Heat dissipation power generation module

Abstract

A heat dissipation and power generation module is applicable to a server. The heat dissipation and power generation module includes a first heat dissipation component, a thermoelectric component, and a second heat dissipation component. The first heat dissipation component is thermally coupled to at least one heat source of the server. The thermoelectric component is disposed on the first heat dissipation component. The thermoelectric component is located between the first heat dissipation component and the second heat dissipation component. A temperature difference is formed between the first heat dissipation component and the second heat dissipation component on opposite sides of the thermoelectric component, and the thermoelectric component generates electrical energy through the temperature difference.

Description

[Technical Field]

[0001] This invention relates to a module, and more particularly to a heat dissipation and power generation module. [Previous Technology]

[0002] Modern servers include heat sources (e.g., central processing unit and graphics processing unit) and can use heat dissipation modules to cool these heat sources. As server performance increases, the heat generated by the heat sources also increases, but current heat dissipation modules can only cool the heat sources and cannot effectively utilize their heat energy, resulting in energy waste. [Summary of the Invention]

[0003] The present invention provides a heat dissipation and power generation module that can simultaneously dissipate heat and generate electricity.

[0004] The heat dissipation and power generation module of the present invention can be used in a server. The heat dissipation and power generation module includes a first heat dissipation component, a thermoelectric component, and a second heat dissipation component. The first heat dissipation component is thermally coupled to at least one heat source of the server. The thermoelectric component is disposed on the first heat dissipation component. The thermoelectric component is located between the first heat dissipation component and the second heat dissipation component. A temperature difference is formed between the first heat dissipation component and the second heat dissipation component on opposite sides of the thermoelectric component, and the thermoelectric component generates electrical energy through the temperature difference.

[0005] Based on the above, the first heat dissipation component of the heat dissipation power generation module of the present invention exchanges heat with the heat source of the server, thereby generating a high temperature on one side of the thermoelectric component. The second heat dissipation component generates a low temperature on the other side of the thermoelectric component. The thermoelectric component generates electricity through the temperature difference between the two sides. In this way, the heat dissipation power generation module can recover the heat energy dissipated by the heat source to generate electricity while dissipating heat from the heat source, thereby achieving the effects of energy recovery and heat dissipation.

Implementation Method

[0007] Figure 1 is a schematic diagram of a heat dissipation and power generation module according to an embodiment of the present invention. Figure 2 is a cross-sectional view of the heat dissipation and power generation module of Figure 1. Figure 3 is an exploded view of the heat dissipation and power generation module of Figure 2. Referring to Figures 1 to 3 simultaneously, the heat dissipation and power generation module 100 can be used in a server 10. The heat dissipation and power generation module 100 includes a first heat dissipation component 110, a thermoelectric component 120, and a second heat dissipation component 130. The first heat dissipation component 110 is thermally coupled to at least one heat source 200 of the server 10. The thermoelectric component 120 is disposed on the first heat dissipation component 110. The thermoelectric component 120 is located between the first heat dissipation component 110 and the second heat dissipation component 130.

[0008] The heat dissipation and power generation module 100 in this embodiment is a water-cooled heat dissipation and power generation module, but is not limited thereto. The first heat dissipation component 110 includes a first inner pipe 116, and the second heat dissipation component 130 includes a second inner pipe 136, with the first inner pipe 116 connected to the second inner pipe 136. A heat dissipation medium M flows within the first inner pipe 116 and the second inner pipe 136. Specifically, the heat dissipation medium M with low thermal energy flows within the second heat dissipation component 130 (second inner pipe 136), resulting in a low temperature on the side S2 where the thermoelectric component 120 is connected to the second heat dissipation component 130. The heat dissipation medium M in the first heat dissipation component 110 exchanges heat with the heat source 200 to dissipate heat from the heat source 200. After heat exchange, the heat dissipation medium M with high thermal energy flows within the first heat dissipation component 110 (first inner pipe 116), resulting in a high temperature on the side S1 where the thermoelectric component 120 is connected to the first heat dissipation component 110. The first heat dissipation component 110 and the second heat dissipation component 130 form a temperature difference on opposite sides S1 and S2 of the thermoelectric component 120 through the heat source 200 and the heat dissipation medium M, and the thermoelectric component 120 generates electrical energy through the temperature difference.

