Lifting head and lifting device

Abstract

This invention provides a lifting head and lifting device capable of easily maintaining the position of the ejector pin in a detachable state for positioning the lifting device. Specifically, the lifting head of this invention comprises: a base member 2 having an adsorption surface 2a; a pin groove shaft 4 supported by the base member 2 and having a lifting shaft flow path 4a; a contact member 5 fixed to one end of the pin groove shaft 4 and in contact with the lifting drive mechanism 11 of the lifting device 10; an ejector pin support member 7 fixed to the pin groove shaft 4 and supporting the ejector pin 8; and an ejector pin cap 9 having a platform 9a at one end and fixed to the base member. The adsorption surface 2a of the base member 2 is adsorbed by the attraction force of the first negative pressure path 16e of the mounting member 16. When the contact member 5 contacts the lifting drive mechanism 11, the ejector pin cap 9 is attracted internally by the attraction force of the second negative pressure path 14b of the lifting drive mechanism 11 via the lifting shaft flow path 4a.

Description

Technical Field

[0001] The present invention relates to a lifting head for lifting at least one of a plurality of chips cut into predetermined shapes on a holding sheet and a lifting device for the lifting head. Prior Art

[0002] During the process of dividing a semiconductor wafer into predetermined shapes to form semiconductor chips, the semiconductor wafer is divided into semiconductor chips of predetermined shapes while being adhered to a retaining sheet. The divided semiconductor chips must be separated individually from the retaining sheet for processing such as a wiring board. At this point, a lifting head is known that lifts and separates the semiconductor chip to be separated from the retaining sheet. While the retaining sheet to which the semiconductor chip is attached is held by suction, the lifting head lifts the predetermined semiconductor chip using pins corresponding to the size of the semiconductor chip. This allows the lifting head to move only the predetermined semiconductor chip, which is seamlessly surrounded by other semiconductor chips, in the lifting direction.

[0003] Such a lift head must change the position of the ejector pins that lift the semiconductor wafer for each type of semiconductor wafer. Therefore, in order to cope with the change in the type of semiconductor wafer, the lift head is constructed so that the position of the ejector pins can be changed by removing the ejector pin cap having a carrier that adsorbs and holds the holding sheet. Moreover, semiconductor wafers are produced in small quantities and in a variety of types to cope with the diversification of electronic equipment. Therefore, the lift head must change the position of the ejector pins in accordance with the change in the type of semiconductor wafer. In order to quickly cope with such frequent changes in types, it is known in the industry to have a lift head that can be detached from a semiconductor manufacturing device by combining the ejector pin cap and an ejector pin holding member that holds the ejector pin and can be raised and lowered as a single unit. For example, Patent Document 1.

[0004] The ejection head described in Patent Document 1 comprises an adapter connected to the housing of semiconductor manufacturing equipment; an ejection shaft held axially movable by the adapter; a support member connected to the ejection shaft; an ejection pin supported by the support member; and a dome covering the support member and the ejection pin. The ejection head is replaceable as a single unit that secures the dome to the adapter that positions the ejection pin. While held in the housing, the ejection head suctions the interior of the dome through a vacuum port within the adapter. [Prior Art Literature] [Patent Document]

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-172122 Summary of the Invention

[0006] [Problems to be solved by the invention]

[0007] The lifting head disclosed in the patent document is engaged within the housing via a replacement arm included in the semiconductor manufacturing apparatus. The lifting head is connected to the housing by engaging a protrusion on the housing with a recessed portion of the lifting head. Therefore, the lifting head experiences a looseness relative to the housing due to the gap between the protrusion and recessed portion. Furthermore, to allow the lifting head to be removed from the housing via the replacement arm, the opening of the vacuum port overlaps and communicates with the opening of the vacuum port on the housing side. Consequently, the lifting head may be slightly moved within the housing due to air leaking from the overlapping vacuum ports due to fluctuations in negative pressure within the dome.

[0008] An object of the present invention is to provide a jacking head and a jacking device that can easily maintain the position of an jacking pin for positioning a jacking device in a detachable state. [Technical means to solve the problem]

[0009] The inventors have investigated a structure for a wafer lift device included in semiconductor manufacturing equipment, which uses ejector pins to lift at least one of multiple wafers attached to a holding sheet, and a lift head for the lift head. The structure aims to easily maintain the position of the ejector pins, which allows the lift device to be removably positioned. As a result of these in-depth investigations, the inventors have arrived at the following structure.

[0010] A lifting head according to one embodiment of the present invention is a lifting head that lifts at least one of a plurality of wafers attached to a holding sheet using a lifting pin in a lifting device included in a semiconductor manufacturing apparatus. The aforementioned jacking head comprises: a base member, which is configured to be detachable from the mounting member of the aforementioned jacking device and has an adsorption surface adsorbed on the aforementioned mounting member; a lifting shaft, which is supported by the aforementioned base member in a state that it can move in the axial direction and cannot rotate around the axis, and has a lifting shaft flow path connected from one end to the other end in the axial direction; a contact member, which is fixed to one end of the aforementioned lifting shaft in a state in which the aforementioned lifting shaft flow path is connected to the outside, and contacts the pushing member of the lifting drive mechanism of the aforementioned jacking device in the lifting direction; an ejector pin supporting member, which is fixed to the other end of the aforementioned lifting shaft in a state in which the aforementioned lifting shaft flow path is connected to the outside, and supports the aforementioned ejector pin in a detachable manner in the aforementioned axial direction; and an ejector pin cap, which is a cylindrical member having a carrier at one end for carrying the aforementioned holding sheet and provided with a through hole for inserting the aforementioned ejector pin, and is fixed to the aforementioned base member at the other end in a state in which the aforementioned insertion hole and the aforementioned ejector pin overlap when viewed in the aforementioned axial direction, with the aforementioned ejector pin supporting member and the aforementioned ejector pin located inside.

[0011] When the base member is positioned on the mounting member, the suction surface is attracted by the suction force of the first negative pressure path of the mounting member. When the contact member contacts the lift drive mechanism, the interior of the ejector cap is sucked through the lift shaft flow path by the suction force of the second negative pressure path of the lift drive mechanism.

[0012] In the above-described structure, the ejector head is constructed as a single unit consisting of a lifting shaft, an ejector support member fixed to the lifting shaft, an ejector supported by the ejector support member, and an ejector cap having a carrier and supported by a base member. Furthermore, the ejector head does not move relative to the mounting member because the base member is attracted to the mounting member by the suction force of the first negative pressure path possessed by the mounting member of the ejector device. Furthermore, the interior of the ejector cap of the ejector head is attracted by the suction force of the second negative pressure path possessed by the lifting drive mechanism of the ejector device. In other words, the ejector head is constructed so as to attract the base member and attract the interior of the ejector cap by the suction forces of two different negative pressure paths. Therefore, fluctuations in the negative pressure within the ejector cap of the ejector head do not affect the adsorption state of the base member. This makes it possible to easily maintain the position of the ejector, which is positioned in a detachable state relative to the ejector device.

