Test handler and method for controlling the same

Abstract

This invention relates to a test processor and its control method. Specifically, according to one embodiment of the invention, a test processor may be provided, comprising: a bag-shaped frame having a plurality of bag-shaped spaces for housing electronic components; and a plurality of shock-absorbing members disposed in the plurality of bag-shaped spaces for housing the electronic components, the shock-absorbing members being formed of an elastic material to absorb impacts applied to the electronic components when the electronic components fall toward the shock-absorbing members, thereby placing the electronic components on the shock-absorbing members, wherein in the bag-shaped frame, a plurality of walls are formed to protrude upward in a manner surrounding the shock-absorbing members.

Description

Test Processor and Control Method Thereof Field of the Invention The present invention relates to a test processor and a control method thereof. Background of the Invention Recently, with the development of the technical field related to electronic components such as semiconductor components, the demand for electronic components is increasing. In particular, there is a need for electronic components that are small in size and have improved functions. Accordingly, the size of electronic components is reduced, but the number of terminals of an electronic component increases, so that the number of terminals per unit area of the electronic component increases. In the case of such an electronic component, even under the same impact, the impact applied to one terminal is greater than that of an electronic component having a small number of terminals per unit area. Therefore, in the process of testing electronic components, it becomes more vulnerable to the impact applied to the electronic components. On the other hand, when manufacturing an electronic component through a predetermined manufacturing process, it is tested by a test handler and a tester, and classified by grade according to the test results. In this test process, the electronic component moves a predetermined path while being loaded on a test tray and is tested. However, the electronic components manufactured through a predetermined manufacturing process are loaded in a customer tray for supply, and in order to test them, they are transferred from the customer tray to the test tray through various workbenches including a buffer table. In addition, the electronic component passes through an opening unit in order to be placed on the test tray. In this way, in order to test the electronic component, it is loaded from the customer tray, passes through the workbench, the opening unit, and is gripped by a loading / unloading device multiple times until it is unloaded onto the test tray, and then undergoes a process of releasing the grip. At this time, when the loading / unloading device grips or releases the grip on the electronic component, a predetermined impact will be applied to the electronic component. In particular, in the process of vacuum-adsorbing the electronic component to grip the electronic component, the electronic component may be damaged due to the predetermined pressing force applied to the electronic component. For example, when the electronic component is pressed for vacuum adsorption, the terminal portion of the electronic component may be deformed, and the electronic component itself may be bent. As another example, electronic components with special uses may be manufactured in a form that is bent from the beginning to suit the purpose, and among the terminals of these electronic components, the outermost terminals can withstand a stronger impact than the terminals arranged inside. In this way, in the bent-shaped electronic component, the edge portion is more vulnerable to impact than the inside and may be subjected to greater damage. In addition, when the rigidity of the test tray is greater than that of the electronic component, placing the electronic component on the test tray or the like may damage the electronic component. In this way, when the electronic component is transferred for testing or is being tested, predetermined damage continues to accumulate, and when the number of terminals per unit area of the electronic component increases, the impact accumulated on one terminal becomes larger. This accumulation of impact becomes a factor in the degradation of the performance of the electronic component. Therefore, it is necessary to minimize the impact applied to the electronic component during the transfer of the electronic component for testing or during the testing process, and to prevent damage to the terminals of the electronic component. Summary of the Invention In view of the above background, embodiments of the present invention have been invented, providing a test processor to minimize the impact applied to the electronic component during the process of transferring the electronic component for testing and during the testing process, and to prevent damage to the terminals of the electronic component. According to an embodiment of the present invention, a test processor can be provided, including: a bag-shaped (pocket) frame having a plurality of bag-shaped spaces for accommodating electronic components; and a plurality of shock-absorbing components disposed in the plurality of bag-shaped spaces for placing the electronic components. The shock-absorbing components are formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the shock-absorbing component, so that the electronic component is placed on the shock-absorbing component. In the bag-shaped frame, a plurality of wall portions protrude upward in a manner surrounding the shock-absorbing component. Further, a test processor can be provided, where the shock-absorbing component includes: a first shock-absorbing component; and a second shock-absorbing component disposed on the upper side of the first shock-absorbing component. The surface friction coefficient of the second shock-absorbing component is less than that of the first shock-absorbing component, and the elastic force of the first shock-absorbing component is higher than that of the second shock-absorbing component. Further, a test processor can be provided, where a plurality of the wall portions are spaced apart from the shock-absorbing component by a predetermined distance in the horizontal direction, so that an air space is provided between the wall portion and the shock-absorbing component. When the electronic component is placed on the shock-absorbing component, a part of the electronic component is disposed in the air space. A bag-shaped (pocket) opening hole penetrating the bag-shaped frame is formed in the bag-shaped frame, and a buffer opening hole penetrating the shock-absorbing component is formed in the shock-absorbing component, and the buffer opening hole corresponds to the bag-shaped opening hole. Further, a test processor can be provided. The shock absorption component includes: a first shock absorption component; and a second shock absorption component disposed on the upper side of the first shock absorption component. The buffer opening holes include: a first buffer opening hole formed in the first shock absorption component to correspond to the bag-shaped opening hole; and a second buffer opening hole formed in the second shock absorption component to correspond to the first buffer opening hole. Further, a test processor can be provided, including: a main body; a bag-shaped frame detachably coupled to the main body, with a bag-shaped space formed in the bag-shaped frame for placing the electronic component; and a shock absorption component sandwiched between the bag-shaped frame and the main body, where the electronic component can be placed in the shock absorption component. The shock absorption component is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls towards the shock absorption component, so that the electronic component is placed on the shock absorption component. Further, a test processor can be provided. A bag-shaped groove portion is formed in the bag-shaped frame, and any part of the shock absorption component can be received in the bag-shaped groove portion. A main body groove portion is formed in the main body, and the other part of the shock absorption component can be received in the main body groove portion. The shock absorption component is fixedly supported on the bag-shaped frame and the main body by being received in the bag-shaped groove portion on one side and the main body groove portion on the other side. Further, a test processor can be provided, including: a main body; a bag-shaped frame detachably coupled to the main body, with a bag-shaped space formed in the bag-shaped frame for placing an electronic component; and a support component sandwiched between the bag-shaped frame and the main body, where the electronic component can be placed in the support component. A first opening hole and a plurality of second opening holes are formed in the support component. When the electronic component is placed on the support component, a part of the electronic component terminals can penetrate through the first opening hole, another part of the terminals of the electronic component can penetrate through the plurality of second opening holes, and the plurality of second opening holes can be formed along the periphery of the first opening hole. Further, a test processor can be provided. In the main body, a protruding portion for supporting the support component protrudes from one surface of the main body. A bag-shaped groove portion into which the support component can be inserted is formed in the bag-shaped frame. When the bag-shaped frame is combined with the main body, the support component is fixedly supported on the bag-shaped frame by inserting at least a part of the support component and the protruding portion into the bag-shaped groove portion. Further, a test processor can be provided. A first fixing element is provided in the bag-shaped frame. In the main body portion, a second fixing element for engaging with the first fixing element is formed. A support fixing hole is formed in the support member. The support fixing hole is provided at a position corresponding to the second fixing element and is used for engaging with any one of the first fixing element and the second fixing element. Any one of the first fixing element and the second fixing element fixes the support member to the main body portion by engaging with the other one of the first fixing element and the second fixing element in the support fixing hole. Further, a test processor can be provided, including: a test tray, the test tray including a tray frame and a holding unit. A receiving portion capable of accommodating an electronic component is formed in the tray frame. The holding unit can support the electronic component in the receiving portion so that the electronic component does not脱离 from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can脱离 from the receiving portion. The opening unit includes: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body. When the opening unit main body presses the holding unit, at least a part of it can be disposed inside the receiving portion. The buffer support member disposed inside the receiving portion is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the buffer support member, so that the electronic component is placed on the buffer support member. When the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic component disposed in the receiving portion is provided in the tray frame. When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. Further, a test processor can be provided, including: a test tray, the test tray including a tray frame and a holding unit, a receiving portion capable of accommodating an electronic component being formed in the tray frame, the holding unit being capable of supporting the electronic component in the receiving portion so that the electronic component does not脱离 from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can脱离 from the receiving portion, the opening unit including: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body, at least a part of which can be disposed inside the receiving