A fluid handling system, method and lithographic apparatus

Abstract

This document discloses a fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine a wetting liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate through the wetting liquid. The fluid handling system includes: a replaceable plate having an outer surface including a plurality of fluid openings configured to supply and / or extract the wetting liquid and / or gas in a channel between the fluid handling system and the substrate; wherein the outer surface is coated.

Description

Technical Field

[0001] This invention relates to a fluid handling system and a method for manufacturing an apparatus. This invention also relates to lithography equipment. Prior Technology

[0002] Lithography equipment is a machine configured to apply a desired pattern onto a substrate. Lithography equipment can be used, for example, in the manufacture of integrated circuits (ICs). Lithography equipment can project, for example, a pattern (also often referred to as a "design layout" or "design") from a patterning device (e.g., a photomask) onto a radiation-sensitive material (resist) layer provided on a substrate (e.g., a wafer). Known lithography equipment includes: a stepper, which irradiates each target portion by exposing the entire pattern onto the target portion in a single pass; and a scanner, which irradiates each target portion by scanning the pattern in a given direction ("scanning" direction) simultaneously with or against this direction via a radiation beam.

[0003] As semiconductor manufacturing processes continue to advance, the size of circuit components has shrunk steadily over the past few decades, while the number of functional components, such as transistors, per device has steadily increased, following a trend commonly known as "Moore's Law." To keep pace with Moore's Law, the semiconductor industry is pursuing technologies that enable the production of increasingly smaller features. To project patterns onto a substrate, lithography equipment uses electromagnetic radiation. The wavelength of this radiation determines the minimum size of the feature patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0004] Further improvements in resolution for smaller features can be achieved by providing a wetting fluid, such as water, with a relatively high refractive index on the substrate during exposure. The wetting fluid effect enables imaging of smaller features because the exposure radiation has a shorter wavelength in a fluid compared to a gas. The wetting fluid effect can also be seen as increasing the system's effective numerical aperture (NA) and depth of focus.

[0005] The wetting fluid can be confined by a fluid handling structure to a localized area between the projection system of a lithography device and the substrate. The use of such wetting fluids can cause droplets to remain on the substrate surface. These droplets can be problematic because they can lead to dry spots on the substrate, and because when droplets hit the meniscus of the wetting fluid, this is attributed to the formation of bubbles caused by gas trapped in the wetting fluid. Bubbles in the wetting fluid can cause printing defects on the substrate. The likelihood of introducing such bubbles can be reduced by decreasing the relative velocity between the substrate and the substrate.

[0006] Fluid handling structures contain openings for providing flow of submerged fluids and gases. Maintenance of fluid handling structures includes operations to clear blockages in these openings. Maintenance of fluid handling structures can reduce the availability of lithography equipment. Summary of the Invention

[0007] One objective of this invention is to provide a fluid handling system with reduced downtime due to maintenance.

[0008] According to a first aspect of the present invention, a fluid processing system for a lithography apparatus is provided, wherein the fluid processing system is configured to confine a wetting liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate through the wetting liquid. The fluid processing system includes: a replaceable plate having an outer surface including a plurality of fluid openings configured to supply and / or extract the wetting liquid and / or gas in a channel between the fluid processing system and the substrate; wherein the outer surface is coated.

[0009] According to a second aspect of the present invention, a fluid processing system for a lithography apparatus is provided, wherein the fluid processing system is configured to confine an impregnating liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate through the impregnating liquid. The fluid processing system comprises: a plurality of replaceable plates; wherein each plate includes an outer surface having a plurality of fluid openings configured to supply and / or extract impregnating liquid and / or gas in a channel between the fluid processing system and the substrate.

[0010] According to a third embodiment of the present invention, a fluid processing system for a lithography apparatus is provided, wherein the fluid processing system is configured to confine a wetting liquid to a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate through the wetting liquid. The fluid processing system includes: a replaceable plate for supplying and / or extracting the wetting liquid and / or gas in a channel between the fluid processing system and the substrate; wherein the plate includes a porous component.

[0011] According to a fourth embodiment of the present invention, a fluid handling system for a lithography apparatus is provided, wherein the fluid handling system is configured to confine a wetting liquid to a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate through the wetting liquid. The fluid handling system includes: one or more damping plates; wherein an outer surface of each damping plate provides an interface between the fluid handling system and a channel between the fluid handling system and the substrate; and a surface of one damping plate provides a minimum spacing across the channel between the fluid handling system and the substrate.

[0012] According to a fifth aspect of the present invention, a lithography apparatus is provided that is based on any one of the first to fourth aspects.

[0013] Other embodiments, features, and advantages of the invention are described in detail below with reference to the accompanying drawings, as well as the structure and operation of various embodiments, features, and advantages of the invention. Simple Explanation of the Diagram

[0014] Embodiments of the invention will now be described by way of example only with reference to the accompanying schematic diagrams, in which corresponding element symbols indicate corresponding portions, and in these schematic diagrams:

[0015] Figure 1 provides a schematic overview of lithography equipment;

[0016] Figures 2A, 2B, 2C, and 2D each depict two different versions of the fluid handling system in cross-section, with the different features illustrated on the left and right sides of each version. These features extend around the entire circumference.

[0017] Figures 3A, 3B, and 3C show parts of the fluid handling system and the substrate in the lithography equipment;

[0018] Figures 4A and 4B show portions of the fluid processing structure according to the first embodiment;

[0019] Figures 5A, 5B, and 5C illustrate portions of the fluid processing structure according to the second embodiment;

[0020] Figure 6 shows the surface of the damper according to the third embodiment; and

[0021] Figure 7 shows the surface of the damper according to the fourth embodiment.

[0022] The features shown in the figures are not necessarily to scale, and the sizes and / or configurations depicted are not limiting. It will be understood that the figures include optional features that may not be essential to the invention. Furthermore, each figure does not depict all features of the device, and the figures may only show some of the components associated with describing a particular feature. Implementation

[0023] In this document, the terms “radiation” and “beam” are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g., wavelengths of 365 nm, 248 nm, 193 nm, 157 nm, or 126 nm).

[0024] As used herein, the terms "reducing mask," "mask," or "patterning device" can be broadly interpreted as referring to a general patterning device that imparts a patterned cross-section to an incident radiation beam, corresponding to a pattern to be generated in a target portion of a substrate. In this context, the term "light valve" may also be used. Examples of such patterning devices, besides typical masks (transmissive or reflective, binary, phase-shifting, hybrid, etc.), include programmable mirror arrays and programmable LCD arrays.

[0025] Figure 1 schematically depicts a lithography apparatus. The lithography apparatus LA includes: an illumination system (also called an illuminator) IL configured to adjust a radiation beam B (e.g., UV or DUV radiation); a mask support (e.g., a mask stage) MT configured to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA according to certain parameters; a substrate support (e.g., a wafer stage) WT configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioner PW configured to accurately position the substrate support WT according to certain parameters; and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted by the patterning device MA to the radiation beam B onto a target portion C (e.g., containing one or more dies) of the substrate W. A controller 500 controls the overall operation of the apparatus. The controller 500 can be a centralized control system or a system of multiple independent sub-controllers within various subsystems of the lithography apparatus.

[0026] In operation, the illumination system IL receives a radiated beam B from the radiation source SO, for example, via a beam delivery system BD. The illumination system IL may include various types of optical components for guiding, shaping, and / or controlling the radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components, or any combination thereof. The illuminator IL can be used to adjust the radiated beam B to have a desired spatial and angular intensity distribution in its cross-section at the plane of the patterning device MA.

[0027] The term "projection system" PS as used herein should be broadly interpreted to encompass all types of projection systems suitable for the exposure radiation used and / or other factors such as the use of wetting liquids or vacuum, including refractive, reflective, reflective-refractive, composite, magnetic, electromagnetic, and / or electrostatic optical systems or any combination thereof. Any use of the term "projection lens" herein may be considered synonymous with the more general term "projection system" PS.

[0028] Lithography equipment belongs to the type in which at least a portion of the substrate W may be covered by an immersion liquid (e.g., water) having a relatively high refractive index to fill the immersion space 11 between the projection system PS and the substrate W; this is also known as immersion lithography. Further information on immersion techniques is given in US 6,952,253, which is incorporated herein by reference.

[0029] Lithography equipment may be of the type having two or more substrate supports WT (also known as "dual stages"). In this "multi-stage" machine, substrate supports WT can be used in parallel, and / or a substrate W located on one of the substrate supports WT can be used to prepare the substrate W for subsequent exposure, while another substrate W on the other substrate support WT is used to expose a pattern on the other substrate W.

[0030] In addition to the substrate support WT, the lithography apparatus may include a measurement stage (not shown in the figure). The measurement stage is configured to hold sensors and / or cleaning devices. The sensors may be configured to measure characteristics of the projection system PS or the characteristics of the radiated beam B. The measurement stage may hold multiple sensors. The cleaning devices may be configured to clean parts of the lithography apparatus, such as parts of the projection system PS or parts of the system providing the immersion liquid. The measurement stage may be movable below the projection system PS when the substrate support WT is away from the projection system PS.

[0031] In operation, a radiation beam B is incident on a patterning device MA (e.g., a photomask) held on a photomask support MT, and patterned by a pattern (design layout) presented on the patterning device MA. Having traversed the photomask MA, the radiation beam B is passed through a projection system PS, which focuses the beam onto a target portion C of the substrate W. The substrate support WT can be accurately moved, for example, to position different target portions C in the path of the radiation beam B at a focused and aligned position, using a second locator PW and a position measurement system IF. Similarly, a first locator PM and possibly another position sensor (not explicitly depicted in Figure 1) can be used to accurately position the patterning device MA relative to the path of the radiation beam B. Photomask alignment marks M1, M2 and substrate alignment marks P1, P2 can be used to align the patterning device MA and the substrate W. Although the substrate alignment marks P1, P2, as described, occupy dedicated target portions, they can be located in the space between the target portions. When substrate alignment marks P1 and P2 are located between target portions C, these substrate alignment marks are called cut track alignment marks.

