Semiconductor device processing apparatus and semiconductor device testing apparatus

Abstract

[Problem] To provide a semiconductor device processing apparatus that can improve the stability of electrical testing of semiconductor devices. [Solution] The processor 30 includes a first moving device 41A and a second moving device 41B, which move a first DUT 100A and a second DUT 100B, respectively. When the first moving device 41A presses the first DUT 100A against the probe card 20, the second moving device 41B performs an alignment operation without stopping the movement of the second DUT 100B, so as to position the second DUT 100B relative to the probe card 20.

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device processing apparatus for processing semiconductor devices (DUTs) formed by cutting semiconductor wafers, and a semiconductor device testing apparatus for testing the semiconductor devices. [Previous Technology]

[0002] An electronic component testing apparatus is known, which positions the bare die relative to the probe card by means of an alignment unit, and then performs electrical testing on the bare die by pressing the bare die against the probe card (for example, see Patent Document 1).

[0003] The alignment unit of this electronic component testing apparatus includes a hot head that holds the bare die and a moving device that moves the hot head. The moving device includes an X-direction track, a Y-direction track, and a Z-direction drive unit. By driving such a moving device, the bare die is positioned by moving the hot head in the XY directions and rotating it around the Z-direction. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2016-85203 [Summary of the Invention]

[0005] [Problem to be Solved by the Invention] In the above-described electronic component testing apparatus, after the positioning action of the bare die relative to the probe card, a die pressing action must be performed, which limits the improvement of the productivity of the electronic component testing apparatus. Here, for example, in order to improve productivity, it is possible to set up two alignment units in the above-described electronic component testing apparatus, whereby when one alignment unit presses the bare die against the probe card, the other alignment unit performs the above-described positioning action. However, in this case, there is a problem that poor contact between the bare die and the probe card may occur due to vibration caused by the positioning action, which may lead to unstable electrical testing of the bare die.

[0006] The problem this invention aims to solve is to provide a semiconductor device processing apparatus and a semiconductor device testing apparatus that can improve the stability of electrical testing of semiconductor devices. [Means for Solving the Problem]

[0007] [1] A first aspect of the present invention is a semiconductor device processing apparatus that moves a DUT to press the DUT against a contact portion, including a plurality of moving devices and a control device. The plurality of moving devices includes a first moving device and a second moving device that move the DUT respectively. The control device controls the plurality of moving devices. The DUT includes a first DUT moved by the first moving device and a second DUT moved by the second moving device. The control device controls the first moving device and the second moving device such that when the first moving device presses the first DUT against the contact portion, the second moving device does not stop the movement of the second DUT but performs an alignment operation to position the second DUT relative to the contact portion.

[0008] [2] The second state of the present invention may be a semiconductor device processing apparatus according to the first state, wherein the aforementioned control device controls the aforementioned first moving device and the aforementioned second moving device, such that the aforementioned second moving device begins the aforementioned alignment operation before the aforementioned first moving device presses the aforementioned first DUT against the aforementioned contact portion.

[0009] [3] The third state of the present invention may be a semiconductor device processing apparatus based on the first state or the second state, wherein the aforementioned control device controls the aforementioned first moving device and the aforementioned second moving device such that after the aforementioned first moving device moves the aforementioned first DUT away from the aforementioned contact portion and retracts from the contact position, the aforementioned second moving device reaches the aforementioned contact position in the state of having completed the aforementioned alignment operation.

[0010] [4] The fourth state sample of the present invention may be any semiconductor element processing device according to the first state sample to the third state sample, wherein the aforementioned control device controls the aforementioned second moving device such that during the aforementioned alignment operation, the aforementioned second moving device changes the moving direction of the aforementioned second DUT by causing the aforementioned second DUT to move in a curved manner.

[0011] [5] The fifth state of the present invention may be any of the semiconductor device processing apparatuses of the first to fourth states, the semiconductor device processing apparatus further comprising a plurality of DUT cameras that respectively capture images of the DUT held by the plurality of moving devices, wherein the control device detects the relative position of the DUT relative to the contact portion based on the image information captured by the DUT camera, wherein the alignment action includes: by means of an action, the DUT is moved relative to the DUT camera, so that the DUT passes relative to the shooting range of the DUT camera; and an adjustment action, based on the detection result of the control device, adjusting the relative position of the DUT relative to the contact portion, wherein the control device controls the DUT camera so that when the moving device performs the passing action, it performs the shooting action of capturing the DUT.

[0012] [6] The sixth state of the present invention may be a semiconductor element processing device according to the fifth state, each of the plurality of the aforementioned mobile devices includes a contact camera for capturing the aforementioned contact portion, and the aforementioned control device detects the relative position of the aforementioned DUT relative to the aforementioned contact portion based on the image information captured by the aforementioned DUT camera and the aforementioned contact camera.

[0013] [7] The seventh state of the present invention may be a semiconductor device processing apparatus according to the fifth state or the sixth state. Each of the aforementioned plurality of moving devices includes a holding part for holding the aforementioned DUT and a moving mechanism for moving the aforementioned holding part. The aforementioned shooting action includes the aforementioned DUT camera shooting the aforementioned DUT held by the aforementioned holding part while the aforementioned moving device moves the aforementioned holding part for holding the aforementioned DUT.

[0014] [8] The eighth state sample of the present invention may be any semiconductor element processing device according to the fifth to seventh state samples. The aforementioned DUT camera includes a first DUT camera having a first shooting range and a second DUT camera having a second shooting range that is narrower than the aforementioned first shooting range. The aforementioned alignment action includes a coarse alignment action performed using the aforementioned first DUT camera and a precision alignment action performed using the aforementioned second DUT camera.

[0015] [9] The ninth state of the present invention may be a semiconductor device processing apparatus according to the eighth state. The aforementioned coarse alignment operation includes: a first passing operation, which moves the aforementioned DUT relative to the aforementioned first DUT camera and passes the aforementioned DUT relative to the aforementioned first shooting range; and a first adjustment operation, which adjusts the relative position of the aforementioned DUT relative to the aforementioned contact portion based on the detection result of the first image information captured by the aforementioned first DUT camera. The aforementioned fine alignment operation includes: a second passing operation, which moves the aforementioned DUT relative to the aforementioned second DUT camera and passes the aforementioned DUT relative to the aforementioned second shooting range after the execution of the aforementioned coarse alignment operation; and a second adjustment operation, which adjusts the relative position of the aforementioned DUT relative to the aforementioned contact portion based on the detection result of the second image information captured by the aforementioned second DUT camera. The aforementioned shooting operation includes: a first shooting operation, which captures the aforementioned DUT by the aforementioned first DUT camera when the aforementioned second moving device performs the aforementioned first passing operation; and a second shooting operation, which captures the aforementioned DUT by the aforementioned second DUT camera when the aforementioned second moving device performs the aforementioned second passing operation.

