Position detection device and article manufacturing method

Abstract

An apparatus includes: a first position detector for detecting the position of a first detection object on a first member; and a second position detector for detecting the position of a second detection object on a second member disposed opposite to the first member. The first position detector may include a first image sensor and a first optical system for forming an image of the first detection object on the imaging surface of the first image sensor. The second position detector may include a second image sensor and a second optical system for forming an image of the second detection object on the imaging surface of the second image sensor. The first and second position detectors may be configured to capture an image of the first image sensor using the second image sensor via the first and second optical systems.

Description

Device comprising two position detectors, and method for manufacturing an article The present invention relates to a device comprising two position detectors and a method for manufacturing an article. Japanese Patent No. 5600952 (Patent Document 1) describes a position detection device. The position detection device includes a lower reference observer and an upper reference observer. When optical axis adjustment is performed in the position detection device, a diffuser plate is placed between the lower and upper reference observers, and an adjustment indicator is projected onto the diffuser plate. The adjustment indicator projected onto the diffuser plate is captured by the imaging units of the upper and lower reference observers. In the position detection device described in Patent Document 1, it is necessary to dispose a diffusion plate between the lower reference observer and the upper reference observer in order to adjust the optical axis, and to project an index onto the diffusion plate. This may complicate the structure of the position detection device. The present invention provides a technique that is advantageous for detecting the relative position of two position detectors. One aspect of the present invention relates to a device comprising: a first position detector for detecting the position of a first detection object of a first component; and a second position detector for detecting the position of a second detection object of a second component arranged opposite to the first component. The first position detector may include a first image sensor and a first optical system for forming an image of the first detection object on a shooting surface of the first image sensor. The second position detector may include a second image sensor and a second optical system for forming an image of the second detection object on a shooting surface of the second image sensor. The first position detector and the second position detector may be configured to be able to use the second image sensor to photograph the first image sensor via the first optical system and the second optical system. Another aspect of the present invention relates to a method for manufacturing an article, comprising: a step of configuring droplets on a substrate; and a step of processing the substrate on which the droplets are configured to obtain an article. The step of configuring the droplets is implemented using a device that includes a first position detector for detecting the position of a first detection object of the first component and a second position detector for detecting the position of a second detection object of the second component arranged opposite to the first component. The first position detector can include a first image sensor and a first optical system that forms an image of the first detection object on the shooting surface of the first image sensor. The second position detector can include a second image sensor and a second optical system that forms an image of the second detection object on the shooting surface of the second image sensor. The first position detector and the second position detector can be configured to be able to use the second image sensor to shoot the first image sensor via the first optical system and the second optical system. The device can further include a processor that detects the relative position of the first position detector and the second position detector based on the image of the first image sensor shot by the second image sensor. The processor can detect the relative position of the first detection object and the second detection object based on the position of the first detection object detected by the first position detector, the position of the second detection object detected by the second position detector, and the position of the first position detector detected based on the image of the first image sensor captured by the second image sensor. The device can further include a structure supporting the second member and the first position detector. The second member can include a discharge head that discharges liquid droplets to supply the liquid droplets to the first member. The following detailed description of the embodiments is provided with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the scope of the invention to which the claims relate. While various features are described in the embodiments, not all of these features are essential to the invention, and any combination of features is possible. Furthermore, in the accompanying drawings, identical or similar structures are denoted by the same reference numerals, and repeated descriptions are omitted. FIG1 schematically shows the structure of an apparatus 1 according to one embodiment. The apparatus 1 can be configured as, for example, a device (printer) that arranges or supplies ink 4 to a substrate 2 (first component) through a discharge head 5 (second component) that discharges the ink 4, but can also be configured as other devices. Other devices can be any device that includes controlling the relative positions of the first component and the second component. The discharge head 5 (second component) is a component arranged opposite to the substrate 2 (first component). Below, an example in which the apparatus 1 is configured as a printer is described. The concept of a printer can include any device that arranges or supplies ink to a substrate (first component). Ink is a liquid that can be arranged or supplied to a substrate (first component) in the form of droplets, for