Cold plate, cold plate assembly and motherboard module

Abstract

A cold plate includes a main inlet channel, a sub-inlet channel, a heat exchange chamber, a sub-outlet channel, and a main outlet channel. The main inlet channel has a cold liquid inlet and a cold liquid outlet. The sub-inlet channel is connected to the main inlet channel. The heat exchange chamber is connected to the sub-inlet channel. The sub-outlet channel is connected to the heat exchange chamber. The main outlet channel is connected to the sub-outlet channel and has a hot liquid inlet and a hot liquid outlet. The cold plate has a first side and a second side opposite to each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side of the cold plate. The cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side of the cold plate.

Description

[Technical Field]

[0001] This invention relates to a cold plate, a cold plate assembly, and a motherboard module. [Previous Technology]

[0002] As the heat generated by heat-generating components (such as central processing units or graphics processors) in servers increases, cold plates are now used to thermally couple to the heat-generating components, and the coolant flowing through the cold plate is used to conduct the heat from the heat-generating components to the cold plate.

[0003] Generally, a T-junction is installed on the upper side of the cold plate to connect pipes for the input and output of coolant. However, servers are placed in cabinets, and there are height restrictions, making it difficult to install the cold plate inside the server due to its excessive height. In view of this, researchers in the field are working to solve the aforementioned problems. [Summary of the Invention]

[0004] The present invention provides a cold plate, a cold plate assembly and a motherboard module, which allows the cold plate to be configured in the internal space of a server.

[0005] A cold plate disclosed in one embodiment of the present invention includes a main inlet channel, a sub-inlet channel, a heat exchange chamber, a sub-outlet channel, and a main outlet channel. The main inlet channel has a cold liquid inlet and a cold liquid outlet. The sub-inlet channel is connected to the main inlet channel. The heat exchange chamber is connected to the sub-inlet channel. The sub-outlet channel is connected to the heat exchange chamber. The main outlet channel is connected to the sub-outlet channel and has a hot liquid inlet and a hot liquid outlet. The cold plate has a first side and a second side opposite to each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side of the cold plate. The cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side of the cold plate.

[0006] An embodiment of the present invention discloses a cold plate assembly comprising a first cold plate and a second cold plate. Each of the first and second cold plates includes a main inlet channel, a sub-inlet channel, a heat exchange chamber, a sub-outlet channel, and a main outlet channel. The main inlet channel has a cold liquid inlet and a cold liquid outlet. The sub-inlet channel is connected to the main inlet channel. The heat exchange chamber is connected to the sub-inlet channel. The sub-outlet channel is connected to the heat exchange chamber. The main outlet channel is connected to the sub-outlet channel and has a hot liquid inlet and a hot liquid outlet. Each of the first and second cold plates forms a thermal coupling surface. Each of the first and second cold plates has a first side and a second side facing each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side. The cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side. The main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate.

[0007] An embodiment of the present invention discloses a motherboard module, comprising a motherboard and a cold plate assembly. The motherboard includes a circuit board and a first heat source and a second heat source disposed on the circuit board. The cold plate assembly includes a first cold plate and a second cold plate. The first cold plate and the second cold plate are thermally coupled to the first heat source and the second heat source, respectively. Each of the first cold plate and the second cold plate includes a main inlet channel, a sub-inlet channel, a heat exchange chamber, a sub-outlet channel, and a main outlet channel. The main inlet channel has a cold liquid inlet and a cold liquid outlet. The sub-inlet channel is connected to the main inlet channel. The heat exchange chamber is connected to the sub-inlet channel. The sub-outlet channel is connected to the heat exchange chamber. The main outlet channel is connected to the sub-outlet channel and has a hot liquid inlet and a hot liquid outlet. Each of the first cold plate and the second cold plate has a first side and a second side facing each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side. The coolant outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side. The main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate.

[0008] According to the cold plate, cold plate assembly and motherboard module disclosed in the above embodiments, by having a cold plate with opposing first and second sides, the cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel of the cold plate are located on the first side of the cold plate, and the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel of the cold plate are located on the second side of the cold plate, the overall height of the cold plate can be reduced, so that the cold plate can be used in the internal space of the server.