[0016]

[10] The tenth state of the present invention may be a semiconductor device processing apparatus according to the ninth state, wherein during the first adjustment operation, the control device adjusts the relative position of the second DUT relative to the contact portion while the second moving device moves the second DUT flexibly.

[0017]

[11] The eleventh state of the present invention may be a semiconductor device processing apparatus according to the ninth state or the tenth state, the aforementioned alignment operation includes a transition operation from the aforementioned first pass operation to the aforementioned second pass operation, the aforementioned control device controls the aforementioned second moving device such that the aforementioned second moving device moves the aforementioned second DUT convexly during the aforementioned transition operation.

[0018]

[12] The twelfth state sample of the present invention may be any of the semiconductor device processing apparatus according to the ninth to eleventh state samples. During the second adjustment operation, the control device adjusts the relative position of the second DUT with respect to the contact portion while the second moving device moves the second DUT flexibly.

[0019]

[13] The thirteenth state sample of the present invention may be any semiconductor device processing apparatus according to the fifth to twelfth state samples, the aforementioned DUT includes a plurality of alignment marks, the aforementioned shooting action includes sequentially shooting each of the plurality of alignment marks when the aforementioned moving device performs the aforementioned passing action, and the aforementioned adjustment action adjusts the relative position of the aforementioned DUT relative to the aforementioned contact portion based on the position of the aforementioned plurality of alignment marks captured.

[0020]

[14] The fourteenth state sample of the present invention may be any semiconductor device processing apparatus according to the first state sample to the thirteenth state sample, wherein the aforementioned DUT is a bare die monomer, a 2.5D device intermediate in which a plurality of bare dies are arranged side by side on a silicon interposer, or a 3D device intermediate in which a plurality of bare dies overlap each other.

[0021]

[15] The fifteenth state sample of the present invention may be any semiconductor device processing apparatus according to the first state sample to the fourteenth state sample, wherein the aforementioned moving device presses the aforementioned DUT against the aforementioned contact portion by lifting the aforementioned DUT in the vertical direction.

[0022]

[16] The sixteenth state sample of the present invention is a semiconductor device testing apparatus, which is a semiconductor device testing apparatus for testing DUT, including any one of the first state sample to the fifteenth state sample, and a tester electrically connected to the aforementioned contact portion. [Effects of the Invention]

[0023] According to the present invention, the semiconductor device processing apparatus includes a plurality of moving devices. When the first moving device presses the first DUT against the contact portion, the second moving device performs an alignment operation to position the second DUT relative to the aforementioned contact portion without stopping the movement of the second DUT. Therefore, when the first moving device presses the DUT against the contact portion, since the starting and stopping of the movement of the second moving device, which are prone to large vibrations, are not performed, the stability of the electrical testing of the semiconductor device can be improved.

Implementation Method

[0025] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings.

[0026] FIG1 is a diagram showing the overall configuration of the semiconductor device testing apparatus 1 of this embodiment and the internal structure of the processor 30. FIG2 is an enlarged view showing part II of FIG1. ​​FIG3 is a block diagram showing the control system of the processor 30 of this embodiment.

[0027] The semiconductor device testing apparatus 1 of this embodiment is an apparatus for testing the first DUT100A and the second DUT100B. In addition, in the following description, the first DUT100A and the second DUT100B will also be collectively referred to as "DUT100".

[0028] As shown in FIG1, this semiconductor device testing apparatus 1 includes a tester 10, a probe card 20, and a processor 30. In addition, the probe card 20 corresponds to an example of the "contact portion" in the present invention, and the processor 30 corresponds to an example of the "semiconductor device processing apparatus" in the present invention.

[0029] A specific example of the DUT100, which is the test object of the semiconductor device test apparatus 1, can be a bare die (bare wafer) obtained after dicing a semiconductor wafer. In addition, the DUT100 is not limited to a bare die, and the DUT100 can also be, for example, a 2.5D device intermediate or a 3D device intermediate.

[0030] Here, the 2.5D device intermediate includes a silicon interposer and a plurality of bare dies arranged side by side on the silicon interposer. By mounting this 2.5D device intermediate, for example, on a wiring board and encapsulating it with resin material, it becomes the final product (i.e., a 2.5D device).

[0031] On the other hand, a 3D device intermediate is a device intermediate comprising a plurality of bare dies stacked on top of each other and electrically connected by through-silicon visors (TSVs). Similar to the 2.5D device intermediate described above, this 3D device intermediate is, for example, mounted on a wiring board and encapsulated with resin material to become the final product (i.e., a 3D device).

[0032] As shown in FIG1, the tester 10 includes a test head 11 and a host (tester body) 12. The test head 11 is connected to the host 12 via a cable. The probe card 20 is electrically connected to the test head 11. The probe card 20 is supported by a support mechanism 35 and enters the interior of the processor 30 through an opening 32 formed in the upper base 31 of the processor 30.

[0033] Although not specifically illustrated, this support mechanism 35 includes a bridge beam for fixing the probe card 20 and a tilt adjustment device for adjusting the tilt of the probe card 20 via this bridge beam. This support mechanism 35 is supported by a columnar member (not shown) erected on the lower base 34. By adjusting the tilt of the probe card 20 via the tilt adjustment device of this support mechanism 35, the parallelism between the probe card 20 and the DUT 100 can be adjusted.

[0034] As shown in Figure 2, the probe card 20 includes a wiring board 21 and a probe head 22 mounted on the wiring board 21. The probe head 22 includes a plurality of probe pins 23.

[0035] The probe 23 is an electrical probe that contacts the terminal 101 (refer to FIG. 2) of the DUT 100. A plurality of probes 23 are configured to correspond to a plurality of terminals 101 of the DUT 100. Although not particularly limited, specific examples of probes 23 may include spring-loaded probes, vertical probes, cantilever probes, anisotropic conductive rubber sheets, bumps provided on the membrane, or contactors made using MEMS technology.

