Heat dissipation device for data processing equipment

Abstract

This invention relates to a heat dissipation device for a data processing apparatus, comprising: a first heat dissipation assembly including a cooling element for mounting in a first direction of a processor, the cooling element being configured to absorb heat from the processor; a second heat dissipation assembly disposed in the first direction of the cooling element, at least one end of the second heat dissipation assembly being mounted in the first direction of a memory module, the second heat dissipation assembly being configured to transfer heat from the memory module to the second heat dissipation assembly for diffusion and transfer to the cooling element; the cooling element including an inlet and an outlet disposed on opposite sides, the inlet direction of the inlet and the outlet direction of the outlet being the same and perpendicular to the heat transfer direction of the cooling element and the second heat dissipation assembly. One end of the second heat dissipation assembly is thermally connected to the memory module and disposed in the first direction of the cooling element, transferring heat from the memory module and the processor to the cooling element for heat dissipation, avoiding loss of thermal conductivity, improving heat dissipation effect, and improving the performance and stability of the data processing apparatus.

Claims

1. A heat dissipation device for a data processing apparatus, wherein, include: A first heat dissipation assembly (10) includes a cooling element (11) for mounting on a processor (30) in a first direction, the cooling element (11) being configured to absorb heat from the processor (30); A second heat dissipation component (20) is disposed in a first direction of the cooling component (11). At least one end of the second heat dissipation component (20) is used to be mounted in the first direction of the memory module (40). The second heat dissipation component (20) is configured to transfer heat from the memory module (40) to the second heat dissipation component (20) for diffusion and transfer to the cooling component (11). The cooling component (11) includes an inlet (12) and an outlet (13) disposed on opposite sides. The inlet direction of the inlet (12) and the outlet direction of the outlet (13) are the same and perpendicular to the heat transfer direction of the cooling component (11) and the second heat dissipation component (20). The cooling component (11) is provided with a chamber (14), one end of which is connected to the inlet (12). One end is connected to the other end, and the other end is connected to the liquid outlet (13); wherein, the cooling component (11) is a cold plate structure, the cooling component (11) includes an upper cold plate (110), a middle cold plate (111) and a lower cold plate (112) stacked in sequence, the upper cold plate (110) and the lower cold plate (112) are provided with flow channels (15) in the chambers (14), and the flow direction of the coolant in the flow channels (15) is perpendicular to the direction of heat transfer of the second heat dissipation component (20); wherein, the upper cold plate (110) and the lower cold plate (112) are respectively provided with multiple fin structures (16) in the chambers (14), the multiple fin structures (16) are arranged in parallel and spaced to form the flow channels (15), and the flow direction of the flow channels (15) is parallel to the liquid inlet (12).

2. The heat dissipation device for a data processing apparatus as described in claim 1, wherein, There is a gap between the two ends of the second heat dissipation component (20) and the cooling component (11). The two ends of the second heat dissipation component (20) are respectively located in the first direction of the memory module (40), and the cooling component (11) is located within the gap.

3. The heat dissipation device for a data processing apparatus as described in claim 2, wherein, The second heat dissipation component (20) includes a heat expansion component (21) and a heat conduction component (22). The heat expansion component (21) extends laterally and is disposed in the first direction of the cooling component (11) and is thermally connected to the cooling component (11). Two heat conduction components (22) are disposed longitudinally at both ends of the heat expansion component (21). One end of the heat conduction component (22) is used to be inserted into the memory module (40).

4. The heat dissipation device for a data processing apparatus as described in claim 1, wherein, The intermediate cooling plate (111) includes an inlet flow equalization channel (113) and an outlet flow convergence channel (114). The inlet flow equalization channel (113) is connected to the liquid inlet (12), and the outlet flow convergence channel (114) is connected to the liquid outlet (13). The inlet flow equalization channel (113) and the outlet flow convergence channel (114) are respectively disposed at both ends of the intermediate cooling plate (111), and the extension direction of the inlet flow equalization channel (113) and the outlet flow convergence channel (114) is perpendicular to the liquid inlet direction.

5. The heat dissipation device for a data processing apparatus as described in claim 4, wherein, The intermediate cooling plate (111) further includes at least one baffle groove (115), which is disposed between the inlet flow equalization groove (113) and the outlet flow convergence groove (114). The extension direction of the baffle groove (115) is parallel to the extension direction of the inlet flow equalization groove (113) and the outlet flow convergence groove (114). The upper cooling plate (110) and the lower cooling plate (112) are respectively provided with baffle ribs (116) corresponding to the position of the baffle groove (115). The baffle ribs (116) are protruding between adjacent fin structures (16), and the extension direction of the baffle ribs (116) is perpendicular to the extension direction of the fin structure (16).

6. The heat dissipation device for a data processing apparatus as described in claim 5, wherein, The intermediate cooling plate (111) is provided with multiple baffles (117), and the baffles (115) are formed between the multiple baffles (117). The height of the baffles (117) is the same as the thickness of the intermediate cooling plate (111).

7. The heat dissipation device for a data processing apparatus as described in claim 6, wherein, The intermediate cooling plate (111) further includes an inlet manifold (118) and an outlet overflow trough (119). The inlet manifold (118) is disposed between the inlet equalizing trough (113) and the baffle (117) and communicates with the inlet manifold (118). The outlet overflow trough (119) is disposed between the baffle (117) and the outlet manifold (114) and communicates with the outlet manifold (114). The extension directions of the inlet manifold (118) and the outlet overflow trough (119) are parallel to the extension direction of the deflector (115).

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