Non-contact laser processing and bonding method for workpices

Abstract

This invention relates to a non-contact laser bonding method for workpieces, comprising the following steps: setting an adjacent distance between a first workpiece and a second workpiece to be bonded, such that a first bonding point of the first workpiece aligns with a second bonding point of the second workpiece; then applying a laser to the first bonding point and the second bonding point, causing the first bonding point and the second bonding point to melt and bond together; after the first bonding point and the second bonding point are fully bonded together, turning off the laser source to allow the first bonding point and the second bonding point to cool and solidify, thereby bonding and fixing the first workpiece and the second workpiece together.

Description

Non-contact laser processing bonding method for workpieces The present invention relates to a non-contact laser processing bonding method for workpieces, in particular to an invention in which a first workpiece and a second workpiece to be bonded are arranged adjacent to each other at a distance, and a laser is applied to heat and melt the bonding portions of the first workpiece and the second workpiece so as to bond and fix them to each other. Laser bonding between workpieces can have a stable bonding and fixing effect. Laser bonding is to align two workpieces to be joined in contact with each other, and apply a laser to melt the joint of the two workpieces, and then cool and solidify to bond and fix the two workpieces. Refer to the Republic of China Patent No. M306016 "Improvement of the Metal Frame of a Liquid Crystal Screen Panel Suitable for Laser Welding". This case discloses "As shown in Figure 7... Take two unequal-sided U-shaped workpieces 71 and join them into a square planar structure 22 by laser welding... For the positioning of the workpieces, we can design a simple positioning fixture according to the characteristics of this creative form. As shown in Figure 8, this positioning fixture includes a pair of rapid displacement clamping mechanisms 81 and positioning pins 82 placed at the four corners. Place each workpiece 71 on the welding fixture table 83 along the positioning pins, and then use the rapid displacement clamping mechanism 81 to push and clamp the workpiece 71 to easily complete the positioning and locking of the workpieces to be welded." As described in the previous case, the laser bonding method requires positioning before workpiece bonding to ensure that the workpieces are bonded in the correct position. However, there may be allowable dimensional errors during the forming of the workpieces. After two workpieces with different allowable errors are aligned in contact and then butt-joined by laser processing, there may be a problem that the butt-joined two workpieces form an excessive dimensional error, resulting in a reduction in the yield rate. Therefore, the present invention provides a non-contact laser processing bonding method for workpieces, including the following steps: Arrange a first workpiece and a second workpiece to be bonded adjacent to each other at a distance, so that a first bonding portion of the first workpiece corresponds to a second bonding portion of the second workpiece. Apply a laser to the first bonding portion and the second bonding portion to heat and melt the first bonding portion and the second bonding portion so as to bond them to each other. Cool and solidify the first bonding portion and the second bonding portion, and further bond and fix the first workpiece and the second workpiece to each other. Those skilled in the art know that the materials of the first workpiece and the second workpiece are materials that can be bonded by laser processing. Furthermore, the laser energy applied makes the temperatures of the first bonding portion and the second bonding portion not higher than the material thermal decomposition temperature. Furthermore, the first workpiece and the second workpiece are made of the same material or different materials. More specifically, the first workpiece and the second workpiece are, for example, any one of polymer materials, glass materials, or metal materials, and the distance between the first workpiece and the second workpiece adjacent to each other is between 0 and 1 centimeter, and preferably between 0 and 200 micrometers. Furthermore, the first workpiece is made of a polymer material, and the second workpiece is made of a polymer material. Alternatively, the first workpiece is made of a polymer material, and the second workpiece is made of glass. Alternatively, the first workpiece is made of a polymer material, and the second workpiece is made of a metal material. Alternatively, the first workpiece is made of glass, and the second workpiece is made of a metal material. Alternatively, the first workpiece is made of a metal material, and the second workpiece is made of a metal material. Furthermore, the cooling and curing is natural cooling and curing. Furthermore, during the process of applying the laser, control the energy of the laser so that the first bonding part and the second bonding part are maintained at a set temperature. The following effects can be achieved according to the above technical features: 1. A gap is provided between the first workpiece and the second workpiece to be bonded. There is no need to adopt the method of contact alignment. The relative first bonding part and the second bonding part can be adjusted according to the dimensional errors of the first workpiece and the second workpiece itself, achieving high-precision alignment, so that the first workpiece and the second workpiece have high precision after being bonded and fixed to each other. 2. During the process of applying the laser, perform temperature tracking and adjust and control the energy of the laser so that the first bonding part and the second bonding part are maintained at the set temperature and can be evenly joined. The following embodiments only assist in explaining the non-contact laser processing and bonding method of the workpieces of the present invention, and are not intended to limit the present invention. Referring to the first, second, and third figures, the steps of the method of this embodiment include: A first workpiece 1 and a second workpiece 2 to be bonded in the process are arranged adjacent to each other with a gap D, and alignment is performed so that a first bonding part 11 of the first workpiece 1 corresponds to a second bonding part 21 of the second workpiece 2. Apply a laser L to the first bonding part 11 and the second bonding part 21, so that the first bonding part 11 and the second bonding part 21 are heated and melted and bonded to each other. The laser L can be applied in a way that the laser L vertically passes through the first workpiece 1 and the second workpiece 2 to heat the first bonding part 11 and the second bonding part 21, or the laser L passes through the first workpiece 1 and the second workpiece 2 from the side (the laser L passes between the first bonding part 11 and the second bonding part 21) to heat