[0009] Accordingly, the heat dissipation power generation module 100 can recover the heat energy dissipated by the heat source 200 while dissipating heat from the heat source 200, and generate electrical energy through the thermoelectric component 120, thus enabling the heat dissipation power generation module 100 to have the functions of energy recovery and heat dissipation. The thermoelectric component 120 can be electrically connected to a circuit board of the server 10 to provide electrical energy or electrically connected to an energy storage device to store electrical energy.

[0010] As shown in Figures 1 and 2, the heat dissipation and power generation module 100 further includes a piping assembly 140, a pump 150, and a cooling assembly 160. The cooling assembly 160 is, for example, a water-cooled radiator, but is not limited thereto. The piping assembly 140 includes a connecting pipe 141 and a plurality of connecting pipes 145. The connecting pipe 141 of the piping assembly 140 connects to a first inner pipe 116 and a second inner pipe 136. The pump 150 is connected to the cooling assembly 160 and the first inner pipe 116 of the first heat dissipation assembly 110 through these connecting pipes 145, and the cooling assembly 160 is connected to the second inner pipe 136 of the second heat dissipation assembly 130 through these connecting pipes 145. The heat dissipation medium M flows between the pump 150, the cooling assembly 160, the piping assembly 140, the first inner pipe 116, and the second inner pipe 136.

[0011] In one heat dissipation cycle, the heat dissipation medium M is driven by the pump 150 to flow into the cooling component 160 for heat exchange. After heat exchange, the heat dissipation medium M with low heat energy flows into the second inner pipe 136 of the second heat dissipation component 130, thereby keeping the second heat dissipation component 130 at a low temperature. The heat dissipation medium M with low heat energy then flows through the connecting pipe 141 into the first inner pipe 116 of the first heat dissipation component 110 for heat exchange with the heat source 200. After heat exchange, the heat dissipation medium M with high heat energy flows out of the first heat dissipation component 110 and into the pump 150, thus completing one heat dissipation cycle for the heat dissipation power generation module 100.

[0012] As shown in Figures 2 and 3, the first heat dissipation assembly 110 and the second heat dissipation assembly 130 have similar structures. The first heat dissipation assembly 110 includes a housing 117, and a first inner pipe 116 is located inside the housing 117. The second heat dissipation assembly 130 includes a housing 137, and a second inner pipe 136 is located inside the housing 137. The first inner pipe 116 and the second inner pipe 136 each include a flow region B1 and two heat dissipation regions B2. The flow region B1 is located between the two heat dissipation regions B2 and is used for the flow of the heat dissipation medium M. The heat dissipation region B2 includes a fin structure to increase the surface area of ​​the heat dissipation region B2, thereby improving the heat exchange efficiency between the heat dissipation region B2 and the housings 117 and 137, and thus improving the heat dissipation efficiency of the heat dissipation power generation module 100.

[0013] The number of heat sources 200 in this embodiment is, for example, two, but is not limited thereto. Heat sources 200 may be, for example, a central processing unit, a graphics processing unit, or electronic components surrounding the processor. A heat source 200 with lower heat generation power may be located near the connecting pipe 141 (i.e., near an inlet 1161 of the first inner pipe 116), and a heat source 200 with higher heat generation power may be located away from the connecting pipe 141 (i.e., away from the inlet 1161 but near an outlet 1162 of the first inner pipe 116), but is not limited thereto. When the heat dissipation medium M with low heat energy enters the first heat dissipation assembly 110, it first exchanges heat with the heat source 200 with lower heat generation power, causing a slight increase in the heat energy of the heat dissipation medium M, and then exchanges heat with the heat source 200 with higher heat generation power.

