Substrate information acquisition device and substrate conveying device equipped with the same

Abstract

This invention provides a substrate information acquisition apparatus that accurately acquires substrate information by clearly defining the boundary between the substrate and the background. The camera of this substrate information acquisition apparatus captures a pattern from the loading / unloading outlet side. Viewed from the loading / unloading outlet, the pattern is asymmetrical vertically relative to the substrate surface and tilted at a predetermined angle in a straight line. When the substrate has warping or other irregularities, the pattern is reflected on the substrate surface, displaying a reversed reflective pattern. Therefore, the image captured by the camera is less susceptible to the influence of reflected light from the substrate surface, thus clearly defining the boundary between the substrate and the background. As a result, the substrate information acquisition unit captures reflective patterns at angles different from the pattern in the image, and can accurately calculate substrate information, including the shape of the substrate, including warping or other irregularities.

Description

Technical Field

[0001] The present invention relates to a substrate information acquisition apparatus for acquiring substrate information including the shape of substrates such as FPD (Flat Panel Display) substrates, photomask glass substrates, and optical disc substrates, which are semiconductor substrates, liquid crystal display or organic EL (Electroluminescence) display devices, and a substrate transport apparatus having the same. Prior Technology

[0002] Previously, such devices have included a robotic arm, a substrate holding hand, a camera, and a control unit (for example, see Patent Document 1).

[0003] A substrate holding hand is mounted on the fore-end of a robotic arm. The substrate holding hand moves forward and backward toward a carrier that separates and stacks multiple substrates using the extension and retraction of the robotic arm. The substrate holding hand moves downward toward the substrates being transported. A camera unit is mounted on the substrate holding hand. The camera unit photographs the multiple substrates stored in the carrier. Based on the images captured by the camera unit, a control unit obtains substrate information, including the vertical position of the stored substrates and their shape, such as warpage. Based on this substrate information, the control unit determines the gaps between the substrates stacked in the carrier and moves the substrate holding hand toward the carrier according to these gaps.

[0004] [Previous Technical Documents] [Patent Literature] [Patent Document 1] Japanese Patent Application Publication No. 2023-30876 Summary of the Invention

[0005] [The problem the invention aims to solve] However, in cases with such a configuration as the precedent, the following problems arise. In other words, the previous device had the following problem: due to the influence of reflected light from the substrate surface, it was impossible to accurately obtain substrate information based on the image captured by the camera. For example, when there was warping in the deeper part of the substrate located on the camera side, the boundary between the substrate and the background could not be accurately distinguished, thus making it impossible to accurately obtain substrate information. Therefore, the gap could not be accurately determined, which could hinder the transport of the substrate.

[0006] The present invention was made in view of this situation, and its purpose is to provide a substrate information acquisition device that can accurately acquire substrate information by making the boundary between the substrate and the background clear, and a substrate transport device having the same.

[0007] [Technical means to solve the problem] To achieve this objective, the present invention employs the following configuration. That is, the substrate conveying device of technical solution 1 can separately store multiple substrates in a horizontal position, and can move substrates into and out of a receiving container formed on one side of the receiving container, and obtain substrate information including the shape of the substrates stored in the receiving container. The device is characterized by including: a pattern, which, when viewed from above, is disposed on the opposite side of the receiving container across the substrates stored in the receiving container, and when viewed from the receiving container, is asymmetrical vertically with respect to the surface of the substrate, and is inclined in a straight line at a predetermined angle; a photographic unit that photographs the pattern from the receiving container side; and a substrate information calculation unit that extracts the pattern from the image captured by the photographic unit, and the reflected pattern from a reflected pattern on the substrate that is different from the pattern at the predetermined angle, and calculates the substrate information.

[0008] [Function and Effect] According to the invention of technical solution 1, the photographic unit captures a pattern from the loading / unloading outlet side. When viewed from the loading / unloading outlet, the pattern is asymmetrical vertically relative to the surface of the substrate and tilted at a predetermined angle in a straight line. Therefore, when the substrate shape is not warped, the pattern is reflected in the image in its original form in areas outside the substrate. On the other hand, when the substrate shape is warped, the pattern is reflected on the substrate surface, resulting in a reversed reflective pattern. Therefore, the image captured by the photographic unit is less affected by reflected light from the substrate surface, making the boundary between the substrate and the background clearer. As a result, the substrate information calculation unit captures reflective patterns at angles different from the pattern in the image and can accurately calculate substrate information including the shape of the substrate, including warping.

[0009] Furthermore, in this invention, the aforementioned substrate information calculation unit preferably calculates the positions of the upper and lower surfaces of the aforementioned substrate as the aforementioned substrate information (Technical Solution 2).

[0010] The positions of the upper and lower surfaces of the substrate are further calculated as substrate information. Therefore, the spacing between this substrate and other substrates stacked above and below it in the receiving container can be calculated. As a result, the spacing between this substrate and adjacent substrates along the vertical direction can be calculated.

[0011] Furthermore, in this invention, the aforementioned substrate information calculation unit preferably performs edge extraction on the image captured by the aforementioned photographic unit, and after removing pixels of a predetermined size or larger as noise, extracts the aforementioned reflective pattern (Technical Solution 3).

[0012] The substrate information calculation unit performs edge extraction on the image captured by the imaging unit. After removing pixels larger than a specified size as noise, it captures the reflection pattern. Therefore, the influence of noise can be suppressed, and the reflection pattern can be captured accurately. As a result, the substrate information can be calculated accurately.

[0013] Furthermore, in this invention, the aforementioned substrate information calculation unit preferably captures the aforementioned reflection pattern based on the aforementioned predetermined angle (Technical Solution 4).

[0014] The angle of the reflected pattern differs from that of the pattern at a specified angle. Therefore, the substrate information calculation unit can extract a reflected pattern that differs from the pattern based on the specified angle of the pattern.

[0015] Furthermore, in this invention, it is preferable to further include: a camera unit moving mechanism that moves the camera unit along the direction of the aforementioned plurality of substrate stacks; and a camera unit moving mechanism control unit that controls the movement of the aforementioned camera unit moving mechanism; and the aforementioned camera unit moving mechanism control unit operates the aforementioned camera unit moving mechanism to take pictures of the plurality of aforementioned substrates housed in the aforementioned receiving container with the aforementioned camera unit; and the aforementioned substrate information calculation unit obtains the aforementioned substrate information with respect to all the aforementioned substrates housed in the aforementioned receiving container (Technical Solution 5).

[0016] The camera movement mechanism control unit can operate the camera movement mechanism to photograph multiple substrates stored in the receiving container. Therefore, the substrate information calculation unit can obtain substrate information for all substrates stored in the receiving container.

