Optical package module and chip set structure and manufacturing method thereof

Abstract

An optical packaging module and its chip assembly structure and manufacturing method are disclosed. The module mainly provides an optoelectronic integrated photonic chip and electronic components disposed on the optoelectronic integrated photonic chip. The optoelectronic integrated photonic chip is then attached to and electrically connected to a carrier structure, and optical components are disposed on the optoelectronic integrated photonic chip to increase the signal transmission speed.

Claims

1. A chip assembly structure, comprising: The optoelectronic integrated photonic chip includes electronic integrated circuit elements and photonic integrated circuit elements, wherein at least one groove is formed on the optoelectronic integrated photonic chip; electronic elements are disposed on the optoelectronic integrated photonic chip; and optical elements are disposed on the optoelectronic integrated photonic chip and connected to the groove.

2. The wafer assembly structure as described in claim 1, wherein, The optoelectronic integrated photonic chip has a plurality of conductive vias connecting its surface.

3. The wafer assembly structure as described in claim 1, wherein, This electronic component is a high-bandwidth memory.

4. The wafer assembly structure as described in claim 1, wherein, The optical element has a lens structure.

5. An optical packaging module, comprising: Load-bearing structure; The chip assembly structure is disposed on and electrically connected to the carrier structure, comprising: an optoelectronic integrated photonic chip, which includes electronic integrated circuit elements and photonic integrated circuit elements, wherein at least one groove is formed on the optoelectronic integrated photonic chip; electronic elements disposed on the optoelectronic integrated photonic chip; and optical elements disposed on the optoelectronic integrated photonic chip and connected to the groove.

6. The optical packaging module as described in claim 5 further includes a heat sink disposed on the support structure for mounting the optical element.

7. The optical packaging module as described in claim 5 further includes a circuit board for mounting the carrier structure.

8. The optical packaging module as described in claim 5, wherein, The supporting structure can be a substrate, an interposer, a circuit structure, or a packaging unit.

9. The optical packaging module as described in claim 5, wherein, The optoelectronic integrated photonic chip has a plurality of conductive vias connecting its surface.

10. The optical packaging module as described in claim 5, wherein, This electronic component is a high-bandwidth memory.

11. The optical packaging module as described in claim 5, wherein, The optical element has a lens structure.

12. A method for manufacturing an optical packaging module, comprising: A chip assembly structure is provided, comprising an optoelectronic integrated photonic chip and electronic components disposed on the optoelectronic integrated photonic chip, wherein at least one groove is formed on the optoelectronic integrated photonic chip; the chip assembly structure is disposed and electrically connected to a carrier structure; and optical components are disposed on the optoelectronic integrated photonic chip and connected to the groove.

13. The method of manufacturing the optical packaging module as described in claim 12 further includes providing a heat sink on the support structure for mounting the optical element.

14. The method of manufacturing the optical packaging module as described in claim 12 further includes attaching and electrically connecting the carrier structure to a circuit board.

15. A method for manufacturing an optical packaging module as described in claim 12, wherein, The supporting structure can be a substrate, an interposer, a circuit structure, or a packaging unit.

16. A method for manufacturing an optical packaging module as described in claim 12, wherein, The optoelectronic integrated photonic chip has a plurality of conductive vias connecting its surface.

17. A method for manufacturing an optical packaging module as described in claim 12, wherein, This electronic component is a high-bandwidth memory.

18. A method for manufacturing an optical packaging module as described in claim 12, wherein, The optical element has a lens structure.

Images