Carboxyl-modified amide resins, resin compositions, laminates and flexible printed wiring boards

Abstract

This invention provides a carboxyl-containing modified amide resin, which can be used as an adhesive for electronic components, or as a coating material for surface protective layers and insulating protective films, exhibiting excellent solution stability, elastic modulus, and heat resistance. This invention is a carboxyl-containing modified amide resin comprising: units derived from polyol (a), units derived from polyamine (b), and units derived from tetracarboxylic dianhydride (c), and having the structure shown in the following general formula (X) (in general formula (X), n represents a number from 0 to 20, R1 represents an organic group from tetracarboxylic dianhydride with the anhydride group removed, R2 represents an organic group from polyamine (b) with the amine group removed, and R3 represents an organic group from polyol (a) with the hydroxyl group removed); the polyamine (b) contains an aromatic diamine (b1), and the amide bond concentration is 0.5 to 2.0 mmol / g.

Claims

1. A carboxyl-modified amide resin, comprising: a constituent unit derived from a polyol (a), a constituent unit derived from a polyamine (b), and a constituent unit derived from a tetracarboxylic dianhydride (c), and having the structure shown in the following general formula (X); wherein the polyamine (b) contains an aromatic diamine (b1); the amide bond concentration is 0.5 to 2.0 mmol / g; the aromatic diamine (b1) is a compound having an aromatic ether bond; the molecular weight of the portion of the aromatic diamine (b1) other than the amino group is 240 to 500; (in the above general formula (X), n represents a number from 0 to 20, R1 represents an organic group from which the anhydride group has been removed from the tetracarboxylic dianhydride, R2 represents an organic group from which the amino group has been removed from the polyamine (b), and R3 represents an organic group from which the hydroxyl group has been removed from the polyol (a)).

2. The carboxyl-containing modified amide resin as described in claim 1, wherein, The aforementioned polyol (a) contains at least one selected from the group consisting of polycarbonate diol and polyester diol.

3. The carboxyl-containing modified amide resin as described in claim 2, wherein, The aforementioned polyol (a) further contains a polyol (a1) that is liquid at 25°C; the content of the constituent units derived from the aforementioned polyol (a1) is 20-60% by mass.

4. The carboxyl-containing modified amide resin as described in claim 1, wherein, The number average molecular weight is 10,000~50,000, and the acid value is 5~40 mgKOH / g.

5. A resin composition comprising a carboxyl-containing modified amide resin according to any one of claims 1 to 4, and an epoxy resin having two or more epoxy groups in one molecule.

6. The resin composition as claimed in claim 5, wherein, It further contains an organic solvent, which is used to dissolve the above-mentioned modified amide resin containing carboxyl groups, and has a boiling point below 200°C.

7. A laminate, which is a hardened layer having the resin composition of claim 5 after curing.

8. A flexible printed wiring board comprising the laminate of claim 7 as a constituent element.