Display device

Abstract

The display device includes a substrate, a liquid crystal layer, a heating unit, and a planarization layer. The substrate includes a peripheral region and a display region, with the peripheral region surrounding the display region. The liquid crystal layer is disposed on the substrate, the heating unit is disposed on the peripheral region of the substrate, and the planarization layer is disposed on the substrate. The planarization layer partially overlaps the heating unit in the peripheral region. The ratio of the projected area of ​​the heating unit on the peripheral region of the substrate to the projected area of ​​the planarization layer on the peripheral region of the substrate is greater than or equal to 1.

Description

[Technical Field]

[0001] This invention relates to a display device. [Previous Technology]

[0002] The display quality of a display device is easily affected by ambient temperature; when the ambient temperature is too low, the display quality will be reduced. Currently, the main technology is to use external heaters to maintain a suitable temperature for the display device. However, external heaters have problems such as increasing the thickness of the display device and poor heating efficiency. Furthermore, regarding the uniformity of heating temperature in the display device, the heating efficiency at the edges is poor. For example, the temperature difference between the central display area and the non-display area at the edge often exceeds 6°C, resulting in uneven heating temperatures between the center and the edges of the display device. Therefore, maintaining a suitable temperature for the display device has become increasingly important. [Summary of the Invention]

[0003] The present invention provides a display device with good heating efficiency.

[0004] The display device of the present invention includes a substrate, a liquid crystal layer, a heating unit and a planarization layer. The substrate includes a peripheral region and a display region. The peripheral region surrounds the display region. The liquid crystal layer is disposed on the substrate. The heating unit is disposed on the peripheral region of the substrate. The planarization layer is disposed on the substrate. The planarization layer partially overlaps the heating unit in the peripheral region. The ratio of the projected area of ​​the heating unit on the peripheral region of the substrate to the projected area of ​​the planarization layer on the peripheral region of the substrate is greater than or equal to 1.

[0005] Based on the above, the heating unit is disposed on the peripheral area of ​​the substrate, and the planarization layer partially overlaps the heating unit in the peripheral area. The ratio of the projected area of ​​the heating unit on the peripheral area of ​​the substrate to the projected area of ​​the planarization layer on the peripheral area of ​​the substrate is greater than or equal to 1. In this way, the display device can achieve optimal heating efficiency and temperature uniformity, and improve display quality.

Implementation Method

[0007] FIG1A is a top view schematic diagram of a display device according to an embodiment of the present disclosure.

[0008] Display device 100A includes a substrate 110, a liquid crystal layer LC, and a heating unit 150. The liquid crystal layer LC is disposed on the substrate 110, and the heating unit 150 is disposed on the substrate 110. It includes a first heater 150a and a second heater 150b. The second heater 150b includes a first portion 150b1 and a second portion 150b2. The second heater 150b is disposed around the first heater 150a and coupled to the first heater 150a, and the resistance value of the second heater 150b is less than the resistance value of the first heater 150a.

[0009] The display device 100A may further include a control element CU and a drive circuit board PB. The control element CU is disposed on the drive circuit board PB and electrically connected to the third heater 150c, the resistance of the third heater 150c being less than the resistance of the second heater 150b. The drive circuit board PB further includes a temperature sensing control circuit, which is connected between the control element CU and the drive circuit board PB and is electrically connected to the sensing trace ST through the drive circuit board PB. Specifically, the current signal generated by the temperature sensor TS in response to the temperature of its area can be transmitted to the temperature sensing control circuit through the sensing trace ST and the drive circuit board PB.

[0010] Temperature sensors TS generate different current signals due to the temperature differences in their respective areas. These current signals can be transmitted to the temperature control circuit on the driver board PB through the sensing trace ST corresponding to the temperature sensor TS. The temperature control circuit sequentially obtains the current signals generated by different temperature sensors TS, further converts them into digital signals, and provides them to the calculation system for analysis.

[0011] In this embodiment, the driving circuit board PB includes a driving chip, such as a system on chip (SOC). The driving chip can be used to analyze the digital signal provided by the temperature control circuit and dynamically adjust the driving signal of the area where each temperature sensor TS is located according to the analysis results, so as to optimize the heating efficiency and temperature uniformity and help improve the display quality.

[0012] Referring to FIG1A, the first heater 150a includes a first end 150a1 and a second end 150a2, and the second heater 150b includes a first portion 150b1 and a second portion 150b2. The first heater 150a extends along a second direction D2. The first end 150a1 of the first heater 150a is coupled to the first portion 150b1 of the second heater, and the second end 150a2 of the first heater 150a is coupled to the second portion 150b2 of the second heater. In some embodiments, the width of the second heater 150b along the second direction D2 is greater than or equal to the width of the first heater 150a along the first direction D1, and the thickness of the second heater 150b along the third direction D3 is greater than or equal to the thickness of the first heater 150a along the third direction D3. The heater in the heating unit 150 may, for example, be composed of a combination of metals such as a single layer / multilayer / metal compound, and the metal may be, for example, aluminum, molybdenum, copper, silver, alloys, or other suitable metal materials with good electrical conductivity.

