Wiring substrate and electrical connecting apparatus

Abstract

The objective of this invention is to suppress the temperature rise of the wiring board and improve the heat dissipation effect of the heated wiring conductors. As a solution, this invention provides a wiring board for an electrical connection device that electrically connects an inspection device and an object being inspected. The board has, on one hand, a first wiring area connected to the inspection device, and on the other hand, a second wiring area connected to a plurality of electrical contacts that are respectively connected to electrode terminals of the object being inspected. At least on the outer periphery of the first wiring area, a first annular groove is provided, and / or on the outer periphery of the second wiring area, a second annular groove is provided.

Description

[Technical Field]

[0001] The present invention relates to wiring substrates and electrical connection devices, such as electrical connection devices for probe cards used in electrical inspections such as power-on tests of various semiconductor integrated circuits formed on semiconductor wafers. [Previous Technology]

[0002] For example, there are various types of wiring boards used in probe cards. One type uses high-temperature co-fired ceramics (HTCC) to improve board strength. However, because it is fired at high temperatures, the wiring conductor system uses tungsten or molybdenum, which have high melting points. However, tungsten has a melting point of 3,422°C, and molybdenum has a melting point of 2,622°C. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] International Publication No. 2017 / 081951 [Summary of the Invention]

[0004] [Problem to be Solved by the Invention] Typically, in a resin substrate, the wiring conductor system is formed of copper, which has a resistivity as low as 1.68 × 10⁻⁸ Ω・m. On the other hand, tungsten, used as the wiring conductor in the aforementioned wiring substrate, has a resistivity as high as 5.29 × 10⁻⁸ Ω・m, which is 3.14 times that of copper.

[0005] When resistivity is high, the wiring conductor heats up due to the applied current, and the wiring substrate expands due to this heat. In the wiring substrate of the probe card, this thermal expansion causes positional displacement of the terminals (e.g., probe pads) and electrical contacts (e.g., probes) of the wiring substrate. As a result, the accuracy of electrical testing of the semiconductor integrated circuit being inspected can be affected.

[0006] Therefore, in view of the above-mentioned problems, the present invention provides a wiring board that can improve the heat dissipation effect of the heat-generating wiring conductors in order to suppress the temperature rise of the wiring board. [Means for solving the problems]

[0007] In order to solve the related problems, the first invention is a wiring board for an electrical connection device for electrically connecting an inspection device and an inspected object. It has a first wiring field connected to the inspection device on one side and a second wiring field connected to a plurality of electrical contacts that are respectively connected to the electrode terminals of the inspected object on the other side. At least on the outer periphery of the first wiring field on one side, a first annular groove is provided, and / or on the outer periphery of the second wiring field on the other side, a second annular groove is provided.

[0008] The second invention relates to an electrical connection device that electrically connects an inspection device to an inspected object, and includes a wiring board of the first invention that is electrically connected to the inspection device and electrically connected to a plurality of electrical contacts that are respectively in contact with electrode terminals on the inspected object. [Effects of the Invention]

[0009] According to the present invention, in order to suppress the temperature rise of the wiring substrate, the heat dissipation effect of the heated wiring conductor can be improved.

Implementation Method

[0011] (A) Main Embodiment Hereinafter, embodiments of the wiring board and electrical connection device of the present invention will be described in detail with reference to the drawings.

[0012] (A-1) The configuration diagram of the electrical connection device is shown in Figure 1.

[0013] In FIG1, the electrical connection device 10 of the embodiment is electrically connected to the inspection unit (tester) TE and has a support member 11, a wiring board 12, a connection board (intermediate layer) 13, a multilayer wiring board 14, a connection unit 15, and a probe board 16.

[0014] However, in the following drawings, the same or corresponding constituent elements are labeled with the same or corresponding symbols. It should be noted that the dimensions, thicknesses, etc., of each constituent element in the schematic diagrams differ from reality. Furthermore, the dimensions and ratios of corresponding constituent elements also differ between the drawings. The embodiments shown below are examples of apparatuses or methods used to concretize the technical concept disclosed herein, and do not limit the material, shape, structure, or arrangement of the constituent elements disclosed herein. Also, each drawing illustrates the main constituent components, but is not limited to the illustrated components; in reality, it may also include components not shown.