[0009] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0011] Please refer to Figures 1 and 2. Figure 1 shows a perspective view of a motherboard module 1 according to some embodiments of the present invention. Figure 2 shows an exploded view of a motherboard module 1 according to some embodiments of the present invention. The structural features of Figures 1 and 2 can be applied to other embodiments of the present invention.

[0012] The motherboard module 1 is adapted, for example, to be placed in the internal space of the housing of an electronic device, wherein the electronic device is, for example, a server. The motherboard module 1 includes a motherboard 10 and a cold plate assembly 20.

[0013] The motherboard 10 includes a circuit board 11 and a first heat source 12 and a second heat source 13 disposed on the circuit board 11, wherein the first heat source 12 and the second heat source 13 may be, for example, a central processing unit or a graphics processing unit. In some embodiments, the first heat source 12 and the second heat source 13 are disposed on the same surface 111 of the circuit board 11.

[0014] The cold plate assembly 20 includes a first cold plate 21 and a second cold plate 22. The first cold plate 21 and the second cold plate 22 are thermally coupled to the first heat source 12 and the second heat source 13, respectively.

[0015] Next, please refer to Figures 3 and 4. Figure 3 shows a cross-sectional view of a portion of the mainboard 10 and the first cold plate 21 according to some embodiments of the present invention. Figure 4 shows a cross-sectional view of the first cold plate 21 according to some embodiments of the present invention. The structural features of Figures 3 and 4 can be applied to other embodiments of the present invention.

[0016] The first cold plate 21 includes a main inlet channel 211, a sub-inlet channel 212, a heat exchange chamber 213, a sub-outlet channel 214, and a main outlet channel 215. The main inlet channel 211 has a cold liquid inlet 2111 and a cold liquid outlet 2112. The sub-inlet channel 212 is connected to the main inlet channel 211. The heat exchange chamber 213 is connected to the sub-inlet channel 212. The sub-outlet channel 214 is connected to the heat exchange chamber 213. The main outlet channel 215 is connected to the sub-outlet channel 214 and has a hot liquid inlet 2151 and a hot liquid outlet 2152. The first cold plate 21 forms a thermal coupling surface 216. The thermal coupling surface 216 corresponds to the heat exchange chamber 213. In some embodiments, in the direction D perpendicular to the thermal coupling surface 216 (such as the direction of the normal N1 parallel to the thermal coupling surface 216), the main inlet channel 211 and the main outlet channel 215 do not overlap with the heat exchange chamber 213 at all.

[0017] The first cold plate 21 has a first side 217 and a second side 218 opposite to each other. The cold liquid inlet 2111 of the main inlet channel 211 and the hot liquid outlet 2152 of the main outlet channel 215 are located on the first side 217 of the first cold plate 21. The cold liquid outlet 2112 of the main inlet channel 211 and the hot liquid inlet 2151 of the main outlet channel 215 are located on the second side 218 of the first cold plate 21.

[0018] In some embodiments, the cold plate assembly 20 may further include a main liquid inlet pipe 23 and a main liquid outlet pipe 24. The cold liquid inlet 2111 of the main inlet channel 211 and the hot liquid outlet 2152 of the main outlet channel 215 are respectively connected to the main liquid inlet pipe 23 and the main liquid outlet pipe 24.

[0019] In some embodiments, the cold plate assembly 20 may further include a first connecting pipe 25 and a second connecting pipe 26. The cold liquid outlet 2112 of the main inlet channel 211 of the first cold plate 21 is connected to the first connecting pipe 25, and the hot liquid inlet 2151 of the first cold plate 21 is connected to the second connecting pipe 26.

[0020] In some embodiments, in the direction D of the vertical thermal coupling surface 216, the sub-outflow channel 214 and the sub-inflow channel 212 overlap the heat exchange chamber 213.

[0021] In some embodiments, the sub-inlet channel 212 includes a first inlet section 2121 and a second inlet section 2122. The first inlet section 2121 is connected to the main inlet channel 211, and the second inlet section 2122 is connected to the first inlet section 2121. The second inlet section 2122 is not parallel to the first inlet section 2121. In some embodiments, the first inlet section 2121 is perpendicular to the main inlet channel 211, and the second inlet section 2122 is perpendicular to the first inlet section 2121.

