Projection device

Abstract

A projection device includes an illumination system, an imaging module, a processing module, and at least one piezoelectric heat dissipation module. The illumination system includes a light source module. The imaging module includes a light valve. The processing module is electrically connected to the illumination system and the imaging module. The at least one piezoelectric heat dissipation module is capable of dissipating heat from at least one of the light source module, the light valve, and the processing module. The piezoelectric heat dissipation module is electrically connected to the processing module and includes at least one piezoelectric heat dissipation unit. The piezoelectric heat dissipation unit includes at least one substrate and at least one piezoelectric element. The piezoelectric element is disposed on the substrate and is used to generate vibration to form an airflow.

Claims

1. A projection device, comprising: An illumination system, including a light source module; an imaging module, including a light valve; A processing module electrically connected to the lighting system and the imaging module; and at least one piezoelectric heat dissipation module adapted to dissipate heat from at least one of the light source module, the light valve and the processing module, wherein the at least one piezoelectric heat dissipation module is electrically connected to the processing module, the at least one piezoelectric heat dissipation module includes at least one piezoelectric heat dissipation unit, and the at least one piezoelectric heat dissipation unit includes: at least one substrate, each of the at least one substrate including a base and a vibrating diaphragm extending from the base, wherein the vibrating diaphragm and the base form a cavity; and at least one piezoelectric element disposed on the vibrating diaphragm of the at least one substrate, the at least one piezoelectric element being adapted to drive the vibrating diaphragm to vibrate by alternating stretching and compression, and to guide airflow through the cavity.

2. The projection device as claimed in claim 1, wherein the processing module includes at least one electronic component and a processing circuit board, the at least one electronic component and the at least one piezoelectric heat dissipation unit are disposed on a surface of the processing circuit board, and the at least one piezoelectric heat dissipation unit is adapted to dissipate heat from the at least one electronic component.

3. The projection device as claimed in claim 2, wherein the at least one piezoelectric heat dissipation module includes at least two piezoelectric heat dissipation units, the at least one electronic component is located between two adjacent piezoelectric heat dissipation units, and the airflow generated by one of the at least two piezoelectric heat dissipation units blows toward the at least one electronic component and the other of the at least two piezoelectric heat dissipation units.

4. The projection device as claimed in claim 1 further includes at least one heat sink, each of the at least one heat sink including a connecting portion and at least one heat sink, the connecting portion including a first surface and a second surface opposite to each other, one of the light source module and the light valve being thermally connected to the first surface, and the at least one piezoelectric heat sink module and the at least one heat sink being disposed on the second surface.

5. The projection device as claimed in claim 4, wherein the number of the at least one piezoelectric heat dissipation module is at least two, and one of the at least one heat dissipation portion is located between two adjacent piezoelectric heat dissipation modules.

6. The projection device as claimed in claim 5, wherein each of the at least two piezoelectric heat dissipation modules further includes a heat dissipation circuit board disposed on the second surface of the connection portion, and the at least one piezoelectric heat dissipation unit is disposed on the heat dissipation circuit board.

7. The projection device as claimed in claim 6, wherein the number of the at least one piezoelectric heat dissipation unit in each of the at least two piezoelectric heat dissipation modules is multiple, the piezoelectric heat dissipation units are arranged along a first direction, each of the at least one heat dissipation portion includes multiple fins, each of the fins extends along a second direction, the first direction and the second direction are perpendicular to each other.

8. The projection device as claimed in claim 7, wherein the airflow generated by each of the piezoelectric heat dissipation units flows in the second direction.

9. The projection device as claimed in claim 4, wherein the at least one piezoelectric heat dissipation module is adapted to dissipate heat from the light source module, the light source module being thermally connected to the first surface of the connection portion.

10. The projection device as claimed in claim 4, wherein the at least one piezoelectric heat dissipation module is adapted to dissipate heat from the light valve, the light valve being thermally connected to the first surface of the connection portion.

11. The projection device as claimed in claim 1, further comprising at least one heat sink, the lighting system further comprising a wavelength conversion element, each of the at least one heat sink comprising a connecting portion and at least one heat dissipation portion, the connecting portion comprising a first surface and a second surface opposite to each other, the wavelength conversion element being thermally connected to the first surface, and the at least one piezoelectric heat dissipation module and the at least one heat dissipation portion being connected to the second surface.

12. The projection device as claimed in claim 1 further includes a fan and a temperature sensor, the fan being electrically connected to the processing module, the temperature sensor being used to sense the temperature of at least one of the light valve and the light source module to generate a temperature signal, the temperature sensor being electrically connected to the processing module to transmit the temperature signal, and the processing module turning the fan on or off according to the temperature signal.

13. The projection device as claimed in claim 1 further includes a fan electrically connected to the processing module, the at least one piezoelectric heat dissipation module being adapted to dissipate heat from the processing module, and when the projection device is in a standby mode, the processing module activates the at least one piezoelectric heat dissipation module and shuts off the fan.

14. The projection device as claimed in claim 1 further includes a fan electrically connected to the processing module, the at least one piezoelectric heat dissipation module being adapted to dissipate heat from the light source module, and when the projection device is in a low-power display mode, the processing module activates the at least one piezoelectric heat dissipation module and shuts down the fan.

15. The projection device as claimed in claim 1, wherein the number of the at least one piezoelectric heat dissipation module is at least two, the at least two piezoelectric heat dissipation modules are adapted to dissipate heat from the light source module and the light valve, and the processing module activates the at least two piezoelectric heat dissipation modules when the projection device is in an operating mode.

16. A projection device, comprising: An illumination system, including a light source module; an imaging module, including a light valve; A processing module electrically connected to the lighting system and the imaging module; and at least one piezoelectric heat dissipation module adapted to dissipate heat from at least one of the light source module, the light valve, and the processing module, wherein the at least one piezoelectric heat dissipation module is electrically connected to the processing module, the at least one piezoelectric heat dissipation module includes at least one piezoelectric heat dissipation unit, and the at least one piezoelectric heat dissipation unit includes: at least one substrate; at least one piezoelectric element disposed on the at least one substrate, the at least one piezoelectric element being used to generate vibration to form airflow; at least one heat dissipation component, each of the at least one heat dissipation component including a connecting portion and at least one heat dissipation portion, the connecting portion including a first surface and a second surface opposite to each other, one of the light source module and the light valve being thermally connected to the first surface and the second surface. The at least one piezoelectric heat dissipation module and the at least one heat dissipation part are disposed on the second surface; and at least one thermal interface material is provided. The number of the at least one piezoelectric heat dissipation module is at least two, and one of the at least one heat dissipation parts is located between two adjacent piezoelectric heat dissipation modules. Each of the at least two piezoelectric heat dissipation modules further includes a heat dissipation circuit board, which is disposed on the second surface of the connecting portion. The at least one piezoelectric heat dissipation unit is disposed on the heat dissipation circuit board, which includes at least one opening. The at least one piezoelectric heat dissipation unit covers the at least one opening, and the at least one thermal interface material is disposed in the at least one opening and contacts the second surface of the connecting portion and the at least one piezoelectric heat dissipation unit.

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