[0014] In this way, both heat sources 200 can have their temperature reduced to the target temperature through the heat dissipation and power generation module 100. During the process of heat exchange between the heat dissipation medium M and the two heat sources 200 in sequence, the temperature of the heat dissipation medium M gradually increases, causing the temperature of side S1 of the thermoelectric component 120 to gradually increase. That is, the temperature of side S1 of the thermoelectric component 120 near the water inlet 1161 is lower than the temperature of side S1 away from the water inlet 1161. Since the second heat dissipation component 130 maintains a uniform temperature, the power generation of the thermoelectric component 120 can be changed according to its location.

[0015] Figure 4 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention, where the structure of the components is simplified. Referring simultaneously to Figures 2 and 4, the heat dissipation and power generation module 100a of this embodiment is similar to the aforementioned embodiment, except that the first heat dissipation component 110a of this embodiment includes at least two first heat dissipation parts 111a and 111b, the second heat dissipation component 130a includes at least two second heat dissipation parts 131a and 131b, the thermoelectric component 120a includes at least two first thermoelectric parts 121a and 121b, and at least one heat source includes at least two heat sources 200a and 200b. The pipe assembly 140a includes at least one first pipe 143, at least one second pipe 144, and a connecting pipe 141. Specifically, the number of first heat dissipation parts, second heat dissipation parts, first thermoelectric parts, and heat sources are each two. The number of first pipes, second pipes, and connecting pipes are each one.

[0016] Two first heat dissipation components 111a and 111b are thermally coupled to corresponding two heat sources 200a and 200b, respectively. The first heat dissipation component 111a and the second heat dissipation component 131a are attached to opposite sides S3 and S4 of the first thermoelectric component 121a, and the first heat dissipation component 111b and the second heat dissipation component 131b are attached to opposite sides of the first thermoelectric component 121b. Two adjacent first heat dissipation components 111a and 111b are connected by a first pipe 143, and two adjacent second heat dissipation components 131a and 131b are connected by a second pipe 144. The two first heat dissipation components 111a and 111b can be considered as being connected in series, and the temperature of the first heat dissipation component 111b is affected by the first heat dissipation component 111a (heat source 200a). A connecting pipe 141 connects the first heat dissipation component 111a and the second heat dissipation component 131a. The heat dissipation medium M flows between the pipe assembly 140, the two first heat dissipation components 111a and 111b, and the two second heat dissipation components 131a and 131b. Through the first pipe 143 and the second pipe 144 of the pipe assembly 140a, the distance between the two heat sources 200a and 200b can be relatively large, thus improving the ease of use of the heat dissipation and power generation module 100a. The heat dissipation and power generation module 100a of this embodiment has the same effect as the aforementioned embodiment, and will not be described again here.

[0017] Figure 5 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Referring simultaneously to Figures 4 and 5, the heat dissipation and power generation module 100b of this embodiment is similar to the aforementioned embodiment, except that the number of heat dissipation components and thermoelectric components connected in series in this embodiment is not more than two, and their series connection relationship is formalized. For example, the number of the first heat dissipation component 111, the second heat dissipation component 131, and the first thermoelectric component 121 are four each, the number of the first pipe 143 and the second pipe 144 are correspondingly three each, and the number of the connecting pipe 141 is one, but this is not limited to these. Therefore, the number of the first heat dissipation component 111, the second heat dissipation component 131, and the first thermoelectric component 121 can be K, and the number of the first pipe 143 and the second pipe 144 can be K-1, where K is a positive integer greater than 1. The heat dissipation and power generation module 100b of this embodiment has the same effect as the aforementioned embodiment, and will not be described again here.

[0018] Figure 6 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Referring simultaneously to Figures 4 and 6, the heat dissipation and power generation module 100c of this embodiment is similar to the aforementioned embodiment, except that the piping assembly 140c of this embodiment includes at least two connecting pipes 141 and at least one manifold 142. The number of connecting pipes 141 is two, and the number of manifold 142 is one, but not limited thereto. The two first heat dissipation components 111c and 111d are connected to the corresponding two second heat dissipation components 131 by the two connecting pipes 141, and adjacent first heat dissipation components 111c and 111d are connected by the manifold 142. The manifold 142 is T-shaped, but not limited thereto. The manifold 142 is connected to the pump 150 (Figure 1).