portion when the opening unit main body presses the holding unit, the buffer support member disposed inside the receiving portion being formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component disposed on the buffer support member, when the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic component disposed in the receiving portion being provided in the tray frame, when the buffer support member is disposed inside the receiving portion, an upper surface of the buffer support member is located above an upper end of the tray support portion. Further, a test processor can be provided, including: a test tray, the test tray including a tray frame, a tray support member, and a holding unit, a receiving portion capable of accommodating an electronic component being formed in the tray frame, the tray support member being used for supporting between a plurality of terminals of the electronic component disposed in the receiving portion, the holding unit being capable of supporting the electronic component on the tray support member so that the electronic component does not脱离 from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can脱离 from the receiving portion, the opening unit including: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body, formed of an elastic material, an opening hole being formed in the tray support member, at least a part of terminals of the electronic component being capable of passing through the opening hole when the electronic component is disposed in the tray support member. Further, a test processor can be provided, when the electronic component falls toward the tray support member or a predetermined pressure is applied to the electronic component disposed on the tray support member, the buffer support member is in close contact with a bottom surface of the tray support member to absorb an impact applied to the tray support member and the electronic component and support the electronic component exposed through the opening hole. Furthermore, a test processor control method can be provided, including: a moving step, in which a loading device moves above a receiving portion of a tray frame while holding an electronic component; a rising step, in which the open unit main body is raised so that a buffer support member supported by the open unit main body is in close contact with the bottom surface of a tray support member supported under the tray frame; a gripping release step, in which the loading device releases the gripping of the electronic component so that the electronic component falls toward the receiving portion; a shock absorption step, in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member, thereby absorbing the shock applied to the electronic component when the electronic component falls toward the tray support member; and a lowering step, in which the open unit main body is lowered so that the buffer support member is spaced apart from the bottom surface of the tray support member. In the lowering step, when the open unit main body is lowered, at least a part of a plurality of terminals of the electronic component is inserted into the open hole. Furthermore, a test processor control method can be provided, including: a moving step, in which an unloading device moves above the receiving portion in order to hold an electronic component in the receiving portion of a tray frame; a rising step, in which the open unit main body is raised so that a buffer support member supported by the open unit main body is in close contact with the bottom surface of a tray support member supported under the tray frame; a gripping step, in which the unloading device grips the electronic component supported by the tray support member; a shock absorption step, in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member, thereby absorbing the shock applied to the electronic component when a predetermined pressure is applied to the electronic component in the gripping step; and a lowering step, in which the open unit main body is lowered so that the buffer support member is spaced apart from the bottom surface of the tray support member. In the rising step, when the open unit main body is raised, at least a part of the terminals of the electronic component rises while being inserted into the open hole. Furthermore, a test processor control method can be provided, further including an opening step of opening a holding unit to support the electronic component by the tray support member or to detach the electronic component from the tray support member. In the rising step, the open unit main body is raised to a predetermined position so that the open unit main body presses the holding unit. According to an embodiment of the present invention, there is an effect of minimizing the shock applied to an electronic component during the process of transferring the electronic component for testing and during the testing process, and preventing damage to the terminals of the electronic component. Detailed implementation manner Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the accompanying drawings. In addition, when describing the present invention, when it is determined that a detailed description of a related well-known configuration or function may obscure the gist of the present invention, its detailed description will be omitted. In addition, when it is mentioned that a certain component is "connected", "supported", or "coupled" to another component, it should be understood that it can be directly connected, supported, or coupled to the other component, but the other component may be present in the middle. The terms used in this specification are only for describing specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, singular expressions include plural expressions. In addition, ordinal terms including first, second, etc. can be used to describe various components, but the corresponding components are not limited by these terms. These terms are only for the purpose of distinguishing one component from another. As used in the specification, the meaning of "including" will embody specific features, regions, integers, steps, actions, elements, and / or components, without excluding the existence or addition of other specific features, regions, integers, steps, actions, elements, components, and / or groups. In addition, in this specification, expressions such as upper part and upper surface described based on the drawings can be expressed in different ways as long as the direction of the corresponding object is changed. Hereinafter, the specific configuration of the test processor 1 according to an embodiment of the present invention will be described with reference to the drawings. Hereinafter, referring to FIG. 1, the test processor 1 according to an embodiment of the present invention can test electronic components manufactured through a manufacturing process, classify them according to grades based on the test results, and load them into customer trays T1 and T2. In addition, the test processor 1 can be detachably coupled to a tester (not shown). Such a test processor 1 can include a loading device 10, a test tray 20, a chamber 30, an unloading device 40, a stacker module 50, and a control unit 60. The loading device 10 can load the electronic components loaded in the first customer tray T1 into the test tray 20. Here, the electronic components placed on the first customer tray T1 are the electronic components before being tested. The specific configuration of the loading device 10 will be described hereinafter. The test tray 20 has a space for placing the electronic components to be tested and can circulate along a predetermined path to test the electronic components. In addition, the test tray 20 can place the electronic components that have completed the test. The chamber 30 can include a wetting chamber 31, a test chamber 32, and a non-wetting chamber 33. The wetting chamber 31 can preheat or precool the electronic components loaded on the test tray 20 transferred from the loading position LP according to the test conditions. The test chamber 32 can provide a space in which the electronic components preheated or precooled in the wetting chamber 31 and transferred into the interior of the test chamber 32 are tested. The non-wetting chamber 33 can be heated or cooled inside the test chamber 32 to assimilate the electronic components that have completed the test to the temperature required for unloading. The unloading device 40 can classify the electronic components loaded in the test tray 20 transferred from the non-wetting chamber 33 according to the test level, and unload them onto the second customer tray T2. Here, the electronic components placed on the second customer tray T2 are the electronic components that have completed the test. The stacker module 50 can store the first customer tray T1 and the second customer tray T2 loaded with electronic components. The controller 60 can control the driving of the loading device 10 and the unloading device 40. Such a control unit 60 can be implemented by an arithmetic device including a microprocessor, a measuring device such as a sensor, and a memory, and this implementation method is obvious to those skilled in the art, so further detailed description is omitted. On the other hand, in this specification, the first customer tray T1 and the second customer tray T2 have been separately described as loading the electronic components before / after the test, but this is only an example to help understand the specification. In actual engineering, the first customer tray T1 and the second customer tray T2 can be mixed during the loading and unloading processes, and can have the same shape and structure. Hereinafter, the detailed configuration of the loading device 10 according to the first embodiment of the present invention will be described with reference to FIGS. 2 and 3. The loading device 10 can include a workbench 100 and a hand 200. The workbench 100 can provide a space for temporarily placing a plurality of electronic components loaded on the first customer tray T1 before being loaded on the test tray 20, or a plurality of electronic components loaded on the test tray 20 before being loaded on the second customer tray T1. Such a workbench 100 can be arranged between the customer trays T1, T2 and the test tray 20. In addition, the workbench 100 can include a bag-shaped frame 110 and a shock absorption member 120. The bag-shaped frame 110 can provide a space for placing electronic components. An accommodation part 111 and a wall part 112 can be formed in such a bag-shaped frame 110, and a bag-shaped space P can be formed as a space for placing electronic components. The shock absorption member 120 can be arranged on the accommodation part 111, and the electronic components can be arranged in the shock absorption member 120. Such an accommodation part 111 can be formed on one surface of the bag-shaped frame 110. In addition, a bag-shaped opening 111a penetrating the bag-shaped frame 110 can be formed in the accommodation part 111. The wall portion 112 can guide the movement of the electronic component so that the electronic component descending toward the shock absorption component 120 can be placed on the shock absorption component 120. A plurality of such wall portions 112 can be provided, and the plurality of wall portions 112 can protrude upward to surround the shock absorption component 120. Additionally, the plurality of wall portions 112 can have a predetermined inclination toward the shock absorption component 120. The bag-shaped space P can be the space where the electronic component is disposed inside the bag-shaped frame 110, and can refer to the space surrounded by the plurality of wall portions 112 and the shock absorption component 120. A plurality of such bag-shaped spaces P can be formed, and a plurality of electronic components can be disposed in the plurality of bag-shaped spaces P. When the electronic component is disposed in the bag-shaped space P, the shock absorption component 120 can provide a portion for placing the electronic component. Additionally, the shock absorption component 120 can absorb the shock applied to the electronic component. For example, when the electronic component falls toward the shock absorption component 120, the shock