Circuit substrate and manufacturing method thereof

Abstract

A circuit board includes a substrate, and a first adhesive layer, a patterned seed layer, and a patterned metal layer sequentially stacked on the substrate. The patterned seed layer and the patterned metal layer define a via, and the via overlaps the first adhesive layer. A method for manufacturing the circuit board is also proposed.

Claims

1. A circuit board, comprising a substrate, and a first adhesive layer, a patterned seed layer and a patterned metal layer sequentially stacked on a surface of the substrate, wherein the patterned seed layer and the patterned metal layer define a via on the surface, and the via overlaps the first adhesive layer on the surface, wherein the first adhesive layer directly contacts the substrate.

2. The circuit board as claimed in claim 1, wherein the first adhesive layer is disposed across the entire surface of the board.

3. The circuit board as claimed in claim 1, wherein the surface roughness (Ra) of the patterned metal layer is in the range of 100 nm to 1000 nm.

4. The circuit board as claimed in claim 1, wherein the patterned metal layer has a metal layer width in a direction perpendicular to the normal of the board, and the metal layer width is in the range of 0.5 micrometers to 1.0 micrometers.

5. The circuit board as claimed in claim 1, wherein the patterned metal layer has a line spacing in a direction perpendicular to the normal of the board, and the line spacing is in the range of 0.5 micrometers to 1.0 micrometers.

6. The circuit board of claim 1, wherein the patterned metal layer has a side surface, and the side surface has an angle with the surface of the substrate, and the angle is in the range of 89 degrees to 91 degrees.

7. The circuit board as claimed in claim 1, wherein the first adhesive layer, the patterned seed layer, and the patterned metal layer are sequentially disposed on a through-hole sidewall of the substrate.

8. The circuit board as claimed in claim 1, wherein the first adhesive layer comprises a metal oxide.

9. The circuit board as claimed in claim 1, further comprising a silane compound or fluorine compound within the through-hole.

10. The circuit board of claim 1, further comprising a second adhesive layer and a dielectric layer, wherein the dielectric layer is located between the patterned metal layer and the second adhesive layer.

11. The circuit board of claim 10, wherein the second adhesive layer comprises conductive particles.

12. A method for manufacturing a circuit board, comprising: A first adhesive layer is formed on a surface of a substrate, wherein the first adhesive layer directly contacts the substrate; a patterned hydrophobic layer is formed on the first adhesive layer; a patterned seed layer is formed on the first adhesive layer, wherein the patterned seed layer is defined by the patterned hydrophobic layer; and a patterned metal layer is formed on the patterned seed layer.

13. The method for manufacturing a circuit board as described in claim 12, further comprising: A first photoresist layer is formed using a photomask to fabricate the patterned hydrophobic layer; And using the photomask to form a second photoresist layer to manufacture the patterned metal layer, wherein the first photoresist layer is one of a positive photoresist and a negative photoresist, and the second photoresist layer is the other of a positive photoresist and a negative photoresist.

14. The method for manufacturing a circuit board as described in claim 12, further comprising: A patterned dielectric layer is disposed on the patterned metal layer, wherein the patterned dielectric layer includes a plurality of grooves; and a second adhesive layer is disposed on the patterned dielectric layer.

15. The method for manufacturing a circuit board as described in claim 12, further comprising: A dielectric layer and a second adhesive layer are sequentially disposed on the patterned metal layer; And laser etching of the dielectric layer and the second adhesive layer.

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