[0032] To illustrate this invention, the Cartesian coordinate system is used. The Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two axes. Rotation about the x-axis is called Rx rotation. Rotation about the y-axis is called Ry rotation. Rotation about the z-axis is called Rz rotation. The x-axis and y-axis define the horizontal plane, while the z-axis lies in the vertical direction. The Cartesian coordinate system is not limiting of the invention and is only used for illustration. In practice, another coordinate system, such as the cylindrical coordinate system, can be used to illustrate the invention. The orientation of the Cartesian coordinate system can be different, for example, such that the z-axis has a component along the horizontal plane.

[0033] Immersion lithography has been introduced into lithography systems to improve the resolution of smaller features. In an immersion lithography apparatus, a liquid layer of a relatively high refractive index is inserted into the immersion space 11 between the projection system PS (which projects a patterned beam toward the substrate W) and the substrate W. The immersion liquid at least covers a portion of the substrate W beneath the final element of the projection system PS. Thus, at least a portion of the exposed substrate W is immersed in the immersion liquid.

[0034] In commercial immersion lithography, the wetting liquid is water. Typically, this water is high-purity distilled water, such as ultrapure water (UPW) commonly used in semiconductor manufacturing plants. In immersion systems, UPW is often purified and may undergo additional treatment before being supplied to the immersion space 11 as the wetting liquid. Besides water, other liquids with high refractive indices can also be used, such as hydrocarbons, such as fluorinated hydrocarbons; and / or aqueous solutions. Furthermore, the use of other fluids besides liquids in immersion lithography has been envisioned.

[0035] In this specification, localized wetting will be referred to in the description, wherein the wetting liquid is confined in use to a wetting space 11 between the final element 100 and the surface facing the final element 100. The facing surface is the surface of the substrate W, or the surface of a support stage (or substrate support WT) coplanar with the surface of the substrate W. (Note that unless otherwise stated, reference to the surface of the substrate W in the following text also refers to the surface of the substrate support WT; and vice versa). A fluid handling structure 12 existing between the projection system PS and the substrate support WT is used to confine the wetting liquid to the wetting space 11. The wetting space 11, filled with the wetting liquid, is smaller in planar plane than the top surface of the substrate W, and the wetting space 11 remains substantially stationary relative to the projection system PS, while the substrate W and the substrate support WT move below.

[0036] Other immersion systems have been envisioned, such as unconfined immersion systems (so-called "full wetting" immersion systems) and bath immersion systems. In an unconfined immersion system, the wetting liquid does not only cover the surface below the final component 100. The liquid system outside the immersion space 11 exists as a thin liquid film. The liquid can cover the entire surface of the substrate W, or even the substrate W and the substrate support WT coplanar with the substrate W. In a bath system, the substrate W is completely immersed in the wetting liquid bath.

[0037] The fluid handling structure 12 is configured to supply wetting liquid to and remove wetting liquid from the wetting space 11, thereby confining the wetting liquid within the wetting space 11. It includes features that are part of a fluid supply system. The configuration disclosed in PCT Patent Application Publication No. WO 99 / 49504 is an earlier fluid handling structure, which includes conduits that supply or recover wetting liquid from the wetting space 11, and operates depending on the relative movement of the stage under the projection system PS. In the latest design, the fluid handling structure extends at least a portion of the boundary of the wetting space 11 between the final element 100 of the projection system PS and the substrate support WT or substrate W, in order to partially define the wetting space 11.

[0038] The fluid handling structure 12 may have a series of different functions. Each function may be derived from the corresponding features that enable the fluid handling structure 12 to achieve that function. The fluid handling structure 12 may be referred to by several different terms, each term referring to a function, such as barrier components, sealing components, fluid supply system, fluid removal system, liquid containment structure, etc.

[0039] As a barrier component, the fluid handling structure 12 acts as a barrier to the flow of the wetting liquid from the wetting space 11. As a liquid confinement structure, this structure confines the wetting liquid within the wetting space 11. As a sealing component, the sealing features of the fluid handling structure 12 form a seal to confine the wetting liquid within the wetting space 11. The sealing features may include an additional gas flow (such as an air knife) from an opening in the surface of the sealing component.

[0040] In one embodiment, the fluid handling structure 12 can supply wetting fluid and is therefore a fluid supply system.

[0041] In one embodiment, the fluid handling structure 12 may at least partially confine the wetting fluid, thereby serving as a fluid confinement system.

[0042] In one embodiment, the fluid handling structure 12 may provide a barrier to the wetting fluid, and thereby be a barrier component, such as a fluid limiting structure.

[0043] In one embodiment, the fluid handling structure 12 may generate or use airflow, for example, to help control the flow and / or position of the wetting fluid.

[0044] The gas flow can form a seal to limit the wetting fluid; therefore, the fluid handling structure 12 can be referred to as a sealing component; this sealing component can be a fluid limiting structure.

[0045] In one embodiment, the wetting fluid system is used as the wetting fluid. In that case, the fluid handling structure 12 may be a liquid handling system. Referring to the foregoing description, references to fluid-defined characteristics in this paragraph may be understood to include liquid-defined characteristics.

[0046] The lithography apparatus has a projection system PS. During exposure of a substrate W, the projection system PS projects a patterned radiation beam onto the substrate W. To reach the substrate W, the path of the radiation beam B from the projection system PS passes through an immersion liquid, which is confined by a fluid handling structure 12 located between the projection system PS and the substrate W. The projection system PS has a lens element in contact with the immersion liquid, which is the last element in the path of the beam. This lens element in contact with the immersion liquid may be referred to as the "last lens element" or "final element". The final element 100 is at least partially surrounded by the fluid handling structure 12. The fluid handling structure 12 confines the immersion liquid below the final element 100 and above the opposing surface.

[0047] Figures 2A, 2B, 2C, and 2D illustrate different features that can exist in variations of fluid handling systems. Unless otherwise described, these designs may share some of the same features as those in Figures 2A, 2B, 2C, and 2D. Features described herein may be selected individually or in combination as shown or as needed. These figures depict different versions of fluid handling systems with different features illustrated on the left-hand and right-hand sides, which may extend around the entire circumference. Thus, for example, the fluid handling system may have the same features extending around the entire circumference. For example, the fluid handling system may have only the features of the left-hand side of Figure 2A, or the right-hand side of Figure 2A, or the left-hand side of Figure 2B, or the right-hand side of Figure 2B, or the left-hand side of Figure 2C, or the right-hand side of Figure 2D, or the left-hand side of Figure 2D. Alternatively, the fluid handling system may have any combination of features from these diagrams at different locations around the circumference. The fluid handling system may include the fluid handling structure 12 described in the following variation.

[0048] Figure 2A illustrates a fluid processing structure 12 surrounding the bottom surface of the final element 100. The final element 100 has an inverted truncated conical shape. The truncated conical shape has a flat bottom surface and a conical surface. The truncated conical shape protrudes from the flat surface and has a flat bottom surface. The flat bottom surface is the photoactive portion of the bottom surface of the final element 100, through which a radiated beam B can pass. The final element 100 may have a coating 30. The fluid processing structure 12 surrounds at least a portion of the truncated conical shape. The fluid processing structure 12 has an inner surface facing the conical surface of the truncated conical shape. The inner surface and the conical surface may have complementary shapes. The top surface of the fluid processing structure 12 is substantially flat. The fluid processing structure 12 may be assembled around the truncated conical shape of the final element 100. The bottom surface of the fluid processing structure 12 may be substantially flat, and in use, the bottom surface may be parallel to the substrate support WT and / or the opposing surface of the substrate W. Therefore, the bottom surface of the fluid processing structure 12 can be referred to as the surface facing the substrate W. The distance between the bottom surface and the opposing surface can be in the range of 30 micrometers to 500 micrometers, ideally in the range of 80 micrometers to 200 micrometers.

[0049] Compared to the final element 100, the fluid processing structure 12 extends closer to the opposing surfaces of the substrate W and the substrate support WT. Therefore, an impregnation space 11 is defined between the inner surface of the fluid processing structure 12, the flat surface of the truncated conical portion, and the opposing surface. During use, the impregnation space 11 is filled with an impregnation liquid. The impregnation liquid fills at least a portion of the buffer space between the complementary surfaces of the final element 100 and the fluid processing structure 12, and in one embodiment, fills at least a portion of the space between the complementary inner surface and the conical surface.

[0050] The wetting liquid is supplied to the wetting space 11 through openings formed in the surface of the fluid processing structure 12. The wetting liquid can also be supplied through supply openings 20 in the inner surface of the fluid processing structure 12. Alternatively or additionally, the wetting liquid is supplied from a lower supply opening 23 formed in the bottom surface of the fluid processing structure 12. The lower supply opening 23 may surround the path of the radiation beam B and may be formed by an array of openings or a single slit. The wetting liquid is supplied to fill the wetting space 11 so that the flow through the wetting space 11 under the projection system PS is laminar. Supplying the wetting liquid from the lower supply opening 23 further prevents air bubbles from entering the wetting space 11. This supply of the wetting liquid can act as a liquid seal.