[0022] In some embodiments, the width W1 of the main inlet channel 211 is greater than the width W2 of the first inlet section 2121 and the width (such as widths W31 and W32) of the second inlet section 2122.

[0023] In some embodiments, the second inlet section 2122 includes a wide portion 2122a, a tapered portion 2122b, and a narrow portion 2122c. The tapered portion 2122b is located between and communicates with the wide portion 2122a and the narrow portion 2122c, and the width W31 of the wide portion 2122a is greater than the width W32 of the narrow portion 2122c. The wide portion 2122a communicates with the first inlet section 2121, and the narrow portion 2122c communicates with the heat exchange chamber 213. In some embodiments, the thermal coupling surface 216 faces away from the heat exchange chamber 213, and the narrow portion 2122c communicates with the side of the central portion of the heat exchange chamber 213 away from the thermal coupling surface 216.

[0024] In some embodiments, the sub-outflow channel 214 includes two outflow sections 2141 and a converging section 2142. The two outflow sections 2141 communicate with the heat exchange chamber 213. One end of the converging section 2142 communicates with the two outflow sections 2141, and the other end of the converging section 2142 communicates with the main outflow channel 215. In some embodiments, a portion of the second inflow section 2122 (such as the narrow portion 2122c of the second inflow section 2122) is located between the two outflow sections 2141. One of the two outflow sections 2141 is partially located between the main inflow channel 211 and the second inflow section 2122, and the other of the two outflow sections 2141 is partially located between the main outflow channel 215 and the second inflow section 2122.

[0025] In some embodiments, the first cold plate 21 may further include a plurality of fins 219. These fins 219 are disposed in the heat exchange chamber 213 and extend along one of the two outflow sections 2141 toward the other.

[0026] Next, please refer to Figures 5 and 6. Figure 5 shows a cross-sectional view of a portion of the main board 10 and the second cold plate 22 according to some embodiments of the present invention. Figure 6 shows a cross-sectional view of the second cold plate 22 according to some embodiments of the present invention. The structural features of Figures 5 and 6 can be applied to other embodiments of the present invention.

[0027] The second cold plate 22 includes a main inlet channel 221, a sub-inlet channel 222, a heat exchange chamber 223, a sub-outlet channel 224, and a main outlet channel 225. The main inlet channel 221 has a cold liquid inlet 2211. The sub-inlet channel 222 is connected to the main inlet channel 221. The heat exchange chamber 223 is connected to the sub-inlet channel 222. The sub-outlet channel 224 is connected to the heat exchange chamber 223. The main outlet channel 225 is connected to the sub-outlet channel 224 and has a hot liquid outlet 2252. The second cold plate 22 forms a thermal coupling surface 226. The thermal coupling surface 226 corresponds to the heat exchange chamber 223. In the direction D perpendicular to the thermal coupling surface 226 (such as the direction parallel to the normal N2 of the thermal coupling surface 226), the main inlet channel 221 and the main outlet channel 225 do not overlap with the heat exchange chamber 223 at all.

[0028] In some embodiments, the cold liquid inlet 2211 of the main inlet channel 221 and the hot liquid outlet 2252 of the main outlet channel 225 are located on the same side of the second cold plate 22.

[0029] In some embodiments, the cold liquid inlet 2211 of the main inlet channel 221 of the second cold plate 22 is connected to the first connecting pipe 25, and the hot liquid outlet 2252 of the second cold plate 22 is connected to the second connecting pipe 26. That is, the main inlet channel 211 of the first cold plate 21 (as shown in FIG. 4) is connected to the main inlet channel 221 of the second cold plate 22 through the first connecting pipe 25, and the main outlet channel 215 of the first cold plate 21 (as shown in FIG. 4) is connected to the main outlet channel 225 of the second cold plate 22 through the second connecting pipe 26.

[0030] In some embodiments, in the direction D of the vertical thermal coupling surface 226, the sub-outflow channel 224 and the sub-inflow channel 222 overlap the heat exchange chamber 223.