absorption component 120 can absorb the shock applied to the electronic component. Such a shock absorption component 120 can include a material having an elastic material advantageous for shock absorption. For example, it can include silicon Si. A plurality of such shock absorption components 120 can be provided, and the plurality of shock absorption components 120 can be disposed in the plurality of bag-shaped spaces P. Additionally, the shock absorption component 120 can include a material having excellent lubricity. For example, the upper surface of the shock absorption component 120 can be made of a material having excellent lubricity (i.e., a material having a low frictional resistance) to minimize the frictional force between the shock absorption component 120 and the electronic component. In this way, when the upper surface of the shock absorption component 120 includes a material with low frictional resistance so that the electronic component is placed on the shock absorption component 120, it is possible to prevent the electronic component from sliding off the shock absorption component 120 or being poorly placed. As another example, the surface of the shock absorption component 120 can be formed as a flat surface without irregularities to prevent poor placement of the electronic component. The shock absorption component 120 is disposed on the placement portion 111 and can be fixedly supported on the placement portion 111. For example, the shock absorption component 120 can be adhered to the upper surface of the placement portion 111 by an adhesive (not shown). Additionally, the shock absorption member 120 can have a predetermined thickness, and in the shock absorption component 120, a buffer opening hole 120a penetrating the shock absorption component 120 in the thickness direction (e.g., the up-down direction in FIG. 3) can be formed. Such a buffer opening hole 120a can be formed in the shock absorption component 120 to correspond to the bag-shaped opening hole 111a. Thus, the bag-shaped opening hole 111a and the buffer opening hole 120a can communicate with each other. Additionally, when an electronic component is disposed on the shock absorption component 120, the buffer opening hole 120a can prevent an air layer from being formed between the electronic component and the shock absorption component 120, so that the electronic component is spaced apart from the shock absorption component 120. The hand 200 can hold a plurality of electronic components placed on the customer tray T1 and transfer them to the workbench 100, and can be placed on the shock absorption component 120. Additionally, the hand 200 can hold a plurality of electronic components placed on the workbench 100 and transfer them to the test tray 20. Additionally, the hand 200 can release the holding of the electronic component from the upper side of the shock absorption component 120 to make it fall. For example, the hand 200 can hold the electronic component by a predetermined vacuum pressure. On the other hand, when the hand 200 holds the electronic component, an impact may be applied to the electronic component due to the pressure exerted by the hand 200, but such an impact can be minimized by the shock absorption component 120. In other words, when the hand 200 holds the electronic component, the impact applied to the electronic component can be absorbed by the shock absorption component 120 through the elastic force of the shock absorption component 120. In this way, there is an effect that the impact applied to the electronic component by the shock absorption component 120 is minimized. As another example, since the rigidity of the placement portion 111 is greater than the rigidity of the electronic component, when the hand 200 places the electronic component in the bag-shaped space P, if the electronic component falls and is immediately placed on the placement portion 111, an impact will be applied to the electronic component. However, when the hand 200 releases the holding of the electronic component, the electronic component is placed on the shock absorption component 120 having an elastic force, thereby minimizing the impact applied to the electronic component. Additionally, there is an effect that by including a material with low frictional resistance on the upper surface of the shock absorption component 120, even if the electronic component is placed on the upper surface of the shock absorption component 120, it will not detach from the shock absorption component 120 and can be placed at a predetermined position. On the other hand, the hand 200 can also be provided in the unloading device 40. The hand 200 provided in the unloading device 40 can transfer the electronic components placed on the test tray 20 to the second customer tray T2. In addition, the hand 200 provided in the loading device 10 can be named the first hand 200, and the hand 200 provided in the unloading device 40 can be named the second hand 200. On the other hand, in addition to these configurations, according to the second embodiment of the present invention, the shock absorption member 120 may include a first shock absorption member 121 and a second shock absorption member 122. Hereinafter, the second embodiment of the present invention will be further described with reference to FIG. 4. When describing the second embodiment, the differences compared with the above embodiment will be mainly described, and the same description and reference numerals are referred to the above embodiment. Referring to FIG. 4, the shock absorption member 120 may include a first shock absorption member 121 and a second shock absorption member 122, and the buffer opening 120a may include a first buffer opening 121a and a second buffer opening 122a. The first shock absorption member 121 may be provided on the placement portion 111 and may be formed of an elastic material. The elastic force of such a first shock absorption member 121 may be higher than the elastic force of the second shock absorption member 122. In addition, the first shock absorption member 121 may have a first buffer opening 121a formed in the first shock absorption member 121 to correspond to the bag-shaped opening 111a. The second shock absorption member 122 may be provided on the first shock absorption member 121 and may provide a portion on which the electronic components are placed. In addition, a second buffer opening 122a penetrating the second shock absorption member 122 in the thickness direction (for example, the up and down direction in FIG. 4) may be formed in the second shock absorption member 122. Such a second shock absorption member 122 may have a predetermined elastic force and have a frictional resistance smaller than that of the first shock absorption member 121. For example, the second shock absorption member 122 may include an engineering plastic having high lubricity due to low frictional resistance. In a more detailed example, the second shock absorption member 122 may include at least one of nylon, mPPO, PC, Acetal, and PBT. In this way, since the second shock absorption member 122 has a low frictional resistance, when the electronic component is placed on the second shock absorption member 122, the electronic component has the effect of being placed on the second shock absorption member 122 without detaching from the second shock absorption member 122. In addition, it has the following effects: Since the second shock-absorbing member 122 and the first shock-absorbing member 121 have elastic forces, when an electronic component is placed on the second shock-absorbing member 122, due to the elasticity of the first shock-absorbing member 121, the shock between the second shock-absorbing member 121 and the electronic component will be absorbed by the first shock-absorbing member 121. Therefore, when an electronic component is placed on the second shock-absorbing member 122, it has the effect of minimizing the shock applied to the electronic component. On the other hand, in addition to this configuration, according to the third embodiment of the present invention, the wall portion 112 can be spaced apart from the shock-absorbing member 120. Hereinafter, the third embodiment of the present invention will be further described with reference to FIGS. 5 and 6. When describing the third embodiment, the differences compared with the above embodiments will be mainly described, and the same descriptions and reference numerals refer to the above embodiments. Referring to FIGS. 5 and 6, the workbench 100 may include a bag-shaped frame 110 and a shock-absorbing member 120. A bag-shaped opening hole 111a penetrating the bag-shaped space P may be formed in the bag-shaped frame 110. A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may protrude upward to surround the shock-absorbing member 120. In addition, the plurality of wall portions 112 may be spaced apart from the shock-absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart from the surface of the shock-absorbing member 120 facing the wall portion 112 by a predetermined distance. In this way, an interspace S can be provided between the wall portion 112 and the shock-absorbing member 120 by spacing the plurality of wall portions 112 from the shock-absorbing member 120. The terminal portion of the electronic component may be provided in the interspace S. For example, a plurality of terminals may be arranged at the edge of the electronic component. In addition, when the electronic component is placed on the shock-absorbing member 120, the edge of the electronic component may be arranged in the interspace S without being placed on the shock-absorbing member 120. In this case, since the terminals of the electronic component do not contact the shock-absorbing member 120, they can be protected from the shock generated by contacting the shock-absorbing member 120. In addition, a buffer opening hole 120a penetrating the shock-absorbing member 120 may be formed in the shock-absorbing member 120 in a manner corresponding to the bag-shaped opening hole 111a. On the other hand, the terminals of the electronic component can be formed not only on the entire front surface of the electronic component but also concentratedly formed at the edge of the electronic component. When such an electronic component is bent with a predetermined curvature, the load is reduced at the center portion, and the load is concentratedly applied to the terminals at the edge. However, according to the third embodiment of the present invention, since an air space S is formed between the wall portion 112 and the shock absorption member 120, the terminals formed at the edge portion of the electronic component can be placed in the air space S. Accordingly, there is an effect of protecting the terminals formed at the edge portion of the electronic component from the shock generated by contact with the shock absorption member 120. On the other hand, in addition to this configuration, according to the fourth embodiment of the present invention, the wall portion 112 can be spaced apart from the first shock absorption member 121 and the second shock absorption member 122. Hereinafter, the fourth embodiment of the present invention will be further described with reference to FIG. 7. When describing the fourth embodiment, the differences compared with the above embodiments will be mainly described, and the same descriptions and reference numerals refer to the above embodiments. Referring to FIG. 7, the workbench 100 can include a bag-shaped frame 110 and a shock absorption member 120. The shock absorption member 120 can include a first shock absorption member 121 and a second shock absorption member 122, and the buffer opening hole 120a can include a first buffer opening hole 121a and a second buffer opening hole 122a. The first shock absorption member 121 can be disposed on the placement portion 111 and can be formed of an elastic material. The elastic force of such a first shock absorption member 121 can be higher than the elastic force of the second shock absorption member 122. In addition, the first shock absorption member 121 can have a first buffer opening hole 121a formed in the first shock absorption member 121 to correspond to the bag-shaped opening hole 111a. The second shock absorption member 122 can be disposed on