[0013] In this embodiment, the first heater 150a may include a plurality of first heaters 150a. At least a portion of the plurality of first heaters 150a overlaps with the liquid crystal layer LC in the normal direction of the substrate 110, and at least another portion of the plurality of first heaters 150a does not overlap with the liquid crystal layer LC in the normal direction of the substrate 110. The number of the plurality of first heaters 150a overlapping with the liquid crystal layer LC is greater than the number of the plurality of first heaters 150a not overlapping with the liquid crystal layer LC. Thus, through the above design, the first heater 150a can enable the display device to achieve optimal heating efficiency and temperature uniformity, which helps to improve display quality.

[0014] Figure 1B is a partially enlarged schematic diagram of region AA' in Figure 1A.

[0015] The display device 100A may include multiple lines. Lines extending along a first direction D1 may include gate lines GL, while lines extending along a second direction D2 may include signal lines SL and a first heater 150a arranged parallel to the signal lines SL. A light-shielding metal SM is arranged along the extension direction of the gate lines GL and overlaps the signal lines SL. The first direction D1 and the second direction D2 are different; in some embodiments, the first direction D1 and the second direction D2 may be perpendicular to each other, but this is not a limitation. Electrode E1 is a common electrode, and multiple electrodes E2 arranged sequentially adjacent to each other are pixel electrodes. The materials of electrodes E1 and E2 may include transparent conductive materials or opaque conductive materials. Transparent conductive materials may include, for example, indium tin oxide, indium zinc oxide, or other suitable transparent conductive materials, but this is not a limitation. Opaque conductive materials may include, for example, aluminum, molybdenum, copper, silver, alloys, or other suitable opaque conductive materials, but this is not a limitation.

[0016] Figure 1C is a cross-sectional view of Figure 1B along I-I'.

[0017] A buffer layer 120 is covered on the substrate 110. The material of the buffer layer 120 includes silicon semiconductors, such as crystalline silicon, polycrystalline silicon, microcrystalline silicon, amorphous silicon, etc. An insulating layer 130, a planarization layer 140, an insulating layer 160, an insulating layer 170, and an insulating layer 180 are sequentially disposed on the buffer layer 120. The material of the insulating layer may include organic insulating materials, inorganic insulating materials, or a stack of multiple insulating materials. Inorganic insulating materials include silicon oxide, nitride-based materials, silicon oxynitride, other oxide insulating materials, other nitride insulating materials, or other oxynitride insulating materials. Organic insulating materials include planarization layer materials, resin materials, or other similar materials. In some embodiments, the insulating layer may be a transparent film layer, thus allowing light, such as visible light, to pass through. The planarization layer 140 can provide a planarized surface for the micro-signal line SL and data line DL to be disposed thereon, but is not limited thereto. Electrode E1 is formed on insulating layer 170 and located between first heater 150a and liquid crystal layer LC. First heater 150a is driven by voltage to generate current heating effect to heat liquid crystal layer LC. Since first heater 150a is close to liquid crystal layer LC, the heating efficiency is high. In addition, since first heater 150a is located on insulating layer 160 and covered by insulating layer 170, this arrangement does not require additional thickness increase of display device 100A. In some embodiments, heating unit 150 can be disposed on a surface of substrate 110 close to liquid crystal layer LC (not shown) to raise the temperature of liquid crystal layer LC to the operating temperature range; in some embodiments, heating unit 150 can be disposed on a surface of substrate 110 away from liquid crystal layer LC (not shown) to raise the temperature of liquid crystal layer LC to the operating temperature range. The present invention is not limited thereto.

[0018] In detail, the liquid crystal molecules in the liquid crystal layer LC can exhibit better characteristics, such as optical properties and electromagnetic wave modulation characteristics, within a certain temperature range to realize the function of the display device 100A. This temperature range can be regarded as the operating temperature range of the liquid crystal layer LC. In some embodiments, the operating temperature range of the liquid crystal layer LC may be, for example, between 10 degrees Celsius and 70 degrees Celsius, such as room temperature. If the ambient temperature of the display device 100A is lower than the operating temperature range of the liquid crystal layer LC, the display device 100A may experience a decrease in operating quality because the liquid crystal layer LC cannot exhibit the expected characteristics. In some embodiments, the display device 100A installed outdoors or in a vehicle may not function properly when the ambient temperature is lower than the operating temperature range of the liquid crystal layer LC. By providing a heating unit 150 inside the display device 100A, the temperature of the liquid crystal layer LC can be heated to the operating temperature range, allowing the display device 100A to operate in low-temperature environments (below the operating temperature range of the liquid crystal layer LC) and be less affected by ambient temperature.

