terminal of the DUT in the semiconductor device testing apparatus. [Previous Technology]

[0002] Electronic component testing equipment is known for testing the electrical characteristics of electronic circuits embedded in a bare die (bare wafer) after semiconductor wafer dicing (e.g., see Patent Document 1). This electronic component testing equipment includes: a test head with a probe card and a handler that moves the bare die and advances it to the probe card.

[0003] This processor includes: a transfer device for transferring the device under test (DUT) from a tray to an alignment unit, and an alignment unit for advancing a pad of the DUT relative to a contactor of the probe card after positioning the DUT transferred by the aforementioned transfer device relative to the probe card. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2016-85203 [Summary of the Invention]

[0005] [Problem to be Solved by the Invention] In the electronic component testing equipment described above, when the die pad is pushed to the contactor of the probe card, the contactor deforms. If the deformation of this contactor is too great, damage may occur to both the contactor and the pad, so it is necessary to predict the amount of contactor deformation. However, in the prior art electronic component testing equipment described above, there is a problem that the amount of contactor deformation cannot be predicted.

[0006] The problem this invention aims to solve is to provide a semiconductor device testing apparatus capable of predicting the deformation of a contactor when the terminal of a device under test is pressed against the contactor of a contacting device, and a method for estimating the deformation of the contactor. [Means for solving the problem]

[0007] [1] Embodiment 1 of the present invention is a semiconductor device testing apparatus, comprising: a holding device for holding a device under test; a connecting device having a contactor that contacts a terminal of the device under test; a pressing device comprising: a driving part for pressing the terminal toward the contactor by moving the holding device in a first direction; a base part for supporting the driving part; a supporting part for supporting the connecting device so that the connecting device and the holding device face each other and are supported by the base part; and an estimation device for estimating a first deformation of the contactor in the first direction based on the thrust of the driving part in the first direction.

[0008] [2] The present invention, sample 2, can also be a semiconductor device testing apparatus. In the semiconductor device testing apparatus of sample 1, the semiconductor device testing apparatus further includes: a drive control device that controls the drive unit to move the holding device by an indicated movement amount in the first direction. The estimation device calculates an estimated value of the first deformation amount based on the indicated movement amount, the first elastic deformation amount of the holding device, the second elastic deformation amount of the pressing device, and the third elastic deformation amount of the support unit.

[0009] [3] The present invention sample 3 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 2, the aforementioned estimation device includes: a memory unit that stores the first spring constant of the aforementioned holding device, the second spring constant of the aforementioned pressing device, and the third spring constant of the aforementioned support unit; a calculation unit that calculates the first elastic deformation amount to the third elastic deformation amount based on the aforementioned first spring constant to the aforementioned third spring constant and the aforementioned thrust; and an estimation unit that calculates the aforementioned estimated value based on the aforementioned indicated movement amount and the decrease of the aforementioned first elastic deformation amount to the aforementioned third elastic deformation amount.

[0010] [4] The present invention sample 4 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 3, the aforementioned memory unit further stores the aforementioned indication movement amount associated with the aforementioned thrust; the aforementioned estimation unit uses the aforementioned indication movement amount associated with the aforementioned thrust as the aforementioned indication movement amount.

[0011] [5] The present invention sample 5 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 3, the aforementioned driving unit further includes: a first measuring device for measuring the aforementioned thrust of the aforementioned driving unit; the aforementioned calculation unit uses the thrust measured by the aforementioned first measuring device as the aforementioned thrust.

[0012] [6] The present invention sample 6 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 3 or 5, the aforementioned driving unit further includes: a second measuring device for measuring the movement of the aforementioned holding device of the aforementioned driving unit; the aforementioned estimation unit uses the movement measured by the aforementioned second measuring device as the aforementioned indicated movement.

[0013] [7] The present invention sample 7 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 3, the aforementioned drive control device can control the aforementioned drive unit to deform the aforementioned contactor in the aforementioned first direction by a predetermined set deformation amount by pressing the aforementioned drive unit; the aforementioned memory unit further stores the thrust associated with the aforementioned set deformation amount; the aforementioned calculation unit uses the aforementioned thrust associated with the aforementioned set deformation amount as the aforementioned thrust; the aforementioned estimation unit uses the aforementioned set deformation amount as the aforementioned indication movement amount.

[0014] [8] The present invention sample 8 may also be a semiconductor device testing device. In the semiconductor device testing device of any of the samples 1 to 7, the aforementioned holding device includes: a holding part that adjusts the temperature of the aforementioned device under test while holding the aforementioned device under test, and an alignment stage that positions the aforementioned device under test relative to the aforementioned connection device while supporting the aforementioned holding part.

[0015] [9] The present invention sample 9 may also be a semiconductor device testing device. In the semiconductor device testing device of any of the samples 1 to 8, the aforementioned support portion includes: a bridging beam on which the aforementioned connecting device is mounted; and a column member vertically erected on the aforementioned base portion and supporting the aforementioned bridging beam.

[0016]

[10] The sample 10 of the present invention may also be a semiconductor device testing device. In any of the semiconductor device testing devices of samples 1 to 9, the aforementioned semiconductor device testing device further includes: a determination device that determines whether the estimated value of the aforementioned first deformation calculated by the aforementioned estimation device is normal or abnormal.

[0017]

[11] The present invention sample 11 can also be a semiconductor device testing device. In the semiconductor device testing device of sample 10, the semiconductor device testing device further includes: a drive control device that controls the drive unit. When the determination device determines that the estimated value is abnormal, the drive control device controls the drive unit to stop the movement of the drive unit in the first direction before the holding device.

[0018]

[12] The sample 12 of the present invention may also be a semiconductor device testing device. In the semiconductor device testing device of sample 10 or 11, the aforementioned semiconductor device testing device further includes: a notification device that notifies the aforementioned estimated value of an abnormal condition.

[0019]

[13] Embodiment 13 of the present invention can also be a semiconductor device testing device. In any of the semiconductor device testing devices of embodiments 1 to 12, the aforementioned semiconductor device testing device further includes: a drive control device that controls the aforementioned drive unit to deform the aforementioned contactor in the aforementioned first direction by a predetermined predetermined deformation amount by pressing the aforementioned drive unit. The aforementioned estimation device further includes a suggested value calculation unit that calculates a suggested value of the aforementioned predetermined deformation amount based on the optimal value of the aforementioned first deformation amount corresponding to the aforementioned type of connection device and the aforementioned thrust, so that the suggested value of the aforementioned first deformation amount becomes the aforementioned optimal value. The aforementioned drive control device controls the aforementioned drive unit based on the aforementioned suggested value.

[0020]

[14] The present invention sample 14 can also be a semiconductor device testing device. In the semiconductor device testing device of any of the samples 1 to 13, the device under test includes a monolithic die. The connection device includes: a probe card, wherein the probe card includes the contact, wherein the contact contacts the terminals included in the die.

[0021]

[15] The present invention provides a deformation estimation method for estimating the first deformation in a semiconductor device testing equipment of any of the states 1 to 14. The deformation estimation method includes: an estimation step, estimating the first deformation based on the thrust.