[0013] According to another aspect, the lifting head of the present invention preferably includes the following configuration: A cylindrical elastic suction member connected to the lifting shaft fluid path is fixed to the lifting shaft or the contact member. The elastic suction member communicates with the second negative pressure path when the contact member contacts the lifting member of the lifting drive mechanism.

[0014] In the above-mentioned structure, when the base member is mounted on the mounting member of the lift device, the lift head connects the second negative pressure path of the lift drive mechanism to the lift shaft flow path of the lift shaft via the elastic suction member. Since the elastic suction member is made of an elastic body such as rubber, the lift drive mechanism is adsorbed by the suction force of the second negative pressure path. That is, the elastic suction member can prevent leakage from the connection portion between the second negative pressure path and the lift shaft flow path of the lift shaft. On the other hand, the elastic suction member does not adsorb the lift drive mechanism by setting the pressure in the second negative pressure path to positive pressure. This makes it easy to maintain the position of the ejector pin positioned relative to the lift device in a detachable state.

[0015] According to another aspect, the lifting head of the present invention preferably includes the following structure: The lifting head has a pressing elastic member that presses the contact member toward the lifting member of the lifting drive mechanism. The contact member is pressed against the lifting member of the lifting drive mechanism by the elastic member.

[0016] In the above-described structure, the force exerted by the pressing elastic member, including a spring, on the lifting drive mechanism constantly acts on the contact member of the ejector head. Therefore, even when the lifting drive mechanism raises or lowers the contact member, the contact member does not separate from the lifting member of the lifting drive mechanism. In other words, the ejector head can prevent leakage from the connection between the second negative pressure path and the lifting shaft flow path of the lifting shaft. Furthermore, the pressing elastic member applies a force to the base member of the ejector head in a direction away from the mounting member of the ejector device. This facilitates maintaining the position of the ejector pin, which is positioned in a detachable state relative to the ejector device.

[0017] According to another aspect, the jacking head of the present invention preferably includes the following structure: The base member has an arm engaging portion for engaging with the replacement arm of the jacking device.

[0018] In the above-described configuration, the ejection head is transported while the replacement arm of the ejection device is engaged with the arm engagement portion. Therefore, the ejection head does not move relative to the replacement arm during transport. This facilitates maintaining the position of the ejector pin, which is positioned relative to the ejection device in a detachable state.

[0019] A jacking device according to one embodiment of the present invention is a jacking device for the jacking head described above. The jacking device comprises: a mounting member for detachably mounting the jacking head; a lifting drive mechanism for lifting and lowering the contact member of the jacking head; and a jacking head replacement mechanism for detaching the jacking head from the mounting member.

[0020] The mounting member includes a first negative pressure path that is attracted by a vacuum source. When the base member of the ejection head is mounted on the mounting member, the first negative pressure path attracts the suction surface of the base member. The lifting drive mechanism includes a lifting member that lifts the contact member of the ejection head, and a second negative pressure path that is attracted by a vacuum source. When the contact member of the ejection head contacts the lifting member, the lifting drive mechanism uses the suction of the second negative pressure path to attract the inside of the ejection head's pin cap via the lifting shaft flow path of the ejection head.

[0021] In the above-described configuration, the ejection device uses the suction force of the first negative pressure path of the mounting member to attract the suction surface of the base member in the ejection head. Furthermore, the ejection device uses the second negative pressure path of the lift drive mechanism to attract the interior of the ejector cap in the ejection head. Therefore, since the ejection device attracts the base member and attracts the interior of the ejection head through separate paths, neither is affected by fluctuations in negative pressure. This facilitates maintaining the position of the ejector pins, which are positioned in a detachable state relative to the ejection device.

[0022] According to another aspect, the lift device of the present invention preferably includes the following configuration: The lift drive mechanism secures a cylindrical elastic suction member, which communicates with the second negative pressure path, to the opening of the second negative pressure path. When the contact member of the lift head contacts the push member, the elastic suction member communicates with the lift shaft flow path of the lift head.

[0023] In the above-mentioned structure, when the base member of the ejection head is mounted on the mounting member, the ejection device connects the second negative pressure path of the lifting drive mechanism with the lifting shaft flow path of the lifting shaft in the ejection head via the suction elastic member. Since the suction elastic member is made of an elastic body such as rubber, it is in close contact with the lifting shaft or contact member in the ejection head by the suction force in the second negative pressure path. That is, the suction elastic member can prevent leakage from the connection portion between the second negative pressure path and the lifting shaft flow path of the lifting shaft. On the other hand, the suction elastic member does not come into close contact with the ejection head by setting the pressure in the second negative pressure path to positive pressure. At this time, the ejection device causes the aforementioned pushing member, which is a rigid body, to contact and lift the contact member of the ejection head, rather than lifting and lowering the ejection head via the suction elastic member. Therefore, the ejection device can ensure the reproducibility of the ejection pin's rising position. Thereby, the position of the ejector pin positioned with respect to the ejection device can be easily maintained in a detachable state.

[0024] According to another aspect, the jacking device of the present invention preferably includes the following configuration: the jacking head replacement mechanism includes a plurality of replacement arms, each of the plurality of replacement arms holding the jacking heads. The selected jacking head is mounted on the mounting member by the replacement arm holding the selected jacking head, and the jacking head mounted on the mounting member is removed by the corresponding replacement arm.

[0025] In the above-described configuration, the multiple replacement arms of the lifter's lifter head replacement mechanism hold lifter heads corresponding to different wafer types. By adjusting the pressures of the first and second negative pressure paths, the lifter device can automatically attach or detach any of the lifter heads held by the multiple replacement arms to the mounting member. This facilitates maintaining the position of the lifter pins, which are positioned in a removable state, within the lifter device.

[0026] The technical terms used in this specification are used only for the purpose of defining specific embodiments, and are not intended to limit the invention by the above technical terms.

[0027] In this specification, the use of "including", "comprising", or "having" and variations thereof specifies the presence of the described features, steps, elements, components, and / or their equivalents, but may include one or more of the steps, actions, elements, components, and / or groups thereof.

[0028] Throughout this specification, the terms "mounted," "connected," "coupled," and / or their equivalents are used broadly to encompass both "direct and indirect" mounting, connection, and coupling. Furthermore, "connected" and "coupled" are not limited to physical or mechanical connections or couplings but may include direct or indirect electrical connections or couplings.

[0029] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meanings as those generally understood by those skilled in the art in the technical field to which the present invention belongs.

[0030] [Semiconductor chip] In this specification, a semiconductor wafer refers to a single cube-shaped slice obtained by slicing a disc-shaped semiconductor wafer with a sintered circuit pattern. The sliced ​​semiconductor wafers are transported while attached to a holding sheet. Multiple semiconductor wafers are placed without gaps between them.