the first shock absorption member 121 and can be fixedly supported on the first shock absorption member 121. For example, the second shock absorption member 122 can be adhered to the upper surface of the first shock absorption member 121 by an adhesive (not shown). Such a second shock absorption member 122 can have a predetermined thickness, and a second buffer opening hole 122a penetrating the second shock absorption member 122 in the thickness direction (for example, the up and down direction in FIG. 7) is formed in the second shock absorption member 122. The second buffer opening hole 122a may be formed in the second shock absorbing member 122 in a manner corresponding to the first buffer opening hole 121a. Accordingly, the second buffer opening hole 122a and the first buffer opening hole 121a may communicate with each other. In addition, the second buffer opening hole 122a may prevent an air layer from being formed between the electronic component and the second shock absorbing member 122 when the electronic component is disposed on the second shock absorbing member 122, so that the electronic component is spaced apart from the second shock absorbing member 122. A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may protrude upward to surround the first shock absorbing member 121 and the second shock absorbing member 122. In addition, the plurality of wall portions 112 may be spaced apart from the shock absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart from a surface of the shock absorbing member 120 facing the wall portions 112 by a predetermined distance. In this manner, an empty space S may be formed between the plurality of wall portions 112 and the first shock absorbing member 121 and the second shock absorbing member 122 by spacing the plurality of wall portions 112 apart from the first shock absorbing member 121 and the second shock absorbing member 122. Terminal portions of the electronic component may be disposed in the empty space S. For example, a plurality of terminals may be disposed at an edge of the electronic component. In addition, when the electronic component is disposed on the second shock absorbing member 1220, an edge of the electronic component may be disposed in the empty space S without being disposed on the second shock absorbing member 122. In this case, since the terminals of the electronic component do not contact the second shock absorbing member 122, they may be protected from impacts generated by contact with the second shock absorbing member 122. In this manner, by forming the empty space S, there is an effect of protecting the terminals of the electronic component from impacts generated by contact with the second shock absorbing member 122. In addition, when the electronic component is disposed on the second shock absorbing member 122, due to the elasticity of the first shock absorbing member 121, there is an effect that the shock between the second shock absorbing member 122 and the electronic component is absorbed by the first shock absorbing member 121. Accordingly, when the electronic component is disposed on the second shock absorbing member 122, there is an effect that the shock applied to the electronic component may be minimized. On the other hand, in addition to this configuration, according to a fifth embodiment of the present invention, the workbench 100 may further include a main body portion 140. Hereinafter, the fifth embodiment of the present invention will be further described with reference to FIGS. 8 to 10. When describing the fifth embodiment, differences from the above-described embodiments will be mainly described, and the same descriptions and reference numerals refer to the above-described embodiments. Referring to FIG. 8, the workbench 100 can provide a space in which a plurality of electronic components loaded in the customer tray T1 are temporarily placed before being loaded into the test tray 20. Such a workbench 100 may include a bag-shaped frame 110, a buffer member 120, and a main body portion 140. Referring to FIG. 9, the bag-shaped frame 110 can provide a space for placing electronic components. In addition, the bag-shaped frame 110 can be detachably coupled to the main body portion 140. A plurality of such bag-shaped frames 110 can be provided, and the plurality of bag-shaped frames 110 can be supported by the main body portion 140. In addition, a plurality of bag-shaped spaces P can be formed in the plurality of bag-shaped frames 110. A wall portion 112, a bag-shaped groove portion 113, and a correction hole 114 can be formed in the bag-shaped frame 110. A plurality of wall portions 112 can be provided, and the plurality of wall portions 112 can be formed to protrude upward to surround the buffer member 120. In addition, the plurality of wall portions 112 and the buffer member 120 can together form a bag-shaped space P, which is a space for the electronic components to be disposed inside the bag-shaped space P. A plurality of such bag-shaped spaces P can be formed. Referring to FIG. 10, the bag-shaped groove portion 113 can provide a portion that houses a part of the buffer member 120. Such a bag-shaped groove portion 113 can be a portion formed by being introduced from the bag-shaped frame 110, and can prevent the buffer member 120 housed in the bag-shaped groove portion 113 from detaching. When the bag-shaped frame 110 is coupled to the main body portion 140, the correction hole 114 can be engaged with the correction pin 143 of the main body portion 140 to correct the positions of each other. For example, the positions of the bag-shaped frame 110 and the main body portion 140 relative to each other can be corrected by inserting the correction pin 143 into the correction hole 114. A plurality of such correction holes 114 can be formed. When the electronic components are placed in the bag-shaped space P, the buffer member 120 can provide a portion for placing the electronic components. In addition, the buffer member 120 can be provided to absorb the impact applied to the electronic components. For example, the buffer member 120 can be in the shape of a pad extending in one direction and can include silicon (Si). A plurality of such buffer members 120 can be provided, and the plurality of buffer members 120 can be supported by the main body portion 140. In addition, when the bag-shaped frame 110 is coupled to the main body portion 140, the buffer member 120 can be sandwiched between the bag-shaped frame 110 and the main body portion 140. For example, a part of the buffer member 120 can be housed in a main body groove portion 141 (described later) of the main body portion 140, and another part of the buffer member 120 can be housed in the bag-shaped groove portion 113 of the bag-shaped frame 110. In this way, the buffer member 120 is inserted into the bag-shaped groove portion 113 and the main body groove portion 141, so that it can be fixedly supported at a predetermined position without detaching from the bag-shaped frame 110 and the main body portion 140. On the other hand, the buffer member 120 is disposed on the main body groove portion 141 and can be fixedly supported on the main body portion 140. For example, the buffer member 120 can be adhered to the upper surface of the main body groove portion 141 by an adhesive (not shown). Additionally, the buffer member 120 can have a predetermined thickness, and a buffer opening hole 120a penetrating the buffer member 120 in the thickness direction can be formed in the buffer member 120. Such a buffer opening hole 120a can be formed at a position corresponding to a main body opening hole 142 described later. Therefore, the buffer opening hole 120a and the main body opening hole 142 can communicate with each other. Further, when an electronic component is placed on the buffer member 120 through the buffer opening hole 120a, an air layer is formed between the electronic component and the buffer member 120 to prevent the electronic component from being spaced apart from the buffer member 120. Referring again to FIG. 9, the main body portion 140 can support a plurality of bag-shaped frames 110 and can support a plurality of buffer members 120. The main body groove portion 141, the main body opening hole 142, and the correction pin 143 can be formed in the main body portion 140. The main body groove portion 141 can support the buffer member 120 and can provide a portion for accommodating a part of the buffer member 120. In other words, when a part of the buffer member 120 is accommodated in the main body groove portion 141, the main body groove portion 141 can fixedly support the buffer member 120. The main body opening hole 142 can be formed to penetrate the main body portion 140 and can be formed in the main body groove portion 141. Such a main body opening hole 142 can communicate with the buffer opening hole 120a. When the bag-shaped frame 110 is combined with the main body portion 140, the correction pin 143 can be engaged with the correction hole 114, thereby correcting the positions between them. For example, the correction pin 143 can be formed to protrude from the main body portion 140 to be inserted into the correction hole 114. A plurality of such correction pins 143 can be provided and can be engaged with a plurality of correction holes 114 formed in a plurality of bag-shaped frames 110. In this way, there is an effect that by engaging the correction pin 143 with the correction hole 114, the relative positions of the bag-shaped frame 110 and the main body portion 140 can be corrected so that they can be combined with each other. Further, by inserting the buffer member 120 into the bag-shaped groove portion 113 and the main body groove portion 141, it will not be detached from the bag-shaped frame 110 or the main body portion 140 and can be fixedly supported. When an electronic component is placed, there is an effect that the impact applied to the electronic component can be more stably absorbed. In addition, since the main body portion 140 and the bag-shaped frame 110 are provided separately, when the buffer member 120 is disposed on the main body portion 140, there is an effect that it can be set more easily and quickly. On the other hand, in addition to this configuration, according to the sixth embodiment of the present invention, the workbench 100 may further include a support member 150. Hereinafter, the sixth embodiment of the present invention will be further described with reference to FIGS. 11 to 15. When describing the sixth embodiment, the differences compared with the above embodiments will be mainly described, and the same descriptions and reference numerals refer to the above embodiments. Referring to FIGS. 11 and 12, the workbench 100 may include a bag-shaped frame 110, a main body portion 140, and a support member 150. A wall portion 112, a bag-shaped groove portion 113, a correction hole 114, and a fixing pin 115 may be formed in the bag-shaped frame 110. Referring to FIG. 13, the bag-shaped groove portion 113 may provide a portion into which at least a part of the support member 150 and a protruding portion 144 described later are inserted. Such a bag-shaped groove portion 113 may be a portion introduced into the bag-shaped frame 110 and may prevent the support member 150 inserted into the bag-shaped groove portion 113 from detaching from the bag-shaped frame 110. The fixing pin 115 may fix the support member 150 to the protruding portion 144 of the main body portion 140. Such a fixing pin 115 may be inserted through a support fixing hole 153 described later and may engage with a main body fixing hole 145 described later. For example, when the bag-shaped frame 110, the support member 150, and the main body portion 140 are sequentially arranged, the fixing pin 115 will be sequentially inserted into the support fixing hole 153 and the main body fixing hole 145 to fix the support member 150 to the protruding portion 144. A plurality of such fixing pins 115 may be provided, and the plurality of fixing pins 115 may protrude and be formed. Referring to FIGS. 12 and 14, a main body opening hole 142, a correction pin 143, a protruding portion 144, and a main body fixing hole 145 may be formed in the main body portion 140. The protruding portion 144 may support the support member 150 and may provide a portion