[0019] The display device 100A may further include a plurality of electrodes E2 arranged along the first direction D1, a color filter layer, a transparent adhesive layer OC, and a glass substrate 190 disposed corresponding to the electrodes E2. The transparent adhesive layer OC is disposed between the color filter layer and the liquid crystal layer LC. The color filter layer provides color filtering so that the display device 100A can display multi-color images, such as displaying a blue color filter layer B, a red color filter layer R, or a green color filter layer G. The arrangement or combination of the color filter layers can be determined according to actual needs. In this embodiment, the blue color filter layer B, the red color filter layer R, and the green color filter layer G are disposed adjacent to each other along the first direction D1. The display device 100A also includes a black matrix BM located between adjacent color filter layers B, R, and G. The black matrix BM may be disposed on the glass substrate 190. Furthermore, the black matrix BM disposed between adjacent color filter layers B, R, and G can prevent the colors of adjacent color filter layers B, R, and G from mixing with each other, which helps to improve the display contrast and display color of the display device 100A.

[0020] In this embodiment, the first heater 150a in the display device 100A has a width W1 along the first direction D1, and there is a width W2 between two adjacent black matrices BM along the first direction D1. The width W2 can be understood as the width of a display pixel, for example, the width along the first direction D1 covered by a color filter layer R displaying red and a black matrix BM. The width W2 is greater than the width W1 of the first heater 150a. In some embodiments, when the display device is at a pixel density of 150 to 220 pixels per inch (PPI), the range of the width W2 is, for example, greater than or equal to 38.4 micrometers and less than or equal to 56.6 micrometers, but is not limited thereto. In some embodiments, the ratio of the width W1 to the width W2 is, for example, less than or equal to 0.2604 and greater than or equal to 0.053, but is not limited thereto.

[0021] Figure 1D is a configuration diagram of a heating unit according to an embodiment of the present disclosure. Please refer to Figures 1C and 1D simultaneously. The first heater 150a in the heating unit 150 has a width W1 along the first direction D1, where the value of W1 is, for example, 3 to 10 micrometers. In this embodiment, taking the value of W1 as an example of 3 micrometers, the first heater 150a has a length L along the second direction D2, where the length L is, for example, 153.75 micrometers (μm). Therefore, the area of ​​one first heater 150a is, for example, 3 * 153.75 μm². The display pixel has a width W2 along the first direction D1, where, in this embodiment, the value of W2 is, for example, 51.25 μm. The display pixel has a length L along the second direction D2, where the length L is, for example, 153.75 micrometers (μm). The area A of one display pixel is, for example, 51.25 * 153.75 μm². 2. When the display device 100A includes four first heaters 150a and three display pixels, the area ratio of the first heaters 150a to the display pixels in the XY plane is, for example, 7.8% (see FIG1E). When the display device 100A includes two first heaters 150a and three display pixels, the area ratio of the first heaters 150a to the display pixels in the XY plane is, for example, 3.9% (see FIG1F). When the display device 100A includes one first heater 150a and three display pixels, the area ratio of the first heaters 150a to the display pixels in the XY plane (i.e., the plane of the substrate 110) is, for example, 1.95%. In some embodiments, the area ratio of the first heaters 150a to the display pixels in the XY plane is, for example, greater than or equal to 1.5% or less than or equal to 10.5%, with a preferred value being, for example, 8%.

[0022] Figure 1G is a configuration diagram of a heating unit according to an embodiment of the present disclosure. The difference between Figure 1G and Figure 1D is that the first heater 150a in the heating unit 150 extends along the first direction D1. The first heater 150a in the heating unit 150 has a width W1 along the second direction D2. In this embodiment, taking W1 as an example, the value of W1 is 3 micrometers. The length of the first heater 150a along the second direction D2 is, for example, 153.75 micrometers (μm). Therefore, the area of ​​one first heater 150a is, for example, 3 * 153.75 μm². The display pixel has a width W2 along the first direction D1, and the value of W2 is, for example, 51.25 μm. The display pixel has a length L along the second direction D2, and the length L is, for example, 153.75 micrometers (μm). The area A of one display pixel is, for example, 51.25 * 153.75 μm². 2. When the display device includes two first heaters 150a and three display pixels, the area ratio of the first heater 150a to the display pixels in the XY plane is, for example, 3.9%. Referring to Figure 1H, when the display device includes one first heater 150a and three display pixels, the area ratio of the first heater 150a to the display pixels in the XY plane is, for example, 1.95%. In some embodiments, the area ratio of the first heater 150a to the display pixels in the XY plane is, for example, greater than or equal to 1.5% or less than or equal to 10.5%, with a preferred value, for example, 4%.