[0031] [Holding sheet] In this specification, a retaining sheet refers to a sheet used to stably transport diced semiconductor wafers. The retaining sheet is made of a resin film. One side of the retaining sheet is coated with an adhesive. The retaining sheet allows multiple semiconductor wafers to be releasably bonded to the adhesive-coated surface. [Effects of the Invention]

[0032] According to an embodiment of the present invention, the ejection head and the ejection device can easily maintain the position of the ejector pin for positioning the ejection device in a detachable state. Simple diagram description

[0033] FIG1 is a perspective view of a lifting head according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the jacking head and the jacking device according to the embodiment of the present invention, as viewed from a direction perpendicular to the lifting direction. 3 is a cross-sectional view of the jacking head and the jacking device viewed from a direction perpendicular to the lifting direction of the jacking head in a state where the jack of the jacking head is in a lowered position according to an embodiment of the present invention. 4 is a cross-sectional view of the jacking head and the jacking device viewed from a direction perpendicular to the lifting direction of the jacking head in a state where the jack of the jacking head is in a raised position according to an embodiment of the present invention. FIG5 is a top view showing a state in which the jacking device according to the embodiment of the present invention is held by a plurality of jacking head replacement mechanisms. FIG6 is a side view showing a state in which the jacking head of the jacking device according to the embodiment of the present invention is installed on the mounting member. Implementation Method

[0034] The following describes an exemplary embodiment of the present invention in detail with reference to the drawings. Identical or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, the dimensions of the components in the drawings do not necessarily accurately represent the actual dimensions of the components or the dimensional ratios of the components. In the following description of the ejector head 1 of the exemplary embodiment of the present invention, the direction parallel to the axis of the lift shaft is referred to as the "lifting direction," the "up-down direction," or the "Z direction," the two directions perpendicular to the axis of the lift shaft and mutually perpendicular to each other are referred to as the "X direction" and the "Y direction," and the direction of rotation about the axis of the lift shaft is referred to as the "circumferential direction." However, these definitions of directions are not intended to limit the orientation of the ejector head 1 during use.

[0035] (Top head 1) 1 and 2 , a lift head 1 for lifting at least one semiconductor wafer C (see FIG3 ) will be described. FIG1 is a perspective view of the lift head 1. FIG2 is a cross-sectional view viewed from a direction perpendicular to the lifting direction of the lift head 1 and the lift device 10.

[0036] As shown in Figures 1 and 2, a lift head 1 is a fixture that lifts any semiconductor wafer C from a plurality of semiconductor wafers C attached to a holding sheet S (see Figure 3). The lift head 1 is detachably mounted on a lift device 10 (see Figure 2). The lift head 1 comprises a base member 2, a keyway nut 3, a keyway shaft 4, a contact member 5, a compression spring 6, an ejector pin support member 7, an ejector pin 8, and an ejector pin cap 9.

[0037] As shown in Figure 2, the base member 2 is a member that fits into the mounting member 16 of the lift device 10. The base member 2 is a hollow cylindrical member. One end surface of the base member 2 forms an adsorption surface 2a that is adsorbed onto the mounting member 16 of the lift device 10. Furthermore, one end surface of the base member 2 includes a cylindrical base member engagement portion 2b that protrudes axially. The base member engagement portion 2b is configured to be removable from the base member engagement hole 16c of the mounting member 16. The base member 2 is positioned relative to the mounting member 16 in the X and Y directions by the base member engagement portion 2b engaging with the base member engagement hole 16c. Furthermore, one end surface of the base member 2 includes a radially extending base member positioning pin groove 2c. The base member positioning pin groove 2c is configured to allow for the removable insertion of the base member positioning pin 16d of the mounting member 16. The position of the base member 2 relative to the mounting member 16 in the circumferential direction is determined by the base member positioning pin groove 2c in which the base member positioning pin 16d is fitted.

[0038] The other end surface of the base member 2 constitutes a mounting surface 2d for fixing the ejector cap 9. Furthermore, the other end surface of the base member 2 has a circular ejector cap engaging portion 2e protruding in the axial direction. The ejector cap engaging portion 2e is configured to allow the ejector cap 9 to be attached and detached. The center of the ejector cap engaging portion 2e overlaps with the center of the base member engaging portion 2b when viewed in the axial direction. That is, the ejector cap engaging portion 2e is configured to be concentric with the base member engaging portion 2b when viewed in the axial direction. The base member 2 determines the position of the ejector cap 9 in the X and Y directions relative to the base member 2 by engaging the ejector cap engaging portion 2e with the ejector cap 9. Furthermore, the mounting surface 2d of the base member 2 has an ejector cap positioning pin 2f. The ejector cap positioning pin 2f is configured to be detachable from the ejector cap positioning pin groove 9d of the ejector cap 9. The circumferential position of the ejector cap 9 relative to the base member 2 is determined by the ejector cap positioning pin 2f engaged in the ejector cap positioning pin groove 9d.

[0039] The base member 2 has an arm engaging portion 2g with which the replacement arm 18 of the lift device 10 engages. The arm engaging portion 2g is a portion with which the replacement arm 18 of the lift device 10 engages. The arm engaging portion 2g is formed by radially recessing a portion of the outer peripheral surface of the base member 2 across the axis of the base member 2. The upper side surface of the arm engaging portion 2g, i.e., the side surface on the ejector cap 9 side, constitutes a replacement arm contact surface 2h with which the upper surface of the replacement arm 18 contacts. The base member 2 is retained by the replacement arm 18 by the upper surface of the replacement arm 18 contacting the replacement arm contact surface 2h from below. The arm engaging portion 2g also has a pair of protrusions 2i at positions across the axis. The pair of protrusions 2i is configured to engage with the replacement arm 18. The base member 2 is configured to be retained by the replacement arm 18 while the movement of the replacement arm 18 in the X and Y directions is regulated by the replacement arm contact surface 2h and the protrusions 2i.

[0040] The bolt nut 3 supports the bolt shaft 4, a lifting shaft, in an axial direction but not axially. The bolt nut 3 supports the bolt shaft 4 via a rotating member (not shown). The bolt nut 3 is fixed to the interior of the base member 2 so that the axis of the supported bolt shaft 4 aligns with the axis of the base member 2. Specifically, the bolt shaft 4 is supported by the base member 2 at the center of the base member 2, allowing it to be raised and lowered in the axial direction but not rotatable about the axis. The bolt shaft 4 is a hollow shaft with an axially extending lifting shaft channel 4a extending from one end to the other.

[0041] The contact member 5 is a member that contacts the lift drive mechanism 11 in the lift device 10. The contact member 5 is a disc-shaped member with an outer diameter larger than that of the bolt slot shaft 4. The contact member 5 is fixed to one end of the bolt slot shaft 4 on the lift device 10 side. Furthermore, the contact member 5 is located on the lift device 10 side of the base member 2. The bolt slot shaft 4 passes through the contact member 5. In other words, the contact member 5 does not block the lift shaft flow path 4a of the bolt slot shaft 4. The end surface of the contact member 5 is configured to contact the push member 14 of the lift drive mechanism 11.

