Computer equipment, and vertical solid-state disk device thereof

Abstract

A computer device includes a chassis, a motherboard, and a vertical solid-state drive (SSD) device. The motherboard is disposed within the chassis and includes at least one slot. The vertical SSD device includes at least one vertical SSD, each corresponding to one slot, and each vertical SSD includes a circuit board. In each vertical SSD, the circuit board includes a short side and a long side, the short side having an edge connector that plugs into the corresponding slot, and the long side perpendicular to the motherboard. Therefore, the vertical SSD device can be vertically inserted into the motherboard, improving the SSD's heat dissipation efficiency and freeing up more horizontal space on the motherboard, thus increasing the flexibility of component placement within the chassis.

Claims

1. A vertical solid-state drive device, comprising: A plurality of vertical solid-state drives (SSDs), each SSD including a circuit board with a short side and a long side, the short side having an edge connector, wherein the edge connector of each vertical SSD is configured to vertically insert into a slot corresponding to a motherboard, and the short sides of the circuit boards of the vertical SSDs are inserted into their respective slots approximately along a straight line; an extended heat dissipation section including a plurality of heat dissipation fins; a plurality of thermal conductive elements, wherein each thermal conductive element corresponds to one of the vertical SSDs; one end of each thermal conductive element is connected to the corresponding vertical SSD, and the other end of each thermal conductive element is connected to the heat dissipation fins of the extended heat dissipation section; and a mounting bracket connected to the extended heat dissipation section, the mounting bracket having an opening slot through which the heat dissipation fins of the extended heat dissipation section pass.

2. The vertical solid-state drive device as described in claim 1, wherein each of the vertical solid-state drives further includes a storage unit, a heat sink, and a heat sink base; wherein, The heat sink and the heat sink base plate are disposed on opposite sides of the circuit board, and the storage unit is disposed on the circuit board.

3. The upright solid-state drive device as described in claim 2 further includes: A locking bracket is connected to the mounting bracket, the extended heat sink, and the heat sink of the vertical solid-state drives.

4. The upright solid-state drive device as described in claim 1, further comprising: A cooling fan is installed in the extended heat dissipation section.

5. A computer device, comprising: A casing; A motherboard, disposed in the chassis and including at least one slot; A vertical solid-state drive (SSD) device, comprising: at least one vertical SSD, wherein each of the at least one vertical SSD corresponds to one of at least one slot, and includes a circuit board; in each of the at least one vertical SSD, the circuit board includes a short side and a long side, the short side is provided with a board edge connector, the board edge connector is inserted into the corresponding slot, and the long side of the circuit board is perpendicular to the motherboard; an extended heat dissipation section including a plurality of heat dissipation fins; a plurality of thermal conductive elements, wherein each thermal conductive element corresponds to one of the at least one vertical SSD; one end of each thermal conductive element is connected to the corresponding vertical SSD, and the other end of each thermal conductive element is connected to the heat dissipation fins of the extended heat dissipation section; and a mounting bracket connected to the extended heat dissipation section, the mounting bracket having an opening slot, wherein the mounting bracket is connected to the extended heat dissipation section and fixed to the expansion opening of the housing, and the heat dissipation fins of the extended heat dissipation section pass through the opening slot and are exposed outside the housing.

6. The computer device as described in claim 5, wherein, Each of the at least one vertical solid-state drive includes a first vertical solid-state drive and a second vertical solid-state drive, wherein the first vertical solid-state drive and the second vertical solid-state drive correspond to adjacent ones of the at least one slot; and wherein the first vertical solid-state drive and the second vertical solid-state drive are inserted into the corresponding two slots in a generally straight line.

7. The computer device as described in claim 5, wherein, Each of the at least one vertical solid-state drive further includes a storage unit, a heat sink, and a heat sink base plate; wherein, in each of the at least one vertical solid-state drive, the heat sink and the heat sink base plate are disposed on opposite sides of the circuit board, and the storage unit is disposed on the circuit board.

8. The computer device as described in claim 7, wherein, The upright solid-state drive device further includes: a locking bracket connected to the mounting bracket, the extended heat dissipation section, and the heat sink of the upright solid-state drives.

9. The computer device as described in claim 5, wherein, The vertical solid-state drive device further includes: a cooling fan disposed on the extended heat dissipation section.

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