Polymer and adhesive composition employing the same

TWI935840BActive Publication Date: 2026-08-11IND TECH RES INST
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Patent Information

Application Number
TW114122255
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-06-13
Publication Date
2026-08-11
Estimated Expiration
2045-06-12

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Abstract

This disclosure provides a polymer and an adhesive composition comprising the thereof. The polymer has a first repeating unit, a second repeating unit, and a third repeating unit, wherein the first repeating unit has the structure shown in formula (I), the second repeating unit has the structure shown in formula (II), and the third repeating unit has the structure shown in formula (III), wherein R1, R2, R3, R4, A1, A2, and A3 are as defined in the specification.
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Claims

1. A polymer having a first repeating unit, a second repeating unit, and a third repeating unit, wherein the first repeating unit has the structure shown in formula (I), the second repeating unit has the structure shown in formula (II), and the third repeating unit has the structure shown in formula (III), wherein R1 is independently hydrogen or methyl; R2 is C1-C12 alkyl; A1, A2, and A3 are C1-C4 alkylene groups; R3 is independently C1-C3 alkyl; and R4 is hydrogen or methyl.

2. The polymer as claimed in claim 1, wherein the ratio of the second repeating unit to the first repeating unit is from 1:10 to 3:

1.

3. The polymer as claimed in claim 1, wherein the ratio of the third repeating unit to the first repeating unit is from 5:100 to 50:

100.

4. The polymer as claimed in claim 1, wherein the first repeating unit is , ...

5. The polymer as claimed in claim 1, wherein the second repeating unit is , , , , , , , , , , , , , or.

6. The polymer as claimed in claim 1, wherein the third repeating unit is , , , , , , , , , , or.

7. An adhesive composition comprising: component (A), wherein component (A) is the polymer of claim 1, wherein the ratio of the second repeating unit to the first repeating unit is 1:10 to 3:1, and the ratio of the third repeating unit to the first repeating unit is 5:100 to 50:100; and component (B), wherein component (B) is an acid generating agent.

8. The adhesive composition as claimed in claim 7, wherein the content of component (A) is 100 parts by weight and the content of component (B) is 0.1 to 10 parts by weight.

9. The adhesive composition as claimed in claim 8 further comprises: component (C), wherein component (C) is a photoinitiator.

10. The adhesive composition as claimed in claim 9, wherein the content of component (C) is from 0.1 parts by weight to 15 parts by weight.

11. The adhesive composition as claimed in claim 8 further comprises: component (D), wherein component (D) is a crosslinking agent.

12. The adhesive composition as claimed in claim 11, wherein the content of component (D) is from 0.1 parts by weight to 5 parts by weight.

Citation Information

Patent Citations

  • Pressure-sensitive adhesive sheet for semiconductor processing

    TW202204550A