[0015] The electrical connection device 10 is used for electrical testing of the object under test 83, and transmits electrical signals between the object under test 83 and the tester (inspection device) TE. The electrical connection device 10 has an electrical contact (probe) that makes electrical contact with the electrode terminals 84 of the object under test 83.

[0016] The electrical connection device 10 is installed on the test head of the tester TE. During inspection, the corresponding electrical contact is electrically connected to each electrode terminal 84 of the object under inspection 83, so that the tester TE and the object under inspection 83 are electrically connected.

[0017] That is, during inspection, the electrical connection device 10 provides the electrical signal from the tester TE to the electrode terminals 84 of the test object 83 via electrical contacts, and also provides the electrical signal from the test object 83 to the tester TE via electrical contacts. In this way, the test object 83 and the tester TE are electrically connected through the electrical connection device 10, and the tester TE can inspect the electrical characteristics of the test object 83.

[0018] [Item under inspection 83] Item under inspection 83 is the object whose electrical characteristics are inspected by the tester TE. For example, suppose that item under inspection 83 is a semiconductor integrated circuit formed on a semiconductor wafer before dicing, having multiple transistors such as semiconductor integrated circuits (IC chip devices), and a high current is allowed during inspection. The shape of item under inspection 83 is not particularly limited, for example, it can be rectangular or triangular when viewed from above.

[0019] The object to be inspected 83 is, for example, placed on top of a chuck 82 connected to a drive unit 81 such as a multi-axis stage. The position of the object to be inspected 83 on the chuck 82 can be adjusted by the drive unit 81. During inspection, the object to be inspected 83 on the chuck 82 is brought close to the electrical contacts of the electrical connection device 10, and each electrode terminal 84 of the object to be inspected 83 makes electrical contact with the corresponding electrical contact.

[0020] [Probe substrate 16] The probe substrate 16 is a substrate having a plurality of probes. The probes of the probe substrate 16 are disposed at positions corresponding to the positions of the electrode terminals of the object being inspected 83. Furthermore, the upper ends of the probes of the probe substrate 16 can be electrically connected to connection terminals disposed on another side (e.g., below) of the multilayer wiring board 14.

[0021] The probe system disposed on the probe substrate 16 can be either a vertical probe or a cantilever probe.

[0022] [Support Member 11] The support member 11 is disposed on the upper center of the wiring board 12 to stabilize the posture of the wiring board 12. The support member 11 is also referred to as a reinforcing member.

[0023] [Wiring substrate 12] The wiring substrate 12 is, for example, a slightly circular plate-shaped printed circuit board formed of a synthetic resin material such as polyimide. The wiring substrate 12 is a test head wiring substrate electrically connected to the test head.

[0024] A wiring pattern is formed on one side (e.g., the top) of the wiring board 12, and electronic components such as resistors and capacitors are provided. At the outer edge of the wiring board 12, a plurality of tester connection portions (not shown) are provided for circuit connection with the tester TE, and each tester connection portion is connected to the printed wiring on the wiring board 12.

[0025] For example, a plurality of through holes are formed on the wiring substrate 12, extending along the thickness direction (Z-axis direction). A conductive connector is inserted into the through holes and connected to the connection terminal on the probe substrate 16. Thus, an electrical connection can be made between the wiring substrate 12 and the probe substrate 16 via the conductive connector.

[0026] [Connection Unit 15] The connection unit 15 is a component that connects the connection substrate 13, the multilayer wiring substrate 14, and the probe substrate 16. The connection unit 15 supports the connection substrate 13 and the multilayer wiring substrate 14, and can mount the probe substrate 16, thereby enabling electrical connection between the upper ends of each probe (probe) of the probe substrate 16 and the plurality of terminals on the lower part of the wiring substrate 12.