[0022]

[16] The present invention sample 16 can also be a deformation estimation method. In the deformation estimation method of sample 15, the aforementioned estimation step includes: subtracting the first elastic deformation of the aforementioned holding device, the second elastic deformation of the aforementioned pressing device, and the third elastic deformation of the aforementioned support from the indicated movement amount of the aforementioned holding part in the aforementioned first direction predicted by the control of the drive control device, thereby calculating the estimated value of the aforementioned first deformation.

[0023]

[17] The state 17 of the present invention can also be a displacement estimation method. In the deformation estimation method of state 16, the aforementioned deformation estimation method further includes: an acquisition step, acquiring the first spring constant of the aforementioned holding device, the second spring constant of the aforementioned pressing device, and the third spring constant of the aforementioned support part; and a calculation step, calculating the aforementioned first elastic deformation amount to the aforementioned third elastic deformation amount based on the aforementioned first spring constant to the aforementioned third spring constant and the aforementioned thrust.

[0024]

[18] The present invention sample 18 can also be a deformation estimation method. In the deformation estimation method of sample 17, the aforementioned obtaining step includes: moving the aforementioned holding device from the first position to the second position by the aforementioned driving part; obtaining the change in the aforementioned thrust when the aforementioned holding device moves from the aforementioned first position to the aforementioned second position; obtaining the second deformation of the aforementioned holding device in the aforementioned first direction when the aforementioned holding device moves from the aforementioned first position to the aforementioned second position; and calculating the aforementioned first spring constant based on the aforementioned change in thrust and the aforementioned second deformation.

[0025]

[19] The present invention, sample 19, can also be a deformation estimation method. In the deformation estimation method of sample 18, the aforementioned support portion includes: a bridging beam on which a dummy platform is mounted; and a column member, which is vertically erected on the aforementioned base portion and supports the aforementioned bridging beam. The aforementioned obtaining step includes: holding the load element in the aforementioned holding device; moving the aforementioned holding device to the aforementioned first position by the aforementioned driving unit, and bringing the aforementioned load element into contact with the aforementioned dummy platform; obtaining the third deformation amount of the aforementioned load element in the aforementioned first direction when the aforementioned holding device is located in the aforementioned second position; and obtaining the aforementioned second deformation amount by subtracting the aforementioned third deformation amount from the distance between the aforementioned first position and the aforementioned second position.

[0026]

[20] The state 20 of the present invention can also be a deformation estimation method. In the deformation estimation method of state 18 or 19, the aforementioned obtaining step includes: obtaining the fourth deformation amount of the aforementioned support portion in the aforementioned first direction when the aforementioned holding device is moved from the aforementioned first position to the aforementioned second position by the aforementioned driving portion; and calculating the aforementioned third spring constant of the aforementioned support portion based on the aforementioned change in thrust and the aforementioned fourth deformation amount.

[0027]

[21] The state 21 of the present invention can also be a deformation estimation method. In the deformation estimation method of state 20, the aforementioned obtaining step includes: subtracting the distance between the aforementioned first position and the aforementioned second position and the aforementioned fourth deformation from the predetermined set deformation of the aforementioned contactor, thereby calculating the fifth deformation in the aforementioned first direction of the aforementioned pressing device; and calculating the second spring constant of the aforementioned pressing device based on the aforementioned change in thrust and the aforementioned fifth deformation.

[0028]

[22] The state 22 of the present invention can also be a deformation estimation method. In the deformation estimation method of any of the states 15 to 21, the aforementioned deformation estimation method further includes: a determination step, determining whether the estimated value of the aforementioned first deformation is normal or abnormal.

[0029]

[23] The state 23 of the present invention can also be a deformation estimation method. In the deformation estimation method of state 22, the aforementioned deformation estimation method further includes: a stop step, in which the aforementioned estimated value is determined to be abnormal in the aforementioned determination step, the movement of the aforementioned drive unit toward the aforementioned holding device in the aforementioned first direction is stopped.

[0030]

[24] The state 24 of the present invention can also be a deformation estimation method. In the deformation estimation method of state 22 or 23, the aforementioned deformation estimation method further includes: a notification step, in which the aforementioned estimated value is determined to be abnormal in the aforementioned determination step, the aforementioned estimated value is notified of the abnormal situation.

[0031]

[25] The present invention, sample 25, can also be a deformation estimation method. In any of the deformation estimation methods of samples 15 to 24, the aforementioned deformation estimation method further includes: a suggested value calculation step, which calculates a suggested value of the set deformation based on the optimal value of the first deformation corresponding to the aforementioned type of connection device and the aforementioned thrust, so that the suggested value of the first deformation becomes the aforementioned optimal value; and a movement step, which, after the aforementioned suggested value calculation step, controls the aforementioned drive unit based on the aforementioned suggested value. [Effects of the Invention]

[0032] The semiconductor device testing equipment and deformation estimation method of the present invention can estimate the first deformation of the contact in the first direction based on the thrust of the driving part in the first direction, and thus can predict the deformation of the contact when the terminal of the device under test is pressed to the contact.

Implementation Method

[0034] [Forms for Implementing the Invention] In the following, embodiments of the invention will be described based on the drawings.

[0035] [First Implementation Form]

[0036] Figure 1 is a cross-sectional view showing the semiconductor device testing apparatus 1 in this embodiment. Figure 2 is a cross-sectional view showing the state in which the terminal 101 of the device under test 100 in Figure 1 begins to contact the contactor 12 of the probe card 10 in the semiconductor device testing apparatus 1. In other words, Figure 2 shows the semiconductor device testing apparatus 1 and the device under test 100 when the position of the terminal 101 of the device under test 100 in Figure 1 is raised by the distance d shown in Figure 1. The dashed line in Figure 2 shows the semiconductor device testing apparatus 1 in Figure 1. Figure 3 is a cross-sectional view showing the state in which the device under test 100 is further raised from the state shown in Figure 2. The dashed line in Figure 3 shows the semiconductor device testing apparatus 1 in Figure 2. Figure 4 is a block diagram illustrating the structure of the drive unit 37 and its drive device 50 in this embodiment.

[0037] As shown in Figures 1 to 3, the semiconductor device testing equipment 1 in this embodiment is a device for testing the electrical characteristics of the device under test 100. In this semiconductor device testing equipment 1, after the terminal 101 of the device under test 100 is brought into contact with the contactor 12 of the probe card 10, the aforementioned test of the device under test 100 is performed.

[0038] The device under test 100 in this embodiment can be exemplified as a bare die (bare chip) monolithically formed by dicing a semiconductor wafer. The semiconductor device test equipment 1 tests the electrical characteristics of the electronic circuit embedded in this bare die. The terminal 101 is, for example, a pad.

[0039] Furthermore, although the device under test 100 in this embodiment is a monolithic bare die, the device under test 100 can also be a die of a semiconductor wafer before it is monolithized. In addition, although an example of testing one die is described in this embodiment, multiple dies can also be tested simultaneously.

[0040] As shown in Figure 1, this semiconductor device testing device 1 includes: a probe card 10, a test head 15, and a processor 20. The probe card 10 in this embodiment corresponds to an example of the "connection device" in this invention.

[0041] The probe card 10 is mounted on the bridging beam 41 (described below) of the support part 40 (described below) of the processor 20 and faces the internal space of the processor 20. In addition, this probe card 10 is electrically connected to the test head 15, and during the testing of the device under test 100, the device under test 100 and the test head 15 are electrically connected.

