PCB component and method for manufacturing voltage regulator module

Abstract

This invention provides a PCB assembly including a PCB and an inductor. The PCB includes a top surface and a bottom surface disposed opposite to each other. The inductor includes a magnetic core, a winding, and an upper surface and a lower surface disposed opposite to each other. The winding passes through the magnetic core, and the winding forms an upper lead-out terminal on the upper surface and a lower lead-out terminal on the lower surface. The inductor is embedded in the PCB, with the top surface spatially opposite to the upper surface and the bottom surface spatially opposite to the lower surface. Multiple conductive layers are provided above the upper surface and below the lower surface, and the top and bottom surfaces respectively have upper solder pads electrically connected to the upper lead-out terminal and lower solder pads electrically connected to the lower lead-out terminal. The upper solder pads are electrically connected to a power device for transmitting input electrical signals. The lower solder pads are electrically connected to an external circuit board for transmitting output electrical signals. The power device, the PCB assembly, and the external circuit board are vertically stacked sequentially. The power device and the upper solder pads, as well as the lower solder pads and the external circuit board, are electrically connected through a single reflow soldering process to form a voltage regulator module.

Description

[Technical Field]

[0001] This case relates to an assembly structure for an electronic device, and more particularly to a PCB assembly for a voltage regulator module and a method for manufacturing the voltage regulator module. [Previous Technology]

[0002] With the rapid development of artificial intelligence, the current of computing chips has increased rapidly, exceeding 1000 amps, which poses a great challenge to the voltage regulator that powers the chip.

[0003] Voltage regulators generally feature low output voltage and high current, primarily implemented using buck converters. A buck converter mainly consists of integrated circuit (IC) power devices, a power inductor, and input / output capacitors. In traditional horizontal voltage regulator designs, as shown in Figure 1, motherboard manufacturers typically place the input capacitor 52, IC power device 53, and power inductor 54 horizontally next to the computing chip 51 on the motherboard 50, while the output capacitor (not shown) is mainly placed below the computing chip 51. This horizontal connection method not only increases the total footprint but also increases parasitic parameters and losses with increasing wiring length, thus affecting power conversion efficiency. Based on this, power supply manufacturers design discrete component-based on-board voltage regulators as voltage regulator modules to improve power density and efficiency. Motherboard manufacturers directly use these voltage regulator modules placed around the computing chip, significantly increasing the output current of the voltage regulator within a limited space, meeting the power supply requirements of higher-power computing chips.

[0004] Another typical stacked voltage regulator module design is shown in Figure 2. Its structure involves stacking IC power devices 63 and inductors 64 on top of each other and soldering them onto the same PCB (Printed Circuit Board) 61. A capacitor 67 is also mounted on PCB 61. Additionally, the inductor 64 is mounted on another PCB 62. PCB 62 is used for electrical signal transfer, ensuring that the soldering surface of the voltage regulator module matches the soldering surface of the computing motherboard (not shown in the figure). PCBs 61 and 62 are electrically connected via multiple signal connectors 65, which are connected by connectors 66. However, this method results in a four-layer structure. The voltage regulator module itself undergoes multiple reflow soldering processes, increasing both the manufacturing difficulty and cost. Furthermore, the additional reflow soldering on the computing motherboard significantly impacts the quality and long-term reliability of the voltage regulator.

[0005] In view of this, it is necessary to provide a PCB assembly for a voltage regulator module and a manufacturing method for the voltage regulator module. By integrating a PCB assembly that includes multiple structures such as output inductors and signal connectors, the number of components is greatly reduced, the number of stacked layers of the voltage regulator module is simplified, thereby greatly reducing the total number of soldering operations, lowering the production cost of the voltage regulator module, and improving product quality. The PCB assembly can be coordinated with power devices, external circuit boards, and stacked components to adjust the placement order during stacking, allowing for flexible adjustments during voltage regulator module manufacturing based on actual conditions, facilitating manufacturing. Furthermore, the entire voltage regulator module can be soldered in a single reflow soldering operation, increasing module production yield and reducing production costs. Furthermore, when PCB assemblies are used in the manufacture of voltage regulator modules, multiple PCB assemblies can be combined with the substrate structure of multiple external circuit boards. Multiple voltage regulator modules can be manufactured in a single reflow soldering process. The multiple voltage regulator modules after cutting and separation are independent, which improves product quality and long-term reliability, and also greatly reduces production costs. Alternatively, multiple PCB assemblies can be placed using an assembly fixture, and multiple voltage regulator modules can also be manufactured in a single reflow soldering process. [Summary of the Invention]

[0006] The purpose of this invention is to provide a PCB assembly for a voltage regulator module and a method for manufacturing the voltage regulator module. By integrating inductors, input circuit paths, control signal paths, signal detection paths, and test function circuits into a single PCB assembly, the number of stacked layers of the voltage regulator module is simplified, thereby greatly reducing the total number of soldering operations, lowering the production cost of the voltage regulator module, and improving product quality. One layer of the voltage regulator module is a PCB assembly with an embedded inductor, and the layer above the PCB assembly can hold power devices. In the inductor integrated into the PCB assembly, the inductor winding passes through the magnetic core and is embedded in the PCB assembly. Its two output terminals are fused to the copper of the circuit board inside the PCB assembly through an electroplating process. The electroplated copper is interconnected from the inside out and is successively pressed together to form the soldering position for the IC power device on the outer layer of the PCB assembly. The number of electroplated copper layers stacked on both sides of the inductor is symmetrical and equal. Power devices, PCB assemblies, stacked components, and external circuit boards are connected in a stacked manner, reducing the total footprint of the voltage regulator module. Furthermore, the entire voltage regulator can be soldered in a single reflow soldering operation, increasing module yield and reducing production costs. The PCB assembly can also be adjusted to accommodate the stacking order of power devices, external circuit boards, and stacked components, allowing for flexible adjustments during voltage regulator module manufacturing to suit specific needs. In addition, when using PCB assemblies in voltage regulator module manufacturing, multiple PCB assemblies can be combined with the substrate structure of multiple external circuit boards, enabling the manufacture of multiple voltage regulator modules in a single reflow soldering operation. The separated voltage regulator modules operate independently, improving product quality and long-term reliability while significantly reducing production costs. Alternatively, multiple voltage regulator modules can be manufactured in a single reflow soldering operation by using an assembly fixture to hold multiple PCB assemblies.

[0007] To achieve the above objectives, one aspect of this application provides a PCB assembly including a PCB and an inductor. The PCB includes a top surface and a bottom surface disposed opposite to each other. The inductor includes an upper surface and a lower surface disposed opposite to each other, and the inductor also includes a magnetic core and a winding. The winding passes through the magnetic core, and the winding forms an upper lead-out terminal on the upper surface and a lower lead-out terminal on the lower surface. The inductor is embedded in the PCB, the top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface. Multiple conductive layers are provided above the upper surface and below the lower surface, and the top and bottom surfaces respectively have upper solder points electrically connected to the upper lead-out terminal and lower solder points electrically connected to the lower lead-out terminal. The upper solder points are electrically connected to a power device to transmit an input electrical signal. The lower solder points are electrically connected to an external circuit board to transmit an output electrical signal. The power device, the PCB assembly, and the external circuit board are arranged vertically in sequence. The power device and the upper solder point, and the lower solder point and the external circuit board, are electrically connected through a single reflow soldering process to form a voltage regulator module.

[0008] In one embodiment, multiple PCB components are arranged in an array within a fixed fixture. Multiple power devices, multiple PCB components, and multiple external circuit boards are stacked vertically in sequence. The upper soldering positions of the multiple power devices and multiple PCB components, as well as the lower soldering positions of the multiple PCB components and multiple external circuit boards, are electrically connected through a single reflow soldering process to form multiple voltage regulator modules.

[0009] In one embodiment, multiple PCB components form a continuous structure, and multiple power devices, the continuous structure and multiple external circuit boards are arranged in sequence and vertically stacked. The upper soldering positions of the multiple power devices and the multiple PCB components of the continuous structure, as well as the lower soldering positions of the multiple PCB components of the continuous structure and the multiple external circuit boards are electrically connected through a single reflow soldering process. The multiple power devices, the continuous structure and the multiple external circuit boards arranged in sequence and vertically stacked are formed by cutting and separating the continuous structure to form multiple independent voltage regulator modules.

[0010] In one embodiment, multiple PCB components form a continuous structure, multiple external circuit boards form a substrate structure, and multiple power devices, the continuous structure and the substrate structure are stacked vertically in sequence. The upper soldering positions of the multiple power devices and the multiple PCB components of the continuous structure, as well as the lower soldering positions of the multiple PCB components of the continuous structure and the multiple external circuit boards of the substrate structure are electrically connected through a single reflow soldering process. The multiple power devices, the continuous structure and the substrate structure are separated by cutting, and the multiple power devices, the continuous structure and the substrate structure are stacked vertically in sequence to form multiple independent voltage regulator modules.

[0011] In one embodiment, the PCB assembly includes a plurality of inductors connected in parallel, wherein the upper soldering positions of the plurality of inductors are respectively electrically connected to a plurality of power devices to transmit input electrical signals, and the lower soldering positions of the plurality of inductors are electrically connected to an external circuit board to transmit output electrical signals. The plurality of power devices, the PCB assembly and the external circuit board are arranged vertically in sequence. The plurality of power devices and the upper soldering positions of the plurality of inductors are electrically connected to each other and the lower soldering positions of the plurality of inductors and the external circuit board are electrically connected through a single reflow soldering process to form a voltage regulator module.

[0012] In one embodiment, the volume ratio of the magnetic core in the PCB assembly exceeds 50%, and in the horizontal plane, the projected area ratio of the magnetic core on the projected area of ​​the PCB assembly exceeds 70%.

[0013] In one embodiment, the PCB assembly further includes an input circuit path, a control signal path, a signal detection path, or a test function circuit.

[0014] In one embodiment, a metal conductor is further provided inside the PCB assembly, and the metal conductor is configured to transmit an electrical signal.

[0015] In one embodiment, the lower soldering position and the external circuit board are electrically connected by a superimposed component, which includes an upper soldering pad and a lower soldering pad.

[0016] In one embodiment, the superimposed component is a capacitor unit, a switch unit, or a magnetic unit.

[0017] In one embodiment, a metal conductor is disposed inside the stacked member, and the metal conductor is configured to transmit an electrical signal.

[0018] In one embodiment, the upper soldering position is electrically connected to the power device, the lower soldering position is electrically connected to the upper soldering pad, and the lower soldering pad is electrically connected to the external circuit board. The power device, PCB assembly, stacked component and external circuit board are arranged vertically in sequence. The power device and the upper soldering position, the lower soldering position and the upper soldering pad, and the lower soldering pad and the external circuit board are electrically connected through a single reflow soldering process to form a voltage regulator module.