[0036] The probe 23 is held by a housing (not shown) and is fixed to the wiring board 21 via the housing by screws or the like, thereby mounting the probe head 22 on the wiring board 21. Alternatively, the wiring board 21 can directly hold the probe 23, in which case the housing can be omitted.

[0037] As shown in Figures 1 and 2, the processor 30 includes a first alignment unit 40A, a second alignment unit 40B, a first imaging unit 50A, a second imaging unit 50B, and a control device 60 (refer to Figure 3). Furthermore, in the following description, the first alignment unit 40A and the second alignment unit 40B will be collectively referred to as "alignment unit 40," and the first imaging unit 50A and the second imaging unit 50B will be collectively referred to as "imaging unit 50." The first imaging unit 50A and the second imaging unit 50B correspond to an example of a "DUT camera" in this invention.

[0038] The first alignment unit 40A includes a first moving device 41A and a contact camera 44. The first moving device 41A moves the DUT 100 relative to the probe card 20 and presses the DUT 100 against the probe card 20. The first moving device 41A includes a heat sink 42 and a moving mechanism 43.

[0039] The heat absorber 42 is a component that holds the DUT100 and adjusts its temperature. As shown in FIG2, the DUT100, conveyed by the conveying device 36 (described later), is placed on the upper surface 421 of the heat absorber 42. The suction nozzle 422 opens into the upper surface 421 of the heat absorber 42. This suction nozzle 422 is connected to a vacuum pump (not shown) via a flow path 423 formed in the heat absorber 42, and can hold the DUT100. The heat absorber 42 corresponds to an example of the "holding part" in the present invention.

[0040] Furthermore, a flow path 424 is formed inside the heat absorber 42, through which a fluid for temperature adjustment can flow. Although not specifically illustrated, a temperature adjustment device capable of supplying fluid for temperature adjustment is connected to this flow path 424. For example, a plurality of fins are provided in this flow path 424, enabling efficient heat exchange with the fluid. Alternatively, the heat absorber 42 may include a heater or a Peltier element instead of the flow path 424. Or, the heat absorber 42 may include a heater or a Peltier element in addition to the flow path 424.

[0041] The moving mechanism 43 is a device for moving the heat suction seat 42. This moving mechanism 43 includes an X-direction rail 431, an X-direction platform 432, a Y-direction rail 433, a Y-direction platform 434, a Z-direction rail 435, a Z-direction actuator 436, and a lifting block 437.

[0042] An X-direction track 431 is disposed on the lower base 34 of the processor 30 and extends along the X direction. An X-direction stage 432 is slidably held on the X-direction track 431 and can be moved along the X direction by means of an actuator (not shown). A Y-direction track 433 is disposed on the X-direction stage 432 and extends along the Y direction. A Y-direction stage 434 is slidably held on the Y-direction track 433 and can be moved along the Y direction by means of an actuator (not shown).

[0043] A Z-direction track 435 is provided on this Y-direction platform 434 and extends along the Z-direction. A lifting block 437 is slidably held on this Z-direction track 435 and can be moved in the Z-direction by means of a Z-direction actuator 436. There is no particular limitation on the specific examples of such a Z-direction actuator 436, for example, an electric motor including a ball screw mechanism can be exemplified.

[0044] The heat absorption seat 42 is fixed to the lifting block 437 and can move together with the lifting block 437. As a result, the moving mechanism 43 can move the heat absorption seat 42 in the XYZ directions. Furthermore, the lifting block 437 has a rotation drive 438 that causes the heat absorption seat 42 to rotate about the Z-axis.

[0045] Additionally, the lifting block 437 may include a tilt adjustment section to adjust the tilt of the DUT100 held by the heat absorber 42. This tilt adjustment section eliminates the relative tilt of the DUT100 with respect to the probe card 20 and suppresses contact errors between the probe card 20 and the DUT100. In particular, the effect of suppressing the aforementioned contact errors is very significant in 2.5D and 3D component intermediates with a laminated structure.

[0046] Furthermore, the lifting block 437 may include a height adjustment section to adjust the height of the DUT100 held by the heat suction seat 42. With this height adjustment section, the displacement of the DUT100 in the height direction caused by the tilt adjustment section adjusting the tilt of the DUT100 can be eliminated, and the occurrence of the contact error mentioned above can be further suppressed.

[0047] The contact camera 44 is a camera that captures images of the probe card 20 from below. This contact camera 44 is positioned on the first moving device 41 with its optical axis oriented in the +Z direction as shown in the figure. As a specific example of this contact camera 44, a camera including an imaging element such as a CCD or CMOS can be used. When the contact camera 44 is moved below the probe card 20 by the first moving device 41A, it can capture images of the probe card 20. As shown in FIG3, this contact camera 44 is electrically connected to the control device 60 and can output the captured image information to the control device 60.

[0048] As shown in FIG. 1, the second alignment unit 40B, like the first alignment unit 40A, is a device that holds the DUT 100 and moves it relative to the probe card 20. The configuration of the second alignment unit 40B is the same as that of the first alignment unit 40A. That is, the second alignment unit 40B includes a second moving device 41B having the same configuration as the first moving device 41A, and a contact camera 44. In the following description, the first moving device 41A and the second moving device 41B will also be collectively referred to as "moving device 41". In addition, in this embodiment, the first moving device 41A and the second moving device 41B share the X-direction track 431. Furthermore, the first moving device 41A and the second moving device 41B can move independently by means of the control device 60.

[0049] In addition, in this embodiment, the processor 30 includes two alignment units 40 (40A, 40B), but the number of alignment units 40 is not particularly limited thereto, and the processor 30 may also include three or more alignment units 40.

[0050] Imaging units 50 (50A, 50B) are cameras that capture images of the DUT100 (100A, 100B) held on the moving device 41 (41A, 41B). Imaging units 50 are mounted on the upper base 31 of the processor 30 with their optical axis pointing downwards (in the -Z direction in the figure).