the first bonding part 11 and the second bonding part 21, and the applied laser energy makes the temperatures of the first bonding part 11 and the second bonding part 21 not higher than the material thermal decomposition temperature to avoid material thermal cracking. When the first bonding part 11 and the second bonding part 21 are fully bonded to each other, gradually reduce the laser parameters to reduce the laser energy until the laser source is turned off, and cool and cure the first bonding part 11 and the second bonding part 21. The cooling and curing in this embodiment adopts natural cooling and curing, so that the first workpiece 1 and the second workpiece 2 are bonded and fixed to each other. It should be further noted that the first workpiece 1 and the second workpiece 2 can be made of the same material or different materials, and preferably, the first workpiece 1 and the second workpiece 2 are made of any one of polymer materials, glass materials, or metal materials. At this time, the distance D between the adjacent first workpiece 1 and the second workpiece 2 can be controlled to be between 0 and 1 cm according to the laser energy and the required bonding strength. When the distance D is between 0 and 200 microns, the first workpiece 1 and the second workpiece 2 can be bonded more evenly. Referring to the fourth and fifth figures, taking the first workpiece 1 made of a polymer material and the second workpiece 2 also made of a polymer material as an example, the first workpiece 1 and the second workpiece 2 are bonded and fixed to each other for a tensile test. Setting the same laser parameters (such as power), the energy is sufficient to heat and melt the first bonding portion 11 and the second bonding portion 21. When the distance D between the first workpiece 1 and the second workpiece 2 increases, the tensile strength after the first workpiece 1 and the second workpiece 2 are bonded and fixed decreases. During the test, when the distance D between the first workpiece 1 and the second workpiece 2 is 200 microns, in order to avoid poor fluidity after the first bonding portion 11 and the second bonding portion 21 are melted, the laser energy is further increased, so that the melting range of the first bonding portion 11 and the second bonding portion 21 becomes larger and the fluidity is improved. At this time, the first workpiece 1 and the second workpiece 2 can be bonded and fixed to each other and have a greater tensile strength. Referring to the sixth and seventh figures, increasing the laser energy can make the melting range of the first bonding portion 11 and the second bonding portion 21 larger and have a deeper bonding depth, so that a greater tensile strength can be obtained as described above. However, according to the test, when the distance D between the first workpiece 1 and the second workpiece 2 exceeds 1 cm, even if the laser intensity is increased, due to the excessive distance D, the first workpiece 1 and the second workpiece 2 cannot be effectively bonded and fixed. Referring to the eighth figure, taking the first workpiece 1 made of a polymer material and the second workpiece 2 made of a glass material as an example, the first workpiece 1 and the second workpiece 2 are bonded and fixed to each other and a tensile test is carried out. Setting the same laser parameters (such as power), similarly, when the distance D between the first workpiece 1 and the second workpiece 2 increases, the tensile strength after the first workpiece 1 and the second workpiece 2 are bonded and fixed decreases. And similarly, according to the test, when the distance D between the first workpiece 1 and the second workpiece 2 exceeds 1 cm, even if the laser intensity is increased, due to the excessive distance D, the first workpiece 1 and the second workpiece 2 cannot be effectively bonded and fixed. Referring to the ninth figure, during the process of applying the laser L to heat and melt the first bonding portion 11 and the second bonding portion 21, it is preferably to perform temperature tracking to adjust and control the energy of the laser L so that the first bonding portion 11 and the second bonding portion 21 can be maintained at a set temperature, enabling the first bonding portion 11 and the second bonding portion 21 to be uniformly melted with a considerable bonding degree, thereby enabling the first workpiece 1 and the second workpiece 2 to be uniformly joined when cooling and curing. Based on the descriptions of the above embodiments, the operation, use, and the effects produced by the present invention can be fully understood. However, the above embodiments are only the preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited thereby. That is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the invention description all fall within the scope covered by the present invention. 1: First workpiece 11: First bonding portion 2: Second workpiece 21: Second bonding portion D: Spacing L: Laser [Figure 1] is a flowchart of the non-contact laser processing bonding method for workpieces of the present invention. [Figure 2] is a schematic diagram showing that when the present invention is implemented, the laser vertically penetrates the first workpiece and the second workpiece, causing the first bonding portion and the second bonding portion to be heated and melted so that they can bond to each other. [Figure 3] is a schematic diagram showing that when the present invention is implemented, the laser passes through the first workpiece and the second workpiece laterally, causing the first bonding portion and the second bonding portion to be heated and melted so that they can bond to each other. [Figure 4] is a table of tensile strength data for a tensile test after the first workpiece and the second workpiece are both made of polymer materials and bonded and fixed to each other at different spacings when the present invention is implemented. [Figure 5] is a graph of the tensile strength of a tensile test after the first workpiece and the second workpiece are both made of polymer materials and bonded and fixed to each other at different spacings when the present invention is implemented. [Figure 6] is a micrograph of the first workpiece and the second workpiece both made of polymer materials and bonded and fixed to each other at different spacings when the present invention is implemented. [Figure 7] is a table of the bonding depth of the first workpiece and the second workpiece both made of polymer materials and bonded and fixed to each other at different spacings when the present invention is implemented. [Figure 8] is a graph of the tensile strength of a tensile test after the first workpiece is made of polymer material and the second workpiece is made of glass material and they are bonded and fixed to each other at different spacings when the present invention is implemented. [Figure 9] is a temperature tracking control diagram for maintaining the first bonding portion and the second bonding portion at a set temperature by controlling the energy of the laser during the process of applying the laser when the present invention is implemented.

