Substrate processing apparatus and substrate processing method

Abstract

This invention provides a substrate processing apparatus and method capable of precisely identifying the processing liquid within a drain section. The substrate processing apparatus 100 of this invention includes a chamber 112, a substrate holding section 120, a processing liquid supply section 130, a drain section 190, at least one near-infrared light source 140, a near-infrared camera 150, and a control unit 102. The substrate holding section 120 is housed within the chamber 112. The substrate holding section 120 holds the substrate W. The processing liquid supply section 130 supplies a plurality of processing liquids to the substrate W at different times. The drain section 190 drains the plurality of processing liquids outside the chamber 112. At least one near-infrared light source 140 irradiates an area AR1 including at least a portion of the drain section 190 using near-infrared light. The near-infrared camera 150 captures images of the plurality of processing liquids within the drain section irradiated by near-infrared light. The control unit 102 identifies the type of processing liquid within the drain section 190 based on the captured images.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Prior Art

[0002] A substrate processing device for processing a substrate by supplying a processing liquid to the substrate is known (for example, refer to Patent Document 1). The substrate processing device described in Patent Document 1 includes a substrate holding portion, a processing liquid supply portion, a common drain pipe, a switching valve, a cleaning liquid supply portion, and a liquid detection portion. The processing liquid supply portion supplies a plurality of processing liquids to the substrate individually. The liquid detection portion detects whether a valve cleaning liquid is present at a detection position on the common drain pipe. In this way, the inside of the switching valve can be easily cleaned. [Prior Technical Literature] [Patent Document]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-208404 Summary of the invention

[0004] [Problems to be solved by the invention] In the substrate processing device described in Patent Document 1, for example, when the switching valve switches the destination of the processing liquid, the opening and closing state of the switching valve connected to the common drain pipe is changed. In this case, it is difficult to confirm whether the processing liquid on the common drain pipe and in the flow path of the switching valve (draining part) has been switched. Specifically, the processing liquid used for substrate processing is usually transparent, so a general CCD camera cannot detect the processing liquid. Therefore, there is a situation where the processing liquid on the common drain pipe and in the switching valve (in the draining part) cannot be identified with high precision.

[0005] The present invention is completed in view of the above-mentioned problems, and its purpose is to provide a substrate processing device and a substrate processing method that can accurately identify the processing liquid in the discharge part. [Technical means to solve the problem]

[0006] According to one aspect of the present invention, a substrate processing device comprises a chamber, a substrate holding portion, a processing liquid supply portion, a liquid discharge portion, at least one near-infrared light source, a near-infrared camera portion and a control portion. The substrate holding portion is accommodated in the chamber. The substrate holding portion holds the substrate. The processing liquid supply portion supplies a plurality of processing liquids to the substrate at different times. The liquid discharge portion discharges the plurality of processing liquids out of the chamber. The at least one near-infrared light source irradiates an area including at least a portion of the liquid discharge portion with near-infrared rays. The near-infrared camera portion captures the plurality of processing liquids in the liquid discharge portion irradiated with the near-infrared rays to generate a captured image. The control portion controls the near-infrared camera portion. The control portion specifies the type of the processing liquid in the liquid discharge portion based on the captured image.

[0007] In one embodiment, the control unit controls the drain unit based on a specific result of the type of the processing liquid.

[0008] In one embodiment, the liquid discharge section has an upstream pipe, a common pipe and a plurality of downstream pipes. The upstream pipe is used for the plurality of processing liquids discharged from the chamber to flow. The common pipe is connected to the downstream end of the upstream pipe. The upstream ends of the plurality of downstream pipes are connected to the common pipe.

[0009] In one embodiment, the liquid discharge unit further includes a switching unit that switches the flow destination of the treatment liquid flowing through the common pipe between the plurality of downstream pipes.

[0010] In one embodiment, the near-infrared light source irradiates an area including at least a portion of the upstream pipe with the near-infrared rays. The near-infrared imaging unit generates the captured image. The captured image is generated by capturing the plurality of processing liquids in the upstream pipe irradiated with the near-infrared rays. The control unit specifies the type of the processing liquid in the upstream pipe based on the captured image.

[0011] In one embodiment, the near-infrared light source irradiates an area including at least a portion of the common pipe with the near-infrared light. The near-infrared imaging unit photographs the plurality of treatment liquids in the common pipe irradiated with the near-infrared light to generate the photographed image. The control unit specifies the type of the treatment liquid in the common pipe based on the photographed image.

[0012] In one embodiment, the control unit controls a switching timing of switching a flow destination of the processing liquid flowing through the common pipe based on a specific result of the type of the processing liquid.

[0013] In one embodiment, the at least one near-infrared light source is plural. The plural near-infrared light sources emit near-infrared rays having different peak wavelengths. The control unit acquires type information indicating the type of the treatment liquid. The control unit changes the near-infrared light source that irradiates the area including at least a portion of the liquid discharge portion based on the type information.

[0014] In one embodiment, the control unit controls the processing liquid supply unit based on a specific result of the type of the processing liquid.

[0015] According to another aspect of the present invention, a substrate processing method includes the following steps: holding a substrate in a chamber; supplying a plurality of processing liquids to the substrate at different time points; a drainage portion discharges the plurality of processing liquids out of the chamber; irradiating an area including at least a portion of the drainage portion with near-infrared rays; photographing the plurality of processing liquids in the drainage portion irradiated by the near-infrared rays to generate a photographed image; and specifying the type of the processing liquid in the drainage portion based on the photographed image.

[0016] In one embodiment, the method further includes controlling the discharge portion based on a specific result of the type of the treatment liquid.

[0017] In one embodiment, the liquid discharge section has an upstream pipe, a common pipe and a downstream pipe. The upstream pipe is used for the circulation of the plurality of processing liquids discharged from the chamber. The common pipe is connected to the downstream end of the upstream pipe. The upstream ends of the plurality of downstream pipes are connected to the common pipe.

[0018] In one embodiment, in the process of controlling the drain section, the flow destination of the processing liquid flowing through the common pipe is switched between the plurality of downstream pipes.

[0019] In one embodiment, in the step of irradiating with the near infrared ray, the region including at least a portion of the upstream pipe is irradiated with the near infrared ray. In the step of generating the captured image, the plurality of processing liquids in the upstream pipe irradiated with the near infrared ray are captured to generate the captured image. In the step of identifying the type of the processing liquid, the type of the processing liquid in the upstream pipe is identified based on the captured image.

[0020] In one embodiment, in the step of irradiating with the near infrared ray, the region including at least a portion of the above is irradiated with the near infrared ray. In the step of generating the captured image, the plurality of processing liquids in the common pipe irradiated with the near infrared ray are captured to generate the captured image. In the step of identifying the type of the processing liquid, the type of the processing liquid in the common pipe is identified based on the captured image.

[0021] In one embodiment, in the step of controlling the discharge portion, a switching timing of switching a flow destination of the processing liquid flowing through the common pipe is controlled based on a specific result of the type of the processing liquid.

[0022] In one embodiment, in the step of irradiating with near infrared rays, any one of a plurality of near infrared light sources emitting near infrared rays having different peak wavelengths irradiates an area including at least a portion of the liquid discharge portion with the near infrared rays. The substrate processing method further includes the steps of: acquiring type information indicating the type of the processing liquid; and changing the near infrared light source irradiating the area including at least a portion of the liquid discharge portion based on the type information.

[0023] In one embodiment, in the process of supplying the processing liquid at different time points, the processing liquid supplied to the substrate is switched based on a specific result of the type of the processing liquid. [Effects of the Invention]

[0024] According to the present invention, a substrate processing device and a substrate processing method can be provided which can identify the processing liquid in the liquid discharge part with high precision. Simple diagram description

[0025] FIG. 1 is a schematic top view of a substrate processing apparatus. FIG. 2 is a schematic diagram of a substrate processing unit in a substrate processing apparatus. FIG. 3 is a block diagram of a substrate processing apparatus. FIG. 4 is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment. FIG. 5 is a block diagram showing the structure of a control device and a switching unit included in the substrate processing apparatus of the present embodiment. FIG. 6 is a flow chart of a substrate processing method. FIG. 7 is a flow chart of a substrate processing step in the substrate processing method according to the present embodiment. FIG. 8 is a flow chart of a substrate processing step in the substrate processing method according to the present embodiment. FIG. 9 is a diagram showing an example of the structure of a switching valve included in the substrate processing apparatus according to the present embodiment. FIG. 10 is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment. FIG. 11 is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment. FIG. 12 is a diagram showing an example of the structure of a switching valve included in the substrate processing apparatus according to the present embodiment. FIG. 13 is a schematic diagram of a substrate processing unit in a substrate processing apparatus having a plurality of near-infrared light sources. FIG. 14 is a flow chart of a substrate processing step in the substrate processing method according to the present embodiment. Implementation

[0026] Hereinafter, the embodiments of the substrate processing device and the substrate processing method of the present invention will be described with reference to the drawings. In addition, the same reference symbols are marked on the same or equivalent parts in the drawings, and the description is not repeated. In addition, in the present specification, in order to facilitate the understanding of the invention, mutually orthogonal X-axis, Y-axis and Z-axis are sometimes described. Typically, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0027] First, a substrate processing apparatus 100 according to the present embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic top view of the substrate processing apparatus 100.

[0028] 1 , the substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by at least one of etching, surface processing, imparting characteristics, forming a processing film, removing at least a portion of a film, and cleaning the substrate W.

[0029] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrate W piece by piece.

[0030] 1 , the substrate processing apparatus 100 includes a plurality of substrate processing units 110, a fluid cabinet 10A, a fluid box 10B, a plurality of loading ports LP, a carrier robot IR, a central robot CR, and a control device 101. The control device 101 controls the loading ports LP, the carrier robot IR, the central robot CR, and the substrate processing units 110.

[0031] Each loading port LP accommodates a plurality of substrates W in a stacked manner. The carrier robot IR transports the substrates W between the loading port LP and the central robot CR. Furthermore, the following device configuration may be adopted: a setting table (path) for temporarily placing the substrates W is provided between the carrier robot IR and the central robot CR, and the substrates W are indirectly transferred between the carrier robot IR and the central robot CR via the setting table. The central robot CR transports the substrates W between the carrier robot IR and the substrate processing unit 110. Each substrate processing unit 110 sprays a processing liquid onto the substrate W to process the substrate W. The fluid cabinet 10A accommodates the processing liquid. Furthermore, the fluid cabinet 10A may also accommodate gas.

[0032] The plurality of substrate processing units 110 form a plurality of towers TW (four towers TW in FIG. 1 ) arranged so as to surround the central robot CR in a top view. Each tower TW includes substrate processing units 110 stacked up and down (three substrate processing units 110 in FIG. 1 ). The fluid boxes 10B correspond to the plurality of towers TW, respectively. The processing liquid in the fluid cabinet 10A is supplied to all the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via any fluid box 10B. In addition, the gas in the fluid cabinet 10A is supplied to all the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via any fluid box 10B.

[0033] The control device 101 controls various operations of the substrate processing device 100. The control device 101 includes a control unit 102 and a memory unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may also have a general-purpose computer.