[0027] For example, the connection unit 15 is located between one side (e.g., the top) of the probe substrate 16 and the other side (e.g., the bottom) of the wiring substrate 12, and includes the connection substrate 13 and the multilayer wiring substrate 14 described later. Through the connection substrate 13 and the multilayer wiring substrate 14, each probe is electrically connected to each terminal portion on the bottom of the wiring substrate 12.

[0028] [Connecting substrate 13] The connecting substrate 13 is a substrate having connecting terminals such as spring pins, electrically connected to connecting terminals formed on another side (e.g., the lower side) of the wiring substrate 12, and connecting terminals formed on one side (e.g., the upper side) of the multilayer wiring substrate 14. However, here, an example using a known spring pin that can be elastically deformed along the axial direction as a connecting terminal is described, but it is not limited to this. As connecting terminals other than spring pins, for example, known terminals, connectors, etc. formed from simple rods or plates may also be used.

[0029] [Multilayer wiring board 14] The multilayer wiring board 14 is a board that electrically connects the upper ends of a plurality of probes disposed on the probe board 16 to the connection terminals on the other side (e.g., below) of the connection board 13.

[0030] For example, the multilayer wiring board 14 is, for example, an insulating board, having connection terminals on one side (e.g., the top) and on the other side (e.g., the bottom). Furthermore, within the multilayer wiring board 14, a connection wiring path is formed between the plurality of connection terminals provided on one side and the connection terminals provided on the other side. The connection terminals on the other side of the multilayer wiring board 14 are located on the probe board 16 relative to the probe position. Therefore, each probe of the probe board 16 can be electrically connected to each connection terminal on the other side (bottom) of the multilayer wiring board 14.

[0031] However, the wiring system of the multilayer wiring board 14 has a conductive metal, which varies depending on the type and manufacturing method of the multilayer wiring board 14, and may be copper, copper alloy, tungsten, molybdenum, etc.

[0032] For example, in the case of a multilayer wiring substrate 14 formed of a resin such as polyimide, the wiring conductor system used in the wiring pattern, connection terminals, internal wiring paths, etc., formed on the substrate can be copper or a copper alloy. Furthermore, for example, in a method of simultaneously firing ceramics at high temperatures, when the multilayer wiring substrate 14 is formed by simultaneously firing the ceramic and the wiring conductor, since it is fired at high temperatures, the wiring conductor can be made of tungsten, molybdenum, etc.

[0033] (A-2) Heat dissipation structure of multilayer wiring board 14 (part 1) Hereinafter, the heat dissipation structure of multilayer wiring board 14 will be described. This structure effectively dissipates heat generated in the wiring conductors by current flowing through them during electrical testing of the tested object 83. Therefore, it is not limited to the type of wiring conductor, nor is it limited to the multilayer wiring board 14; any board having wiring conductors can be widely applied.

[0034] Figure 2 is a top view of the multilayer wiring board 14, Figure 3 is a perspective view of the multilayer wiring board 14, and Figure 4 is a cross-sectional view of the multilayer wiring board 14 in Figure 2.

[0035] As shown in Figures 2 to 4, the multilayer wiring substrate 14 is a slightly rectangular plate-shaped substrate. However, the shape of the multilayer wiring substrate 14 is not limited to a rectangle.

[0036] A wiring pattern is formed on one side (e.g., the top) of the multilayer wiring board 14, and a plurality of connecting terminals 21 connected to the wiring pattern of this specification are provided. The plurality of connecting terminals 21 are each capable of being connected to connecting terminals such as spring pins of the connecting board 13. On one side of the multilayer wiring board 14, the area where the wiring pattern and connecting terminals 21 are provided is referred to as the first wiring area 142.

[0037] Furthermore, a wiring pattern is also formed on another side of the multilayer wiring board 14 (for example, below), and a plurality of connection terminals 22 connected to the wiring pattern of this specification are provided. The plurality of connection terminals 22 can be connected to the probes of the probe board 16. As shown in FIG4, on the other side of the multilayer wiring board 14, the area where the wiring pattern and connection terminals 22 are provided is referred to as the second wiring area 144.