[0019] In one embodiment, multiple PCB components are arranged in an array within a fixed fixture. Multiple power devices, multiple PCB components, multiple stacked components, and multiple external circuit boards are vertically stacked in sequence. The upper soldering positions of the multiple power devices and multiple PCB components, the lower soldering positions of the multiple PCB components and the upper soldering pads of the multiple stacked components, and the lower soldering pads of the multiple stacked components and the multiple external circuit boards are electrically connected through a single reflow soldering process to form multiple voltage regulator modules.

[0020] In one embodiment, multiple PCB components form a continuous structure, and multiple power devices, continuous structures, multiple stacked components and multiple external circuit boards are arranged vertically in sequence. The upper soldering positions of the multiple power devices and multiple PCB components of the continuous structure, the lower soldering positions of the multiple PCB components of the continuous structure and the upper soldering pads of the multiple stacked components, and the lower soldering pads of the multiple stacked components and the multiple external circuit boards are electrically connected through a single reflow soldering process. The continuous structure is cut and separated, and the multiple power devices, continuous structures, multiple stacked components and multiple external circuit boards arranged vertically in sequence form multiple independent voltage regulator modules.

[0021] In one embodiment, multiple PCB components form a continuous structure, multiple external circuit boards form a substrate structure, and multiple power devices, continuous structures, multiple stacked components and substrate structure are arranged in sequence and vertically stacked. The upper soldering positions of the multiple power devices and multiple PCB components of the continuous structure, the lower soldering positions of the multiple PCB components of the continuous structure and the upper soldering pads of the multiple stacked components, and the lower soldering pads of the multiple stacked components and multiple external circuit boards of the substrate structure are electrically connected through a single reflow soldering process. The continuous structure and substrate structure are cut and separated, and the multiple power devices, continuous structures, multiple stacked components and substrate structure arranged in sequence and vertically stacked form multiple independent voltage regulator modules.

[0022] In one embodiment, the PCB includes an M-layer conductive layer and an N-layer conductive layer, where M and N are positive integers. The M-layer conductive layer is disposed above the upper surface, and the upper lead-out terminal is electrically connected to the M-layer conductive layer that is attached to the upper surface. The N-layer conductive layer is disposed below the lower surface, and the lower lead-out terminal is electrically connected to the N-layer conductive layer that is attached to the lower surface. M=N≥2.

[0023] In one embodiment, the M-layer conductive layer and the N-layer conductive layer respectively include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes a top surface and a bottom surface, and is used for surface wiring, copper plating and soldering devices, and the inner conductive layer is used for internal wiring and copper plating.

[0024] In one embodiment, the M-layer conductive layer and the N-layer conductive layer are each composed of multiple copper-plated layers.

[0025] In one embodiment, the PCB assembly further includes a copper-plated edge layer, which is disposed on the top surface, bottom surface and sidewall of the PCB and electrically connected between the M-layer conductive layer and the N-layer conductive layer, and is used to transmit current signals or form a test function circuit.

[0026] In one embodiment, the PCB assembly further includes a conductive via that penetrates the top and bottom surfaces and is electrically connected between the M-layer conductive layer and the N-layer conductive layer.

[0027] In one embodiment, two adjacent conductive layers in the M-layer conductive layer and the N-layer conductive layer are connected by a buried via, and the M-layer conductive layer and the N-layer conductive layer are connected to the external electrical signal sequentially from the inside to the outside through the buried via.

[0028] In one embodiment, the N-layer conductive layer forms output solder positions and ground solder positions on the bottom surface through buried vias, wherein the output solder positions and ground solder positions are arranged alternately.

[0029] In one embodiment, the upper welding position and the upper output terminal are spatially opposite to each other and electrically connected through the upper circuit channel, which is sequentially electrically connected to the M-layer conductive layer.

[0030] In one embodiment, the lower welding position and the lower output terminal are spatially opposite to each other and electrically connected through a lower circuit channel, which is sequentially electrically connected to N conductive layers.

[0031] In one embodiment, the upper circuit channel is electrically connected to the upper soldering position and the upper output terminal from the inside to the outside in the M layer conductive layer through electroplated copper holes, and the lower circuit channel is electrically connected to the lower soldering position and the lower output terminal from the inside to the outside in the N layer conductive layer through electroplated copper holes.

[0032] To achieve the above objectives, another aspect of this invention provides a method for manufacturing a voltage regulator module, comprising the steps of: (a) providing a PCB assembly, the PCB assembly including a PCB and an inductor, wherein the PCB includes a top surface and a bottom surface disposed opposite to each other, the inductor includes an upper surface and a lower surface disposed opposite to each other, the top surface being spatially opposite to the upper surface, the bottom surface being spatially opposite to the lower surface, the inductor being embedded in the PCB, and the inductor including a magnetic core and a winding, the winding passing through the magnetic core, and the winding forming an upper lead-out terminal on the upper surface and a lower lead-out terminal on the lower surface; wherein the upper surface has a plurality of conductive layers above it and the lower surface has a plurality of solder pads below it, and the top surface and the bottom surface respectively have an upper solder pad electrically connected to the upper lead-out terminal and a lower solder pad electrically connected to the lower lead-out terminal; (b) providing a power device having a solder portion spatially opposite to the upper solder pad; (c) providing an external circuit board having a solder area spatially opposite to the lower solder pad; (d) Solder is applied to the soldering area and the upper soldering position, and the power devices, PCB assemblies and external circuit boards are stacked vertically in sequence, wherein the soldering part is aligned with the upper soldering position and the lower soldering position is aligned with the soldering area; and (e) a reflow soldering process is performed to achieve electrical connection between the power devices, PCB assemblies and external circuit boards.

[0033] In one embodiment, the volume ratio of the magnetic core in the PCB assembly exceeds 50%, and in the horizontal plane, the projected area ratio of the magnetic core on the projected area of ​​the PCB assembly exceeds 70%.

[0034] In one embodiment, the solder is solder paste, which is applied by spraying or printing.

[0035] In one embodiment, the PCB assembly further integrates an input circuit path, a control signal path, a signal detection path, or a test function circuit.

[0036] In one embodiment, a metal conductor is further provided inside the PCB assembly, and the metal conductor is configured to transmit electrical signals.

[0037] In one embodiment, the PCB assembly includes a plurality of inductors connected in parallel, and step (d) includes: applying solder to the soldering area and the upper soldering positions of the plurality of inductors, and vertically stacking the plurality of power devices, the PCB assembly and the external circuit board in sequence, wherein the soldering portions of the plurality of power devices are aligned with the upper soldering positions of the plurality of inductors, and the lower soldering positions of the plurality of inductors are aligned with the soldering area.

[0038] In one embodiment, step (d) includes: (d1) arranging a plurality of PCB components in an array within a fixing fixture; (d2) applying solder to the upper soldering positions of the plurality of PCB components; (d3) placing the plurality of PCB components onto the soldering areas of the plurality of external circuit boards with solder applied by means of side clamping; and (d4) correspondingly placing a plurality of power devices onto the upper soldering positions of the plurality of PCB components.

[0039] In one embodiment, step (d) includes: (d1) providing a bridging structure, the bridging structure including a plurality of PCB components; (d2) applying solder to the upper soldering positions of the plurality of PCB components of the bridging structure; (d3) placing the bridging structure onto the soldering areas of a plurality of external circuit boards with solder applied by side clamping; and (d4) correspondingly placing a plurality of power devices onto the upper soldering positions of the plurality of PCB components of the bridging structure.

[0040] In one embodiment, step (e) includes the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, a bridging structure and multiple external circuit boards; (e2) cutting and separating the bridging structure so that multiple power devices, bridging structures and multiple external circuit boards arranged vertically in sequence form multiple independent voltage regulator modules.

[0041] In one embodiment, step (d) includes: (d1) providing a laminate structure, the laminate structure including a plurality of PCB components; (d2) providing a substrate structure, the substrate structure including a plurality of external circuit boards; (d3) applying solder to the upper soldering positions of the plurality of PCB components of the laminate structure; (d4) placing the laminate structure onto the soldering areas of the plurality of external circuit boards of the substrate structure with solder applied in a side-clamping manner; and (d5) correspondingly placing a plurality of power devices onto the upper soldering positions of the plurality of PCB components of the laminate structure.

[0042] In one embodiment, step (e) includes the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, a lamination structure and a substrate structure; (e2) cutting and separating the lamination structure and the substrate structure so that multiple power devices, lamination structures and substrate structures arranged in sequence and vertically stacked form multiple independent voltage regulator modules.

[0043] In one embodiment, the lower soldering position and the external circuit board are electrically connected by a superimposed component, which includes an upper soldering pad and a lower soldering pad.

[0044] In one embodiment, the superimposed component is a capacitor unit, a switch unit, or a magnetic unit.

[0045] In one embodiment, a metal conductor is disposed inside the stacked member, and the metal conductor is configured to transmit electrical signals.

[0046] In one embodiment, step (d) includes: (d1) setting solder in the welding area and placing the stacked component on the welding area so that the lower welding pad is aligned with the welding area; (d2) setting solder on the upper welding pad and placing the PCB assembly on the upper welding pad so that the lower welding position is aligned with the upper welding pad; and (d3) setting solder on the upper welding position and placing the power device on the upper welding position so that the welding part is aligned with the upper welding position.

[0047] Step (d) includes: (d1) arranging multiple PCB components in an array within a fixed fixture; (d2) applying solder to the soldering areas of multiple external circuit boards and placing multiple stacked components on the soldering areas of multiple external circuit boards, so that the lower soldering pads of the multiple stacked components are aligned with the soldering areas of the multiple external circuit boards; (d3) applying solder to the upper soldering pads of the multiple stacked components and placing the lower soldering positions of the multiple PCB components onto the upper soldering pads of the multiple stacked components by side clamping, so that the lower soldering positions of the multiple PCB components are aligned with the upper soldering pads of the multiple stacked components; and (d4) applying solder to the upper soldering positions of the multiple PCB components and placing multiple power devices onto the upper soldering positions of the multiple PCB components, so that the soldering portions of the multiple power devices are aligned with the upper soldering positions of the multiple PCB components.

[0048] In one embodiment, step (d) includes: (d1) providing a continuous structure, the continuous structure including multiple PCB assemblies; (d2) setting solder in the soldering areas of multiple external circuit boards, and placing multiple stacked components on the soldering areas of multiple external circuit boards, so that the lower solder pads of the multiple stacked components are aligned with the soldering areas of the multiple external circuit boards; (d3) setting solder in the upper solder pads of the multiple stacked components, and placing the lower soldering positions of the multiple PCB assemblies of the continuous structure onto the upper soldering pads of the multiple stacked components by side clamping, so that the lower soldering positions of the multiple PCB assemblies of the continuous structure are aligned with the upper soldering pads of the multiple stacked components; and (d4) setting solder in the upper soldering positions of the multiple PCB assemblies of the continuous structure, and placing multiple power devices onto the upper soldering positions of the multiple PCB assemblies of the continuous structure, so that the soldering portions of the multiple power devices are aligned with the upper soldering positions of the multiple PCB assemblies of the continuous structure.