[0034] The memory unit 104 includes a main memory device and an auxiliary memory device. The main memory device is, for example, a semiconductor memory. The auxiliary memory device is, for example, a semiconductor memory and / or a hard disk. The memory unit 104 may also include a removable medium. The control unit 102 executes the computer program stored in the memory unit 104 to perform substrate processing operations.

[0035] The memory unit 104 stores data. The data includes process recipe data. The process recipe data includes information indicating a plurality of process recipes. Each of the plurality of process recipes specifies the processing content and processing sequence of the substrate W.

[0036] Furthermore, the memory unit 104 may also memorize the brightness value or brightness of the reference processing solution. Alternatively, the memory unit 104 may also memorize the reference image obtained by photographing the reference processing solution.

[0037] Next, the substrate processing unit 110 in the substrate processing apparatus 100 of the present embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100.

[0038] The substrate processing unit 110 includes a chamber 112, a substrate holding unit 120, and a processing liquid supply unit 130. The chamber 112 accommodates the substrate holding unit 120 and the processing liquid supply unit 130.

[0039] The chamber 112 is substantially box-shaped with an internal space. The chamber 112 accommodates the substrate W. Here, the substrate processing unit 110 is a single-wafer type that processes the substrates W one by one, and accommodates the substrates W one by one in the chamber 112. The substrates W are accommodated in the chamber 112 and processed in the chamber 112.

[0040] The substrate holding part 120 holds the substrate W. The substrate holding part 120 holds the substrate W horizontally in such a manner that the upper surface (front surface) Wt of the substrate W faces upward and the back surface (lower surface) Wr of the substrate W faces vertically downward. In addition, the substrate holding part 120 rotates the substrate W while holding the substrate W. The upper surface Wt of the substrate W may also be flattened. Alternatively, a device surface may be provided on the upper surface Wt of the substrate W, or a columnar laminated body provided with a groove may be provided. The substrate holding part 120 rotates the substrate W while holding the substrate W.

[0041] For example, the substrate holding part 120 may be a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding part 120 may also have an arbitrary mechanism that holds the substrate W from the back side Wr. For example, the substrate holding part 120 may also be a vacuum type. In this case, the substrate holding part 120 holds the substrate W horizontally by adsorbing the central part of the back side Wr of the substrate W, which is the non-device forming surface, onto its upper surface. Alternatively, the substrate holding part 120 may also combine a clamping type that makes a plurality of chuck pins contact the peripheral end surface of the substrate W with a vacuum type.

[0042] For example, the substrate holding portion 120 includes a rotating base 121, a chuck member 122, a shaft 123, an electric motor 124, and a housing 125. The chuck member 122 is provided on the rotating base 121. The chuck member 122 chucks the substrate W. Typically, a plurality of chuck members 122 are provided on the rotating base 121.

[0043] The shaft 123 is a hollow shaft. The shaft 123 extends in the vertical direction along the rotation axis Ax. The rotation base 121 is coupled to the upper end of the shaft 123. The substrate W is placed on the rotation base 121.

[0044] The rotating base 121 is in the shape of a disk. The chuck member 122 supports the substrate W horizontally. The shaft 123 extends downward from the center of the rotating base 121. The electric motor 124 applies a rotational force to the shaft 123. The electric motor 124 rotates the shaft 123 in the rotation direction, thereby rotating the substrate W and the rotating base 121 around the rotation axis Ax. The housing 125 surrounds the shaft 123 and the electric motor 124.

[0045] The processing liquid supply unit 130 supplies a plurality of processing liquids at different times to the substrate W. Typically, the processing liquid supply unit 130 supplies the processing liquids to the upper surface Wt of the substrate W held by the substrate holding unit 120 .

[0046] The processing liquid may be an etching liquid for etching the substrate W. Examples of the etching liquid include nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO 3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H 3PO 4). The type of etching liquid is not particularly limited, and may be acidic or alkaline, for example.

[0047] Alternatively, the treatment liquid may be a rinse liquid. Examples of the rinse liquid include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0048] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of the organic solvent include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol ethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0049] In this embodiment, the processing liquid supply unit 130 includes a first processing liquid supply unit 130a, a second processing liquid supply unit 130b, and a rinse liquid supply unit 130c. The first processing liquid supply unit 130a supplies the first processing liquid to the substrate W. The second processing liquid supply unit 130b supplies the second processing liquid different from the first processing liquid to the substrate W. The rinse liquid supply unit 130c supplies the rinse liquid to the substrate W.

[0050] The first processing liquid supply unit 130a includes a pipe 132a, a valve 134a, a nozzle 136a, and a moving mechanism 1381. The first processing liquid from the supply source flows through the pipe 132a. The valve 134a opens and closes the flow path in the pipe 132a. The nozzle 136a is connected to the pipe 132a. The nozzle 136a sprays the first processing liquid onto the upper surface Wt of the substrate W by the first processing liquid flowing through the nozzle 136a. The nozzle 136a is preferably configured to be movable relative to the substrate W.

[0051] The pipe 132a and the nozzle 136a are made of resin. The pipe 132a and the nozzle 136a are not particularly limited, and are formed of, for example, PFA (perfluoroalkoxyalkane) or PTFE (polytetrafluoroethylene).

[0052] The moving mechanism 1381 moves the nozzle 136a in the horizontal direction and the vertical direction. Specifically, the moving mechanism 1381 moves the nozzle 136a in the circumferential direction around the rotation axis extending in the vertical direction. Furthermore, the moving mechanism 1381 moves the nozzle 136a up and down in the vertical direction.

[0053] The moving mechanism 1381 includes an arm 138a, a shaft 138b, and a driving part 138c. The arm 138a extends in the horizontal direction. The nozzle 136 is arranged at the front end of the arm 138a. The nozzle 136 is arranged at the front end of the arm 138a in a posture capable of supplying a processing liquid to the upper surface Wt of the substrate W held by the chuck member 122. In detail, the nozzle 136a is coupled to the front end of the arm 138a and protrudes downward from the arm 138a. The base end of the arm 138a is coupled to the shaft 138b. The shaft 138b extends in the vertical direction.

[0054] The driving part 138c has a rotation driving mechanism and a lifting driving mechanism. The rotation driving mechanism of the driving part 138c rotates the shaft part 138b around the rotation axis, thereby causing the arm 138a to rotate along the horizontal plane around the shaft part 138b. As a result, the nozzle 136a moves along the horizontal plane. Specifically, the nozzle 136a moves along the circumferential direction around the shaft part 138b. The rotation driving mechanism of the driving part 138c includes, for example, a motor capable of forward and reverse rotation.

[0055] The lifting drive mechanism of the driving part 138c lifts the shaft part 138b in the vertical direction. The lifting drive mechanism of the driving part 138c lifts the shaft part 138b, so that the nozzle 136 is lifted in the vertical direction. The lifting drive mechanism of the driving part 138c has a driving source such as a motor and a lifting mechanism. The lifting mechanism is driven by the driving source to lift or lower the shaft part 138b. The lifting mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0056] The second processing liquid supply unit 130b includes a pipe 132b, a valve 134b, a nozzle 136b, and a moving mechanism 1382. The second processing liquid from the supply source flows through the pipe 132b. The valve 134b opens and closes the flow path in the pipe 132b. The nozzle 136b is connected to the pipe 132b. The second processing liquid flows through the nozzle 136b, and the nozzle 136b sprays the second processing liquid onto the upper surface Wt of the substrate W. The nozzle 136b is preferably configured to be movable relative to the substrate W.

[0057] The pipe 132b and the nozzle 136b are made of resin. The pipe 132b and the nozzle 136b are not particularly limited, and are formed of, for example, PFA or PTFE.

[0058] The moving mechanism 1382 moves the nozzle 136b in the horizontal direction and the vertical direction. The moving mechanism 1382 has the same structure as the moving mechanism 1381, so the description is omitted.

[0059] The rinse liquid supply unit 130c includes a pipe 132c, a valve 134c, and a nozzle 136c. Rinsing liquid from a supply source flows through the pipe 132c. The valve 134c opens and closes the flow path in the pipe 132c. The nozzle 136c is connected to the pipe 132c. The rinse liquid flows through the nozzle 136c, and the nozzle 136c sprays the rinse liquid onto the upper surface Wt of the substrate W. The nozzle 136c is fixed relative to the substrate W.

[0060] The pipe 132c and the nozzle 136c are made of resin. The pipe 132b and the nozzle 136b are not particularly limited, and are made of, for example, PFA or PTFE.

[0061] In this specification, the pipe 132a, the pipe 132b, and the pipe 132c are sometimes collectively referred to as the pipe 132. In addition, in this specification, the valve 134a, the valve 134b, and the valve 134c are sometimes collectively referred to as the valve 134. In addition, in this specification, the nozzle 136a, the nozzle 136b, and the nozzle 136c are sometimes collectively referred to as the nozzle 136. In addition, in this specification, the moving mechanism 1381 and the moving mechanism 1382 are sometimes collectively referred to as the moving mechanism 138.

[0062] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid scattered from the substrate W. The cup 180 rises and falls. For example, during the entire period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W, the cup 180 rises vertically upward to the side of the substrate W. In this case, the cup 180 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. Moreover, when the processing liquid supply unit 130 ends the period in which the processing liquid is supplied to the substrate W, the cup 180 descends vertically downward from the side of the substrate W.

[0063] Next, the substrate processing apparatus 100 will be further described with reference to FIG2 . As shown in FIG2 , the substrate processing apparatus 100 further includes a liquid discharge unit 190 , at least one near-infrared light source 140 , and a near-infrared imaging unit 150 . In this embodiment, the substrate processing apparatus 100 includes one near-infrared light source 140 .

[0064] The drain section 190 discharges the plurality of processing liquids to the outside of the chamber 112. The drain section 190 is disposed outside the chamber 112. The drain section 190 is disposed, for example, below the chamber 112. The drain section 190 includes an upstream pipe 12, a common pipe 13, a plurality of downstream pipes 14, a switching section 19, a first port P1, a second port P2, a third port P3, and a fourth port P4.

[0065] The upstream pipe 12 is used to circulate a plurality of processing liquids discharged from the chamber 112. The upstream pipe 12 is a tubular member extending from the inside to the outside of the chamber 112. One end 12a of the upstream pipe 12 is connected to the bottom of the cup 180. More specifically, a discharge hole is provided at the bottom of the cup 180. The upstream pipe 12 is connected to the bottom of the cup 180 in a manner that is connected to the discharge hole. As a result, the processing liquid collected in the cup 180 after the substrate processing flows into the upstream pipe 12 due to its own weight. That is, the discharge liquid collected in the cup 180 flows into the upstream pipe 12 due to its own weight.

[0066] The downstream end 12 b of the upstream pipe 12 is connected to the common pipe 13 . The common pipe 13 is a tubular member and is disposed outside the chamber 112 .

[0067] The upstream ends 14a of the plurality of downstream pipes 14 are connected to the common pipe 13. The plurality of downstream pipes 14 are tubular members. In this embodiment, the plurality of downstream pipes 14 include a first pipe 141, a second pipe 142, a third pipe 143, and a fourth pipe 144.