[0042] The probe card 10 includes: a substrate 11 and a plurality of contactors 12. The substrate 11 is a printed circuit board, and in this embodiment, the substrate 11 is mounted on the bridging beam 41. Furthermore, the plurality of contactors 12 in this embodiment corresponds to an example of a "contact" in this invention.

[0043] A plurality of contactors 12 are disposed on the lower surface of the substrate 11 to correspond to the positions of a plurality of terminals 101 of the device under test 100. This contactor 12 is a needle-shaped member capable of elastic deformation in the Z direction shown in the figure. Specific examples of such a contactor 12 include, for example, a vertical probe, a pogo pin, a cantilever probe, a bump on a membrane, or a contactor manufactured using MEMS technology.

[0044] The processor 20 includes: a holding unit 30, a pressing unit 35, a support part 40, and a control device 50. The holding unit 30 in this embodiment corresponds to an example of the "holding device" in this invention, and the pressing unit 35 in this embodiment corresponds to an example of the "pressing device" in this invention.

[0045] The holding unit 30 holds the device under test 100. This holding unit 30 includes a thermal head 31 and an alignment stage 32. The thermal head 31 adjusts the temperature of the device under test 100 while holding it. The thermal head 31 in this embodiment is equivalent to an example of the "holding part" in this invention.

[0046] While not particularly limited, the method for holding the element under test 100 in the thermistor 31 can be exemplified by, for example, a method in which the element under test 100 is vacuum-adsorbed at the upper surface of the thermistor 31. Furthermore, while not particularly limited, the method for adjusting the temperature of the element under test 100 in the thermistor 31 can be exemplified by, for example, a method in which the element under test 100 is heated by a temperature adjustment device such as a heater installed inside the thermistor 31. Moreover, this temperature adjustment device may include, in addition to a heater, a cooling source capable of cooling the heater.

[0047] In addition, although not specifically illustrated, the processor 20 may also include a transfer device for transferring the device under test 100 onto the thermal head 31. As an example, the processor 20 may also include a transport arm capable of picking and placing the device under test 100 mounted on a tray by means of an adsorption head or the like, and may also transfer the device under test 100 from the tray onto the thermal head 31 by means of the transport arm.

[0048] The alignment stage 32 supports the thermal head 31 from below. This alignment stage 32 is a platform for positioning the device under test 100 relative to the probe card 10. Specifically, the alignment stage 32 adjusts the relative position and orientation of the device under test 100 relative to the probe card 10 with the terminals 101 of the device under test 100 and the contactors 12 of the probe card 10 facing each other, thereby positioning the device under test 100 relative to the probe card 10. Although there are no particular limitations on the alignment stage 32, for example, an XYθ platform can be used.

[0049] The pressing unit 35 moves the holding unit 30 holding the element under test 100 along the Z direction in the figure. This pressing unit 35 includes: a lower base 36 and a driving part 37. The lower base 36 in this embodiment corresponds to an example of the "base part" in this invention, and the +Z direction in this embodiment corresponds to an example of the "first direction" in this invention.

[0050] The lower base 36 supports the drive unit 37 from below. The drive unit 37 is vertically disposed on the lower base 36 and extends upward from the upper surface of the lower base 36 (in the +Z direction in the figure).

[0051] As shown in Figures 1 to 3, the drive unit 37 is a device that raises and lowers the holding unit 30 in the Z direction to advance the device under test 100 to the probe card 10. During testing of the device under test 100, the drive unit 37 raises the holding unit 30 in the +Z direction to press the terminal 101 of the device under test 100 toward the contactor 12. Furthermore, after testing of the device under test 100 is completed, the drive unit 37 lowers the holding unit 30 in the -Z direction to move the terminal 101 of the device under test 100 away from the contactor 12.

[0052] Furthermore, although not specifically illustrated, the drive unit 37 can also be driven in the X or Y direction shown in the figure. For example, the pressing unit 35 may also include a track laid on the lower base 36, and the drive unit 37 may further include a drive mechanism that can move along this track.

[0053] As shown in Figure 4, the drive unit 37 includes: a motor 371, a thrust sensor 372, and a stroke sensor 373. The motor 371 generates power for the drive unit 37 to raise and lower the holding unit 30. This motor 371 is controlled by a drive signal Sd from the drive control device 55 (described below) of the control device 50, and generates power for raising and lowering the holding unit 30 based on this drive signal Sd.

[0054] The thrust sensor 372 measures the thrust T in the Z direction of the drive unit 37. Furthermore, this thrust sensor 372 outputs the measured thrust TREAL to the first calculation unit 62 (described below) or the second calculation unit 80 (described below) of the control device 50.

[0055] The motor 371 in this embodiment includes a ball screw mechanism (not shown). The thrust sensor 372 measures the thrust T based on the drive torque of the motor 371, the lead of the feed screw of the ball screw mechanism, and the positive efficiency of the feed screw.

[0056] The stroke sensor 373 measures the expected movement (stroke) Lz of the holding unit 30 in the Z direction, which is anticipated in response to the control of the drive control device 55. The stroke sensor 373 outputs the measured movement Lz to the estimation unit 63 of the control device 50.

[0057] The drive unit 37 is controlled by the drive control device 55 to raise the holding unit 30 until the measured value (movement Lz) of the travel sensor 373 is equal to the programmed overdrive (POD). The programmed overdrive is a pre-set deformation amount of the contactor 12, which is set according to the type of probe card 10, the type of the device under test 100, etc.

[0058] This overdrive setting, while not particularly limited, can be a value determined through prior measurement, etc. For example, by controlling the drive unit 37 through the drive control device 55 to advance the device under test 100 to the contactor 12, the amount of movement of the terminal 101 of the device under test 100 pressed against the contactor 12 is measured in advance to achieve a level that allows testing of the device under test 100. The value of this measured movement can be used as the overdrive setting. Furthermore, the overdrive setting in this embodiment is equivalent to an example of the "setting deformation amount" in this invention.

[0059] However, in reality, this overdrive setting is not consistent with the deformation amount of the contactor 12 in the +Z direction when the holding unit 30 shown in Figure 3 completes its ascent. The deformation amount of the contactor 12 in the +Z direction when the holding unit 30 completes its ascent can also be referred to as actual overdrive (AOD), push-in amount, or overdrive amount. Hereinafter, this deformation amount will be referred to as actual overdrive. Furthermore, the actual overdrive in this embodiment corresponds to an example of the "first deformation amount" in this invention.

[0060] If only the amount of movement of the holding unit 30 by the driving part 37 is considered, the actual overdrive should be consistent with the set overdrive when the rising of the holding unit 30 is completed (actual overdrive = set overdrive). However, at this time, in reality, due to the elastic deformation of the holding unit 30, the pressing unit 35 and the support part 40, the actual overdrive becomes smaller than the set overdrive (actual overdrive < set overdrive). Therefore, in the semiconductor device testing equipment 1 of this embodiment, as described below, a control device 50 is included, and an estimation device 60 is included that is capable of estimating such actual overdrive.