[0023] Figure 1I is a schematic diagram of a heating unit according to an embodiment of the present disclosure.

[0024] Please refer to Figures 1A and 1D simultaneously. The control element CU includes a first control unit C1 and a second control unit C2. The first control unit C1 and the second control unit C2 are respectively connected to the third heater 150c disposed relative to the control unit CU. The control unit CU provides current to the heating unit 150. Since the resistance value of the third heater 150c is less than the resistance value of the second heater 150b and the resistance value of the second heater 150b is less than the resistance value of the first heater 150a.

[0025] Specifically, the heater has a resistance value (R), so when current (I) flows through the heater, heat energy (P) will be generated. According to the definition of power and Ohm's law, the heat energy (P) generated by the heater can conform to the following formula: P=V 2 / R=I 2R, where the unit of P is watt (W), the unit of V is volt (V), and the unit of I is ampere (A). The display device 100A can adjust the resistance value of the heater, the voltage value of the first control unit C1, and the voltage value of the second control unit C2 according to the above formula and the desired heating effect. In some embodiments, the heater can be a conductive component with impedance, such as an electric heating wire, an electric heating element, an electric heating plate, etc., and this disclosure is not limited thereto.

[0026] The heat energy (P) generated by the heater, the thermal conductivity (K) and contact area (A) of the material in contact with the heater, the heat transfer distance (ΔH) of the material in contact with the heater along the thickness direction, and the temperature difference (ΔT) caused by the heater to the material in contact with the heater along the thickness direction can be expressed by the equation P = K × A × (ΔT / ΔH). From the above equation, it can be seen that when the thermal conductivity K of the material in contact decreases or the heat transfer distance (ΔH) of the material in contact with the heater along the thickness direction increases, the temperature difference (ΔT) caused by the heater to the material in contact with the heater along the thickness direction easily increases. This makes it impossible for the heat energy (P) generated by the heater to be effectively and evenly transferred to the material in contact, resulting in excessive heat accumulation in the material in contact. This causes deformation of the material in contact due to uneven heat distribution, and the interface between the heater and the material in contact is prone to bending.

[0027] In all embodiments of the present invention, the thermal transfer coefficient K of the substrate 110 is between 0.5 and 1, the thermal transfer coefficient K of the light-shielding metal SM is 138, the thermal transfer coefficient K of the buffer layer 120 is 90 to 150, the thermal transfer coefficient K of the insulating layers 130, 160, 170, and 180 is 90 to 150, the thermal transfer coefficient K of the heating unit 150, heating unit 150d, and heating unit 150e is 240, and the thermal transfer coefficient K of the electrodes E1 and E2 is 70 to 250. The thickness of the buffer layer 120 can be 295 nm, and the thickness of the insulating layers 130, 160, 170, and 180 can be 740 nm or fall within the range of 175 nm to 300 nm. The thickness of the planarization layer 140 can fall within the range of 2 micrometers to 3 micrometers.

[0028] In all embodiments of the present invention, the material of the light-shielding metal SM can be molybdenum (Mo), and the thickness can be 50 nm to 150 nm. The material of the light-shielding metal SM can also be aluminum alloy, and the thickness can be 50 nm to 150 nm. The materials of heating unit 150, heating unit 150d1 and heating unit 150d2 can be molybdenum (Mo), titanium (Ti) / aluminum (Al) / titanium (Ti) alloy or molybdenum (Mo) / aluminum (Al) / molybdenum (Mo) alloy, and the thickness is, for example, 300 nm for molybdenum (Mo) metal, 500 nm for molybdenum (Mo) metal, or 95 nm titanium (Ti) / 365 nm aluminum (Al) / 75 nm titanium (Ti) alloy, or 95 nm titanium (Ti) / 440 nm aluminum (Al) / 75 nm titanium (Ti) alloy, or 95 nm titanium (Ti) / 200 nm aluminum (Al) / 75 nm titanium (Ti) alloy, or 95 nm titanium (Ti) / 600 nm aluminum (Al) / 75 nm titanium (Ti) alloy. The thickness of electrodes E1 and E2 is, for example, 50 nm, and the alloys are either 100 nm titanium (Ti) alloy, 100 nm molybdenum (Mo) / 300 nm aluminum (Al) / 600 nm molybdenum (Mo) alloy, or 100 nm molybdenum (Mo) / 365 nm aluminum (Al) / 600 nm molybdenum (Mo) alloy.