[0049] In one embodiment, step (e) includes the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, a bridging structure, multiple stacked components and multiple external circuit boards; (e2) cutting and separating the bridging structure so that multiple power devices, bridging structures, multiple stacked components and multiple external circuit boards arranged vertically in sequence form multiple independent voltage regulator modules.

[0050] In one embodiment, step (d) includes: (d1) providing a continuous structure, the continuous structure including a plurality of PCB assemblies; (d2) providing a substrate structure, the substrate structure including a plurality of external circuit boards; (d3) setting solder on the soldering areas of the plurality of external circuit boards of the substrate structure, and placing a plurality of stacked components on the soldering areas of the plurality of external circuit boards of the substrate structure, so that the lower soldering pads of the plurality of stacked components are aligned with the soldering areas of the plurality of external circuit boards of the substrate structure; (d4) setting solder on the upper soldering pads of the plurality of stacked components, and placing the lower soldering positions of the plurality of PCB assemblies of the continuous structure onto the upper soldering pads of the plurality of stacked components by side clamping, so that the lower soldering positions of the plurality of PCB assemblies of the continuous structure are aligned with the upper soldering pads of the plurality of stacked components; and (d5) setting solder on the upper soldering positions of the plurality of PCB assemblies of the continuous structure, and placing a plurality of power devices onto the upper soldering positions of the plurality of PCB assemblies of the continuous structure, so that the soldering portions of the plurality of power devices are aligned with the upper soldering positions of the plurality of PCB assemblies of the continuous structure.

[0051] In one embodiment, step (e) includes the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, a bridging structure, multiple stacked components and a substrate structure; (e2) cutting and separating the bridging structure and the substrate structure so that multiple power devices, bridging structures, multiple stacked components and a substrate structure arranged vertically in sequence form multiple independent voltage regulator modules.

[0052] In one embodiment, the PCB includes an M-layer conductive layer and an N-layer conductive layer, where M and N are positive integers. The M-layer conductive layer is disposed above the upper surface, and the upper lead-out terminal is electrically connected to the M-layer conductive layer that is attached to the upper surface. The N-layer conductive layer is disposed below the lower surface, and the lower lead-out terminal is electrically connected to the N-layer conductive layer that is attached to the lower surface. M=N≥2.

[0053] In one embodiment, the M-layer conductive layer and the N-layer conductive layer respectively include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes the top and bottom surfaces of the PCB and is used for surface wiring, copper plating and soldering of devices, and the inner conductive layer is used for internal wiring and copper plating.

[0054] In one embodiment, the M-layer conductive layer and the N-layer conductive layer are each composed of multiple copper-plated layers.

[0055] In one embodiment, the PCB assembly further includes a copper-plated edge layer, which is disposed on the top surface, bottom surface and sidewall of the PCB and electrically connected between the M-layer conductive layer and the N-layer conductive layer, and is used to transmit current signals or form a test function circuit.

[0056] In one embodiment, the PCB assembly further includes a conductive via that penetrates the top and bottom surfaces and is electrically connected between the M-layer conductive layer and the N-layer conductive layer.

[0057] In one embodiment, the upper soldering position and the upper outgoing terminal are spatially opposite to each other and electrically connected through an upper circuit channel, the upper circuit channel being sequentially electrically connected to M conductive layers, wherein the lower soldering position and the lower outgoing terminal are spatially opposite to each other and electrically connected through a lower circuit channel, the lower circuit channel being sequentially electrically connected to N conductive layers.

[0058] In one embodiment, the upper circuit channel is electrically connected to the upper soldering position and the upper output terminal from the inside to the outside in the M layer conductive layer through electroplated copper holes, and the lower circuit channel is electrically connected to the lower soldering position and the lower output terminal from the inside to the outside in the N layer conductive layer through electroplated copper holes.

Implementation Method

[0077] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and drawings therein are essentially for illustrative purposes and not for limiting this invention. For example, if the following description of this invention involves a first feature disposed on or above a second feature, it indicates that it includes embodiments where the first feature and the second feature are in direct contact, and also includes embodiments where additional features can be disposed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, different embodiments of this invention may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity purposes and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Furthermore, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatial terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations illustrated in the diagrams, spatially related terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially related terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Additionally, it is understood that while terms such as "first," "second," etc., may be used within the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items.

[0078] Figure 3 shows a three-dimensional structure of a voltage regulator module (external circuit board not shown) according to an embodiment of the present invention. Figure 4 shows a cross-sectional view of Figure 3 along line segment AA'. Figure 5 shows a cross-sectional view of a PCB assembly according to an embodiment of the present invention. For ease of illustration, the external circuit board is not shown in Figures 3 and 4. To simplify the overall number of component layers of the voltage regulator module 1, facilitate subsequent soldering, and reduce the number of soldering operations, the present invention proposes a PCB assembly 2 for the voltage regulator module 1. In this embodiment, the PCB assembly 2 includes a PCB 10 and an inductor 15. The PCB 10 includes a top surface 101 and a bottom surface 102. The inductor 15 is embedded in the PCB 10. The inductor 15 includes an upper surface 151 and a lower surface 152 disposed opposite to each other. The inductor 15 includes a magnetic core 14 and a winding 13, the winding 13 passing through the magnetic core 14, and the winding 13 forming an upper lead-out terminal 131 on the upper surface 151 and a lower lead-out terminal 132 on the lower surface 152. It is worth noting that, in this embodiment, the volume ratio of the magnetic core 14 in the PCB assembly 2 exceeds 50%. Furthermore, in this embodiment, the PCB 10 is a multilayer board structure, including an M-layer conductive layer and an N-layer conductive layer, wherein the M-layer conductive layer is disposed above the upper surface 151 of the inductor 15. In this embodiment, the M-layer conductive layer includes three conductive layers 111, 112, and 113. The upper lead-out terminal 131 of the winding 13 is connected to the inner conductive layer 111 attached to the upper surface 151 of the inductor 15. The upper conductive layer 113 forms an upper soldering position 103 on the top surface 101 of the PCB assembly 2. In this embodiment, the upper soldering position 103 and the upper lead-out terminal 131 of the winding 13 are spatially opposite to each other and connected through an upper circuit channel 114. The upper circuit channel 114 connects the upper soldering position 103 and the upper lead-out terminal 131 through copper-plated holes from the inside to the outside within the M-layer conductive layer. In this embodiment, the N-layer conductive layer is disposed below the lower surface 152 of the inductor 15. In this embodiment, the N-layer conductive layer includes three conductive layers 121, 122, and 123. The lower lead-out terminal 132 of the winding 13 is connected to the inner conductive layer 121 attached to the lower surface 152 of the inductor 15, while the lower conductive layer 123 forms a lower soldering position 104 on the bottom surface 102 of the PCB assembly 2. In this embodiment, the lower soldering position 104 and the lower lead-out terminal 132 of the winding 13 are spatially opposite to each other and connected through the lower circuit channel 124. The lower circuit channel 124 connects the lower soldering position 104 and the lower lead-out terminal 132 through copper-plated holes from the inside to the outside within the N-layer conductive layer. It should be noted that M and N are integers, and M = N ≥ 2.

[0079] In this embodiment, the upper soldering position 103 on the top surface 101 of the PCB 10 is further electrically connected to the soldering pad 31 of the power device 3 to assemble and transmit input electrical signals. The power device 3 can be an IC (Integrated Circuit) device. The connection between the soldering pad 31 and the upper soldering position 103 can be achieved using solder 5 in a reflow soldering process. In this embodiment, the PCB assembly 2, the power device 3, and the external circuit board (not shown in the figure) form a new voltage regulator module 1 structure. The overall shape of the voltage regulator module 1 structure is shown in Figure 3, including the upper power device 3, the lower PCB assembly 2, and the bottommost external circuit board (not shown in the figure). The power device 3 can be a DrMOS, including two switching transistors and a driving circuit. The PCB assembly 2 used to structure the voltage regulator module 1 can further form an edge copper plating layer 21 through an edge copper plating process. In this embodiment, the copper-plated layer 21 on the board edge is disposed on the top surface 101, bottom surface 102, and sidewalls of the PCB 10, and is electrically connected between the M-layer conductive layer and the N-layer conductive layer, assembling to transmit current signals or form a test function circuit. In other embodiments, the copper-plated layer 21 on the board edge is further connected to other subsequent motherboard connections for testing and repair. In another embodiment, the PCB assembly 2 may also be provided with conductive vias 22, penetrating the top surface 101 and bottom surface 102 of the PCB 10, and electrically connected between the M-layer conductive layer and the N-layer conductive layer. In some embodiments of this invention, two adjacent conductive layers in the M-layer and N-layer conductive layers are connected through buried vias 17, and the M-layer conductive layer and the N-layer conductive layer are sequentially connected to external electrical signals from the inside out through the buried vias 17.

[0080] Figure 6 shows a schematic diagram of an inductor structure according to an embodiment of this invention. Referring to Figures 3 to 6. In this embodiment, the PCB assembly 2 includes an inductor 15 embedded in the PCB 10, and a multilayer board structure above the upper surface 151 and below the lower surface 152 of the inductor. The integrated inductor 15 has, for example, the structure shown in Figure 6. The inductor 15 includes at least one winding 13 and a magnetic core 14. The winding 13 passes through the magnetic core 14, which is constructed from a magnetically conductive material such as ferrite or magnetic powder core, and is then pressed together to form an integral inductor 15. The entire process is integrally formed. It is worth noting that in this embodiment, the volume ratio of the magnetic core 14 in the PCB assembly 2 exceeds 50%, and the area ratio of the magnetic core 14 on the top view of the PCB assembly 2 (i.e., the plane formed by directions X and Y in Figure 6) exceeds 70%. By increasing the effective magnetic cross-sectional area of ​​the magnetic core 14, the losses of the magnetic core 14 and the winding 13 are reduced, thereby improving the overall conversion efficiency of the voltage regulator module 1. In other words, within a horizontal plane, the horizontal plane can be parallel to the upper surface 151 and the lower surface 152, and the projected area of ​​the magnetic core 14 accounts for more than 70% of the projected area of ​​the PCB assembly 2.

[0081] In this embodiment, the inductor 15 includes, for example, two windings 13. The two windings 13 each form two upper output terminals A1 and B1 on the upper surface 151 of the inductor 15, and each form two lower output terminals A2 and B2 on the lower surface 152 of the inductor 15, as shown in FIG6.

[0082] In this embodiment, as shown in FIG5, the M-layer conductive layer includes inner conductive layers G1, G2, G3 and upper surface conductive layer GTL. The N-layer conductive layer includes inner conductive layers G4, G5, G6 and lower surface conductive layer GBL. In this embodiment, the inner conductive layers G1, G2, G3, G4, G5, and G6 can all be regarded as the inner layers of the PCB assembly 2, used for internal wiring and copper plating of the PCB assembly 2. The upper surface conductive layer GTL and the lower surface conductive layer GBL can be regarded as the outer layers of the PCB assembly 2, such as the top surface 101 and bottom surface 102 of the PCB 10, used for surface wiring, copper plating, and soldering of components.