[0068] The switching unit 19 switches the flow destination of the processing liquid flowing through the common pipe 13 (the flow destination of the processing liquid in the common pipe 13) between the plurality of downstream pipes 14. Specifically, the switching unit 19 is controlled by the control device 101 (control unit 102). The control device 101 (control unit 102) controls the switching unit 19 to switch the flow destination of the processing liquid flowing through the common pipe 13 between the plurality of downstream pipes 14. Hereinafter, the flow destination of the processing liquid flowing through the common pipe 13 is sometimes referred to as "the flow destination of the processing liquid".

[0069] In the present embodiment, the switching unit 19 switches the flow destination of the processing liquid flowing through the common pipe 13 between the first pipe 141 to the fourth pipe 144 .

[0070] In detail, the switching unit 19 includes a switching valve 191. The switching valve 191 includes a first switching valve 191a to a fourth switching valve 191d. The first switching valve 191a to the fourth switching valve 191d are arranged in sequence in a straight line. That is, the first switching valve 191a is adjacent to the second switching valve 191b, the second switching valve 191b is adjacent to the third switching valve 191c, and the third switching valve 191c is adjacent to the fourth switching valve 191d. Therefore, the first switching valve 191a is connected to the second switching valve 191b. Similarly, the second switching valve 191b is connected to the third switching valve 191c, and the third switching valve 191c is connected to the fourth switching valve 191d. In this embodiment, the switching valve 191 extends straight in a substantially horizontal posture. In this embodiment, the common pipe 13 and the first switching valve 191a to the fourth switching valve 191d constitute a multi-valve.

[0071] The downstream end 12b of the upstream pipe 12 is connected to the first switching valve 191a. More specifically, in this embodiment, the upstream pipe 12 includes a horizontal portion 12c extending in the horizontal direction, and one end of the horizontal portion 12c is connected to the first switching valve 191a. One end of the first pipe 141 is further connected to the first switching valve 191a. The other end of the first pipe 141 is connected to the first port P1. The processing liquid flowing through the upstream pipe 12 flows in the horizontal portion 12c substantially in the horizontal direction.

[0072] One end of the second pipe 142 is connected to the second switching valve 191b. The other end of the second pipe 142 is connected to the second port P2. One end of the third pipe 143 is connected to the third switching valve 191c. The other end of the third pipe 143 is connected to the third port P3. One end of the fourth pipe 144 is connected to the fourth switching valve 191d. The other end of the fourth pipe 144 is connected to the fourth port P4.

[0073] The control device 101 (control unit 102) controls the first switching valve 191a to the fourth switching valve 191d to switch the flow destination of the processing liquid between the first pipe 141 to the fourth pipe 144. In other words, the control device 101 (control unit 102) switches the flow destination of the processing liquid between the first port P1 to the fourth port P4. For example, if the first pipe 141 (first port P1) is selected as the flow destination of the processing liquid, the processing liquid flows into the first pipe 141 through the switching valve 191, and is guided to the first port P1 through the first pipe 141.

[0074] For example, a drain line (not shown) is connected to the first port P1, the second port P2, the third port P3, and the fourth port P4. The drain line is laid in a factory where the substrate processing apparatus 100 is installed. Furthermore, the first port P1, the second port P2, the third port P3, and the fourth port P4 can also be connected to a drain tank (not shown) provided in the substrate processing apparatus 100 via a pipe (not shown).

[0075] The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching portion 19 contain resin. The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching portion 19 transmit near infrared rays emitted from the near infrared light source 140. The details of the near infrared light source 140 will be described below. In the present embodiment, the upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching portion 19 transmit near infrared rays emitted from the near infrared light source 140. The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching portion 19 are not particularly limited, and are formed of, for example, PFA or PTFE.

[0076] The near-infrared light source 140 emits at least near-infrared rays. The near-infrared light source 140 irradiates an area including at least a portion of the liquid discharge portion 190 with near-infrared rays. The near-infrared light source 140 irradiates an area including at least a portion of the liquid discharge portion 190 located outside the chamber 112 with near-infrared rays. Specifically, the near-infrared light source 140 irradiates an area including at least a portion of the common pipe 13. Here, the near-infrared light source 140 emits near-infrared rays toward the entire area of ​​the common pipe 13.

[0077] For example, the near-infrared light source 140 emits at least near-infrared light having a wavelength in the range of 800 nm to 2.5 μm. Typically, the near-infrared light source 140 emits at least near-infrared light having a wavelength in the range of 800 nm to 1.5 μm. Furthermore, the near-infrared light source 140 may also emit near-infrared light and visible light.

[0078] For example, the near infrared light emitted from the near infrared light source 140 travels in a straight line along the optical axis. Alternatively, the near infrared light emitted from the near infrared light source 140 travels while diffusing around the optical axis. It is preferred that the near infrared light source 140 is arranged so that the optical axis of the near infrared light source 140 passes through the center of the common pipe 13.

[0079] The near infrared camera unit 150 has a plurality of pixels. The near infrared camera unit 150 is sensitive to at least near infrared rays. The near infrared camera unit 150 photographs a plurality of processing liquids in the liquid discharge unit 190 irradiated with near infrared rays to generate a photographed image. Specifically, the near infrared camera unit 150 photographs the inside of the liquid discharge unit 190 by receiving the component of the near infrared rays emitted from the near infrared light source 140 that passes through the components in the liquid discharge unit 190 and / or is reflected, thereby generating a photographed image. Here, the near infrared camera unit 150 receives the component of the near infrared rays emitted from the near infrared light source 140 that passes through the common pipe 13 and / or is reflected.

[0080] The near-infrared camera section 150 captures an area including at least a portion of the drainage section 190. The near-infrared camera section 150 captures an area including at least a portion of the drainage section 190 located outside the chamber 112. The near-infrared camera section 150 may also capture the entire drainage section 190. Alternatively, the near-infrared camera section 150 may also capture a portion of the drainage section 190. In this case, the near-infrared camera section 150 may also switch the capture area in the drainage section 190 to capture. Alternatively, the near-infrared camera section 150 may also switch the capture area between the entire drainage section 190 and a portion of the drainage section 112 to capture. The area captured by the near-infrared camera section 150 may not be consistent with the area irradiated by the near-infrared light source 140.

[0081] In the near infrared camera unit 150, the frame rate may be 30 fps, or 60 fps, or 120 fps.

[0082] The near infrared camera unit 150 may also include a SWIR (Short Wavelength Infra-Red) image sensor. In this case, the near infrared camera unit 150 at least detects near infrared rays within a wavelength range of 800 nm or more and 2.5 μm or less.

[0083] Furthermore, the near infrared camera unit 150 may be sensitive not only to near infrared rays but also to visible light. Alternatively, the near infrared camera unit 150 may switch between near infrared rays and visible light to receive light.

[0084] The near infrared camera unit 150 captures the surroundings centered on the capturing optical axis. Typically, the capturing optical axis is located at the center of the captured image. For example, the center of the captured image of the near infrared camera unit 150 is located at the center of the common pipe 13. In this case, the capturing optical axis of the near infrared camera unit 150 is located at the center of the common pipe 13. Alternatively, the center of the captured image of the near infrared camera unit 150 may also be located at the upstream pipe 12.

[0085] The near infrared imaging unit 150 generates an image obtained by capturing an area including at least a portion of the liquid discharge unit 190. The type of the processing liquid in the liquid discharge unit 190 is identified using the image. For example, it is preferable to identify the type of the processing liquid flowing in the common pipe 13 using the image. Alternatively, it is preferable to identify the type of the processing liquid flowing in the upstream pipe 12 using the image.

[0086] When the substrate processing unit 110 is observed from vertically above, the optical axis of the near-infrared light source 140 and the optical axis of the near-infrared imaging unit 150 pass through the drain 190. Furthermore, when the substrate processing unit 110 is observed from vertically above, the optical axis of the near-infrared light source 140 and the optical axis of the near-infrared imaging unit 150 may be consistent or parallel. Furthermore, when the substrate processing unit 110 is observed from vertically above, the optical axis of the near-infrared light source 140 and the optical axis of the near-infrared imaging unit 150 may not be parallel.

[0087] Here, the near infrared light source 140 and the near infrared imaging unit 150 are arranged near the drain portion 190. Specifically, the near infrared light source 140 and the near infrared imaging unit 150 are arranged near the common pipe 13. The near infrared light source 140 and the near infrared imaging unit 150 may also be arranged fixedly to each other.

[0088] The near-infrared light source 140 and the near-infrared camera unit 150 may also be movable relative to the liquid discharge unit 190. For example, the near-infrared light source 140 and the near-infrared camera unit 150 are preferably movable in the horizontal direction and / or the vertical direction following the moving mechanism controlled by the control unit 102. When the near-infrared light source 140 and the near-infrared camera unit 150 move, the near-infrared light source 140 and the near-infrared camera unit 150 may also be movable independently of each other. Alternatively, the near-infrared light source 140 and the near-infrared camera unit 150 may also be movable as a whole.

[0089] The processing liquid may also contain organic matter. For example, in organic matter, bonds such as CH, CO, CN, and CF absorb specific wavelengths contained in near-infrared rays. The absorption amount of a specific wavelength of near-infrared rays is proportional to the amount of components having a specific bonding group, so the amount of a specific component present in the substrate W can be measured based on the near-infrared rays that pass through the liquid discharge section 190 and / or are reflected. Therefore, the type of processing liquid flowing through the liquid discharge section 190 can be identified.

[0090] As described above, the control device 101 includes the control unit 102 and the memory unit 104. The control unit 102 controls the substrate holding unit 120, the processing liquid supply unit 130, the near-infrared light source 140, the near-infrared imaging unit 150, the cup 180, and / or the liquid discharge unit 190. In one example, the control unit 102 controls the electric motor 124, the valve 134a, the valve 134b, the valve 134c, the moving mechanism 1381, the moving mechanism 1382, the near-infrared light source 140, the near-infrared imaging unit 150, the cup 180, and / or the liquid discharge unit 190.

[0091] According to the substrate processing apparatus 100 of the present embodiment, the processing liquid in the chamber 112 irradiated with near infrared light from the near infrared light source 140 is photographed by the near infrared camera unit 150. Typically, the processing liquid is transparent and allows visible light to pass through. On the other hand, the processing liquid often exhibits relatively strong absorption in the near infrared region. Moreover, the processing liquid often exhibits unique absorption in the near infrared region depending on the type. Therefore, the type of the processing liquid can be identified in the photographed image obtained by photographing the processing liquid in the liquid discharge unit 190 by the near infrared camera unit 150.

[0092] Furthermore, when the absorbance of the processing liquid to near infrared rays is very high, the near infrared light source 140 preferably emits near infrared rays and visible light. Thus, the captured image can show the processing liquid in the discharge portion 190 with relatively high brightness.

[0093] Alternatively, since the wavelength showing strong absorption varies depending on the treatment liquid, the near-infrared light source 140 can also change the wavelength of the emitted near-infrared light. In this way, the outer edge and type of the treatment liquid can be easily identified.