[0051] When the heat-absorbing base 42 of the first DUT100A is held and passes under the first imaging unit 50A via the first moving device 41A, the first imaging unit 50A can capture an image of the first DUT100A. Similarly, when the heat-absorbing base 42 of the second DUT100B is held and passes under the second imaging unit 50B via the second moving device 41B, the second imaging unit 50B can capture an image of the second DUT100B. As shown in FIG3, this imaging unit 50 is electrically connected to the control device 60 and can output the captured image information to the control device 60.

[0052] As shown in FIG3, the imaging unit 50 includes a first DUT camera 51 and a second DUT camera 52. As specific examples of the first DUT camera 51 and the second DUT camera 52, cameras including imaging elements such as CCD and CMOS can be illustrated. The first DUT camera 51 is a camera with a first imaging range, and the second DUT camera 52 is a camera with a second imaging range that is narrower than the first imaging range. That is, the viewing angle of the second DUT camera 52 is narrower than the viewing angle of the first DUT camera 51.

[0053] As shown in FIG3, the control device 60 is, for example, a computer. Although not specifically illustrated, this computer is an electronic computer including a CPU (processor), main storage device (RAM, etc.), auxiliary storage device (hard disk, SSD, etc.), and interface. Functionally, this control device 60 includes a shooting control unit 61, an image processing unit 62, a calculation unit 63, a drive control unit 64, and a judgment unit 65. These functions 61 to 65 are functionally implemented by the processor executing the program installed in the control device 60. Alternatively, this control device 60 may be constructed by replacing the computer with a circuit board.

[0054] The imaging control unit 61 controls the imaging unit 50 to capture images of the DUT 100 mounted on the heat-absorbing base 42. Specifically, when the DUT 100, moved by the moving device 41, passes through the imaging range of the imaging unit 50, the imaging control unit 61 controls the imaging unit 50 to perform an image capture operation on the DUT 100. In addition, in this embodiment, the first DUT camera 51 and the second DUT camera 52 of the imaging unit 50 are controlled to capture images of a plurality of alignment marks 102a to 102d set on the DUT 100 (refer to Figures 6A to 6D described later).

[0055] The image processing unit 62 detects the position of the probe needle 23 (refer to FIG. 2) of the probe head 22 by performing image processing on the image information output from the contact camera 44. The time point at which the probe card 20 is photographed by the contact camera 44 is, for example, when the probe card 20 is replaced along with the type of the DUT 100.

[0056] Furthermore, this image processing unit 62 detects the positions of a plurality of alignment marks 102a-102d (refer to Figures 6A-6E described later) on the DUT100 held in the heat-absorbing seat 42 by performing image processing on the image information output from the imaging unit 50. Alternatively, the position of the terminal 101 of the DUT100 may be detected based on the positions of the plurality of alignment marks 102a-102d (refer to Figures 6A-6E described later). In this case, the relative positional relationship between the alignment marks 102a-102d and the terminal 101 can be predetermined by design information of the DUT100, etc.

[0057] The relative positional relationship between the contact camera 44 and the imaging unit 50 is determined before the DUT 100 is tested. Specifically, for example, by positioning the contact camera 44 below the imaging unit 50 and having them photograph each other, the relative position of the contact camera 44 and the imaging unit 50 can be detected based on the image information from both. Based on the plurality of positional relationships as described above, the control device 60 can identify the relative positional relationship of the alignment marks 102a~102d relative to the probe 23.

[0058] The calculation unit 63 calculates the position of the DUT100 relative to the probe card 20 based on the detection results of the image processing unit 62, and also calculates a correction amount for the position of the DUT100 relative to the probe card 20. Specifically, the calculation unit 63 calculates the position of the probe 23 of the DUT100 relative to the probe card 20 from the obtained position of the probe 23 and the positions of the alignment marks 102a to 102d by the image processing unit 62. Then, it calculates the relative deviation of the position of the DUT100 relative to the position of the probe 23, and calculates a position correction amount to eliminate this deviation. That is, the calculation unit 63 calculates the position correction amount from the detection results of the image processing unit 62 so that the position of the probe 23 of the probe card 20 is aligned with the position of the terminal 101 of the DUT100.

[0059] The drive control unit 64 controls the drive of the moving device 41 of the alignment unit 40. Specifically, the drive control unit 64 controls the drive of the moving device 41 to cause the DUT 100 to move up and down in the height direction, or to move in the planar direction (XY direction in the figure). The drive control unit 64 can control the drive of the moving device 41 to move the alignment unit 40 to any one of the following positions: a placement position facing the opening 33 that the transport device 36 can enter, an alignment position facing the imaging unit 50, or a contact position facing the probe card 20.

[0060] Furthermore, this drive control unit 64 can control the drive of the moving device 41 so that the alignment unit 40 performs an alignment operation at the alignment position. Details of the alignment operation will be described later. For example, the drive control unit 64 controls the drive of the moving device 41 based on the position correction amount calculated by the calculation unit 63 described above.

[0061] Furthermore, regarding the drive control of the moving device 41, the drive control unit 64 controls the drive of the moving device 41 so that before the first alignment unit 40A presses the first DUT100A against the probe card 20 at the contact position, the second alignment unit 40B moves to the alignment position and begins the alignment operation. Then, the drive control unit 64 controls the moving device 41 so that when the first moving device 41A presses the first DUT100A against the probe card 20, the second moving device 41B does not stop moving the second DUT100B, but performs the alignment operation. Subsequently, the drive control unit 64 controls the moving device 41 so that after the first moving device 41A moves the first DUT100A away from the probe card 20 and retreats from the contact position, the second moving device 41B reaches the contact position after completing the alignment operation.

[0062] The determination unit 65 determines whether the moving device 41 presses the DUT 100 against the probe card 20 and transmits the determination result to the drive control unit 64. For example, based on a signal indicating the height in the Z direction (such as a feedback signal from the encoder included in the Z drive unit of the moving mechanism 43), the determination unit 65 determines that the moving device 41 presses the DUT 100 against the probe card 20 when the height of the DUT 100 is a predetermined height. Alternatively, the determination unit 65 may also detect the height of the DUT 100 based on image information from the contact camera 44 of the alignment unit 40, and determine that the alignment unit 40 presses the DUT 100 against the probe card 20 when the height of the DUT 100 is a predetermined height. Alternatively, the determination unit 65 may also determine that the alignment unit 40 presses the DUT 100 against the probe card 20 when it receives a signal from the tester 10 indicating that the DUT 100 and the probe card 20 are electrically connected.