example. The constituent material of the ink is not limited to a specific substance. When manufacturing functional elements, functional materials such as organic EL materials or quantum dot materials can be used. In this specification and drawings, directions are described using an XYZ coordinate system. Here, the surface on which the substrate 2 is arranged is a surface parallel to the XY plane. The device 1 can be used to manufacture a display panel. The parent material of the substrate 2 can be, for example, a glass substrate or a plastic substrate. The substrate 2 can include one or more layers of the parent material. The parent material of the substrate 2 can be, for example, a deformable film or a circular substrate. The substrate 2 can include a pixel array area (display area) 8. The pixel array area 8 includes a plurality of pixel areas, and ink can be configured or supplied to each pixel area. The ejection head 5 can include a plurality of nozzles for ejecting ink. Device 1 may include a processor 13 (control unit). Processor 13 may operate in a manner that specifies the operation of device 1. Processor 13 (control unit) may be composed of, for example, an FPGA (Field Programmable Gate Array), a PLD (Programmable Logic Device), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program, or a combination of all or part of these. The device 1 may include a substrate stage 3 (holding portion) for holding the substrate 2. In addition, the device 1 may include an actuator 11 for driving the substrate stage 3. The actuator 11 may be understood as a driving mechanism or a part thereof for changing or adjusting the relative position of the substrate 2 (first component) and the ejection head 5 (second component). The device 1 may include a position measuring device 12 for measuring the position of the substrate stage 3, such as the position in the X and Y directions, and the processor 13 may control the actuator 11 based on the output of the position measuring device 12 to position the substrate stage 3 at the target position. In addition to measuring the X and Y directions of the substrate stage 3, the position measuring device 12 may also measure at least one of the rotation around the X axis, the rotation around the Y axis, and the rotation around the Z axis. The substrate 2 can be arranged on the substrate stage 3 through a conveying mechanism (not shown). At this time, the substrate 2 can be arranged on the substrate stage 3 with a configuration error relative to the target position. In addition, since the substrate 2 undergoes various manufacturing processes, shape deformation in a plane parallel to the XY plane may occur on the substrate 2. The device 1 includes a first position detector 6 for detecting the position of a plurality of first marks 81 (first detection objects) of the substrate 2 (first component). The processor 13 can detect the position of the substrate 2 and the shape deformation of the substrate 2 based on the positions of the plurality of first marks 81 detected using the first position detector 6. If the relative position between the first position detector 6 and the ejection head 5 is constant and known, the processor 13 can control the actuator 11's drive of the substrate stage 3 and the timing of ejecting the ink 4 from the ejection head 5 based on the detection results using the first position detector 6. Therefore, the ink 4 can be arranged at the destination area in the pixel array area 8 of the substrate 2. However, the relative position between the first position detector 6 and the ejection head 5 (second component) may change due to heat, etc. Therefore, the processor 13 can operate in a manner that corrects the actuator 11's drive of the substrate stage 3 and / or the timing of ejecting the ink 4 from the ejection head 5 based on (the change in) the relative position between the first position detector 6 and the ejection head 5 (second component). By using the second position detector 7 to detect the relative position between the first position detector 6 and one or more second marks 601 (second detection objects) of the ejection head 5 (second component), the processor 13 can offset or reduce the impact of this relative position change. Thus, the ink 4 can be arranged in the target area in the pixel array area 8 of the substrate 2 regardless of changes in the relative position between the first position detector 6 and one or more second marks 601 (second detection objects) of the ejection head 5 (second member). However, the height of the surface of the substrate 2 (in other words, the thickness of the substrate 2) may vary. Therefore, if the driving of the substrate stage 3 and the ejection of the ink 4 from the ejection head 5 are controlled on the premise that the height of the surface of the substrate 2 is constant, the ink 4 can be supplied to a position that deviates from the destination area of ​​the pixel array area 8 of the substrate 2. Therefore, the device 1 can include a height sensor 9 that detects the height of the surface of the substrate 2. The processor 13 can operate in a manner that corrects the driving of the substrate stage 3 by the actuator 11 and / or the ejection timing of the ink 4 from the ejection head 5 based on the height of the surface of the substrate 2 or the height distribution of the surface of the substrate 2. FIG2 schematically shows a portion of the device 1. This portion can also be understood as a position detection device assembled in the device 1. Alternatively, this portion can also be understood as including the position detection device assembled in the device 1. The first position detector 6 can include: a first camera body 201 including a first image sensor IS1; and a first optical system 203 that forms an image of the first mark 81 (first detection object) of the substrate 2 (first component) on the imaging surface of the first image sensor IS1. The first camera body 201 can include a first mounting seat that holds the first optical system 203. In addition to the photoelectric conversion element array, the first image sensor IS1 can also include a microlens array and a filter. Typically, no optical system with optical power is arranged between the first image sensor IS1 and the first optical system 203. The first position detector 6 can also include a first lighting system 202 that illuminates the first mark 81 (first detection object) when detecting the position of the first mark 