[0094] The substrate processing apparatus 100 of this embodiment is suitable for manufacturing a semiconductor element provided with a semiconductor. Typically, in a semiconductor element, a conductive layer and an insulating layer are stacked on a substrate. The substrate processing apparatus 100 is suitable for cleaning and / or processing (e.g., etching, characteristic change, etc.) the conductive layer and / or the insulating layer when manufacturing a semiconductor element.

[0095] Next, a substrate processing apparatus 100 according to the present embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 3 is a block diagram of the substrate processing apparatus 100.

[0096] As shown in FIG3 , the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the carrier robot IR, the central robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the near-infrared light source 140, the near-infrared camera unit 150, the cup 180, and the liquid discharge unit 190. Specifically, the control device 101 controls the carrier robot IR, the central robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the near-infrared light source 140, the near-infrared camera unit 150, the cup 180, and the liquid discharge unit 190 by sending control signals to the carrier robot IR, the central robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the near-infrared light source 140, the near-infrared camera unit 150, the cup 180, and the liquid discharge unit 190.

[0097] In addition, the memory unit 104 stores computer programs and data. The data includes process recipe data. The process recipe data includes information indicating a plurality of process recipes. Each of the plurality of process recipes specifies the processing content, processing sequence, and substrate processing conditions of the substrate W. The control unit 102 executes the computer program stored in the memory unit 104 to perform substrate processing operations.

[0098] Furthermore, the process recipe data includes type information indicating the type of the processing liquid supplied from the nozzle 136 to the substrate W. Furthermore, the memory unit 104 pre-memorizes data associating the type of the processing liquid with the brightness or lightness of the processing liquid in the reference image.

[0099] The control unit 102 controls the carrier robot IR to transfer the substrate W via the carrier robot IR.

[0100] The control unit 102 controls the central robot CR to transfer the substrate W through the central robot CR. For example, the central robot CR receives an unprocessed substrate W and moves the substrate W into any one of the plurality of chambers 112. Also, the central robot CR receives a processed substrate W from the chamber 112 and moves the substrate W out.

[0101] The control unit 102 controls the substrate holding unit 120 to control the start of rotation of the substrate W, change of the rotation speed, and stop of the rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 120 to change the rotation speed of the substrate holding unit 120. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 124 of the substrate holding unit 120.

[0102] The control unit 102 can control the valve 134 of the processing liquid supply unit 130 to switch the state of the valve 134 between an open state and a closed state. Specifically, the control unit 102 can control the valve 134 of the processing liquid supply unit 130 to set the valve 134 to an open state, thereby allowing the processing liquid flowing in the pipe 132 toward the nozzle 136 to pass. In addition, the control unit 102 can control the valve 134 of the processing liquid supply unit 130 to set the valve 134 to a closed state, thereby stopping the supply of the processing liquid flowing in the pipe 132 toward the nozzle 136.

[0103] The control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136. Specifically, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 to above the upper surface Wt of the substrate W. In addition, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 to a retreat position away from above the upper surface Wt of the substrate W.

[0104] The control unit 102 controls the near-infrared light source 140 and the near-infrared camera unit 150 to capture the area including at least a portion of the liquid discharge unit 190 and generate a captured image. The control unit 102 controls the near-infrared light source 140 to irradiate the area including at least a portion of the liquid discharge unit 190 with near-infrared rays. In addition, the control unit 102 controls the near-infrared camera unit 150 to capture the area including at least a portion of the liquid discharge unit 190 and generate a captured image.

[0105] For example, the control unit 102 controls the near-infrared light source 140 and the near-infrared imaging unit 150 in the following manner: near-infrared light is emitted from the near-infrared light source 140 toward the common pipe 13, and near-infrared light that has passed through each component or has been reflected is received in the near-infrared imaging unit 150 to measure the brightness value. Furthermore, the control unit 102 may also control the near-infrared light source 140 and the near-infrared imaging unit 150 so that the near-infrared light source 140 and the near-infrared imaging unit 150 move relative to the common pipe 13.

[0106] Furthermore, the control unit 102 specifies the type of the processing liquid in the liquid discharge unit 190 based on the captured image. Specifically, the control unit 102 specifies the type of the processing liquid in the captured image based on the brightness value in the captured image. The type of the processing liquid in the captured image is specified based on the brightness value in the captured image and the brightness value of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 specifies the type of the processing liquid in the captured image based on the captured image and the reference image.

[0107] The control unit 102 can also control the cup 180 to move the cup 180 relative to the substrate W. Specifically, during the entire period that the processing liquid supply unit 130 supplies the processing liquid to the substrate W, the control unit 102 causes the cup 180 to rise vertically upward to the side of the substrate W. After the processing liquid supply unit 130 supplies the processing liquid to the substrate W, the control unit 102 causes the cup 180 to fall vertically downward from the side of the substrate W.

[0108] The substrate processing apparatus 100 of this embodiment is suitable for forming a semiconductor element. For example, the substrate processing apparatus 100 is suitable for processing a substrate W used as a semiconductor element of a stacked structure. The semiconductor element is a so-called 3D structure memory (memory device). As an example, the substrate W is suitable for use as a NAND type flash memory.

[0109] Furthermore, the control unit 102 controls the drain unit 190 based on the identification result of the type of the processing liquid. For example, the control unit 102 controls the switching timing of switching the flow destination of the processing liquid flowing through the common pipe 13 based on the identification result of the type of the processing liquid.

[0110] Next, an example of the structure of the switching valve 191 will be described with reference to Fig. 4. Fig. 4 is a diagram showing an example of the structure of the switching valve 191 included in the substrate processing apparatus 100 of the present embodiment.

[0111] As shown in FIG. 4 , the switching valve 191 may also include a first valve body 193a to a fourth valve body 193d, a common flow path MR, and a first branch flow path BR1 to a fourth branch flow path BR4. The first valve body 193a and the first branch flow path BR1 are included in the first switching valve 191a. The second valve body 193b and the second branch flow path BR2 are included in the second switching valve 191b. The third valve body 193c and the third branch flow path BR3 are included in the third switching valve 191c. The fourth valve body 193d and the fourth branch flow path BR4 are included in the fourth switching valve 191d.

[0112] The common flow path MR extends linearly in a substantially horizontal posture. One end of the common flow path MR is open, and the other end of the common flow path MR is closed. The upstream pipe 12 is connected to one end of the common flow path MR, and the flow path R1 of the upstream pipe 12 is connected to the common flow path MR.

[0113] The first branch flow path BR1 to the fourth branch flow path BR4 are respectively flow paths branched from the common flow path MR, and communicate with the common flow path MR. The first branch flow path BR1 to the fourth branch flow path BR4 extend in a direction intersecting with the direction in which the common flow path MR extends.

[0114] One end of the first branch flow path BR1 is connected to the common flow path MR. The first pipe 141 is connected to the other end of the first branch flow path BR1, and the flow path R2a of the first pipe 141 is communicated with the first branch flow path BR1.

[0115] One end of the second branch flow path BR2 is connected to the common flow path MR. The second pipe 142 is connected to the other end of the second branch flow path BR2, and the flow path R2b of the second pipe 142 is communicated with the second branch flow path BR2.

[0116] One end of the third branch flow path BR3 is connected to the common flow path MR. The third pipe 143 is connected to the other end of the third branch flow path BR3, and the flow path R2c of the third pipe 143 is communicated with the third branch flow path BR3.

[0117] One end of the fourth branch flow path BR4 is connected to the common flow path MR. The fourth pipe 144 is connected to the other end of the fourth branch flow path BR4, and the flow path R2d of the fourth pipe 144 is communicated with the fourth branch flow path BR4.

[0118] The first valve body 193a can move between a closed position and an open position. The closed position of the first valve body 193a indicates a position where the first valve body 193a closes one end of the first branch flow path BR1. The open position of the first valve body 193a indicates a position where the first valve body 193a opens one end of the first branch flow path BR1 to connect the first branch flow path BR1 with the common flow path MR.

[0119] If the first valve body 193a moves from the open position to the closed position, one end of the first branch flow path BR1 is closed, and the first branch flow path BR1 and the common flow path MR are no longer connected. Therefore, the first branch flow path BR1 and the flow path R1 of the upstream pipe 12 are no longer connected. On the other hand, if the first valve body 193a moves from the closed position to the open position, one end of the first branch flow path BR1 is opened, and the first branch flow path BR1 and the common flow path MR are connected. That is, the first branch flow path BR1 and the flow path R1 of the upstream pipe 12 are connected.

[0120] The second valve body 193b is movable between a closed position and an open position, similarly to the first valve body 193a. The closed position of the second valve body 193b indicates a position where the second valve body 193b closes one end of the second branch flow path BR2. The open position of the second valve body 193b indicates a position where the second valve body 193b opens one end of the second branch flow path BR2 to connect the second branch flow path BR2 with the common flow path MR.

[0121] If the second valve body 193b moves from the open position to the closed position, one end of the second branch flow path BR2 is closed, and the second branch flow path BR2 and the common flow path MR are no longer connected. Therefore, the second branch flow path BR2 and the flow path R1 of the upstream pipe 12 are no longer connected. On the other hand, if the second valve body 193b moves from the closed position to the open position, one end of the second branch flow path BR2 is opened, and the second branch flow path BR2 and the common flow path MR are connected. That is, the second branch flow path BR2 is connected to the flow path R1 of the upstream pipe 12.

[0122] The third valve body 193c is movable between a closed position and an open position, similarly to the first valve body 193a and the second valve body 193b. The closed position of the third valve body 193c indicates a position where the third valve body 193c closes one end of the third branch flow path BR3. The open position of the third valve body 193c indicates a position where the third valve body 193c opens one end of the third branch flow path BR3 to connect the third branch flow path BR3 with the common flow path MR.

[0123] If the third valve body 193c moves from the open position to the closed position, one end of the third branch flow path BR3 is closed, and the third branch flow path BR3 and the common flow path MR become disconnected. Therefore, the third branch flow path BR3 and the flow path R1 of the upstream pipe 12 become disconnected. On the other hand, if the third valve body 193c moves from the closed position to the open position, one end of the third branch flow path BR3 is opened, and the third branch flow path BR3 and the common flow path MR are connected. That is, the third branch flow path BR3 is connected to the flow path R1 of the upstream pipe 12.

[0124] The fourth valve body 193d is movable between a closed position and an open position, similarly to the first valve body 193a to the third valve body 193c. The closed position of the fourth valve body 193d indicates a position where the fourth valve body 193d closes one end of the fourth branch flow path BR4. The open position of the fourth valve body 193d indicates a position where the fourth valve body 193d opens one end of the fourth branch flow path BR4 to connect the fourth branch flow path BR4 with the common flow path MR.