[0063] As shown in Figures 4A to 4F, the semiconductor device testing apparatus 1 described above performs the processing operations as described below by the processor 30 in order to test the DUT 100. Figures 4A to 4F are cross-sectional views showing the processing operations of the processor 30 on the DUT 100 in this embodiment.

[0064] First, as shown in FIG4A, the second alignment unit 40B moves such that the heat absorber 42 is located below the opening 33 of the upper base 31 of the processor 30. That is, the control device 60 controls the second moving device 41B to move the second alignment unit 40B to the placement position. In this state, the transfer device 36 included in the processor 30 picks up the second DUT100B before testing from the tray (not shown) and transfers the second DUT100B to the heat absorber 42 of the moving device 41B through the opening 33. When the second DUT100B is placed on the heat absorber 42 by the transfer device 36, the heat absorber 42 adsorbs and holds the second DUT100B.

[0065] Furthermore, as a specific example of the conveying device 36, although not particularly limited, a pick-and-place device including an adsorption pad can be exemplified. Also, as a specific example of the aforementioned tray, although not particularly limited, a customer tray conforming to the Joint Electron Device Engineering Council (JEDEC) specifications can be exemplified. Furthermore, a plate can also be used instead of the aforementioned tray. As such a plate, a buffer plate capable of holding the DUT100 can be exemplified. Additionally, in the case where the DUT100 is a single bare die, instead of the aforementioned tray or plate, the DUT100 before testing can also be held in a ring frame (wafer ring).

[0066] When the second DUT100B is placed on the heat absorber 42 by the conveying device 36, the control device 60 drives the adsorption holding mechanism and the temperature adjustment mechanism of the heat absorber 42. As a result, the heat absorber 42 adsorbs and holds the second DUT100B and adjusts the temperature of the second DUT100B.

[0067] Next, as shown in FIG4B, the second moving device 41B moves so that the second DUT100B faces the second imaging unit 50B, and before the first moving device 41A presses the first DUT100A against the probe card 20, the second moving device 41B begins the alignment action of the second DUT100B.

[0068] Next, as shown in FIG4C, after the second moving device 41B begins the alignment operation of the second DUT100A, the first moving device 41A presses the first DUT100A against the probe card 20 and begins the electrical test of the first DUT100A. In this electrical test, the tester 10 inputs an electrical signal to the first DUT100A via terminal 101. Then, the tester 10 determines the quality and characteristics of the first DUT100A based on the electrical signal output from the first DUT100A via terminal 101 and probe 23.

[0069] Here, the alignment operation of this embodiment will be described in detail with reference to FIG5 and FIGS. 6A-6D. FIG5 is a flowchart showing the alignment operation of the second moving device 41B of this embodiment. FIGS. 6A-6D are top views showing the alignment operation of the second moving device 41B of this embodiment. In addition, in FIGS. 6A-6D, only the first DUT camera 51 and the second DUT camera 52 of the second DUT 100B and the second imaging unit 50B are shown.

[0070] As shown in FIG5, the alignment operation in this embodiment includes a coarse alignment operation S1 and a fine alignment operation S2. In the alignment operation, firstly, the second moving device 41B performs the coarse alignment operation S1. This coarse alignment operation S1 consists of a first passing operation S101, a first adjustment operation S102, and a transition operation S103.

[0071] FIG6A is a top view showing an example of the first passing action S101 of the coarse alignment action S1 of this embodiment, and FIG6B is a top view showing an example of the first adjustment action S102 and the transition action S103 of the coarse alignment action S1 of this embodiment. In addition, FIG6A and FIG6B show the virtual coordinate axis A1 of the probe 23 and the coordinate axis A2 of the second DUT 100B. In this embodiment, the deviation of the coordinate axis A2 relative to the coordinate axis A1 is regarded as the deviation of the terminal 101 relative to the probe 23, and the alignment action is performed to move the second DUT 100B in the XYθ direction.

[0072] Furthermore, coordinate axis A1 can be obtained by image processing of image information output from contact camera 44. Although not particularly limited, as an example, coordinate axis A1 can be formed by the central axis along the X direction and the central axis along the Y direction of the forming portion of probe 23 of probe card 20. On the other hand, coordinate A2 can be obtained by image processing of image information output from imaging unit 50. Although not particularly limited, as an example, coordinate axis A2 can be formed by two orthogonal central axes in the second DUT100B.

[0073] As shown in FIG6A, in the first passing action S101, the second DUT 100B is moved relative to the first DUT camera 51, and the second DUT 100B passes relative to the first shooting range of the first DUT camera 51. In this embodiment, the second moving device 41B is driven to move the second DUT 100B along the moving path M1. Although not particularly limited, the moving path M1 in this embodiment extends in a direction substantially parallel to the diagonal line connecting the second alignment mark 102b of the second DUT 100B to the first alignment mark 102a.

[0074] When the second moving device 41B performs the first passing action S101, the first DUT camera 51 of the imaging unit 50B scans the second DUT 100B (first shooting action). In this first shooting action, as the second DUT 100B moves along the moving path M1, firstly, the first alignment mark 102a is photographed, and then the second alignment mark 102b is photographed.

[0075] The first DUT camera 51 outputs the first image information acquired during the first shooting action to the control device 60. The image processing unit 62 of the control device 60 performs image processing on the first image information to detect the positions of the first alignment mark 102a and the second alignment mark 102b, and calculates the coordinate axis A2. In addition, as described above, this image processing unit 62 uses the contact camera 44 to detect the position of the probe 23 (refer to FIG. 2) of the probe head 22 in advance, and calculates the coordinate axis A1 in advance.

[0076] The calculation unit 63 of the control device 60 detects the relative position of the second DUT100B with respect to the probe card 20 based on the detection results of the image processing unit 62, and calculates the position correction amount of the second DUT100B with respect to the probe card 20. Specifically, the calculation unit 63 calculates the deviation of coordinate axis A2 from coordinate axis A1 (the relative position of the second DUT100B with respect to the probe card 20), and calculates the position correction amount to eliminate this deviation. That is, the calculation unit 63 calculates the first position correction amount required to make coordinate axes A1 and A2 consistent.