[0019] The heat dissipation medium M, which has high thermal energy after heat exchange with heat sources 200c and 200d, flows from the first heat dissipation components 111c and 111d to the manifold 142, and then flows from the manifold 142 into the pump 150 (Fig. 1). Compared with the two first heat dissipation components 111a and 111b connected in series in Fig. 4, the two first heat dissipation components 111c and 111d in this embodiment can be regarded as being connected in parallel. The two first heat dissipation components 111c and 111d are isolated from each other. The temperature of the first heat dissipation component 111c is not affected by the first heat dissipation component 111d (heat source 200d), and the temperature of the first heat dissipation component 111d is not affected by the first heat dissipation component 111c (heat source 200c). In this way, the two first heat dissipation components 111c and 111d can respectively exchange heat with two heat sources 200c and 200d with high heat generation power, and can be used in servers with multiple heat sources 200c and 200d with high heat generation power.

[0020] The thermoelectric component 120c of this embodiment may optionally include at least one second thermoelectric element 122. The number of second thermoelectric elements 122 corresponds to the number of manifolds 142 and is one. The second thermoelectric element 122 includes two opposing sides S5 and S6, with side S5 of the second thermoelectric element 122 thermally coupled to the manifold 142. Since the temperature of the external environment is lower than the temperature of the manifold 142, a temperature difference is generated between the two sides S5 and S6 of the second thermoelectric element 122, thereby generating electrical energy. The heat dissipation and power generation module 100c of this embodiment has similar effects to the aforementioned embodiments, and will not be described again here.

[0021] Additionally, in an embodiment not shown, the second heat dissipation assembly 130c may include an auxiliary heat dissipation component such as a cooling fan or heat sink. A second thermoelectric component 122 is disposed between the auxiliary heat dissipation component and the manifold 142, and a low-heat-energy heat dissipation medium M can flow within the auxiliary heat dissipation component. The second thermoelectric component 122 can create a larger temperature difference between the auxiliary heat dissipation component and the manifold 142 to generate greater electrical energy.

[0022] Furthermore, in the embodiments shown in Figures 4 to 7, the heat dissipation and power generation module may optionally include at least one water cooling head (not shown in the figures), the number of water cooling heads corresponding to the number of heat sources. The heat sources are located between the first heat dissipation component and the water cooling head to improve the heat dissipation efficiency of the heat dissipation and power generation module.

[0023] Figure 7 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Referring simultaneously to Figures 6 and 7, the heat dissipation and power generation module 100d of this embodiment is similar to the aforementioned embodiment, except that in this embodiment, the number of parallel heat dissipation components and thermoelectric components is not limited to two, and their parallel connection relationship is formalized. For example, the number of first heat dissipation components 111, second heat dissipation components 131, and first thermoelectric components 121 are four each, the number of manifolds 142 is three, and the number of connecting pipes 141 is four. Corresponding first heat dissipation components 111 and second heat dissipation components 131 are connected by connecting pipes 141, and adjacent first heat dissipation components 111 are connected by manifolds 142.

[0024] It can be seen that the number of the first heat dissipation component 111, the second heat dissipation component 131, the first thermoelectric component 121, and the connecting pipe 141 can be N, and the number of the busbar 142 can be N-1, where N is a positive integer greater than 1. The heat dissipation and power generation module 100d in this embodiment has similar effects to the aforementioned embodiments, and will not be described again here.

[0025] In addition, in an embodiment not shown, the thermoelectric assembly 120d may include a second thermoelectric component, the number of which may be three corresponding to the number of manifolds 142.

[0026] FIG8 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. FIG9 is an exploded view of the heat dissipation and power generation module of FIG8. Referring to FIG8 and FIG9 simultaneously, the heat dissipation and power generation module 100e of this embodiment is an air-cooled heat dissipation and power generation module. The heat dissipation and power generation module 100e includes a first heat dissipation component 110e, a thermoelectric component 120e, and a second heat dissipation component 130e. The first heat dissipation component 110e includes a connecting portion 112 and two extension portions 113 connected together. The connecting portion 112 is connected to a heat source 200, and the two extension portions 113 are located on opposite sides of the connecting portion 112 and away from the heat source 200. The heat energy of the heat source 200 is guided from the connecting portion 112 to the extension portions 113. The first heat dissipation component 110e is T-shaped, but is not limited thereto. The thermoelectric component 120e includes two first thermoelectric components 121e, and the two first thermoelectric components 121e are respectively disposed on the two extension portions 113. The first thermoelectric component 121e is located between the extension 113 and the second heat dissipation assembly 130e.