[0042] The pressing elastic member, compression spring 6, is an elastic member that presses the contact member 5 against the lifting member 14 of the lift drive mechanism 11. Compression spring 6 is located between the base member 2 and the contact member 5. One end of compression spring 6 contacts the contact member 5. The other end of compression spring 6 contacts the base member 2. When the distance between the base member 2 and the contact member 5 is narrower than the natural length of spring 6, compression spring 6 applies a force to the base member 2, pressing the contact member 5 toward the lift drive mechanism 11 of the lift device 10.

[0043] Ejector support member 7 supports ejector pin 8 in a specified configuration. It is a cylindrical member with an outer diameter larger than that of the bolt slot shaft 4 and smaller than the inner diameter of the ejector cap 9. Ejector support member 7 is fixed to the bolt slot shaft 4 at its other end, on the side of the ejector cap 9. One end of the ejector support member 7 allows the other end of the bolt slot shaft 4 to be inserted into it. Ejector support member 7 includes an ejector support member flow path 7a that connects the lift shaft flow path 4a with the outside. This flow path 7a extends radially along the ejector support member 7, connecting the lift shaft flow path 4a with the outside.

[0044] The ejector support member 7 has a plurality of ejector retaining holes 7b at its other end for retaining the ejector pin 8. The plurality of ejector retaining holes 7b extend along the axis of the bolt slot shaft 4. The plurality of ejector retaining holes 7b are configured to allow the base end of the ejector pin 8 to be inserted axially. Furthermore, the plurality of ejector retaining holes 7b are configured to allow the base end of the ejector pin 8 to be removably inserted. Thus, the ejector support member 7 can retain the ejector pin 8 via the ejector retaining holes 7b, with the axis of the ejector pin 8 aligned with the axis of the bolt slot shaft 4.

[0045] Ejector pins 8 are rod-shaped members that lift and hold specific semiconductor wafers C from among the plurality of semiconductor wafers C on the sheet S. Ejector pins 8 are configured so that the projected area of ​​their tip ends, as viewed in the axial direction, is smaller than the cross-sectional area of ​​the semiconductor wafer C being lifted. Furthermore, their base ends are configured so that they can be axially removable from the plurality of ejector pin holding holes 7b of the ejector pin support member 7. Ejector pins 8 are positioned on the ejector pin support member 7 at positions corresponding to the positions of the semiconductor wafers C being lifted.

[0046] Ejector cap 9 is a cylindrical member that covers ejector support member 7 and ejector pins 8 and forms a stage 9a for placing semiconductor wafer C. Ejector cap 9 is a cylindrical member with stage 9a for placing semiconductor wafer C at one end and an open end at the other end. Stage 9a is a plane perpendicular to the axis of ejector cap 9. Stage 9a has a plurality of stage through-holes 9b that attract a holding sheet S to which semiconductor wafer C is attached or through which ejector pins 8 are inserted. Ejector cap 9 has a radially extending annular fixing flange 9c at the other end. Fixing flange 9c has a groove 9d for ejector cap positioning pins. Furthermore, the inner diameter of fixing flange 9c is configured to fit into the ejector cap fitting portion 2e of base member 2.

[0047] The fixing flange 9c of the ejector cap 9 is fixed to the mounting surface 2d of the base member 2. At this point, the annular fixing flange 9c of the ejector cap 9 engages with the ejector cap engaging portion 2e of the base member 2. The fitting of the fixing flange 9c with the ejector cap engaging portion 2e determines the position of the ejector cap 9 in the X and Y directions relative to the base member 2. Furthermore, the ejector cap 9 engages with the ejector cap positioning pin 2f of the base member 2 at the ejector cap positioning pin groove 9d. The fitting of the ejector cap positioning pin 2f with the ejector cap positioning pin groove 9d determines the circumferential position of the ejector cap 9 relative to the base member 2.

[0048] Furthermore, the ejector cap 9 is fixed to the base member 2 with the ejector support member 7 and the ejector pin 8 positioned therein. That is, the ejector cap 9 covers the ejector support member 7 and the ejector pin 8. At this point, the carrier through-hole 9b of the ejector cap 9 overlaps with the ejector pin 8 when viewed in the axial direction of the bolt slot shaft 4. Furthermore, the interior of the ejector cap 9 communicates with the lift shaft flow path 4a of the bolt slot shaft 4 via the ejector support member flow path 7a of the ejector support member 7.

[0049] The positions of the slotted nut 3 and the slotted shaft 4 of the ejector head 1 constructed as described above in the X and Y directions, as well as their positions around the axis of the slotted shaft 4, are determined by the base member 2. Furthermore, the positions of the ejector pin support member 7 and the ejector pin 8 of the ejector head 1 in the X and Y directions, as well as their positions around the axis of the slotted shaft 4, are determined by the slotted shaft 4. That is, the positions of the ejector pin support member 7 and the ejector pin 8 of the ejector head 1 in the X and Y directions, as well as their positions around the axis of the slotted shaft 4, are determined by the base member 2. Furthermore, the positions of the ejector pin cap 9 of the ejector head 1 in the X and Y directions, as well as their positions around the axis of the slotted shaft 4, are determined by the base member 2. Furthermore, the slotted nut 3, slotted shaft 4, ejector pin support member 7, ejector pin 8, and ejector cap 9 of the ejector head 1 are supported by the base member 2. Thus, the ejector head 1 is constructed to be detachable as a single unit including the base member 2, the bolt groove nut 3, the bolt groove shaft 4, the ejector pin support member 7, the ejector pin 8 and the ejector pin cap 9.

[0050] Furthermore, the ejector head 1 moves the contact member 5 in the axial direction of the bolt slot shaft 4, thereby axially moving the ejector support member 7 and the ejector pin 8 fixed to the bolt slot shaft 4. When the contact member 5 is in the raised position, the ejector head 1 inserts the ejector pin 8 into the platform through-hole 9b of the ejector cap 9. This causes the tip of the ejector pin 8 of the ejector head 1 to protrude from the platform 9a by a predetermined amount. When the contact member 5 is in the lowered position, the ejector pin 8 is removed from the platform through-hole 9b of the ejector cap 9. This prevents the tip of the ejector pin 8 of the ejector head 1 from protruding from the platform 9a.

[0051] (Lifting device 10) Next, using Figures 2 to 6, an exemplary embodiment 1 of the jacking device for jacking up the jacking head 1 of the present invention will be described. Figure 3 is a cross-sectional view of the jacking head 1 and the jacking device 10, viewed from a direction perpendicular to the lifting direction of the jacking head 1, with the jack pin 8 in the lowered position P1. Figure 4 is a cross-sectional view of the jacking head 1 and the jacking device 10, viewed from a direction perpendicular to the lifting direction of the jacking head 1, with the jack pin 8 in the raised position P2. Figure 5 is a top view showing the jacking device 10 holding a plurality of jacking heads 1 by the jacking head replacement mechanism 17. Figure 6 is a side view showing the jacking device 10 mounting the jacking head 1 on the mounting member 16.