[0077] After performing the first passage action S101 described above, a first adjustment action S102 and a transition action S103 are performed simultaneously. In this embodiment, the first adjustment action S102 is an action that adjusts the relative position of the second DUT100B relative to the probe card 20 based on the detection result of the first image information. The transition action S103 is an action that transitions the movement of the second moving device 41B from the first passage action S102 to the second passage action S103.

[0078] Specifically, as shown in FIG6B, by means of the first adjustment action S102, the drive control unit 64 adjusts the relative position of the second DUT100B relative to the probe 23 by moving the second DUT100B relative to the probe 23 by a first position correction amount. At the same time, by means of the transition action S103, the drive control unit 64 moves the second DUT100B to the position where the second passing action S201 of the precision alignment action S2 in the subsequent step begins.

[0079] The first adjustment action S102 and the transition action S103 are executed continuously from the first passing action S101, and the movement of the second DUT100B is not stopped, transitioning from the first passing action S101 to the first adjustment action S102 and the transition action S103.

[0080] Furthermore, the movement path M2 of the second DUT100B in the first adjustment action S102 and the movement path M2 of the second DUT100B in the transition action S103 are curves, and the second moving device 41B changes the movement direction of the second DUT100B by moving the second DUT100B in a curved manner. That is, in the first adjustment action S102, the second moving device 41B moves the second DUT100B in a curved manner, and simultaneously performs the adjustment of the relative position of the second DUT100B and the transition to the second passing action S201. Although not particularly limited, in order to make the DUT100B move in a curved manner, the acceleration of the moving device 41 in the X direction or the acceleration in the Y direction can be gradually changed.

[0081] Here, as described above, since the first imaging range of the first DUT camera 51 is wider than the second imaging range of the second DUT camera 52, the detection accuracy of the relative position of the DUT 100 is lower than when using the second image information output from the second DUT camera 52. Therefore, as shown in FIG6B, the alignment accuracy of this first adjustment action S102 is not as high as the alignment accuracy of the precision alignment action S3 described later, so there is still a slight deviation between coordinate axis A2 and coordinate axis A1.

[0082] After the second DUT100B reaches the starting position of the precision alignment action S2 via the transition action S103, the second moving device 41B performs the precision alignment action S2. As shown in FIG5, the precision alignment action S2 consists of a second passing action S201, a second adjustment action S202, and a conveying action S203. FIG6C is a top view showing an example of the second passing action S201 of the precision alignment action S2 of this embodiment. FIG6D is a top view showing an example of the second adjustment action S202 and the conveying action S203 of the precision alignment action S2 of this embodiment.

[0083] As shown in FIG6C, in the second passing action S201, after performing the first adjustment action S102 and the first transition action S103, the second DUT100B is moved relative to the second DUT camera 52 of the imaging unit 50B, and the second DUT100B passes relative to the second shooting range of the imaging unit 50B.

[0084] This second passing action S301 is executed continuously from the first adjustment action S102 and the first transition action S103, and does not stop the movement of the second DUT100B, transitioning to the second passing action S201.

[0085] In this second transit action S201, the second moving device 41B is driven to move the second DUT100B along the moving path M4. Although not specifically defined, the moving path M4 extends in a direction that is substantially parallel to the diagonal line connecting the fourth alignment mark 102d of the second DUT100B to the third alignment mark 102c.

[0086] When the second moving device 41B performs the second passing action S301, the second DUT camera 52 of the imaging unit 50B scans the second DUT 100B (second shooting action). In this second shooting action, as the second DUT 100B moves along the moving path M4, the second DUT camera 52 shoots the third alignment mark 102c, and then shoots the fourth alignment mark 102d.

[0087] The second DUT camera 52 outputs the second image information acquired during the second shooting action to the control device 60. The image processing unit 62 of the control device 60 performs image processing on the second image information to detect the positions of the third alignment mark 102c and the fourth alignment mark 102d.

[0088] The image processing unit 62 of the control device 60 recalculates the coordinate axis A2. Then, the calculation unit 63 recalculates the deviation of the coordinate axis A2 relative to the coordinate axis A1, and calculates a second position correction amount to eliminate this deviation.

[0089] After performing the second passing action S201 as described above, the second adjustment action S202 and the second transition action S203 are performed simultaneously. The second passing action S201 is an action to adjust the relative position of the second DUT100B with respect to the probe card 20 based on the detection result from the second image information. On the other hand, the second transition action S203 is an action to move the second DUT100B from the alignment position to the contact position. As shown in FIG6D, in the second adjustment action S302, the drive control unit 64 adjusts the relative position of the second DUT100B with respect to the probe 23 by moving the second DUT100B relative to the probe 23 by a second position correction amount based on the calculation result of the calculation unit 63. At the same time, the second DUT100B is moved to the contact position facing the probe card 20 by the transport action S203.

[0090] As described above, since the second imaging range of the second DUT camera 52 is wider than the first imaging range of the first DUT camera 51, the second DUT camera 52 can more accurately grasp the positions of the third alignment mark 102c and the fourth alignment mark 102d, and can detect the relative position of the DUT 100 with better precision. Therefore, as shown in FIG6D, by means of this second adjustment action S202, the deviation of coordinate axis A2 relative to coordinate axis A1 remaining after the execution of coarse alignment S1 can be eliminated. By means of the above-mentioned second adjustment action S202, coordinate axes A1 and A2 are almost aligned.

[0091] The second adjustment action S202 and the conveying action S203 are executed continuously from the second passing action S201, and the movement of the second DUT100B is not stopped. The transition from the second passing action S201 to the second adjustment action S202 and the conveying action S203 is completed.

[0092] Furthermore, the movement path M5 of the second DUT100B in the second adjustment action S102 and the movement path M6 of the second DUT100B in the conveying action S203 are curves, and the second moving device 41B changes the movement direction of the second DUT100B by moving the second DUT100B in a curved manner. That is, in this embodiment, the second moving device 41B moves the second DUT100B to the contact position, and at the same time moves the second DUT100B in a curved manner and moves the second position correction amount.

[0093] Furthermore, although Figures 4A and 4B illustrate the case where the alignment unit 40A is in a standby position at the contact position when the conveying device 36 is performing a conveying operation on the second DUT100B or when the alignment operation begins, this is not a limitation. For example, the timing of performing the conveying operation on the alignment unit 40A and the alignment operation on the first DUT100A can be any timing point as long as it is before the alignment operation of the alignment unit 40B is completed.

