Modular metrology apparatus for interchangeable process modules

Abstract

This application discloses a modular metrology apparatus comprising a vacuum chamber housing with an opening having a mechanical interface for sealing attachment of multiple modular adapters. A sample platform located within the vacuum chamber positions a sample to be processed. One or more charged particle scanning systems scan a particle beam across the entire sample. The mechanical interface is capable of integrating detachable, interchangeable modular adapters containing different process module configurations. These process modules are sealed within multiple adapters and extend from the outside into the vacuum chamber housing toward the sample platform. The modular adapters are interchangeable to reconfigure the installed process modules. Configurations may include scanning electron beams, focused ion beams, interferometers, detectors, and other process modules. This modular architecture provides a configurable mechanical framework that optimizes the metrology apparatus by interchangeable adapters with multiple sets of customized process modules.

Description

Modular metering device for interchangeable process modules This case study largely comprises various examples of metering systems. Particularly relevant is a modular metering device that integrates multiple process modules configured for different operating modes. In modern metrology applications, various techniques are employed for material property analysis, defect inspection, and sample measurement. Instruments such as scanning electron microscopes (SEM), focused ion beam (FIB), laser-induced fluorescence (LIF), and gas injection systems (GIS) can perform specialized tasks, but their operation is often limited. For example, the current configuration of SEM systems typically provides an insufficient working distance (WD) to meet the demands of higher resolution. Furthermore, the cutting efficiency of FIB systems is often affected by design limitations. For instance, a dual-beam FIB-SEM system combines two functions, but the positions of the electron and ion columns relative to each other, as well as the working distance to the sample, are mechanically constrained and cannot be changed after system integration. Metrological systems can be found in patent documents such as DE 10 2021 128 117 A1 and DE 10 2021 110 948 A1. It is impractical to adapt conventional measuring devices to constantly changing requirements, and such adjustments would necessitate drilling, realignment, and recalibration. Therefore, it is usually necessary to purchase additional systems to meet different testing requirements. Therefore, there is a need for advanced metrology systems that mitigate or reduce at least some of the aforementioned drawbacks. In particular, there is a need for a metrology device employing at least one charged particle scanning system that can be easily adapted to changing requirements. This requirement is met through the features of the independent request item. The features of the subsidiary request item define several embodiments. It should be understood that the aforementioned features and features as explained below can be used not only in the corresponding combinations shown, but also in other combinations or individually, without departing from the scope of the invention. A modular metrology apparatus is provided for processing samples in a vacuum chamber. The vacuum chamber is formed of a vacuum chamber housing having an opening having a mechanical interface configured for attaching a modular adapter. The modular metrology apparatus further includes a sample platform located inside the vacuum chamber housing. The modular metrology apparatus further includes at least one charged particle scanning system, each of the at least one charged particle scanning system being configured to scan a corresponding beam of charged particles on the sample platform. The opening may be located, for example, on one side of the vacuum chamber housing relative to the sample platform. The opening may be a circular opening (i.e., circular in shape) or may include at least partially straight and / or angled edges. The mechanical interface may be configured for sealing attachment of one of a variety of modular adapters. In various instances, the claimed modular metrology device may or may not include a modular adapter. The modular adapter may be formed such that it can be inserted into the opening from a top-side detachable portion of the vacuum chamber housing, but cannot completely pass through the opening due to its larger dimensions in the xy-plane compared to the external opening. When attached, the modular adapter may extend along the z-axis portion through the opening into the sealed internal space of the metrology device. The modular adapter may extend from the opening of the vacuum chamber housing along the z-axis in both the positive and negative directions. It may extend beyond the thickness of the vacuum chamber housing or twice its thickness on the top outer surface of the vacuum chamber housing. It can extend from above the inner surface of the vacuum chamber housing into the interior of the vacuum chamber by more than 20%, 30%, or 50% of the distance from the vacuum chamber housing to the sample platform along the z-axis. A modular adapter can accommodate one or more process modules in a specific spatial configuration, such as two or more, three or more, or four or more process modules, to implement a desired operating mode. At least one charged particle scanning system may include one of these at least one process module. In other words, these at least one process module may include a process module comprising at least a portion of the charged particle scanning system, and selectively one or more additional process modules providing alternative processing operating modes. The vacuum chamber housing may include an opening, wherein the mechanical interface is formed along the edge of the opening, particularly around the edge of the opening. A modular metering device may be configured to hermetically attach to the modular adapter. The modular metering device may be configured to hermetically attach to at least one or various, for example, at least two or three different modular adapters. The modular adapter may include a corresponding mechanical interface, i.e., a mechanical interface corresponding to the vacuum chamber opening. It should be understood that the mechanical interface of the vacuum chamber opening and the modular adapter provides a sealed attachment between the vacuum chamber housing and the modular adapter. These mechanical interfaces may include corresponding mechanical attachments and / or sealing structures that correspond to each other, enabling the sealed attachment. The mechanical interface may extend along and / or around the opening, particularly around the entire perimeter of the opening. In other words, the modular metrology device includes a vacuum chamber housing, which, together with the modular adapter, forms a closed structure with an internal space. The vacuum chamber housing includes an opening on one side allowing access to the internal space. A mechanical interface can be provided around this opening, enabling the implementation of detachable accessories for the interchangeable modular adapter. When the modular adapter is installed, this mechanical interface provides a sealed connection to maintain the vacuum condition. A sample platform is located within the vacuum chamber housing, on which a sample or specimen can be mounted for analysis or processing. The sample platform allows the sample to be adjustably positioned within the internal space of the vacuum chamber housing. By moving the sample platform, the position of the sample can be controlled in three dimensions. In other instances, the sample platform can also move only in a plane (i.e., in the xy direction). In various instances, the modular metrology apparatus employs a charged particle scanning system. In some instances, this may represent a modular metrology apparatus comprising a custom-designed process module, particularly an electron microscope process module, which includes an electron microscope particle source column capable of scanning a focused beam across the sample. Therefore, at least one process module may include at least a portion of a charged particle scanning system. At least one charged electron scanning system may be included, but multiple charged particle scanning systems may also be included. The charged particle beam may comprise, for example, electrons or ions. Each scanning system can independently scan its respective particle beam on the sample platform surface. Generally, a modular adapter represents a mechanical component configured to receive, guide, or hold various process modules. A modular adapter is an interchangeable component that connects to the vacuum chamber housing of a metrology apparatus. The primary purpose of this modular adapter is to integrate and provide mounting points for one or more process modules. The modular adapter can be configured within an opening in the vacuum chamber housing. Therefore, at least one process module can be configured within or extend through an opening in the vacuum chamber housing. The modular adapter includes connectors, fittings, alignment features, and other components for receiving the process module, and is interchangeable with the vacuum chamber housing. When attached to the edge of an opening in the vacuum chamber housing, the modular adapter allows the process module to extend into the internal vacuum space and interact with samples on the platform. The modular adapter is interchangeable to allow for different combinations of process modules. By interchangeable modular components tailored to specific analytical needs, metrology apparatuses can be flexibly optimized. This adapter acts as the primary medium between the vacuum chamber housing and customized process modules. The modular architecture with interchangeable adapters allows the entire system to be adapted and reconfigured for different detection and measurement applications. Modular adapters provide an interface that integrates this configurability and modularity. In various instances, the charged particle scanning system may include or be integrated into a process module that is sealed and fixed within and extends through a modular adapter and openings into a vacuum chamber