[0051] The wetting liquid can be recovered through a recovery opening 21 formed in the internal surface. Recovery of the wetting liquid through the recovery opening 21 can be achieved by applying negative pressure; recovery through the recovery opening 21 can be a result of the velocity of the wetting liquid flow through the wetting space 11; or it can be a result of both. When viewed in plan view, the recovery opening 21 can be located on the opposite side of the supply opening 20. Alternatively, the wetting liquid can be recovered via an overflow recovery member 24 located on the top surface of the fluid processing structure 12. The supply opening 20 and the recovery opening 21 can be interchanged (i.e., the flow direction of the liquid can be reversed). This allows the flow direction to be changed depending on the relative movement of the fluid processing structure 12 and the substrate W.

[0052] Alternatively, the wetting liquid can be recovered from below the fluid processing structure 12 via a recovery opening 25 formed in the bottom surface of the fluid processing structure 12. The recovery opening 25 can be used to hold the meniscus 33 of the wetting liquid to the fluid processing structure 12. The meniscus 33 is formed between the fluid processing structure 12 and the opposing surface, and it acts as the boundary between the liquid space and the gaseous external environment. The recovery opening 25 can be a porous plate that can recover the wetting liquid in a single-phase flow. The recovery opening in the bottom surface can be a series of restraining openings 32 for recovering the wetting liquid. The restraining openings 32 can recover the wetting liquid in a two-phase flow.

[0053] Depending on the situation, the air knife opening 26 extends radially outward from the inner surface of the fluid treatment structure 12. Gas can be supplied at high speed through the air knife opening 26 to help confine the wetting liquid within the wetting space 11. The supplied gas can be humidified and may substantially contain carbon dioxide. A gas recovery opening 28 for recovering the gas supplied through the air knife opening 26 extends radially outward from the air knife opening 26.

[0054] For example, other openings to the atmosphere, a gas source, or a vacuum may exist in the bottom surface of the fluid processing structure 12, that is, in the surface of the fluid processing structure 12 facing the substrate W. An example of such an alternative opening 50, selected as appropriate, is shown by a dashed line on the right-hand side of Figure 2A. As shown, the alternative opening 50 may be a supply or extraction component, indicated by a double-headed arrow. For example, if configured as a supply component, the alternative opening 50 may be connected to a liquid supply or a gas supply, just like any of the supply components. Alternatively, if configured as an extraction component, the alternative opening 50 may be used to extract fluid and may be connected, for example, to the atmosphere, a gas source, or a vacuum. For example, at least one alternative opening 50 may exist between the air knife opening 26 and the gas recovery opening 28 and / or between the restraint opening 32 and the air knife opening 26.

[0055] The left and right sides of Figure 2A show two different versions of the fluid handling structure 12 that trap the meniscus 33. Due to the fixed position of the trapping opening 32, the version of the fluid handling structure 12 on the right side of Figure 2A traps the meniscus 33 at a position substantially fixed relative to the final element 100. The version of the fluid handling structure 12 on the left side of Figure 2A traps the meniscus 33 below the recovery opening 25, and therefore the meniscus 33 can move along the length and / or width of the recovery opening 25. For the radiation beam B to be guided to the full side of the substrate W under exposure, the substrate support WT supporting the substrate W is moved relative to the projection system PS. To maximize the output of the substrate W exposed by the lithography equipment, the substrate support WT (and therefore the substrate W) is moved as quickly as possible. However, there is a critical relative velocity (often referred to as the critical scan velocity), beyond which the meniscus 33 between the fluid handling structure 12 and the substrate W becomes unstable. An unstable meniscus 33 has a greater risk of losing wetting fluid, for example, in the form of one or more droplets. Furthermore, the unstable meniscus 33 poses a greater risk of introducing air bubbles into the wetting liquid, especially when the confined wetting liquid crosses the edge of the substrate W.

[0056] Droplets present on the surface of substrate W can impose thermal loads and can be sources of defects. Droplets may evaporate, leaving dry spots; droplets may migrate, transporting contaminants such as particles; droplets may collide with larger bodies in the wetting liquid, introducing gas bubbles into the larger bodies; and droplets may evaporate, thus imposing thermal loads on the surface to which they are positioned. If this surface is associated with components of a lithography apparatus positioned relative to the imaging substrate W, this thermal load can be a cause of deformation and / or a source of positioning errors. Therefore, the formation of droplets on the surface is undesirable. To avoid the formation of these droplets, the speed of the substrate support WT is therefore limited to a critical scanning speed at which the meniscus 33 remains stable. This situation limits the output of the lithography apparatus.

[0057] The left-hand side of the fluid handling system in Figure 2A may include a spring 60. Spring 60 may be an adjustable passive spring configured to apply a bias force to the fluid handling structure 12 in the direction of the substrate W. Therefore, spring 60 can be used to control the height of the fluid handling structure 12 above the substrate W. Such adjustable passive springs are described in US 7,199,874, which is incorporated herein by reference in its entirety. Other biasing devices using electromagnetic force, for example, may also be suitable. Although spring 60 is shown using the left-hand side of Figure 2A, it is optional and not necessary to include other features of the left-hand side of Figure 2A. Spring 60 is not shown in any of the other figures, but may include other variations of the fluid handling system described with respect to Figures 2A, 2B, 2C, or 2D.

[0058] Figure 2B shows two different versions of the fluid handling structure 12 on its upper left and upper right sides, which allow the meniscus 33 to move relative to the final element 100. The meniscus 33 can move in the direction of the moving substrate W. This reduces the relative velocity between the meniscus 33 and the moving substrate W, which results in improved stability and a lower risk of meniscus 33 breakdown. The increased velocity of the substrate W in the event of meniscus 33 breakdown allows the substrate W to move faster under the projection system PS. This thus increases yield.

[0059] The features shown in Figure 2B are common to those in Figure 2A and share the same reference numerals. The fluid handling structure 12 has an internal surface that is complementary to the conical surface of the truncated conical shape. The bottom surface of the fluid handling structure 12 is closer to the opposing surface than the flat bottom surface of the truncated conical shape.

[0060] The wetting liquid is supplied to the wetting space 11 via a supply opening 34 formed in the inner surface of the fluid processing structure 12. The supply opening 34 is located near the bottom of the inner surface, possibly below the bottom surface of the truncated conical shape. The supply opening 34 is positioned around the inner surface and spaced around the path of the radiating beam B.

[0061] The wetting liquid is recovered from the wetting space 11 via the recovery opening 25 on the bottom surface of the fluid processing structure 12. As the opposing surface moves below the fluid processing structure 12, the meniscus 33 can migrate above the surface of the recovery opening 25 in the same direction as the movement of the opposing surface. The recovery opening 25 can be formed of a porous component. The wetting liquid can be recovered as a single phase. The wetting liquid can also be recovered as a two-phase flow. A two-phase flow is received in a chamber 35 within the fluid processing structure 12, wherein the two-phase flow is separated into liquid and gas. The liquid and gas are recovered from the chamber 35 through separation channels 36 and 38.

[0062] The inner periphery 39 of the bottom surface of the fluid processing structure 12 extends away from the inner surface into the wetting space 11 to form a plate 40. The inner periphery 39 forms a small aperture that can be sized to match the shape and size of the radiation beam B. The plate 40 can be used to isolate the wetting liquid on either side of it. The supplied wetting liquid flows radially inward toward the aperture, through the inner aperture, and then radially outward toward the surrounding recovery opening 25 below the plate 40.

[0063] The fluid handling structure 12 may be in two parts, as shown on the right side of Figure 2B: an inner part 12a and an outer part 12b. The inner part 12a and the outer part 12b may move relative to each other primarily in a plane parallel to opposing surfaces. The inner part 12a may have a supply opening 34 and may have an overflow recovery element 24. The outer part 12b may have a plate 40 and a recovery opening 25. The inner part 12a may have an intermediate recovery element 42 for recovering the wetting liquid flowing between the inner part 12a and the outer part 12b.

[0064] The two different versions of the fluid handling structure in Figure 2B thus allow the meniscus 33 to move in the same direction as the substrate W, thereby enabling faster scanning speeds and increased throughput of the lithography equipment. However, the migration speed of the meniscus 33 above the surface of the recovery opening 25 in the fluid handling structure 12 on the left side of Figure 2B can be slow. By moving the outer portion 12b relative to the inner portion 12a and the final element 100, the fluid handling structure 12 on the right side of Figure 2B allows the meniscus 33 to move faster. However, it may be difficult to control the intermediate recovery element 42 to ensure that sufficient wetting fluid is provided between the inner portion 12a and the outer portion 12b to prevent contact between these portions.

[0065] Figure 2C shows two different versions of the fluid handling structure 12 on its upper left and upper right sides. These versions can be used to restrain the meniscus 33 of the wetting liquid to the fluid handling structure 12, as described above with respect to Figures 2A and / or 2B. Features shown in Figure 2C that are common to Figures 2A and / or 2B share the same reference numerals.

[0066] The fluid processing structure 12 has an internal surface that complements the conical surface of the truncated conical shape. The bottom surface of the fluid processing structure 12 is closer to the opposing surface than the flat bottom surface of the truncated conical shape. The wetting liquid is supplied to the wetting space 11 via openings formed in the surface of the fluid processing structure 12. The wetting liquid can be supplied via a supply opening 34 in the internal surface of the fluid processing structure 12. Alternatively or additionally, the wetting liquid can be supplied via a supply opening 20 in the internal surface of the fluid structure 12. Alternatively or additionally, the wetting liquid can be supplied via a lower supply opening 23. The wetting liquid can be recovered via an extraction component, for example via a recovery opening 21 and / or an overflow recovery component 24 formed in the internal surface and / or one or more openings in the surface of the fluid processing structure 12 as described below.

[0067] The left and right versions of the fluid handling structure 12 in Figure 2C contain the meniscus 33. Due to the fixed position of the recovery opening 32a, the right-hand version of the fluid handling structure 12 in Figure 2C can contain the meniscus 33 in a position substantially fixed relative to the final element 100. The left-hand version of the fluid handling structure 12 in Figure 2C can contain the meniscus 33 below the recovery opening 25, and therefore the meniscus 33 can move along the length and / or width of the recovery opening 25.

