Resistor and method for manufacturing the same

Abstract

A resistor includes a resistive layer, first and second insulating protective layers, first and second thermally conductive layers, and first and second terminal electrode structures. The resistive layer has opposing first and second surfaces and first and second end faces. The first and second surfaces include a central portion and first and second end faces. The first and second insulating protective layers are respectively disposed on the central portions of the first and second surfaces. The first and second thermally conductive layers are spaced apart and extend from the first and second end faces of the first surface to the first insulating protective layer, respectively. The first insulating protective layer is longer than the second insulating protective layer. The first and second terminal electrode structures are opposing and spaced apart. The first terminal electrode structure extends from the first thermally conductive layer through the first end face to the second insulating protective layer. The second terminal electrode structure extends from the second thermally conductive layer through the second end face to the second insulating protective layer.

Claims

1. A resistor comprising: a resistive layer having a first surface and a second surface opposite to each other, and a first end face and a second end face opposite to each other, wherein each of the first surface and the second surface includes a central portion and a first end face and a second end face located on opposite sides of the central portion; a first insulating protective layer disposed on the central portion of the first surface; a first thermally conductive layer and a second thermally conductive layer extending from the first end face and the second end face of the first surface to the first insulating protective layer, respectively, and spaced apart from each other; and a second insulating protective layer disposed on the central portion of the second surface, wherein a length of the first insulating protective layer is greater than a length of the second insulating protective layer, and both the length of the first insulating protective layer and the length of the second insulating protective layer are dimensions along the length of the resistive layer. A first end electrode structure, covering the first thermally conductive layer, the first end face, the first end of the second surface, and a portion of the second insulating protective layer, wherein the cross-sectional shape of the first end electrode structure is C-shaped; and a second end electrode structure, opposite to and spaced from the first end electrode structure, covering the second thermally conductive layer, the second end face, the second end of the second surface, and another portion of the second insulating protective layer, wherein the cross-sectional shape of the second end electrode structure is inverted C-shaped.

2. The resistor as claimed in claim 1, wherein the difference between the length of the first insulating protective layer and the length of the second insulating protective layer is equal to or greater than 100 μm.

3. The resistor as claimed in claim 1, wherein the length of the second insulating protective layer is 1 / 5 to 3 / 5 of the length of the resistive layer.

4. The resistor as claimed in claim 1, wherein each of the first thermally conductive layer and the second thermally conductive layer comprises: a first portion; and a second portion, joined to the first portion to form a T-shaped structure, wherein the width of one portion of the second portion is smaller than the width of one portion of the first portion, wherein the second portion of the first thermally conductive layer and the second portion of the second thermally conductive layer are opposite to each other.

5. The resistor as claimed in claim 4, wherein a distance between the first thermally conductive layer and the second thermally conductive layer is 1 / 5 to 1 / 3 of the length of the resistive layer, the width of the first portion is 4 / 5 to 1 / 3 of the width of the resistive layer, and the difference between the width of the first portion and the width of the second portion is from 100 μm to 200 μm.

6. The resistor as claimed in claim 1, wherein the first terminal electrode structure includes a first inner electrode and a first outer electrode covering the first inner electrode, the second terminal electrode structure includes a second inner electrode and a second outer electrode covering the second inner electrode, the first inner electrode and the second inner electrode are respectively embedded in the first end and the second end of the second surface, the first outer electrode extends from the first thermally conductive layer through the first end face to the first inner electrode, and the second outer electrode extends from the second thermally conductive layer through the second end face to the second inner electrode.

7. The resistor as claimed in claim 6, wherein each of the first external electrode and the second external electrode comprises a copper layer, a nickel layer, and a tin layer stacked sequentially from the inside out, and a distance greater than 5 μm between a bottom surface of the copper layer and a bottom surface of the second insulating protective layer.

8. A method of manufacturing a resistor, comprising: carrying a resistive layer on a carrier, wherein the resistive layer has a first surface and a second surface opposite to each other, and a first end face and a second end face opposite to each other, and the first surface is attached to the carrier, wherein each of the first surface and the second surface includes a central portion, and a first end face and a second end face located on opposite sides of the central portion; removing a portion of the resistive layer to form a first groove and a second groove in the first end face and the second end face of the second surface, respectively; forming a first inner electrode and a second inner electrode in the first groove and the second groove, respectively; removing the carrier; forming a first insulating protective layer and a second insulating protective layer on the central portion of the first surface and the central portion of the second surface, respectively, wherein the length of one of the first insulating protective layers is greater than the length of one of the second insulating protective layers, and the lengths of the first insulating protective layer and the second insulating protective layer are both dimensions along the length of one of the resistive layers; A first thermally conductive layer and a second thermally conductive layer are formed, wherein the first thermally conductive layer and the second thermally conductive layer extend from the first end and the second end of the first surface to the first insulating protective layer, respectively, and are spaced apart from each other; and a first external electrode and a second external electrode are formed, wherein the first external electrode extends from the first thermally conductive layer through the first end face to the first internal electrode, and the second external electrode extends from the second thermally conductive layer through the second end face to the second internal electrode, wherein the first internal electrode and the first external electrode form a first end electrode structure, and the second internal electrode and the second external electrode form a second end electrode structure, wherein the cross-sectional shape of the first end electrode structure is C-shaped, and the cross-sectional shape of the second end electrode structure is inverted C-shaped.

9. A method of manufacturing a resistor as claimed in claim 8, wherein the depth of each of the first groove and the second groove is 20 μm to 50 μm.

10. The method of manufacturing a resistor as claimed in claim 8, wherein before forming the first insulating protective layer and the second insulating protective layer, the method of manufacturing a resistor further includes performing a repair operation on the central portion of the second surface of the resistive layer to remove a portion of the resistive layer.

11. A method of manufacturing a resistor as claimed in claim 8, wherein the difference between the length of the first insulating protective layer and the length of the second insulating protective layer is equal to or greater than 100 μm.

12. A method of manufacturing a resistor as claimed in claim 8, wherein forming the first thermally conductive layer and the second thermally conductive layer comprises using a printing method or a sputtering method.

13. A method of manufacturing a resistor as claimed in claim 8, wherein each of the first thermally conductive layer and the second thermally conductive layer comprises: a first portion; and a second portion, joined to the first portion to form a T-shaped structure, wherein the width of one portion of the second portion is smaller than the width of one portion of the first portion, wherein the second portion of the first thermally conductive layer and the second portion of the second thermally conductive layer are opposite to each other.

14. A method of manufacturing a resistor as claimed in claim 13, wherein a distance between the first thermally conductive layer and the second thermally conductive layer is 1 / 5 to 1 / 3 of the length of the resistive layer, the width of the first portion is 4 / 5 to 1 / 3 of the width of the resistive layer, and the difference between the width of the first portion and the width of the second portion is from 100 μm to 200 μm.

15. A method of manufacturing a resistor as claimed in claim 8, wherein each of the first external electrode and the second external electrode comprises a copper layer, a nickel layer, and a tin layer stacked sequentially from the inside out, and a distance between a bottom surface of the copper layer and a bottom surface of the second insulating protective layer is greater than 5 μm.

Images