Claims

1. A non-contact laser bonding method for workpieces, comprising the following steps: setting an adjacent distance between a first workpiece and a second workpiece to be bonded, and aligning a first bonding portion of the first workpiece with a second bonding portion of the second workpiece; applying a laser to the first bonding portion and the second bonding portion, causing the first bonding portion and the second bonding portion to be heated and melted to bond together, wherein the laser heats the first bonding portion and the second bonding portion through the first workpiece and the second workpiece, and the applied laser energy ensures that the temperature of the first bonding portion and the second bonding portion does not exceed the thermal decomposition temperature of the material; cooling and solidifying the first bonding portion and the second bonding portion, thereby bonding and fixing the first workpiece and the second workpiece together; wherein the first workpiece is a polymer material, the second workpiece is a glass material, and the distance is controlled between 40 micrometers and 60 micrometers; or, the first workpiece is a polymer material, the second workpiece is a polymer material, and the distance is controlled between 40 micrometers and 60 micrometers.

2. The non-contact laser processing and bonding method for workpieces as described in claim 1, wherein, The cooling and curing system is a natural cooling and curing process.

3. The non-contact laser processing bonding method for workpieces as described in claim 1, further comprising, during the application of the laser, controlling the energy of the laser to maintain the first bonding area and the second bonding area at a set temperature.

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