[0083] In this embodiment, in addition to integrating the inductor 15, the PCB assembly 2 integrates input circuit paths, control signal paths, signal detection paths, and even test function circuits. The traces in the multilayer board structure of the PCB 10 can all realize the transmission of input signals, control signals, and sampling signals. In one embodiment, the voltage regulator module 1 can also improve the overall functionality of the PCB assembly 2 by adding a copper plating layer 21 to the edge of the PCB assembly 2. For example, the copper plating layer 21 can be used to transmit current signals or to add test function circuits. Of course, this invention is not limited to this.

[0084] In this embodiment, when the power input terminal VIN is connected to the power device 3 via the GTL conductive layer on the upper surface of the PCB assembly 2, the solder pad 31 of the power device 3 is spatially opposite to the upper soldering position 103 on the upper surface of the PCB assembly 2. The upper soldering position 103 and the upper output terminal 131 of the inductor 15 are spatially opposite to each other and electrically connected through the upper circuit channel 114. The upper soldering position 103 is connected to the upper output terminal 131 of the upper surface 151 of the inductor 15 via electroplating and drilling, thereby realizing the electrical signal transmission between the power device 3 and the inductor 15. The lower output terminal 132 of the lower surface 152 of the inductor 15 is also electrically connected to the solder pad connected to the GBL conductive layer on the lower surface of the PCB assembly 2 via electroplating and drilling.

[0085] In other embodiments, the control signal and the sampling signal are electrically connected between the pads on the top surface 101 and the bottom surface 102 through internal traces and electroplated holes in the PCB assembly 2. Alternatively, the electrical connection between the pads on the top surface 101 and the bottom surface 102 of the PCB assembly 2 can be achieved through the copper plating layer 21 on the board edge. At the same time, the load current can flow from the bottom surface 102 of the PCB assembly 2 back to the top surface 101 of the PCB assembly 2 through the copper plating layer 21 on the board edge. Since the transmission path is exposed on the outer surface of the PCB assembly 2, it is beneficial to the overall heat dissipation of the PCB assembly 2.

[0086] In this embodiment, the inductor 15 is embedded in the PCB multilayer board structure, and the upper lead-out terminal 131 of the winding 13 is connected to the inner conductive layer G3, which can be achieved by electroplating. In one embodiment, the multilayer board structure above the upper surface 151 of the inductor can be electrically interconnected with the inner conductive layers G3, G2, G1 and the upper surface conductive layer GTL through a copper plating process, and electrically connected through the upper circuit channel 114. Similarly, the multilayer board structure below the lower surface 152 of the inductor can be electrically interconnected with the inner conductive layers G4, G5, G6 and the lower surface conductive layer GBL through a copper plating process, and electrically connected through the lower circuit channel 124.

[0087] In this embodiment, a metal conductor 16 is also provided inside the PCB assembly 2. The metal conductor 16 is configured to transmit electrical signals. In other embodiments, the metal conductor can be a copper block, used to transmit control signals or other signals, and the copper block can also help increase the stress of the PCB assembly 2. Of course, the position of the copper block can be adjusted according to actual application requirements. This embodiment is not limited to this.

[0088] Figure 7 shows a schematic diagram of the upper soldering positions corresponding to the power devices on the top surface of the PCB assembly in this case. In this embodiment, the upper multilayer board structure is processed layer by layer from the inside to the outside through a copper plating process, and the layers are stacked sequentially to form upper soldering positions 103 on the top surface 101 of the PCB assembly 2. Finally, the upper conductive layer GTL forms the first winding soldering position SW1 and the second winding soldering position SW2 corresponding to the two power devices 3 on the top surface 101 of the PCB assembly 2, as shown in Figure 7, for soldering the power devices 3 so that the external input current flows into the inductor 15. The terminals of the inductor 15 are located inside the PCB assembly 2 and are directly connected through electroplating and wiring, avoiding the risks that may occur when soldering traditional independent inductors and PCBs, and reducing the process flow. In this embodiment, the PCB assembly 2 is paired with two power devices 3. In other embodiments, the number of power devices 3 paired with the PCB assembly 2 can be adjusted according to the actual application requirements. When the voltage regulator module 1 needs to mount multiple power devices 3 on the PCB assembly 2, the power devices 3 can be arranged horizontally on the top surface 101 of the PCB assembly 2 and electrically connected to the inductor 15 through the upper soldering position 103. Of course, this case is not limited to this.

[0089] Figure 8 shows a schematic diagram of the lower soldering position on the bottom surface of the PCB assembly in this case. Similarly, the multilayer board structure below the lower surface 152 of the inductor is processed layer by layer from the inside to the outside, and after being stacked in sequence, a lower soldering position 104 can be formed on the bottom surface 102 of the PCB assembly 2. Among them, the output terminals A2 and B2 (see Figure 6) on the other side of the inductor 15 are electroplated layer by layer and connected to the lower conductive layer GBL, forming the first output soldering position VO1 and the second output soldering position VO2, as shown in Figure 8. In one embodiment, the first output soldering position VO1 and the second output soldering position VO2 can be used to connect to an external circuit board, such as a system motherboard or an adapter board, so that current flows out of the inductor to power the system motherboard or provide electrical signals to the adapter board. It is worth noting that the multilayer board structure above the upper surface 151 and below the lower surface 152 of the inductor has the same number of conductive layers and is symmetrically arranged to ensure that the electrical performance on both sides of the inductor 15 is the same.

[0090] Figure 9 shows a schematic diagram of the lower soldering position on the bottom surface of the PCB assembly in this case, according to another embodiment. In this embodiment, the lower soldering position 104 formed by electroplating on the bottom surface 102 of the PCB assembly 2 can be adjusted according to actual application requirements. In this embodiment, the lower soldering position 104 can, for example, form a matrix pad, wherein the first output soldering position VO1 and the second output soldering position VO2 are composed of different matrix pads. Other matrix pads can also be used for the ground soldering position GND. In some embodiments of this case, the multilayer board structure below the lower surface 152 of the inductor 15 is processed layer by layer from the inside to the outside to form the first output soldering position VO1, the second output soldering position VO2, and the ground soldering position GND. The first output soldering position VO1 and the ground soldering position GND are arranged in an alternating manner, and the second output soldering position VO2 and the ground soldering position GND are arranged in an alternating manner to disperse the current density of the PCB assembly 2 and the external circuit board and reduce the parasitic inductance of the output port. Of course, this case is not limited to this.

[0091] Figures 10 and 11 show schematic diagrams of the disassembly of the external circuit board of another voltage regulator module in this case. In this embodiment, the lower PCB assembly 2, combined with the upper power device 3, is disposed on the external circuit board to form the voltage regulator module 1. The bottom surface 102 of the lower PCB assembly 2 can be electrically connected to the external circuit board 9. In this embodiment, the external circuit board 9 is, for example, the motherboard or adapter board of an external system. The bottom surface 102 of the PCB assembly 2 has a lower solder pad 104, which includes a plurality of matrix pads. Some of the matrix pads are further divided into a first output solder pad VO1 and a second output solder pad VO2 according to the circuit design requirements. Other matrix pads can also be divided for other applications. In addition, the upper surface of the external circuit board 9 has a soldering area 91 corresponding to the matrix pads. In this embodiment, the connection between the soldering area 91 of the external circuit board 9 and the lower solder pad 104 of the PCB assembly 2 can be achieved by soldering in a reflow soldering process. In this embodiment, the terminals of the inductor 15 are all integrally formed inside the PCB assembly 2. Electrical connection is achieved directly through the electroplating and wiring of the multilayer board structure above the upper surface 151 and below the lower surface 152 of the inductor. This avoids the risks that may arise when independent inductors are soldered to external systems via terminals, and also reduces the number of process steps.

[0092] It should be noted that, in this case, when assembling the voltage regulator module 1 before soldering, the power device 3, PCB assembly 2, and external circuit board 9 are stacked vertically in sequence. The upper soldering position 103 of the PCB assembly 2 is electrically connected to the power device 3 to transmit input electrical signals. The lower soldering position 104 of the PCB assembly 2 is electrically connected to the external circuit board 9 to transmit output electrical signals. It is worth noting that the power device 3 and the upper soldering position 103, as well as the lower soldering position 104 and the external circuit board 9, are electrically connected through a single reflow soldering process to form the voltage regulator module 1. In other words, the manufacturing of the voltage regulator module 1 in this case avoids multiple soldering processes. The more times the solder joint undergoes the high-temperature reflow process, the easier it is for bubbles inside the solder joint to accumulate and expand, causing solder balls to splash out and resulting in soldering quality problems. Especially on the motherboard of artificial intelligence, the number of voltage regulator modules 1 used is in the tens or hundreds, which will seriously amplify this quality risk. In order to ensure that the PCB assembly 2 and the power device 3 only undergo one reflow soldering process when the voltage regulator is produced, this case proposes a new method. After the power device 3, PCB assembly 2, and external circuit board 9 are vertically stacked, the entire power system is soldered through a single reflow soldering process. This not only maintains the overall mechanical structure of the voltage regulator module 1 and preserves all its performance advantages, but also improves product quality and long-term reliability while reducing overall costs.

[0093] Figures 12 and 13 show exploded views of another voltage regulator module of this invention. Figure 14 shows a flowchart of the manufacturing method of the voltage regulator module of the first embodiment of this invention. In the production method of the voltage regulator in one reflow soldering, referring to Figures 3 to 14, in this embodiment, firstly, as shown in steps S01, S02 and S03, a PCB assembly 2, a power device 3 and an external circuit board 9 are provided respectively, and the order of their provision can be adjusted as needed. In this embodiment, the PCB assembly 2 includes a PCB 10 and an inductor 15. The PCB 10 includes a top surface 101 and a bottom surface 102 disposed opposite to each other. The inductor 15 is embedded in the PCB 10, and the inductor 15 includes an upper surface 151 and a lower surface 152 disposed opposite to each other. The inductor 15 also includes a magnetic core 14 and a winding 13, the winding 13 passing through the magnetic core 14, and the winding 13 forming an upper lead-out terminal 131 on the upper surface 151 and a lower lead-out terminal 132 on the lower surface 152. PCB 10 has a multilayer structure, including an M-layer conductive layer and an N-layer conductive layer. The M-layer conductive layer is disposed above the upper surface 151 of the inductor 15, and the N-layer conductive layer is disposed below the lower surface 152 of the inductor 15. Notably, the upper surface 151 and the lower surface 152 have the same number of conductive layers. Furthermore, the top surface 101 and bottom surface 102 of the PCB assembly 2 have upper solder joints 103 connecting to the upper lead-out terminal 131 of the winding 13 and lower solder joints 104 connecting to the lower lead-out terminal 132 of the winding 13, respectively. In this embodiment, the volume ratio of the magnetic core 14 in the PCB assembly 2 exceeds 50%, and the area ratio of the magnetic core 14 on the top view of the PCB assembly 2 exceeds 70%, thereby reducing the losses of the magnetic core 14 and the winding 13, and improving the overall conversion efficiency of the voltage regulator module 1. In other words, within a horizontal plane, the horizontal plane can be parallel to the upper surface 151 and the lower surface 152, and the projected area of ​​the magnetic core 14 accounts for more than 70% of the projected area of ​​the PCB assembly 2. Of course, this case is not limited to this. In this embodiment, the power device 3 is, for example, an IC device, specifically a DrMOS, including two switching transistors and a driving circuit. The power device 3 includes two sides, and the lower surface contains a soldering portion formed by solder pads 31, spatially relative to the upper soldering position 103 of the PCB assembly 2. In this embodiment, the upper surface of the external circuit board 9 includes a soldering area 91 with a solder pad structure, spatially relative to the lower soldering position 104 of the PCB assembly 2, for soldering the PCB assembly 2. Then, as in step S04: solder is applied to the soldering area 91 of the external circuit board 9 and solder is applied to the upper soldering position 103 of the PCB assembly 2. The solder is, for example, solder paste, and the solder can be applied by spraying or printing. In this step, the power device 3, PCB assembly 2 and external circuit board 9 with solder set are stacked vertically in sequence to form a vertical structure, from top to bottom: power device 3, PCB assembly 2 and external circuit board 9.When forming a vertical structure, the order in which the power device 3, PCB assembly 2, and external circuit board 9 are provided can be adjusted according to requirements. That is, the power device 3 can be placed on the PCB assembly 2 first, and then the power device 3 and PCB assembly 2 can be placed together on the external circuit board 9, or the PCB assembly 2 can be placed on the external circuit board 9 first, and then the power device 3 can be placed on the PCB assembly 2. In this process, the lower solder pad 104 of the PCB assembly 2 is aligned with the soldering area 91 of the external circuit board 9, and the solder pad 31 of the power device 3 is aligned with the upper solder pad 103 of the PCB assembly 2. Finally, a reflow soldering process is performed according to step S05 to achieve electrical connection between the power device 3, PCB assembly 2, and external circuit board 9.

