Multi-pole synchronous magnetic composite electroplating system and electroplating method thereof

Abstract

This invention relates to a multi-pole synchronous magnetic composite electroplating system and its electroplating method. The system includes: an electroplating tank for containing an electroplating solution containing two or more conductive metal ions; a high-frequency magnetic field generating device disposed around the electroplating tank, outputting a magnetic field with adjustable frequency and intensity to adjust the Lorentz force response according to the mass-charge ratio of the metal ions, thereby changing the spatial distribution of ions and reducing local concentration polarization; a plurality of electrodes, including at least one anode and at least one cathode, connected to a potential control module, wherein the anode maintains metal ion balance, the cathode serves as the deposition substrate, and the simultaneous or sequential deposition of ions is controlled by different potential differences; and a control unit for adjusting the rate of change of the potential difference and the duration of action, so that a conductive composite coating with a set metal composition ratio is formed on the cathode surface.

Claims

1. A composite electroplating system using multi-pole synchronous magnetic force, comprising: An electroplating tank is used to hold an electroplating solution containing two or more conductive metal ions; A high-frequency magnetic field generating device is disposed at least on one side, bottom, or rear side of the electroplating tank to output a magnetic field with adjustable frequency and intensity, and adjusts the Lorentz force response according to the mass-charge ratio of the conductive metal ions to change the spatial distribution of the metal ions in the electroplating solution and reduce local concentration polarization; a plurality of anode modules are respectively disposed in the electroplating tank, each anode module including an independent potential / current source, a reference electrode, a measurement circuit, and a microprocessor unit for closed-loop control of local potential or current density; at least one cathode module is disposed in the electroplating tank as the substrate to be plated, which includes an iR compensation circuit and a pulse / anti-pulse control function to stabilize the actual interface potential and suppress hydrogen evolution; an additive control unit is disposed at the rear upper part of the electroplating tank, including a programmable micro-pump for accurately injecting brightener, inhibitor, or leveling agent according to spectral monitoring data; an online spectral monitoring and sensing module is used to measure the metal ion concentration, additive concentration, redox potential, and pH value of the electroplating solution in real time. The device includes a control unit electrically connected to the potential control module and the high-frequency magnetic field generating device. The control unit is used to adjust the rate of change and duration of the potential difference to obtain a set conductive metal composition ratio and form a conductive composite coating on the cathode surface. The potential control module can provide DC voltage, pulse voltage, or alternating voltage to dynamically control the deposition rate of various metal ions. The pulse waveform output by the potential control module has a duty cycle of 10-80% and a frequency of 1-100 kHz, and includes 1-10% anti-pulse to suppress the preferential growth of a single metal. The at least one cathode module is positioned vertically and / or horizontally in the electroplating tank.

2. The multi-pole synchronous magnetic composite electroplating system as described in claim 1, wherein the high-frequency magnetic field generating device can output a magnetic field with adjustable frequency, and adjust the magnetic field frequency and intensity according to the mass-charge ratio of different metal ions to make it close to the cyclotron frequency of the corresponding metal ions in order to control uniformity, wherein the frequency of the high-frequency magnetic field is 1~100 kHz and the magnetic flux density is 1~100 mT.

3. The composite electroplating system of multi-pole synchronous magnetic force as described in claim 1, wherein the conductive metal ions are selected from Cu²⁺, Ni²⁺, Cr³⁺, Zn²⁺, Sn²⁺ / Sn⁴⁺, Pb²⁺, Au³⁺, Ag⁺, Pt²⁺ / Pt⁴⁺, Pd²⁺, Rh³⁺, Co²⁺, Fe²⁺, In³⁺, Mo⁶⁺, W⁶⁺.

4. The multi-pole synchronous magnetic composite electroplating system as described in claim 1, wherein the conductive metal ions are a mixed combination forming an alloy coating, comprising: Related possible combinations include Ni²⁺ + Co²⁺, Cu²⁺ + Sn²⁺, Zn²⁺ + Ni²⁺, Sn²⁺ + Pb², etc.

5. The composite electroplating system of multi-pole synchronous magnetic force as described in claim 1, wherein the electroplating solution further comprises non-metallic or carbon-based positive ions selected from Graphene⁺ and polycations, which are co-deposited with metal ions to form a composite coating.

6. The multi-pole synchronous magnetic composite electroplating system as described in claim 1, wherein the electroplating solution further comprises a fluxing or stabilizing cation selected from NH₄⁺, H⁺ or organic amine salt cations.

7. The multi-pole synchronous magnetic composite electroplating system as described in claim 1, wherein the control unit further includes a feedback control module that monitors the ion concentration, current density or pH value of the electroplating solution through sensors, and adjusts the potential difference and magnetic field strength in real time based on the monitoring data to maintain the stability and uniformity of the deposition process.

8. A multi-pole synchronous magnetic composite electroplating method, comprising the following steps: introducing an electroplating solution containing two or more conductive metal ions into an electroplating tank; arranging at least one anode and at least one cathode in the electroplating tank, the cathode being the surface of the substrate to be plated, and the anode being used to maintain the concentration balance of metal ions in the electrolyte; applying a high-frequency magnetic field to the electroplating tank to selectively change the spatial distribution of metal ions in the electroplating solution according to their mass-charge ratio; arranging multiple electrodes between the anode and the cathode, and applying different potential differences to different electrodes, so that the metal ions can be uniformly deposited on the cathode surface in a controlled manner, either simultaneously or sequentially; controlling the rate of change and duration of each potential difference to obtain a predetermined proportion of conductive metal composition, forming a conductive composite coating.

9. The composite electroplating method using multi-pole synchronous magnetic force as described in claim 8 further includes a monitoring step, wherein the metal ion concentration, current density, pH value or temperature of the electroplating solution is detected during the electroplating process, and the potential difference and magnetic field parameters are adjusted in real time based on the detected monitoring data to maintain the stability and uniformity of the multi-metal ion deposition.

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