[0068] As described above with respect to Figure 2B, the inner periphery of the bottom surface of the fluid processing structure 12 may extend away from the inner surface into the wetting space 11 to form a plate 40, as shown on the left-hand side. As described above, this configuration can create a small aperture and isolate the wetting liquid on either side and / or allow the wetting liquid to flow radially inward toward the aperture, through the inner aperture, and then radially outward toward the surrounding recovery openings 25 below the plate 40. Although this feature is shown on the left-hand side in Figure 2C, other features shown in combination are optional. Preferably, as shown on the left-hand side, the wetting liquid is supplied to the wetting space 11 via supply openings 34 formed in the inner surface of the fluid processing structure 12. The supply openings 34 are positioned toward the bottom of the inner surface, possibly below the bottom surface of the truncated conical shape. The supply openings 34 are positioned around the inner surface and spaced apart around the path of the radiating beam B. Alternatively or additionally, the wetting liquid may be supplied via supply openings 20 in the inner surface of the fluid structure 12. Alternatively or additionally, the wetting liquid may be supplied via the lower supply opening 23. Although supply opening 34 is preferred for liquid supply, any combination of supply opening 34, supply opening 20 and / or lower supply opening 23 may be provided.

[0069] As shown on the left-hand side of Figure 2C, the fluid processing system may include the fluid processing structure 12 as described above and other devices 3000. The fluid processing structure 12 may have extraction components, such as a recovery opening 25, and liquid supply openings, such as a lower supply opening 23. It should be understood that the fluid processing structure 12 may include any configuration in combination with other devices 3000 as shown with respect to the left-hand side of Figure 2A, the right-hand side of Figure 2A, the left-hand side of Figure 2B, the right-hand side of Figure 2B, or (as described below) the right-hand side of Figure 2C.

[0070] The other device 3000 may also be referred to as a droplet trap. The other device 3000 is provided to reduce the presence of liquid on the surface of the substrate W after the fluid processing structure 12 has moved above the surface. The other device 3000 may include a liquid supply component 3010 and at least one extraction component 3020. The at least one extraction component 3020 may be formed to planarly surround the at least one supply component 3010. The at least one liquid supply component 3010 may be configured to provide additional liquid to at least a portion of the space 3110 between the other device 3000 and the surface of the substrate W. The other device 3000 may be configured to recover at least some of the liquid via the at least one extraction component 3020. The other device 3000 can be used to combine any liquid remaining on the surface of the substrate W with the liquid in the space 3110, and then use the other device 3000 to extract the liquid to reduce the amount of liquid remaining on the surface of the substrate W.

[0071] Other device 3000 is shown in FIG. 2C as a device separate from fluid processing structure 12. Other device 3000 may be positioned adjacent to fluid processing structure 12. Alternatively, other device 3000 may be part of fluid processing structure 12, or integrated with fluid processing structure (as is generally shown in FIG. 3d, however, other configurations may be selected).

[0072] Other devices 3000 can be configured to provide liquid to space 3110, which is separate from the liquid provided by liquid handling structure 12.

[0073] Alternatively or concurrently, the fluid processing structure 12 may have the components shown on the right-hand side of FIG2C. More specifically, the fluid processing structure 12 may include at least one liquid supply component, two extraction components (e.g., recovery openings 32a and 32b), and two gas supply components (e.g., gas supply openings 27a and 27b) formed on the surface of the fluid processing structure 12. The gas supply opening 27a may be omitted, i.e., selected as appropriate. At least one liquid supply component may be the same as the lower supply opening 23 in the bottom surface of the fluid processing structure 12 described above, or the same as the supply opening 20 or liquid supply opening 34 formed on the inner surface of the fluid processing structure 12 as described with respect to the left-hand side of FIG2B. The liquid supply component, extraction component, and gas supply component may be formed on the surface of the fluid processing structure 12. Specifically, these components may be formed on the surface of the fluid processing structure 12 facing the substrate W, i.e., on the bottom surface of the fluid processing structure 12.

[0074] At least one of the two extraction components may contain a porous material 37. The porous material 37 may be provided within an opening, such as a recovery opening 32a, through which the fluid processing structure 12 extracts fluid from below, and this opening allows for single-phase flow recovery of the wetting liquid. The other of the two extraction components, such as a recovery opening 32b, may function as a two-phase extractor to recover the wetting fluid. The porous material 37 does not need to be flush with the bottom surface of the fluid processing structure 12.

[0075] Specifically, the fluid processing structure 12 may include a liquid supply component (e.g., a lower supply opening 23), a first extraction component (e.g., a recovery opening 32a) radially outside the liquid supply component, a first gas supply component (e.g., a gas supply opening 27a) radially outside the first extraction component, a second extraction component (e.g., a recovery opening 32b) radially outside the first gas supply component, and a second gas supply component (e.g., a gas supply opening 27b) radially outside the second extraction component. Similar to FIG. 2A, other openings, such as those to the atmosphere, a gas source, or a vacuum, may exist in the bottom surface of the fluid processing structure 12 (relative to the fluid processing structure 12) as previously described.

[0076] For example, at least one additional opening (not shown) may be provided in the bottom surface of the fluid processing structure 12. The additional opening is selected as appropriate. The additional opening may be configured as described above between the first extraction component (e.g., recovery opening 32a) and the first gas supply component (e.g., gas supply opening 27a). Alternatively or additionally, the additional opening may be configured as described above between the second extraction component (e.g., recovery opening 32b) and the second gas supply component (e.g., gas supply opening 27b). The additional opening may be the same as the additional opening 50 described above.

[0077] Depending on the situation, the fluid processing structure 12 includes a notch 29. The notch 29 may be provided between recovery openings 32a and 32b, or between gas supply openings 27a and 32b. The shape of the notch 29 may be uniform around the fluid processing structure 12 and may include a beveled surface, depending on the situation. When the notch 29 is provided between recovery openings 32a and 32b, the gas supply opening 27b may be provided on the beveled surface shown in FIG. 2C. When the notch 29 is provided between supply openings 27a and 32b, the gas supply opening 27b may be provided on the beveled surface of the fluid processing structure 12 or on a portion of the bottom surface, which is parallel to the surface of the substrate W. Alternatively, the shape of the notch 29 may vary around the circumference of the fluid processing structure 12. The shape of the notch 29 may vary to alter the effect of gas supplied from the gas supply component on the fluid below the fluid processing structure 12.

[0078] Figure 2D shows two different versions of the fluid handling structure 12 in its left and right halves. The fluid handling structure 12 in the left half of Figure 2D has a liquid injection buffer 41a that holds a buffer amount of wetting liquid; and a liquid injection orifice 41 that supplies the wetting liquid from the liquid injection buffer to the space 11. The liquid injection orifice 41 extends outward to an internal liquid recovery orifice 43, thereby guiding the liquid to an internal recovery buffer 43a, which has porous components. A notch 29, similar to the notch described with respect to Figure 2C, is provided outside the internal liquid recovery orifice 43. Outside the notch 29, in the lower surface of the fluid handling structure 12, is a gas guiding groove 44 that opens the external recovery orifice 44a. The external recovery orifice 44a guides the two-phase recovery flow to an external recovery buffer 44b, which also has porous components. The outermost part is a gas-sealed orifice 45 that communicates between the gas-sealed buffer volume 45a and the space below the fluid handling structure 12 to provide an airflow containing the wetting liquid.

[0079] The fluid processing structure 12 in the right half of Figure 2D has a liquid supply opening 20 in its inner inclined surface. On the underside of the fluid processing structure 12, there are extraction openings 25 (from the inner side to the outer side), which have porous components 37; a first air knife opening 26a, a second air knife opening 26b, and a third air knife opening 26c. Each of these openings opens into a groove in the underside of the fluid processing structure 12, which provides a buffer volume. The outermost portion of the fluid processing structure 12 is stepped to provide a larger spacing between the fluid processing structure 12 and the substrate W.

[0080] Figures 2A to 2D illustrate examples of different configurations that can be used as parts of a fluid handling system. It should be understood that the examples provided above refer to specific extraction and recovery components, but not necessarily to exact types of extraction and / or recovery components. In some cases, different terms are used to indicate the location of components, but provide the same functional characteristics. Examples of extraction components mentioned above include recovery opening 21, overflow recovery 24, recovery opening 25 (which may include a perforated plate and / or chamber 35), gas recovery opening 28, restraint opening 32, recovery opening 32a, recovery opening 32b, and / or intermediate recovery element 42. Examples of supply components mentioned above include supply opening 20, lower supply opening 23, air knife opening 26, gas supply opening 27a, gas supply opening 27b, and / or supply opening 34. Generally, extraction components used for extracting / recovering fluids, liquids, or gases are interchangeable with at least any of other examples used for extracting / recovering fluids, liquids, or gases, respectively. Similarly, the supply component for supplying fluids, liquids, or gases may be interchangeable with at least any of other examples for supplying fluids, liquids, or gases respectively. The extraction component may extract / recover fluids, liquids, or gases via a space connected to a negative pressure, which extracts the fluid, liquid, or gas into the extraction component. The supply component may supply fluids, liquids, or gases to a space connected to the relevant supply unit.

[0081] As previously described, while the use of wetting fluids / liquids is beneficial for improving the resolution of smaller features on the substrate, there are also problems associated with defects introduced onto the substrate when using wetting fluids / liquids.