81. The illumination method of the first illumination system 202 may be coaxial illumination or oblique incident illumination. The first position detector 6 and the discharge head 5 (second member) can be supported by the structure 207 . The second position detector 7 can include: a second camera body 206 including a second image sensor IS2; and a second optical system 204 that forms an image of the second mark 601 (second detection object) of the ejection head 5 (second component) on the shooting surface of the second image sensor IS2. The second camera body 206 can include a second mounting seat for holding the second optical system 204. In addition to the photoelectric conversion element array, the second image sensor IS2 can also include a microlens array and a filter. Typically, an optical system with optical focal length is not arranged between the second image sensor IS2 and the second optical system 204. The second position detector 7 can also include a second lighting system 205 that illuminates the second mark 601 when detecting the position of the second mark 601 (second detection object). The lighting method of the second lighting system 205 can be either coaxial lighting or oblique incident lighting. As will be described later, the second illumination system 205 can illuminate the first image sensor IS1 via the first optical system 203 when imaging the first image sensor IS1. The second position detector 7 can be supported by the substrate stage 3. The first position detector 6 and the second position detector 7 can be configured so as to be able to image the first image sensor IS1 using the second image sensor IS2 via the first optical system 203 and the second optical system 204. When viewed from the first optical system 203, the first image sensor IS1 side is the image plane side of the first optical system 203, and when viewed from the first optical system 203, the second optical system 204 side is the object side of the first optical system 203. The first optical system 203 can be an optical system in which both the first image sensor IS1 side (image plane side) and the second optical system 204 side (object side) are telecentric. In other words, the first optical system 203 can be a bilaterally telecentric optical system. When viewed from the second optical system 204, the second image sensor IS2 side is the image plane side of the second optical system 204, and when viewed from the second optical system 204, the first optical system 203 side is the object side of the second optical system 204. The second optical system 204 can be an optical system in which at least the first optical system 203 side (object side) is telecentric. The second optical system 204 may also be a double-sided telecentric optical system in which both the second image sensor IS2 side (image plane side) and the first optical system 203 side (object side) are telecentric. This configuration enables the first image sensor IS1 to be imaged by the second image sensor IS2 via the first optical system 203 and the second optical system 204. A second mark 601 (second detection object) is arranged on the ejection head 5 (second component). The relative position of the nozzle provided in the ejection head 5 and the second mark 601 is known. Therefore, by detecting the position of the second mark 601 by the second position detector 7, the position of the nozzle of the ejection head 5 can be detected. The second mark 601 can be arranged on the same surface as the surface on which the nozzles are arranged, or on a surface different from the surface on which the nozzles are arranged (a surface with a height difference). At least one of the multiple nozzles arranged in the ejection head 5 can also be used as the second mark 601. In addition, multiple second marks 601 can also be arranged on the ejection head 5. When detecting the position of the second mark 601, the focal plane of the second position detector 7 is consistent with the Z-direction position (height) of the second mark 601. For example, the substrate mounting table 3 can be driven by the actuator 11 so that the focal plane of the second position detector 7 is consistent with the Z-direction position (height) of the second mark 601. A plurality of first marks 81 are arranged on the substrate 2. The first position detector 6 can detect the X and Y position of the substrate 2 and its shape. When detecting the position of the first mark 81, the focal plane of the first position detector 6 coincides with the Z position (height) of the first mark. For example, the substrate stage 3 can be driven by the actuator 11 so that the focal plane of the first position detector 6 coincides with the Z position (height) of the first mark 81. A reference mark 701 can also be arranged on the substrate stage 3 to provide a reference for position detection. The first position detector 6 and the second position detector 7 can be configured so that the field of view of the second position detector 7 is larger than that of the first position detector 6. Furthermore, a plurality of first position detectors 6 and a plurality of second position detectors 7 may be provided. The positions of the first position detector 6 and the second position detector 7 may also be reversed. In this case, the first position detector 6 can be configured to detect the position of the second mark 601 of the ejection head 5, and the second position detector 7 can be configured to detect the position of the first mark 81 of the substrate 2. The first position detector 6 and the second position detector 7 can be configured so as to be able to image the second image sensor IS2 using the first image sensor IS1 via the second optical system 204 and the first optical system 203 . The following describes an example method for detecting the relative position of the first position detector 6 and the second position detector 7. First, the substrate stage 3 can be driven by the actuator 11 so that the focal plane of the first position detector 6 coincides with the focal plane of the second position detector 7. In this case, the amount of drive of the substrate stage 3 in the Z direction can be determined based on the respective configurations of the first and second position detectors 6, 7, their respective focal lengths, and other factors. Alternatively, the Z direction position (height) of the substrate stage 3 can be adjusted to a predetermined height based on the output of the height