[0061] Furthermore, regarding the movement Lz measured by the travel sensor 373, as shown in Figures 1 and 2, during the period from the start of the rise of the holding unit 30 until the terminal 101 of the device under test 100 begins to contact the contactor 12 of the probe card 10 (-d≦Lz≦0), the movement Lz becomes equal to the actual movement LREAL of the holding unit 30 in the +Z direction (Lz=LREAL). In this embodiment, the movement of the holding unit 30 when it rises a distance d from its initial position is used as the reference for the movement Lz.

[0062] In contrast, when terminal 101 is advanced to contactor 12, due to the aforementioned elastic deformation, the movement Lz is not equal to the movement LREAL, but includes an error in the movement LREAL. Such a movement Lz in this embodiment corresponds to an example of the "expected movement" in this invention.

[0063] As shown in Figures 1 to 3, the support part 40 supports the probe card 10 so that the probe card 10 is aligned with the holding unit 30, and also supports the lower base 36. This support part 40 includes a bridging beam 41 and a column member 42.

[0064] The bridging beam 41, although not particularly limited, is located inside the opening of the base (not shown) provided above the ceiling portion constituting the support portion 40. A probe clip 10 is installed on the lower surface of this bridging beam 41.

[0065] The column member 42 system is vertically erected on the lower base 36 and supports the bridging beam 41. In this embodiment, the column member 42 system is located between the lower base 36 and the bridging beam 41, and directly contacts the lower base 36 and the bridging beam 41.

[0066] As shown in Figure 4, the control device 50 controls the drive unit 37. This control device 50 is composed of an arithmetic processing unit including a central processing unit, read-only memory, random access memory, and input / output interface. The control device 50 includes: a drive control device 55, an estimation device 60, a determination device 70, a notification device 75, and a second arithmetic unit 80.

[0067] The drive control device 55, as described above, sends a drive signal Sd to the drive unit 37. This drive signal Sd contains information specifying the torque of the motor 371. After receiving the drive signal Sd, the drive control device 55 instructs the drive unit 37 to raise the holding unit 30 by controlling the torque of the motor 371, corresponding to a set overdrive distance.

[0068] The estimation device 60 estimates the actual overdrive based on the thrust T of the drive unit 37 in the +Z direction. This estimation device 60 includes: a memory unit 61, a first arithmetic unit 62, an estimation unit 63, and a suggested value calculation unit 64. The first arithmetic unit 62 in this embodiment corresponds to an example of the "arithmetic unit" in this invention.

[0069] The memory unit 61 stores the first spring constant k1 of the holding unit 30, the second spring constant k2 of the pressing unit 35, and the third spring constant k3 of the support unit 40. The first spring constant k1 to the third spring constant k3 are different for each processor 20. Therefore, it is preferable to obtain the first spring constant k1 to the third spring constant k3 in each processor 20 before using the processor 20 in the test of the device under test 100. Furthermore, the method for obtaining the first spring constant k1 to the third spring constant k3 in advance will be described below.

[0070] This memory unit 61 outputs the first spring constant k1 to the third spring constant k3 to the first arithmetic unit 62. The first arithmetic unit 62 calculates the first elastic deformation amount x1 of the holding unit 30, the second elastic deformation amount x2 of the pressing unit 35, and the third elastic deformation amount x3 of the support unit 40 based on the first spring constant k1 to the third spring constant k3 and the thrust T, as shown in Figure 3.

[0071] In this embodiment, the first arithmetic unit 62 uses the thrust TREAL measured by the thrust sensor 372 when the contactor 12 is pressed by the terminal 101 as the thrust T. In this document, when the contactor 12 is pressed by the terminal 101, it means that the amount of movement Lz output from the stroke sensor 373 is greater than 0 (0 < Lz). At this time, the thrust TREAL increases immediately until the rising of the holding unit 30 ends.

[0072] The first elastic deformation amount x1 to the third elastic deformation amount x3 are calculated based on Hooke's law using the following formulas (1) to (3). Furthermore, since the thrust T can be expressed as a linear function of the torque of the drive unit 37, the torque value can also be used to replace the thrust T to calculate the elastic deformation amount.

[0073] x1=TREAL / k1… (1) x2=TREAL / k2… (2) x3=TREAL / k3… (3)

[0074] Figure 5 is a graph showing the relationship between the elastic deformation x and the displacement Lz and the thrust T in this embodiment. The horizontal axis in Figure 5 represents the thrust T. The vertical axis on the left side of Figure 5 represents the elastic deformation x, and the vertical axis on the right side represents the displacement Lz.

[0075] The first straight line (1) shown in Figure 5 is a proportional straight line representing the above formula (1), the second straight line (2) is a proportional straight line representing the above formula (2), and the third straight line (3) is a proportional straight line representing the above formula (3). The first elastic deformation amount x1 to the third elastic deformation amount x3 can be calculated by substituting the measured value TREAL into the above formulas (1) to (3) representing the first straight line (1) to the third straight line (3). Furthermore, the magnitude relationship between the first straight line (1) and the third straight line (3) is not limited to the magnitude relationship shown in Figure 5. The magnitude relationship between the first straight line (1) and the third straight line (3) varies according to the first spring constant k1 to the third spring constant k3.

[0076] As shown in Figure 4, the first calculation unit 62 outputs the first elastic deformation amount x1 to the third elastic deformation amount x3 to the estimation unit 63. The estimation unit 63 calculates the estimated value AODE of the actual overdrive by subtracting the first elastic deformation amount x1 to the third elastic deformation amount x3 from the movement amount Lz (0 < Lz) as described in the following formula (4).

[0077] AODE=LZ-x1-x2-x3… (4)

[0078] The above formula (4) has the following physical meaning. That is, as shown in Figure 3, when the device under test 100 presses the probe card 10, the thermal head 31 and the alignment stage 32 of the holding unit 30 are pressed in the -Z direction by the device under test 100, and deformed in a compressed manner in the Z direction. Therefore, the holding unit 30 is deformed in a compressed manner in the Z direction by a first elastic deformation amount x1. Similarly, the lower base 36 and the driving part 37 of the pressing unit 35 are also deformed in a compressed manner in the Z direction, and the pressing unit 35 is deformed in a compressed manner in the Z direction by a second elastic deformation amount x2.

[0079] Furthermore, the bridging beam 41 and column member 42 of the support part 40 are deformed by bending in the +Z direction and extending in the +Z direction, because they are pushed upward in the +Z direction by the probe card 10. As a result, the support part 40 deforms in the +Z direction by a third elastic deformation amount x3.

[0080] Therefore, the actual overdrive is less than the sum of the first elastic deformation x1 to the third elastic deformation x3 relative to the measured movement Lz. So by using the above formula (4), the estimated value AODE can be calculated based on the movement Lz and the thrust TREAL at a specific time point.

[0081] Furthermore, since the thickness of the device under test 100 and the substrate 11 are relatively thin compared to the components of the processor 20, the device under test 100 and the substrate 11 hardly undergo elastic deformation. Therefore, in this embodiment, the amount of elastic deformation of the device under test 100 and the substrate 11 is not considered.

[0082] The suggested value calculation unit 64 obtains the suggested value PODR for setting the overdrive relative to the AODO input from the actual overdrive input unit 300. Since the suggested value calculation unit 64 is not directly related to the estimation of the actual overdrive described in this embodiment, details of it will be described below.