[0017] Furthermore, in this invention, the substrate conveying device preferably includes: a substrate information acquisition device as described in any of the above claims; a hand that holds the aforementioned substrate; a hand drive unit that drives the aforementioned hand to move forward and backward relative to the aforementioned receiving container for conveying the aforementioned substrate, and drives the aforementioned hand to move up and down in the vertical direction; and a hand drive unit control unit that operates the aforementioned hand drive unit based on the aforementioned substrate information acquired by the aforementioned substrate information acquisition device (Technical Solution 6).

[0018] Based on the substrate information acquired by the substrate information acquisition device, the hand drive control unit operates the hand drive unit. Therefore, the substrate transport device can move the hand forward and backward without contacting the multiple substrates housed in the receiving container.

[0019] Furthermore, in this invention, it is preferable to further include a determination unit, which determines whether the hand can enter or exit the aforementioned receiving container based on the aforementioned substrate information obtained by the aforementioned substrate information acquisition device (Technical Solution 7).

[0020] In situations where the spacing between substrates is narrow and there is a risk of hand contact, the determination unit can prevent hands from entering or leaving the substrate. Therefore, there is no risk of the substrate being damaged due to hand contact. [Effects of the Invention]

[0021] According to the substrate information acquisition apparatus of the present invention, the photographic unit captures a pattern from the loading / unloading outlet side. When viewed from the loading / unloading outlet, the pattern is asymmetrical vertically relative to the surface of the substrate and tilted at a predetermined angle in a straight line. Therefore, when the substrate shape is not warped, the pattern is reflected in the image in its original form in areas other than the substrate. On the other hand, when the substrate shape is warped, the pattern is reflected on the substrate surface, resulting in a vertically reversed reflected pattern. Therefore, the image captured by the photographic unit is less susceptible to the influence of reflected light from the substrate surface, making the boundary between the substrate and the background more distinct. As a result, the substrate information calculation unit captures reflected patterns at angles different from the pattern in the image and can accurately calculate substrate information including the shape of the substrate, including warping. Simple Explanation of the Diagram

[0022] Figure 1 is a top view showing the overall configuration of the substrate processing apparatus of the embodiment. Figure 2 is a diagram of the substrate processing device in Figure 1 viewed from the rear (X). Figure 3 is a side view showing the main parts of the embodiment. Figure 4 is a top view showing the main parts of the embodiment. Figure 5 shows a detail of the pattern. Figure 6 is a schematic diagram showing an example of a pattern viewed from the camera side. Figure 7 is a flowchart of one example of information acquisition and processing for a display substrate. Figures 8(a) to (e) are schematic diagrams illustrating the process of obtaining substrate information for a non-warped substrate. Figures 9(a) to (e) are schematic diagrams illustrating the process of obtaining substrate information for a non-warped substrate. Figures 10(a) to (c) are schematic diagrams illustrating the process of obtaining substrate information for a non-warped substrate. Figures 11(a) to (e) are schematic diagrams illustrating the process of obtaining substrate information for an upwardly warped substrate. Figures 12(a) to (e) are schematic diagrams illustrating the process of obtaining substrate information for an upwardly warped substrate. Figures 13(a) to (c) are schematic diagrams illustrating the process of obtaining substrate information for an upwardly warped substrate. Figure 14 is a flowchart illustrating an example of the transport operation of a display substrate. Implementation

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0024] Figure 1 is a top view showing the overall configuration of the substrate processing apparatus of the embodiment. Figure 2 is a view of the substrate processing apparatus of Figure 1 viewed from the rear (X) direction.

[0025] <1. Overall Composition>

[0026] The substrate processing apparatus 1 includes a transfer block 3, a transfer unit block 5, and a processing block 7.

[0027] The substrate processing apparatus 1 processes substrate W. Substrate W is, for example, circular in top view. The substrate processing apparatus 1 performs a cleaning process on substrate W, for example. The substrate processing apparatus 1 processes substrate W in a single-piece manner within the processing block 7. One substrate W is processed sequentially in a horizontal position.

[0028] For convenience, in this specification, the orientation of the loading / unloading block 3, the transfer block 5, and the processing block 7 is referred to as the "front-back direction X". The front-back direction X is horizontal. The direction from the processing block 7 towards the loading / unloading block 3 in the front-back direction X is called "front". The opposite direction of the front is called "rear". The horizontal direction orthogonal to the front-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called "right". The opposite direction of the right is called "left". The direction perpendicular to the horizontal direction is called the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0029] <2. Moving In / Out Block>

[0030] The loading / unloading block 3 includes an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged along the width direction Y. Multiple substrates W (e.g., 25) are stacked and stored horizontally at certain intervals within a carrier C. The carrier C, containing the unprocessed substrates W, is placed in the input section 9. The input section 9, for example, includes two mounting stages 13 for holding the carriers C. The carriers C separate the surfaces of the substrates W from each other, receiving the substrates W one by one. The carriers C, for example, receive the substrates W with the front side facing upwards. For example, a FOUP (Front Opening Unify Pod) can be used as the carrier C. FOUP is a sealed container. The carrier C can be an open container, and its type is not limited. Within the carrier C, the transmittance of visible light varies depending on the material. In carrier C, there are those with low transmittance of visible light due to the material, but high transmittance of infrared light.

[0031] The output section 11 is positioned opposite the input section 9, across the center of the substrate processing apparatus 1 in the width direction Y. The output section 11 is located to the left of the input section 9, Y. The output section 11 collects the processed substrate W into the carrier C and outputs it to each carrier C. The output section 11, which functions in the same way as the input section 9, includes, for example, two mounting stages 13 for placing the carrier C. The input section 9 and the output section 11 are also referred to as wafer loading and unloading machines.

[0032] <3. Transporter Block>

[0033] The transfer block 5 is disposed adjacent to the transfer block 3 of the substrate processing apparatus 1. The transfer block 5 includes a transfer robot IR and a transfer section 15.

[0034] The transfer robot IR is configured to rotate about a rotation axis parallel to the vertical direction Z. The transfer robot IR is also configured to move along the width direction Y. The transfer robot IR includes a first hand 19 and a second hand 21. In Figure 1, only one hand is shown for illustration purposes. The first hand 19 and the second hand 21 each hold a substrate W. The first hand 19 and the second hand 21 are configured to independently move forward and backward in the front-back direction X. The transfer robot IR moves along the width direction Y and rotates about the vertical direction Z, causing the first hand 19 and the second hand 21 to move forward and backward, exchanging substrate W with each cartridge C. Similarly, the transfer robot IR exchanges substrate W with the exchange section 15. The direction of movement of the first hand 19 and the second hand 21 when exchanging substrate W with the carrier C is defined as the forward / backward direction FD.

[0035] The junction 15 has a first reversing unit 23, a path section 25, a path section 27, and a second reversing unit 29 in the direction below and above the vertical direction Z.