[0125] If the fourth valve body 193d moves from the open position to the closed position, one end of the fourth branch flow path BR4 is closed, and the fourth branch flow path BR4 and the common flow path MR are no longer connected. Therefore, the fourth branch flow path BR4 and the flow path R1 of the upstream pipe 12 are no longer connected. On the other hand, if the fourth valve body 193d moves from the closed position to the open position, one end of the fourth branch flow path BR4 is opened, and the fourth branch flow path BR4 and the common flow path MR are connected. That is, the fourth branch flow path BR4 is connected to the flow path R1 of the upstream pipe 12.

[0126] 4 illustrates a switching valve 191 in which the first valve body 193a is located at an open position and the second valve body 193b to the fourth valve body 193d are located at a closed position. In this case, the first pipe 141 becomes the flow destination of the treatment liquid (drain liquid) flowing in the common pipe 13.

[0127] Next, the substrate processing apparatus 100 of the present embodiment will be described with reference to Fig. 5. Fig. 5 is a block diagram showing the configuration of the control device 101 and the switching unit 19 included in the substrate processing apparatus 100 of the present embodiment.

[0128] As shown in Fig. 5, the switching valve 191 further includes a first valve driving unit 192a to a fourth valve driving unit 192d. The first valve driving unit 192a is included in the first switching valve 191a. Similarly, the second valve driving unit 192b to the fourth valve driving unit 192d are included in the second switching valve 191b to the fourth switching valve 191d, respectively.

[0129] The first valve driving unit 192a is controlled by the control device 101 (control unit 102) to move the first valve body 193a between the closed position and the open position. The first valve driving unit 192a may include a motor as a power source for the first valve body 193a.

[0130] Similarly, the second valve driving unit 192b is controlled by the control device 101 (control unit 102) to move the second valve body 193b between the closed position and the open position. The third valve driving unit 192c is controlled by the control device 101 (control unit 102) to move the third valve body 193c between the closed position and the open position. The fourth valve driving unit 192d is controlled by the control device 101 (control unit 102) to move the fourth valve body 193d between the closed position and the open position. Each of the second valve driving unit 192b to the fourth valve driving unit 192d may include a motor as a power source for the second valve body 193b to the fourth valve body 193d.

[0131] Next, the substrate processing method of this embodiment is described with reference to Figures 1 to 6. Figure 6 is a flow chart of the substrate processing method. In addition, step SB is an example of the "step of holding the substrate" of the present invention.

[0132] As shown in Fig. 6, in step SA, the substrate W is carried into the substrate processing apparatus 100. Specifically, the substrate W is carried into the chamber 112 of the substrate processing unit 110 via the carrier robot IR and the central robot CR.

[0133] In step SB, the substrate W is held. Specifically, in the chamber, the substrate holding unit 120 holds the substrate W. After the substrate W is carried into the chamber 112 , the substrate W is held by the substrate holding unit 120 .

[0134] In step SC, the substrate W is processed. The substrate W is processed in the substrate processing unit 110. Typically, the substrate holding unit 120 rotates while holding the substrate W, and the processing liquid supply unit 130 supplies the processing liquid to the substrate W.

[0135] In the present embodiment, the near-infrared light source 140 emits near-infrared rays. The region including at least a portion of the liquid discharge portion 190 is irradiated with the near-infrared rays emitted from the near-infrared light source 140. For example, the common pipe 13 is irradiated with the near-infrared rays emitted from the near-infrared light source 140. The near-infrared camera section 150 photographs the region including at least a portion of the liquid discharge portion 190 irradiated with the near-infrared rays. For example, the near-infrared camera section 150 photographs the common pipe 13 irradiated with the near-infrared rays. By photographing the region including at least a portion of the liquid discharge portion 190 irradiated with the near-infrared camera section 150, even if the processing liquid in the liquid discharge portion 190 is substantially transparent, the processing liquid can be photographed with high precision.

[0136] In step SD, the substrate W is released from being held. Specifically, the substrate holding portion 120 releases the substrate W from being held.

[0137] In step SE, the substrate W is unloaded. The substrate W is unloaded from the substrate processing apparatus 100. Specifically, the substrate W is unloaded from the chamber 112 of the substrate processing unit 110 via the central robot CR and the carrier robot IR.

[0138] According to this embodiment, the near-infrared imaging unit 150 captures the processing liquid irradiated with near-infrared light from the near-infrared light source 140. The processing liquid often exhibits unique absorption in the near-infrared region depending on the type. Therefore, in the captured image of the processing liquid in the liquid discharge unit 190 captured by the near-infrared imaging unit 150, the type of the processing liquid can be identified.

[0139] Next, the substrate processing steps in the substrate processing method of the present embodiment are described with reference to FIGS. 1 to 11. FIGS. 7 and 8 are flow charts of the substrate processing steps in the substrate processing method of the present embodiment. FIGS. 9 to 11 are diagrams showing an example of the structure of the switching valve 191 included in the substrate processing apparatus 100 of the present embodiment.

[0140] In FIG. 7 and FIG. 8, step S120 is an example of the "process of utilizing near-infrared irradiation", "process of generating a photographic image" and "process of changing the near-infrared light source" of the present invention. Step S125 is an example of the "process of obtaining type information" of the present invention. Step S130, step S160 and step S210 are an example of the "process of supplying a plurality of processing liquids at different time points" of the present invention. Step S140, step S170 and step S220 are an example of the "process of discharging liquid" of the present invention. Step S180 and step S230 are an example of the "process of specifying the type of processing liquid" of the present invention. Step S250 is an example of the "process of controlling the liquid discharge portion" of the present invention.

[0141] In Fig. 9, area AR1 indicates an area where near-infrared light source 140 irradiates near-infrared rays. Area AR2 indicates an area captured by near-infrared imaging unit 150. In this embodiment, area AR1 coincides with area AR2.

[0142] As shown in FIG. 7 , in step S110 , the substrate W is rotated while being held. Specifically, the substrate holding unit 120 rotates the substrate W while holding the substrate W. For example, the rotation speed of the substrate W is 10 rpm to 1500 rpm. The process proceeds to step S120 .

[0143] In step S120, the near-infrared light source 140 irradiates the area including at least a portion of the liquid discharge portion 190 with near-infrared rays, and the near-infrared camera unit 150 photographs the area including at least a portion of the liquid discharge portion 190 irradiated with near-infrared rays. The near-infrared light source 140 irradiates the area including at least a portion of the liquid discharge portion 190 with near-infrared rays, and the near-infrared camera unit 150 photographs the area including at least a portion of the liquid discharge portion 190 irradiated with near-infrared rays to generate a photographed image. The control unit 102 controls the near-infrared light source 140 and the near-infrared camera unit 150 in the following manner, namely: the near-infrared light source 140 emits near-infrared rays toward the area including at least a portion of the liquid discharge portion 190, and the near-infrared camera unit 150 photographs the area including at least a portion of the liquid discharge portion 190. Furthermore, the time point when the near-infrared light source 140 starts to emit near-infrared rays and the time point when the near-infrared imaging unit 150 starts to photograph the substrate W may be the same or different. Also, the time point when the near-infrared light source 140 starts to emit near-infrared rays may be earlier or later than the time point when the near-infrared imaging unit 150 starts to photograph the substrate W. The process proceeds to step S125.

[0144] In step S125, type information indicating the type of the processing liquid is obtained. Specifically, the control unit 102 obtains type information indicating the type of the processing liquid from the process recipe data stored in the memory unit 104. In this embodiment, the types of the processing liquid are, for example, SC1 (ammonia-hydrogen peroxide solution), DIW, and IPA. In addition, the control unit 102 obtains data that associates the type of the processing liquid with the brightness or lightness of the processing liquid in the reference image from the process recipe data stored in the memory unit 104. The process proceeds to step S130.

[0145] In step S130, the first processing liquid La is supplied to the upper surface Wt of the substrate W. Specifically, the first processing liquid supply unit 130a starts supplying the first processing liquid La to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the first processing liquid supply unit 130a to start supplying the first processing liquid La to the upper surface Wt of the substrate W. The first processing liquid La is, for example, SC1. The process proceeds to step S140.

[0146] Furthermore, the supply of the processing liquid in step S130 may be started before or after the irradiation of the near-infrared rays in step S120 and / or the photographing by the near-infrared camera unit 150 .

[0147] In step S140, the drain unit 190 discharges the processing liquid after the substrate processing to the outside of the chamber 112. Here, the drain unit 190 discharges the first processing liquid La after the substrate processing to the outside of the chamber 112. Here, as shown in FIG. 9, in the switching valve 191, the first valve body 193a is located in the open position, and the second valve body 193b to the fourth valve body 193d are located in the closed position. In this case, the first pipe 141 becomes the flow destination of the first processing liquid La flowing in the common pipe 13. Therefore, the first processing liquid La after the substrate processing flows in the upstream pipe 12, flows in the common pipe 13, and then flows in the first pipe 141. Furthermore, the first valve body 193a may be driven in an open position and the second valve body 193b to the fourth valve body 193d may be driven in a closed position at the time of step S140. If the first valve body 193a is in an open position and the second valve body 193b to the fourth valve body 193d are in a closed position in advance, this state may be maintained. The process proceeds to step S150.

[0148] In step S150, the supply of the first processing liquid La is stopped. Specifically, the first processing liquid supply unit 130a stops supplying the first processing liquid La to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the first processing liquid supply unit 130a in the following manner, that is, after a predetermined period has passed since the supply of the first processing liquid La was started, the supply of the first processing liquid La is stopped. The predetermined period is, for example, 30 seconds. The predetermined period, that is, the time from the start of the supply of the first processing liquid La to the stop of the supply of the first processing liquid La, is specified by the process recipe represented by the process recipe data stored in the memory unit 104. The process proceeds to step S160.

[0149] In step S160, the rinse liquid Lb is supplied to the upper surface Wt of the substrate W. Specifically, the rinse liquid supply unit 130c starts supplying the rinse liquid Lb to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the rinse liquid supply unit 130c to start supplying the rinse liquid Lb to the upper surface Wt of the substrate W. By supplying the rinse liquid Lb to the upper surface Wt of the substrate W, the first processing liquid La covering the upper surface Wt of the substrate W is replaced with the rinse liquid Lb. The rinse liquid Lb is, for example, DIW. The process proceeds to step S170.

[0150] In step S170, the drain section 190 discharges the processing liquid after the substrate processing to the outside of the chamber 112. Here, the drain section 190 discharges the rinse liquid Lb after the substrate processing to the outside of the chamber 112. Here, as shown in FIG. 10, in the switching valve 191, the first valve body 193a is located at the open position, and the second valve body 193b to the fourth valve body 193d are located at the closed position. In this case, the first pipe 141 becomes the flow destination of the rinse liquid Lb flowing in the common pipe 13. Therefore, the rinse liquid Lb after the substrate processing flows in the upstream pipe 12, flows in the common pipe 13, and then flows in the first pipe 141 of the downstream pipe 14. The first processing liquid La flowing in the drain section 190 is gradually diluted by the rinse liquid Lb. That is, with respect to the processing liquid flowing through the liquid discharge section 190, as time passes, the ratio of the first processing liquid La decreases, and the ratio of the rinse liquid Lb increases. Furthermore, the first valve body 193a may be driven in an open position and the second valve body 193b to the fourth valve body 193d may be driven in a closed position at the time of step S170. If the first valve body 193a is in an open position and the second valve body 193b to the fourth valve body 193d are in a closed position in advance, this state may be maintained. The process proceeds to step S180.