[0052] As shown in Figures 2 to 4, the lift device 10 included in the semiconductor manufacturing apparatus is a device for moving the ejector pins 8 of the ejector head 1 in the axial direction. The lift device 10 includes a lifting drive mechanism 11, a mounting member 16, and an ejector head replacement mechanism 17.

[0053] The lift drive mechanism 11 is a mechanism for raising and lowering the ejector pins of the ejection head 1. The lift drive mechanism 11 is installed in a semiconductor manufacturing apparatus (not shown). The lift drive mechanism 11 includes an actuator (i.e., an electric motor (not shown)), a power conversion device 13, a push member 14, and a suction elastic member 15.

[0054] The electric motor is a servo motor that can rotate at any rotational position, rotational speed, and rotational torque. The electric motor is connected to the power conversion device 13. The electric motor is configured to transmit the rotational force to the power conversion device 13.

[0055] The power conversion device 13 converts the rotational motion of the electric motor into lifting motion. The power conversion device 13 converts the rotational motion input from the electric motor into linear motion via a cam mechanism. The power conversion device 13 is configured with its linear motion output portion 13a oriented in the Z direction (upward and downward). A lifting member 14 is secured to the output portion 13a, which moves the contact member 5 of the lifting head 1 upward. The power conversion device 13 raises the lifting member 14 by rotating the electric motor in one direction. Furthermore, the power conversion device 13 lowers the lifting member 14 by rotating the electric motor in the other direction.

[0056] The lifting member 14 has a support portion 14a that contacts the contact member 5 of the lifting head 1. The support portion 14a is a pair of rectangular blocks that protrude from the side surface of the lifting member 14 on the contact member 5 side toward the contact member 5. The support portions 14a face each other across the center of the lifting member 14. The support portions 14a are configured to support the contact member 5.

[0057] The lifting member 14 has a second negative pressure path 14b, which serves as a gas flow path. One end of the second negative pressure path 14b has an opening between a pair of blocks constituting the support portion 14a. That is, one end of the second negative pressure path 14b opens toward the contact member 5 at approximately the center of the side surface of the lifting member 14 on the contact member 5 side. Furthermore, the other end of the second negative pressure path 14b has an opening on the side surface parallel to the lifting direction of the lifting member 14. Thus, the second negative pressure path 14b is configured as a flow path that connects the side surface parallel to the lifting direction of the lifting member 14 with the side surface on the contact member 5 side. The opening at the other end of the second negative pressure path 14b is connected to a vacuum source of a semiconductor manufacturing device (not shown).

[0058] The suction elastic member 15 is a cylindrical member that connects the second negative pressure path 14b to the lifting shaft flow path 4a of the lifting head 1. The suction elastic member 15 is made of a flexible material such as rubber. The suction elastic member 15 is fixed to the side surface of the lifting member 14 on the contact member 5 side, with the axial direction serving as the lifting direction. Furthermore, the suction elastic member 15 is positioned such that the opening at one end of the second negative pressure path 14b is contained within the interior of the suction elastic member 15, as viewed in the axial direction. Thus, the suction elastic member 15 communicates with the second negative pressure path 14b. Furthermore, the suction elastic member 15 is positioned such that the lifting shaft flow path 4a of the lifting head 1, which is mounted on the mounting member 16, is contained within the interior of the suction elastic member 15, as viewed in the axial direction. The end of the suction elastic member 15 on the contact member 5 side protrudes further toward the contact member 5 than the support portion 14a of the lifting member 14. Thereby, the end portion of the contact member 5 side of the elastic member 15 for attraction contacts the contact member 5 when the contact member 5 of the lifting head 1 contacts the supporting portion 14a of the lifting member 14.

[0059] The mounting member 16 is a roughly cubical member for mounting the jacking head 1. The mounting member 16 has a through-hole 16a extending from one opposing side to the other side. The mounting member 16 is secured to the end of the power conversion device 13 on the output portion 13a side, with one side of the mounting member 16 having the through-hole 16a opening facing the power conversion device 13. Specifically, the mounting member 16 is secured to the power conversion device 13 with the through-hole 16a extending in the lifting direction. The mounting member 16 inserts the output portion 13a of the power conversion device 13 into the through-hole 16a from the opening on one side.

[0060] The mounting member 16 has a mounting surface 16b on its other side surface, which has an opening, for mounting the ejection head 1. The opening of the mounting surface 16b forms a base member engagement hole 16c, into which the base member engagement portion 2b of the base member 2 of the ejection head 1 is removably engaged. Furthermore, the mounting surface 16b has a base member positioning pin 16d that engages with the base member positioning pin groove 2c of the base member 2.

[0061] The mounting member 16 includes a first negative pressure path 16e, which serves as a gas flow path. The first negative pressure path 16e has an opening around the base member engagement hole 16c in the mounting surface 16b. The opening at one end of the first negative pressure path 16e overlaps with the suction surface 2a of the ejection head 1 mounted on the mounting member 16, as viewed in the lifting direction. Therefore, when the ejection head 1 is mounted on the mounting member 16, the opening at one end of the first negative pressure path 16e is covered by the suction surface 2a. Furthermore, the other end of the first negative pressure path 16e has an opening on a side surface of the mounting member 16 parallel to the lifting direction. Thus, the first negative pressure path 16e forms a flow path connecting the side surface of the mounting member 16 parallel to the lifting direction with the mounting surface 16b. The opening at the other end of the first negative pressure path 16e is connected to a vacuum source of the semiconductor manufacturing equipment (not shown).

[0062] As shown in Figure 5, the jacking head replacement mechanism 17 is a mechanism for replacing the jacking head 1 mounted on the mounting member 16. The jacking head replacement mechanism 17 includes a plurality of replacement arms 18. The plurality of replacement arms 18 are radially and evenly spaced apart and supported by a disk-shaped base 19. In this embodiment, the base 19 supports six replacement arms 18. The six replacement arms 18 hold jacking heads 1 corresponding to different types. The base 19 is configured to be movable relative to the mounting member 16 in the X and Z directions (elevation directions), as well as in a circumferential direction with the center of the base 19 as the center of rotation, by a transport device (not shown).

[0063] The replacement arm 18 includes a pair of rod-shaped members, or retaining portions 18a. The pair of retaining portions 18a connects the base ends. The pair of retaining portions 18a have upper surfaces 18b that can contact the replacement arm contact surface 2h of the base member 2 in the jacking head 1. Furthermore, the pair of retaining portions 18a have opposing, parallel inner surfaces 18c. The pair of retaining portions 18a are positioned so that the base member 2 can be inserted between the opposing inner surfaces 18c. Furthermore, each of the pair of retaining portions 18a has a claw portion 18d that protrudes toward the retaining portion 18a facing the front end.