[0036] The first reversal unit 23 reverses the vertical orientation of the substrate W received by the self-transfer block 5. The first reversal unit 23 reverses the horizontal orientation of the substrate W. The second reversal unit 29 performs the opposite operation. That is, the second reversal unit 29 reverses the vertical orientation of the substrate W received by the self-processing block 7.

[0037] The reversal directions of the first reversal unit 23 and the second reversal unit 29 described above can be opposite to each other. That is, the first reversal unit 23 reverses the orientation of the substrate W in a face-up position. The second reversal unit 29 reverses the orientation of the substrate W in a back-up position.

[0038] Path sections 25 and 27 are used for transferring substrate W between transport block 5 and processing block 7. Path section 25 is used, for example, to transport substrate W from processing block 7 to transport block 5. Path section 27 is used, for example, to transport substrate W from transport block 5 to processing block 7. Furthermore, the transport directions of substrate W in path sections 25 and 27 can be opposite to each other.

[0039] <4. Processing Block>

[0040] Processing block 7 performs a cleaning process on substrate W, for example. The cleaning process involves, for example, a brush in addition to a cleaning solution. As shown in Figure 1, processing block 7 is divided into three rows: R1 (first row), R2 (second row), and R3 (third row) along the width direction Y. Specifically, R1 (first row) is positioned on the left side of the Y direction. R2 (second row) is positioned in the center of the width direction Y. In other words, R2 (second row) is positioned to the right of R1 (first row). R3 (third row) is positioned to the right of R2 (second row).

[0041] <4-1. Line 1>

[0042] The first row R1 of processing block 7 has a plurality of processing units 31. For example, the first row R1 has four processing units 31. The four processing units 31 are stacked in the first row R1 along the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. As a cleaning unit, for example, there is a front cleaning unit that cleans the front side of the substrate W, and a back cleaning unit that cleans the back side of the substrate W.

[0043] <4-2. Line 2>

[0044] The second row R2 of processing block 7 includes a central robot CR. The central robot CR is configured to rotate about a rotation axis parallel to the vertical direction Z. The central robot CR is also configured to move up and down along the vertical direction Z. The central robot CR, for example, includes a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold a substrate W. The first hand 33 and the second hand 35 are configured to independently move forward and backward in the front-back direction X and the width direction Y.

[0045] <4-3. Line 3>

[0046] The third row R3 of processing block 7 has the same configuration as the first row R1. That is, the third row R3 has a plurality of processing units 31. For example, the third row R3 has four processing units 31. The four processing units 31 in the third row R3 are stacked along the vertical direction Z. The processing units 31 of the first row R1 and the processing units 31 of the third row R3 are arranged facing each other in the width direction Y. In this way, the central robot CR can move in and out of the opposing processing units 31 of the first row R1 and the third row R3 at the same height in the vertical direction Z.

[0047] Processing block 7 is configured as described above. Here, a simplified explanation of the operation of the central robot CR is provided. The central robot CR receives substrate W from the first reversal unit 23, for example. The central robot CR transports substrate W to processing units 31 in either row R1 or row R3 for processing. The central robot CR receives substrate W that has been processed in processing units 31 in either row R1 or row R3. The central robot CR transports substrate W to the second reversal unit 29.

[0048] <5. Platform>

[0049] As shown in Figure 1, the loading and unloading block 3 has a loading platform 13 and a cover opening and closing mechanism 41.

[0050] The mounting platform 13 holds the carrier rack C. The carrier rack C has an inlet / outlet CT. The inlet / outlet CT is formed on one side of the carrier rack C. The carrier rack C has a cover (not shown). The cover is configured to allow for easy installation and removal of the inlet / outlet CT of the carrier rack C. The cover seals the interior of the carrier rack C. When the cover is installed, the carrier rack C is isolated from the external gas environment.

[0051] The cover opening and closing mechanism 41 removes the cover from the carrier C or installs the cover onto the carrier C. By lowering the cover while holding it in place, the cover opening and closing mechanism 41 can set the loading and unloading outlet CT of the carrier C to be fully open.

[0052] <6. Control System>

[0053] Here, the control system of the substrate processing apparatus 1 is described. The substrate processing apparatus 1 is controlled by a control unit CU. The control unit CU is equipped with a CPU or memory, etc. The control unit CU operates according to a pre-memorized program. The control unit CU controls the cap opening and closing mechanism 41 for cap removal and lifting, and the cap opening and closing mechanism 41 for raising and lowering. The control unit CU controls the transfer robot IR. Specifically, the control unit CU controls the movement of the first hand 19 and the second hand 21 in the forward and backward direction FD, the movement of the first hand 19 and the second hand 21 in the vertical direction Z, and the rotation of the transfer robot IR around the vertical direction Z. The control unit CU controls the processing of the substrate W in the processing unit 31. The control unit CU controls the central robot CR.

[0054] <7. Transfer Robot and Platform>

[0055] Next, referring to Figure 3, details regarding the transfer robot IR and the platform 13 will be described. Figure 3 is a side view showing the main parts of the embodiment.

[0056] Here, the first hand 19 of the transport robot IR is used as an example for explanation, but the second hand 21 has the same configuration. In addition, in Figure 3, the carrier C is shown with the cover removed, and the plurality of grooves that support the front X and width Y ends of the substrate W are omitted.

[0057] The lifting, rotating, and forward / backward movements (FD) of the first hand 19 in the transport robot IR are performed by the hand drive unit 43. The transport robot IR includes a position output unit 45. The position output unit 45 outputs position information relative to a preset reference position of the first hand 19, including vertical height information (Z), forward / backward position information (X), and left / right position information (Y), to the control unit CU. Based on the position information from the position output unit 45, the control unit CU operates the hand drive unit 43. Thus, the first hand 19 is controlled by the control unit CU.

[0058] The first hand part 19 has a camera 47 at its base end (behind the front-rear direction X). The camera 47 is sensitive to visible light, for example. The camera 47 has a defined field of view, for example. The defined field of view is preferably such that when observing a substrate W directly opposite the loading / unloading outlet CT, it includes the substrate W and at least includes the vertical region along the vertical direction Z with respect to the storage pitch of the substrate W in the carrier C. That is, when observing the substrate W facing a substrate W along the forward / backward direction FD, it includes the substrate W and at least includes the region of the substrate W that is separated from the substrate W and arranged adjacent to it along the vertical direction Z. The camera 47 has a photographic area of ​​a ZY plane formed by the vertical direction Z and the width direction Y. In addition, the width direction Y in the field of view preferably extends at least to the inner side of the grooves on both ends of the width direction Y. Also, the camera 47 is preferably telecentric on the object side. In this way, distortion of the photographed substrate W can be suppressed, thereby improving the accuracy of the substrate information.

[0059] Camera 47 is connected to substrate information acquisition unit 49. Substrate information acquisition unit 49 is connected to control unit CU. Position output unit 45 is connected to substrate information acquisition unit 49. Substrate information acquisition unit 49 controls the imaging conditions and imaging sequence of camera 47. Based on the image output from camera 47, substrate information acquisition unit 49 acquires substrate information about substrate W, including its position in the vertical direction Z. Details on how substrate information is acquired will be described later.