[0151] In step S180, the type of the processing liquid in the captured image is identified based on the captured image generated by the near-infrared imaging unit 150. The control unit 102 identifies the type of the processing liquid in the captured image based on the captured image. In this embodiment, the control unit 102 identifies the type of the processing liquid in the common pipe 13 based on the captured image. Furthermore, the control unit 102 can also identify the type of the processing liquid in the upstream pipe 12 based on the captured image.

[0152] More specifically, the control unit 102 identifies the type of the processing liquid in the captured image based on the brightness value or brightness in the captured image generated by the near-infrared imaging unit 150. Alternatively, the control unit 102 identifies the type of the processing liquid in the captured image based on the brightness value or brightness in the captured image and the brightness value or brightness of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 identifies the type of the processing liquid in the captured image based on the captured image and the reference image.

[0153] Furthermore, the control unit 102 specifies the position of the rinse liquid Lb (processing liquid) in the captured image based on the brightness value or brightness in the captured image and the type information. Furthermore, the control unit 102 may also identify the area where the first processing liquid La is located and the area where the rinse liquid Lb is located in a specified area of ​​the captured image (for example, an area corresponding to the common pipe 13) based on the brightness value or brightness in the captured image, the brightness value or brightness of the reference processing liquid stored in the memory unit 104, and the type information. Furthermore, for example, the control unit 102 may also calculate the ratio of the number of pixels having the brightness value or brightness corresponding to the first processing liquid La to the total number of pixels in the specified area in the captured image (for example, an area corresponding to the common pipe 13). Furthermore, the control unit 102 may also calculate the total brightness value or brightness of all pixels in the specified area.

[0154] For example, when the area where the rinse liquid Lb is located is greater than or equal to a predetermined value (e.g., 99%) of a predetermined area of ​​the captured image (e.g., an area corresponding to the common pipe 13), the control unit 102 specifies the type of the processing liquid as the rinse liquid Lb. For another example, when the calculated above ratio is greater than or equal to a predetermined value (e.g., 99%), the control unit 102 specifies the type of the processing liquid as the rinse liquid Lb. Furthermore, when the calculated above total is greater than or equal to a predetermined value, the control unit 102 may also specify the type of the processing liquid as the rinse liquid Lb.

[0155] In step S190, the control unit 102 determines whether the type of the specified processing liquid is the rinse liquid Lb. If the control unit 102 determines that the type of the specified processing liquid is not the rinse liquid Lb (No in step S190), the process returns to step S180. In this way, for the processing liquid flowing in the discharge unit 190, the identification of the type of the processing liquid and the determination of whether the type of the specified processing liquid is the rinse liquid Lb are repeated until the first processing liquid La is replaced by the rinse liquid Lb. On the other hand, if the control unit 102 determines that the type of the specified processing liquid is the rinse liquid Lb (Yes in step S190), the process enters step S190.

[0156] In step S200, the supply of the rinse liquid Lb is stopped. Specifically, the rinse liquid supply unit 130c stops supplying the rinse liquid Lb to the upper surface Wt of the substrate W. More specifically, the control unit 102 controls the rinse liquid supply unit 130c (the treatment liquid supply unit 130) to stop supplying the rinse liquid Lb based on the identification result of the type of the treatment liquid. Specifically, if the control unit 102 determines that the type of the identified treatment liquid is the rinse liquid Lb (yes in step S190), the control unit 102 controls the rinse liquid supply unit 130c (the treatment liquid supply unit 130) to stop supplying the rinse liquid Lb. Therefore, the supply of the rinse liquid Lb can be stopped after the treatment liquid flowing in the discharge unit 190 is fully replaced from the first treatment liquid La to the rinse liquid Lb. Therefore, the timing of stopping the supply of the rinse liquid Lb can be executed at an appropriate time. As a result, the amount of the rinse liquid Lb used can be suppressed. As shown in FIG. 8, the process enters step S210.

[0157] As shown in FIG8 , in step S210, the second processing liquid Lc is supplied to the upper surface Wt of the substrate W. Specifically, the second processing liquid supply unit 130b starts to supply the second processing liquid Lc to the upper surface Wt of the substrate W. Here, when the supply of the rinse liquid Lb to the substrate W is stopped, the supply of the second processing liquid Lc starts. The second processing liquid Lc is, for example, isopropyl alcohol (IPA). The process proceeds to step S220.

[0158] In step S220, the drain section 190 discharges the processing liquid after the substrate processing to the outside of the chamber 112. Here, the drain section 190 discharges the second processing liquid Lc after the substrate processing to the outside of the chamber 112. Here, as shown in FIG. 10, in the switching valve 191, the first valve body 193a is located in the open position, and the second valve body 193b to the fourth valve body 193d are located in the closed position. With respect to the processing liquid flowing in the drain section 190, as time passes, the ratio of the rinse liquid Lb decreases, and the ratio of the second processing liquid Lc increases. The process enters step S230.

[0159] In step S230, the type of the processing liquid in the captured image is identified based on the captured image generated by the near-infrared imaging unit 150. The control unit 102 identifies the type of the processing liquid in the captured image based on the captured image. For example, the control unit 102 identifies the type of the processing liquid in the captured image based on the captured image.

[0160] Furthermore, the control unit 102 specifies the type of the processing liquid in the captured image based on the brightness value in the captured image. The type of the processing liquid in the captured image is specified based on the brightness value in the captured image and the brightness value of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 specifies the type of the processing liquid in the captured image based on the captured image and the reference image.

[0161] In step S240, the control unit 102 determines whether the type of the specified processing liquid is the second processing liquid Lc. If the control unit 102 determines that the type of the specified processing liquid is not the second processing liquid Lc (No in step S240), the process returns to step S230. In this way, for the processing liquid flowing in the discharge unit 190, the identification of the type of the processing liquid and the determination of whether the type of the specified processing liquid is the second processing liquid Lc are repeated until the rinse liquid Lb is replaced with the second processing liquid Lc. On the other hand, if the control unit 102 determines that the type of the specified processing liquid is the second processing liquid Lc (Yes in step S240), the process proceeds to step S250.

[0162] In step S250, the control unit 102 controls the drain unit 190 based on the identification result of the type of the treatment liquid. Specifically, the control unit 102 switches the flow destination of the treatment liquid flowing in the common pipe 13 between the plurality of downstream pipes 14. More specifically, in step S240, if the control unit 102 determines that the type of the identified treatment liquid is the second treatment liquid Lc (yes in step S240), the control unit 102 controls the switching valve 191 in the following manner, that is, from the state in which the first valve body 193a is located in the open position and the second valve body 193b to the fourth valve body 193d are located in the closed position in the switching valve 191 as shown in FIG. 10, to the state in which the second valve body 193b is located in the open position and the first valve body 193a, the second valve body 193b and the fourth valve body 193d are located in the closed position in the switching valve 191 as shown in FIG. 11. As a result, the flow destination of the processing liquid flowing through the common pipe 13 is switched from the first pipe 141 to the second pipe 142. Therefore, the second processing liquid Lc after the substrate processing flows through the upstream pipe 12, flows through the common pipe 13, and then flows through the second pipe 142. The process proceeds to step S260.

[0163] In step S260, the drain unit 190 discharges the processing liquid after the substrate processing to the outside of the chamber 112. Here, the drain unit 190 discharges the second processing liquid Lc after the substrate processing to the outside of the chamber 112. In step S250, the flow destination of the processing liquid flowing in the common pipe 13 is switched from the first pipe 141 to the second pipe 142. Therefore, the second processing liquid Lc is discharged through the second pipe 142.

[0164] In step S270, the supply of the second processing liquid Lc is stopped. Specifically, the second processing liquid supply unit 130b stops supplying the second processing liquid Lc to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the second processing liquid supply unit 130b in the following manner, that is, after a predetermined period has passed since the start of supplying the second processing liquid Lc, the supply of the second processing liquid Lc is stopped. The predetermined period is, for example, 4 seconds. The predetermined period, i.e., the time from the start of supplying the second processing liquid Lc to the stop of supplying the second processing liquid Lc, is specified by the process recipe represented by the process recipe data stored in the memory unit 104. The process proceeds to step S280.

[0165] In step S280, the rotation of the substrate W is stopped. Specifically, the control unit 102 controls the substrate holding unit 120 so that the substrate holding unit 120 stops the rotation of the substrate W. The process ends.

[0166] In this embodiment, the area including at least a part of the liquid discharge section 190 irradiated with near infrared rays from the near infrared imaging section 150 is photographed. The near infrared rays are selectively absorbed by the processing liquid. Therefore, the processing liquid in the liquid discharge section 190 can be photographed with high precision. Therefore, the type of the processing liquid in the liquid discharge section 190 can be identified. As a result, the control section 102 can control the processing of the liquid discharge section 190 according to the type of the processing liquid in the liquid discharge section 190.

[0167] As described above, the near infrared light source 140 can also switch between visible light and near infrared light to emit. In addition, the near infrared camera unit 150 can also switch between the visible light region and the near infrared region to shoot.

[0168] In this embodiment, as described above, the control unit 102 specifies the type of the processing liquid in the area including at least a portion of the discharge unit 190 based on the captured image. Therefore, for example, it is possible to confirm whether the processing liquid in the discharge unit 190 has been switched.

[0169] Furthermore, in the present embodiment, after the control unit 102 determines that the type of the specified processing liquid is the second processing liquid Lc (for example, IPA) (Yes in step S240), the control unit 102 controls the drain unit 190 (step S250). Specifically, for example, after the processing liquid in the drain unit 190 is fully replaced with the second processing liquid Lc, the flow destination of the processing liquid flowing in the common pipe 13 can be switched between the downstream pipes 14. Therefore, the mixing of the processing liquid in the downstream pipe 14 can be suppressed. For example, the mixing of the first processing liquid La (for example, SC1) and the second processing liquid Lc (for example, IPA) in the downstream pipe 14 can be suppressed.

[0170] Furthermore, generally speaking, the time from the start of supplying the rinse liquid (step S160) to the stop of supplying the rinse liquid (step S200) is preset. Generally speaking, it is preferred that the rinse liquid Lb is continuously supplied from the rinse liquid supply section 130c to the substrate W until the processing liquid flowing in the drain section 190 is fully replaced by the rinse liquid. Furthermore, generally speaking, the time required for the processing liquid in the drain section 190 to be fully replaced by the rinse liquid varies depending on the temperature, etc. Therefore, the time from the start of supplying the rinse liquid Lb to the substrate W to the stop of supplying the rinse liquid Lb to the substrate W is set to be longer. In this embodiment, a supply setting time is also set in the process recipe, and the supply setting time indicates the time from the start of supplying the rinse liquid Lb to the substrate W to the stop of supplying the rinse liquid to the substrate W. In the following, in the specification of this case, "the time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid to the substrate W" is sometimes recorded as "the rinsing liquid supply period", and, in the following, in the specification of this case, "the set time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid to the substrate W" is sometimes recorded as "the rinsing liquid supply setting time".