[0038] As shown in FIG. 4, the connection terminal 21 on one side and the connection terminal 22 on the other side are electrically connected via an internal wiring path 23. Also, as shown in FIG. 4, a power layer 24 is provided inside the multilayer wiring board 14, which applies a power current as the main power supply during the inspection of the inspected object 83. Applying a relatively large power current to the power layer 24 can be considered one of the sources of heat generation.

[0039] As shown in Figures 2 to 4, an annular groove (hereinafter also referred to as "first annular groove") 141 is provided along the square edge 143 of one side of the multilayer wiring substrate 14. In other words, the groove 141 is provided around the slightly rectangular first wiring area 142.

[0040] Furthermore, as shown in FIG4, the trench 141 is provided at a position relating to a portion of the power layer 24 located inside the multilayer wiring board 14. For example, the trench 141 is provided at a position corresponding to the position of the end 241 of the power layer 24. In this example, the trench 141 is provided above the position of the end 241 of the power layer 24.

[0041] Thus, by providing a groove 141 at a position corresponding to the end 241 of the power layer 24, the heat generated by the power layer 24, which is the source of the heat generation, is transferred to the groove 141 through the substrate, and the heat is transferred to the air from the upper open groove 141, thereby dissipating heat.

[0042] Furthermore, on one side of the multilayer wiring substrate 14, by providing a groove 141 in an annular manner surrounding the first wiring field 142, heat dissipation can be uniformly achieved throughout the substrate.

[0043] Furthermore, in the multilayer wiring board 14, the second wiring field 144 on one side is connected to probes arranged with a narrow pitch, and the connection terminals 22 are also arranged with a narrow pitch. In contrast, the connection terminals 21 of the first wiring field 142 on one side are also arranged with a narrow pitch, but the spacing is not as large as that of the connection terminals 22 of the second wiring field 144. Therefore, by providing a groove 141 in an annular shape on one side of the multilayer wiring board 14, the heat generated by the entire board can be effectively and uniformly dissipated.

[0044] Here, in order to avoid the influence of noise, the bottom of the trench 141 does not reach the power layer 24. For example, if the power layer 24 is located at a distance of a few mm (e.g., 4 to 6 mm) from one side of the multilayer wiring board 14, then the depth of the trench 141 is a depth that does not reach the power layer 24 (for example, 3.5 to 5.5 mm in this case).

[0045] However, in the examples of FIG2 to FIG4, the edge portion 143 of the multilayer wiring board 14 is provided in order to facilitate the installation of the multilayer wiring board 14. However, from the viewpoint of improving heat dissipation, the edge portion 143 may not be provided.

[0046] (A-3) Heat dissipation structure of multilayer wiring board 14 (part 2) Next, referring to FIG5 and FIG6, the heat dissipation structure of multilayer wiring board 14 (part 2) will be described.

[0047] FIG5 is a plan view of the multilayer wiring board 14 of the embodiment, and FIG6 is a BB cross-sectional view of the multilayer wiring board 14 of FIG5.

[0048] The heat dissipation structure of the substrate shown in Figures 5 and 6 is such that a Peltier element 31, which serves as a heat dissipation component, is provided in the groove 141 shown in Figures 2 to 4. Also, as shown in Figure 6, it has a terminal 32 for supplying direct current to the Peltier element 31 provided in the groove 141 and a terminal 33 for outputting the current flowing through it.

[0049] The Peltier element 31 is an element having an n-type semiconductor (marked as "N" in FIG6), a p-type semiconductor (marked as "P" in FIG6) and a metal electrode, and has the property of absorbing heat (cooling) on ​​one side of the element and releasing heat on the other side when a direct current flows through it in a certain direction.