[0060] A pattern 51 and a light source 53 are provided on the mounting stage 13. The pattern 51 and the light source 53 are vertically disposed on the mounting stage 13. The light source 53 illuminates light in the rearward direction X. The light illuminated by the light source 53 includes visible light. The pattern 51 and the light source 53 are disposed in front of the carrier C in the rearward direction X. The pattern 51 is disposed between the outer side of the carrier C in the rearward direction X and the light source 53. The pattern 51 is disposed on the outer side of the carrier C opposite to the loading / unloading outlet CT in the frontward direction X. In top view, the pattern 51 is disposed on the opposite side of the loading / unloading outlet CT, separated by the substrate W housed in the carrier C. The pattern 51 and the light source 53 are disposed in the mounting stage 13 at a position that does not interfere with the carrier C. The pattern 51 and the light source 53 are disposed slightly apart in the frontward direction X.

[0061] The light source 53 can be illuminated by the control unit CU only when taking images FG as described later, and turned off when not taking images. In this way, power saving can be achieved.

[0062] Here, refer to Figures 4 and 5. Figure 4 is a top view showing the main parts of the embodiment. Figure 5 is a detail view showing the pattern.

[0063] Pattern 51 comprises a component body 55 and a pattern body 57. The component body 55 is composed of a component through which light from the light source 53 passes. The pattern body 57 is disposed behind the component body 55 in a front-rear direction X. The pattern body 57 is composed of a component with low transmittance to light from the light source 53. In other words, the pattern body 57 blocks the light from the light source 53.

[0064] The pattern body 57 is a straight line of a specified width. The pattern body 57 is tilted at a specified angle relative to the vertical direction Z. The pattern body 57 tilts downwards to the right relative to the vertical direction Z. The pattern body 57 is continuous and uninterrupted in the tilting direction. The specified angle of the pattern body 57 is, for example, 45°. A plurality of pattern bodies 57 are formed. The plurality of pattern bodies 57 are arranged at intervals. The interval between each pattern body 57 is, for example, a fixed interval. When the substrate W is viewed horizontally from the loading / unloading outlet CT, as shown by the two-point chain line in Figure 5, the pattern body 57 is asymmetrical vertically, with the surface of the substrate W extending along the width direction Y as a reference.

[0065] The camera 47, mounted on the hand 19, has a photographic center C1. The photographic center C1 is the center of the lens (not shown) of the camera 47 and the center of the image output by the camera 47. Preferably, the camera 47 is mounted on the hand 19 such that, in a top-view orientation, the photographic center C1 coincides with the center cp of the substrate W in the width direction Y. This is because the captured image is obtained through an optical system, and the closer to the center, the less distortion. This is also because, when determining the vertical distance Z between substrates W that are warped or deformed, based on substrate information, the closer to the center cp of the substrate W, the more important it is. The camera 47 has a top-view field of view that includes both ends in the width direction Y. In Figure 4, the field of view is represented by a chain extending from the camera 47 along the front-rear direction X.

[0066] <8. Images>

[0067] Here, refer to Figure 6. Figure 6 is a schematic diagram showing an example of a pattern viewed from the camera side.

[0068] Figure 6 shows the state of pattern 51 observed from the CT side of the loading / unloading outlet via three substrates W. Substrate W1 shows no warping or other deformation. Substrate W2 shows upward convex warping (so-called umbrella-shaped deformation). Substrate W3 shows downward convex warping (so-called bowl-shaped deformation).

[0069] When the substrates W1 to W3 are observed horizontally at the loading and unloading points via the CT scanner, the undeformed substrate W1 appears to have only its outer peripheral surface as shadowed. The upper and lower surfaces of the unwarped substrate W1 are not visible. Therefore, the pattern body 57 constituting the background is seen intact above and below the outer peripheral surface of substrate W1. That is, only the pattern body 57, tilted downwards to the right, is seen above and below the outer peripheral surface of substrate W1. Furthermore, in substrates W offset from the imaging center C1, even if the substrate W itself is undeformed, it is photographed at an angle. Therefore, the pattern body 57 sometimes appears reversed.

[0070] The convex-shaped substrate W2 appears to have its outer peripheral surface in shadow. Furthermore, on the shadow of the outer peripheral surface of the convex-shaped substrate W2, a reflective pattern 61, which is vertically reversed from the pattern body 57 constituting the background, is seen. That is, the reflective pattern 61 is seen on the surface above the shadow of the outer peripheral surface of the convex-shaped substrate W2. The reflective pattern 61 is tilted downwards to the left, opposite to the pattern body 57. The pattern body 57 located on the convex portion of the substrate W2 (the pattern body 57 located at the front of the convex portion of the substrate W2) is not visible from the loading / unloading outlet CT side. However, the pattern body 57 located above the convex portion of the substrate W2 is seen through reflection from the convex portion. Therefore, in the convex portion of the substrate W2, the pattern body 57 is seen as the reflective pattern 61.

[0071] The deformed substrate W3, which is convex downwards, appears to have its outer peripheral surface shaded. Furthermore, a reflective pattern 61 is seen beneath the shadow of the outer peripheral surface of the deformed substrate W3, which is convex downwards. That is, a reflective pattern 61 is seen on the surface beneath the shadow of the outer peripheral surface of the deformed substrate W3, which is convex downwards. The reflective pattern 61 is tilted downwards to the left, opposite to the pattern body 57 that forms the background. The pattern body 57 located on the convex portion of the substrate W3 is not visible from the loading / unloading outlet CT side. However, the pattern body 57 located below the convex portion of the substrate W3 is seen reflected from the convex portion. Therefore, in the convex portion of the substrate W3, the pattern body 57 is seen as the reflective pattern 61.

[0072] As shown in FIG. 6, camera 47 captures an image FG represented by a two-point chain line when substrate W2 is placed at the imaging center C1. As described above regarding the field of view, image FG, for example, when observing a substrate W directly opposite the loading / unloading outlet CT, includes the substrate W and encompasses a vertical region along the Z direction at least at a distance equivalent to the storage pitch of substrate W in the carrier C. However, in FIG. 6, it is depicted in a slightly smaller area to make the two-point chain line representing image FG easily identifiable. Substrate information acquisition unit 49 receives image FG from camera 47. Substrate information acquisition unit 49 receives height position information from position output unit 45. Based on the substrate W, pattern body 57, and reflective pattern 61 in image FG, substrate information acquisition unit 49 acquires substrate information including the shape of the substrate W, such as warping, or calculates the vertical Z-direction spacing of substrate W based on the substrate information. Details of this processing are explained below.