[0171] In this embodiment, in step S190, if the control unit 102 determines that the type of the processing liquid specified is the rinse liquid Lb, the process proceeds to step S200 regardless of whether the rinse liquid supply setting time has passed. In this case, for example, the control unit 102 may also overwrite the process recipe in the following manner, that is, according to the time point when the type of the processing liquid specified is determined to be the rinse liquid Lb, the rinse liquid supply setting time (for example, 15 seconds) is shortened. Furthermore, for example, the control unit 102 may also overwrite the process recipe in the following manner, that is, according to the time point when the type of the processing liquid specified is determined to be the rinse liquid Lb, the rinse liquid supply setting time (for example, 15 seconds) is extended.

[0172] In this way, it is possible to confirm whether the processing liquid in the drain section 190 has been switched. Therefore, regardless of whether the rinse liquid supply setting time has passed, the supply of the processing liquid (for example, rinse liquid Lb) of the processing liquid supply section 130 is stopped at the point in time when it is confirmed that the processing liquid in the drain section 190 has been switched, thereby shortening the substrate processing time. In addition, the amount of rinse liquid Lb used can be reduced, thereby reducing the environmental load. In addition, by shortening the substrate processing time, the amount of processing liquid after the substrate processing, that is, the amount of drainage, can be reduced. If the amount of drainage increases, the burden on the factory increases. According to this embodiment, the amount of drainage can be reduced, thereby reducing the burden on the factory.

[0173] Furthermore, as described above, the processing liquid supply unit 130 supplies a plurality of processing liquids to the substrate W at different times. Thus, when a plurality of processing liquids are supplied to the substrate W at different times, that is, when the liquid discharge unit 190 discharges a plurality of processing liquids, the present invention is particularly effective.

[0174] As described above, the control unit 102 controls the processing liquid supply unit 130 based on the identification result of the type of processing liquid. Therefore, the flow destination of the processing liquid flowing in the discharge unit 190 can be easily determined according to the condition of the processing liquid in the discharge unit 190.

[0175] As described above, the liquid discharge unit 190 includes the upstream pipe 12, the common pipe 13, and the downstream pipe 14. The plurality of processing liquids discharged from the chamber 112 flow through the upstream pipe 12. The downstream end 12b of the upstream pipe 12 is connected to the common pipe 13. The upstream end 14a of the downstream pipe 14 is connected to the common pipe 13. In this way, when the plurality of processing liquids flow through the upstream pipe 12, it is particularly effective to specify the type of the processing liquid by applying the present invention.

[0176] Furthermore, as described above, the control unit 102 specifies the type of the processing liquid in the area including the common pipe 13 based on the captured image. Therefore, the status of the processing liquid in the common pipe 13 can be easily confirmed. For example, it can be easily confirmed whether the processing liquid in the common pipe 13 has been switched. In other words, it can be easily confirmed whether the processing liquid in the drain unit 190 has been switched.

[0177] Furthermore, as described above, the drain section 190 includes the switching section 19. The switching section 19 switches the flow destination of the processing liquid flowing through the common pipe 13 between the plurality of downstream pipes 14. Therefore, the processing liquid can be divided and discharged to different downstream pipes 14. As a result, the mixing of the processing liquid in the downstream pipe 14 can be suppressed. For example, the mixing of the first processing liquid La (for example, SC1) and the second processing liquid Lc (for example, IPA) in the downstream pipe 14 can be suppressed.

[0178] Furthermore, as described above, the control unit 102 can also specify the type of the processing liquid in the area including the upstream pipe 12 based on the captured image. Therefore, the status of the processing liquid in the upstream pipe 12 can be easily confirmed. For example, it can be easily confirmed whether the processing liquid in the upstream pipe 12 has been switched. In other words, it can be easily confirmed whether the processing liquid in the drain unit 190 has been switched.

[0179] 9 to 11, the region AR1 irradiated with near infrared rays is a region including at least a portion of the common pipe 13, but the present invention is not limited thereto. For example, the region AR1 irradiated with near infrared rays may also be a region including at least a portion of the upstream pipe 12.

[0180] In the examples described with reference to FIGS. 9 to 11 , the region AR2 captured by the near-infrared imaging unit 150 is a region including at least a portion of the common pipe 13, but the present invention is not limited thereto. For example, the region AR2 captured by the near-infrared imaging unit 150 may also be a region including at least a portion of the upstream pipe 12.

[0181] FIG. 12 is a diagram showing an example of the configuration of the switching valve 191 included in the substrate processing apparatus 100 of the present embodiment. In FIG. 12 , the area AR1 represents the area where the near-infrared light source 140 irradiates the near-infrared ray. The area AR2 represents the area photographed by the near-infrared imaging unit 150. As shown in FIG. 12 , the area AR1 irradiated with the near-infrared ray is an area including at least a portion of the upstream piping 12. The area AR2 photographed by the near-infrared imaging unit 150 is an area including at least a portion of the upstream piping 12.

[0182] In this embodiment, the area AR1 coincides with the area AR2. The area AR1 and the area AR2 are preferably disposed on the downstream end 12b side of the upstream pipe 12 (see FIG. 2 ). In other words, the area AR1 and the area AR2 are preferably disposed near the common pipe 13. By disposing the area AR1 and the area AR2 near the common pipe 13, the time until the processing liquid in the area AR1 and the processing liquid in the area AR2 reach the common pipe 13 can be shortened. Therefore, it is possible to suppress the unintended mixing of the processing liquid into the common pipe 13.

[0183] In this embodiment, the near-infrared light source 140 irradiates the area AR1 including at least a portion of the upstream pipe 12 with near-infrared rays. The near-infrared imaging unit 150 captures a plurality of processing liquids in the upstream pipe 12 irradiated with near-infrared rays to generate a captured image. The control unit 102 specifies the type of processing liquid in the upstream pipe 12 based on the captured image. Therefore, it is possible to confirm whether the processing liquid in the upstream pipe 12 has been switched.

[0184] Furthermore, the area AR1 irradiated with near infrared rays may include the area AR1 including at least a portion of the common pipe 13 and the area AR1 including at least a portion of the upstream pipe 12. Furthermore, the area AR2 photographed by the near infrared imaging unit 150 may include the area AR1 including at least a portion of the common pipe 13 and the area AR1 including at least a portion of the upstream pipe 12.

[0185] Next, an example in which a plurality of near-infrared light sources 140 are provided will be described with reference to FIG13. Here, an example in which the near-infrared light source 140 includes a near-infrared light source 140a and a near-infrared light source 140b will be described. FIG13 is a schematic diagram of a substrate processing unit 110 in a substrate processing apparatus 100 having a plurality of near-infrared light sources 140 (near-infrared light source 140a and near-infrared light source 140b). The substrate processing unit 110 shown in FIG13 has the same structure as the substrate processing unit 110 shown in FIG2 except that a plurality of near-infrared light sources 140 are provided, and repeated descriptions are omitted to avoid redundancy.

[0186] As shown in Fig. 13, the near infrared light source 140 includes a near infrared light source 140a and a near infrared light source 140b. The near infrared light source 140a and the near infrared light source 140b emit near infrared rays having different peak wavelengths.

[0187] The control unit 102 acquires the process recipe data from the memory unit 104, and acquires type information indicating the type of the process liquid supplied to the substrate W by the process liquid supply unit 130 (the first process liquid supply unit 130a, the second process liquid supply unit 130b, and the rinse liquid supply unit 130c) from the process recipe data. Also, for example, the process recipe data may also include information indicating the type of the near-infrared light source 140 corresponding to the type of the process liquid. Also, for example, the control unit 102 may also acquire type information indicating the type of the process liquid supplied by the process liquid supply unit 130 (the first process liquid supply unit 130a, the second process liquid supply unit 130b, and the rinse liquid supply unit 130c) from input information input by the user.

[0188] The control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a portion of the liquid discharge unit 190 based on the acquired type information. For example, when the rinse liquid supply unit 130c supplies DIW to the substrate W, that is, when the liquid discharge unit 190 discharges DIW, the control unit 102 irradiates with the near-infrared light source 140a. On the other hand, when the second processing liquid supply unit 130b supplies IPA to the substrate W, that is, when the liquid discharge unit 190 discharges IPA, the control unit 102 irradiates with the near-infrared light source 140b.

[0189] Referring to FIG. 7 , FIG. 13 and FIG. 14 , the substrate processing step in the substrate processing method when a plurality of near-infrared light sources 140 are provided is described. FIG. 14 is a flow chart of the substrate processing step in the substrate processing method of the present embodiment. The flow chart of FIG. 14 is the same as the flow chart of FIG. 8 except that the near-infrared light source 140 is changed, and repeated descriptions are omitted to avoid redundancy. Furthermore, step S205 in the example of providing a plurality of near-infrared light sources 140 is an example of the "step of changing near-infrared light" of the present invention.

[0190] As shown in FIG7 , the processing of step S110 to step S200 is performed. In this embodiment, after the processing of step S200 is completed, the processing enters step S205 shown in FIG14 .

[0191] As shown in FIG. 14 , in step S205, the control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a portion of the liquid discharge portion 190 based on the type information. Specifically, the control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a portion of the liquid discharge portion 190 from the near-infrared light source 140a to the near-infrared light source 140b based on the type information. The process proceeds to step S210.

[0192] Steps S220 to S280 are the same as steps S220 to S280 shown in FIG. 8 .

[0193] In this embodiment, as described above, the control unit 102 acquires the type information indicating the type of the processing liquid, and based on the acquired type information, changes the near-infrared light source 140 that irradiates the area including at least a portion of the liquid discharge unit 190. Therefore, the irradiated near-infrared light can be changed according to the absorbance (also called absorbance) of the processing liquid, so even when the type of the processing liquid is changed, the type of the processing liquid can be more accurately identified.

[0194] Specifically, the absorbance of the treatment liquid varies depending on the type of the treatment liquid. Therefore, for example, by irradiating the second treatment liquid with light of a wavelength having a relatively high absorbance and photographing the treatment liquid, the contrast between the brightness value or brightness of the area representing the second treatment liquid and the area other than the second treatment liquid in the photographed image can be increased. Therefore, the type of the treatment liquid can be more accurately identified based on the photographed image.

[0195] Other effects in the example where a plurality of near-infrared light sources 140 are provided are the same as those of the substrate processing apparatus 100 described using FIGS. 1 to 12 .

[0196] Above, the embodiments of the present invention are described with reference to the drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various ways without departing from the scope of its main purpose. In addition, various inventions can be formed by appropriately combining the multiple components disclosed in the above embodiments. For example, several components can be deleted from all the components shown in the embodiments. Furthermore, the components in different embodiments can also be appropriately combined. For ease of understanding, the drawings mainly show each component in a schematic manner, and the thickness, length, number, spacing, etc. of each component shown in the drawings may also be different from the actual one for the convenience of making the drawings. In addition, the material, shape, size, etc. of each component shown in the above embodiments are examples, and there is no special limitation, and various changes can be made within the scope of the effect of the present invention.