[0027] The first heat dissipation assembly 110e of this embodiment includes a first heat dissipation fin group 114 and a heat pipe 115. The heat pipe 115 is embedded in the first heat dissipation fin group 114 and is used to accelerate the transfer of heat energy dissipated by the heat source 200 to the two extensions 113. The second heat dissipation assembly 130e includes a second heat dissipation fin group 133 and a housing 134. The second heat dissipation fin group 133 is disposed in the housing 134. A portion of the first heat dissipation fin group 114 and the heat pipe 115 form a connecting portion 112, and another portion of the first heat dissipation fin group 114 and the heat pipe 115 form two extensions 113. The housing 134 of the second heat dissipation assembly 130e includes two baffles 132. The two heat sources 200 contact the connecting portion 112.

[0028] The heat energy emitted by the heat source 200 is conducted to the second heat dissipation fin assembly 133 through the connecting part 112, and is then dissipated to the external environment through the second heat dissipation fin assembly 133 for heat dissipation. The heat energy of the heat source 200 is also conducted to the extension part 113 through the connecting part 112. The extension part 113, which has high heat energy, forms a high temperature on the side S7 of the first thermoelectric component 121e, while the second heat dissipation fin assembly 133, which has low heat energy, forms a low temperature on the side S8 of the first thermoelectric component 121e. The first thermoelectric component 121e generates electricity through the temperature difference between the two sides S7 and S8.

[0029] The heat dissipation and power generation module 100e further includes at least one fan assembly 170 for forming an airflow A. The fan assembly 170 is disposed on the circuit board 300 of the server 10e. The two baffles 132 of the second heat dissipation assembly 130e are located between the two extensions 113 and the fan assembly 170, and are located in the movement path of the airflow A to block the airflow A. The airflow A can exchange heat with the heat source 200 through the connection portion 112 of the first heat dissipation assembly 110e to improve the heat dissipation efficiency of the heat dissipation and power generation module 100e. Since the airflow A is blocked by the baffles 132, the extension portion 113 of the first heat dissipation assembly 110e still has high thermal energy and can still generate high temperature on the side S7 of the first thermoelectric component 121e. The airflow A can also exchange heat with the second heat dissipation assembly 130e to further reduce the temperature of the second heat dissipation assembly 130e to generate a lower temperature on the side S8 of the first thermoelectric component 121. In this way, the heat dissipation power generation module 100e can generate electrical energy through the first thermoelectric component 121e without affecting the heat dissipation of the heat source 200.

[0030] In this embodiment, the number of fan assemblies 170 is one, which consists of two fans, but is not limited thereto. In an embodiment not shown, the number of fan assemblies 170 may be two, with the first heat dissipation assembly 110e, the second heat dissipation assembly 130e, and the thermoelectric assembly 120e located between the two fan assemblies 170. The two fan assemblies 170 are located on the movement path of the airflow A. One fan assembly is used to generate airflow A, and the other fan assembly is used to increase the speed of airflow A, so that airflow A leaves the heat dissipation and power generation module 100e (server 10e) more quickly, thereby improving the heat dissipation efficiency of the heat dissipation and power generation module 100e.