[0073] <9. Action Flow>

[0074] In the following description, we will take the case of processing a substrate W1 without warping and a substrate W2 with warping that is convex upwards as examples.

[0075] <9-1. Obtaining substrate information>

[0076] Here, refer to Figures 7-13. Figure 7 is a flowchart showing an example of the substrate information acquisition process. Figures 8-10 are schematic diagrams illustrating the process of acquiring substrate information for a non-warped substrate. Figures 11-13 are schematic diagrams illustrating the process of acquiring substrate information for an upwardly warped substrate. That is, Figures 8-10 focus on substrate W1 in Figure 6, and Figures 11-13 focus on substrate W2 in Figure 6.

[0077] Step S1 Under the control of the control unit CU, the substrate information acquisition unit 49 operates the camera 47 to capture an image FG. The substrate information acquisition unit 49 reads the image FG captured by the camera 47. For ease of understanding, the following explanation assumes processing an image FG that only captures the substrate W1 and an image FG that only captures the substrate W2.

[0078] Here, to distinguish images FG from substrates W1 and W2, the symbol FG represents the image of substrate W1, and the symbol FGs represents the image of substrate W2. Furthermore, for images captured by camera 47, and images taken before the image processing described below (images just captured), the symbol is appended with the number 0. This number increases as each image FG and image FGs is processed. Also, for ease of explanation, the viewpoints of images FG and FGs differ from those described above. The shadow on the right side of a portion of images FG and FGs represents the right side wall of the carrier C. The rectangular shadow below images FG of substrate W1 and images FGs of substrate W2 is formed by the sealing material attached to the outer side of the carrier C. Furthermore, the right side wall of the carrier C is excluded from the processing described below.

[0079] Figure 8(a) is a newly captured photographic image FG0 of a non-warped substrate W. Figure 11(a) is a newly captured photograph FGs0 of a substrate W that is warped upwards into a convex shape.

[0080] Steps S2 and S3 The substrate information acquisition unit 49 performs preprocessing on the newly captured images FG0 and FGs0.

[0081] Specifically, the processing performed by the value filter in step S2 and the brightness value correction in step S3 are carried out. This results in noise removal and brightness unevenness correction for images FG0 and FGs0. Thus, images FG1 (Figure 8(b)) and FGs1 (Figure 11(b)) are obtained.

[0082] Step S4 The substrate information acquisition unit 49 performs binarization processing on image FG1 (Fig. 8(b)) and image FGs1 (Fig. 11(b)). Herein, pixels with a predetermined brightness value below a certain threshold in images FG1 (Fig. 8(b)) and FGs1 (Fig. 11(b)) are set to black, and pixels with a brightness value exceeding the predetermined threshold are set to white, thus becoming images FG2 (Fig. 8(c)) and FGs2 (Fig. 11(c)). Furthermore, in Fig. 8(c) and Fig. 11(c), for convenience, pixels that were previously considered black are represented in gray.

[0083] Step S5 The substrate information acquisition unit 49 captures the upper and lower surfaces of substrates W1 and W2.

[0084] Specifically, for images FG2 (Fig. 8(c)) and FGs2 (Fig. 11(c)), an opening process is performed, which involves multiple shrinking and expanding. In this way, the black connected portions are separated in step S4. Furthermore, tilted pixels consisting of a predetermined number of pixels are removed. Thus, images FG2 (Fig. 8(c)) and FGs2 (Fig. 11(c)) are excluding the pixels constituting the background pattern body 57 and other pixels constituting the substrates W1 and W2, and are designated as images FG3 (Fig. 8(d)) and FGs3 (Fig. 11(d)). Image FG3 (Fig. 8(d)) is an image of substrate W1 extracted from image FG2. In step S17, described later, this image is combined with the edge image of the reflective pattern (image FG9, described later (Fig. 10(a))) to produce an image of the shape of the display substrate W1. The same applies to image FGs3. That is, image FGs3 (Fig. 11(d)) is an image of substrate W2 extracted from image FGs2. In step S17, described later, this image is combined with the edge image of the reflective pattern (Fig. 13(a)) to produce an image of the shape of the display substrate W2.

[0085] Step S6 The substrate information acquisition unit 49 sets a region of interest (ROI) on image FG1 (Fig. 8(b)) and image FGs1 (Fig. 11(b)) of substrate W2. An example of an image with a set ROI is image FG4 (Fig. 8(e)) and image FGs4 (Fig. 11(e)). The ROI is indicated by a white border in the figure.

[0086] The Region of Interest (ROI) is preset considering the storage pitch of the carrier C. The ROI is set as follows: In the vertical direction Z, it refers to the area containing the object acquiring substrate information, i.e., substrate W, and the area corresponding to the vertical storage pitch proportion of substrate W in the Z direction. In the width direction Y, it refers to the area in the width direction Y of the object acquiring substrate information, i.e., substrate W, corresponding to the area near the groove formed on the inner side of the carrier C.

[0087] Step S7 The substrate information acquisition unit 49 performs edge extraction on the region of interest (ROI) set in image FG1 (Fig. 8(b)) and image FGs1 (Fig. 11(b)) of substrate W2 (referencing image FG4 (Fig. 8(e)) and image FGs4 (Fig. 11(e))). The substrate information acquisition unit 49 extracts edges, for example, by applying Canny edge detection.

[0088] Specifically, the substrate information acquisition unit 49 performs edge detection on the regions of interest (ROIs) in the images FG1 (Fig. 8(b)) of substrate W1 and FGs1 (Fig. 11(b)) of substrate W2 after preprocessing. This is achieved by detecting edges in images FG5 (Fig. 9(a)) of substrate W1 and FGs5 (Fig. 12(a)) of substrate W2. Specifically, edge extraction is performed based on the magnitude and direction of the gradient between pixels. In these images FG5 (Fig. 9(a)) and FGs5 (Fig. 12(a)), the extracted edges are represented in gray in the diagram. Fig. 9(b) shows the pixel distribution at each angle of substrate W1, and Fig. 12(b) shows the pixel distribution at each angle of substrate W2. Large peaks are observed at both locations. The peak on the left is formed by the right edge of the pattern body 57, and the peak on the right is formed by the left edge of the pattern body 57. In Figure 12(b), due to the negative influence of the reflective pattern 61, many pixel distribution areas are also generated in the parts other than the peak.

[0089] Steps S8 and S9 The substrate information acquisition unit 49 captures edge candidates of the pattern body 57 that constitutes the background.