[0197] For example, in the above embodiment, an example of applying the present invention to a substrate processing step to shorten the substrate processing time is shown, but the present invention is not limited to this. For example, when setting the rinse liquid supply setting time (for example, 10 seconds) (when making a process recipe), the present invention can also be applied. In this case, the process recipe making time can be shortened. In addition, as in the above embodiment, the amount of rinse liquid Lb used can be reduced, thereby reducing the environmental load.

[0198] In the above embodiment, the example in which the drain section 190 includes the switch section 19 is shown, but the present invention is not limited thereto. For example, the drain section 190 may not include the switch section 19. [Industrial Applicability]

[0199] The present invention can be used in substrate processing devices and corresponding fields.

[0200] 10A: Fluid cabinet 10B: Fluid tank 12: Upstream piping 12a: One end 12b: Downstream end 12c: horizontal part 13: Common piping 14: Downstream piping 14a: Upstream end 19: Switching Department 100: substrate processing device 101: Control Device 102: Control Department 104: Memory Department 110: Substrate processing unit 112: Chamber 120: substrate holding portion 121: Rotating base 122: Clamp member 123: Axis 124: Electric Motor 125: Shell 130: Treatment liquid supply unit 130a: first processing liquid supply unit (processing liquid supply unit) 130b: Second processing liquid supply unit (processing liquid supply unit) 130c: Rinse liquid supply unit (processing liquid supply unit) 132:Piping 132a:Piping 132b:Piping 132c:Piping 134: Valve 134a: Valve 134b: Valve 134c: Valve 136: Nozzle 136a: Nozzle 136b: Nozzle 136c: Nozzle 138: Mobile mechanism 138a: Arm 138b: shaft 138c: driving unit 140:Near infrared light source 140a:Near infrared light source 140b:Near infrared light source 141: 1st piping 142: 2nd piping 143: 3rd piping 144: 4th piping 150:Near infrared camera unit 180: Cup 190: Drainage part 191:Switch valve 191a: 1st switching valve 191b: Second switching valve 191c: 3rd switching valve 191d: 4th switching valve 192a: 1st valve driving unit 192b: Second valve drive unit 192c: 3rd valve drive unit 192d: 4th valve drive unit 193a: 1st valve body 193b: Second valve body 193c: 3rd valve body 193d: 4th valve body 1381: Mobile mechanism 1382: Mobile mechanism AR1: Area AR2: Area Ax: Rotation axis BR1: Branch 1 BR2: Second branch flow path BR3: The third branch flow path BR4: 4th branch flow path CR: Center Robot IR:Transport Robot LP: Loading Port La: 1st treatment liquid Lb: flushing fluid Lc: Second treatment liquid MR: Common flow path P1: Port 1 P2: Port 2 P3: Port 3 P4: Port 4 R1: flow path R2a:Flow path R2b: flow path R2c: flow path R2d: flow path S110: Steps S120: Step (process of utilizing near infrared irradiation), (process of generating captured images) S125: Step (Process of obtaining type information) S130: Step (Process of supplying multiple treatment solutions at different time points) S140: Step (liquid discharge process) S150: Steps S160: Step (Process of supplying multiple treatment solutions at different time points) S170: Step (liquid discharge process) S180: Step (process for specifying the type of treatment liquid) S190: Steps S200: Steps S205: Step (Changing the process of near infrared rays) S210: Step (Process of supplying multiple treatment solutions at different time points) S220: Step (liquid discharge process) S230: Step (process for specifying the type of treatment liquid) S240: Steps S250: Step (process of controlling the drainage part) S260: Steps S270: Steps S280: Steps SA: Steps SB: Step (process of holding substrate) SC: Steps SD: Steps SE: Steps TW:Tower W: substrate Wr:Back Wt: upper surface X: Axis Y: Axis Z: Axis

Claims

1. A substrate processing apparatus comprising: a chamber; a substrate holding section housed in the chamber and holding a substrate; a processing liquid supply section supplying a plurality of processing liquids to the substrate at different times; a drain section draining the plurality of processing liquids out of the chamber; at least one near-infrared light source irradiating an area including at least a portion of the drain section with near-infrared light; a near-infrared imaging section capturing an image of the plurality of processing liquids irradiated by the near-infrared light by receiving near-infrared light transmitted through a component in the drain section and / or reflected by the near-infrared light; and a control section controlling the near-infrared imaging section; wherein the control section identifies the type of processing liquid in the drain section based on the captured image, the brightness value, luminance, or image of a reference processing liquid.

2. A substrate processing apparatus comprising: a chamber; a substrate holding section housed in the chamber and holding a substrate; a processing liquid supply section supplying a plurality of processing liquids to the substrate at different times; a draining section draining the plurality of processing liquids out of the chamber; at least one near-infrared light source irradiating an area including at least a portion of the draining section with near-infrared light; a near-infrared camera capturing an image of the plurality of processing liquids within the draining section irradiated by the near-infrared light; and a control section controlling the near-infrared camera; the draining section... The device comprises: an upstream pipe for the flow of the plurality of treatment fluids discharged from the aforementioned chamber; a common pipe connected to the downstream end of the upstream pipe; and a plurality of downstream pipes, the upstream ends of which are connected to the common pipe; wherein the near-infrared light source irradiates an area including at least a portion of the common pipe with the near-infrared light, the near-infrared camera captures the plurality of treatment fluids in the common pipe irradiated by the near-infrared light to generate the captured image, and the control unit identifies the type of treatment fluid in the common pipe based on the captured image.

3. A substrate processing apparatus comprising: a chamber; a substrate holding section that houses and holds a substrate within the chamber; a processing liquid supply section that supplies a plurality of processing liquids to the substrate at different times; a drain section that drains the plurality of processing liquids out of the chamber; at least one near-infrared light source that irradiates an area including at least a portion of the drain section with near-infrared light; a near-infrared camera that captures an image of the plurality of processing liquids within the drain section irradiated by the near-infrared light; and a control section that controls the near-infrared camera; wherein the at least one near-infrared light source is a plurality of near-infrared light sources that emit near-infrared light having different peak wavelengths, the control section identifies the type of processing liquid within the drain section based on the captured image, acquires type information indicating the type of processing liquid, and changes the near-infrared light source used to irradiate the area including at least a portion of the drain section based on the type information.

4. A substrate processing apparatus comprising: a chamber; a substrate holding section that houses and holds a substrate within the chamber; a processing liquid supply section that supplies a plurality of processing liquids to the substrate at different times; a drain section that drains the plurality of processing liquids out of the chamber; at least one near-infrared light source that irradiates an area including at least a portion of the drain section with near-infrared light; a near-infrared camera that captures images of the plurality of processing liquids within the drain section irradiated by the near-infrared light; and a control section that controls the near-infrared camera; wherein the control section identifies the type of processing liquid within the drain section based on the captured image, and controls the processing liquid supply section based on the identification result of the type of processing liquid.

5. The substrate processing apparatus of any one of claims 1 to 4, wherein the control unit controls the draining unit based on a specific result of the type of processing liquid.

6. The substrate processing apparatus of any one of claims 1, 3 and 4, wherein the drain section comprises: an upstream pipe for the flow of the plurality of processing liquids discharged from the chamber; a common pipe connected to the downstream end of the upstream pipe; and a plurality of downstream pipes, the upstream ends of which are connected to the common pipe.

7. The substrate processing apparatus of claim 6, wherein the drain section further comprises a switching section that switches the destination of the processing liquid flowing in the common pipe between the plurality of downstream pipes.

8. The substrate processing apparatus of claim 6, wherein the near-infrared light source irradiates an area including at least a portion of the upstream pipe using the near-infrared light, the near-infrared camera captures the plurality of processing liquids in the upstream pipe irradiated by the near-infrared light to generate the captured image, and the control unit identifies the type of processing liquid in the upstream pipe based on the captured image.

9. The substrate processing apparatus of claim 7, wherein the control unit controls the timing of switching the flow destination of the processing liquid flowing in the common piping based on the specific result of the type of processing liquid.

10. A substrate processing method comprising the steps of: holding a substrate in a chamber; supplying a plurality of processing liquids to the substrate at different times; draining the plurality of processing liquids out of the chamber via a drain section; irradiating an area including at least a portion of the drain section with near-infrared light; generating an image of the plurality of processing liquids in the drain section irradiated with near-infrared light by receiving the near-infrared light transmitted through a component in the drain section and / or reflected by the near-infrared light; and identifying the type of processing liquid in the drain section based on the image, the brightness value, lightness, or image of a reference processing liquid.

11. A substrate processing method comprising the steps of: holding a substrate in a chamber; supplying a plurality of processing liquids to the substrate at different times; draining the plurality of processing liquids out of the chamber via a drain section; irradiating an area including at least a portion of the drain section with the near-infrared light emitted by any one of a plurality of near-infrared light sources having different peak wavelengths; generating an image of the plurality of processing liquids in the drain section irradiated by the near-infrared light; identifying the type of the processing liquid in the drain section based on the image; acquiring type information indicating the type of the processing liquid; and changing the near-infrared light source used to irradiate the area including at least a portion of the drain section based on the type information.

12. A substrate processing method comprising the steps of: holding a substrate in a chamber; supplying a plurality of processing liquids to the substrate at different times; draining the plurality of processing liquids to the outside of the chamber via a drain section; irradiating an area including at least a portion of the drain section with near-infrared light; generating an image of the plurality of processing liquids in the drain section irradiated by the near-infrared light; and identifying the type of processing liquid in the drain section based on the image; and switching the processing liquid supplied to the substrate based on the specific result of the type of processing liquid during the step of supplying the processing liquids at different times.

13. The substrate processing method of any one of claims 10 to 12 further includes a process of controlling the drain section based on a specific result of the type of the processing liquid.

14. The substrate processing method of claim 13, wherein the drain section comprises: an upstream pipe for the flow of the plurality of processing liquids discharged from the chamber; a common pipe connected to the downstream end of the upstream pipe; and a plurality of downstream pipes, the upstream ends of which are connected to the common pipe.

15. The substrate processing method of claim 14, wherein in the process of controlling the drain section, the destination of the processing liquid flowing in the common pipe is switched among the plurality of downstream pipes.

16. The substrate processing method of claim 14, wherein in the step of irradiating with near-infrared light, the area including at least a portion of the upstream pipe is irradiated with near-infrared light; in the step of generating the image, the plurality of processing liquids in the upstream pipe irradiated with near-infrared light are photographed to generate the image; and in the step of identifying the type of processing liquid, the type of processing liquid in the upstream pipe is identified based on the image.

17. The substrate processing method of claim 14, wherein in the step of irradiating with near-infrared light, an area including at least a portion of the common pipe is irradiated with near-infrared light; in the step of generating the image, the plurality of processing liquids in the common pipe irradiated with near-infrared light are photographed to generate the image; and in the step of identifying the type of processing liquid, the type of processing liquid in the common pipe is identified based on the image.

18. The substrate processing method of claim 15, wherein in the process of controlling the drain section, the timing of switching the flow destination of the processing liquid flowing in the common pipe is controlled based on the specific result of the type of processing liquid.

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