for placing the support member 150. Such a protruding portion 144 may be a portion protruding from the main body portion 140 by a predetermined height. In addition, the protruding portion 144 may be inserted into the bag-shaped groove portion 113 together with the support member 150. The main body fixing hole 145 can be engaged with the fixing pin 115 to fix the support member 150. For example, the main body fixing hole 145 can be formed through the main body portion 140 to insert the fixing pin 115. Additionally, a plurality of main body fixing holes 145 can be formed, and the plurality of main body fixing holes 145 can be formed on the protruding portion 144. The above-mentioned fixing pin 115 and main body fixing hole 145 can be respectively named the first fixing element 115 and the second fixing element 145, and can be deformed such that the first fixing element 115 has a hole shape and the second fixing element 145 has a pin shape. Therefore, either one of the first fixing element 115 and the second fixing element 145 is engaged with the other one of the first fixing element 115 and the second fixing element 145 on the support fixing hole 153 to fix the support member 150 to the main body portion 140. Referring to FIG. 15, the support member 150 can be provided to support the electronic component. For example, such a support member 150 can be provided as a film for supporting the electronic component. Additionally, the support member 150 can be supported on the protruding portion 144 and can be disposed on the upper surface of the protruding portion 144. When the bag-shaped frame 110 is combined with the main body portion 140, such a support member 150 can be sandwiched between the bag-shaped frame 110 and the main body portion 140. For example, the support member 150 can be inserted into the bag-shaped groove portion 113 to be supported by the bag-shaped frame 110. The first opening hole 151, the second opening hole 152, and the support fixing hole 153 can be formed in the support member 150. When the electronic component is supported by the support member 150, a part of the terminals of the electronic component can penetrate through the first opening hole 151. For example, the terminals formed in the central portion of the electronic component can penetrate through the first opening hole 151. Such a first opening hole 151 penetrates the support member 150 in the thickness direction of the support member 150, and can be formed in the central portion of the support member 150. When the electronic component is supported by the support member 150, some of the terminals of the electronic component can penetrate through the second opening hole 152. For example, the terminals formed at the edge of the electronic component can penetrate through the second opening hole 152. Such a second opening hole 152 surrounds the first opening hole 151 along the periphery of the first opening hole 151, and penetrates the support member 150 in the thickness direction of the support member 150. Additionally, a plurality of second opening holes 152 can be formed. On the other hand, the depths of the first opening hole 151 and the second opening hole 152 in the thickness direction of the support member 150 can be the same as the thickness t of the support member 150. Additionally, the first opening hole 151 and the second opening hole 152 can be formed in the support member 150 in a manner equal to or deeper than the terminal length of the electronic component. The support fixing hole 153 may penetrate through the support member 150 to insert the fixing pin 115. Such a support fixing hole 153 may be formed at a position corresponding to the main body fixing hole 145. Therefore, the fixing pin 115 inserted into the support fixing hole 153 may be inserted into the main body fixing hole 145, and the support member 150 may be fixedly supported on the protruding portion 144. In this way, since the first opening hole 151 and the second opening hole 152 are formed on the support member 150, there is an effect that various types of electronic components can be placed on the support member 150 regardless of the number of terminals. In addition, there is an effect that the support member 150 is inserted into the fixing pin 115 and into the bag-shaped groove portion 113 without detaching from the protruding portion 144. On the other hand, in addition to this configuration, according to the seventh embodiment of the present invention, the loading device 10 may further include an opening unit 300. Hereinafter, the seventh embodiment of the present invention will be further described with reference to FIGS. 16 to 20. When describing the seventh embodiment, the differences compared with the above embodiments will be mainly described, and the same descriptions and reference numerals refer to the above embodiments. Referring to FIGS. 16 and 17, the loading device 10 may further include an opening unit 300. The opening unit 300 may convert the following holding unit 22 of the test tray 20 into a released state or a state of preventing detachment. Such an opening unit 300 may move in a direction away from or close to the test tray 20 to load electronic components. In addition, the opening unit 300 may include a driving device (not shown) such as a hydraulic piston for such movement. However, in this specification, it is described that the opening unit 300 approaches or moves away from the test tray 20, but this is only an example, and the test tray 20 may also approach or move away from the opening unit 300. Such an opening unit 300 may include an opening unit main body 310, a support member 320, and an elastic unit 330. The opening unit main body 310 may support the support member 320 and open the holding unit 22 of the test tray 20. A recess 311, an opening protrusion 312, a positioning protrusion 313, and an anti-adhesion protrusion 314 may be formed in such an opening unit main body 310. The recess 311 may be formed on one side of the opening unit main body 310, and such one side may be the surface on the test tray 20 side. The support member 320 may be received in such a recess 311, and a groove 311a may be provided for receiving the elastic unit 330. The opening protrusion 312 may operate the holding unit 22. Such an opening unit 300 may be provided adjacent to the recess 311 and may protrude toward the test tray 20. In addition, the opening protrusion 312 may be formed on the opening unit main body 310 to correspond to the holding unit 22. The positioning protrusion 313 can guide the relative movement between the test tray 20 and the opening unit 300, so that the opening protrusion 312 can act on the holding unit 22. In other words, the opening protrusion 312 can be guided to the holding unit 22 with higher accuracy through the positioning protrusion 313. When the opening unit 300 approaches the test tray 20, the anti-sticking protrusion 314 can prevent the opening unit 300 from getting too close to the test tray 20. Therefore, even when the opening protrusion 312 operates the holding unit 22, the opening unit 300 can be kept at a predetermined distance from the test tray 20. Referring to FIG. 18, the support member 320 can be supported by the opening unit main body 310 to move forward and backward in a direction away from the opening unit main body 310. For example, the support member 320 can move in the recess 311 of the opening unit main body 310 in a direction away from the opening unit main body 310, and can move in a direction approaching the opening unit main body 310. Such a support member 320 can support the electronic component housed in the test tray 20 in a released state. Such a support member 320 can include a support body 321 and a buffer support member 322. The support body 321 can support the elastic unit 330. For this purpose, an elastic member groove 321a can be formed in the support body 321. The buffer support member 322 can provide a portion for placing the electronic component in the accommodation portion 21a described later. Such a buffer support member 322 can be inserted into the accommodation portion 21a in the unlocked state of the holder 22a, and the electronic component can be supported by the buffer support member 322. The area of the surface of the buffer support member 322 in contact with the electronic component can be wider than the area of the surface of the tray support portion 21b described later in contact with the electronic component, and the buffer support member 322 is located between the tray support portions 21b in the released state. In addition, when the buffer support member 322 is provided inside the accommodation portion 21a, the upper surface of the buffer support member 322 can be located above the upper end of the tray support portion 21b. The buffer support member 322 can be provided to absorb the impact applied to the electronic component. For example, if the hand 200 releases the grip on the electronic component on the accommodation portion 21a, the buffer support member 322 can absorb the impact applied to the electronic component when the electronic component is placed on the buffer support member 322. As another example, when the hand 200 grips the electronic component provided in the accommodation portion 21a, if a predetermined pressure is applied to the electronic component, the buffer support member 322 can absorb the impact applied to the electronic component. Such a buffer support member 322 can include a material having an elastic material conducive to absorbing impact, for example, it can include silicone (Si). The buffer support member 322 can be disposed on the upper surface of the support body 321 and can be fixedly supported on the support body 321. For example, the buffer support member 322 can be adhered to the upper surface of the support body 321 by an adhesive (not shown). Further, a buffer support hole 322a penetrating the buffer support member 322 in the thickness direction (e.g., the up-down direction in FIG. 19) can be formed in the buffer support member 322. Such a buffer support hole 322a can communicate with a hole formed in the support body 321. In addition, when an electronic component is placed on the buffer support member 322, an air layer is formed between the electronic component and the buffer support member 322, so that the buffer support hole 322a can prevent the electronic component from being separated from the buffer support member. Referring to FIG. 19, the elastic unit 330 can press the support member 320 toward the test tray 20. Such an elastic unit 330 can include an elastic member 331 and a detachment prevention portion 332. The elastic member 331 can press the support member 320 toward the test tray 20. For example, the elastic member 331 can be sandwiched between the support body 321 and the open unit main body 310. One end of such an elastic member 331 can be received in an elastic member groove 321a provided in the lower part of the support body 321, and the other end can be received in a recess 311 of the open unit main body 310. When the pressurization is released, the elastic unit 330 moves the support member 320, which has been pressed by the test tray 20 and moved in the direction approaching the open unit main body 310, in the direction away from the open unit main body 310 by the restoring force. In addition, during the test tray 20 moving a predetermined distance in the direction away from the open unit 300, the support member 320 is pressed toward the test tray 20 by the elastic member 331, so that it can be closely attached to the test tray 20, and the support member 320 can support the electronic component in the accommodation portion 21a. The detachment prevention portion 332 can prevent the support member 320 from completely detaching from the open unit main body 310. One end of such a detachment prevention portion 332 can be fixed to the open unit main body 310 and can guide the support member 320 to move in the direction away from the open unit main body 310. In addition, when the support member 320 is pressed by the elastic member 331 and moves in the direction away from the open unit main body 310, the other end of the detachment prevention portion 332 can limit the movement of the support member 320. However, in this specification, the elastic unit 330 has