sensor 9. Alternatively, the Z direction position of the substrate stage 3 can be adjusted based on contrast information from an image captured by the second camera body 206 (second image sensor IS2) of the second position detector 7. For example, the Z direction position of the substrate stage 3 can be adjusted so that the grayscale change rate of brightness, obtained by differentiating the brightness value of the image (at the pixel position), reaches a maximum value or exceeds a threshold value. Illumination light from the second illumination system 205 travels in the +Z direction through the beam splitter within the second optical system 204, illuminating the first image sensor IS1 of the first camera body 201 via the first optical system 203. The first optical system 203 and the second optical system 204 form an image of the first image sensor IS1 on the imaging surface of the second image sensor IS2. In other words, the first image sensor IS1 and the second image sensor IS2 are arranged at optically conjugate positions. The image plane side and the object side of the first optical system 203 can be telecentric, and the object side of the second optical system 204 can be telecentric. The image plane side of the second optical system 204 can be either telecentric or non-telecentric. When imaging the first image sensor IS1 through the second image sensor IS2, the first illumination system 202 can be turned off to prevent halation. Next, with reference to FIG3 , the method by which the processor 13 determines the relative positions of the first position detector 6 and the second position detector 7 based on the image of the first image sensor IS1 captured by the second image sensor IS2 will be described. As illustrated in FIG3 , the second position detector 7 can be configured to capture an area including the entire imaging area 301 of the first image sensor IS1 through the second image sensor IS2. In FIG3 , the field of view 302 represents the field of view of the second position detector 7, i.e., the imaging area of ​​the second image sensor IS2. The imaging area 301 of the first image sensor IS1 is generally rectangular. The processor 13 can detect the relative positions of the first position detector 6 and the second position detector 7 in the X direction by detecting the X-direction position of the edge portion 303 of the short side of the imaging area 301 of the first image sensor IS1. For example, as shown in FIG4 , by differentiating the X-direction brightness distribution 402 of the edge portion 303 of the short side of the imaging region 301 of the first image sensor IS1 with respect to the position in the X direction, a differential waveform 403 can be obtained. Based on the peak position of the differential waveform 403, the processor 13 can obtain the X-position information of the edge portion 401 of the short side of the imaging region 301 of the first image sensor IS1 as the X-position information of the edge portion 303. Similarly, based on the Y-direction brightness distribution of the edge portion 305 of the long side of the imaging region 301 of the first image sensor IS1, the processor 13 can obtain the Y-position information of the edge portion 305 of the long side of the imaging region 301 of the first image sensor IS1 as the Y-position information of the edge portion 305. Alternatively, as shown in FIG5 , the X and Y position information of the corner 304 of the imaging area 301 within the field of view 302 can be obtained based on the correlation between the shape of the corner 501 of the imaging area 301 captured by the second image sensor IS2 and a pre-registered pattern 502. Furthermore, the processor 13 can also obtain the X and Y position information of the imaging area 301 within the field of view 302 by matching the image of the imaging area 301 captured by the second image sensor IS2 with the pattern of a pre-registered pattern. Alternatively, by driving the substrate stage 3 in the XY directions using the actuator 11, the edge portion 303, 304, or 305, the target of position detection, can be positioned at the center of the field of view 302. This allows the position of the first image sensor IS1 to be detected using information near the center of the optical axis. Consequently, the influence of aberrations between the first optical system 203 and the second optical system 204 can be reduced, allowing the position of the first image sensor IS1 (the relative position between the first image sensor IS1 and the second image sensor IS2 (the first position detector 6 and the second position detector 7)) to be detected with high precision. FIG6 schematically illustrates the detection of the X and Y position of the ejection head 5. The substrate stage 3 can be driven in the X and Y directions by the actuator 11 so that the second mark 601 disposed on the ejection head 5 is within the field of view of the second position detector 7. Furthermore, the substrate stage 3 can be driven in the Z direction by the actuator 11 so that the focal plane of the second position detector 7 coincides with the Z position of the second mark 601. The processor 13 can cause the second image sensor IS2 of the second position detector 7 to image the second mark 601 and calculate the relative position of the second mark 601 with respect to the second position detector 7 based on the image of the second mark 601. Here, the nozzle of the ejection head 5 or a component including a nozzle can also be used as the second mark 601. FIG7 schematically illustrates the detection of the X and Y position of the substrate 2. The substrate stage 3 can be driven in the X and Y directions by the actuator 11 so that the first mark 81 on the substrate 2 is within the field of view of the first position detector 6. Furthermore, the substrate stage 3 can be driven in the Z direction by the actuator 11 so that the focal plane of the first position detector 6 coincides with the Z-direction position of the first mark 81. The processor 13 can cause the first position detector 6 to capture an image of the first mark 81 on the substrate 2 and calculate the relative position of the first mark 81 with respect to the first position detector 6 based on the image of the first mark 81. As described above, based on the detection results of the relative positions of the first position detector 6 and the second position detector 7 in the X and Y directions, the position of the ejection head 5 in