Chemically amplified positive photosensitive resin composition, cured film, and device having the cured film

Abstract

This invention provides a chemically amplified positive photosensitive resin composition exhibiting good coating uniformity, storage stability, and environmental friendliness, along with a cured film prepared from it, and an element containing the cured film. The chemically amplified positive photosensitive resin composition includes: an acid-dissociating resin (A), a photoacid generator (B), and a solvent (C). The photoacid generator (B) includes a fluorine-free photoacid generator (B-1). The fluorine content of the chemically amplified positive photosensitive resin composition is below 500 ppm.

Claims

1. A chemically amplified positive photosensitive resin composition, comprising: An acid-dissociative resin (A); a photoacid generator (B); and a solvent (C), wherein the acid-dissociative resin (A) is formed by copolymerization of a monomer mixture 1, the monomer mixture 1 comprising an unsaturated monomer (a-1) having an acid-dissociative group, an unsaturated monomer (a-2) having a structure as shown in formula (a2-1) or formula (a2-2) below, and an unsaturated monomer (a-3) having a maleimide group; the photoacid generator (B) comprises a fluorine-free photoacid generator (B-1), the fluorine-free photoacid generator (B-1) having a structure as shown in formula (b1-1) below; the fluorine content of the chemically amplified positive photosensitive resin composition is less than 500 ppm; in formula (a2-1) or formula (a2-2), R1, R2, and R3 independently represent hydrogen atoms or straight-chain alkyl or branched alkyl groups having 1 to 30 carbon atoms; in formula (b1-1) In formula (b1-1), A1 represents an alkyl or aryl group with 1 to 10 carbon atoms that is substituted or unsubstituted; A2 represents an alkyl group with 1 to 10 carbon atoms, an aryl group with 1 to 10 carbon atoms, or a nitrile group; A3 to A7 independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms that is substituted or unsubstituted with an ether group (-O-) or a thioether group (-S-), or an aryl group.

2. The chemically amplified positive photosensitive resin composition as described in claim 1, wherein, The fluorine content of the chemically amplified positive photosensitive resin composition is below 300 ppm.

3. The chemically amplified positive photosensitive resin composition as described in claim 1, wherein, The fluorine content of the chemically amplified positive photosensitive resin composition is less than 100 ppm.

4. The chemically amplified positive photosensitive resin composition as described in claim 1, wherein, The fluorine content of the chemically amplified positive photosensitive resin composition is above 0 ppm.

5. The chemically amplified positive photosensitive resin composition as described in claim 1, wherein, Based on the total weight of the solid components of the chemically amplified positive photosensitive resin composition (100% by weight), the amount of acid-dissociating resin (A) used is 60% to 95% by weight, the amount of photoacid generator (B) used is 0.3% to 3% by weight, and based on the total weight of the chemically amplified positive photosensitive resin composition (100% by weight), the amount of solvent (C) used is 15% to 60% by weight.

6. The chemically amplified positive photosensitive resin composition as described in claim 1, wherein, Based on the total weight of the solid components of the chemically amplified positive photosensitive resin composition being 100% by weight, the amount of photoacid generator (B-1) used is 0.3% to 3% by weight.

7. The chemically amplified positive photosensitive resin composition as claimed in claim 1, further comprising resin (D), said resin (D) being formed by copolymerization of monomer mixture 2, said monomer mixture 2 comprising unsaturated monomers (d-1) having alkoxysilicone groups.

8. The chemically amplified positive photosensitive resin composition as described in claim 7, wherein, Based on the total weight of the solid components of the chemically amplified positive photosensitive resin composition being 100% by weight, the amount of resin (D) used is 4% to 39% by weight.

9. A curing film formed by coating a chemically amplified positive photosensitive resin composition as described in any one of claims 1 to 8 onto a substrate, followed by pre-baking, exposure, development, and post-baking.

10. An element having a hardened film, comprising: Substrate; And a hardened film as described in claim 9, disposed on the substrate.