Electronic device and liquid cooling assembly

Abstract

An electronic device includes a housing, a liquid cooling heat dissipation assembly, and a hard drive. The liquid cooling heat dissipation assembly includes a heat exchange section, an inlet pipe, an outlet pipe, and a fin structure. The heat exchange section has an inlet channel, a bend channel, and an outlet channel. The bend channel has an inlet section, a connecting section, and an outlet section. One end of the inlet pipe and the inlet section is connected to the inlet channel. One end of the connecting section is connected to the other end of the inlet section. The connecting section and the inlet section are not parallel. One end of the outlet section is connected to the other end of the connecting section. The outlet section and the connecting section are not parallel. The other end of the outlet section and the outlet pipe are connected to the outlet channel. The width of the inlet section is greater than the width of the outlet section. The fin structure includes a first fin and a second fin. The first fin is disposed within the inlet section. The second fin is disposed within the outlet section. The hard drive is disposed within the housing.

Claims

1. An electronic device for containing a cooling fluid, the electronic device comprising: a housing for containing the cooling fluid; a liquid cooling heat dissipation assembly for allowing the cooling fluid to flow through, and including a heat exchange section, an inlet pipe, an outlet pipe, a fin structure, and a plurality of air-cooled fins, the heat exchange section having an inlet channel, a plurality of bend channels, and an outlet channel, the bend channels being located on opposite sides of the inlet channel and the outlet channel, each having an inlet section, a connecting section, and an outlet section, one end of the inlet pipe and the inlet section communicating with the inlet channel, one end of the connecting section communicating with the other end of the inlet section, the connecting section not being parallel to the inlet section and extending in a direction away from the inlet pipe, one end of the outlet section communicating with the other end of the connecting section, the outlet section communicating with the connecting section, and the connecting section communicating with the other end of the connecting section. The sections are not parallel, and the inlet section and the outlet section are side by side. The other end of the outlet section and the outlet pipe are connected to the outlet flow channel. The width of the inlet section is greater than the width of the outlet section. The fin structure includes a plurality of first fins and a plurality of second fins. The first fins are disposed in the inlet section, and the second fins are disposed in the outlet section. The number of first fins is greater than the number of second fins. The air-cooling fins are disposed between the bends and are arranged alternately with the bends. At least one hard disk is disposed in the housing and is used to be immersed in the cooling fluid. At least one fan is disposed in the housing and is located on one side of the outlet pipe. The at least one fan is used to generate a cooling airflow through the heat exchange section.

2. The electronic device as claimed in claim 1, wherein the liquid cooling heat dissipation assembly further includes a diversion section, the diversion section including a diversion pipe and a plurality of outlet pipes, the outlet pipes and the liquid outlet pipe being respectively connected to opposite sides of the diversion pipe, and the diversion pipe and the outlet pipes being used to divert the cooling fluid flowing toward the at least one hard drive.

3. The electronic device as claimed in claim 1, wherein the liquid cooling heat dissipation assembly further includes a manifold, the manifold including a manifold and a plurality of inlet pipes, the inlet pipes and the liquid inlet pipes being respectively connected to opposite sides of the manifold, and the manifold and the inlet pipes being used to allow the cooling fluid flowing through the at least one hard drive to converge to the liquid inlet pipes.

4. The electronic device as claimed in claim 1, wherein the liquid cooling heat dissipation assembly further includes a pump disposed on and connected to the liquid inlet pipe, the pump being used to drive the flow of the cooling fluid.

5. A liquid-cooled heat dissipation assembly for being disposed within a housing and for supplying a cooling fluid, the liquid-cooled heat dissipation assembly comprising: a heat exchange section having an inlet channel, a plurality of bend channels, and an outlet channel, the bend channels being respectively located on opposite sides of the inlet channel and the outlet channel, each having an inlet section, a connecting section, and an outlet section; one end of the inlet section communicating with the inlet channel, one end of the connecting section communicating with the other end of the inlet section, the connecting section not being parallel to the inlet section; one end of the outlet section communicating with the other end of the connecting section, the outlet section not being parallel to the connecting section, and the inlet section and the outlet section being side by side, the other end of the outlet section communicating with the inlet channel. The liquid outlet channel is connected, and the width of the liquid inlet section is greater than the width of the liquid outlet section; a liquid inlet pipe is connected to the liquid inlet channel, and the connecting section extends away from the liquid inlet pipe; a liquid outlet pipe is connected to the liquid outlet channel; a fin structure includes a plurality of first fins and a plurality of second fins, the first fins being disposed in the liquid inlet section, the second fins being disposed in the liquid outlet section, and the number of the first fins being greater than the number of the second fins; and a plurality of air-cooling fins are disposed between the bend channels and are arranged alternately with the bend channels.

6. The liquid cooling heat dissipation assembly as claimed in claim 5, wherein the liquid cooling heat dissipation assembly further includes a diversion section, the diversion section including a diversion pipe and a plurality of outlet pipes, the outlet pipes and the liquid outlet pipes being respectively connected to opposite sides of the diversion pipe, and the diversion pipe and the outlet pipes being used to divert the cooling fluid flowing toward at least one hard drive.

7. The liquid cooling heat dissipation assembly as claimed in claim 5, wherein the liquid cooling heat dissipation assembly further includes a manifold, the manifold including a manifold pipe and a plurality of inlet pipes, the inlet pipes and the liquid inlet pipes being respectively connected to opposite sides of the manifold pipe, and the manifold pipe and the inlet pipes being used to allow the cooling fluid flowing through at least one hard drive to converge to the liquid inlet pipes.

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