[0094] Figure 15 shows a schematic diagram of another embodiment of the PCB assembly of this case. It should be noted that, in addition to the PCB assembly 2 structure shown in Figures 12 and 13, the PCB assembly 2a proposed in this case for use in the assembly of the voltage regulator module 1 is composed of a multilayer board structure 10a, and further includes an inductor 15 embedded in the multilayer board structure 10a. The inductor 15 includes a magnetic core 14 and at least one winding 13. The magnetic core 14 is pre-formed, and the winding 13 passes through the magnetic core 14 and is embedded in the multilayer board structure 10a of the PCB assembly 2a, forming the upper and lower lead-out terminals of the inductor 15. The upper and lower lead-out terminals of the winding 13 of the inductor 15 are electrically connected to the soldering positions 103 and lower soldering positions 104 on the surface of the PCB assembly 2a by electroplating and drilling, forming the first upper soldering position SWA and the second upper soldering position SWB of the two windings 13 of the inductor 15, and the first output soldering position VOA and the second output soldering position VOB. By integrating the inductor 15 into the multilayer board structure 10a of the PCB assembly 2a, and using electroplating to form a unified whole between the inductor 15 and the multilayer board structure 10a of the PCB assembly 2a, the unified PCB assembly 2a, power device 3, and external circuit board 9 can complete the entire soldering process with only one reflow soldering operation. This increases the soldering reliability of the voltage regulator module 1 while simultaneously reducing production costs.

[0095] Referring again to Figures 3 to 15, in other embodiments of this invention, a single PCB assembly 2, 2a may include multiple inductors 15 connected in parallel. In step S04, solder is applied to the soldering area 91 of the external circuit board 9 and the upper soldering positions 103 of the multiple inductors 15, and the multiple power devices 3, PCB assemblies 2, 2a, and external circuit board 9 are arranged in a vertically stacked sequence, wherein the soldering portions of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple inductors 15, and the lower soldering positions 104 of the multiple inductors 15 are aligned with the soldering area 91. Finally, a reflow soldering process is performed according to step S05 to achieve electrical connection between the multiple power devices 3, PCB assembly 2a, and external circuit board 9. Of course, this invention is not limited to this.

[0096] Referring to Figures 3 to 14, in some other embodiments of the above-mentioned production method for one-time reflow soldering of voltage regulator module, multiple PCB components 2 can be arranged in an array in a fixed fixture first, and then solder paste can be applied to the upper soldering position 103 on the top surface 101 of the PCB component 2 by printing or spraying process. Then, the PCB component 2 with solder paste applied can be placed on the soldering area 91 of the external circuit board 9 by side clamping. Solder paste has been applied to the soldering area 91 by printing or spraying process. Then, power devices such as ICs can be placed on the upper soldering position 103 on the top surface 101 of the PCB component 2. In other embodiments of this invention, multiple PCB assemblies 2 can be arranged in an array within a fixture. Solder paste is then applied to the upper soldering positions 103 on the top surface 101 of the PCB assembly using a printing or spraying process. Power devices 3, such as ICs, are then placed onto the soldering positions 103 on the top surface 101 of the PCB 10 with the applied solder paste. The PCB assembly 2 with the applied solder paste and the placed power devices 3 is then placed onto the soldering area 91 of the external circuit board 9 using a side-clamping method. Solder paste has already been applied to the soldering area 91 using a printing or spraying process. Finally, a reflow soldering process is performed to achieve electrical connection between the multiple power devices 3, the PCB assembly 2, and the external circuit board 9. Of course, this invention is not limited to these methods.

[0097] Figure 16 illustrates the continuous structure formed by arranging multiple PCB components in this invention. Referring to Figures 3 to 14 and Figure 16, in some other embodiments of the above-mentioned method for producing a voltage regulator module using a single reflow soldering process, a continuous structure 200 comprising multiple PCB components 2 is further provided. When producing the voltage regulator module 1 using a single reflow soldering process, solder can first be applied to the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. Then, the continuous structure 200 is placed onto the soldering areas 91 of multiple external circuit boards 9 with solder applied using a side-clamping method. Then, multiple power devices 3 are correspondingly placed onto the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. In other embodiments of this invention, solder paste can be first applied to the soldering positions 103 of the multiple PCB components 2 of the laminated structure 200 using a printing or spraying process. Then, multiple power devices 3 are placed onto the soldering positions 103 of the multiple PCB components 2 of the laminated structure 200 with the solder paste applied. Finally, the laminated structure 200 with the solder paste applied and multiple power devices 3 placed is placed onto the soldering areas 91 of multiple external circuit boards 9 using a side-clamping method. Afterward, a single reflow soldering process is performed to achieve electrical connection between the multiple power devices 3, the laminated structure 200, and the multiple external circuit boards 9. Finally, the laminated structure 200 is cut and separated, so that the multiple power devices 3, the laminated structure 200, and the multiple external circuit boards 9, which are sequentially and vertically stacked, form multiple independent voltage regulator modules 1.

[0098] In addition to the continuous structure 200 formed by arranging multiple PCB components 2, in some other embodiments of this invention, a substrate structure formed by arranging multiple external circuit boards 9 can also be provided. When producing the voltage regulator module 1 by one reflow soldering, solder can first be applied to the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. Then, the continuous structure 200 is placed onto the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure with solder applied by side clamping. Then, multiple power devices 3 are correspondingly placed onto the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. In other embodiments of this invention, solder paste can be first applied to the soldering positions 103 of the multiple PCB components 2 of the laminated structure 200 using a printing or spraying process. Then, multiple power devices 3 are placed onto the soldering positions 103 of the multiple PCB components 2 of the laminated structure 200 with the solder paste applied. Finally, the laminated structure 200 with the solder paste applied and multiple power devices 3 placed is placed onto the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure using a side-clamping method. Afterward, a single reflow soldering process is performed to achieve electrical connection between the multiple power devices 3, the laminated structure 200, and the substrate structure. Finally, the laminated structure 200 and the substrate structure are cut and separated, so that the multiple power devices 3, the laminated structure 200, and the substrate structure, which are stacked vertically in sequence, form multiple independent voltage regulator modules 1.

[0099] Figure 17 shows a three-dimensional structure of a voltage regulator module including a stacked component according to another embodiment of the present invention. Figures 18 and 19 show exploded views of the voltage regulator module of Figure 17. Figure 20 shows a cross-sectional view of the stacked component according to an embodiment of the present invention. In this embodiment, the voltage regulator module 1a is similar to the voltage regulator module 1 shown in Figures 1 to 13, and the same component reference numerals represent the same components, structures, and functions, which will not be described again here. In this embodiment, the voltage regulator module 1a further includes a stacked component 4, which is stacked between the PCB assembly 2 and the external circuit board 9, so that the lower solder pad 104 of the PCB assembly 2 and the external circuit board 9 are electrically connected through the stacked component 4. The stacked component 4 includes an upper solder pad 403 and a lower solder pad 404, which are located on opposite upper surfaces 401 and lower surfaces 402, respectively. In this embodiment, the stacked component 4 may be a single capacitor, which may include a capacitor assembly and / or a metal conductor 406, embedded inside the stacked component 4. The capacitor assembly may, for example, consist of multiple capacitors 405 embedded in a circuit board (as shown in Figure 20). In other embodiments of this invention, the capacitor assembly may also consist of multiple capacitors soldered onto the surface of a circuit board. Additionally, the metallic conductor 406 may be, for example, a copper block, configured to transmit electrical signals and to increase the structural strength of the stack 4. In other embodiments, the stack 4 may also be a single switch unit or a single magnetic unit. This invention is not limited to these embodiments.

[0100] In this embodiment, the upper soldering position 103 of the PCB assembly 2 is electrically connected to the power device 3, the lower soldering position 104 is electrically connected to the upper soldering pad 403 of the stack 4, and the lower soldering pad 404 of the stack 4 is electrically connected to the soldering area 91 of the external circuit board 9. The power device 3, PCB assembly 2, stack 4, and external circuit board 9 are arranged vertically in sequence. The power device 3 and the upper soldering position 103, the lower soldering position 104 and the upper soldering pad 403, and the lower soldering pad 404 and the external circuit board 9 are electrically connected through a single reflow soldering process to form the voltage regulator module 1a. In this embodiment, the PCB assembly 2, power device 3, stack 4, and external circuit board 9 are first provided for assembly before reflow soldering, and the order of their provision and stacking assembly can be adjusted as needed.