the X and Y directions, and the position of the substrate 2 in the X and Y directions, the ink 4 can be accurately configured on the destination area of ​​the substrate 2 through the ejection head 5. Furthermore, as shown in Figure 8 , wiring pattern 801 can be arranged around imaging area 301 of first imaging sensor IS1. Processor 13 can also detect the position of first imaging sensor IS1 by detecting the position of wiring pattern 801 based on pixels of first imaging sensor IS1 captured by second imaging sensor IS2. Since wiring pattern 801 is composed of multiple linear shapes, a large amount of edge information can be obtained for position detection, thereby improving the accuracy of position calculation. Furthermore, by performing position detection based on pattern matching on a unique wiring pattern within the field of view, erroneous pattern detection can be reduced. According to this embodiment, even if the relative position between the first position detector 6 and the ejection head 5 changes due to influences such as heat, the amount of change or the changed relative position can be detected by the second position detector 7. Furthermore, by capturing an image of the first image sensor IS1 via the second image sensor IS2 and performing image processing based on the image, the structure of the apparatus 1 or the position detection device can be simplified. In particular, to balance the need for larger substrates 2 and improved production cycle times, a large number of position detectors can be deployed within the apparatus. In such cases, this configuration is advantageous in terms of space and cost savings. Hereinafter, a method for manufacturing an article using the device 1 will be described. The method for manufacturing an article may include, for example, a configuration step of configuring droplets on a substrate using the device 1 and a step of processing the substrate on which the droplets are configured to obtain an article. The article may be, for example, an organic EL (OLED) panel. In the configuration step, droplets of ink, such as a solution (a solution containing a solute and a solvent for forming an organic film), may be configured or supplied to the substrate. The processing step may include, for example, a drying step of drying the droplets on the substrate through a reduced pressure drying device. In addition, the processing step may also include other well-known steps (calcination, cooling, dehumidification, dry cleaning, formation of electrodes, formation of a sealing film, etc.). Compared with previous methods, the method for manufacturing an article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article. While the above description specifically describes apparatus 1 as a device (printer) that places or supplies ink 4 onto substrate 2 (first component), the present invention is not limited thereto. For example, apparatus 1 may be a bonding device (die bonder) that places or bonds an integrated circuit to a printed circuit board. The bonding device includes a pickup unit and a bonding unit, and bonds bare dies (secondary components) arranged on a dicing tape affixed to a dicing frame at arbitrary locations on a wafer (first component). The pickup unit consists of a pickup head and a release head. The release head peels the dicing tape and die, while the pickup head absorbs the bonded die. The pickup head rotates and delivers the die to the placement head. For bonding methods such as hybrid bonding that involve surface activation, the bonding surface is preferably a highly stable surface such as a diamond-like carbon coating or a fluorine coating. To achieve high-precision alignment in the bonding apparatus, the wafer observation camera (first position detector 6) and the die observation camera (second position detector 7) must be aligned relative to each other. These observation cameras each comprise an image sensor, and this alignment is achieved by measuring the characteristic points of each observed object. As described above, the bonding apparatus can also provide a technology that facilitates the relative position detection of the two position detectors. The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the appended claims are intended to disclose the scope of the invention. 1: Device 2: Substrate 3: Substrate mounting table (holding portion) 4: Ink 5: Dispenser head 6: First position detector 7: Second position detector 8: Pixel array area 9: Height sensor 11: Actuator 12: Position measuring device 13: Processor 81: First mark 201: First camera body 202: First illumination system 203: First optical system 204: Second optical system 205: Second illumination system 206: Second camera body 207: Structure 301: Shooting area 302: Field of view 303: Edge 304: Corner 305: Edge 401: Edge 402: Brightness distribution 403: Differential waveform 501: Corner 502: Template 601: Second mark 701: Reference mark 801: Wiring pattern IS1: First image sensor IS2: Second image sensor FIG1 schematically illustrates the configuration of an apparatus according to one embodiment. FIG2 schematically illustrates a portion of the apparatus shown in FIG1. ​​FIG3 schematically illustrates an image of an imaging area of ​​a first imaging sensor captured by a second imaging sensor. FIG4 schematically illustrates a method for calculating the X-direction position of the imaging area of ​​the first imaging sensor based on an image of the first imaging sensor captured by the second imaging sensor. FIG5 schematically illustrates a method for calculating the X- and Y-direction positions of the imaging area of ​​the first imaging sensor based on an image of the first imaging sensor captured by the second imaging sensor. FIG6 schematically illustrates the detection of the X- and Y-direction positions of a dispensing head. FIG7 schematically illustrates the detection of the X- and Y-direction positions of a substrate. FIG8 schematically illustrates another method for detecting the position of the first imaging sensor using the second imaging sensor based on an image of the first imaging sensor. 2:Substrate 3: Substrate mounting table (holding part) 5: Spray head 6: 1st position detector 7: Second position detector 81: Mark 1 201: 1st camera body 202: 1st lighting system 203:1st optical system 204: Second optical system 205: Second Lighting System 206: Second camera body 207: Construct 601: Mark 2 701:Fix mark IS1: Image sensor 1 IS2: Second image sensor