[0083] The estimation unit 63 outputs the estimated value AODE to the determination device 70. The determination device 70 determines whether the calculated estimated value AODE is normal or abnormal. Although not particularly limited, the determination device 70 determines that if the estimated value AODE is smaller than the preset actual overdrive threshold, it is normal; conversely, if the estimated value AODE is larger than the aforementioned threshold, it is abnormal.

[0084] The determination device 70, when determining that the estimated value AODE is abnormal, outputs a stop signal SS to the drive control device 55. After the stop signal SS is input, the drive control device 55 controls the drive unit 37 to stop its movement in the +Z direction relative to the holding unit 30. Specifically, the drive control device 55 controls the drive unit 37 to stop the motor 371 of the drive unit 37.

[0085] Furthermore, the determination device 70, when determining that the estimated value AODE is abnormal, outputs a signal Sj to the notification device 75. This notification device 75 notifies the operator that the estimated value AODE is abnormal. The notification device 75 is, for example, a device capable of outputting light or sound to the outside; specifically, it could be a display, warning light, speaker, etc. Such a notification device 75 can notify the operator of the abnormal estimated value AODE through light or sound.

[0086] The second arithmetic unit 80 pre-calculates the first spring constant k1 to the third spring constant k3 before performing the actual overdrive estimation by the estimation device 60. Furthermore, this second arithmetic unit 80 outputs the calculated first spring constant k1 to the third spring constant k3 to the memory unit 61. The method for pre-measuring the first spring constant k1 to the third spring constant k3 using this second arithmetic unit 80 will be described below.

[0087] Figure 6 is a flowchart illustrating the pre-measurement steps of spring constants k1 to k3 in this embodiment. Furthermore, Figure 7 is a cross-sectional view showing the holding unit 30 raised to the first position P1 when the spring constants k1 to k3 are pre-measured in the semiconductor device testing equipment 1 of Figure 1; Figure 8 is a cross-sectional view showing the holding unit 30 raised to the second position P2 when the spring constants k1 to k3 are pre-measured in the semiconductor device testing equipment 1 of Figure 1. The dashed lines in Figure 8 represent the semiconductor device testing equipment 1, load cell 400, first measuring device 500, second measuring device 600, and dummy stage 700 in Figure 7. Moreover, the pre-measurement steps shown in Figure 6 correspond to an example of the "acquisition step" in this invention.

[0088] In the pre-measurement step of this embodiment, as shown in Figure 7, the spring constants k1 to k3 are calculated using the load element 400, the first measuring device 500, the second measuring device 600, and the dummy stage 700.

[0089] As shown in Figure 4, the load cell 400 measures the thrust (load) applied in the Z direction of the load cell 400 and outputs it to the second calculation unit 80. In this prior measurement step, the probe card 10 is not installed on the bridging beam 41, and the third deformation amount ΔD3 of the load cell 400 can be regarded as the actual overdrive of the contactor 12 of the probe card 10.

[0090] As shown in Figure 7, a first measuring device 500 is mounted on the holding unit 30. The first measuring device 500 measures the distance from the first measuring device 500 to the dummy stage 700. Furthermore, as shown in Figure 4, this first measuring device 500 outputs the measured distances H1 and H2 (described below) to the second arithmetic unit 80. Although not particularly limited, a laser displacement meter or the like can be used as the first measuring device 500.

[0091] As shown in Figure 7, the second measuring device 600 measures the distance from the second measuring device 600 to the upper surface of the support 40. This second measuring device 600 includes: a portal frame 601 disposed outside the processor 20, and a laser displacement meter 602 mounted on the portal frame 601 facing the upper surface of the bridging beam 41. As shown in Figure 4, the laser displacement meter 602 outputs the measured distances H3 and H4 (described below) to the second calculation unit 80.

[0092] As shown in Figure 7, the dummy stage 700 is a printed circuit board. As described above, in this pre-measurement step, the probe card 10 is not installed at the bridging beam 41. Instead of the aforementioned probe card 10, the substrate 11 is installed at the bridging beam 41. This dummy stage 700 is set up so that the pressure applied to the bridging beam 41 via the load cell 400 is similar to the pressure applied to the bridging beam 41 via the substrate 11 of the probe card 10. In this way, the deformation of the bridging beam 41 when the probe card 10 is installed can be reproduced in the pre-measurement step.

[0093] In the pre-measurement step, firstly, as shown in Figure 6, in step S101, the load cell 400 is held on the upper surface of the holding unit 30. Next, in step S102, the holding unit 30 is raised to the first position P1 by the drive unit 37, thereby bringing the load cell 400 into contact with the dummy stage 700, as shown in Figure 7. Furthermore, in this embodiment, the first position P1 is set to a position where the aforementioned movement amount Lz is 0. However, the first position P1 is not particularly limited, as long as it is a position where the load cell 400 can be brought into contact with the dummy stage 700.

[0094] In step S102 of this embodiment, the distance H measured by the first measuring device 500 is distance H1 (H = H1). Furthermore, in this step S102, no deformation occurs in the load element 400, the holding unit 30, the pressing unit 35, or the elastic deformation of the support part 40.

[0095] Next, in step S103 shown in Figure 6, as shown in Figure 7, the holding unit 30 is raised from the first position P1 to the second position P2 by the drive unit 37. At this time, the distance H measured by the first measuring device 500 is a shorter distance H2 than the distance H1 (H = H2 < H1). Furthermore, in this embodiment, the second position P2 is the position after the drive unit 37 raises the holding unit 30 by a set deformation amount POD according to the control signal Sd from the drive control device 55. Such a second position P2 is not particularly limited, as long as it is a position higher than the first position P1.

[0096] Next, in step S104 shown in Figure 6, the change in thrust T, ΔT, is obtained. As shown in Figure 4, the second calculation unit 80 can calculate the change ΔT from the output of the load element 400. Furthermore, ΔT can also be calculated based on the change in the measured value of the thrust sensor 372 of the drive unit 37.

[0097] In Figure 5, the fourth straight line (4) is shown, representing the relationship between the movement Lz obtained in the prior measurement step and the thrust T. In step S102, the thrust T output by the load cell 400 is 0. Then, in step S103, the drive control device 55 controls the drive unit 37 to raise the holding unit 30 by a movement LZP. In this embodiment, after this rise is completed, the measured thrust TP is the change ΔT (ΔT = TP).

[0098] Next, in step S105 shown in Figure 6, the third deformation ΔD3 in the Z direction of the load element 400 is obtained. In this embodiment, the spring constant k4 of the load element 400 is a known value, and the memory unit 61 stores this spring constant k4. The second calculation unit 80 calculates the third deformation ΔD3 of the load element 400 based on Hooke's law, according to the known spring constant k4 and the change ΔT obtained from the memory unit 61.

[0099] Next, in step S106 shown in Figure 6, the second deformation amount ΔD2 of the holding unit 30 is obtained. As shown in Figure 8, the second deformation amount ΔD2 can be obtained by subtracting the third deformation amount ΔD3 of the load element 400 from the distance ΔH between the first position P1 and the second position P2.

[0100] In this embodiment, the second calculation unit 80 first subtracts the distance H2 obtained from the first measuring device 500 in step S103 from the height distance H1 obtained from the first measuring device 500 in step S102, thereby calculating the distance ΔH (ΔH = H1 - H2) between the first position P1 and the second position P2. Furthermore, the second calculation unit 80 subtracts the third deformation amount ΔD3 from this distance ΔH to calculate the second deformation amount ΔD2 (ΔD2 = ΔH - ΔD3) of the holding unit 30.