[0094] As shown in FIG4D, during the alignment operation of the second moving device 41B, the tester 10 completes the electrical test of the first DUT 100A, and the alignment unit 40A moves the first DUT 100A away from the probe card 20 and retracts from the contact position. Then, in the state after the above-mentioned alignment operation is completed (in the state after the second adjustment operation S302 is completed), the alignment unit 40B replaces the alignment unit 40A and reaches the contact position.

[0095] Next, the tested first DUT100A is transported by the transport device 36, and the untested first DUT100A is placed on the alignment unit 40A by the transport device 36. Then, as shown in FIG4E, before the second moving device 41B of the alignment unit 40B presses the second DUT100B against the probe card 20, the first moving device 41A moves the first DUT100A to the alignment position facing the imaging unit 50A, and the alignment operation of the first DUT100A relative to the probe card 20 begins. In addition, the alignment operation performed here can be the same as the alignment operation shown in FIG5, FIG6A to FIG6E above.

[0096] Next, as shown in FIG4F, the second moving device 41B of the alignment unit 40B presses the second DUT 100B against the probe card 20. Although not specifically illustrated, similarly to the above, the tester 10 completes the electrical test of the second DUT 100B during the alignment operation of the first moving device 41A, and the alignment unit 40B moves the second DUT 100B away from the probe card 20 and retracts from the contact position. Then, with the alignment operation completed, the alignment unit 40A replaces the alignment unit 40B and reaches the contact position. By repeating the above processing operation, electrical tests are performed on a plurality of DUTs 100.

[0097] According to the semiconductor device testing apparatus 1 of this embodiment as described above, the control device 60 controls the first moving device 41A and the second moving device 41B such that when the first moving device 41A presses the first DUT100A against the probe card 20, the second moving device 41B does not stop the movement of the second DUT100B, but performs an alignment operation to position the second DUT100B relative to the probe card 20. Therefore, when the first moving device 41A presses the first DUT100A against the probe card 20, since the starting and stopping of the movement of the second moving device 41B, which are prone to large vibrations, are not performed, the stability of the electrical testing of the first DUT100A can be improved.

[0098] Furthermore, according to the semiconductor device testing apparatus 1 of this embodiment, the control device 60 controls the first moving device 41A and the second moving device 41B, such that the second moving device 41B begins an alignment operation before the first moving device 41A presses the first DUT100A against the probe card 20. Therefore, since the second moving device 41B does not perform the movement start operation when the first moving device 41A presses the first DUT100A against the probe card 20, the stability of the electrical testing of the first DUT100A can be further improved.

[0099] Similarly, the control device 60 controls the first moving device 41A and the second moving device 41B, such that the first moving device 41A begins the alignment operation before the second moving device 41B presses the second DUT100B against the probe card 20. Therefore, as described above, the stability of the electrical test of the second DUT100B can be further improved.

[0100] Furthermore, according to the semiconductor device testing apparatus 1 of this embodiment, the control device 60 controls the moving device 41 during the alignment operation, so that the moving device 41 changes the moving direction of the DUT100 by moving the DUT100 in a curved manner. That is, during the alignment operation, since neither the X-direction stage 432 on the X-direction track 431 nor the Y-direction stage 434 on the Y-direction track 433 is stopped, the occurrence of vibration can be suppressed and the stability of the electrical test of the DUT100 can be improved.

[0101] Furthermore, the embodiments described above are for the purpose of facilitating understanding of the present invention and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design changes and equivalents that fall within the scope of the present invention.

[0102] For example, in the above embodiment, although only one DUT100 is tested at a time by means of semiconductor device test apparatus 1, the number of DUT100 tested at the same time by means of semiconductor device test apparatus 1 is not particularly limited to the above, and semiconductor device test apparatus 1 can test multiple DUT100 at the same time. [Simplified Explanation of the Diagram]

[0024] FIG1 is a diagram showing the overall configuration of the semiconductor device testing apparatus and the internal structure of the processor according to an embodiment of the present invention. FIG2 is an enlarged view showing part II of FIG1. ​​FIG3 is a block diagram showing the control system of the semiconductor device processing apparatus according to an embodiment of the present invention. FIG4A is a cross-sectional view (first) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG4B is a cross-sectional view (second) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG4C is a cross-sectional view (third) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG4D is a cross-sectional view (fourth) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG4E is a cross-sectional view (fifth) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG4F is a cross-sectional view (sixth) showing the processing operation of the processor on the semiconductor device according to an embodiment of the present invention. FIG5 is a flowchart showing the alignment operation of the second moving device according to an embodiment of the present invention. FIG6A is a top view showing an example of the first pass operation of the coarse alignment operation according to an embodiment of the present invention. Figure 6B is a top view showing an example of the first adjustment action and the first transition action of the coarse alignment operation according to an embodiment of the present invention. Figure 6C is a top view showing an example of the second through action of the precision alignment operation according to an embodiment of the present invention. Figure 6D is a top view showing an example of the second adjustment action and the second transition action of the precision alignment operation according to an embodiment of the present invention.

Claims

1. A semiconductor device processing apparatus for moving a device under test (DUT) to press the DUT against a contact portion, comprising: A plurality of moving devices, including a first moving device and a second moving device that respectively move the aforementioned DUT; and a control device for controlling the aforementioned plurality of moving devices, wherein the aforementioned DUT includes: a first DUT, which is moved by the aforementioned first moving device; The second DUT is moved by the aforementioned second moving device, wherein the aforementioned control device controls the aforementioned first moving device and the aforementioned second moving device such that when the aforementioned first moving device presses the aforementioned first DUT onto the aforementioned contact portion, the aforementioned second moving device does not stop the movement of the aforementioned second DUT but performs an alignment operation to position the aforementioned second DUT relative to the aforementioned contact portion.

2. The semiconductor device processing apparatus as claimed in claim 1, wherein the aforementioned control device controls the aforementioned first moving device and the aforementioned second moving device such that the aforementioned second moving device begins the aforementioned alignment operation before the aforementioned first moving device presses the aforementioned first DUT against the aforementioned contact portion.