[0031] In some embodiments, the sub-inlet channel 222 includes a first inlet section 2221 and a second inlet section 2222. The first inlet section 2221 is connected to the main inlet channel 221, and the second inlet section 2222 is connected to the first inlet section 2221. The second inlet section 2222 is not parallel to the first inlet section 2221. In some embodiments, the first inlet section 2221 is perpendicular to the main inlet channel 221, and the second inlet section 2222 is perpendicular to the first inlet section 2221.

[0032] In some embodiments, the width W4 of the main inlet channel 221 is greater than the width W5 of the first inlet section 2221 and the width (such as widths W61 and W62) of the second inlet section 2222.

[0033] In some embodiments, the second inlet section 2222 includes a wide portion 2222a, a tapered portion 2222b, and a narrow portion 2222c. The tapered portion 2222b is located between and communicates with the wide portion 2222a and the narrow portion 2222c, and the width W61 of the wide portion 2222a is greater than the width W62 of the narrow portion 2222c. The wide portion 2222a communicates with the first inlet section 2221, and the narrow portion 2222c communicates with the heat exchange chamber 223. In some embodiments, the thermal coupling surface 226 faces away from the heat exchange chamber 223, and the narrow portion 2222c communicates with the side of the central portion of the heat exchange chamber 223 away from the thermal coupling surface 226.

[0034] In some embodiments, the sub-outflow channel 224 includes two outflow sections 2241 and a converging section 2242. The two outflow sections 2241 communicate with the heat exchange chamber 223. One end of the converging section 2242 communicates with the two outflow sections 2241, and the other end of the converging section 2242 communicates with the main outflow channel 225. In some embodiments, a portion of the second inflow section 2222 (such as the narrow portion 2222c of the second inflow section 2222) is located between the two outflow sections 2241. One of the two outflow sections 2241 is partially located between the main inflow channel 221 and the second inflow section 2222, and the other of the two outflow sections 2241 is partially located between the main outflow channel 225 and the second inflow section 2222.

[0035] In some embodiments, the second cold plate 22 may further include a plurality of fins 229. These fins 229 are disposed in the heat exchange chamber 223 and extend along one of the two outflow sections 2241 toward the other.

[0036] In some embodiments, the minimum width of the sub-inlet channel 212 of the first cold plate 21 (such as the width W32 of the narrow portion 2122c) is smaller than the minimum width of the sub-inlet channel 222 of the second cold plate 22 (such as the width W62 of the narrow portion 2222c).

[0037] Next, the flow process of the coolant in the cold plate assembly 20 will be described with reference to Figures 4 and 6, and the flow direction of the coolant is indicated by dashed arrows. In the above embodiment, low-temperature coolant (not shown) flows into the main inlet channel 211 of the first cold plate 21 through the main inlet pipe 23, and a portion of the low-temperature coolant flows into the heat exchange chamber 213 through the sub-inlet channel 212, where it exchanges heat with the fins 219 in the heat exchange chamber 213. Another portion of the low-temperature coolant flows into the main inlet channel 221 of the second cold plate 22 through the first connecting pipe 25, and then flows into the heat exchange chamber 223 through the sub-inlet channel 222, where it exchanges heat with the fins 229 in the heat exchange chamber 223.

[0038] The high-temperature coolant flowing out of the heat exchange chamber 223 of the second cold plate 22 will reach the main outlet channel 225 via the sub-outlet channel 224, and then enter the main outlet channel 215 of the first cold plate 21 via the second connecting pipe 26. The high-temperature coolant flowing out of the heat exchange chamber 213 of the first cold plate 21 will reach the main outlet channel 215 via the sub-outlet channel 214 to merge with the high-temperature coolant from the second cold plate 22. Then, the merged high-temperature coolant will flow from the main outlet channel 215 of the first cold plate 21 to the main outlet pipe 24, and then reach the radiator (not shown) via a pipeline (not shown) to be cooled.