[0064] The replacement arm 18 is configured to hold the base member 2 of the lifting head 1 between a pair of holding portions 18a. The replacement arm 18 can move the lifting head 1 in the lifting direction (up and down direction) by bringing the upper surface 18b into contact with the replacement arm contact surface 2h of the base member 2. Furthermore, the replacement arm 18 determines the position of the replacement arm 18 in the X direction, the position in the Y direction, and the circumferential position with the center of the lifting head 1 as the center of rotation by bringing the inner side surface 18c into contact with the protrusion 2i of the base member 2. Furthermore, the replacement arm 18 can move the replacement arm 18 in the circumferential direction by bringing the inner side surface 18c into contact with the protrusion 2i of the base member 2. Furthermore, the replacement arm 18 regulates the radial movement of the lifting head 1 with respect to the replacement arm 18 by bringing the claw portion 18d into contact with the protrusion 2i of the base member 2.

[0065] Next, the attachment and removal of the jacking head 1 by the jacking device 10 will be described using Figures 2 to 4. It is assumed that the jacking head 1 is not mounted on the jacking device 10. Furthermore, it is assumed that the jacking head 1 is supported as a single unit by the replacement arm 18 of the head replacement mechanism 17.

[0066] As shown in Figures 2 and 3, when the jacking head 1 is mounted on the jacking device 10, the jacking head replacement mechanism 17 of the jacking device 10 rotates the base 19 via a conveying device (not shown), thereby moving the selected jacking head 1 from the jacking heads 1 held by the plurality of replacement arms 18 to the standby position P3 (see Figure 5). Next, the jacking head replacement mechanism 17 moves the base 19 toward the jacking device 10 to the replacement position P4 (see Figure 5). Next, the jacking head replacement mechanism 17 lowers the base 19 and mounts the jacking head 1 supported by the replacement arm 18 to the mounting member 16 of the jacking device 10. After lowering the base 19 until the claw 18d of the replacement arm 18 is clear of the protrusion 2i of the base member 2, the jacking head replacement mechanism 17 moves the replacement arm 18 to the standby position P3.

[0067] The ejection head 1, supported by the replacement arm 18, lowers the base 19 of the ejection head replacement mechanism 17, engaging the base member engagement portion 2b of the base member 2 with the base member engagement hole 16c of the mounting member 16. This determines the X- and Y-direction positions of the ejection head 1 relative to the mounting member 16. Simultaneously, the ejection head 1 engages the base member positioning pin 16d of the mounting member 16 in the base member positioning pin groove 2c of the base member 2. This determines the circumferential position of the ejection head 1 relative to the mounting member 16, with the center of rotation being the center of the base member engagement hole 16c.

[0068] The lift head 1 is supported by the mounting member 16, with the suction surface 2a of the base member 2 in contact with the mounting surface 16b of the mounting member 16. At this point, the suction surface 2a covers the opening of the first negative pressure path 16e on the mounting surface 16b. Furthermore, the lift head 1 uses the compression spring 6 to press the contact member 5 against the lifting member 14 of the lift drive mechanism 11. The contact member 5 contacts the support portion 14a of the lifting member 14. Simultaneously, the contact member 5 is pressed against the elastic suction member 15, which protrudes above the support portion 14a. The elastic suction member 15 is compressed toward the lift drive mechanism 11 by the contact member 5. At this point, the opening of the lift shaft flow path 4a of the bolt-grooved shaft 4, which passes through the contact member 5, is contained within the elastic suction member 15. Consequently, the lift shaft flow path 4a communicates with the second negative pressure path 14b of the lift device 10 via the elastic suction member 15, which is in communication with the second negative pressure path 14b.

[0069] Next, the lifting device 10 uses a vacuum source to reduce the pressure within the first negative pressure path 16e to a negative pressure. The suction surface 2a of the lifting head 1, which covers the opening of the first negative pressure path 16e, is attracted by the suction force from the first negative pressure path 16e. This suction force presses the suction surface 2a against the support surface 16b. The lifting head 1 maintains its position relative to the support surface 16b by the frictional force generated between the suction surface 2a and the support surface 16b due to the suction force. Furthermore, the lifting head 1 can be secured not only by suction but also by a locking member pressed by a spring or the like.

[0070] Next, the lift device 10 uses a vacuum source to reduce the pressure within the second negative pressure path 14b to a negative pressure. The reduced internal pressure causes the suction elastic member 15, which is connected to the second negative pressure path 14b, to come into close contact with the contact member 5 of the lift head. The pressure within the lift shaft flow path 4a of the lift head 1, which is connected to the suction elastic member 15, becomes negative. Furthermore, the lift head 1 suctions the interior of the ejector cap 9 via the ejector support member flow path 7a of the ejector support member 7, which is connected to the lift shaft flow path 4a. As a result, the lift head 1 generates a suction force within the plurality of carrier through-holes 9b of the carrier 9a of the ejector cap 9, which attracts and holds the holding sheet S (see FIG. 3 ) holding the semiconductor wafer C (see FIG. 3 ).

[0071] As shown in Figure 4, the lift device 10, while the lift head 1 is held against the mounting member 16 by the suction force of the first negative pressure path 16e, raises and lowers the ejector pin 8 of the lift head 1 via the lift drive mechanism 11. At this time, the suction elastic member 15, which connects the second negative pressure path 14b to the lift shaft flow path 4a of the lift head 1, is brought into close contact with the contact member 5 of the lift head 1 by the negative pressure of the second negative pressure path 14b. Furthermore, the contact member 5 is pressed against the support portion 14a of the lifting member 14 by the compression spring 6 of the lift head 1, and therefore does not separate from the lifting member 14 regardless of the lift of the lifting member 14. Therefore, the suction of the contact member 5 by the suction elastic member 15 does not affect the operation of the lift head 1.

[0072] As shown in Figure 3, the lift device 10 raises the pressure within the second negative pressure path 14b to atmospheric pressure when moving the holding sheet S (see Figure 3) holding the semiconductor wafer C (see Figure 3). The increased internal pressure causes the suction elastic member 15, a flexible member, to stop attracting the negative pressure contact member 5. The suction elastic member 15 maintains contact with the contact member 5 due to the elastic force of the flexible member. Therefore, when the lift device 10 returns the pressure within the second negative pressure path 14b to negative pressure, the suction elastic member 15 remains in close contact with the contact member 5 at the same position. This allows the lift device 10 to maintain the connection between the lift shaft flow path 4a of the lift head 1 and the second negative pressure path 14b, achieved by the suction elastic member 15, even if the pressure in the second negative pressure path 14b fluctuates.

[0073] On the other hand, since the first negative pressure path 16e is a separate system from the second negative pressure path 14b, it is not affected by pressure fluctuations in the second negative pressure path 14b. In other words, the suction force exerted by the first negative pressure path 16e on the ejection head 1 is not affected by pressure fluctuations in the second negative pressure path 14b. Therefore, the position of the ejection head 1 relative to the mounting member 16 is maintained.