[0050] Therefore, as shown in FIG6, one side (heat-absorbing surface) of the Peltier element 31 is set on the side where the power supply layer 24, which serves as the heat source, is located, and the other side (heat-dissipating surface) of the Peltier element 31 is set on the opening side of the groove 141. Thus, the Peltier element 31 provided in the groove 141 absorbs heat from the melt generated by the power supply layer 24, and then the Peltier element 31 dissipates heat from the heat source to the opening of the groove 141.

[0051] By providing an annular groove 141 on one side of the multilayer wiring board 14, the heat dissipation effect can be improved. However, by providing a Peltier element 31 on the groove 141, direct current flows through the Peltier element 31, and the Peltier element 31 performs the effect of heat transfer, which can further improve the heat dissipation effect.

[0052] However, in this embodiment, in order to dissipate heat evenly on the substrate, a Peltier element 31 is embedded in the entirety of the groove 141 provided in an annular shape on one side of the multilayer wiring substrate 14. However, in order to dissipate heat on a part of the substrate, a Peltier element 31 may also be provided on a part of the groove 141.

[0053] (A-4 Heat dissipation structure of multilayer wiring board 14 (part 3) Next, referring to FIG7 and FIG8, the heat dissipation structure of multilayer wiring board 14 (part 3) will be described.

[0054] Figure 7 is a cross-sectional view of the multilayer wiring board 14 in the embodiment, and Figure 8 is an explanatory diagram illustrating the heat transfer caused by the heat dissipation structure.

[0055] The heat dissipation structure of the substrate shown in FIG7 and FIG8 is provided with a groove (hereinafter also referred to as "second annular groove") 145 in an annular shape in the outer field of the second wiring field 144 located in the center of the other side (e.g. below) of the multilayer wiring substrate 14.

[0056] On another aspect of the multilayer wiring board 14, connection terminals 22 arranged with a narrow pitch are provided on the second wiring field 144. Therefore, it is difficult to form a trench within the field of the second wiring field 144 for heat dissipation. However, on another aspect of the multilayer wiring board 14, outside the field of the second wiring field 144 (outer field), there is a support field 146 for ensuring support of the connection unit 15.

[0057] Here, as shown in Figures 7 and 8, a trench 145 is provided in the support area 146 of the multilayer wiring board 14. The trench 145 is provided at a position relating to a portion of the power layer 24 located inside the multilayer wiring board 14. For example, the trench 145 is provided at a position corresponding to the position of the end 241 of the power layer 24. In this example, the trench 145 is provided below the position of the end 241 of the power layer 24.

[0058] Furthermore, a Peltier element 31 is provided in the groove 145, and one side (heat absorption side) of the Peltier element 31 is set as the side where the power supply layer 24 is located, and the other side (heat dissipation side) of the Peltier element 31 is set as the open side of the groove 145.

[0059] Here, the support field 146 is the part supported by the connecting unit 15. However, as shown in FIG8, the Peltier element 31 provided in the groove 145 transfers heat to the connecting unit 15, and then the connecting unit 15 transfers heat to the support member 11, and the support member 11 dissipates heat into the air.

[0060] At this time, in order to ensure good heat transfer through the connecting unit 15 and the supporting member 11, a heat-conducting paste may be applied to the surface of the connecting unit 15 and the supporting member 11.

[0061] (A-5) As shown in FIG9, a variation of the heat dissipation structure of the multilayer wiring board 14 may be provided on one side of the multilayer wiring board 14, on the annular groove 141 and the groove 141 thereon, and on the other side, on the annular groove 145 and the groove 145 thereon. This can further improve the heat dissipation effect.

[0062] However, in FIG9, a case is illustrated in which a Peltier element 31 is provided in a groove 141 on one side of the multilayer wiring board 14, but it is also possible to provide only the groove 141 without providing a Peltier element 31.

[0063] Furthermore, as shown in FIG10, the multilayer wiring substrate 14 may replace the annular groove 141, and has four recesses 147 (147a~147d) formed in a slightly symmetrical arrangement on the outer periphery of one side of the multilayer wiring substrate 14.