[0082] Generally, when using a wetting liquid, droplets of the wetting liquid can remain on the surface of the substrate W. The meniscus 33 at the edge of the wetting liquid can collide with any droplets on the surface of the substrate W. When a droplet hits the meniscus 33, gas can be trapped within the wetting liquid. This results in air bubbles in the wetting liquid. Air bubbles forming in the wetting liquid can lead to defects on the substrate W. Droplets remaining on the surface of the substrate W can cause spots to dry and / or affect the chemical properties of the resist, thus also leading to defects.

[0083] It is well known that droplet incidence increases with the moving speed of the substrate W relative to the fluid handling system. In some cases, droplet formation is absent or negligible at the critical scan rate, while significant droplet formation occurs above the critical scan rate. The critical scan rate relates to the static receding contact angle between the wetting liquid and the resist provided on the substrate W. Increasing the static receding contact angle increases the critical scan rate. Since the critical scan rate can be a limiting factor for the output of lithography equipment, increasing the critical scan rate is desirable. Effects of increasing the critical scan rate include increasing the static receding contact angle by changing the resist formulation or by providing a top coating over the resist.

[0084] Figures 3A to 3C illustrate a portion of the fluid handling system and the substrate W in the lithography apparatus. As shown in Figure 3A, a channel 306 exists between the fluid handling system and the substrate W. The channel 306 may contain an impregnating liquid 309 and / or a gas 310. The portion of the fluid handling system adjacent to the channel 306 may be referred to as the fluid handling structure 307. Figure 3B shows the surface of the fluid handling structure 307 that provides the surface of the channel 306, and this surface may be referred to as the damper surface 308.

[0085] The fluid handling structure 307 includes a first fluid supply component 301. The first fluid supply component 301 includes a first fluid supply conduit 301b and a first fluid supply opening 301a in the damper surface 308. The first fluid supply component 301 may be a lower supply opening 23 as previously described with reference to at least Figures 2A and 2C.

[0086] The fluid processing structure 307 also includes a first fluid extraction component 302. The first fluid extraction component 302 includes a first fluid extraction conduit 302b and a first fluid extraction opening 302a in the damper surface 308. The first fluid extraction component 302 may be a restraining opening 32 or a recovery opening 32a, as previously described with reference to at least Figures 2A and 2C.

[0087] The fluid handling structure 307 may include a second fluid supply component 303. The second fluid supply component 303 includes a second fluid supply conduit 303b and a second fluid supply opening 303a in the damper surface 308. The second fluid supply component 303 may be an air knife opening 26 or a gas supply opening 27a as previously described with reference to at least Figures 2A and 2C.

[0088] The fluid processing structure 307 may include a second fluid extraction component 305. The second fluid extraction component 305 includes a second fluid extraction conduit 305b and a second fluid extraction opening 305a in the damper surface 308. The second fluid extraction component 305 may be a gas recovery opening 28 or a recovery opening 32b, as previously described with reference to at least Figures 2A and 2C.

[0089] Although not shown in Figures 3A to 3C, the fluid handling structure 307 may include any number of other openings. For example, the fluid handling structure 307 may include a third fluid supply component. The third fluid supply component may be located between the second fluid supply component 303 and the second fluid extraction component 305. The third fluid supply component may include a third fluid supply conduit and a third fluid supply opening in the damper surface 308.

[0090] In Figure 3A, the damper surface 308 is substantially flat and substantially parallel to the surface of the substrate W. Alternatively, portions of the damper surface 308 may be tilted or raised to vary the distance between the fluid handling structure 307 and the substrate W.

[0091] Figure 3B shows a schematic plan view of the damper surface 308 of the fluid handling structure 307. A plurality of fluid openings 301a, 302a, 303a, and 305a are disposed in the damper surface 308. The plurality of fluid openings 301a, 302a, 303a, and 305a are disposed in a plurality of different sets of openings.

[0092] Figure 3C shows a schematic plan view of the damper surface 308 of the fluid processing structure 307 and some of the first fluid extraction conduits 302b passing through the fluid processing structure 307. There are separate first fluid extraction conduits 302b for each first fluid extraction opening 302a. Each first fluid extraction conduit 302b extends through the fluid processing structure 307, which has a substantially constant cross-section. Although not all of the fluid openings 301a, 302a, 303a, and 305a in Figure 3C are shown, there are separate fluid conduits 301b, 302b, 303b, and 305b for each fluid opening 301a, 302a, 303a, and 305a, and each fluid conduit 301b, 302b, 303b, and 305b extends through the fluid processing structure 307, which has a substantially constant cross-section.

[0093] As described above, the fluid handling structure 307 can be time-consuming, difficult, and costly to manufacture. Specifically, manufacturing the damper surface 308 and the fluid openings 301a, 302a, 303a, and 305a to the required flatness, roughness levels, and dimensional tolerances can be time-consuming. Repairing or reworking damaged surfaces in the event of collisions or scratches between the fluid handling structure 307 and the substrate W is also costly and time-consuming. In some applications, the damper surface 308 may be coated. Coatings have a limited lifespan due to scratches, aging, and / or contamination, and replacing the coating can be difficult and costly. The lack of availability of lithography equipment during maintenance of the fluid handling structure 307 also increases costs.

[0094] Generally, it is necessary to improve the usability of lithography equipment and reduce the maintenance costs of fluid handling structures.

[0095] Embodiments of the present invention can help improve the usability of lithography equipment and reduce the maintenance costs of fluid handling structures. Various embodiments of fluid handling structures that can be used in all types of positioning immersion lithography equipment are disclosed herein.

[0096] As described in detail below, embodiments provide a fluid handling system having a fluid handling structure comprising one or more replaceable plates. Each plate includes at least some of the fluid openings. The outer surface of each plate provides at least some of the damper surfaces 308. Advantageously, maintenance of the fluid handling structure can be performed simply by removing the plates and attaching new or readjusted plates to the fluid handling structure—a relatively straightforward operation. This reduces the time and cost of maintaining the fluid handling structure and increases the availability of the lithography equipment. Advantages of the embodiments may include greater manufacturability of the fluid handling structure, better protection of the main body of the fluid handling structure, and faster and cheaper production and repair / rework timelines.

[0097] Figures 4A and 4B show portions of the fluid processing structure 403 according to the first embodiment. The fluid processing structure 403 includes a plate support member 403a and a replaceable plate 400. The plate support member 403a is part of the main body of the fluid processing structure 403, and the plate 400 is fixed to the plate support member 403a.

[0098] As previously described, a channel 306 exists between the fluid processing structure 403 and the substrate W. The channel 306 may contain an impregnating liquid 309 and / or a gas 310.

[0099] The fluid handling structure 403 includes a first fluid supply component 401. The first fluid supply component 401 includes a first fluid supply conduit 401b, which is an opening through the main body of the fluid handling structure 403. The first fluid supply component 401 also includes a first fluid supply opening 401a, which is an opening through the plate 400.

[0100] The fluid processing structure 403 includes a first fluid extraction component 402. The first fluid extraction component 402 includes a first fluid extraction conduit 402b, which is an opening through the main body of the fluid processing structure 403. The first fluid extraction component 402 also includes a first fluid extraction opening 402a, which is an opening through the plate 400.

[0101] The fluid processing structure 403 may include a second fluid supply component 303 and a second fluid extraction component 305, as may be described substantially as previously shown in Figures 3A to 3C.

[0102] Plate 400 may have a substantially flat structure. The outer surface 400a of plate 400 (which is the main surface of plate 400) may be the surface of channel 306. The outer surface 400a of plate 400 may provide at least a portion of the damper surface 308 of fluid handling structure 403.

[0103] The plate support member 403a may include a cavity in the body of the fluid handling structure 403 for receiving the plate 400. The plate 400 may be received entirely within the cavity such that the outer surface 400a of the plate 400 is flush with the damper surface 308 not included by the plate 400. Preferably, the plate 400 is received only partially by the cavity such that a portion of the plate 400 protrudes from the damper surface 308 not included by the plate 400. The outer surface 400a of the plate 400 can therefore be closer to the substrate W than the damper surface 308 surrounding the plate 400. For example, the damper surface 308 surrounding the plate 400 may be approximately 10 µm to 200 µm further away from the substrate W than the outer surface 400a of the plate 400. Advantageously, when the width of channel 306 is reduced by plate 400, plate 400 may be the only part of the fluid processing structure 403 that is damaged in the event of a collision with the substrate W or any other surface very close to the fluid processing structure 403. Repairing the fluid processing structure 403 after such a collision may only require replacing plate 400.

[0104] Figure 4B shows a plan view of plate 400 when it is fixed to the fluid handling system. In a configuration similar to that shown in Figures 3A to 3C, a plurality of fluid openings 401a, 402a, 303a, and 305a may be present. The plurality of fluid openings 401a, 402a, 303a, and 305a may be arranged in a plurality of different sets of openings.

[0105] Each group comprising a plurality of fluid openings 401a, 402a, 303a, and 305a may include a fluid opening disposed around the midpoint of the liquid boundary space. The plurality of fluid openings 401a, 402a, 303a, and 305a may be configured in any of a circular, square, rectangular, or star configuration, or any combination thereof. The fluid handling system may have two opposite sides facing the projection lens. The midpoint of the liquid boundary space may be the space directly below the projection lens.

[0106] One of the first group of fluid openings in plate 400 may include a plurality of first fluid supply openings 401a. One of the second group of fluid openings in plate 400 may include a plurality of first fluid extraction openings 402a. Compared with the first group of fluid openings, the second group of fluid openings is configured further away from the beam path of the radiation beam B.

[0107] As shown in Figure 4A (and also described later in Figure 5C), the cross-section of the first fluid supply conduit 401b may have a different size and / or shape compared to the first fluid supply opening 401a. Specifically, the cross-sectional dimension (e.g., width) of the first fluid supply conduit 401b may be substantially larger than the maximum cross-sectional dimension, such as the diameter, of the first fluid supply opening 401a. Furthermore, a single first fluid supply conduit 401b may supply fluid through a plurality of fluid supply openings 401a. The first fluid supply conduit 401b may be in the shape of a slot / slit. For example, it may have a substantially rectangular cross-section in a plane parallel to the damper surface 308. Therefore, any fluid blockage is expected to occur in the first fluid supply opening 401a but not in the first fluid supply conduit 401b.