[0074] As shown in Figure 3, when the ejection head 1 is removed from the ejection device 10, the ejection device 10 increases the pressure within the second negative pressure path 14b to atmospheric pressure. This causes the elastic suction member 15, which is a flexible member, to be no longer attracted to the contact member 5 of the ejection head due to the increased internal pressure. The elastic suction member 15 maintains contact with the contact member 5 due to the elastic force of the flexible member. Furthermore, the ejection head 1 is not being sucked into the interior of the ejector cap 9.

[0075] Next, the lifting device 10 increases the pressure within the first negative pressure path 16e to atmospheric pressure. The suction surface 2a of the lifting head 1, which covers the opening of the first negative pressure path 16e, is not suctioned. The lifting head 1 is pressed against the mounting surface 16b of the mounting member 16 solely by gravity. The lifting head 1 is now movable relative to the mounting surface 16b.

[0076] As shown in FIG. 5 , the jack head replacement mechanism 17 moves the replacement arm 18 and the base 19 at the standby position P3 toward the jacking device 10 to the replacement position P4 by a conveying device (not shown).

[0077] As shown in Figure 6, the lift-head replacement mechanism 17 lowers its base 19, causing the replacement arm 18 to contact the lift-head 1 mounted on the mounting member 16 of the lift device 10. With its inner side surface 18c in contact with the protrusion 2i of the base member 2 and its upper surface 18b in contact with the replacement arm contact surface 2h of the base member 2, the replacement arm 18 removes the lift-head 1 from the mounting member 16. As the base 19 of the lift-head replacement mechanism 17 rises, the lift-head 1 separates the suction surface 2a of the base member 2 from the mounting surface 16b of the mounting member 16. Simultaneously, the lift-head 1 separates the contact member 5 from the support portion 14a of the lifting member 14 and the elastic suction member 15, removing the base member engagement portion 2b from the base member engagement hole 16c of the mounting member 16. The lift-head replacement mechanism 17 then moves the replacement arm 18 to the standby position P3, while maintaining the lift-head 1 removed from the mounting member 16.

[0078] The ejection head 1 thus constructed is a single unit that supports other components via the base member 2. Furthermore, the base member 2 of the ejection head 1 is attracted to the mounting member 16 by the suction force of the first negative pressure path 16e of the mounting member 16 of the ejection device 10. Therefore, the ejection head 1 does not move relative to the mounting member 16. Furthermore, the interior of the ejector cap 9 of the ejection head 1 is attracted by the suction force of the second negative pressure path 14b of the lift drive mechanism 11 of the ejection device 10. In other words, the ejection head 1 is configured to attract the base member 2 and the interior of the ejector cap 9 by the suction force of different negative pressure paths. Therefore, fluctuations in the negative pressure within the ejector cap 9 of the ejection head 1 do not affect the attracted state of the base member 2.

[0079] Furthermore, the force exerted by the compression spring 6 on the lift drive mechanism 11 constantly acts on the contact member 5 of the lift head 1. Therefore, even when the lift drive mechanism 11 is raised or lowered, the contact member 5 does not separate from the lifting member 14 of the lift drive mechanism 11. In other words, the lift head 1 can prevent leakage from the connection portion of the suction elastic member 15 connecting the second negative pressure path 14b with the lift shaft flow path 4a of the bolt groove shaft 4. Furthermore, the compression spring 6 applies a force in the direction in which the base member 2 moves away from the mounting member 16.

[0080] Furthermore, the ejection head 1 is transported while the replacement arm 18 of the ejection device 10 is controlled by the replacement arm contact surface 2h and the protrusion 2i of the arm engagement portion 2g of the base member 2, which regulate the movement of the replacement arm 18 in the X, Y, and Z directions (elevation direction). Therefore, the ejection head 1 does not move relative to the replacement arm 18 during transport. This allows the ejection head 1 to easily maintain the position of the ejector pin 8, which is positioned relative to the ejection device 10 in a detachable state.

[0081] The lifter 10 of this embodiment uses the suction force of the first negative pressure path 16e of the mounting member 16 to attract the suction surface 2a of the base member 2 in the lifter head 1. Furthermore, the lifter 10 uses the second negative pressure path 14b of the lift drive mechanism 11 to attract the interior of the ejector cap 9 in the lifter head 1. Therefore, because the lifter 10 uses separate paths to attract and attract the interior of the lifter head 1, neither is affected by fluctuations in negative pressure.

[0082] Furthermore, when the base member 2 of the lifting head 1 is mounted on the mounting member 16, the lifting device 10 connects the second negative pressure path 14b of the lifting drive mechanism 11 with the lifting shaft flow path 4a of the bolt-grooved shaft 4 in the lifting head 1 via the suction elastic member 15. Since the suction elastic member 15 is made of an elastic material such as rubber, it is brought into close contact with the bolt-grooved shaft 4 or the contact member 5 of the lifting head 1 by the suction force within the second negative pressure path 14b. The suction elastic member 15 then moves away from the lifting head 1 by setting the pressure within the second negative pressure path 14b to a positive pressure. Thus, the lifting device 10 prevents leakage from the connection between the second negative pressure path 14b and the lifting shaft flow path 4a.

[0083] Furthermore, the plurality of replacement arms 18 of the lift-up head replacement mechanism 17 of the lift-up device 10 hold lift-up heads 1 corresponding to different wafer types. The lift-up device 10 can automatically attach or detach any of the lift-up heads 1 held by the plurality of replacement arms 18 to the mounting member 16 using the replacement arms 18. As described above, the lift-up device 10 can easily maintain the position of the ejector pins 8, which are positioned relative to the lift-up device 10 in a detachable state, by adjusting the pressure of the first negative pressure path 16e and the second negative pressure path 14b.

[0084] (Other embodiments) Furthermore, in all of the above-described embodiments, the lift shaft flow path 4a of the bolt-grooved shaft 4 in the lift head 1 communicates with the second negative pressure path 14b via the elastic suction member 15 of the lift device 10. However, the elastic suction member 15 may be provided by the lift head 1. When the elastic suction member 15 is attached to the mounting member 16 of the lift device 10, it presses against the push member 14 of the lift drive mechanism 11. Alternatively, the lift head 1 and the lift device 10 may each have an elastic suction member 15.

[0085] When the ejection head 1 includes the aforementioned elastic suction member 15, the elastic suction member 15 connects the second negative pressure path 14b of the lift drive mechanism 11 with the lift shaft flow path 4a of the lift shaft. Since the elastic suction member 15 is made of an elastic material such as rubber, it is held in close contact with the lift drive mechanism 11 by the suction force of the second negative pressure path 14b. Thus, the elastic suction member 15 prevents leakage from the connection between the second negative pressure path 14b and the lift shaft flow path 4a. Meanwhile, the elastic suction member 15 is removed from the lift drive mechanism 11 by maintaining the pressure within the second negative pressure path 14b at a positive pressure. This facilitates maintaining the position of the ejector pin 8, which is positioned in a detachable state relative to the ejection device 10.