[0101] Next, in step S107 shown in Figure 6, the first spring constant k1 of the holding unit 30 is calculated based on the change in thrust ΔT and the second deformation ΔD2.

[0102] Furthermore, in step S108 shown in Figure 6, the fourth deformation amount ΔD4 of the support portion 40 is obtained. The fourth deformation amount ΔD4 of the support portion 40 is the sum of the bending amount in the +Z direction of the bridging beam 41 and the elongation amount in the +Z direction of the column member 42. As shown in Figure 8, the fourth deformation amount ΔD4 can be calculated from the measurement value of the laser displacement meter 602.

[0103] The second calculation unit 80 in this embodiment calculates the fourth deformation amount ΔD4 (ΔD4=H3-H4) by subtracting the distance H3 output by the laser displacement meter 602 in step S102 from the distance H4 output by the laser displacement meter 602 in step S103.

[0104] Next, in step S109 shown in Figure 6, the third spring constant k3 of the support part 40 is calculated based on the change in thrust ΔT and the fourth deformation ΔD4.

[0105] Furthermore, in step S110 shown in Figure 6, the second calculation unit 80 obtains the fifth deformation amount ΔD5 of the pressing unit 35. The fifth deformation amount ΔD5 can be calculated by subtracting the distance ΔH and the fourth deformation amount ΔD4 from the movement amount LZP (ΔD5 = LZP - ΔH - ΔD4). In this text, since the distance ΔH is the sum of the second change amount ΔD2 and the third change amount ΔD3 mentioned above, the fifth deformation amount ΔD5 is calculated by subtracting the sum of the third elastic deformation amount ΔD3 of the load element 400, the second elastic deformation amount ΔD2 of the holding unit 30, and the fourth elastic deformation amount ΔD4 of the support part 40 in step S103 from the movement amount LZP (ΔD5 = LZP - ΔD2 - ΔD3 - ΔD4).

[0106] Next, in step S111 shown in Figure 6, the second calculation unit 80 calculates the second spring constant k2 of the pressing unit 35 based on the change in thrust ΔT and the fifth deformation ΔD5. Furthermore, when the drive unit 37 includes a drive belt that transmits power from the motor 371, the second spring constant k2 also takes into account the elongation of this drive belt.

[0107] In the above-described configuration, the first spring constant k1 to the third spring constant k3 can be calculated by the second arithmetic unit 80. The second arithmetic unit 80 outputs the calculated first spring constant k1 to the third spring constant k3 to the memory unit 61, and the memory unit 61 stores the first spring constant k1 to the third spring constant k3.

[0108] Next, a method for estimating actual overdrive using the semiconductor device testing equipment 1 described above will be explained. This method for estimating actual overdrive is an example of the "deformation estimation method" in this invention.

[0109] Figure 9 is a flowchart illustrating the actual overdrive estimation method in this embodiment. This actual overdrive estimation method is run after the device under test 100 is positioned by the alignment stage 32.

[0110] First, in step S201 of Figure 9, the drive control device 55 starts controlling the drive unit 37 to perform the rising of the holding unit 30 until the movement amount Lz becomes set overdrive. Next, in step S202, as shown in Figures 2 to 4, during the rising of the holding unit 30, the thrust TREAL is measured by the thrust sensor 372, and the movement amount Lz is measured by the stroke sensor 373. As shown in Figure 4, the measured thrust TREAL and movement amount Lz are output to the first calculation unit 62 of the estimation device 60.

[0111] Next, as shown in Figure 9, in step S203, the first calculation unit 62 calculates the first elastic deformation amount x1 to the third elastic deformation amount x3 from the measured thrust TREAL and the first spring constant k1 to the third spring constant k3. This step S203 is equivalent to an example of the "calculation step" in this invention.

[0112] Next, in step S204, the estimation unit 63 calculates the estimated value AODE based on the above formula (4) from the movement amount Lz and the first elastic deformation amount x1 to the third elastic deformation amount x3. This step S203 is equivalent to an example of the "estimation step" in this invention.

[0113] Next, in step S205, the determination device 70 determines whether the calculated estimated value AODE is normal or abnormal.

[0114] In step S205, if the estimated value AODE is determined to be normal by the determination device 70, in step S206, the drive control device 55 determines whether the movement amount Lz obtained by the travel sensor 373 has reached the set drive.

[0115] In step S206, if it is determined that the movement amount Lz has reached the set overdrive, in step S207, the drive control device 55 controls the drive unit 37 to complete the raising of the holding unit 30. On the other hand, in step S206, if it is determined that the movement amount Lz has not reached the set overdrive, the drive control device 55 controls the drive unit 37 to continue raising the holding unit 30.

[0116] Furthermore, in step S205, if the estimated value AODE is determined to be abnormal, in step S208, the drive control device 55 controls the drive unit 37 to stop the rise of the holding unit 30. Simultaneously, the notification device 75 notifies the operator that the estimated value AODE is abnormal.

[0117] As described above, as long as the semiconductor device test equipment 1 and the actual overdrive estimation method in this embodiment are used, the actual overdrive during the rise of the holding unit 30 can be estimated based on the thrust TREAL obtained from the thrust sensor 372.

[0118] Furthermore, as long as the semiconductor device testing equipment 1 and the actual overdrive estimation method in this embodiment are used, the actual overdrive when the contactor 12 is pressed against terminal 101 can be continuously monitored, so it is possible to determine whether the actual overdrive at this point in time is normal or abnormal. Therefore, since excessive actual overdrive when the contactor 12 is pressed against terminal 101 can be suppressed, damage to terminal 101 and contactor 12 can be reduced. Thus, the goal of increasing the lifespan of terminal 101 and contactor 12 can be achieved.

[0119] Furthermore, as long as the semiconductor device test equipment 1 in this embodiment and the actual overdrive estimation method are used, the recommended value of the set overdrive PODR corresponding to the expected actual overdrive AODD can be calculated. The expected actual overdrive AODD is, for example, the optimal value of the actual overdrive set corresponding to the type of probe card 10.

[0120] Figure 10 is a flowchart illustrating the calculation method of the suggested overdrive value PODR in this embodiment. As shown in Figure 10, firstly, in step S301, the expected actual overdrive AODD is input into the actual overdrive input unit 300 shown in Figure 4. The expected actual overdrive AODD is similar to the set overdrive described above; it can be a value set in the test program of the semiconductor device test equipment 1, or it can be a value input by the operator to the semiconductor device test equipment 1 before the test run of the device under test 100. The actual overdrive input unit 300 is not particularly limited, but it can also be a memory medium containing the test program, or it can be a user interface.

[0121] Next, in step S302, the expected actual overdrive AODD is input from the actual overdrive input unit 300 to the suggestion value calculation unit 64, and the suggestion value calculation unit 64 selects the setting overdrive corresponding to the expected actual overdrive AODD. Specifically, in this case, the memory unit 61 shown in Figure 4 stores, in addition to the first spring constant k1 to the third spring constant k3 mentioned above, a table showing the relationship between the setting overdrive and the thrust T. For example, in the formula of the fourth straight line (4) shown in Figure 5, by considering the movement amount Lz as the setting overdrive, a table containing the setting overdrive and the thrust T corresponding to this setting overdrive can be obtained.