been described as being provided to press the support member 320 toward the test tray 20 and prevent the support member 320 from detaching from the open unit main body 310, but this is only an example, and the elastic unit 330 can be omitted. Therefore, the support member 320 can also be fixedly supported on the open unit main body 310. Hereinafter, the test tray 20 will be described in detail. The test tray 20 can accommodate electronic components, and the object accommodated in the test tray 20 can be prevented from detaching by the holding unit 22 described below. Electronic components can be loaded or unloaded into such a test tray 20. Such a test tray 20 can include a tray frame 21 and a holding unit 22. A receiving portion 21a for placing electronic components may be formed in the tray frame 21. Such a receiving portion 21a may be configured in the form of a through hole, and this through hole may be formed to narrow toward one side. For example, the receiving portion 21a may be formed to narrow toward the opening unit 300. One side of such a receiving portion 21a may serve as an entrance for moving the electronic component. On the other hand, a tray support portion 21b may be formed on the tray frame 21. Such a tray support portion 21b may be a protrusion protruding from the receiving portion 21a. In addition, the tray support portion 21b may contact and support the electronic component placed in the receiving portion 21a. Referring to FIGS. 19 and 20, the holding unit 22 can selectively hold the electronic component disposed in the receiving portion 21a. Therefore, even if the test tray 20 moves or rotates, the electronic component can be constrained and will not detach from the test tray 20. Such a holding unit 22 can be switched to either a released state or a non-detaching state through the opening unit 300. Here, the released state means a state in which the electronic component is allowed to be placed in and detached from the receiving portion 21a through the opening unit 300, and the non-detaching state means a state in which the detachment of the electronic component from the receiving portion 21a is prevented. The holding unit 22 can include a holder 22a and a holder spring 22b. The holder 22a can selectively hold the electronic component received in the receiving portion 21a. Such a holder 22a can be pivoted, for example, by a hinge connection. In other words, without applying any force to the holder 22a, the holder 22a can be rotated around the pivot toward the tray support portion 21b by the acting force of the holder spring 22b, so that the electronic component can be held by the holder 22a. In addition, if the electronic component is placed in the receiving portion 21a, one side of the electronic component can be supported by the holder 22a, and the other side of the electronic component can be supported by the tray support portion 21b. The holder spring 22b can provide a restoring force to the holder 22a. On the other hand, in this specification, the holder spring 22b is shown as a torsion spring, but this is only an example, and other well-known springs can also be used. Hereinafter, the operation and effects of the test processor 1 according to the seventh embodiment of the present invention will be described. The hand 200 can load multiple electronic components loaded on the customer trays T1 and T2 onto the workbench 100. The workbench 100 can transfer the multiple electronic components to the test tray 20. Additionally, the hand 200 can move the multiple electronic components loaded on the workbench 100 to the upper side of the test tray 20 and can release the grip on the upper side of the test tray 20. The opening unit 300 can rise toward the test tray 20 so that the receiving portion 21a of the test tray 20 is in a released state. At this time, the opening protrusion 312 of the opening unit 300 rotates the retainer 22a, so that the receiving portion 21a can be in a released state. Additionally, when the opening unit 300 is in close contact with the test tray 20, the buffer support member 322 can be disposed inside the receiving portion 21a. When the hand 200 releases the grip on the electronic component from the upper side of the receiving portion 21a, the electronic component can descend and be placed on the buffer support member 322. Additionally, when the opening unit 300 descends, the electronic component placed on the buffer support member 322 can be supported by the tray support portion 21b. At this time, the retainer 22a can be rotated to the original position by the retainer spring 22b and be in a state of preventing detachment. In this way, when the hand 200 releases the grip on the electronic component from the upper side of the receiving portion 21a, the buffer support member 322 has an elastic force, so that the impact between the buffer support member 322 and the electronic component will be absorbed by the buffer support member 322. Therefore, it has the effect of minimizing the impact applied to the electronic component. Additionally, since one end of the buffer support member 322 is disposed above the tray support portion 21b, when the electronic component descends, it can be placed on the buffer support member 322, and the impact applied to the electronic component can be minimized. After that, when the buffer support member 322 descends, the electronic component placed on the buffer support member 322 will be supported by the tray support portion 21b. At this time, the electronic component can be supported by the tray support portion 21b without being impacted. Therefore, it has the effect of preventing the impact applied to the electronic component. On the other hand, in addition to this configuration, according to the eighth embodiment of the present invention, the test tray 20 can omit the test support portion 21b and include a tray support member 23. Hereinafter, the eighth embodiment of the present invention will be further described with reference to FIGS. 21 to 23. When describing the eighth embodiment, the differences compared with the above embodiments will be mainly described, and the same descriptions and reference numerals refer to the above embodiments. The tray support member 23 can support the electronic component 2 placed inside the accommodation portion 21a. For example, the tray support member 23 can support between multiple terminals 2a of the electronic component. Such a tray support member 23 can be supported by the tray frame 21 on the lower side of the tray frame 21. Additionally, multiple open holes 23a through which the terminals of the electronic component can penetrate can be formed in the tray support member 23. For example, when the electronic component is supported by the tray support member 23, multiple terminals of the electronic component can be exposed downward through the multiple open holes 23a. The holding unit 22 can prevent the electronic component supported by the tray support member 23 from detaching from the tray support member 23. The buffer support member 322 can absorb the impact applied to the tray support member 23 and the electronic component supported by the tray support member 23. For example, when the electronic component falls toward the tray support member 23 or when a predetermined pressure is applied to the electronic component, the buffer support member 322 can absorb the impact applied to the tray support member 23. That is, the buffer support member 322 is in close contact with the bottom surface of the tray support member 23 to absorb the impact applied to the tray support member 23. Moreover, the buffer support member 322 can support the electronic component exposed through the open hole 23a, thereby absorbing the impact applied to the electronic component when the electronic component is placed on the tray support member 23. Hereinafter, a test processor control method S10 according to an eighth embodiment of the present invention will be described with reference to FIGS. 21 to 26. The test processor control method S10 can support the test of the electronic component by loading or unloading the electronic component into or from the test tray 20. Such a test processor control method S10 can include a moving step S100, a rising step S200, an opening step S300, a gripping release step S400, a gripping step S500, an impact absorption step S600, and a descending step S700. In the moving step S100, the loading device 10 that grips the electronic component can move to the accommodation portion 21a of the test tray 20 where no electronic component is placed. In this case, the electronic component can be located above the accommodation portion 21a. Additionally, in the moving step S110, the unloading device 40 can move to the accommodation portion 21a to grip the electronic component placed on the tray support member 23 of the test tray 20 that has completed the test. Referring to FIG. 22, in the rising step S200, the opening unit 300 can rise to approach the test tray 20. Additionally, in the rising step S200, the opening unit main body 310 can be raised so that the buffer support member 322 is in close contact with the bottom surface of the tray support member 23. On the other hand, when the rising step S200 is executed while the electronic component is supported by the tray support member 23, the electronic component is not supported by the tray support member 23 but rises while being supported by the buffer support member 322. In the opening step S300, the holding unit 22 can be opened so that the electronic component can be placed on the tray support member 23. That is, the holding unit 22 can be in a released state. For example, in the opening step S300, the opening protrusion 312 can press the holder 22a so that the holder 22a rotates. In the gripping release step S400, the loading device 10 can release the gripping of the electronic component so that the electronic component falls toward the receiving portion 21a. This gripping release step S400 can be performed when the electronic component is not supported by the tray support member 23. In the gripping step S500, the unloading device 40 can grip the electronic component supported by the tray support member 23. This gripping step S500 can be performed when the electronic component is supported by the tray support member 23. Referring to FIG. 23, in the shock absorption step S500, when the electronic component falls toward the tray support member 23, the shock applied to the electronic component can be absorbed. In addition, in the shock absorption step S500, when a predetermined pressure is applied to the electronic component supported by the tray support member 23, the shock applied to the electronic component can be absorbed. For example, in the shock absorption step S500, the buffer support member 322 supports the terminals of the electronic component exposed through the opening hole 23a formed in the tray support member 23, so that the shock applied to the electronic component can be absorbed.. Referring to FIGS. 24 and 25, in the lowering step S600, the opening unit main body 310 can be lowered so that the buffer support member 322 is spaced apart from the bottom surface of the tray support member 23. In addition, if the lowering step S600 is performed after the gripping release step S400, then when the opening unit main body 310 is lowered, at least a part of the plurality of terminals of the electronic component can be inserted into the opening hole 23a. As described above, the embodiments of the present invention have been described as specific embodiments, but these are only examples, and the present invention is not limited thereto. It should be interpreted as having the broadest scope according to the basic idea disclosed in this specification. Those skilled in the art can combine / substitute the disclosed embodiments to implement patterns of shapes not shown, but this also does not depart from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on this specification, and it is clear that such changes or modifications also belong to the scope of the present invention. From the above discussion, it can be understood that the present invention can be embodied in various forms, including but not limited to the following: Example 1. A test processor, characterized by comprising: a bag-shaped