Light-emitting module and developing device including the same

Abstract

This disclosure provides a light-emitting module and a developing apparatus including the same. The light-emitting module includes a substrate, a plurality of light-emitting units, an encapsulation layer, and a light-shielding layer. The light-emitting units are disposed on the substrate. The encapsulation layer is disposed on the substrate and covers the light-emitting units, wherein the encapsulation layer has a top surface and a side surface. The light-shielding layer is disposed on the encapsulation layer, wherein the light-shielding layer includes a central light-shielding portion and a peripheral light-shielding portion. The central light-shielding portion is disposed on the top surface of the encapsulation layer and has a plurality of openings. The openings expose the light-emitting units. The peripheral light-shielding portion extends from the top surface of the encapsulation layer to the side surface, wherein the peripheral light-shielding portion includes chamfered corners or rounded corners.

Claims

1. A light-emitting module, comprising: One substrate; A plurality of light-emitting units are disposed on the substrate; An encapsulation layer is disposed on the substrate and covers the light-emitting units, wherein the encapsulation layer has a top surface and a side surface; And a light-shielding layer disposed on the encapsulation layer, wherein the light-shielding layer includes: a central light-shielding portion disposed on the top surface of the encapsulation layer and having a plurality of openings, wherein the openings correspond to the light-emitting units; and a peripheral light-shielding portion extending from the top surface of the encapsulation layer along an outer periphery of the encapsulation layer to the side surface, wherein the peripheral light-shielding portion forms a chamfer or a fillet at the outer periphery.

2. The light-emitting module as claimed in claim 1, wherein the side surface of the encapsulation layer is an inclined side surface, and the angle between the side surface of the encapsulation layer and the normal direction of the substrate is between 0 degrees and 50 degrees.

3. The light-emitting module as claimed in claim 2, wherein the substrate has a side surface, and the side surface of the encapsulation layer forms a continuous side surface with the side surface of the substrate.

4. The light-emitting module as claimed in claim 3, wherein the peripheral light-shielding portion extends further from the side surface of the encapsulation layer to the side surface of the substrate.

5. The light-emitting module as claimed in claim 3, wherein the angle between the side surface of the encapsulation layer and the normal direction of the substrate is between 40 degrees and 50 degrees.

6. The light-emitting module as claimed in claim 3, wherein the surface roughness of the side surface of the encapsulation layer is greater than the surface roughness of the top surface of the encapsulation layer.

7. The light-emitting module as claimed in claim 1, wherein the side surface of the encapsulation layer is an arc-shaped side surface, and the light-shielding layer is conformally disposed on the side surface of the encapsulation layer.

8. The light-emitting module as claimed in claim 1, wherein the substrate has a top surface and the peripheral light-shielding portion extends from the side surface of the encapsulation layer to the top surface of the substrate.

9. The light-emitting module as claimed in claim 8, wherein the thickness of the peripheral light-shielding portion on the top surface of the substrate is different from the thickness on the top surface of the encapsulation layer.

10. The light-emitting module as claimed in claim 9, wherein the side surface of the encapsulation layer is an inclined side surface or a vertical side surface.

11. A developing apparatus, comprising: The light-emitting module as described in any one of claims 1 to 10; And a photosensitive photographic paper is disposed on the top surface of the encapsulation layer of the light-emitting module.

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