[0064] For example, on one side of the multilayer wiring board 14, a partition portion 148 (148a~148d) is provided in a groove along the outer periphery, and the recesses divided by the partition portion 148 are designated as recesses 147a~147d. Here, the so-called slightly symmetrical arrangement means, for example, that recesses 147a and 147c are provided in positions opposite to each other on one side of the multilayer wiring board 14, and such arrangement is considered symmetrical. Similarly, recesses 147b and 147d are located in positions opposite to each other on one side of the multilayer wiring board 14, and are thus arranged in a slightly symmetrical manner. However, the slightly symmetrical arrangement is not limited to the arrangement of the recesses 147 in FIG10.

[0065] Thus, by providing the recesses 147 formed in a slightly symmetrical arrangement, the thickness of the multilayer wiring board 14 can be ensured and its rigidity can be improved when the multilayer wiring board 14 has the recesses 147. Furthermore, Peltier elements 31 can also be provided at appropriate positions in the recesses 147.

[0066] (A-6) As described above, according to the embodiment, in order to prevent the temperature of the multilayer wiring board from rising, the heat dissipation effect of the heat-generating wiring conductor can be improved. [Simplified Explanation of the Diagram]

[0010] [Figure 1] A structural diagram showing the configuration of the electrical connection device according to the embodiment. [Figure 2] A plan view (1) of the multilayer wiring board according to the embodiment. [Figure 3] A perspective view (1) of the multilayer wiring board according to the embodiment. [Figure 4] A-A cross-sectional view (1) of the multilayer wiring board in Figure 2. [Figure 5] A plan view (2) of the multilayer wiring board according to the embodiment. [Figure 6] B-B cross-sectional view (2) of the multilayer wiring board in Figure 5. [Figure 7] A cross-sectional view (3) of the multilayer wiring board according to the embodiment. [Figure 8] An explanatory diagram illustrating the heat transfer caused by the heat dissipation structure of the board according to the embodiment. [Figure 9] A modified example of the heat dissipation structure of the multilayer wiring board according to the embodiment (1). [Figure 10] A modified example of the heat dissipation structure of the multilayer wiring board according to the embodiment (2).

Claims

1. A wiring board for an electrical connection device that electrically connects an inspection device to an inspected object, characterized in that: in one aspect, it has a first wiring field connected to the inspection device; in another aspect, it has a second wiring field connected to a plurality of electrical contacts that are respectively connected to electrode terminals of the inspected object; and inside the wiring board, a power supply layer is provided for applying current between the first wiring field and the second wiring field. It has at least: a first annular groove with an upper open portion, located on one side and directly above the end of the power layer inside the wiring substrate, and overlapping with the end of the power layer, continuously disposed around the outer periphery of the first wiring area and along the edge of the aforementioned side, to release heat generated by the power layer; and / or a second annular groove with a lower open portion, located on the other side and directly below the end of the power layer, and overlapping with the end of the power layer, continuously disposed around the outer periphery of the second wiring area and along the edge of the aforementioned other side, to release heat generated by the power layer; a Peltier element that absorbs heat generated by the power layer and opens to the upper portion to release heat is disposed on the first annular groove; and a Peltier element that absorbs heat generated by the power layer and opens to the lower portion to release heat is disposed on the second annular groove.

2. The wiring board as described in claim 1, wherein, The first annular groove and the second annular groove are provided at a position corresponding to a portion of the aforementioned power layer.

3. The wiring board as described in claim 1, wherein, The aforementioned second annular groove is provided in the support field supported by the external support member on the other side, and the heat absorbed by the aforementioned Peltier element of the aforementioned second annular groove is transferred to the aforementioned external support member for heat dissipation.

4. An electrical connection device, characterized in that it is an electrical connection device for electrically connecting an inspection device and an object to be inspected, characterized in that it has a wiring board as described in any one of claims 1 to 3, which is electrically connected to the aforementioned inspection device and electrically connected to a plurality of electrical contacts that are respectively in contact with the electrode terminals of the aforementioned object to be inspected.

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