housing. In some instances, at least one process module may be part of the charged particle scanning system. For example, this charged particle scanning system process module may include an electron column or ion column assembly. This process module may extend through a socket or port in the modular adapter from the outside of the vacuum chamber housing into the internal vacuum space. The portion of the scanning system within the vacuum may include, for example, beam generation components such as ion sources, lenses, detectors, etc. The external portion outside the vacuum may include electronics, pumps, controllers, and peripheral components that are not required to be in a vacuum. The modular adapter can be configured to hold at least one process module in different spatial configurations, such as at different angles or positions relative to the modular adapter and / or relative to other process modules, as will be described in more detail below. The modular design allows different scanning systems to be interchanged at the openings of the vacuum chamber. Various modules can be attached to openings in the vacuum chamber housing to reconfigure the metrology device for desired analytical capabilities. All modules are securely connected to a mechanical interface to maintain vacuum integrity during operation. Process modules can be fixedly attached to the vacuum chamber housing or detachably attached. In other words, the mechanical interface can be configured to receive and attach to various modular adapters. This can be implemented by providing a mechanical interface configured to attach and seal to a corresponding mechanical interface of the modular adapter. For example, the mechanical interface can extend around the periphery of an opening in a vacuum chamber housing. By extending around the periphery of the opening, the mechanical interface provides a continuous mounting surface on which the modular adapter can be fixed and sealed. The modular adapter can be hermetically sealed within the opening. The modular adapter can include one or more process modules designed to interact with or process samples within the vacuum chamber. By arranging the mechanical interface around the opening, different modular adapters containing various process modules can be interchanged and implemented on the metrology device. Thus, the mechanical interface around the opening in the vacuum chamber housing provides a configurable mounting point for integrating multiple interchangeable modular adapters to reconfigure the metrology device. The mechanical interface can utilize various types of connectors to attach multiple modular adapters, as described in more detail with reference to the figures. For example, the mechanical interface can use quick-release clamps, screws, latches, or other fastening mechanisms to secure a modular adapter. These removable fasteners allow for adapter replacement by removing and reinstalling the clamps or screws. The mechanical interface can also utilize gaskets or seals between the opening and multiple surfaces of the adapter. This creates a hermetically tight connection to maintain a vacuum within the cavity. Gasket materials can include elastomers, metals, or other materials compatible with high vacuum. Additionally, the mechanical interface can include alignment guides, such as pins, shoulder drill joints, or other registration devices. These guides enable precise positioning of the modular adapter relative to the interior of the vacuum cavity. Proper alignment helps ensure proper integration of the process module with the sample platform and beam optics. In various instances, the connection itself can involve flanges, lips, or other engagements where the adapter and vacuum cavity mesh with each other. This joint can be designed for force fit, form fit, friction fit, or material bonding to create a strong attachment, as will be described in detail below. A vacuum seal is provided between the modular adapter and the vacuum chamber housing. Modular adapters can be constructed as a single unit containing all the interfaces and receptacles for mounting at least one process module. In this approach, the adapter is a single, complete unit integrating multiple modules. Alternatively, a modular adapter can comprise two or more individual segments or units that combine to form a complete adapter assembly. For example, process module receptacles can be different removable modules attached to the base adapter structure. This allows the adapter to be reconfigured by interchangeing different receptacle modules. Receptacles and ports for receiving individual process modules can also be integral parts of the adapter. Alternatively, receptacles can be different modular components attached to the adapter to implement flexible receptacle configurations. A hybrid approach is also possible, where some parts (such as vacuum seals and main structural elements) are integrated while the modular receptacles remain separate. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the embodiments described below are not intended to be limiting. The scope of the present invention is not intended to be limited to the embodiments or drawings described below, but rather to be illustrative examples of the overall inventive concept. Unless otherwise specifically stated, features of various embodiments may be combined with each other. The diagrams are intended as schematic representations, and the elements shown are not necessarily to scale. Rather, the various elements are presented to make their function and general purpose clearer to those skilled in the art. Any connection or coupling between functional blocks, devices, components, or other entities or functional units shown in the diagrams or described herein may also be implemented through indirect connections or joints. Coupling between multiple components may also be established through wireless connections. Functional blocks may be implemented in hardware, firmware, software, or a combination thereof. Some embodiments of the present invention generally provide a plurality of modules or other electrical devices for modular metering devices. The modules and other electrical devices, and all the functions provided by each module and other electrical device, are not intended to be limited to what is shown and described herein. While specific labels may be assigned to the various modules or other electrical devices disclosed, such labels are not intended to limit the scope of operation of the modules and other electrical devices. Such modules and other electrical devices may be combined and / or separated from each other in any way based on a specific type of desired mechanical and / or electrical implementation. It should be understood that any process module or other electrical device disclosed herein may include any number of microcontrollers, graphics processing units (GPUs), integrated circuits, memory devices (e.g., flash memory, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), electronically erasable programmable read-only memory (EPROM), or other suitable variations), and software that cooperates with each other to perform the operations disclosed herein(s). In addition, any or more of the electrical devices may be configured to execute program code specifically implemented in a non-transitory computer-readable medium, the program code being programmed to perform any number of functions as disclosed. The following describes techniques for imaging and processing microscopic samples using charged particle scanning systems such as SEM and FIB. It should be understood that the described techniques can be applied to any metrology apparatus employing a vacuum chamber. Figure 1 schematically illustrates a dual-beam modular metering device 1000 containing a SEM process module 5040 and a FIB process module 5050, wherein the technology according to the present invention can be applied. As shown in Figure 1, the metrology apparatus 1000 includes a wafer inspection system configured for slicing and imaging methods with a dual-beam configuration. Sample processing in the metrology apparatus is typically performed in a sealed environment, such as a process chamber, specifically within a vacuum chamber formed by a vacuum chamber housing 10, schematically depicted around the metrology apparatus 1000. According to the invention, a process module containing, for example, SEM pillars 5040, FIB pillars 5050, and a particle detector 1017 can extend from the outside of the vacuum chamber through the vacuum chamber housing 10 into the interior of the vacuum chamber housing 10. For wafer 1008, multiple measurement points containing measurement points 1006.1 and 1006.2 are defined in a location map or inspection list generated from inspection tools or design information. Wafer 1008 is placed on wafer stage 1015 (corresponding to sample platform 30). Wafer stage 1015 is mounted on platform 1155, which has actuators and positioning controller 1021. Actuators and components (such as laser interferometers) for precise control 1021 of wafer platform 1155 are known in the art. A control unit 1016 receives information about the actual positioning of wafer platform 1155 and is configured to control wafer platform 1155 and adjust the measurement point 1006.1 of wafer 1008 at the intersection 1043 of dual-beam device 1001. The dual-beam setup 1001 includes a FIB column 1050 with an FIB optical axis 1048 and a charged particle beam (CPB) imaging system 1040 (e.g., SEM or HIM; see Figure 3: Charged Particle Scanning Microscope 160) with an optical axis 1042. At the intersection 1043 of the two optical axes of the FIB and CPB imaging systems, the wafer surface 1055 is configured at an angle GF to the FIB axis 1048. The FIB and CPB jointly observe the sample. The FIB axis 1048 and the CPB imaging system axis 1042 include an angle GFE. In the coordinate system of Figure 7, the normal to the wafer surface 15 is provided by the z-axis. The focused ion beam (FIB) 1051 is generated by the FIB column 1050 and impacts the surface 1055 of the wafer 1008 at an angle GF. An inclined profile surface is ground into the wafer at a predetermined y-position by ion beam grinding at detection site 1006.1 at an angle of approximately GF, controlled by platform 1155 and positioning controller 1021. In the example shown, the angle of GF is approximately 30°. Due to the beam divergence of the focused ion beam (e.g., gallium ion beam) or due to the different