[0108] Similarly, the cross-section of the first fluid extraction conduit 402b may have a different size and / or shape compared to the first fluid extraction opening 402a. Specifically, the width of the first fluid extraction conduit 402b may be substantially larger than the diameter of the first fluid extraction opening 402a. Furthermore, a single first fluid supply conduit 402b may extract fluid via a plurality of fluid supply openings 402a. The first fluid extraction conduit 402b may be in the shape of a slot / slit. For example, it may have a substantially rectangular cross-section in a plane parallel to the damper surface 308. Therefore, any fluid blockage is expected to occur in the first fluid extraction opening 402a but not in the first fluid extraction conduit 402b.

[0109] As described above, the use of lithography equipment can lead to contaminants and / or damage on the fluid handling structure 403. For example, contaminant particles (such as resist flakes) can block some of the fluid openings 401a, 402a, 303a, and 305a, and the fluid openings 401a, 402a, 303a, and 305a may need to be cleaned. Scratches may also occur on the damper surface 308.

[0110] The maintenance fluid handling structure 403 may include removing plate 400 from the fluid handling structure 403 and replacing plate 400 with a new plate 400. The replacement plate 400 may be a completely new plate 400, or a plate 400 that has been previously used and subsequently appropriately readjusted. The fluid handling structure 403 may be removed from the lithography apparatus so that plate 400 is removed and a new plate 400 is secured to the fluid handling structure 403. Alternatively, the fluid handling structure 403 may remain in the lithography apparatus while plate 400 is being replaced.

[0111] Some of the fluid openings 401a, 402a, 303a, and 305a are more likely to be blocked by contaminants compared to the other openings. Specifically, the fluid openings 401a and 402a in plate 400 (through which the wetting liquid 309 flows) are very likely to be blocked by contaminants. The outer surface 400a of plate 400 may be the surface of fluid handling structure 403 closest to substrate W. The outer surface 400a of plate 400 is therefore more likely to be damaged, such as scratched, compared to any other part of damper surface 308. Therefore, the only part of fluid handling structure 403 that requires maintenance may be in plate 400. Other parts of fluid handling structure 403 may require much less maintenance. Advantageously, maintenance of fluid handling structure 403 may only require replacement of plate 400. Any maintenance required for other parts of fluid handling structure 403 can be performed relatively easily, quickly, and inexpensively. For example, other parts of the fluid handling structure 403 may only require cleaning, and the entire fluid handling structure 403 may not need to be sent away for rework and requalification. The use of the replaceable plate 400 can therefore substantially reduce the time and cost of maintaining the fluid handling structure 403.

[0112] Another advantage of using replaceable plates is that the same fluid handling structure 403 can be used with plates 400 having different configurations of fluid openings. Therefore, the fluid handling structure 403 can be reconfigurable.

[0113] The plate 400 can be secured to the plate support member 403a by any of several techniques. For example, the plate 400 can be secured to the plate support member 403a by one or more of the following: screws, bolts, adhesives, magnetism, capillary force, electrostatic force, or van der Waals force. Specifically, in addition to screws, liquid-impermeable adhesives / gels or other liquid-impermeable substances can be used to ensure that the edges of the plate 400 are liquid-impermeable.

[0114] The technique used to secure the plate 400 to the plate support member 403a should not damage or substantially alter any part of the fluid handling structure 403 when the plate 400 is secured to the plate support member 403a or when the plate 400 is removed from the plate support member 403a. Therefore, techniques such as welding the plate 400 to the plate support member 403a would be unsuitable because the plate would not achieve its intended purpose. Welded plate 400 is difficult to attach and remove, and the removal process could damage both the fluid handling structure 403 and the plate 400.

[0115] The plate 400 is easier to manufacture than the known fluid handling structure 307. For example, it is easier to manufacture small fluid openings in the thin plate 400 than in the fluid handling structure 307.

[0116] Plate 400 may comprise metal, such as steel. Specifically, plate 400 may be a metal foil. Plate 400 may be manufactured using laser ablation, laser cutting, or electron or ion beam processing. Plate 400 may be made from low-cost materials (such as foil) so that discarded plates do not represent a substantial cost. If a glossy metal foil is used as the starting material, surface polishing (such as grinding) may not be necessary. Some manufacturing steps in known techniques for manufacturing fluid handling structures may not be required.

[0117] Sheet 400 may contain plastic materials.

[0118] The thickness of the 400 plate can be between 5 µm and 5 mm, more preferably between 10 µm and 2 mm, and even more preferably between 10 µm and 100 µm.

[0119] The outer surface 400a of plate 400 (which is a portion of damper surface 308) may be coated. For example, the outer surface 400a of plate 400 may be coated with a hydrophobic coating. Alternatively, the outer surface 400a of plate 400 may be coated with a hydrophilic or other type of coating. The advantage of using a replaceable plate 400 is that the coating can be changed by replacing plate 400, such as when the coating needs to be changed at the end of its service life.

[0120] Examples include the use of a plate 400 for a micro sieve.

[0121] Examples include the use of a plate 400 for a porous component.

[0122] Figures 5A, 5B, and 5C illustrate a portion of the fluid processing structure 502 according to the second embodiment. The second embodiment differs from the first embodiment in that the plate 500 only includes a fluid extraction opening.

[0123] In the second embodiment, the fluid processing structure 502 includes a plate support member 502a and a replaceable plate 500. The plate support member 502a is part of the main body of the fluid processing structure 502 and the plate 500 is fixed to the plate support member 502a.

[0124] As previously described, a channel 306 exists between the fluid processing structure 502 and the substrate W. The channel 306 may contain an impregnating liquid 309 and / or a gas 310.

[0125] The fluid processing structure 502 may include a first fluid supply component 301, a second fluid supply component 303, and a second fluid extraction component 305. These may substantially be as described above with reference to Figures 3A to 3C.

[0126] The fluid processing structure 502 also includes a first fluid extraction component 501. The first fluid extraction component 501 includes a first fluid extraction conduit 501b, which is an opening through the main body of the fluid processing structure 502. The first fluid extraction component 501 also includes a first fluid extraction opening 501a, which is an opening through the plate 500.

[0127] As described with respect to the first embodiment, the outer surface 500a of the plate 500 is the surface of the channel 306. The outer surface 500a of the plate 500 may provide at least a portion of the damper surface 308 of the fluid handling structure 502. The plate support member 502a may include a cavity in the body of the fluid handling structure 502 for receiving the plate 500. The plate 500 may be fully received within the cavity such that the outer surface 500a of the plate 500 is flush with the damper surface 308 not included by the plate 500. Preferably, the plate 500 is only partially received by the plate support member 502a such that a portion of the plate 500 protrudes from the damper surface 308 not included by the plate support member 502a. The outer surface 500a of the plate 500 can therefore be closer to the substrate W than the damper surface 308 surrounding the plate 500. Advantageously, when the width of channel 306 is reduced by plate 500, plate 500 can be the only part of the fluid processing structure 502 that is damaged in the event of a collision with the substrate W or any other surface very close to the fluid processing structure 502. Repairing the fluid processing structure 502 after such a collision may only require replacing plate 500.

[0128] Figure 5B shows a plan view of plate 500 when it is fixed to the fluid handling system. In a configuration similar to that shown in Figures 3A, 3B, 3C, 4A, and 4B, a plurality of fluid openings 301a, 501a, 303a, and 305a may exist. The plurality of fluid openings 301a, 501a, 303a, and 305a may be arranged in a plurality of different sets of openings.

[0129] As shown in Figure 5C, the cross-section of the first fluid extraction conduit 501b can have a different size and / or shape compared to the first fluid extraction opening 501a. Specifically, a single first fluid extraction conduit 501b can extract fluid through a plurality of fluid extraction openings 501a. The first fluid extraction conduit 501b can have a substantially rectangular cross-section in a plane parallel to the damper surface 308. Furthermore, the width of the first fluid extraction conduit 501b can be substantially larger than the diameter of the first fluid extraction opening 501a.

[0130] The second embodiment offers advantages similar to the first embodiment. Specifically, maintenance of the fluid handling structure 502 may only require replacing the plate 500. The plate 500 of the second embodiment thus offers the advantage of reduced maintenance time for the fluid handling structure 502. Contaminant blocking openings are mostly located within the liquid extraction openings, and all of these are contained within the plate 500.

[0131] Figure 6 shows the damper surface according to the third embodiment. Although the third embodiment is shown as a technique applied to the first embodiment, the technique of the third embodiment can be applied in conjunction with either the first or second embodiment.

[0132] In the third embodiment, all fluid openings may be configured in the same plate. The plate 400 may be any hollow shape in plan view, such as a hollow square. The plate 400 includes an aperture configured such that when the plate 400 is fixed to the fluid processing structure 403, the beam path of the radiating beam B can pass through the aperture. The fluid openings may extend around the aperture.

[0133] Figure 7 shows the damper surface according to the fourth embodiment. Although the fourth embodiment is shown as a technique applied to the first embodiment, the technique of the fourth embodiment can be applied in conjunction with either the first or second embodiment.

[0134] In the fourth embodiment, there are a plurality of replaceable plates 400. Each plate 400 may be a plate 400 according to the first or second embodiment described above. Therefore, each plate 400 may include a plurality of fluid openings. The outer surface 500a of each plate 400 may be the interface between the fluid handling system and the channel 306, i.e., a portion of the damper surface 308.