[0029] In this embodiment, the control element CU coupled to the heater is, for example, a switching element. Here, the switching element may be, for example, a transistor element, but is not limited thereto. The control element CU includes a first control unit C1 or a second control unit C2 disposed on the side of the substrate 110 and coupled to the heater. The second control unit C2 includes a first terminal C2a and a second terminal C2b, while the first control unit C1 may also include a third terminal C1a and a fourth terminal C1b. The first terminal C2a of the second control unit C2 can receive a control signal, while the second terminal C2b is coupled to the third terminal C1a of the first control unit C1, and the heater is coupled to the fourth terminal C1b of the first control unit C1. In some embodiments, when the heating unit 150 needs to heat the liquid crystal layer LC, the control signal is set to a signal to turn on the control element CU. Therefore, the current generated by the voltage difference between the second control unit C2 and the first control unit C1 will be input to the first control unit C1 through the second control unit C2 and then output from the first control unit C1, causing the heater to emit heat and heat the liquid crystal layer LC to the operating temperature range. When the heating unit 150 does not require heating, the control signal is set to turn off the switching element, thereby preventing current from flowing through the heater and thus preventing it from heating up. This design ensures energy-saving control of the heater and guarantees its service life, thereby improving the reliability and stability of the product.

[0030] In some embodiments, the control signal can be adjusted according to different parameters, so that the heating unit 150 performs the heating function according to different conditions. For example, the display device 100A can be operated together with a temperature sensor TS. The temperature sensor TS, such as an infrared sensor or other similar device, can sense the temperature of the display device 100A. When the temperature sensor TS detects that the temperature of the display device 100A is lower than the operating temperature range of the liquid crystal layer LC (e.g., 10 degrees Celsius), the temperature sensor TS can provide this result to the temperature control circuit, so that the temperature control circuit outputs a control signal to the control element CU, causing the heating unit 150 to heat the liquid crystal layer LC to the operating temperature range. In some embodiments, if the temperature sensor TS detects that the temperature of the display device 100A is close to or has reached the maximum value of the operating temperature range of the liquid crystal layer LC (e.g., 70 degrees Celsius), the temperature sensor TS can provide this result to the temperature control circuit, so that the temperature control circuit outputs a control signal to the control element CU, thereby stopping the heating unit 150 from continuously heating the liquid crystal layer LC. In other words, the display device 100A can adjust the control signal to control the heating unit 150 to heat or stop heating within a specified time interval, thereby achieving a time-zoned heating effect. However, this disclosure is not limited thereto. In some embodiments, the display device 100A can be operated in conjunction with a temperature control device (not shown) to heat the liquid crystal layer LC to a preset temperature range within the operating temperature range.

[0031] FIG2 is a top view schematic diagram of a display device according to another embodiment of the present disclosure. Referring to FIG1A and FIG2, the display device 100B of this embodiment is similar to the display device 100A of FIG1A. The difference between FIG2 and FIG1A is that each of the plurality of first heaters 150a has a first end 150a1 and a second end 150a2, and the second heater 150b includes a first portion 150b1 and a second portion 150b2. At least some of the first ends 150a1 of the plurality of first heaters 150a are connected to each other, and at least some of the second ends 150a2 of the plurality of first heaters 150a are connected to each other. At least another portion of the first ends 150a1 of the plurality of first heaters 150a are coupled to the first portion 150b1 of the second heater 150b, and at least another portion of the second ends 150a2 of the plurality of first heaters 150a are coupled to the second portion 150b2 of the second heater 150b. Therefore, in order to optimize the heater resistance design, The first heater 150a can pass through the liquid crystal layer LC in a single pass, three passes, or multiple passes, but is not limited to these. Here, "single pass" means that the first heater 150a extends along the second direction D2 from the first portion 150b1 of the second heater 150b towards the second portion 150b2. "Three passes" means that the first heater 150a extends along the second direction D2 from the first portion 150b1 of the second heater 150b towards the second portion 150b2 without contacting the second portion 150b2, then returns towards the first portion 150b1 without contacting it, and then returns towards the second portion 150b2 and couples with it. Through this design, the first heater 150a can optimize the heating efficiency and temperature uniformity of the display device, improving display quality.

[0032] In some embodiments, the location of the heating unit 150 can be determined based on the characteristics of the display device 100A, the application environment, and other conditions. For example, a plurality of first heaters 150a can be uniformly arranged in the display device 100A at equal intervals. Alternatively, the distribution density of the first heaters 150a can be denser in one area of ​​the display device 100A and sparser in another area, but this is not a limitation.