Claims

1. A position detection device, comprising: a first position detector for detecting the position of a first detection object of a first member; and a second position detector for detecting the position of a second detection object of a second member disposed opposite to the first member; the first position detector comprising a first image sensor and a first optical system for forming an image of the first detection object on the imaging surface of the first image sensor; the second position detector comprising a second image sensor and a second optical system for forming an image of the second detection object on the imaging surface of the second image sensor; the first position detector and the second position detector being configured to be capable of capturing an image of the first image sensor using the second image sensor via the first optical system and the second optical system.

2. The apparatus of claim 1 further includes: a processor that detects the relative position of the first position detector and the second position detector based on an image of the first image sensor captured by the second image sensor.

3. The apparatus as claimed in claim 1, wherein, The first optical system is a telecentric optical system where both the first image sensor side and the second optical system side are telecentric; the second optical system is a telecentric optical system where at least the first optical system side is telecentric.

4. The apparatus as claimed in claim 1, wherein, The second image sensor captures the entire capture area of ​​the first image sensor.

5. The apparatus as claimed in claim 1, wherein, The second position detector is able to capture the entire area captured by the first image sensor through the second image sensor.

6. The apparatus as claimed in claim 1, wherein, The first position detector further includes a first illumination system that illuminates the first detection object when detecting the position of the first detection object; the second position detector further includes a second illumination system that illuminates the second detection object when detecting the position of the second detection object; the second illumination system illuminates the first image sensor via the first optical system when capturing the first image sensor.

7. The apparatus of claim 1 further includes: a drive mechanism for changing the relative position of the first member and the second member.

8. The apparatus of claim 7 further includes: a retaining portion for retaining the first member; wherein, The drive mechanism includes an actuator that drives the retaining part.

9. The apparatus as claimed in claim 8, wherein, The retaining part supports the second position detector.

10. The apparatus of claim 2, wherein, The processor detects the relative position of the first detected object and the second detected object based on the position of the first detected object detected by the first position detector, the position of the second detected object detected by the second position detector, and the position of the first position detector detected based on the image of the first image sensor captured by the second image sensor.

11. The apparatus of claim 10 further comprises: a structure supporting the second member and the first position detector.

12. The apparatus of claim 11, wherein, The second component includes a nozzle that ejects droplets to supply the first component with the droplets.

13. A method for manufacturing an article, comprising: the step of configuring droplets on a substrate using the apparatus of claim 12; and the step of processing the substrate configured with the droplets to obtain an article.

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