material properties along the profile grinding, the actual angle of the inclined profile surface can deviate from the angle of GF by 1° to 4°. An image of the ground surface is acquired using charged particle beam imaging system 1040. In the example of FIG7, charged particle beam imaging system 1040 is configured with its charged particle beam 1044 perpendicular to wafer surface 1055 and parallel to the z-axis. In other configurations, the optical axis 1042 of charged particle beam imaging system 1040 is configured at an angle formed with the z-axis. During imaging, a charged particle beam 1044 is scanned by the scanning unit of the charged particle beam imaging system 1040 along a scanning path on the cross-sectional surface of the wafer at measurement site 106.1, generating secondary particles and backscattered particles. Particle detectors 1017.1 and selective internal particle detectors 1017.2 collect at least some of the secondary particles and / or backscattered particles and communicate particle counts to control unit 1019. Other detectors for other types of interaction products (such as X-rays or photons) may also be present. Control unit 1019 controls the charged particle beam imaging column 1040 and FIB column 1050 and is connected to control unit 1016 to control the positioning of the wafer mounted on wafer stage 1015 via wafer platform 1155. The operation control unit 1002 communicates with the control unit 1019. This control unit triggers, for example, the placement and alignment of the measurement point 1006.1 on wafer 1008 at intersection 1043 via wafer platform movement, and repeatedly triggers FIB polishing, image acquisition, and platform movement operations. Both the control unit 1019 and the operation control unit 1002 include memory for storing instructions in the form of software program code and at least one processor for executing instructions during operation. The memory also provides for storing digital image data. The operation control unit 1002 may further include a user interface or an interface to other communication interfaces to receive instructions, previous information, and transmit test results. Figure 2 schematically illustrates various process modules 20, 21, 22 of a modular metering device for processing samples, which can be anchored in a modular adapter according to the technology of the present invention. The metrology apparatus illustrates a process module 20 comprising an SEM process module 21, a focused ion beam process module 22, and other oriented sample platforms 30. The process modules can be configured within the vacuum chamber of the modular metrology apparatus, wherein the techniques described herein can be applied using a modular adapter (not shown) instead of anchoring the process modules 20, 21, 22 separately within the vacuum chamber housing (not shown) of the metrology apparatus. In particular, in FIB-SEM applications, the available space adjacent to the scanning area is limited because additional devices (e.g., precursor gas sources, micromanipulators, or detectors) should be positioned as close to the sample as possible. The modular adapter, sealed within the vacuum chamber housing, provides a mechanical framework for integrating multiple process modules into a miniaturized layout optimized for operation close to the sample platform. The modular adapter specifically allows the SEM column 21 (also known as the SEM process module) and FIB column 22 (also known as the FIB process module), along with other auxiliary process modules such as a gas injection system and a micromanipulator, to be positioned close to the sample. The modular metrology device enables flexible configuration via interchangeable modular adapters, which are customized to integrate multiple analytical techniques. Figure 3 schematically illustrates a modular metrology device 1 comprising a SEM process module 21, a FIB process module 22, and a laser interferometer, according to one of various examples. As shown in Figure 3, the modular metering device 1 includes a vacuum chamber housing 10 with an opening, a sample platform 30, a modular adapter 50, a SEM process module 21, a FIB process module 22, and a laser interferometer system 40 with a reference mirror 41. The modular adapter 50 is located within the opening of the vacuum chamber housing 10 and is attached to the vacuum chamber housing 10 via a mechanical interface 60 extending along the opening. Therefore, multiple portions of the vacuum chamber housing 10 are schematically depicted as the right and left sides of the modular adapter and positioned around the modular adapter 50 such that the edges of the opening surround the modular adapter 50 to form and seal a closed vacuum chamber housing at least a portion of the sample platform 30 and process modules 21, 22. The sample platform 30 is located within the vacuum chamber housing, where the sample to be analyzed is mounted. The modular adapter 50 is positioned around the SEM and FIB process modules 21, 22, which extend through the modular adapter 50 and are positioned and sealed within it. It has connection ports through which the SEM 21 and FIB 22 modules extend. In the example of Figure 3, the FIB process module 21 and the SEM process module 22 are configured in a specific spatial configuration defined by the modular adapter 50. The SEM process module 21 is positioned at the center and extends vertically (along the z-axis) through the modular adapter 50 and downwards toward the sample platform 30. The FIB process module 22 is located to one side of the SEM process module 21. It also extends through the modular adapter to guide its beam to the sample platform 30 and forms an angle relative to the z-axis and the longitudinal axis of the SEM process module. At the bottom is the laser interferometer system 40 and its reference mirror 41. This allows for precise measurement of the distance between the adapter and the sample platform. Different modular adapters 50 include different configurations of process modules, i.e., different spatial configurations and / or different modular adapters 20 that can be attached to the vacuum chamber housing 10. For example, additional modular adapters 50 can provide different (selectively transferable) configurations, i.e., the orientation and / or positioning of process modules 21, 22 relative to each other and modular adapters 50, will be explained in more detail with reference to the following figures. The vacuum chamber housing 10 provides an opening with a standardized mechanical interface 60 to integrate various modular adapters 50 with corresponding mechanical interfaces in a flexible and interchangeable manner. Figure 4 schematically illustrates the working distance of the modular metering device 1 according to various examples of Figure 3. FIB process module 22 is depicted at an angle relative to the z-axis, orienting the sample platform 30. The angular orientation of FIB module 22 facilitates reaching the common overlap point on the sample platform 30 with SEM process module 21. An additional process module 20 is shown configured around the SEM and FIB pillars 21, 22. The presence of the additional process module adjacent to the pillars limits the available space around the sample platform 30. SEM process module 21 is vertically oriented along an axis perpendicular to the z-axis of the sample platform 30. Due to the close configuration of multiple process modules, the working distance between the tip of the SEM pillar and the sample platform 30 is mechanically constrained. As can be seen from Figure 4, the minimum achievable working distance is limited by the potential collision or interference between the angled FIB pillar 22 and the vertically oriented SEM pillar 21, the additional process module 20, and the bundle diameter of the SEM and FIB process modules. Typically, the working distance between the pillar tip and the sample is a critical parameter that the SEM and / or FIB process modules should minimize, but it is limited by mechanical constraints. Figure 5 further schematically illustrates the working distance of the modular metrology device 1 relative to the reference mirror 41 of the laser interferometer system 40 according to various examples of Figures 2 and 3. Figure 5 further illustrates the limitation on the minimum working distance imposed by the laser interferometer system 40 integrated into the modular metrology apparatus. Similar to Figure 4, the SEM process module 21 and FIB process module 22 are shown anchored to the modular adapter 50 and oriented towards the sample platform 30. Additionally, a laser interferometer system 40 is incorporated into the modular adapter 50 and / or the SEM process module 21 assembly. The laser interferometer system 40 includes a reference mirror 41 mounted to the modular adapter 50 and / or the SEM process module 21. The bottom reflective surface of the reference mirror 41 is used for interferometric measurements. The distance between the reference mirror 41 and the sample platform 30 limits how close the SEM and FIB column tips can be positioned to the sample platform. This bottom reflective surface of the reference mirror 41 is positioned lower than the lower tip of the SEM process module 21, i.e., closer to the sample platform 30. Because the reference mirror 41 extends closer to the sample platform 30 than the SEM tip, it imposes a limit on the minimum working distance between the SEM tip and the sample platform. Figure 6 schematically shows a modular adapter 50 mounted to a vacuum chamber housing 10, wherein a reference mirror 41 of a laser interferometer 40 is recessed into the modular adapter 50. Reference mirror 41 shows a recessed location within the modular adapter 50, recessed rearward from the lower outer boundary / edge of the modular adapter 50, as indicated by the dashed line. This illustrates how the recess and positioning of components within the adapter can provide greater flexibility. However, the integrated nature of the modular design means that all components must be fully considered when determining the minimum working distance. Figure 7 schematically shows the modular metrology device 1 of Figure 3, which includes a modular adapter 50 with different configurations of SEM and FIB process modules 21 and 22, and a laser interferometer 40 with a recessed reference mirror 41. Figure 7 schematically illustrates the modular metrology apparatus 1 of Figure 3, which differs from Figure 3 in its modular adapter 