3. The semiconductor device processing apparatus as claimed in claim 1, wherein the aforementioned control device controls the aforementioned first moving device and the aforementioned second moving device such that after the aforementioned first moving device moves the aforementioned first DUT away from the aforementioned contact portion and retracts from the contact position, the aforementioned second moving device reaches the aforementioned contact position in a state after completing the aforementioned alignment operation.

4. The semiconductor device processing apparatus of claim 1, wherein the aforementioned control device controls the aforementioned second moving device such that during the aforementioned alignment operation, the aforementioned second moving device changes the direction of movement of the aforementioned second DUT by causing the aforementioned second DUT to move zigzag.

5. The semiconductor device processing apparatus as claimed in claim 1, further comprising a plurality of DUT cameras, each capturing an image of the DUT held by the plurality of moving devices, wherein the control device detects the relative position of the DUT relative to the contact portion based on image information captured by the DUT cameras, wherein the alignment operation includes: The action involves moving the DUT relative to the aforementioned DUT camera, causing the DUT to pass relative to the shooting range of the aforementioned DUT camera; and adjusting the action by adjusting the relative position of the aforementioned DUT relative to the aforementioned contact portion based on the detection result of the aforementioned control device, wherein the aforementioned control device controls the aforementioned DUT camera so that when the aforementioned moving device performs the aforementioned passing action, it performs the shooting action of shooting the aforementioned DUT.

6. The semiconductor device processing apparatus of claim 5, wherein each of the plurality of the aforementioned moving devices includes a contact camera for capturing images of the aforementioned contact portion, wherein the aforementioned control device detects the relative position of the aforementioned DUT relative to the aforementioned contact portion based on image information captured by the aforementioned DUT camera and the aforementioned contact camera.

7. The semiconductor device processing apparatus as claimed in claim 5, wherein each of the aforementioned plurality of moving devices comprises: The device includes a holding part for holding the aforementioned DUT; and a moving mechanism for moving the aforementioned holding part, wherein the aforementioned shooting action includes, while the aforementioned moving device moves the aforementioned holding part holding the aforementioned DUT, the aforementioned DUT camera shoots the aforementioned DUT held by the aforementioned holding part.

8. A semiconductor device processing apparatus for moving a DUT to press the DUT against a contact portion, comprising: A plurality of moving devices, including a first moving device and a second moving device that respectively move the aforementioned DUT; The device includes a control unit that controls the plurality of moving devices, wherein the DUT includes: a first DUT moved by the first moving device; and a second DUT moved by the second moving device. The control unit controls the first and second moving devices such that when the first moving device presses the first DUT against the contact portion, the second moving device performs an alignment operation without stopping the movement of the second DUT, thereby positioning the second DUT relative to the contact portion. The semiconductor device processing apparatus further includes a plurality of DUT cameras that capture images of the DUT held by the plurality of moving devices. The control unit detects the relative position of the DUT relative to the contact portion based on the image information captured by the DUT cameras. The alignment operation includes: moving the DUT relative to the DUT cameras to pass through the field of view of the cameras; and adjusting the relative position of the DUT relative to the contact portion based on the detection result of the control unit. The aforementioned control device controls the aforementioned DUT camera to perform a shooting action of the aforementioned DUT when the aforementioned mobile device performs the aforementioned passing action. The aforementioned DUT camera includes: a first DUT camera having a first shooting range; and a second DUT camera having a second shooting range that is narrower than the aforementioned first shooting range. The aforementioned alignment action includes: a coarse alignment action performed using the aforementioned first DUT camera; and a fine alignment action performed using the aforementioned second DUT camera.

9. The semiconductor device processing apparatus as claimed in claim 8, wherein the aforementioned coarse alignment operation comprises: The first action causes the aforementioned DUT to move relative to the aforementioned first DUT camera, and causes the aforementioned DUT to pass relative to the aforementioned first shooting range; The first adjustment action, based on the detection result of the first image information captured by the first DUT camera, adjusts the relative position of the DUT relative to the contact portion. The precision alignment action includes: a second passing action, after the execution of the coarse alignment action, causing the DUT to move relative to the second DUT camera, so that the DUT passes relative to the second shooting range; and a second adjustment action, based on the detection result of the second image information captured by the second DUT camera, adjusts the relative position of the DUT relative to the contact portion. The shooting action includes: a first shooting action, when the second moving device performs the first passing action, the first DUT camera shoots the DUT; and a second shooting action, when the second moving device performs the second passing action, the second DUT camera shoots the DUT.

10. The semiconductor device processing apparatus of claim 9, wherein during the aforementioned first adjustment operation, the aforementioned control device adjusts the relative position of the aforementioned second DUT with respect to the aforementioned contact portion while the aforementioned second moving device moves the aforementioned second DUT zigzag.

11. The semiconductor device processing apparatus of claim 9, wherein the aforementioned alignment action includes a transition action from the aforementioned first through action to the aforementioned second through action, wherein the aforementioned control device controls the aforementioned second moving device such that the aforementioned second moving device flexibly moves the aforementioned second DUT during the aforementioned transition action.

12. The semiconductor device processing apparatus of claim 9, wherein during the second adjustment operation, the control device adjusts the relative position of the second DUT with respect to the contact portion while the second moving device moves the second DUT zigzag.

13. The semiconductor device processing apparatus of claim 5, wherein the aforementioned DUT includes a plurality of alignment marks, wherein the aforementioned photographing action includes sequentially photographing each of the plurality of alignment marks when the aforementioned moving device performs the aforementioned passing action, wherein the aforementioned adjustment action adjusts the relative position of the aforementioned DUT with respect to the aforementioned contact portion based on the positions of the photographed plurality of alignment marks.

14. The semiconductor device processing apparatus of claim 1, wherein the aforementioned DUT is: a bare die monomer; a 2.5D device intermediate having a plurality of bare dies arranged side by side on a silicon interposer; or a 3D device intermediate having a plurality of bare dies overlapping each other.

15. The semiconductor device processing apparatus of claim 1, wherein the aforementioned moving device presses the aforementioned DUT against the aforementioned contact portion by lifting the aforementioned DUT upward in a vertical direction.

16. A semiconductor device testing apparatus, specifically for testing a DUT (Distributed Under Test), comprising: Semiconductor device processing apparatus as described in any one of claims 1 to 15; And the tester, which is electrically connected to the aforementioned contact portion.

Images