[0101] In some other embodiments of this case, solder can be first applied to the soldering area 91 of the external circuit board 9, and the stacked component 4 can be placed on the soldering area 91, so that the lower soldering pad 404 of the stacked component 4 is aligned with the soldering area 91. Next, solder is applied to the upper soldering pad 403 of the stacked component 4, and the PCB assembly 2 is placed on the upper soldering pad 403, so that the lower soldering position 104 is aligned with the upper soldering pad 403. After that, solder is applied to the upper soldering position 103 of the PCB assembly 2, and the power device 3 is placed on the upper soldering position 103, so that the soldering part of the power device 3 is aligned with the upper soldering position 103 of the PCB assembly 2. Finally, by performing a reflow soldering process, the electrical connection of the power device 3, the PCB assembly 2, the stacked component 4 and the external circuit board 9 can be realized to form the voltage regulator module 1a. Of course, the stacking order and the order of provision of the power device 3, the PCB assembly 2, the stacked component 4 and the external circuit board 9 can be adjusted according to the actual application requirements, and are not limited to sequential stacking. For example, solder can be applied to the upper solder pad 403 of the stacked component 4 first, and the PCB assembly 2 can be placed on the upper solder pad 403, aligning the lower solder position 104 with the upper solder pad 403. Next, solder is applied to the upper solder position 103 of the PCB assembly 2, and the power device 3 is placed on the upper solder position 103, aligning the soldering portion of the power device 3 with the upper solder position 103 of the PCB assembly 2. Then, solder is applied to the soldering area 91 of the external circuit board 9, and the stacked component 4 is placed on the soldering area 91. Finally, by performing a reflow soldering process, the electrical connection between the power device 3, the PCB assembly 2, the stacked component 4, and the external circuit board 9 can be achieved, forming the voltage regulator module 1a. Other manufacturing combinations can be flexibly adjusted according to actual manufacturing needs, and will not be elaborated here.

[0102] In some other embodiments of this case, multiple PCB components 2 may be arranged in an array within a fixing fixture. Next, solder is applied to the soldering areas 91 of the multiple external circuit boards 9, and multiple stacked components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9, aligning the lower soldering pads 404 of the multiple stacked components 4 with the soldering areas 91 of the multiple external circuit boards 9. Then, solder is applied to the upper soldering pads 403 of the multiple stacked components 4, and the lower soldering positions 104 of the multiple PCB components 2 are correspondingly placed on the upper soldering pads 403 of the multiple stacked components 4 using a side-clamping method, aligning the lower soldering positions 104 of the multiple PCB components 2 with the upper soldering pads 403 of the multiple stacked components 4. Finally, solder is applied to the upper soldering positions 103 of the multiple PCB components 2, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB components 2, aligning the soldering portions of the multiple power devices 3 with the upper soldering positions 103 of the multiple PCB components 2. In this way, the stacked structure of power device 3, PCB assembly 2, stacked component 4, and external circuit board 9 can be completed. Only one reflow soldering process is needed to achieve the electrical connection between the power device 3, PCB assembly 2, stacked component 4, and external circuit board 9, forming multiple voltage regulator modules 1a. Of course, the stacking order and supply order of the multiple power devices 3, multiple PCB assemblies 2, multiple stacked components 4, and multiple external circuit boards 9 can be adjusted according to actual application requirements and are not limited to sequential stacking. For example, solder can be first applied to the upper solder pads 403 of the multiple stacked components 4, and then the multiple PCB assemblies 2 can be arrayed and arranged in a fixing fixture. Afterwards, the lower solder positions 104 of the multiple PCB assemblies 2 can be placed onto the upper solder pads 403 of the multiple stacked components 4 using a side-clamping method, aligning the lower solder positions 104 of the multiple PCB assemblies 2 with the upper solder pads 403 of the multiple stacked components 4. Subsequently, solder is applied to the upper soldering positions 103 of multiple PCB assemblies 2, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB assemblies 2, so that the soldering parts of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB assemblies 2. Finally, solder is applied to the soldering areas 91 of multiple external circuit boards 9, and multiple stacked components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9. In this way, the stacked structure of power devices 3, PCB assemblies 2, stacked components 4, and external circuit boards 9 can be completed. Only one reflow soldering process is needed to achieve the electrical connection between power devices 3, PCB assemblies 2, stacked components 4, and external circuit boards 9, forming multiple voltage regulator modules 1a. As described above, other manufacturing combinations can be flexibly adjusted according to actual manufacturing requirements, and will not be elaborated here.

[0103] Refer to Figures 16 to 20. In some other embodiments of this invention, a laminated structure 200 including multiple PCB components 2 can also be provided for manufacturing a voltage regulator. When producing the voltage regulator module 1a in a single reflow soldering process, solder can first be applied to the soldering areas 91 of multiple external circuit boards 9, and multiple stacked components 4 can be placed on the soldering areas 91 of multiple external circuit boards 9, so that the lower solder pads 404 of the multiple stacked components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9. Next, solder is applied to the upper solder pads 403 of the multiple stacked components 4, and the lower soldering positions 104 of the multiple PCB components 2 of the laminated structure 200 are correspondingly placed on the upper soldering pads 403 of the multiple stacked components 4 by side clamping, so that the lower soldering positions 104 of the multiple PCB components 2 of the laminated structure 200 are aligned with the upper soldering pads 403 of the multiple stacked components 4. Next, solder is applied to the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200, so that the soldering parts of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200. Then, by performing a single reflow soldering process, the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the multiple external circuit boards 9 are electrically connected. Finally, the laminated structure 200 is cut and separated, so that the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the multiple external circuit boards 9 arranged vertically in sequence form multiple independent voltage regulator modules 1a. Of course, the stacking order and the order of provision of the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the multiple external circuit boards 9 can be adjusted according to the actual application requirements, and are not limited to sequential stacking. For example, solder can be first applied to the upper soldering pads 403 of the multiple stacked components 4, and the lower soldering positions 104 of the multiple PCB assemblies 2 of the continuous structure 200 can be placed onto the upper soldering pads 403 of the multiple stacked components 4 using a side-clamping method, so that the lower soldering positions 104 of the multiple PCB assemblies 2 of the continuous structure 200 are aligned with the upper soldering pads 403 of the multiple stacked components 4. Next, solder is applied to the upper soldering positions 103 of the multiple PCB assemblies 2 of the continuous structure 200, and multiple power devices 3 are placed onto the upper soldering positions 103 of the multiple PCB assemblies 2 of the continuous structure 200, so that the soldering portions of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB assemblies 2 of the continuous structure 200. Afterwards, solder is applied to the soldering areas 91 of the multiple external circuit boards 9, and multiple stacked components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9, so that the lower soldering pads 404 of the multiple stacked components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9. Then, by performing a single reflow soldering process, electrical connections can be achieved for multiple power devices 3, laminated structures 200, multiple stacked components 4, and multiple external circuit boards 9.As mentioned above, other manufacturing combinations can be flexibly adjusted according to actual manufacturing needs, and will not be elaborated here.

[0104] In addition to the continuous structure 200 formed by arranging multiple PCB components 2, in some other embodiments of this invention, a substrate structure formed by arranging multiple external circuit boards 9 can also be provided. When producing a voltage regulator module by one reflow soldering, solder is first applied to the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, and multiple stacked components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, so that the lower soldering pads 404 of the multiple stacked components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure. Next, solder is applied to the upper soldering pads 403 of the multiple stacked components 4, and the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are correspondingly placed on the upper soldering pads 403 of the multiple stacked components 4 by side clamping, so that the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are aligned with the upper soldering pads 403 of the multiple stacked components 4. Next, solder is applied to the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200, so that the soldering parts of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB components 2 of the laminated structure 200. Then, by performing a reflow soldering process, the electrical connection of the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the substrate structure is achieved. Finally, the laminated structure 200 and the substrate structure are cut and separated, so that the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the substrate structure arranged vertically in sequence form multiple independent voltage regulator modules 1a. Of course, the stacking order and the order of provision of the multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the substrate structure can be adjusted according to the actual application requirements, and are not limited to sequential stacking. For example, solder can be first applied to the upper soldering pads 403 of the multiple stacked components 4, and the lower soldering positions 104 of the multiple PCB assemblies 2 of the laminated structure 200 can be placed onto the upper soldering pads 403 of the multiple stacked components 4 using a side-clamping method, so that the lower soldering positions 104 of the multiple PCB assemblies 2 of the laminated structure 200 are aligned with the upper soldering pads 403 of the multiple stacked components 4. Next, solder is applied to the upper soldering positions 103 of the multiple PCB assemblies 2 of the laminated structure 200, and multiple power devices 3 are placed onto the upper soldering positions 103 of the multiple PCB assemblies 2 of the laminated structure 200, so that the soldering portions of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB assemblies 2 of the laminated structure 200. Afterwards, solder is applied to the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, and multiple stacked components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, so that the lower soldering pads 404 of the multiple stacked components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure. Then, by performing a single reflow soldering process, electrical connections can be achieved between multiple power devices 3, the laminated structure 200, the multiple stacked components 4, and the substrate structure.As mentioned above, other manufacturing combinations can be flexibly adjusted according to actual manufacturing needs, and will not be elaborated here.

[0105] In summary, this invention provides a PCB assembly for a voltage regulator module and a method for manufacturing the voltage regulator module. By integrating inductors, input circuit paths, control signal paths, signal detection paths, and test function circuits into a single PCB assembly, the number of stacked layers of the voltage regulator module is simplified, thereby greatly reducing the total number of soldering operations, lowering the production cost of the voltage regulator module, and improving product quality. One layer of the voltage regulator module is a PCB assembly with an embedded inductor, and the layer above the PCB assembly can hold power devices. In the inductor integrated into the PCB assembly, the inductor winding passes through the magnetic core and is embedded in the PCB assembly. Its two output terminals are fused with the copper of the circuit board inside the PCB assembly through an electroplating process. The electroplated copper is interconnected from the inside out and is sequentially pressed together to form soldering positions for IC power devices on the outer layer of the PCB assembly. The number of electroplated copper layers stacked on both sides of the inductor is symmetrical and equal. Power devices, PCB assemblies, stacked components, and external circuit boards are connected in a stacked manner, reducing the total footprint of the voltage regulator module. Furthermore, the entire voltage regulator can be soldered in a single reflow soldering operation, increasing module yield and reducing production costs. The PCB assembly can also be adjusted to accommodate the stacking order of power devices, external circuit boards, and stacked components, allowing for flexible adjustments during voltage regulator module manufacturing to suit specific needs. In addition, when using PCB assemblies in voltage regulator module manufacturing, multiple PCB assemblies can be combined with the substrate structure of multiple external circuit boards, enabling the manufacture of multiple voltage regulator modules in a single reflow soldering operation. The separated voltage regulator modules operate independently, improving product quality and long-term reliability while significantly reducing production costs. Alternatively, multiple voltage regulator modules can be manufactured in a single reflow soldering operation by using an assembly fixture to hold multiple PCB assemblies.

[0106] This case may be modified in various ways by any person skilled in this technology, but none of them shall be outside the scope of the claims of this case. [Simplified Explanation of the Diagram]

[0059] The following detailed description of the case and the schematic diagrams of the embodiments are intended to enable those skilled in the art to better understand the above content, and are not intended to limit the case.

[0060] Figure 1 shows a schematic diagram of the structure of a traditional horizontal power supply voltage regulator module.

[0061] Figure 2 shows a schematic diagram of the structure of a traditional stacked power supply voltage regulator module.