50 and process module configuration. Similar to Figure 3, the apparatus includes an SEM process module 21, a FIB process module 22, and a laser interferometer 40 with a recessed reference mirror 41. However, in Figure 7, the SEM process module 21 is shown tilted relative to the z-axis, rather than vertically. This tilted orientation of the SEM column 21 and the recessed reference mirror 41 allows for a closer working distance between the SEM tip and the sample platform 30. Figure 8 schematically illustrates the working distance of the modular metering device according to various examples of Figure 7. As illustrated in Figure 8, in this and various other instances described with reference to other figures, the working distance from the SEM and / or FIB to the sample platform can be less than 5 mm. The SEM column tilting function provided by the modular adapter can further shorten the minimum working distance even faster. This demonstrates how interchangeable modular adapters can change the position of the process module relative to the sample platform. Figure 7 illustrates how interchangeable adapters facilitate flexible positioning of process modules to shorten the working distance. Figure 9 schematically illustrates a modular metering device 1 according to various examples, which includes a modular adapter 50 with additional pivotable process module configurations. As shown in the preceding diagram, the modular adapter 50 is attached to the vacuum chamber housing 10 via a mechanical interface. The mechanical interface between the adapter 50 and the housing 10 is a sealed connection. In this configuration, process modules 22 and 21 can be pivoted relative to the modular adapter 50 by actuator 51. Actuator 51 achieves angular positioning of the process modules by rotating the process modules about a pivot axis relative to the sample platform 30 and / or the modular adapter 50. This allows for flexible orientation of the modules to optimize the incident angle on the sample platform 30. As mentioned above, the reference mirror 41 of the laser interferometer is recessed. Process modules 22 and 21 can be independently pivoted and locked into position using the integrated actuator 51. Figure 10 schematically illustrates a modular metering device 1 with a modular adapter 50 according to various examples, the modular adapter having additional configurable process module configurations or configurations. In this configuration, the FIB process module 22 can be pivoted relative to the modular adapter 50 via an integrated actuator 51. This allows for angular positioning of the FIB module 22 by rotating it about the pivot axis via an additional actuator 52. Specifically, the SEM process module 21 can be translated vertically relative to the modular adapter 50 and / or the sample platform 30 via a linear actuator 52. This allows the SEM module 21 to be positioned closer to or further away from the sample platform 30. The modular adapter 50 combines a rotary actuator 51 for pivoting the FIB module 22 and a linear actuator 52 for translating the SEM module 21. As mentioned above, the reference mirror 41 of the laser interferometer is recessed. This demonstrates how different types of actuators can be integrated into the adapter 50 to provide the flexibility to independently position different process modules. Angle and linear accuracy adjustments are possible. Figure 11 schematically illustrates a modular metering device 1 according to various examples, which includes a modular adapter 50 having an additional process module configuration. As shown in Figure 11, the modular metering device 1 with a modular adapter 50 is configured to accommodate multiple similar process modules 21, 22, 23 and 24. The adapter 50 integrates a first SEM process module 21 and a second SEM process module 23. The adapter also incorporates a first FIB process module 22 and a second FIB process module 24. Additionally, two recessed reference mirrors 41 and 42 related to the laser interferometer system are shown. The first reference mirror 41 is associated with the first SEM module 21. The second reference mirror 42 is associated with the second SEM module 23. By integrating multiple SEM and FIB pillars and multiple recessed reference mirrors, the modular architecture enables the implementation of a multi-beam metrology device. The adapter 50 allows for the replication of process modules and flexible placement of components. Multiple electron beam and ion beam pillars enable advanced multimodal inspection and processing. This demonstrates the versatility of the modular adapter-based architecture, allowing for adaptation to multiple tool configurations through customized adapters. Figure 12 schematically illustrates the mechanical interface 60 between the vacuum chamber housing 10 and the modular adapter 50 according to various examples. As shown in Figure 12, a mechanically clamping interface is provided between the vacuum chamber housing 10 and the modular adapter 50. In this example, the mechanical interface consists of screws 61 that attach and seal the modular adapter 50 to an opening in the vacuum chamber housing 10. The screws 61 provide a clamping connection between the two components. Tightening the screws presses the adapter 50 against the housing 10 to form a robust engagement. The mechanical force generated by the screws forces the modular adapter 50 to adhere to the vacuum chamber housing 10. This clamping interface ensures a leak-proof seal. The screws 61 also interact with gaskets or O-ring seals between the adapter and the housing surface. Compression gaskets provide an airtight interface. Although only the tightening screw interface is shown here, the rest of the modular metering device setup is similar to the previously described examples and figures. This includes the configuration of process modules, sample platforms, and other components integrated via a modular adapter architecture. Figure 13 schematically shows a shape-fitting mechanical interface between a vacuum chamber housing 10 and a modular adapter 50. As shown in Figure 13, the mechanical interface provides a form-fit connection, such as a snap-fit ​​installation. The vacuum chamber housing 10 has an opening with a specific geometric profile. The modular adapter 50 has a corresponding geometry on its underside that matches the profile of the housing opening. During assembly, the complementary shapes on the housing 10 and the modular adapter 50 interlock with each other. This creates a precise form-fit interface between the components that securely attach the adapter 50 to the housing 10. The geometric interlocking of the surfaces prevents lateral movement and separation between the housing 10 and the modular adapter 50. The mechanical interface can be designed to allow the adapter 50 to detach from the housing 10 in a controlled manner, thereby enabling the interchangeability of the modular components. Figure 14 schematically illustrates, according to one of various examples, an additional mechanical interface 60 between a vacuum chamber housing and a modular adapter. As shown in Figure 14, a material-fitting mechanical interface is provided between a vacuum chamber housing 10 and a modular adapter 50. This interface is described as a weld or adhesive bonding between the housing 10 and the adapter 50. Welding or adhesive bonding forms a material-fitting connection by fusing or bonding components together at the molecular level. While welding or adhesive bonding helps ensure the hermetically tight seal of the vacuum environment, it lacks the modularity and configurability of detachable accessories (such as force-fit or form-fit interfaces). Figure 15 schematically illustrates a modular metering device 1 according to various examples, which includes SEM and FIB process modules 21, 22 and a deflection unit 70 integrated into a modular adapter 50. The deflection unit 70 is fixed to the modular adapter 50 and configured to deflect the ion beam of the FIB system 22 to adjust its incident angle on the sample platform 30. The deflection unit 70 can utilize an electromagnetic lens or an electrostatic deflector (especially a wire) to influence the path of the FIB beam through a variable magnetic field. The trajectory of the focused ion beam can be manipulated by controlling the voltage / current through the wire. Furthermore, the deflection unit 70 can be used to make the FIB beam and the SEM beam coincide at the same point without moving the sample platform. This enables bi-beam processing with a similar profile without moving the sample platform 30. In other words, the deflection unit 70 uses a generated magnetic field to guide the current-carrying conductors of the FIB beam. The strength of the magnetic field can be altered by manipulating the current. This allows for tuning and adjustment of the coincidence point and incident angle of the FIB beam on the sample platform 30. A stronger magnetic field provides greater deflection. The beam path manipulation can include refocusing the FIB optics to compensate for the increased distance and potential astigmatism introduced by the deflection. To restore the FIB and SEM beams to a common coincidence point after deflection, the height of the sample platform 30 may need to be adjusted. Alternatively, the coincidence can be maintained, and the platform 30 can be moved along the x-direction to scan different areas beneath the undeflected beam. Slightly retracting the FIB pillar 22 provides the additional volume required to incorporate the deflector compared to a fixed coincidence design. The external deflection unit 70 allows the FIB column 22 to be positioned closer to the SEM column 21 and the sample platform 30. In addition to the mechanical tilting of the FIB column 22, the miniaturized deflector can manipulate the beam within the limited space between the tip of the SEM process module and the sample platform. This tighter component packaging implemented by the deflection unit 70 allows for a reduction in the overall working distance between the tip of the SEM column and the sample platform 30. Without the need for mechanical tilting, the columns 21 and 22 can extend further forward toward the sample platform 30. The close-spaced configuration increases beam strength and achieves advanced simultaneous imaging and processing capabilities. This further facilitates the development of modular architectures. The external deflection unit described herein is presented