[0033] FIG3A is a top view schematic diagram of a display device according to another embodiment of the present disclosure.

[0034] It should be noted that the following embodiments use the component reference numerals and some content of the foregoing embodiments, wherein similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For descriptions of the omitted parts, please refer to the foregoing embodiments; the following embodiments will not repeat them.

[0035] Please refer to Figures 1A and 3A simultaneously. The display device 100C of this embodiment is similar to the display device 100A of Figure 1A. The difference between Figure 3A and Figure 1A is that the first heater includes a plurality of first heaters 150a. The plurality of first heaters 150a completely overlap with the liquid crystal layer LC in the normal direction of the substrate 110, and the plurality of first heaters 150a extend along the first direction D1. The first end 150a1 of the first heater 150a is coupled to the first part 150b1 of the second heater, and the second end 150a2 of the first heater 150a is coupled to the second part 150b2 of the second heater. Through the above design, the first heater 150a can enable the display device to achieve optimal heating efficiency and temperature uniformity, which helps to improve display quality.

[0036] Figure 3B is a magnified schematic diagram of a portion of region BB' in Figure 3A.

[0037] Please refer to Figures 1B and 3B at the same time. The display device 100C of this embodiment is similar to the display device 100A of Figure 1B. The difference between Figure 3B and Figure 1B is that the display device 100C may include multiple lines. The lines extending along the first direction D1 may include a gate line GL and a first heater 150a arranged parallel to the gate line GL.

[0038] Figure 3C is a cross-sectional view of Figure 3B along I-I'.

[0039] Please refer to Figures 1C and 3C simultaneously. The display device 100C of this embodiment is similar to the display device 100A of Figure 1B. The difference between Figure 3C and Figure 1C is that the first heater 150a in the display device 100C partially overlaps with the electrode E1. The electrode E1, the gate line GL, the active layer A1, and the light-shielding metal SM completely overlap in the normal direction of the substrate 110. The first heater 150a does not overlap with the gate line GL in the normal direction of the substrate 110. Since the first heater 150a does not overlap with the gate line GL, the signal of the gate line GL can be avoided.

[0040] FIG4 is a top view schematic diagram of a display device according to another embodiment of the present disclosure.

[0041] Please refer to Figures 4 and 3A simultaneously. The display device 100D of this embodiment is similar to the display device 100C of Figure 3A. The difference between Figure 4 and Figure 3A is that the first part 150b1 of the second heater 150b in the display device 100D can be further divided into two staggered parts according to temperature control requirements. One part 150b1-1 has two widths along the first direction D1, and the two widths are not the same. The width away from the driving circuit board PB is greater than the width close to the driving circuit board PB. The other portion 150b1-2 has a width along the first direction D1. At least a portion of the first ends 150a1 of the plurality of first heaters 150a are coupled to portions 150b1-1 of the second heaters 150b, and at least a portion of the first ends 150a1 of the plurality of first heaters 150a are coupled to portions 150b1-2 of the second heaters 150b. The second ends 150a2 of the first heaters 150a and the second portions 150b2 of the second heaters are connected to the first ends 150a1 in the same way, which will not be described again here. Through the above design, the first heaters 150a can enable the display device to achieve optimal heating efficiency and temperature uniformity, which helps to improve display quality.

[0042] FIG5 is a top view schematic diagram of a display device according to another embodiment of the present disclosure.

[0043] Please refer to Figures 5 and 3A simultaneously. The display device 100E of this embodiment is similar to the display device 100C of Figure 3A. The difference between Figures 5 and 3A is that the plurality of first heaters 150a in the display device 100E can be divided into multiple groups, such as a first group 150a-1, a second group 150a-2, a third group 150a-3, and a fourth group 150a-4. In order to optimize the resistance design of the first heaters 150a, each group may include four first heaters 150a. The first end 150a1 of each of the four first heaters 150a is coupled to each other and simultaneously coupled to the first part 150b1 of the second heater 150b. In addition, each group may include four first heaters 150a. The second end 150a2 of each of the four first heaters 150a is coupled to each other and simultaneously coupled to the second part 150b2 of the second heater 150b. In some embodiments, each group of first heaters 150a-1 may include, for example, 6, 8, 10 or 2N (N is a positive integer) first ends 150a1 of the first heaters 150a-1 coupled to each other and simultaneously coupled to the first portion 150b1 of the second heater 150b, but is not limited thereto.

[0044] FIG6A is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG6B is a cross-sectional schematic diagram of FIG6A along I-I'.