[0090] Specifically, the substrate information acquisition unit 49 extracts images from the edges of the image FG5 (Fig. 9(a)) of substrate W1 and the image FGs5 (Fig. 12(a)) of substrate W2 at a predetermined angle that is the same as the pattern body 57 constituting the background. As shown in Fig. 9(b) and Fig. 12(b), the pattern body 57 can be extracted from the image FG5 (Fig. 9(a)) of substrate W1 and the image FGs5 (Fig. 12(a)) of substrate W2 based on the distribution of angles. Furthermore, the substrate information acquisition unit 49 performs noise removal using an area filter. In other words, by using an area filter, pixel blocks of a certain size that do not constitute the edges of the pattern body 57 are removed. In this way, an image like the image FG6 (Fig. 9(c)) of substrate W1 and the image FGs6 (Fig. 12(c)) of substrate W2 is obtained. That is, only the pattern body 57 constituting the background can be extracted. In the image FG6 (Fig. 9(c)) of substrate W1 and the image FGs6 (Fig. 12(c)) of substrate W2, the edge of the pattern body 57 is represented in white.

[0091] Step S10 The substrate information acquisition unit 49 captures edge candidates of the reflection pattern 61.

[0092] Specifically, for example, from the edges of image FG5 (Fig. 9(a)) of substrate W1, an edge at a different angle from the pattern body 57 constituting the background is extracted. Or, the difference between image FG5 (Fig. 9(a)) of substrate W1 and the edge of the pattern body 57 constituting the background, i.e., image FG6 (Fig. 9(c)), is extracted. In this way, for example, an image like image FG7 (Fig. 9(d)) of substrate W1 is obtained. Also, for example, from the edges of image FGs5 (Fig. 12(a)) of substrate W2, an edge at a different angle from the pattern body 57 constituting the background is extracted. Or, the difference between image FGs5 (Fig. 12(a)) of substrate W2 and the edge of the pattern body 57 constituting the background, i.e., image FGs6 (Fig. 12(c)), of substrate W2 is extracted. In this way, for example, an image such as image FGs7 of substrate W2 (Fig. 12(d)) can be obtained. That is, according to this step, the edges other than the pattern body 57 constituting the background can be captured.

[0093] Steps S11 and S12 After marking the edges (i.e., edge candidates of the reflective pattern 61) other than the pattern body 57 constituting the background, the substrate information acquisition unit 49 performs a lateral dilation process on each edge candidate. In this way, for example, as in image FG8 of substrate W1 (Fig. 9(e)) and image FGs8 of substrate W2 (Fig. 12(e)), the edges (i.e., edge candidates of the reflective pattern 61) other than the pattern body 57 constituting the background are expanded in the lateral direction.

[0094] Steps S13~S15 The substrate information acquisition unit 49 obtains the difference area between the substrate and the pattern body 57 that constitutes the background.

[0095] Specifically, the substrate information acquisition unit 49 obtains the difference region between the image FG6 (Fig. 9(c)) of the edge of the pattern body 57 constituting the background, i.e., the substrate W1, and the image FG8 (Fig. 9(e)) of the substrate W1 that expands the edge candidate of the reflective pattern 61 in the lateral direction. Furthermore, if the intersection area in the difference region is a predetermined number of pixels (e.g., 4 pixels) or more, it is determined to be noise and removed. On the other hand, if the intersection area in the difference region is less than the predetermined number of pixels (e.g., 4 pixels), it is not removed. Similarly, the substrate information acquisition unit 49 obtains the difference region between the image FGs6 (Fig. 12(c)) of the edge of the pattern body 57 constituting the background, i.e., the substrate W2, and the image FGs8 (Fig. 12(e)) of the substrate W2 that expands the edge candidate of the reflective pattern 61 in the lateral direction. Furthermore, if the intersection area in the difference region is a predetermined number of pixels (e.g., 4 pixels) or more, it is determined to be noise and removed. On the other hand, if the cross region in the differential region does not reach the specified number of pixels (e.g., 4 pixels), it is not removed.

[0096] In this way, for example, images such as image FG9 of substrate W1 (Fig. 10(a)) and image FGs9 of substrate W2 (Fig. 13(a)) can be obtained. That is, based on image FG7 of substrate W1 (Fig. 9(d)) and image FGs7 of substrate W2 (Fig. 12(d)) which include the edges of substrate W1 other than pattern body 57, and image FG6 of substrate W1 (Fig. 9(c)) and image FGs6 of substrate W2 (Fig. 12(c)) which include the edges of substrate W1 other than reflective pattern 61, only the edges of reflective pattern 61 are captured.

[0097] Step S16 The substrate information acquisition unit 49 removes noise from the edges of the self-reflective pattern 61.

[0098] Specifically, edges that do not constitute the reflective pattern 61 are removed from the image FG9 of substrate W1 (Fig. 10(a)) and the image FGs9 of substrate W2 (Fig. 13(a)).

[0099] Step S17 The substrate information acquisition unit 49 calculates the sum area of ​​the upper and lower surfaces of the substrate W and the reflection pattern 61.

[0100] Specifically, the substrate information acquisition unit 49 obtains, for example, the sum of the areas of the reflection patterns 61 in the images FG3 (Fig. 8(d)) of substrate W1 and FGs3 (Fig. 11(d)) of substrate W2, and the edges of the reflection patterns 61, namely the images FG9 (Fig. 10(a)) of substrate W1 and FGs9 (Fig. 13(a)) of substrate W2. Thus, for example, an image is obtained such as the image FG10 (Fig. 10(b)) of substrate W1 and the image FGs10 (Fig. 13(b)) of substrate W2.

[0101] Step S18 The substrate information acquisition unit 49 performs final processing on the processed image.

[0102] The final processing is, for example, a closing process. The closing process involves multiple expansion and contraction processes. Through this closing process, interrupted parts of the pixels can be connected. Thus, for example, images such as image FG11 on substrate W1 (Fig. 10(c)) and image FGs11 on substrate W2 (Fig. 13(c)) are obtained. Regarding substrate W1, since there is no warping, an outer diameter shape OL1 is obtained including the area of ​​the upper and lower surfaces of substrate W1. Regarding substrate W2, since there is warping, an outer diameter shape OL2 is obtained including the upper and lower surfaces of substrate W2 and the upwardly warped reflective pattern 61.

[0103] Step S19 The substrate information acquisition unit 49 calculates the substrate information.

[0104] Specifically, the substrate information acquisition unit 49 calculates substrate information for substrates W1 and W2. At this time, it refers to the vertical Z-direction position information output from the position output unit 45 when each image FG0 and image FGs0 are captured. Based on the position information from the position output unit 45, and the outer diameter shapes OL1 and OL2, the substrate information acquisition unit 49 calculates substrate information including the vertical Z-direction position of substrates W1 and W2, and the positions of the upper and lower edges of substrates W1 and W2. Preferably, this substrate information is associated with each substrate W and stored in the control unit CU.

[0105] <9-2. Transporting Action>

[0106] Here, referring to Figure 14, the transfer process of substrate W based on substrate information will be described. Figure 14 is a flowchart showing an example of substrate transfer operation.