as an example, providing additional beam manipulation capabilities. However, it should be understood that the deflection unit can be combined with any other features as described in other figures and various examples. For example, configurations with tilted SEM process modules, rotatable or translational movable process modules, actuable process modules, and multi-column configurations. The deflection unit can complement and enhance the functionality provided by other modular components to further reduce working distances by allowing miniaturized process modules to be configured near the sample and by manipulating the FIB beam below the tip of the metrology unit's SEM process module. Therefore, the example of deflection unit 70 in Figure 15 should not be construed as limiting, given its compatibility with other modular features and configurations. The modular architecture allows the deflection unit to be integrated as part of various process module configurations. The present invention can be further illustrated by the following examples. In various examples, the modular metering device may include a modular adapter with a mechanical interface attached to a vacuum chamber housing. The modular adapter may be configured to receive and seal at least one process module. The modular adapter may include at least one process module configured to process samples placed on a sample platform. The modular adapter may include a mechanical and / or electrical socket for each of the at least one process module. Generally, for each of at least one process module, the modular adapter may include a socket, port, or other mounting point where at least one process module can be mounted. At least one process module may extend from the outside of the vacuum chamber into the interior, facing the sample platform. This allows at least one process module to interact with the sample within the vacuum chamber. At least one process module may be hermetically attached to the modular adapter, such that the vacuum chamber housing, the modular adapter, and the at least one process module maintain a sealed environment within the vacuum chamber. The mechanical interface between the modular adapter and the vacuum chamber allows for the interchangeability of the modular adapter and / or process modules. Process modules can be fixedly attached or detachably attached via fasteners, and / or alignment guides, and / or electrical connections, and / or vacuum seals. This allows for the reconfiguration of metering devices using different process modules on interchangeable modular adapters. The entire modular adapter assembly with the process module is interchangeable and detachable from the vacuum chamber housing. This allows the complete modular adapter assembly containing the integrated process module to be interchanged as needed to reconfigure the entire metering device. The mechanical interface around the vacuum chamber opening makes these modular adapter assemblies interchangeable. In various instances, modular metering devices may further include a mechanical interface mounting mechanism that allows modular adapters to be detachably and interchangeably attached to the vacuum chamber housing. The modular metering device may include a mounting mechanism as part of a mechanical interface surrounding an opening in the vacuum chamber housing. This mounting mechanism allows the modular adapter to be attached and detached in a removable manner. It should be understood that the corresponding mechanical interface of the modular adapter may also include at least part or all of the mounting mechanism as described. For example, the mounting mechanism may include multiple clamps, screws, latches, or other fasteners to securely hold the modular adapter to the vacuum chamber, while also allowing the adapter to be removed and interchanged as needed. The mounting mechanism may also include multiple alignment guides, seals, and connectors to properly orient the modular adapter and integrate it into the vacuum chamber housing. The ability to disassemble and interchange modular adapters allows for the reconfiguration of metrology equipment. Different modular adapters containing various process modules are interchangeable by using a detachable mounting mechanism as part of the mechanical interface. This allows for optimization of the entire system and adaptation to different inspection, metrology, or analytical procedures through the interchangeability of modular adapters. In various instances, the modular metering device may further include at least one process module encapsulated within a modular adapter, and at least one process module extending from the outside of the vacuum chamber housing toward the sample and into the interior. The modular metering device may include at least one process module mounted within and / or surrounded by the modular adapter assembly. When the modular adapter is attached to the vacuum chamber housing, the process module may be enclosed within the adapter so that it does not come into contact with the vacuum chamber housing itself. At least one process module extends from the outside of the vacuum chamber, wherein supporting peripheral devices may be located inside the chamber toward the sample platform. This allows the process module to interact with or process samples on the sample platform disposed inside the vacuum chamber, and is easily interchangeable with modular adapters. Multiple process modules can be integrated and sealed within a specific modular adapter. Different types of process modules can be interchanged by installing alternative modular adapters containing the desired components. This modularity and configurability enable metrology equipment to be optimized for a variety of analytical programs. In various instances, modular metering devices may include a mechanical interface comprising a force-fit connection, and / or a form-fit connection, and / or a material-fit connection. The mechanical interface between the modular adapter and the vacuum chamber housing can utilize various types of connections for secure attachment. For example, a force-fit connection applies force or pressure between components to achieve a secure connection. This can be implemented using clamps, screws, interference fits, or other components that generate compressive forces between mating components. A form-fit connection utilizes shape and surface geometry to achieve a secure connection. This may involve pins, shoulder joints, protruding lips, flanges, or other interlocking shapes that prevent movement or separation. A material-fit connection utilizes chemical or molecular bonds between multiple materials. Many examples involve forging, welding, or bonding that creates attachment at the material level. Using one or a combination of these mating principles allows for customization of the mechanical interface for leak-proof and robust connections. The connection must maintain vacuum integrity while also allowing for modular flexibility through interchangeable adapters. In various instances, the mechanical interface can utilize snap-fit ​​mounting as a form-fit connection between the modular adapter and the vacuum chamber housing. Snap-fit ​​mounting can use mating components with corresponding indentations and protrusions that interlock when rotated to the engaged position. For example, the mechanical interface of a vacuum chamber may have protruding pins or tabs, while a modular adapter has a groove with a mating shape. By aligning the groove of the adapter with the tab of the chamber and then twisting to engage a locking mechanism, the components are pulled together for a secure installation. This allows for quick interchange of modular adapters while also establishing a reliable attachment through a vacuum seal. Snap-fit ​​installation is an example of this specific shape-fitting interface implementation. Other examples of form-fit connections may include threaded fittings, grooves, or equivalent geometric couplings that align and interlock vacuum chamber housings and interchangeable modular adapters. In various instances, the modular metrology device may further include at least one of the following components: scanning electron microscope (SEM), focused ion beam (FIB) system, gas injection system (GIS), energy dispersive X-ray spectroscopy (EDX) detector, secondary electron detector, backscattered electron detector, and infrared detector camera. Modular metering devices can be configured to house various types of process modules within interchangeable modular adapter assemblies. Examples of integrable process modules include one or more of the following: Components of charged particle beam columns (such as lenses, apertures, deflectors, detectors), charged particle columns (like scanning electron microscopes or focused ion beams, auxiliary detectors) or analytical components (like gas injection systems, EDX detectors or electron detectors), complementary detector modules (such as infrared cameras). This allows the metrology apparatus to be optimized for different inspection and analysis capabilities by selecting the desired process modules. Modular adapters can be pre-configured with different process tools or analysis sets to adapt the system as needed. Through modular interchangeability that adapts to a range of process modules, the metrology apparatus provides flexibility and customization for a variety of metrology applications. One or more other process modules can be integrated into the modular metrology device, which can be configured to detect, analyze or measure samples or processing parameters within a vacuum chamber. Some examples include: an optical microscope for providing visual inspection of samples with high resolution and multiple illumination modes; a laser scanning microscope for performing confocal optical imaging and surface profilometry of samples; multiple spectral analysis modules, such as FTIR, Raman, or UV-Vis spectrometers, for chemical characterization and compositional analysis; an ellipsometry for measuring optical properties and film thickness; multiple stress measurement sensors for determining residual stress in structures via strain gauges or other techniques; a Hall effect sensor for measuring the electrical properties of semiconductor materials; a stylus profilometer for delineating surface layout by dragging a fine stylus across a sample; an interferometer for measuring changes in position and distance; a mass spectrometer for