[0122] Furthermore, the recommended value calculation unit 64, in addition to the first spring constant k1 to the third spring constant k3 mentioned above, substitutes the combination of the set overdrive included in this table and the thrust T corresponding to the aforementioned set overdrive into the following formula (5), and calculates a plurality of actual overdrives corresponding to the aforementioned combinations.

[0123] AOD=POD-T / k1-T / k2-T / k3... (5)

[0124] Furthermore, the recommended value calculation unit 64 selects the value of the set overdrive used when calculating the actual overdrive that is closest to the expected value of the actual overdrive AODD from the plurality of actual overdrives calculated by the above formula (5).

[0125] Next, in step S303, the recommended value calculation unit 64 outputs the selected setting overdrive as the recommended value PODR to the drive control device 55.

[0126] Next, in step S304, the drive control device 55 controls the drive unit 37 to raise the holding unit 30 to the recommended value PODR.

[0127] As long as the semiconductor device test equipment 1 and the actual overdrive estimation method described in this embodiment are used, the holding unit 30 can be raised to the recommended value PODR corresponding to the expected actual overdrive AODD. Therefore, the actual overdrive value can be set to be approximately the same as the expected actual overdrive AODD. Thus, a suitable actual overdrive method for the probe card type can be obtained by pressing the terminal 101 to the contactor 12, thereby reducing damage to the terminal 101 and the contactor 12. As a result, the lifespan of the terminal 101 and the contactor 12 can be extended.

[0128] [Second Implementation Form]

[0129] Figure 11 is a block diagram illustrating the structure of the drive unit 37 and its drive device 50 in the second embodiment. The drive unit 37 in the second embodiment does not have a thrust sensor 372 and a stroke sensor 373. In other words, it differs from the first embodiment in that it estimates the actual overdrive value without using the measurement results of the sensors, but the structure is otherwise similar. In the following text, only the differences between the second embodiment and the first embodiment regarding the estimation of actual overdrive will be explained; structural parts similar to those in the first embodiment will be given the same reference numerals and their descriptions will be omitted.

[0130] As shown in Figure 11, in this embodiment, the drive control device 55 outputs a drive signal Sd to the motor 371 and then to the holding unit 30. More specifically, the drive control device 55 supplies current to the motor 371, causing the motor 371 to generate a predetermined torque TQ. Furthermore, the drive control device 55 outputs a signal containing information about the torque TQ to the memory unit 61.

[0131] The memory unit 61 in this embodiment stores a table showing the relationship between torque TQ and thrust T, and obtains the thrust T corresponding to torque TQ from the aforementioned table. Although not particularly limited, this relationship between torque TQ and thrust T can be obtained based on the torque of motor 371 and the thrust detected by load cell 400 when performing the pre-measurement step (see Figure 6).

[0132] Furthermore, similar to the first embodiment, the memory unit 61 also stores a table showing the relationship between the indicated movement amount LZI and the thrust T, in addition to the first spring constant k1 to the third spring constant k3 described above. The memory unit 61 obtains the indicated movement amount LZI associated with the thrust T based on the thrust T corresponding to the input torque TQ and the formula of the fourth straight line (4) shown in Figure 5. Furthermore, this memory unit 61 outputs the thrust T corresponding to the torque TQ, the indicated movement amount LZI corresponding to the aforementioned thrust T, and the first spring constant k1 to the third spring constant k3 described above to the first calculation unit 62. Furthermore, as described above,

[0133] The first calculation unit 62, similar to the first embodiment, calculates the first elastic deformation amount x1 to the third elastic deformation amount x3 based on the first spring constant k1 to the third spring constant k3 and the thrust T. Furthermore, the first calculation unit 62 outputs the indicated movement amount LZI and the first elastic deformation amount x1 to the third elastic deformation amount x3 to the estimation unit 63. Also, as described above, since the thrust T can be expressed as a linear function of the torque of the motor 371 of the drive unit 37, the value of the torque TQ can also be used to replace the thrust T in calculating the elastic deformation amount.

[0134] The estimation unit 63 calculates the estimated value of the actual overdrive AODE by subtracting the first elastic deformation amount x1 to the third elastic deformation amount x3 from the movement amount Lzi, as shown in the following formula (6).

[0135] AODE=Lzi-x1-x2-x3… (6)

[0136] As described above, as long as the semiconductor device test equipment 1 in the second embodiment and the actual overdrive estimation method are used, the actual overdrive during the rise of the holding unit 30 can be estimated based on the torque TQ of the motor 371.

[0137] Furthermore, the embodiments described above are for the purpose of facilitating understanding of the present invention and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are also intended to include all design changes and equivalents that fall within the scope of the present invention.

[0138] For example, the actual overdrive estimation method described in the first and second embodiments is a method of estimating the actual overdrive in real time when the device under test 100 is pressed, but it is also possible to estimate the actual overdrive based on the expected setting overdrive PODD before the device under test 100 is pressed.

[0139] Figure 12 is a flowchart illustrating another actual overdrive estimation method in this embodiment. This actual overdrive estimation method is run before the start of the rise of holding unit 30.

[0140] As shown in Figure 12, firstly, in step S401, the intended setting overdrive PODD is input to the memory unit 61. Although not specifically illustrated, the intended setting overdrive PODD can be input to the memory unit 61 via the setting overdrive input unit 200.

[0141] Next, in step S402, the memory unit 61 obtains the thrust TD corresponding to the expected setting overdrive PODD. The thrust TD corresponding to the expected setting overdrive PODD is an estimated value of the thrust obtained when the movement amount Lz becomes the expected setting overdrive PODD. For example, such a thrust TD system can be obtained from the fourth line (4) shown in Figure 5. Specifically, in this fourth line (4), the value of the movement amount Lz can be set as the thrust when the expected setting overdrive PODD is obtained.

[0142] Next, in step S403, the first calculation unit 62 calculates the first elastic deformation amount xD1 to the third elastic deformation amount xD3 from the thrust TD and the first spring constant k1 to the third spring constant k3. At this time, the first calculation unit 62 can use the above formulas (1) to (3).

[0143] Next, in step S404, the estimation unit 63 calculates the estimated value AODE based on the following formula (7) from the expected set overdrive PODD and the first elastic deformation amount xD1 to the third elastic deformation amount xD3.

[0144] AODE=PODD-xD1-xD2-xD3... (7)

[0145] Next, in step S405, the determination device 70 determines whether the calculated estimated value AODE is normal or abnormal.

[0146] In step S405, if the determination device 70 determines that the estimated value AODE is normal, in step S406, the drive control device 55 starts the control of the drive unit 37 to raise the holding unit 30 to the expected set overdrive PODD.

[0147] On the other hand, in step S405, if the determination device 70 determines that the estimated value AODE is abnormal, in step S407, the drive control device 55 controls the drive unit 37 to stop the holding unit 30 from rising. Simultaneously, the notification device 75 notifies the operator that the estimated value AODE is abnormal.