[0107] Step T1 The control unit CU, regarding the carrier C that houses the multiple substrates W to be processed, acquires substrate information for each substrate W using the method described above. Specifically, the control unit CU operates the hand drive unit 43 to drive the first hand 19 so that the camera 47 and each substrate W are at the same height in the vertical direction Z. The control unit CU operates the substrate information acquisition unit 49 at each position where the camera 47 faces each substrate W to acquire substrate information. The control unit CU reads out the substrate information for each substrate W.

[0108] Steps T2~T4 The control unit (CU) reads out substrate information related to the substrate W to be transported. Specifically, the control unit (CU) reads the position, thickness, and tilt of the substrate W to be transported from the corresponding substrate information. The thickness mentioned here includes the thickness of the substrate W itself, as well as the thickness formed by deformation such as warping of the substrate W.

[0109] Step T5 The control unit (CU) calculates the spacing of the substrate W.

[0110] Specifically, the control unit CU calculates the spacing based on the substrate information of the substrate W to be transported. More specifically, the control unit CU calculates the spacing between the lower surface of the substrate W to be transported and the upper surface of the substrate W below it, based on the substrate information of the substrate W to be transported and the substrate information of the substrate W located below the substrate W to be transported.

[0111] Step T6 Based on the substrate information corresponding to the substrate W, the control unit CU calculates the entry and exit position of the first hand part 19.

[0112] Specifically, the control unit CU calculates the vertical height Z of the first hand part 19 when it enters and exits the carrier C to receive the substrate W of the transport object based on the interval calculated in step T5.

[0113] Step T7 The control unit (CU) will process the branch based on whether there is contact.

[0114] Specifically, the control unit CU determines whether the entry / exit position of the first hand part 19, calculated in step T6, is in contact with the upper surface of the substrate W located below the substrate W to be transported. In other words, the control unit CU determines whether the first hand part 19 can enter or exit. If the control unit CU determines that there is no contact, it branches the processing to step T8. On the other hand, if the control unit CU determines that there is contact, it branches the processing to step T9.

[0115] Step T8 The control unit CU corrects the entry / exit position of the first hand part 19 to the position calculated in step T6. This allows the first hand part 19 to move the substrate W to be transported. The first hand part 19 can reliably perform transport regardless of whether the substrate W to be transported or the substrate W below it is deformed.

[0116] Step T9 The control unit (CU) issues an alarm and stops the transport. The alarm may be based on a display (not shown) or a light, or on a sound emitted by a speaker (not shown).

[0117] Specifically, the control unit CU generates an alarm when the first hand part 19, calculated in step T6, comes into contact with the upper surface of the substrate W located below the substrate W being transported, thus alerting the operator. This stops the first hand part 19 from moving towards the carrier C. This prevents the first hand part 19 from contacting the substrate W and causing damage to the substrate W.

[0118] According to this embodiment, camera 47 captures pattern 51 from the CT side of the loading / unloading outlet. When viewed from the CT side of the loading / unloading outlet, pattern 51 is asymmetrical vertically relative to the surface of substrate W and tilted at a predetermined angle in a straight line. Therefore, when the shape of substrate W is not warped, pattern 51 is reflected in the image in its original state in areas other than substrate W. On the other hand, when the shape of substrate W is warped, pattern 51 is reflected on the surface of substrate W, resulting in a vertically reversed reflected pattern 61. Therefore, the image captured by camera 47 is less susceptible to the influence of reflected light from the surface of substrate W, making the boundary between substrate W and the background more distinct. As a result, substrate information acquisition unit 49 captures reflected patterns 61 in the image at predetermined angles different from pattern 51, and can accurately calculate substrate information including the shape of substrate W, including warping.

[0119] Furthermore, based on the substrate information obtained as described above, the control unit CU operates the hand drive unit 43. Therefore, the first hand 19 can move forward and backward without contacting the plurality of substrates W housed in the carrier C. As a result, transport can be performed without damaging the substrates W.

[0120] Furthermore, the correspondence between the above embodiments and the present invention is as follows.

[0121] The carrier C corresponds to the "collection container" of this invention. The camera 47 corresponds to the "photographic unit" of this invention. The substrate information acquisition unit 49 corresponds to the "substrate information calculation unit" of this invention. The transport robot IR and hand drive unit 43 correspond to the "photographic unit moving mechanism". The control unit CU corresponds to the "photographic unit moving mechanism control unit". The camera 47, the substrate information acquisition unit 49, and the pattern 51 correspond to the "substrate information acquisition device" of this invention.

[0122] The first hand part 19 corresponds to the "hand" of this invention. The hand drive part 43 corresponds to the "hand drive part". The control part CU corresponds to the "hand drive part control part". The camera 47, the substrate information acquisition part 49, the pattern 51, the first hand part 19, the hand drive part 43, and the control part CU correspond to the "substrate transport device" of this invention. The control part CU corresponds to the "determination part" of this invention.

[0123] The present invention is not limited to the above-described embodiments, and may be implemented in the following variations.

[0124] (1) In this embodiment, the substrate processing apparatus 1 configured as shown in FIG1 and FIG2 is described as an example. However, the present invention is not limited to such a configuration. That is, the configuration of the transfer block 5 and the processing block 7 is not limited. For example, the transfer block 5 does not need to have a first hand 19 and a second hand 21, as long as it has at least one hand.

[0125] (2) In this embodiment, a camera 47, a substrate information acquisition unit 49, and a pattern 51 are included, but the substrate processing apparatus 1 is equipped with the substrate information acquisition apparatus of the present invention. However, the present invention is not limited to this embodiment. That is, the substrate information acquisition apparatus, which includes the camera 47, the substrate information acquisition unit 49, and the pattern 51, can be configured individually. In this case, the substrate information acquisition apparatus acquires the substrate information of each substrate W in the carrier C, and sends the substrate information to the substrate processing apparatus 1. The substrate information is used when the substrate W is removed from the carrier C.

[0126] (3) In this embodiment, a configuration in which one camera 47 is provided in the first hand portion 19 (second hand portion 21) is illustrated. However, the present invention is not limited to such a configuration. That is, a configuration with two or more cameras 47 may be used.

[0127] (4) In this embodiment, the light source 53 and the pattern 51 are arranged separately in the front-rear direction X. However, the present invention allows the light source 53 and the pattern 51 to be arranged in close proximity. Furthermore, the light source 53 and the pattern 51 can be limited to the size of the photographing area of ​​the camera 47. In this case, the light source 53 and the pattern 51 can be moved in conjunction with the movement of the camera 47 while facing the camera 47.

[0128] (5) In this embodiment, steps S2 (median filter) and S3 (brightness value correction) are performed in order to calculate the substrate information. However, if the image FG obtained in step S1 (photographing and reading) has little noise and little unevenness in brightness values, such processing is not necessary. This reduces the number of steps in the substrate information acquisition process, thereby reducing the load on the substrate information acquisition unit 49.