[0031] In summary, the first heat dissipation component of the heat dissipation and power generation module of the present invention exchanges heat with the heat source of the server, thereby generating a high temperature on one side of the thermoelectric component. The second heat dissipation component generates a low temperature on the other side of the thermoelectric component. The thermoelectric component generates electricity through the temperature difference between the two sides. In this way, the heat dissipation and power generation module can recover the heat energy dissipated by the heat source to generate electricity while dissipating heat from the heat source, thereby achieving the effects of energy recovery and heat dissipation. [Simplified Explanation of the Diagram]

[0006] Figure 1 is a schematic diagram of a heat dissipation and power generation module according to an embodiment of the present invention. Figure 2 is a cross-sectional view of the heat dissipation and power generation module of Figure 1. Figure 3 is an exploded view of the heat dissipation and power generation module of Figure 2. Figure 4 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Figure 5 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Figure 6 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Figure 7 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Figure 8 is a cross-sectional view of a heat dissipation and power generation module according to another embodiment of the present invention. Figure 9 is an exploded view of the heat dissipation and power generation module of Figure 8.

Claims

1. A heat dissipation and power generation module, suitable for a server, the heat dissipation and power generation module comprising: A first heat dissipation component that is in direct contact with at least one heat source of the server; A thermoelectric component is disposed on the first heat dissipation component; The device includes a second heat dissipation component, the thermoelectric component being located between the first heat dissipation component and the second heat dissipation component; a piping assembly, the first heat dissipation component including a first inner pipe, the second heat dissipation component including a second inner pipe, the piping assembly connecting the first inner pipe and the second inner pipe; a pump; and a cooling component, the pump connected to the cooling component and the first inner pipe, the cooling component connected to the second inner pipe, a heat dissipation medium flowing between the pump, the cooling component, the first inner pipe and the second inner pipe, the first heat dissipation component and the second heat dissipation component creating a temperature difference on opposite sides of the thermoelectric component, the thermoelectric component generating electrical energy through the temperature difference. The first heat dissipation assembly includes at least two first heat dissipation components, the second heat dissipation assembly includes at least two second heat dissipation components, the thermoelectric assembly includes at least two first thermoelectric components, the at least one heat source includes at least two heat sources, each of the at least two first thermoelectric components is attached to the opposite sides of each of the at least two first heat dissipation components and each of the at least two second heat dissipation components, and each of the at least two first heat dissipation components is thermally coupled to the at least two heat sources, the pipeline assembly includes at least one first pipeline, at least one second pipeline and a connecting pipe, each of the at least two adjacent first heat dissipation components is connected by each of the at least one first pipeline, each of the at least two adjacent second heat dissipation components is connected by each of the at least one second pipeline, the connecting pipe is connected between one of the at least two first heat dissipation components and one of the at least two second heat dissipation components, and a heat dissipation medium flows between the pipeline assembly, the at least two first heat dissipation components and the at least two second heat dissipation components.

2. The heat dissipation and power generation module as claimed in claim 1, wherein the piping assembly includes at least two connecting pipes and at least one manifold, each of the at least two first heat dissipation components and each of the at least two second heat dissipation components are connected by the at least two connecting pipes, and each of the at least two adjacent first heat dissipation components is connected by the at least one manifold.

3. The heat dissipation and power generation module as claimed in claim 2, wherein the thermoelectric component further includes at least one second thermoelectric element, each of the at least one second thermoelectric element includes opposite sides, one of the sides of each of the at least one second thermoelectric element is thermally coupled to each of the at least one manifold, and the at least one second thermoelectric element generates electrical energy through the temperature difference between the sides.

4. The heat dissipation and power generation module as claimed in claim 1, wherein the first heat dissipation component includes a connecting portion and two extension portions connected together, the connecting portion is connected to the at least one heat source, the two extension portions are located on opposite sides of the connecting portion, and the thermoelectric component includes two first thermoelectric components, the two first thermoelectric components being respectively disposed on the two extension portions.

5. The heat dissipation and power generation module as claimed in claim 4 further includes at least one fan assembly, wherein the second heat dissipation assembly includes two baffles located between the two extensions and the at least one fan assembly, the two baffles being located on the movement path of an airflow formed by the at least one fan assembly to block the airflow.

6. The heat dissipation and power generation module as claimed in claim 5, wherein the first heat dissipation component includes a first heat dissipation fin group and a heat pipe, the second heat dissipation component includes a second heat dissipation fin group and a housing, the heat pipe is embedded in the first heat dissipation fin group, the housing includes the two baffles, and the second heat dissipation fin group is disposed in the housing.

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