analyzing composition through ionization and mass-based classification of chemicals; multiple gas analysis modules for measuring partial pressure and detecting leaks using residual gas analyzers; multiple thermal sensors for determining the temperature or heat flow of samples; and multiple nanomanipulators for precisely positioning and manipulating nanoscale samples. Modular design allows for the integration of any combination of these detectors, sensors, and analytics components into process modules to implement comprehensive sample characterization. In various instances, a modular metrology apparatus may include a modular adapter configured to receive two or more (e.g., three or more) different process modules. The modular adapter assembly may be designed to simultaneously house multiple process modules. By integrating more than one type of process module, the functionality of the metrology apparatus can be expanded. For example, the modular adapter may include both a scanning electron beam column and a focused ion beam column. This provides the ability to perform electron and ion beam imaging, ablation, deposition, and other techniques on a single adapter. Additional process modules, such as dedicated detectors, may also be included. In various instances, at least one process module includes a scanning electron microscope (SEM). Modular metrology setups may include a scanning electron microscope (SEM) as one of several interchangeable process modules. The SEM process module may include one or more electron column assemblies, which include an electron source, multiple lenses, multiple deflectors, and multiple detectors to generate a focused electron beam. This electron beam can perform raster scanning on the sample surface to build an image and map based on the detected signals. Modular adapters can fully incorporate and integrate the SEM column and related components. By using interchangeable modular adapters, the SEM can be changed in different spatial configurations as needed, providing flexibility for reconfiguring metrology setups for electron microscopes. Changing the modular adapter allows the SEM to be interchanged with other process modules to reconfigure metrology setups for electron microscopy analysis. SEMs enable high-resolution imaging, metrology, defect detection, and other analytical techniques on samples within a vacuum chamber. In various instances, the modular metrology apparatus may further include a modular adapter configured for tilting and orienting the SEM particle source column relative to the z-axis of the machine coordinate system defined by preset settings of the sample platform. The modular adapter allows the offset of the SEM column relative to the vertical z-axis of the sample platform to form a tilt or angle. The SEM column can be intentionally offset from the z-axis by a tilt angle, such as 10-30 degrees. This allows the electron beam to strike the sample surface at an angle rather than perpendicularly. The tilting mechanism can use a pivoting or linear offset platform integrated into the modular adapter assembly. Tilting the SEM column provides flexibility in beam positioning for angle-resolved imaging, 3D tomography, sidewall imaging, and optimized detection geometry. This allows the electron beam to strike the sample at an angle or side angle rather than perpendicularly to the sample surface. Tilting the column provides flexibility in how the SEM interrogates the sample. In various instances, the modular adapter may further comprise at least two process modules, each including a particle source column for a scanning electron microscope (SEM) and a beam emitter for a focused ion beam (FIB) system. The modular adapter can integrate both an SEM column and an FIB column. It can combine an SEM column and a focused ion beam (FIB) column within the same adapter. This provides combined electron and ion beam capabilities in a single modular configuration. The FIB process module may include one or more of an ion source, beam optics, gas injection, and detectors customized for ion beam processing and imaging. The combined SEM and FIB columns allow metrology equipment to perform operations such as high-resolution profiling through a combination of FIB grinding and SEM imaging. Adaptable systems for SEM-FIB modular adapter replacement enable correlated, multimodal electron and ion beam analysis. This provides combined electron and ion beam capabilities in a single modular configuration. For example, the adapter can be replaced between SEM-only, FIB-only, or combined SEM-FIB operations in various and / or different spatial configurations. In various examples, the modular metrology apparatus may further include a laser interferometer system with a reference mirror integrated into a modular adapter, the laser interferometer configured to measure the distance between the modular adapter and the sample platform. The interferometer uses the laser aiming and the reference mirror integrated into the adapter to monitor the distance through an interference pattern. A laser interferometer module can be combined to accurately measure the relative positioning between the modular adapter and the sample platform. This uses an integrated reference mirror to reflect the interferometer laser for distance measurement and positioning control feedback. In various instances, the modular metrology apparatus may further include a reference mirror recessed into the modular adapter relative to at least one process module, wherein the tip of the at least one process module has a forward-facing position towards the sample platform. This allows the column to extend forward closer to the sample platform without interfering with the laser path. Since the process modules need to be as close to the sample as possible, recessing the reference mirror eliminates potential obstacles, thereby minimizing the working distance. For example, a recess exceeding 5 mm allows unobstructed access to angled or tilted process modules while maintaining positioning reference. The reference mirror can be positioned in the recessed location such that the process module tip extends further towards the sample platform. This allows electron / ion columns or other process modules to be positioned as close as possible for maximum flexibility. In various instances, the modular metrology unit may further incorporate a scanning electron microscope (SEM) with a working distance of less than 5 mm between the tip of the particle source column and the sample platform. The modular adapter can accommodate the SEM column, enabling a smaller working distance between its lower tip and the sample platform. For example, a working distance of less than 5 mm can be achieved. This allows the SEM to be positioned close to the sample to improve resolution and beam intensity. The reduced working distance also enables several special modes, such as low-voltage scanning for ultra-sensitive imaging. To achieve working distances below 5 mm, the mechanical and electrical designs must avoid collisions and field interactions between the column and platform. The modular adapter provides an integrated solution for positioning the SEM column within this tight constraint when scanning the sample. The adaptable modular architecture facilitates the miniaturization of SEM configurations that are not conventional. In various instances, the modular metrology apparatus may further include a modular adapter with a turntable shape, comprising a rotatable structure to allow at least one process module to be variably positioned relative to the sample platform. The modular adapter can utilize a turntable design to allow the process module to rotate around the sample platform. In a turntable configuration, the adapter has a rotating portion that can pivot to precisely aim at the attached process module. For example, the adapter may include multiple posts or tools at a fixed port around the turntable. By rotating the turntable portion, different process modules can be indicated to align with the sample. This allows for variable positioning without disrupting the vacuum. The rotatable turntable provides flexibility to reorient the process module to approach the sample from different angles. Discrete rotational increments allow for repeatable positioning. This method allows for the implementation of unconventional geometries while maintaining the modular interchangeability of the adapter. In various instances, the modular metrology apparatus may further include at least one process module that can be translated and / or pivoted relative to a modular adapter via at least one actuator to position the process module relative to a sample platform. The modular adapter allows for the integrated movement of process modules using actuators. These actuators can translate (linearly position) and / or pivot (rotate) the process module relative to the sample. For example, a process module can be mounted on a controllable linear slide or rotary table. This enables precise xyz positioning adjustments and / or angular tilting of the column or tool relative to the sample. Actuators can be used to align the process module with calibration targets, optimize working distances, raster scan beams, perform angular positioning, and further customize the geometry between the module and the sample. The modular adapter provides an integrated mechanical structure to incorporate adjustable actuators. This allows for flexible positioning of the module after the adapter is installed, thereby enhancing modularity and configurability. The actuator expands the range of possible process module orientations. In various examples, the modular metrology apparatus may further include an external deflection unit, which is fixed to the modular adapter and configured to deflect the ion beam of the focused ion beam (FIB) system to adjust the incident angle on the sample platform. An external deflection unit can be incorporated into the modular adapter to manipulate the trajectory of the ion beam within the FIB column. This deflection unit is located outside the FIB column itself and provides additional control over the beam angle. For example, the deflection unit can be implemented via one or more charged wires or an electromagnetic lens placed in the beam path. By controlling the voltage or current, the ion beam can be deflected to change its incident angle on the sample platform. This enables variable beam approach angles, overlap with other beam