[0039] In the above embodiment, since the first cold plate 21 has a first side and a second side, the cold liquid inlet 2111 of the main inlet channel 211 and the hot liquid outlet 2152 of the main outlet channel 215 are located on the first side 217 of the first cold plate 21. The arrangement of the cold liquid outlet 2112 of the main inlet channel 211 and the hot liquid inlet 2151 of the main outlet channel 215 located on the second side 218 of the first cold plate 21 reduces the overall height of the first cold plate 21, making the first cold plate 21 suitable for use within the internal space of a server. Similarly, the arrangement of the cold liquid inlet 2211 of the main inlet channel 221 and the hot liquid outlet 2252 of the main outlet channel 225 of the second cold plate 22 located on the same side of the second cold plate 22 reduces the overall height of the second cold plate 22, making the second cold plate 22 suitable for use within the internal space of a server.

[0040] In one embodiment, the main inlet channel of the second cold plate may also have a cold liquid outlet (not shown), and the main outlet channel of the second cold plate may also have a hot liquid inlet (not shown), and the cold liquid outlet and hot liquid inlet of the second cold plate are located on the same side to be connected in series with another cold plate. That is to say, the structure of the second cold plate is the same as that of the first cold plate.

[0041] Furthermore, in the direction of the thermal coupling surface of the vertical cold plate, the main inlet channel and the main outlet channel of the cold plate do not overlap with the heat exchange chamber at all, and the main inlet channel and the main outlet channel are connected to the heat exchange chamber through sub-inlet channels and sub-outlet channels respectively. This configuration can further reduce the overall height of the cold plate, making the cold plate suitable for use in the internal space of the server. For example, comparing the cold plate with the top T-joint with the first cold plate 21 (or the second cold plate 22) of this embodiment, the overall height of the first cold plate 21 (or the second cold plate 22) of this embodiment can be reduced from 24.78mm to 19.15mm, and the heat dissipation performance of the two is similar after simulation.

[0042] Furthermore, by configuring the width W1 of the main inlet channel 211 of the first cold plate 21 to be greater than the width W2 of the first inlet section 2121 and the width (e.g., widths W31 and W32) of the second inlet section 2122, and the tapered portion 2122b of the second inlet section 2122 located between the wide portion 2122a and the narrow portion 2122c, and the width W31 of the wide portion 2122a being greater than the width W32 of the narrow portion 2122c, the pressure drop of the coolant after flowing through the main inlet channel 211 and the sub-inlet channel 212 can be adjusted. Similarly, the width design of the main inlet channel 221 and the sub-inlet channel 222 of the second cold plate 22 can achieve the aforementioned effect.

[0043] Furthermore, by configuring the minimum width of the sub-inlet channel 212 of the first cold plate 21 (e.g., the width W32 of the narrow portion 2122c) to be smaller than the minimum width of the sub-inlet channel 222 of the second cold plate 22 (e.g., the width W62 of the narrow portion 2222c), the pressure drop of the coolant flowing through the sub-inlet channel 212 of the first cold plate 21 can be greater than the pressure drop of the coolant flowing through the sub-inlet channel 222 of the second cold plate 22. In this way, the coolant can flow evenly through the first cold plate 21 and the second cold plate 22.

[0044] Next, please refer to FIG7, which shows a side view of a motherboard module 1' according to some embodiments of the present invention.

[0045] The motherboard module 1' in this embodiment is similar to the motherboard module 1 in the embodiment of FIG1. ​​The following mainly describes the differences between the two, while the same parts will not be described in detail.

[0046] In some embodiments, the first heat source 12' and the second heat source 13' of the motherboard 10' are respectively disposed on opposite surfaces 111' and 112' of the circuit board 11'. The first heat source 12' is, for example, a central processing unit or a graphics processing unit. The second heat source 13' is, for example, a voltage regulator. The first connecting pipe 25' and the second connecting pipe 26' are flexible hoses. The first connecting pipe 25' and the second connecting pipe 26' are bent around the edge of the circuit board 11' and connected to the first cold plate 21' and the second cold plate 22' located on opposite surfaces 111' and 112' of the circuit board 11'.

[0047] In the embodiment of FIG7, even though the first heat source 12' and the second heat source 13' are respectively disposed on the two opposite surfaces 111' and 112' of the circuit board 11', the overall height of the first cold plate 21' and the second cold plate 22' is reduced compared to the height of the cold plate with the three-way connector on the top, so the motherboard module 1' can still be used in the internal space of the server.