[0045] Please refer to Figures 6A and 6B simultaneously. The substrate 110 of the display device 100F may further include a display area DA and a peripheral area NA. Heating units 150d and 150e are disposed on opposite sides of the display area DA and located in the peripheral area NA, with the heating units 150d and 150e being adjacent to each other. The heating unit 150d includes heating units 150d1 and 150d2, which are disposed on the peripheral area NA of the substrate 110, surrounding the display area DA. The planarization layer 140 partially overlaps the heating units 150d1 and 150d2 in the peripheral area NA, and the ratio of the projected area of ​​the heating units 150d1 and 150d2 on the peripheral area NA of the substrate 110 to the projected area of ​​the planarization layer 140 on the peripheral area NA of the substrate 110 is greater than or equal to 1.

[0046] The peripheral area NA also includes electrodes E3 and E4, with electrode E4 located in the display area DA. The materials of electrodes E3 and E4 can be the same as those of electrodes E1 and E2.

[0047] Figures 6C and 6D are schematic cross-sectional views of Figure 6A along II-II'. Please refer to Figures 6C and 6D simultaneously.

[0048] The main difference between Figures 6C and 6D is that in Figure 6C, there is no planarization layer 140 between heating units 150d1 and 150d2, while in Figure 6D, there is a planarization layer 140 between heating units 150d1 and 150d2. When heat energy is transferred from the insulating layer 130 into heating unit 150d2, the structure of Figure 6C allows heat energy to be directly transferred to heating unit 150d1, that is, heating unit 150d1 directly contacts heating unit 150d2. In Figure 6D, when heat energy is transferred from the insulating layer 130 into heating unit 150d2, it must pass through the planarization layer 140 before being transferred to heating unit 150d1.

[0049] Figure 6E is a graph showing the relationship between temperature and heating time of a display device according to another embodiment of the present disclosure. Curve 1 represents the relationship between the temperature of the display area DA and the heating time. Curve 2 corresponds to the structure in Figure 6C and represents the relationship between temperature change and time when there is no planarization layer 140 between heating units 150d1 and 150d2. Curve 3 corresponds to the structure in Figure 6D and represents the relationship between temperature change and time when there is a planarization layer 140 between heating units 150d1 and 150d2. From the comparison between curves 2 and 3, it can be seen that the heating efficiency when there is no planarization layer 140 between heating units 150d1 and 150d2 is at least 30% higher than the heating efficiency when there is a planarization layer 140 between heating units 150d1 and 150d2.

[0050] Since the peripheral area NA includes the structures of both FIG6C and FIG6D, the heating efficiency of the peripheral area NA can be further improved, so that the temperature difference between the display area DA and the peripheral area NA can be reduced. In this embodiment, the temperature difference between the display area DA and the peripheral area NA is, for example, ≥ 3°C and ≦ 6°C.

[0051] Figure 6F is a partially enlarged schematic diagram of region AA in Figure 6A. Figure 6G is a partially enlarged schematic diagram of region BB in Figure 6F. Figure 6H is a cross-sectional schematic diagram of Figure 6G along III-III'. Please refer to Figures 6F, 6G, and 6H simultaneously.

[0052] The peripheral region NA of the display device includes alternating PP regions and a support structure PS located between the alternating PP regions. Referring to FIG6H, the PP region can be defined as a region containing a portion of heating unit 150d1 and heating unit 150d2 without a planarization layer 140 and a region containing a portion of heating unit 150d1 and heating unit 150d2 with a planarization layer 140. The support structure PS is located between the optical adhesive layer OC and the insulating layer 160 and overlaps with the color filter layer R. The support structure PS surrounds the PP region. The projection of the support structure PS on the substrate 110 and the PP region has a width W3 along the first direction D1. W3 is, for example, within a range greater than or equal to 20 micrometers, but is not limited thereto. In the peripheral region NA, the alternating PP regions account for approximately 50% of the entire peripheral region NA, that is, the portion of the peripheral region NA including the PP regions can account for at least 50% of the entire peripheral region NA, but is not limited thereto.

[0053] FIG7 is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure. The display device 100G of this embodiment is similar to the display device 100F of FIG6H. The difference between FIG7 and FIG6H is that the display device 100G may not include the heating unit 150d1. In this way, the volume of the display device 100G can be further reduced while maintaining the high heating efficiency of the display device 100G.

[0054] FIG8 is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure. The display device 100H of this embodiment is similar to the display device 100G of FIG7. The difference between FIG8 and FIG7 is that the display device 100H does not include the heating unit 150d2. The display device 100H can use the light-shielding metal SM as the heating unit to heat the display device 100H. In this way, the volume of the display device 100H can be further reduced while maintaining the high heating efficiency of the display device 100H.

[0055] FIG9A is a partially enlarged schematic diagram of a display device according to another embodiment of the present disclosure. FIG9B is a cross-sectional schematic diagram of FIG9A along VI-VI'. Please refer to FIG9A and FIG9B simultaneously.