frame having a plurality of bag-shaped spaces for accommodating electronic components; and a plurality of shock-absorbing components disposed in the plurality of bag-shaped spaces for placing the electronic components, the shock-absorbing components being formed of an elastic material to absorb the impact applied to the electronic components when the electronic components fall towards the shock-absorbing components, so that the electronic components are placed on the shock-absorbing components, and in the bag-shaped frame, a plurality of wall portions protrude upward in a manner surrounding the shock-absorbing components. Example 2. The test processor according to Example 1, wherein the shock-absorbing components include: a first shock-absorbing component; and a second shock-absorbing component disposed on the upper side of the first shock-absorbing component, the surface friction coefficient of the second shock-absorbing component being less than the surface friction coefficient of the first shock-absorbing component, and the elastic force of the first shock-absorbing component being higher than the elastic force of the second shock-absorbing component. Example 3. The test processor according to Example 1, wherein a plurality of the wall portions are spaced apart from the shock-absorbing components by a predetermined distance in the horizontal direction, so that an air space is provided between the wall portions and the shock-absorbing components, and when the electronic components are placed on the shock-absorbing components, a part of the electronic components is disposed in the air space, a bag-shaped opening hole penetrating the bag-shaped frame is formed in the bag-shaped frame, and a buffer opening hole penetrating the shock-absorbing component corresponding to the bag-shaped opening hole is formed in the shock-absorbing component. Example 4. The test processor according to Example 3, wherein the shock-absorbing components include: a first shock-absorbing component; and a second shock-absorbing component disposed on the upper side of the first shock-absorbing component, and the buffer opening hole includes: a first buffer opening hole formed in the first shock-absorbing component corresponding to the bag-shaped opening hole; and a second buffer opening hole formed in the second shock-absorbing component corresponding to the first buffer opening hole. Example 5. A test processor, characterized by comprising: a main body portion; a bag-shaped frame detachably coupled to the main body portion, a bag-shaped space capable of placing electronic components being formed in the bag-shaped frame; and a shock-absorbing component sandwiched between the bag-shaped frame and the main body portion, the electronic components being capable of being placed on the shock-absorbing component, the shock-absorbing component being formed of an elastic material to absorb the impact applied to the electronic components when the electronic components fall towards the shock-absorbing component, so that the electronic components are placed on the shock-absorbing component.Example 6. The test processor as described in Example 5, wherein a bag-shaped groove is formed in the bag-shaped frame, and a part of the shock absorption component can be accommodated in the bag-shaped groove. A main body groove is formed in the main body part, and another part of the shock absorption component can be accommodated in the main body groove. The shock absorption component is fixedly supported on the bag-shaped frame and the main body part by being accommodated in the bag-shaped groove on one side and the main body groove on the other side. Example 7. A test processor, characterized by comprising: a main body part; a bag-shaped frame detachably coupled to the main body part, and a bag-shaped space for placing electronic components is formed in the bag-shaped frame; and a support component sandwiched between the bag-shaped frame and the main body part, and the electronic component can be placed in the support component. A first open hole and a plurality of second open holes are formed in the support component. When the electronic component is placed on the support component, a part of the terminals of the electronic component can penetrate through the first open hole, and another part of the terminals of the electronic component can penetrate through the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole. Example 8. The test processor as described in Example 7, wherein, in the main body part, a protruding part for supporting the support component protrudes from one surface of the main body part. A bag-shaped groove for inserting the support component is formed in the bag-shaped frame. When the bag-shaped frame is combined with the main body part, the support component is fixedly supported on the bag-shaped frame by inserting at least a part of the support component and the protruding part into the bag-shaped groove. Example 9. The test processor as described in Example 7, wherein a first fixing element is provided in the bag-shaped frame, a second fixing element for engaging with the first fixing element is formed in the main body part, a support fixing hole is formed in the support component, and the support fixing hole is provided at a position corresponding to the second fixing element and is used for engaging with any one of the first fixing element and the second fixing element. Any one of the first fixing element and the second fixing element fixes the support component to the main body part by engaging with the other one of the first fixing element and the second fixing element in the support fixing hole.Example 10. A test processor, characterized by comprising: a test tray, the test tray including a tray frame and a holding unit, a receiving portion capable of accommodating an electronic component being formed in the tray frame, the holding unit being capable of supporting the electronic component in the receiving portion so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can detach from the receiving portion, the opening unit including: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body, at least a part of which can be disposed inside the receiving portion when the opening unit main body presses the holding unit, the buffer support member disposed inside the receiving portion being formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the buffer support member, so that the electronic component is placed on the buffer support member, a tray support portion being provided in the tray frame, the tray support portion being capable of supporting the electronic component disposed in the receiving portion when the opening unit is spaced apart from the holding unit, when the buffer support member is disposed inside the receiving portion, an upper surface of the buffer support member being located above an upper end of the tray support portion. Example 11. A test processor, characterized by comprising: a test tray, the test tray including a tray frame and a holding unit, a receiving portion capable of accommodating an electronic component being formed in the tray frame, the holding unit being capable of supporting the electronic component in the receiving portion so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can detach from the receiving portion, the opening unit including: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body, at least a part of which can be disposed inside the receiving portion when the opening unit main body presses the holding unit, the buffer support member disposed inside the receiving portion being formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member, a tray support portion being provided in the tray frame, the tray support portion being capable of supporting the electronic component disposed in the receiving portion when the opening unit is spaced apart from the holding unit, when the buffer support member is disposed inside the receiving portion, an upper surface of the buffer support member being located above an upper end of the tray support portion.Example 12. A test processor, characterized by comprising: a test tray, the test tray including a tray frame, a tray support member, and a holding unit, a receiving portion capable of arranging electronic components being formed in the tray frame, the tray support member being used for supporting between a plurality of terminals of the electronic component arranged in the receiving portion, the holding unit being capable of supporting the electronic component on the tray support member so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressing the holding unit so that the electronic component can detach from the receiving portion, the opening unit including: an opening unit main body capable of pressing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body and formed of an elastic material, an opening hole being formed in the tray support member, and at least a part of the terminals of the electronic component being capable of passing through the opening hole when the electronic component is arranged in the tray support member. Example 13. The test processor according to Example 12, wherein when the electronic component falls toward the tray support member or a predetermined pressure is applied to the electronic component arranged on the tray support member, the buffer support member is in close contact with the bottom surface of the tray support member to absorb the impact applied to the tray support member and the electronic component and support the electronic component exposed through the opening hole. Example 14. A test processor control method, characterized by comprising: a moving step of moving a loading device to above the receiving portion of the tray frame while holding an electronic component; a rising step of raising the opening unit main body so that the buffer support member supported by the opening unit main body is in close contact with the bottom surface of the tray support member supported under the tray frame; a holding release step of the loading device releasing the holding of the electronic component so that the electronic component falls toward the receiving portion; an impact absorption step of the buffer support member supporting the electronic component exposed through the opening hole formed in the tray support member, thereby absorbing the impact applied to the electronic component when the electronic component falls toward the tray support member; and a descending step of lowering the opening unit main body so that the buffer support member is spaced apart from the bottom surface of the tray support member, in the descending step, when the opening unit main body descends, at least a part of the plurality of terminals of the electronic component is inserted into the opening hole.Example 15. A test processor control method, characterized by comprising: a moving step, in which a unloading device moves above the receiving portion in order to hold an electronic component in the receiving portion of a tray frame; a rising step, in which the open unit main body is raised so that a buffer support member supported by the open unit main body is in close contact with the bottom surface of a tray support member supported under the tray frame; a holding step, in which the unloading device holds the electronic component supported by the tray support member; a shock absorption step, in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member, so as to absorb the shock applied to the electronic component when a predetermined pressure is applied to the electronic component in the holding step; and a lowering step, in which the open unit main body is lowered so that the buffer support member is spaced apart from the bottom surface of the tray support member. In the rising step, when the open unit main body rises, at least a part of the terminals of the electronic component rises while being inserted into the open hole. Example 16. The test processor control method according to Example 14 or 15, further comprising an opening step of opening a holding unit to support the electronic component by the tray support member or to disengage the electronic component from the tray support member. In the rising step, the open unit main body is raised to a predetermined