[0135] Multiple plates 400 can all be fixed to the same plate support component 403a.

[0136] As shown in Figure 7, a plurality of plates 400 can be configured to surround the beam path of the radiating beam B. Each of the plurality of plates 400 can be placed on an object configured in a hollow shape (such as a hollow square or circular configuration) in a plan view to surround the beam path. Specifically, one or more of the plurality of replaceable plates 400 can be substantially pointed, such as L-shaped or V-shaped. One or more of the plurality of replaceable plates 400 can be C-shaped, crescent-shaped, moon-shaped, or rectangular. Each plate can include corners aligned with the scanning or stepping direction of the lithography device. As shown in Figure 7, four L-shaped plates can provide the four corners of the square configuration of the plates 400.

[0137] Advantageously, by using multiple plates 400, only the plates 400 that need to be replaced can be replaced during maintenance of the fluid handling structure 403.

[0138] The embodiments can be incorporated into any of the fluid handling systems shown in Figures 2A to 2D.

[0139] The embodiments include the presence and use of other features derived from those specifically described above. Specifically, the fluid handling system of the embodiments may include one or more pumps for controlling fluid flow via either the fluid supply or extraction components. One or more pumps for controlling fluid flow may or may additionally be located outside the fluid handling system.

[0140] The embodiments also include several modifications and variations to the techniques described above.

[0141] For example, in a second embodiment of the second embodiment, plate 500 may be configured to include only a fluid supply opening and no fluid extraction opening. The fluid supply opening included by plate 500 may be part of one or more fluid supply components and is similar to the first fluid supply component 401 as described with respect to the first embodiment.

[0142] In a third embodiment of the second embodiment, the fluid processing structure may include one or more plates 500 that only contain fluid extraction openings, as shown in Figures 5A to 5C, and one or more plates 500 that only contain fluid supply openings, as in a second embodiment of the second embodiment. Advantageously, when servicing the fluid processing structure, only the plates 500 that need to be replaced can be replaced.

[0143] The embodiments include the use of one or more plates 400, wherein each plate 400 includes any number of sets of fluid extraction openings and any number of sets of fluid supply openings.

[0144] In the figures, all fluid openings on the surface of each plate and damper are circular. More generally, embodiments include any of the fluid openings having any shape. For example, some of the fluid openings may be square or have an irregular shape.

[0145] The embodiments also include fluid handling structures 307, 403, 502 comprising one or more damper plates (not depicted in the figures). Similar to each plate containing a fluid opening, each damper plate may be disposed on a channel 306 facing the surface of the fluid handling structures 307, 403, 502. One outer surface of each damper plate may provide an interface between the fluid handling system and the channel 306.

[0146] Each outer surface may be a portion of damper surface 308. The damper plate may not contain any fluid openings or connections to any pipes. Each damper plate may comprise metal, rubber, and / or plastic materials. The internal structure of each damper plate may be a substantial honeycomb structure.

[0147] The outer surface of the damper plate can be configured to provide a minimum spacing of channel 306 between the fluid handling structures 307, 403, 502 and the substrate W. The purpose of the damper plate is to provide a first portion of the fluid handling structures 307, 403, 502 to impact the substrate W in the event of a collision, provided that the spacing between the fluid handling structures 307, 403, 502 and the substrate W is reduced to below an acceptable level during use. Any damage caused by the collision may therefore only affect one or more of the damper plates and / or the substrate W, and not the other portions of the fluid handling structures 307, 403, 502.

[0148] In the above embodiments, plates 400 and 500 are shown as providing the upper surface of channel 306. In a typical configuration where the substrate W is horizontally arranged, plates 400 and 500 would provide the upper surface of channel 306. However, the embodiments more generally include plates 400 and 500 providing a surface for a fluid handling system, which is substantially parallel to the surface of the substrate W. The surface of the substrate W is not limited to a horizontal arrangement.

[0149] This invention provides a lithography apparatus. The lithography apparatus may have any or all of the other features or components of a lithography apparatus as described above. For example, the lithography apparatus may include at least one or more of the following: a source SO, an illumination system IL, a projection system PS, a substrate support WT, etc.

[0150] Specifically, the lithography apparatus may include a projection system PS configured to project a radiating beam B toward a surface region of a substrate W. The lithography apparatus may further include a fluid handling system as described in any of the embodiments and variations above.

[0151] The lithography apparatus may include an actuator configured to move a substrate W relative to a fluid handling system. Therefore, the actuator can be used to control the position of the substrate W (or, alternatively, the position of the fluid handling system). The actuator may be or may include: a substrate support (e.g., a substrate stage) WT constructed to hold the substrate W and / or a substrate holder, and / or a second positioner PW configured to accurately position the substrate support WT.

[0152] While references may be specifically made herein to the use of lithography equipment in IC manufacturing, it should be understood that the lithography equipment described herein may have other applications. Possible other applications include the fabrication of integrated optical systems, guiding and detecting patterns for magnetic domain memory, flat panel displays, liquid crystal displays (LCDs), thin-film magnetic heads, and so on.

[0153] Where the context permits, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine-readable medium, which may be read and executed by one or more processors. Machine-readable media may include any means for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, machine-readable media may include: read-only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory; electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.); and others. Furthermore, firmware, software, routines, and instructions may be described herein as performing certain actions. However, it should be understood that such descriptions are merely for convenience, and such actions are in fact caused by a computing device, processor, controller, or other means of executing firmware, software, routines, instructions, etc., and this enables actuators or other devices to interact with the physical world.

[0154] Although embodiments of the invention are specifically referenced herein in the context of lithography equipment, these embodiments can be used in other equipment. Embodiments of the invention can form components of photomask inspection equipment, metrology equipment, or any equipment for measuring or processing objects such as wafers (or other substrates) or photomasks (or other patterning devices). Such equipment may generally be referred to as lithography tools. Such lithography tools can be used under ambient (non-vacuum) conditions.

[0155] Although specific references may have been made above to embodiments of the invention used in the context of optical lithography, it should be understood that the invention is not limited to optical lithography as the context permits.

[0156] The embodiments include the following numbered items: 1. A fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine a wetting liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate via the wetting liquid, the fluid handling system comprising: a replaceable plate having an outer surface including a plurality of fluid openings configured for supplying and / or extracting the wetting liquid and / or gas in a channel between the fluid handling system and the substrate; wherein the outer surface is coated. 2. A fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine an impregnating liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate via the impregnating liquid, the fluid handling system comprising: a plurality of replaceable plates; wherein each plate includes an outer surface having a plurality of fluid openings configured to supply and / or extract impregnating liquid and / or gas in a channel between the fluid handling system and the substrate. 3. The fluid handling system of clause 1 or 2 further includes a plate support member configured such that each plate can be fixed to and removed from the plate support member. 4. The fluid handling system of clause 3, wherein each plate is fixed to the plate support member by one or more of the following: screw, adhesive, magnetism, capillary force or electrostatic force. 5. The fluid handling system of clause 3 or 4, wherein the plate support member includes one or more conduits configured to supply fluid to or extract fluid from the one or more fluid openings of each plate. 6. The fluid handling system of clause 5, wherein one of the conduits of the plate support component is configured to supply fluid to or extract fluid from a plurality of fluid openings of a plate. 7. A fluid handling system as described in clause 5 or 6, wherein each conduit has a substantially rectangular cross-section in a plane perpendicular to the flow path of the fluid passing through one or more of the fluid openings. 8. A fluid handling system as described in any of clauses 3 to 7, wherein the plate support member includes a cavity configured to receive at least a portion of at least one plate. 9. The fluid handling system of paragraph 8, wherein when at least one plate is fixed to the fluid handling system, a portion of the at least one plate protrudes from the cavity to thereby locally reduce the spacing of the channel across the fluid handling system and the substrate. 10. The fluid handling system of any of the preceding clauses, wherein each plate is a substantially flat structure; and the outer surface of each plate is a primary surface of the plate. 11. A fluid handling system as described in any of the preceding clauses, wherein a plurality of fluid openings are configured to extract wetting liquids and / or gases from the channel. 12. A fluid handling system as described in any of the preceding clauses, wherein a plurality of fluid openings are configured to supply wetting liquids and / or gases to the channel. 13. The fluid processing system of any of the preceding clauses, wherein each plate includes: a first set of fluid openings for fluid supply; a second set of fluid openings for fluid extraction; and the second set of fluid openings is configured to be further away from the beam path of the radiation beam than the first set of fluid openings. 14. The fluid handling system of any of the preceding clauses, wherein the fluid openings are disposed around the midpoint of one of the liquid confinement spaces; and the fluid openings are configured as such in a circular, square, rectangular or star configuration or any combination thereof. 15. A fluid handling system as described in any of the preceding clauses, wherein one or more plates comprise metal, such as steel. 16. The fluid handling system of any of the preceding clauses, wherein one or more plates comprise a metal foil. 17. The fluid handling system of any of the preceding clauses, wherein one or more plates comprise a plastic material. 18. A fluid handling system as described in any of the preceding clauses, wherein one or more plates have a thickness between 5 µm and 5 mm, preferably between 10 µm and 100 µm. 19. A fluid handling system as described in clause 2 or any of its dependent clauses, wherein the outer surface of one or more plates is coated. 20. The fluid handling system of any of the preceding clauses, wherein the outer surface of one or more plates is coated with a hydrophobic coating. 21. The fluid handling system of any of the preceding clauses, wherein the outer surface of one or more plates is coated with a hydrophilic coating. 22. The fluid handling system of any of the preceding clauses, wherein one or more plates comprise micro-screens. 23. The fluid handling system of any of the preceding clauses, wherein one or more plates include a porous component. 24. A fluid handling system as described in clause 1 or any of its dependent clauses, wherein the plate includes an aperture configured such that the beam path of the radiating beam passes through the aperture. 25. A fluid handling system as described in clause 1, or any of clauses 3 to 23 when dependent on clause 1, wherein: the fluid handling system comprises a plurality of replaceable plates; all of the plates comprise an outer surface comprising a plurality of fluid openings; and each outer surface is an interface between the fluid handling system and the channel. 26. A fluid handling system as described in Clause 2, Clause 25, or any of the preceding clauses that depend on Clause 2, wherein a plurality of plates may be attached to the same plate support member. 27. A fluid handling system, such as clause 2, clause 25, clause 26, or any of the preceding clauses of clause 2, wherein one or more of the plurality of plates are substantially pointed, such as L-shaped or V-shaped. 28. The fluid handling system of clause 27, wherein each plate includes a corner configured to align with the scanning or stepping direction of one of the lithography devices. 29. A fluid handling system, such as clause 2, any of clauses 25 to 28, or dependent on any of the preceding clauses of clause 2, wherein the plurality of plates are configured to surround the beam path of the radiating beam. 30. The fluid handling system of clause 29, wherein the plurality of plates are configured in a substantially square configuration to surround the beam path. 31. The fluid handling system of any of the preceding clauses, further comprising one or more damper plates; wherein one outer surface of each damper plate provides an interface between the fluid handling system and the channel; and one surface of a damper plate provides a minimum spacing across the channel between the fluid handling system and the substrate. 32. The fluid handling system of clause 31, wherein each damper plate comprises a metal, rubber and / or a plastic material. 33. A fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine a wetting liquid into a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate via the wetting liquid, the fluid handling system comprising: a replaceable plate for supplying and / or extracting the wetting liquid and / or gas in a channel between the fluid handling system and the substrate; wherein the plate includes a porous component. 34. A fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine a wetting liquid to a liquid confinement space between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiant beam projected from the projection system to irradiate the surface of the substrate via the wetting liquid, the fluid handling system comprising: one or more damping plates; wherein an outer surface of each damping plate provides an interface between the fluid handling system and a channel between the fluid handling system and the substrate; and a surface of one damping plate provides a minimum spacing across the channel between the fluid handling system and the substrate. 35. A lithography apparatus comprising a fluid handling system as described in any of the preceding clauses. 36. The apparatus of clause 34 further includes a positioning system configured to move a substrate holder relative to the projection system on a plane substantially parallel to the surface of the substrate, the substrate holder being configured to support the substrate.