positioning, misalignment, and platform drift compensation. External operation simplifies changes in ion beam geometry. Fixed integration into the adapter modularizes the deflector along with the FIB column. An external deflection unit may include an electromagnetic or electrostatic lens configured to deflect the ion beam of a focused ion beam (FIB) system to adjust the incident angle on the sample platform. The external ion beam deflection unit can influence the beam path using a charged electromagnetic lens or an electrostatic deflector. By controlling the lens voltage or current, the trajectory of the focused ion beam can be manipulated and adjusted as needed. This allows the angle at which the beam impacts the sample surface to be controlled, independent of the FIB post alignment. In various examples, the external deflection unit may include a conductor traversing the ion beam through the focused ion beam (FIB) system to generate a magnetic field that deflects the ion beam, thereby adjusting the incident angle on the sample platform. The ion beam deflection unit can use a current-carrying wire or other conductor placed in the beam path to generate the magnetic field. When the charged ion beam passes through this magnetic field, its trajectory will bend according to the electromagnetic right-hand rule. Changing the current in the wire adjusts the ion beam deflection angle and the incident angle on the sample platform. An external deflection unit can be configured to deflect the ion beam of a focusing ion beam (FIB) system to adjust the incident angle and align it with a common incident point on the sample platform, serving as the electron beam for a scanning electron microscope (SEM). The ion beam deflector can be used to coincide the FIB and SEM beams at the same point on the sample. By deflecting the ion beam, it strikes the sample at the same location as the stationary electron beam. This allows certain dual-beam operations (such as profiling) to be performed without sample movement. Adjustable ion beam deflection allows for flexible alignment of the two beams. In various instances, the modular metrology device may be a charged particle microscope system or a scanning electron microscope (SEM) system; or in some instances, a combined SEM-FIB system that selectively has additional processing modes provided by other process modules. In various examples, the vacuum chamber housing, modular adapter, and at least one process module are mechanically interlocked to form a sealed internal space within the vacuum chamber. The vacuum chamber housing, adapter, and process module are sealed together to create the vacuum environment required for charged particle beams. The mechanical interlocking between these detachable components forms a closed internal space that can be evacuated to achieve the vacuum conditions required for electron beam or ion beam operation, sample detection, and processing. In various instances, the mechanical interface may include a separation mechanism, such as a quick-release mechanism, for the removal and reattachment of the modular adapter. The mechanical interface may incorporate one or more precision alignment features, such as motion mounts or pin or keyed designs, to ensure the repeatability of the modular adapter. For example, the mechanical interface can employ a standardized design compatible with various modular adapters, such as a flange design. In various instances, a standardized interface allows for interchangeability between different adapter configurations without requiring modification of the vacuum chamber housing. Modular adapters can be configured to accept and / or hold multiple (i.e., two or more, or three or more) different process modules. For example, they can position multiple process modules relative to each other in a predefined spatial configuration. For example, they can define the relative positions of the process modules to each other. In various instances, the spatial configuration of the process modules can be predetermined by the adapter. A modular adapter for a metering device can be formed as a component separable from at least one process module and configured to attach to a mechanical interface of a vacuum chamber. The modular adapter may include a corresponding mechanical interface corresponding to the mechanical interface of the vacuum chamber housing. The mechanical interface can be configured for separable attachment of the modular adapter. The modular adapter can be configured as an intermediate mechanical component between the mechanical interfaces of one or more process modules and the vacuum chamber housing. Mechanical interfaces can provide uniform and / or standardized mechanical and / or electrical and / or fluid connections between one or more process modules and the vacuum chamber. For example, one or more process modules can be configured as one or more integrated units within an adapter in a metrology system. In various instances, they can be interchanged integrally by separating the interface between the modular adapter and the housing. This integrated design of the adapter allows different analytical tools to be mounted closer than in individual positions on the vacuum chamber housing. Different adapters with different configurations of one or more process modules are interchangeable. In various instances, they can utilize the same standardized mechanical and / or sealing interfaces as the vacuum chamber housing. Therefore, switching between different analysis system configurations can be achieved simply by replacing the adapter. The modular adapter can be attached to one side of one or more process modules and to the other side of the vacuum chamber housing. The modular adapter can surround each of the one or more process modules. The modular adapter provides a vacuum seal as a single interface to the vacuum chamber housing. This eliminates the need to seal each module directly and individually to the housing. Although the invention has been shown and described with reference to certain preferred embodiments, equivalents and modifications will arise upon reading and understanding this specification by those skilled in the art. The invention includes all such equivalents and modifications and is limited only by the scope of the claims following this document. To illustrate this, the various examples above have been disclosed, in which the dwell time is adjusted between multiple image captures with low and high SNR, respectively. In addition to adjusting the dwell time, different imaging parameters affecting SNR, such as particle flux / particle current, can also be adjusted. 10: Vacuum chamber housing; 20: Process module / modular adapter; 21: First SEM process module; 22: First FIB process module; 23: Second SEM process module; 24: Second FIB process module; 30: Sample platform; 40: Laser interferometer system; 41: Reference mirror; 42: Reference mirror; 50: Modular adapter; 51: Actuator; 52: Linear actuator; 60: Mechanical interface; 61: Screw; 70: Deflection unit; 1000: Dual-beam modular metrology equipment; 1001: Dual-beam device; 1002: Operation control sheet. 1006.1: Measurement point; 1006.2: Measurement point; 1008: Wafer; 1015: Wafer stage; 1016: Control unit; 1017.1: Particle detector; 1017.2: Particle detector; 1019: Control unit; 1021: Position control; 1040: Charged particle beam (CPB) imaging system; 1042: CPB imaging system axis; 1043: Intersection point; 1044: Charged particle beam; 1048: FIB optical axis / FIB axis; 1050: FIB column; 1051: Focused ion beam (FIB); 1055: Wafer surface; 1155: Platform; GFE: Angle; GF: Tilting angle. Those skilled in the art will understand and appreciate these and other objects of the invention from the following preferred embodiments in conjunction with the drawings, wherein like reference numerals denote like elements. Figure 1 schematically illustrates a modular metering device comprising a SEM process module and a FIB process module according to various examples. Figure 2 schematically illustrates a modular metering device containing various additional process modules for processing samples, according to various examples. Figure 3 schematically illustrates a modular metrology device comprising a SEM process module, a FIB process module, and a laser interferometer, according to various examples. Figure 4 schematically illustrates the working distance of the modular metering device according to various examples of Figure 3. Figure 5 further schematically illustrates the working distance of the modular metrology device for the reference mirror of the laser interferometer according to various examples of Figures 2 and 3. Figure 6 schematically illustrates modular adapters according to various examples, in which a reference mirror system for the laser interferometer phase is recessed into the modular adapter. Figure 7 schematically illustrates a modular metrology apparatus according to various examples of Figure 3, which includes different modular adapters with different configurations of SEM and FIB process modules, and a laser interferometer with a recessed reference mirror. Figure 8 schematically illustrates the working distance of the modular metering device according to various examples of Figure 7. Figure 9 schematically illustrates a modular metering device containing a modular adapter with additional process module configurations, according to various examples. Figure 10 schematically illustrates a modular metering device, according to various examples, containing a modular adapter with additional process module configurations. Figure 11 schematically illustrates a modular metering device containing a modular adapter with additional process module configurations, according to various examples. Figure 12 schematically illustrates the mechanical interface between a vacuum chamber housing and a modular adapter, according to one of various examples. Figure 13 schematically illustrates, according to one of various examples, an additional mechanical interface between a vacuum chamber housing and a modular adapter. Figure 14 schematically illustrates, according to one of various examples, an additional mechanical interface between a vacuum chamber housing and a modular adapter. Figure 15 schematically illustrates a modular metering device, according to various examples, containing SEM and FIB process modules and a deflection unit integrated into a modular adapter. 10: Vacuum chamber shell 41: Reference Mirror 50: Modular Adapter