position so that the open unit main body presses the holding unit. 1: Test processor 2: Electronic component 2a: Terminal 10: Loading device 20: Test tray 21: Tray frame 21a: Accommodating part; Receiving part 21b: Tray support part 22: Holding unit 22a: Holder 22b: Holder spring 23: Tray support component 23a: Open hole 30: Chamber 31: Wetting chamber 32: Test chamber 33: Non-wetting chamber 40: Unloading device 50: Stacker module 60: Control unit 100: Workbench 110: Bag-shaped frame 111: Placement part 111a: Bag-shaped open hole 112: Wall part 113: Bag-shaped groove part 114: Correction hole 115: Fixed pin 120: Impact absorption component; Buffer component 120a: Buffer open hole 121: First impact absorption component 121a: First buffer open hole 122: Second impact absorption component 122a: Second buffer open hole 140: Main body part 141: Main body groove part 142: Main body open hole 143: Correction pin 144: Protrusion part 145: Main body fixing hole 150: Support component 151: First open hole 152: Second open hole 153: Support fixing hole 200: Hand part 300: Opening unit 310: Opening unit main body 311: Concave part 311a: Groove 312: Opening protrusion 313: Positioning protrusion 314: Anti-sticking protrusion 320: Support piece 321: Support body 321a: Elastic component groove 322: Buffer support component 322a: Buffer support hole 330: Support elastic unit 331: Elastic component 332: Anti-separation part LP: Loading position P: Bag-shaped space S: Spacing space S10: Test processor control method S100-S700: Steps t: Thickness T1, T2: Customer tray FIG. 1 is a perspective view conceptually showing a test processor according to an embodiment of the present invention; FIG. 2 is a perspective view of a workbench according to a first embodiment of the present invention; FIG. 3 is a sectional view taken along line A-A' of FIG. 2; FIG. 4 is a sectional view taken along line A-A' of the workbench according to a second embodiment of the present invention; FIG. 5 is a perspective view of a workbench according to a third embodiment of the present invention; FIG. 6 is a sectional view taken along line B-B' of FIG. 5; FIG. 7 is a sectional view taken along line B-B' of the workbench according to a fourth embodiment of the present invention; FIG. 8 is a perspective view of a workbench according to a fifth embodiment of the present invention; FIG. 9 is an exploded perspective view of the workbench of FIG. 8; FIG. 10 is a bottom perspective view of the bag-shaped frame of FIG. 9; FIG. 11 is a perspective view of a workbench according to a sixth embodiment of the present invention; FIG. 12 is an exploded perspective view of the workbench of FIG. 11; FIG. 13 is a bottom perspective view and a partially enlarged view of the bag-shaped frame of FIG. 12; FIG. 14 is an enlarged view of C in FIG. 12; FIG. 15 is a perspective view of the support member of FIG. 12; FIG. 16 is a perspective view conceptually showing a test processor according to a seventh embodiment of the present invention; FIG. 17 is a perspective view of the test tray and the opening unit of FIG. 16; FIG. 18 is a partially enlarged perspective view of the test tray and the opening unit of FIG. 16; FIG. 19 is a sectional view taken along line D-D' of FIG. 18; FIG. 20 is a sectional view showing the state where the holding unit in FIG. 18 is in a released state; FIG. 21 is a longitudinal sectional view of the test tray and the opening unit according to an eighth embodiment of the present invention; FIG. 22 is a view showing the state where the opening unit in FIG. 21 is raised and the holding unit is in a released state; FIG. 23 is an enlarged view of part E in FIG. 22; FIG. 24 is a view showing the state where the opening unit in FIG. 22 is lowered and the holding unit is in a state of preventing detachment; FIG. 25 is an enlarged view of F in FIG. 24; FIG. 26 is a flowchart sequentially showing a test processor control method according to an eighth embodiment of the present invention. 1: Test processor 10: Loading device 20: Test tray 30: Chamber 31: Wetting chamber 32: Testing chamber 33: Non-wetting chamber 40: Unloading device 50: Stacking machine module 60: Control unit 100: Workbench 200: Hand T1, T2: Customer tray

Claims

1. A test processor, comprising: The test tray includes a tray frame and a retaining unit. The tray frame has a receiving portion for placing electronic components, and the retaining unit can support the electronic components in the receiving portion so that the electronic components do not detach from the receiving portion. And an opening unit capable of pressurizing the holding unit to allow the electronic component to detach from the receiving portion, the opening unit comprising: an opening unit body capable of pressurizing the holding unit by approaching the test tray; The system includes a buffer support member supported by the open unit body. When the open unit body presses against the holding unit, at least a portion of the buffer support member can be disposed inside the receiving portion. The buffer support member disposed inside the receiving portion is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the buffer support member, thereby placing the electronic component on the buffer support member. A tray support portion is provided in the tray frame. When the open unit is spaced apart from the holding unit, the tray support portion can support the electronic component disposed in the receiving portion. When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. The buffer support member supports the electronic component from below, and one of the contact areas between the buffer support member and the electronic component is larger than one of the contact areas between the tray support portion and the electronic component.

2. A test processor, comprising: The test tray includes a tray frame and a retaining unit. The tray frame has a receiving portion for placing electronic components, and the retaining unit can support the electronic components in the receiving portion so that the electronic components do not detach from the receiving portion. And an opening unit capable of pressurizing the holding unit to allow the electronic component to detach from the receiving portion, the opening unit comprising: an opening unit body capable of pressurizing the holding unit by approaching the test tray; The system includes a buffer support member supported by the open unit body. When the open unit body presses against the holding unit, at least a portion of the buffer support member can be disposed inside the receiving portion. The buffer support member disposed inside the receiving portion is formed of an elastic material to absorb impacts applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member. A tray support portion is provided in the tray frame. When the open unit is spaced apart from the holding unit, the tray support portion can support the electronic component disposed in the receiving portion. When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. The buffer support member supports the electronic component from below, and one of the contact areas between the buffer support member and the electronic component is larger than one of the contact areas between the tray support portion and the electronic component.

3. A test processor, comprising: A test tray includes a tray frame, a tray support member, and a retaining unit. The tray frame has a receiving portion for arranging electronic components. The tray support member is used to support multiple terminals of the electronic components arranged in the receiving portion. The retaining unit is capable of supporting the electronic components on the tray support member so that the electronic components do not detach from the receiving portion. And an opening unit capable of pressurizing the holding unit to allow the electronic component to detach from the receiving portion, the opening unit comprising: an opening unit body capable of pressurizing the holding unit by approaching the test tray; The device includes a buffer support member supported by the open unit body and formed of an elastic material. An open hole is formed in the tray support member, and at least a portion of the terminals of the electronic component can pass through the open hole when the electronic component is placed in the tray support member. The buffer support member supports the electronic component from below, and one of the contact areas between the buffer support member and the electronic component is larger than one of the contact areas between the tray support member and the electronic component.

4. The test processor as described in claim 3, wherein, When the electronic component falls toward the tray support component or when a predetermined pressure is applied to the electronic component placed on the tray support component, the cushioning support component is in close contact with the bottom surface of the tray support component to absorb the impact applied to the tray support component and the electronic component, and to support the electronic component exposed through the opening.

5. A method for testing processor control, comprising: During the moving step, the loading device moves above the receiving section of the tray frame while holding the electronic components; The lifting step involves raising an open unit body so that the cushioning support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; the grip release step involves the loading device releasing its grip on the electronic component so that the electronic component falls toward the receiving portion; and the impact absorption step involves the cushioning support member supporting the electronic component exposed through an opening formed in the tray support member, thereby absorbing the impact applied to the electronic component when it falls toward the tray support member. The process includes a descent step, in which the open unit body is lowered to space the buffer support member from the bottom surface of the tray support member. During the descent step, as the open unit body is lowered, at least a portion of the plurality of terminals of the electronic component is inserted into the open hole. The buffer support member supports the electronic component from below, and one of the contact areas between the buffer support member and the electronic component is larger than one of the contact areas between the tray support member and the electronic component.

6. A method for testing processor control, comprising: In the moving step, the unloading device moves above the receiving section in order to hold the electronic components inside the receiving section of the tray frame; The lifting step involves raising an open unit body so that the buffer support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; the holding step involves the unloading device holding the electronic component supported by the tray support member; and the shock absorption step involves the buffer support member supporting the electronic component exposed through an opening formed in the tray support member, thereby absorbing the impact applied to the electronic component when a predetermined pressure is applied to the electronic component during the holding step. The process includes a lowering step, in which the open unit body is lowered to space the buffer support member from the bottom surface of the tray support member. In the raising step, as the open unit body rises, at least a portion of the terminals of the electronic component rises while being inserted into the open hole. The buffer support member supports the electronic component from below, and one of the contact areas between the buffer support member and the electronic component is larger than one of the contact areas between the tray support member and the electronic component.

7. The test processor control method as described in claim 5 or 6, wherein, It also includes an opening step, in which the holding unit is opened to support the electronic component by the tray support member or to detach the electronic component from the tray support member, and in the lifting step, the opening unit body is raised to a predetermined position to pressurize the holding unit.

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