[0056] The display device 100I of this embodiment is similar to the display device 100F of FIG. 6H. The difference between FIG. 9B and FIG. 6H is that the heating unit 150d2 can be further disposed within the insulating layer 130 and the buffer layer 120, and the electrode E1 is disposed within the insulating layer 160. In this way, the volume of materials with a small heat transfer coefficient in the peripheral area NA (e.g., insulating layer 130, insulating layer 160, insulating layer 170, insulating layer 180 or buffer layer 120) is reduced, and the volume of materials with a large heat transfer coefficient (e.g., heating unit 150, heating unit 150d1 or heating unit 150d2) is increased, so as to improve the heating efficiency of the display device.

[0057] In some embodiments, the area of ​​insulating layer 160 may be smaller than the area of ​​insulating layer 130, and the area of ​​insulating layer 130 may be smaller than the area of ​​planarization layer 140, but this is not a limitation. In some embodiments, insulating layer 160 and insulating layer 130 may partially overlap with planarization layer 140 in the third direction D3. In other embodiments, insulating layer 160 and insulating layer 130 do not overlap with planarization layer 140 in the third direction D3, but this is not a limitation.

[0058] In some embodiments, the shapes of insulating layer 160 and insulating layer 130 and electrode E1 or electrode E2 may be, for example, square, rectangular or circular, but are not limited thereto.

[0059] In summary, the heating unit is disposed on the peripheral area of ​​the substrate, and the planarization layer partially overlaps the heating unit in the peripheral area. The ratio of the projected area of ​​the heating unit on the peripheral area of ​​the substrate to the projected area of ​​the planarization layer on the peripheral area of ​​the substrate is greater than or equal to 1. In this way, the display device can achieve optimal heating efficiency and temperature uniformity, and improve display quality. [Simplified Explanation of the Diagram]

[0006] FIG1A is a top view schematic diagram of a display device according to an embodiment of the present disclosure. FIG1B is a partially enlarged schematic diagram of region AA' in FIG1A. FIG1C is a cross-sectional schematic diagram along I-I' in FIG1B. FIG1D to FIG1H are configuration diagrams of heating units according to an embodiment of the present disclosure. FIG1I is a schematic diagram of a heating unit according to an embodiment of the present disclosure. FIG2 is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG3A is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG3B is a partially enlarged schematic diagram of region BB' in FIG3A. FIG3C is a cross-sectional schematic diagram along I-I' in FIG3B. FIG4 is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG5 is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG6A is a top view schematic diagram of a display device according to another embodiment of the present disclosure. FIG6B is a cross-sectional schematic diagram along I-I' in FIG6A. FIG6C and FIG6D are cross-sectional schematic diagrams along II-II' in FIG6A. FIG6E is a graph showing the relationship between temperature and heating time of a display device according to another embodiment of the present disclosure. Figure 6F is a partially enlarged schematic diagram of region AA in Figure 6A. Figure 6G is a partially enlarged schematic diagram of region BB in Figure 6E. Figure 6H is a cross-sectional schematic diagram of Figure 6G along III-III'. Figure 7 is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure. Figure 8 is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure. Figure 9A is a partially enlarged schematic diagram of a display device according to another embodiment of the present disclosure. Figure 9B is a cross-sectional schematic diagram of Figure 9A along VI-VI'.

Claims

1. A display device, comprising: A substrate, the substrate including a peripheral region and a display region, the peripheral region surrounding the display region; A liquid crystal layer is disposed on the substrate; another substrate is disposed opposite to the substrate; a plurality of support structures are disposed between the substrate and the other substrate; a heating unit is disposed on the peripheral area of ​​the substrate; a planarization layer is disposed on the substrate; The device includes a planarization layer disposed between the heating unit and the other heating unit, and the other heating unit disposed between the liquid crystal layer and the heating unit; wherein the planarization layer has a plurality of contact windows through which the heating unit and the other heating unit contact each other; in a top view of the display device, the plurality of contact windows of the planarization layer are alternately arranged with the plurality of support structures.

2. The display device as claimed in claim 1 further includes an insulating layer and a buffer layer, wherein the other heating unit is disposed within the insulating layer and the buffer layer.

3. The display device as claimed in claim 1, wherein the heat transfer coefficient of the heating unit is greater than the heat transfer coefficient of the planarization layer.

4. The display device as claimed in claim 1, wherein the material of the heating unit includes molybdenum (Mo), titanium (Ti) / aluminum (Al) / titanium (Ti) alloy or molybdenum (Mo) / aluminum (Al) / molybdenum (Mo) alloy.

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