[0062] Figure 3 shows the three-dimensional structure of a voltage regulator module (external circuit board not shown) according to an embodiment of this invention;

[0063] Figure 4 shows a cross-sectional view along line segment AA' in Figure 3;

[0064] Figure 5 shows a cross-sectional view of a PCB assembly according to an embodiment of this case;

[0065] Figure 6 shows a schematic diagram of the inductor structure of an embodiment of this case;

[0066] Figure 7 shows a schematic diagram of the upper soldering position of the power device corresponding to the top surface of the PCB assembly in this case;

[0067] Figure 8 shows a schematic diagram of the lower soldering position on the bottom surface of the PCB assembly in this case;

[0068] Figure 9 shows a schematic diagram of the lower soldering position of another embodiment of the bottom surface of the PCB assembly in this case;

[0069] Figures 10 and 11 show schematic diagrams of the external circuit board of another voltage regulator module in this case;

[0070] Figures 12 and 13 show exploded views of another voltage regulator module in this case; and

[0071] Figure 14 shows a flowchart of a method for manufacturing a voltage regulator module according to an embodiment of this invention.

[0072] Figure 15 shows a structural schematic diagram of another embodiment of the PCB assembly in this case.

[0073] Figure 16 shows the continuous structure formed by the arrangement of multiple PCB components in this case.

[0074] Figure 17 shows the three-dimensional structure of a voltage regulator module including stacked components in another embodiment of this case.

[0075] Figures 18 and 19 show exploded views of the voltage regulator module shown in Figure 17.

[0076] Figure 20 shows a cross-sectional view of the superimposed component according to an embodiment of this case.

Claims

1. A PCB assembly, characterized in that it comprises: A PCB, the PCB including a top surface and a bottom surface disposed opposite to each other; The inductor includes an upper surface and a lower surface disposed opposite to each other. The inductor also includes a magnetic core and a winding passing through the magnetic core. The winding forms an upper lead-out terminal on the upper surface and a lower lead-out terminal on the lower surface. The inductor is embedded in the PCB. The top surface is spatially opposite to the upper surface, and the bottom surface is spatially opposite to the lower surface. Multiple conductive layers are provided above the upper surface and below the lower surface. The top surface and the bottom surface each have an upper solder joint electrically connected to the upper lead-out terminal and a lower solder joint electrically connected to the lower lead-out terminal, respectively. The upper solder joint is electrically connected to a power device to transmit an input electrical signal, and the lower solder joint is electrically connected to an external circuit board to transmit an output electrical signal. The power device, the PCB assembly, and the external circuit board are vertically stacked in sequence. The power device and the upper solder joint, as well as the lower solder joint and the external circuit board, are electrically connected through a reflow soldering process to form a voltage regulator module.

2. The PCB assembly as claimed in claim 1, wherein a plurality of the PCB assemblies are arranged in an array within a fixed fixture, a plurality of the power devices, a plurality of the PCB assemblies and a plurality of the external circuit boards are arranged in sequence and vertically stacked, and the upper soldering positions of the plurality of power devices and the plurality of PCB assemblies and the lower soldering positions of the plurality of PCB assemblies and the plurality of the external circuit boards are electrically connected through a single reflow soldering process to form a plurality of the voltage regulator modules.

3. The PCB assembly as claimed in claim 1, wherein a plurality of the PCB assemblies form a continuous structure, a plurality of power devices, the continuous structure and a plurality of external circuit boards are arranged in sequence and vertically stacked, and the plurality of power devices and the plurality of upper soldering positions of the plurality of PCB assemblies of the continuous structure and the plurality of external circuit boards are electrically connected through a single reflow soldering process, wherein by cutting and separating the continuous structure, the plurality of power devices, the continuous structure and the plurality of external circuit boards arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

4. The PCB assembly as claimed in claim 1, wherein a plurality of the PCB assemblies form a continuous structure, a plurality of the external circuit boards form a substrate structure, a plurality of power devices, the continuous structure and the substrate structure are sequentially and vertically stacked, and the upper soldering positions of the plurality of power devices and the plurality of PCB assemblies of the continuous structure and the plurality of external circuit boards of the substrate structure are electrically connected through a single reflow soldering process, wherein the plurality of power devices, the continuous structure and the substrate structure are separated by cutting, and the sequentially and vertically stacked plurality of power devices, the continuous structure and the substrate structure form a plurality of independent voltage regulator modules.

5. The PCB assembly as claimed in claim 1, wherein the PCB assembly includes a plurality of inductors connected in parallel, wherein, The upper solder joints of the multiple inductors are electrically connected to the multiple power devices to transmit the input electrical signal. The lower solder joints of the multiple inductors are electrically connected to the external circuit board to transmit the output electrical signal. The multiple power devices, the PCB assembly, and the external circuit board are stacked vertically in sequence. The upper solder joints of the multiple power devices and the multiple inductors, as well as the lower solder joints of the multiple inductors and the external circuit board, are electrically connected through a single reflow soldering process to form the voltage regulator module.

6. The PCB assembly as claimed in claim 1, wherein the volume of the magnetic core in the PCB assembly accounts for more than 50%, and the projected area of ​​the magnetic core accounts for more than 70% of the projected area of ​​the PCB assembly in a horizontal plane.

7. The PCB assembly as claimed in claim 1, wherein the PCB assembly further includes an input circuit path, a control signal path, a signal detection path, or a test function circuit.

8. The PCB assembly as claimed in claim 1, wherein the PCB assembly further comprises a metal conductor configured to transmit an electrical signal.

9. The PCB assembly as claimed in claim 1, wherein the lower solder pad and the external circuit board are electrically connected via a stack, the stack including an upper solder pad and a lower solder pad.

10. The PCB assembly as claimed in claim 9, wherein the superimposed component is a capacitor unit, a switch unit, or a magnetic unit.

11. The PCB assembly as claimed in claim 9, wherein a metal conductor is disposed within the stacked component, the metal conductor being configured to transmit an electrical signal.

12. The PCB assembly as claimed in claim 9, wherein the upper solder pad is electrically connected to the power device, the lower solder pad is electrically connected to the upper solder pad, the lower solder pad is electrically connected to the external circuit board, the power device, the PCB assembly, the stack and the external circuit board are arranged vertically in sequence, and the power device and the upper solder pad, the lower solder pad and the upper solder pad, and the lower solder pad and the external circuit board are electrically connected through a single reflow soldering process to form the voltage regulator module.

13. The PCB assembly as claimed in claim 9, wherein a plurality of the PCB assemblies are arranged in an array within a fixture, and a plurality of the power devices, the plurality of the PCB assemblies, the plurality of the stacked components, and the plurality of the external circuit boards are vertically stacked in sequence, and the upper solder pads of the plurality of power devices and the plurality of the PCB assemblies, the lower solder pads of the plurality of the PCB assemblies and the upper solder pads of the plurality of the stacked components, and the lower solder pads of the plurality of the stacked components and the plurality of the external circuit boards are electrically connected through a single reflow soldering process to form a plurality of the voltage regulator modules.

14. The PCB assembly as claimed in claim 9, wherein a plurality of the PCB assemblies form a continuous structure, a plurality of power devices, the continuous structure, a plurality of stacked components and a plurality of external circuit boards are arranged in sequence and vertically stacked, and the plurality of power devices and the plurality of upper solder pads of the PCB assemblies of the continuous structure, the plurality of lower solder pads of the PCB assemblies of the continuous structure and the plurality of upper solder pads of the stacked components, and the plurality of lower solder pads of the stacked components and the plurality of external circuit boards are electrically connected by a single reflow soldering process, wherein the continuous structure is cut apart, and the plurality of power devices, the continuous structure, the plurality of stacked components and the plurality of external circuit boards arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

15. The PCB assembly as claimed in claim 9, wherein a plurality of the PCB assemblies form a lap structure, a plurality of the external circuit boards form a substrate structure, a plurality of power devices, the lap structure, a plurality of stacked components and the substrate structure are sequentially and vertically stacked, and the upper soldering positions of the plurality of power devices and the plurality of PCB assemblies of the lap structure, the lower soldering positions of the plurality of PCB assemblies of the lap structure and the upper soldering pads of the plurality of stacked components, and the lower soldering pads of the plurality of stacked components and the plurality of external circuit boards of the substrate structure are electrically connected by a single reflow soldering process, wherein the lap structure and the substrate structure are cut and separated, and the plurality of power devices, the lap structure, the plurality of stacked components and the substrate structure sequentially and vertically stacked form a plurality of independent voltage regulator modules.

16. The PCB assembly as claimed in claim 1, wherein the PCB includes an M conductive layer and an N conductive layer, where M and N are positive integers, the M conductive layer is disposed above the upper surface, the upper lead-out terminal is electrically connected to the M conductive layer that is attached to the upper surface, the N conductive layer is disposed below the lower surface, the lower lead-out terminal is electrically connected to the N conductive layer that is attached to the lower surface, and M=N≥2.

17. The PCB assembly as claimed in claim 16, wherein the M-layer conductive layer and the N-layer conductive layer each include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes the top surface and the bottom surface for surface routing, copper plating, and soldering of devices, and the inner conductive layer is used for internal routing and copper plating.

18. The PCB assembly as claimed in claim 16, wherein the M-layer conductive layer and the N-layer conductive layer are each composed of multiple copper plating layers.

19. The PCB assembly as claimed in claim 16, further comprising an edge copper plating layer disposed on the top surface, the bottom surface and one side wall of the PCB, and electrically connected between the M conductive layer and the N conductive layer, for assembling to transmit current signals or forming a test function circuit.

20. The PCB assembly as claimed in claim 16, further comprising a conductive via penetrating the top surface and the bottom surface and electrically connected between the M conductive layer and the N conductive layer.

21. The PCB assembly as claimed in claim 16, wherein two adjacent conductive layers of the M-layer and the N-layer are connected by a buried via, and the M-layer and the N-layer are connected to external electrical signals sequentially from the inside to the outside through the buried via.

22. The PCB assembly as claimed in claim 21, wherein the N-layer conductive layer forms an output solder pad and a ground solder pad on the bottom surface through the buried via, wherein the output solder pad and the ground solder pad are arranged alternately.

23. The PCB assembly as claimed in claim 16, wherein the upper solder pad and the upper lead are spatially opposite to each other and electrically connected through an upper circuit channel, the upper circuit channel being sequentially electrically connected to the M-layer conductive layer.

24. The PCB assembly as claimed in claim 16, wherein the lower solder pad and the lower lead are spatially opposite to each other and electrically connected via a lower circuit channel, the lower circuit channel being sequentially electrically connected to the N conductive layers.

25. The PCB assembly as claimed in claim 23, wherein the upper circuit channel is electrically connected from the inside to the outside of the M-layer conductive layer via plated copper vias to the upper solder pad and the upper lead-out terminal.

26. The PCB assembly as claimed in claim 24, wherein the lower circuit channel is electrically connected from the inside to the outside of the N-layer conductive layer to the lower solder pad and the lower lead-out terminal via plated copper vias.