[0086] Furthermore, in the above-described embodiment, the base member 2 of the ejector head 1 is positioned relative to the mounting member 16 by the base member positioning pins 16d. Furthermore, the ejector cap 9 of the ejector head 1 is positioned relative to the base member 2 by the ejector cap positioning pins 2f. However, the positioning of the base member relative to the mounting member and the positioning of the ejector cap relative to the base member do not necessarily require positioning pins.

[0087] Furthermore, in the above embodiment, the jacking device 10 converts the rotary motion of the electric motor into a linear motion through the lifting drive mechanism 11. However, the jacking device may be a structure in which a linear actuator such as a linear motor is used to lift the jacking head 1.

[0088] Furthermore, in the above-mentioned embodiment, the replacement arm 18 of the jack head replacement mechanism 17 holds the jack head 1 by a pair of rod-shaped holding portions 18a. However, the replacement arm may hold the jack head by other shapes and structures.

[0089] Furthermore, in the above embodiment, the lift device 10 is configured so that the lift head 1 can be replaced according to the type of semiconductor wafer C (see FIG. 3 ) by the lift head replacement mechanism 17. However, the lift device 10 may not have the lift head replacement mechanism.

[0090] The embodiments of the present invention have been described above, but the embodiments described above are merely examples for implementing the present invention. Therefore, the present invention is not limited to the embodiments described above, and the embodiments described above can be appropriately modified and implemented without departing from the scope of the present invention.

[0091] 1: Lift your head 2: Base components 2a: Adsorption surface 2b: Fitting portion for base member 2c: Base member positioning pin groove 2d: Mounting surface 2e: Fitting portion for thimble cap 2f: Positioning pin for ejector cap 2g: Arm engagement portion 2h: Replace the arm contact surface 2i: protrusion 3: Bolt-slot nut 4: bolt groove shaft 4a: Lifting axis flow path 5: Contact components 6: Compression spring 7: Ejector support component 7a: Ejector pin support component flow path 7b: Ejector pin retaining hole 8: Ejector pin 9: Thimble cap 9a: Carrier 9b: Carrier through hole 9c: Fixing flange 9d: Groove for positioning pin of ejector cap 10: Lifting device 11: Lifting drive mechanism 13: Power conversion device 13a: Output unit 14: Pushing component 14a: Support Department 14b: Second negative pressure path 15: Elastic member for suction 16: Install components 16a: Through hole 16b: Loading surface 16c: base member fitting portion 16d: Positioning pin for base member 16e: 1st negative pressure path 17: Lifting head replacement mechanism 18: Replacement Arm 18a: Holding portion 18b: Upper surface 18c: inner side 18d: claw 19: Base C: semiconductor wafer P1: descending position P2: rising position P3: Standby position P4: Change position S: Keep sheet

Claims

1. A lifting head, used in a semiconductor manufacturing apparatus to lift at least one of a plurality of wafers adhered to a holding sheet by means of a lifting device, and comprising: a base member configured to be detachable from a mounting member of the lifting device, having an adsorption surface adsorbed onto the mounting member; a lifting shaft supported by the base member in a state of being movable in an axial direction but not rotatable about an axis, having a lifting shaft flow path communicating from one end to the other in the axial direction; and a contact member fixed to one end of the lifting shaft in a state of communicating with the outside through the lifting shaft flow path, and contacting a pushing member of a lifting drive mechanism of the lifting device in the lifting direction; A pin support member is fixed to the other end of the aforementioned lifting shaft in a state where the aforementioned lifting shaft flow path is connected to the outside, and the aforementioned pin is detachably supported in the aforementioned axial direction; and a pin cap is a cylindrical member with a platform at one end for holding the aforementioned retaining sheet and having a through hole for inserting the aforementioned pin, and the aforementioned pin support member and the aforementioned pin are located inside, and the aforementioned through hole overlaps with the aforementioned pin when viewed in the aforementioned axial direction, and the other end is fixed to the aforementioned base member; the aforementioned base member, in a state where it is positioned on the aforementioned mounting member, is attracted by the attraction force of the first negative pressure path of the aforementioned mounting member; the aforementioned pin cap, when the aforementioned contact member contacts the aforementioned lifting drive mechanism, is attracted inside by the attraction force of the second negative pressure path of the aforementioned lifting drive mechanism through the aforementioned lifting shaft flow path.

2. As claimed in claim 1, wherein a cylindrical suction elastic member connected to the flow path of the aforementioned lifting shaft is fixed at the aforementioned lifting shaft or the aforementioned contact member; and the aforementioned suction elastic member is connected to the aforementioned second negative pressure path when the aforementioned contact member contacts the aforementioned lifting drive mechanism's pushing member.

3. The lifting head of claim 1 has a pressing elastic member for pressing the aforementioned contact member against the lifting member of the aforementioned lifting drive mechanism; and the aforementioned contact member is pressed against the lifting member of the aforementioned lifting drive mechanism by the elastic member.

4. The lifting head of claim 2 has a pressing elastic member for pressing the aforementioned contact member against the lifting member of the aforementioned lifting drive mechanism; and the aforementioned contact member is pressed against the lifting member of the aforementioned lifting drive mechanism by the elastic member.

5. The lifting head of any of claims 1 to 4, wherein the aforementioned base member has an arm engaging portion for engaging the replacement arm of the aforementioned lifting device.

6. A lifting device for a lifting head, which is a lifting device for raising and lowering the ejector pin of any one of claims 1 to 5, and comprising: a mounting member for detachably mounting the lifting head; a lifting drive mechanism for raising and lowering the contact member of the lifting head; and a lifting head replacement mechanism for detaching the lifting head from the mounting member; wherein the mounting member has a first negative pressure path attracted by a vacuum source, and when the base member of the lifting head is mounted on the mounting member, the suction force of the first negative pressure path attracts the adsorption surface of the base member; the lifting drive mechanism comprises: a pushing member for pushing the contact member of the lifting head; and a second negative pressure path attracted by a vacuum source; wherein when the contact member of the lifting head contacts the pushing member, the suction force of the second negative pressure path attracts the ejector pin cap of the lifting head through the lifting axis flow path of the lifting head.

7. The lifting device of claim 6, wherein the aforementioned lifting drive mechanism has a cylindrical suction elastic member fixed at the opening of the aforementioned second negative pressure path and communicating with the aforementioned second negative pressure path; and the aforementioned suction elastic member is communicating with the lifting shaft flow path of the aforementioned lifting head when the contact member of the aforementioned lifting head contacts the aforementioned pushing member.

8. The lifting device as claimed in claim 6 or 7, wherein the aforementioned lifting head replacement mechanism has a plurality of replacement arms, each of the plurality of replacement arms holding the aforementioned lifting head, thereby installing the selected lifting head onto the aforementioned mounting member by means of the replacement arm holding the aforementioned lifting head, and thereby removing the lifting head installed on the aforementioned mounting member by means of the corresponding replacement arm.

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