[0148] As described above, as long as the semiconductor device test equipment 1 in this embodiment and the actual overdrive estimation method are used, the actual overdrive in the state of the holding unit 30 when the rise is completed can be estimated before the terminal 101 of the device under test 100 contacts the contactor 12.

[0149] Furthermore, as long as this semiconductor device test equipment 1 and the actual overdrive estimation method are available, the expected set overdrive PODD can be appropriately corrected when the predicted actual overdrive is abnormal, thereby suppressing the excessive actual overdrive. Therefore, the purpose of increasing the lifespan of terminal 101 and contactor 12 can be achieved. [Simplified Explanation of the Diagram]

[0033] Figure 1 is a cross-sectional view showing the semiconductor device testing apparatus according to the first embodiment of the present invention. Figure 2 is a cross-sectional view showing the state in which the terminal of the device under test (DUT) and the contactor of the probe card begin to contact in the semiconductor device testing apparatus of Figure 1. Figure 3 is a cross-sectional view showing the state in which the DUT is further raised from the state shown in Figure 2. Figure 4 is a block diagram illustrating the structure of the drive unit and its drive device according to the first embodiment of the present invention. Figure 5 is a graph showing the relationship between the elastic deformation and the amount of movement and the thrust according to the first embodiment of the present invention. Figure 6 is a flowchart illustrating the pre-measurement step of the spring constant according to the first embodiment of the present invention. Figure 7 is a cross-sectional view showing the state in which the holding unit is raised to the first position when the spring constant is pre-measured in the semiconductor device testing apparatus of Figure 1. Figure 8 is a cross-sectional view showing the state in which the holding unit is raised to the second position when the spring constant is pre-measured in the semiconductor device testing apparatus of Figure 1. Figure 9 is a flowchart illustrating the actual overdrive estimation method according to the first embodiment of the present invention. Figure 10 is a flowchart illustrating the calculation method for setting the suggested overdrive value in the first embodiment of the present invention. Figure 11 is a block diagram illustrating the structure of the drive unit and its drive device in the second embodiment of the present invention. Figure 12 is a flowchart illustrating another practical overdrive estimation method in an embodiment of the present invention.

Claims

1. A semiconductor device testing apparatus, comprising: Hold the device, hold the component under test; A connection device having a contactor that contacts the terminals of the component under test; The pressing device includes: a drive unit for pressing a terminal toward a contact by moving a holding device in a first direction; a base unit supporting the drive unit; a support unit for supporting the connecting device so that the connecting device faces the holding device and is supported by the base unit; an estimation device for estimating a first deformation of the contact in the first direction based on the thrust of the drive unit in the first direction; and a drive control device for controlling the drive unit to move the holding device by an indicated movement amount in the first direction; wherein the estimation device calculates an estimated value of the first deformation amount based on the indicated movement amount, a first elastic deformation of the holding device, a second elastic deformation of the pressing device, and a third elastic deformation of the support unit.

2. The semiconductor device testing equipment as described in claim 1, wherein, The estimation device includes: a memory unit for storing a first spring constant of the holding device, a second spring constant of the pressing device, and a third spring constant of the support unit; a calculation unit for calculating the first elastic deformation amount to the third elastic deformation amount based on the first spring constant to the third spring constant and the thrust; and an estimation unit for calculating the estimated value based on the indicated movement amount and the first elastic deformation amount to the third elastic deformation amount.

3. The semiconductor device testing equipment as described in claim 2, wherein, The memory unit further stores the indicated movement amount associated with the thrust; the estimation unit uses the indicated movement amount associated with the thrust as the indicated movement amount.

4. The semiconductor device testing equipment as described in claim 1 further includes: The determination device determines whether the estimated value of the first deformation calculated by the estimation device is normal or abnormal.

5. The semiconductor device testing equipment as described in claim 4, wherein, If the determination device determines that the estimated value is abnormal, the drive control device controls the drive unit to stop the movement of the drive unit toward the first direction of the holding device.

6. The semiconductor device testing equipment as described in claim 4 further includes: Notify the device that the estimated value is abnormal.

7. A semiconductor device testing apparatus, comprising: Hold the device, hold the component under test; 4. A connection device having a contactor that contacts the terminals of the component under test; The pressing device includes: a drive unit for pressing a terminal toward a contact by moving a retaining device in a first direction; a base unit supporting the drive unit; a support unit for supporting the connecting device so that the connecting device faces the retaining device and is supported by the base unit; an estimation device for estimating a first deformation amount of the contact in the first direction based on the thrust of the drive unit in the first direction; and a drive control device for controlling the drive unit to deform the contact in the first direction by a preset deformation amount by pressing with the drive unit; wherein the estimation device further includes a suggested value calculation unit for calculating a suggested value of the set deformation amount based on an optimal value of the first deformation amount corresponding to the type of connecting device and the thrust, so that the suggested value of the first deformation amount becomes the optimal value; wherein the drive control device controls the drive unit based on the suggested value.

8. The semiconductor device testing equipment as described in claim 1, wherein, The device under test comprises a monolithic die; the connection device includes a probe card, wherein the probe card includes the contact, wherein the contact contacts the terminal included in the die.

9. A deformation estimation method for estimating a first deformation in a semiconductor device testing apparatus as described in any one of claims 1 to 8, the deformation estimation method comprising: The estimation step involves estimating the first deformation based on the thrust.

10. The method for estimating deformation as described in claim 9, wherein, The estimation step includes: calculating an estimated value of the first deformation based on the indicated movement of the holding device in the first direction indicated by the drive control device, the first elastic deformation of the holding device, the second elastic deformation of the pressing device, and the third elastic deformation of the support portion.

11. The deformation estimation method described in claim 10 further includes: The step involves obtaining the first spring constant of the retaining device, the second spring constant of the pressing device, and the third spring constant of the support part; And the calculation steps, based on the first spring constant to the third spring constant and the thrust, calculate the first elastic deformation amount to the third elastic deformation amount.

12. The deformation estimation method as described in claim 11, wherein, The acquisition step includes: moving the holding device from a first position to a second position by means of the drive unit; acquiring the change in thrust when the holding device moves from the first position to the second position; acquiring the second deformation of the holding device in the first direction when the holding device moves from the first position to the second position; and calculating the first spring constant based on the change in thrust and the second deformation.

13. The deformation estimation method as described in claim 12, wherein, The support includes: a bridging beam with a dummy platform mounted on it; and a column member vertically erected on the base and supporting the bridging beam. The acquisition step includes: holding the load element in the holding device; moving the holding device to the first position by the drive unit, bringing the load element into contact with the dummy platform; obtaining a third deformation of the load element in the first direction when the holding device is in the second position; and obtaining a second deformation by subtracting the third deformation from the distance between the first position and the second position.

14. The method for estimating deformation as described in claim 12, wherein, The acquisition step includes: acquiring a fourth deformation amount in the first direction of the support portion when the holding device is moved from the first position to the second position by the drive portion; and calculating the third spring constant of the support portion based on the change in thrust and the fourth deformation amount.

15. The deformation estimation method as described in claim 14, wherein, The acquisition step includes: subtracting the distance between the first position and the second position and the fourth deformation from the preset deformation of the contactor, thereby calculating the fifth deformation in the first direction of the pressing device; and calculating the second spring constant of the pressing device based on the change in thrust and the fifth deformation.

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