27. A method for manufacturing a voltage regulator module, characterized by comprising the steps of: (a) providing a PCB assembly, the PCB assembly including a PCB and an inductor, wherein the PCB includes a top surface and a bottom surface disposed opposite to each other, the inductor includes an upper surface and a lower surface disposed opposite to each other, the top surface being spatially opposite to the upper surface, the bottom surface being spatially opposite to the lower surface, the inductor being embedded in the PCB, and the inductor including a magnetic core and a winding, the winding passing through the magnetic core, and the winding forming an upper lead-out terminal on the upper surface and a lower lead-out terminal on the lower surface; wherein the upper surface and the lower surface each have a plurality of conductive layers above and below the upper surface, and the top surface and the bottom surface each have an upper solder joint electrically connected to the upper lead-out terminal and a lower solder joint electrically connected to the lower lead-out terminal, respectively; (b) providing a power device having a solder portion spatially opposite to the upper solder joint; (c) providing an external circuit board having a solder area spatially opposite to the lower solder joint; (d) Solder is applied to the soldering area and the upper soldering position, and the power device, the PCB assembly and the external circuit board are arranged vertically in sequence, wherein the soldering part is aligned with the upper soldering position and the lower soldering position is aligned with the soldering area; and (e) a reflow soldering process is performed to achieve electrical connection of the power device, the PCB assembly and the external circuit board.

28. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the volume of the magnetic core in the PCB assembly accounts for more than 50%, and the projected area of ​​the magnetic core accounts for more than 70% of the projected area of ​​the PCB assembly in a horizontal plane.

29. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the solder is a solder paste and is applied by spraying or printing.

30. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the PCB assembly further integrates an input circuit path, a control signal path, a signal detection path, or a test function circuit.

31. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the PCB assembly further comprises a metal conductor configured to transmit an electrical signal.

32. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the PCB assembly includes a plurality of inductors connected in parallel, the step (d) comprising: Solder is applied to the soldering area and the upper soldering positions of the multiple inductors, and the multiple power devices, the PCB assembly and the external circuit board are stacked vertically in sequence, wherein the soldering portions of the multiple power devices are aligned with the upper soldering positions of the multiple inductors, and the lower soldering positions of the multiple inductors are aligned with the soldering area.

33. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein step (d) comprises: (d1) Arrange multiple of the PCB components in a fixed fixture; (d2) Apply the solder to the soldering position of the plurality of the PCB components; (d3) Place multiple PCB components onto the soldering area of ​​multiple external circuit boards where the solder is provided by side clamping; (d4) Place the power devices onto the solder pads of the PCB assemblies.

34. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein step (d) comprises: (d1) Provide a continuous structure comprising a plurality of the PCB assemblies; (d2) Apply the solder to the upper soldering position of the plurality of PCB components in the continuous structure; (d3) Place the continuous structure onto the soldering area of ​​the plurality of external circuit boards with the solder applied by means of side clamping; and (d4) Place the plurality of power devices onto the upper soldering position of the plurality of PCB components in the continuous structure.

35. A method of manufacturing a voltage regulator module as claimed in claim 34, wherein step (e) comprises the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of a plurality of power devices, a bridging structure and a plurality of external circuit boards; (e2) cutting and separating the bridging structure such that a plurality of power devices, a bridging structure and a plurality of external circuit boards arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

36. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein step (d) comprises: (d1) Provide a continuous structure comprising a plurality of the PCB assemblies; (d2) Provide a substrate structure including a plurality of external circuit boards; (d3) Apply solder to the upper soldering position of the plurality of PCB components of the laminated structure; (d4) Place the laminated structure onto the soldering area of ​​the plurality of external circuit boards of the substrate structure with the solder applied in a side-clamping manner; and (d5) Correspondingly place the plurality of power devices onto the upper soldering position of the plurality of PCB components of the laminated structure.

37. A method of manufacturing a voltage regulator module as claimed in claim 36, wherein step (e) includes the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of a plurality of the power devices, the bridging structure and the substrate structure; (e2) cutting and separating the bridging structure and the substrate structure such that a plurality of the power devices, the bridging structure and the substrate structure arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

38. A method of manufacturing a voltage regulator module as claimed in claim 27, wherein the lower solder pad and the external circuit board are electrically connected via a stack, the stack comprising an upper solder pad and a lower solder pad.

39. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein the superimposed component is a capacitor unit, a switch unit, or a magnetic unit.

40. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein a metal conductor is disposed inside the stacked component, the metal conductor being configured to transmit an electrical signal.

41. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein step (d) comprises: (d1) Apply solder to the soldering area and place the stack on the soldering area, so that the lower solder pad is aligned with the soldering area; (d2) Apply solder to the upper solder pad and place the PCB assembly on the upper solder pad, so that the lower soldering position is aligned with the upper solder pad; and (d3) Apply solder to the upper soldering position and place the power device on the upper soldering position, so that the soldering part is aligned with the upper soldering position.

42. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein step (d) comprises: (d1) Arrange multiple of the PCB components in a fixed fixture; (d2) The solder is applied to the soldering area of ​​the plurality of external circuit boards, and the plurality of stacked components are placed on the soldering area of ​​the plurality of external circuit boards, such that the lower solder pads of the plurality of stacked components are aligned with the soldering area of ​​the plurality of external circuit boards. (d3) A solder is applied to the upper solder pad of the plurality of stacked components, and the lower soldering positions of the plurality of PCB assemblies are placed on the upper solder pad of the plurality of stacked components by means of side clamping, so that the lower soldering positions of the plurality of PCB assemblies are aligned with the upper solder pad of the plurality of stacked components; and (d4) The solder is applied to the upper soldering positions of the plurality of PCB assemblies, and the plurality of power devices are placed on the upper soldering positions of the plurality of PCB assemblies, so that the soldering portions of the plurality of power devices are aligned with the upper soldering positions of the plurality of PCB assemblies.

43. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein step (d) comprises: (d1) Provide a continuous structure comprising a plurality of the PCB assemblies; (d2) The solder is applied to the soldering area of ​​the plurality of external circuit boards, and the plurality of stacked components are placed on the soldering area of ​​the plurality of external circuit boards, such that the lower solder pads of the plurality of stacked components are aligned with the soldering area of ​​the plurality of external circuit boards. (d3) A solder is applied to the upper solder pad of the plurality of stacked components, and the lower soldering positions of the plurality of PCB assemblies of the continuous structure are correspondingly placed on the upper solder pad of the plurality of stacked components in a side-clamping manner, so that the lower soldering positions of the plurality of PCB assemblies of the continuous structure are aligned with the upper solder pad of the plurality of stacked components; and (d4) The solder is applied to the upper soldering positions of the plurality of PCB assemblies of the continuous structure, and the plurality of power devices are correspondingly placed on the upper soldering positions of the plurality of PCB assemblies of the continuous structure, so that the soldering portions of the plurality of power devices are aligned with the upper soldering positions of the plurality of PCB assemblies of the continuous structure.

44. A method of manufacturing a voltage regulator module as claimed in claim 43, wherein step (e) comprises the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connections between a plurality of power devices, the bridging structure, the plurality of stacked components, and the plurality of external circuit boards; and (e2) cutting and separating the bridging structure such that the plurality of power devices, the bridging structure, the plurality of stacked components, and the plurality of external circuit boards arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

45. A method of manufacturing a voltage regulator module as claimed in claim 38, wherein step (d) comprises: (d1) Provide a continuous structure comprising a plurality of the PCB assemblies; (d2) A substrate structure is provided, the substrate structure including a plurality of external circuit boards; (d3) Solder is applied to the soldering area of ​​the plurality of external circuit boards of the substrate structure, and a plurality of stacked components are placed on the soldering area of ​​the plurality of external circuit boards of the substrate structure, such that the lower solder pads of the plurality of stacked components are aligned with the soldering area of ​​the plurality of external circuit boards of the substrate structure; (d4) Solder is applied to the upper solder pad of the plurality of stacked components, and the lower soldering positions of the plurality of PCB assemblies of the laminated structure are correspondingly placed on the upper soldering pad of the plurality of stacked components in a side-clamping manner, such that the lower soldering positions of the plurality of PCB assemblies of the laminated structure are aligned with the upper soldering pad of the plurality of stacked components; and (d5) Solder is applied to the upper soldering positions of the plurality of PCB assemblies of the laminated structure, and a plurality of power devices are correspondingly placed on the upper soldering positions of the plurality of PCB assemblies of the laminated structure, such that the soldering portions of the plurality of power devices are aligned with the upper soldering positions of the plurality of PCB assemblies of the laminated structure.

46. ​​A method of manufacturing a voltage regulator module as claimed in claim 45, wherein step (e) comprises the following sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of a plurality of power devices, a bridging structure, a plurality of stacked components and a substrate structure; and (e2) cutting and separating the bridging structure and the substrate structure such that a plurality of power devices, a bridging structure, a plurality of stacked components and a substrate structure arranged in sequence and vertically stacked form a plurality of independent voltage regulator modules.

47. A method for manufacturing a voltage regulator module as claimed in claim 27, wherein the PCB includes an M-layer conductive layer and an N-layer conductive layer, where M and N are positive integers, the M-layer conductive layer is disposed above the upper surface, the upper output terminal is electrically connected to the portion of the M-layer conductive layer that is attached to the upper surface, the N-layer conductive layer is disposed below the lower surface, the lower output terminal is electrically connected to the portion of the N-layer conductive layer that is attached to the lower surface, and M=N≥2.

48. A method of manufacturing a voltage regulator module as claimed in claim 47, wherein the M-layer conductive layer and the N-layer conductive layer each include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes the top surface and the bottom surface of the PCB and is used for surface routing, copper plating, and soldering of devices, and the inner conductive layer is used for internal routing and copper plating.

49. A method for manufacturing a voltage regulator module as claimed in claim 47, wherein the M-layer conductive layer and the N-layer conductive layer are each composed of multiple copper plating layers.

50. A method of manufacturing a voltage regulator module as claimed in claim 47, wherein the PCB assembly further includes an edge copper plating layer disposed on the top surface, the bottom surface and one side wall of the PCB, and electrically connected between the M conductive layer and the N conductive layer, for assembling to transmit current signals or forming a test function circuit.

51. A method of manufacturing a voltage regulator module as claimed in claim 47, wherein the PCB assembly further includes a conductive via penetrating the top surface and the bottom surface and electrically connected between the M conductive layer and the N conductive layer.

52. A method of manufacturing a voltage regulator module as claimed in claim 47, wherein the upper soldering position and the upper output terminal are spatially opposite to each other and electrically connected through an upper circuit channel, the upper circuit channel being sequentially electrically connected to the M-layer conductive layer, wherein the lower soldering position and the lower output terminal are spatially opposite to each other and electrically connected through a lower circuit channel, the lower circuit channel being sequentially electrically connected to the N-layer conductive layer.

53. A method of manufacturing a voltage regulator module as claimed in claim 52, wherein the upper circuit channel is electrically connected from the inside to the outside of the M-layer conductive layer via electroplated copper vias, to the upper solder position and the upper output terminal, and the lower circuit channel is electrically connected from the inside to the outside of the N-layer conductive layer via electroplated copper vias.

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