[0129] (6) In this embodiment, the positions of the upper and lower surfaces of the substrate W are calculated, and these positions are included in the outer diameter shapes OL1 and OL2 as substrate information. However, the present invention may not necessarily calculate the positions of the upper and lower surfaces of the substrate W. That is, as substrate information, it may be a shape of deformation such as warping, excluding the positions of the upper and lower surfaces of the substrate W. In this case, since the type and shape of the substrate W housed in the carrier C are known in advance according to the specifications, it is sufficient to add the positions of the upper and lower surfaces to the substrate information based on the specifications.

[0130] (7) In this embodiment, Canny edge detection is used to capture the reflective pattern 61, etc. However, the present invention is not limited to such a method. For example, the predetermined angle of the pattern body 57 and the end face shape of the substrate W are known in advance. Therefore, the pattern body 57 and the end face of the substrate W can be captured by pattern matching of the image FG, and the other part can be captured as the reflective pattern 61.

[0131] (8) In the above embodiment, pattern 51 is disposed on the outer side of the front side in the front-rear direction X of the carrier C. However, the present invention is not limited to such a configuration of pattern 51. For example, pattern 51 may be disposed inside the carrier C. More specifically, it may be disposed on the inner side of the front side in the front-rear direction X of the carrier C. Furthermore, pattern 51 may be projected from the rear side in the front-rear direction X of the loading and unloading CT and displayed on the inner side of the front side in the front side in the front-rear direction X of the carrier C.

[0132] (9) In the above embodiments, the substrate W is circular in plan view, but the present invention is not limited to such substrate W. For example, the substrate W may be rectangular in plan view. Also, it has been described assuming that the warping of the substrate W is umbrella-shaped or bowl-shaped. However, the present invention is applicable to substrate W that is three-dimensionally deformed by warping such as semi-tubular shape.

[0133] (10) In the above embodiment, the camera unit moving mechanism is composed of a transport robot IR. However, a camera unit moving mechanism having a transport robot IR that moves the camera unit such as the camera 47 in the vertical direction Z can be adopted.

[0134] (11) In the above embodiment, the camera 47 moves only in the vertical direction Z. However, the present invention is not limited to this configuration. That is, in the case where the field of view of the camera 47 is narrow and can only photograph a portion of the central part of the substrate W, it can be configured to move in the width direction Y, take multiple photographs of one substrate W, and combine them to obtain one image FG.

[0135] (12) In the above embodiments, a camera 47 that also has a field of view in the vertical direction Z can be used as the imaging unit. However, the present invention is not limited to such a configuration. For example, a line sensor that has a field of view only in the width direction Y can be used as the imaging unit. In this case, it is sufficient to obtain one image FG simply by moving the line sensor along the vertical direction Z.

[0136] (13) In the above embodiment, it is assumed that the camera 47 of the imaging unit is telecentric on the object side. However, the present invention is not limited to such a configuration. That is, the camera 47 may be non-telecentric on the object side. However, distortion occurs in the image FG outside the imaging center. Therefore, it is preferable to use only the area near the imaging center in the image FG to obtain substrate information. Furthermore, substrate information can be obtained by performing transformation processing on the area outside the imaging center of the image FG.

[0137] 1: Substrate processing device 3: Moving in and moving out blocks 5: Transporter Block 7: Processing Block 9: Investment Department 11: Dissemination Department 13: Platform 15: Handover Department 19: First Hand / Hand 21, 35: Second hand 23: First Inversion Unit 25: Path Section 27: Path Section 29: Second Inversion Unit 31: Processing Department 33: First Hand 41: Cover opening and closing mechanism 43: Hand drive unit 45: Position Output Unit 47: Camera 49: Substrate Information Acquisition Department 51: Pattern 53: Light source 55: Component Body 57: Pattern Body 61: Reflective pattern C: Carrier / Cardboard C1: Photography Center CR: Central Robot CT: Moving In / Out CU: Control Unit cp: Center of substrate FD: Forward and Reverse Direction FG, FG0~FG11, FGs, FGs0~FGs11: Images IR: Transport Robot OL1, OL2: Outer diameter shape R1: Line 1 R2: Line 2 R3: Line 3 ROI: Region of Interest S1~S19, T1~T9: Steps W, W1, W2, W3: substrate X: Forward / Backward / Front Y: Width direction / Left / Right Z: Vertical direction

Claims

1. A substrate information acquisition apparatus, which is capable of separately storing a plurality of horizontally oriented substrates, and of loading and unloading the substrates from a loading and unloading port formed on one side of a receiving container, and acquiring substrate information including the shape of the substrates stored in the receiving container, characterized in that it comprises: a pattern, which, when viewed from above, is disposed on the opposite side of the loading and unloading port across the substrates stored in the receiving container, and is asymmetrical vertically with respect to the surface of the substrates, and is inclined at a predetermined angle in a straight line; a photographic unit that photographs the pattern from the loading and unloading port side; and a substrate information calculation unit that extracts the pattern from the image captured by the photographic unit, and the reflected pattern from a reflected pattern on the substrate that is at a predetermined angle different from the pattern, and calculates the substrate information.

2. The substrate information acquisition apparatus of claim 1, wherein the aforementioned substrate information calculation unit further calculates the positions of the upper surface and the lower surface of the aforementioned substrate as the aforementioned substrate information.

3. The substrate information acquisition apparatus of claim 1, wherein the substrate information calculation unit performs edge extraction on the image captured by the photographing unit, and after removing pixels of a specified size or larger as noise, captures the aforementioned reflective pattern.

4. The substrate information acquisition apparatus of claim 3, wherein the substrate information calculation unit captures the aforementioned reflection pattern based on the aforementioned predetermined angle.

5. The substrate information acquisition apparatus of claim 1 further comprises: a camera unit moving mechanism that moves the camera unit along the direction of the plurality of substrates stacked; and a camera unit moving mechanism control unit that controls the movement of the camera unit moving mechanism; and the camera unit moving mechanism control unit operates the camera unit moving mechanism to capture images of the plurality of the aforementioned substrates housed in the aforementioned receiving container using the camera unit; and the substrate information calculation unit acquires the aforementioned substrate information from all the aforementioned substrates housed in the aforementioned receiving container.

6. A substrate conveying apparatus, characterized in that it comprises: a substrate information acquisition device as described in any one of claims 1 to 5; a hand holding the aforementioned substrate; a hand drive unit that drives the aforementioned hand to move forward and backward relative to the aforementioned receiving container for conveying the aforementioned substrate, and drives the aforementioned hand to move up and down in a vertical direction; and a hand drive unit control unit that operates the aforementioned hand drive unit based on the aforementioned substrate information acquired by the aforementioned substrate information acquisition device.

7. The substrate conveying device of claim 6 further includes: a determination unit that determines whether the aforementioned hand can enter or exit the aforementioned receiving container based on the aforementioned substrate information obtained by the aforementioned substrate information acquisition device.

Images