Claims

1. A modular metering device, comprising: - A vacuum chamber housing having an opening with a mechanical interface configured to seal and attach a modular adapter; - A sample platform located inside the vacuum chamber housing; - At least one charged particle scanning system, each of the at least one charged particle scanning system configured to scan a corresponding charged particle beam across the sample platform; wherein the mechanical interface between the modular adapter and the vacuum chamber housing extends along the periphery of the opening and includes a mounting mechanism to allow the modular adapter to be detachably attached to the vacuum chamber housing.

2. The modular metering device as described in claim 1 further includes: - A modular adapter attached to the mechanical interface, the modular adapter including at least one process module configured to process samples placed on the sample platform.

3. The modular metering apparatus as described in claim 2, wherein the at least one process module includes at least one particle source column of the at least one charged particle scanning system.

4. The modular metrology device as described in claim 3, wherein the modular adapter is configured such that the particle source column is tilted relative to the z-axis of the machine coordinate system defined by a preset setting of the sample platform.

5. The modular metering device as claimed in claim 1, wherein the at least one process module is enclosed within the modular adapter and extends from the outside of the vacuum chamber housing toward the sample.

6. The modular metering device as described in claim 1, wherein the mechanical interface includes a force-fit connection.

7. The modular metrology apparatus as claimed in claim 1, wherein the at least one process module comprises at least two process modules, wherein the at least two process modules are selected from the group consisting of: scanning electron microscope (SEM), focused ion beam (FIB) system, gas injection system (GIS), energy dispersive X-ray spectroscopy (EDX) detector, secondary electron detector, backscattered electron detector and infrared detector camera.

8. The modular metrology apparatus as claimed in claim 1, wherein the at least one process module comprises at least two process modules, each comprising a particle source column for a scanning electron microscope (SEM) and a beam emitter for a focusing pear beam (FIB) system.

9. The modular metrology apparatus as claimed in claim 1 further includes a laser interferometer system having a reference mirror integrated into the modular adapter and configured to measure the distance between the modular adapter and the sample platform, wherein the reference mirror is recessed within the modular adapter relative to the at least one process module, wherein the tip of the at least one process module has a foremost position facing the sample platform.

10. The modular metering apparatus as claimed in claim 1, wherein the at least one process module is translatable relative to the modular adapter in a vertical and / or lateral direction by at least one actuator, so as to position the process module relative to the sample platform.

11. The modular metering device as claimed in claim 1, wherein the at least one process module is pivotable relative to the modular adapter by means of the at least one actuator, so as to enable angular positioning of the process module relative to the sample platform.

12. The modular metrology apparatus as described in claim 8 further includes an external deflection unit fixed to the modular adapter and configured to deflect the ion beam of the focused ion beam (FIB) system to adjust the incident angle on the sample platform.

13. The modular metrology apparatus as claimed in claim 12, wherein the external deflection unit includes a conductor that passes through the ion beam of the focused ion beam (FIB) system to generate a variable magnetic field that deflects the ion beam to adjust the incident angle on the sample platform.

14. The modular metrology apparatus as claimed in claim 12, wherein the external deflection unit is configured to deflect the ion beam of the focused ion beam (FIB) system to adjust the incident angle and align it with a common incident point on the sample platform as the electron beam of a scanning electron microscope (SEM).

Images