[0157] While specific embodiments of the invention have been described above, it will be understood that the invention may be practiced in other ways different from those described. The description above is intended to be illustrative and not restrictive. Thus, it will be apparent to those skilled in the art that modifications can be made to the described invention without departing from the scope of the claims set forth below.

[0158] 11: Immersive Space 12: Fluid processing structure 12a: Internal part 12b: External part 20: Supply Opening 21: Recycling opening 23: Supply opening below 24: Overflow recovery parts 25: Recycling opening 26: Air knife opening 26a: First air knife opening 26b: Second air knife opening 26c: Third air knife opening 27a: Gas supply opening 27b: Gas supply opening 28: Gas recovery opening 29: Notch 30: Coating 32: Restricting the opening 32a: Recycling opening 32b: Recycling opening 33: Meniscus 34: Supply Opening 35: Chamber 36: Separation Channel 37: Porous materials 38: Separation Channel 39: Internal and surrounding areas 40: board 41a: Liquid Injection Buffer 42: Intermediate Recycling Components 43: Internal liquid recovery orifice diameter 43a: Internal Recycling Buffer 44: Gas guiding trench 44a: External recycling port 45: Gas sealing hole 45a: Gas-tight buffer volume 50: Other openings 60: Spring 100: Final Component 301: First fluid supply component 301a: First fluid supply opening / fluid opening 301b: First fluid supply pipeline 302: First fluid extraction component 302a: First fluid extraction opening / fluid opening 302b: First fluid extraction pipeline 303: Second fluid supply component 303a: Second fluid supply opening / fluid opening 303b: Second fluid supply pipeline 305: Second fluid extraction component 305a: Second fluid extraction opening / fluid opening 305b: Second fluid extraction pipeline 306: Channel 307: Fluid Processing Structure 308: Damper surface 309: Wetting liquid 310: Gas 400: Replaceable board 400a: Outer surface 401: First fluid supply component 401a: First fluid supply opening 401b: First fluid supply pipeline 402: First fluid extraction component 402a: First fluid extraction opening 402b: First fluid extraction pipeline 403: Fluid Processing Structure 403a: Plate support components 500: Controller / Board 500a: Outer surface 501: First fluid extraction component 501a: First fluid extraction opening / fluid opening 501b: First fluid extraction pipeline 502: Fluid handling structure 502a: Plate support component 3000: Other devices 3010: Liquid supply components 3020: Extraction Component 3110: Space B: Radiation beam BD: Beam Delivery System C: Target Section IL: Lighting System M1: Photomask alignment mark M2: Photomask alignment mark MA: Patterning device MT: Photomask support P1: Substrate alignment mark P2: Substrate alignment mark PM: First Positioner PS: Projection system PW: Second Positioner SO: Radiation source W: substrate WT: Substrate support

Claims

1. A fluid handling system for a lithography apparatus, wherein the fluid handling system is configured to confine a wetting liquid to a liquid confinement space, the liquid confinement space being located between a portion of a projection system in the lithography apparatus and a surface of a substrate, thereby allowing a radiation beam projected from the projection system to irradiate the surface of the substrate via the wetting liquid, the fluid handling system comprising: a replaceable plate having a coated outer surface including a plurality of fluid openings configured to supply and / or extract wetting liquid and / or gas in a channel between the fluid handling system and the substrate; or a plurality of replaceable plates, each plate including an outer surface including a plurality of fluid openings configured to supply and / or extract wetting liquid and / or gas in a channel between the fluid handling system and the substrate; wherein the fluid handling system further comprises: A plate support member configured such that at least one plate can be fixed to and removed from the plate support member; wherein the plate support member includes an internal cavity configured to receive at least a portion of the at least one plate; and wherein when the at least one plate is fixed to the fluid processing system, a portion of the at least one plate protrudes from the cavity to locally reduce the spacing of the channel across the fluid processing system and the substrate; a first set of fluid openings for fluid supply; and a second set of fluid openings for fluid extraction, wherein the first set of fluid openings and the second set of fluid openings face the surface of the substrate.

2. The fluid handling system of claim 1, wherein the plate support member includes one or more pipes configured to supply fluid to or extract fluid from one or more fluid openings of each plate.

3. The fluid handling system of claim 1, wherein a conduit of the plate support member is configured to supply fluid to or extract fluid from a plurality of fluid openings of a plate, and wherein each plate is secured to the plate support member by one or more of the following: screws, an adhesive, magnetism, capillary force or electrostatic force, and wherein each conduit has a substantially rectangular cross-section in a plane perpendicular to the flow path of the fluid passing through one or more of the fluid openings.

4. The fluid handling system of claim 1, wherein each plate is a substantially flat structure; the outer surface of each plate is a main surface of the plate, and wherein each plate includes: the first set of fluid openings, which are fluid supply openings; the second set of fluid openings, which are fluid extraction openings; and the second set of fluid openings is configured to be further away from the beam path of the radiating beam than the first set of fluid openings.

5. A fluid handling system as claimed in any of claims 1 to 4, wherein a plurality of fluid openings are configured to draw wetting liquid and / or gas from the channel, and wherein a plurality of fluid openings are configured to supply wetting liquid and / or gas to the channel, and wherein the fluid openings are disposed around a midpoint of one of the liquid confinement spaces; and wherein the fluid openings are configured as any of a circular, square, rectangular or star configuration or any combination thereof.

6. A fluid handling system as claimed in any one of claims 1 to 4, wherein the replaceable plate or one or more of the replaceable plates comprises a metal and / or a plastic material, and wherein the replaceable plate or one or more of the replaceable plates has a thickness between 5 µm and 5 mm, preferably between 10 µm and 100 µm.

7. A fluid handling system as claimed in any of claims 1 to 4, wherein the outer surface of the replaceable plate or one or more of the plurality of replaceable plates is coated, and wherein the plurality of plates can be attached to the same plate support member, and wherein one or more of the plurality of plates is substantially pointed, such as L-shaped or V-shaped, and wherein the plurality of plates is configured to surround the beam path of the radiating beam.

8. A fluid handling system as claimed in any of claims 1 to 4, wherein the outer surface of the replaceable plate or one or more of the plurality of replaceable plates is coated with a hydrophobic coating or a hydrophilic coating, and / or wherein the replaceable plate or one or more of the plurality of replaceable plates includes a micro-sieve or a porous component.

9. A fluid handling system as claimed in any of claims 1 to 4, wherein at least one of the plurality of replaceable plates includes an aperture configured such that the beam path of the radiating beam passes through the aperture, and wherein: all of the plates include an outer surface having a plurality of fluid openings; and each outer surface is an interface between the fluid handling system and the channel.

10. The fluid handling system of claim 7, wherein each plate includes a corner configured to be aligned with one of the scanning or stepping directions of the lithography device, and wherein the plurality of plates are configured in a substantially square configuration to surround the beam path.

11. The fluid handling system of any one of claims 1 to 4, further comprising one or more damper plates; wherein one outer surface of each damper plate provides an interface between the fluid handling system and the channel; and one surface of a damper plate provides a minimum spacing between the channel across the fluid handling system and the substrate.

12. The fluid handling system of claim 11, wherein each damper plate comprises metal, rubber and / or a plastic material.

13. A lithography apparatus comprising a fluid handling system as claimed in any one of claims 1 to 12.

Images