[0048] In the above embodiments, the main inlet and main outlet channels of the cold plate do not overlap with the heat exchange chamber in the direction perpendicular to the thermal coupling surface, but this is not a limitation. Please refer to Figures 8 and 9. Figure 8 shows a cross-sectional view of the cold plate 21'' of some embodiments of the present invention. Figure 9 shows another cross-sectional view of the cold plate 21'' of some embodiments of the present invention, wherein Figure 9 is drawn along the cut line 9-9 in Figure 8. The structural features of Figures 8 and 9 can be applied to other embodiments of the present invention.

[0049] The cold plate 21'' of this embodiment is similar to the first cold plate 21 of the embodiment in FIG4. The following mainly describes the differences between the two, while the same parts will not be described in detail.

[0050] In some embodiments, in the direction D perpendicular to the thermal coupling surface 216'' of the cold plate 21'', the main inlet channel 211'' and the main outlet channel 215'' of the cold plate 21'' do not overlap with the central portion 2131'' of the heat exchange chamber 213''. For example, the main inlet channel 211'' and the main outlet channel 215'' of the cold plate 21'' respectively overlap with the outer portions 2132'' located on opposite sides of the central portion 2131'' in the heat exchange chamber 213''. In some embodiments, the central portion 2131'' covers the geometric center of the heat exchange chamber 213''.

[0051] In some embodiments, the main inlet channel 211'' of the cold plate 21'' is connected to the heat exchange chamber 213'' through the sub-inlet channel 212'', and the connection point C1 between the sub-inlet channel 212'' and the main inlet channel 211'' is located at the boundary B1 of one side of the central portion 2131''.

[0052] Please refer to Figures 8 and 10 together. Figure 10 shows another perspective cross-sectional view of the cold plate according to some embodiments of the present invention, wherein Figure 10 is drawn along the cut line 10-10 in Figure 8. In some embodiments, the cold plate 21'' may include two sub-outflow channels 214'', and the two sub-outflow channels 214'' are located on opposite sides of the sub-inflow channel 212''. The main outflow channel 215'' communicates with the heat exchange chamber 213'' through the two sub-outflow channels 214'', and the connection point C2 between the main outflow channel 215'' and the two sub-outflow channels 214'' is located at the boundary B2 on the other side of the central portion 2131''.

[0053] According to the cold plate, cold plate assembly and motherboard module disclosed in the above embodiments, by having a cold plate with opposing first and second sides, the cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel of the cold plate are located on the first side of the cold plate, and the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel of the cold plate are located on the second side of the cold plate, the overall height of the cold plate can be reduced, so that the cold plate can be used in the internal space of the server.

[0054] In addition, in the direction of the heat coupling surface of the vertical cold plate, the main inlet channel and the main outlet channel of the cold plate do not overlap with the heat exchange chamber at all, and the main inlet channel and the main outlet channel are connected to the heat exchange chamber through the sub-inlet channel and the sub-outlet channel respectively. This configuration can further reduce the overall height of the cold plate, so that the cold plate can be used in the internal space of the server.

[0055] Furthermore, by means of the configuration that the width of the main inlet channel of the cold plate is greater than the width of the first inlet section and the second inlet section, the tapering part of the second inlet section is located between the wide part and the narrow part, and the width of the wide part is greater than the width of the narrow part, the pressure drop of the coolant after flowing through the main inlet channel and the sub-inlet channel can be adjusted.

[0056] Furthermore, by configuring the minimum width (e.g., the width of the narrow section) of the sub-inlet channel of the first cold plate to be smaller than the minimum width (e.g., the width of the narrow section) of the sub-inlet channel of the second cold plate, the pressure drop of the coolant flowing through the sub-inlet channel of the first cold plate can be greater than the pressure drop of the coolant flowing through the sub-inlet channel of the second cold plate. In this way, the coolant can flow evenly through the first cold plate and the second cold plate.

[0057] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]

[0010] Figure 1 shows a perspective view of a motherboard module according to some embodiments of the present invention. Figure 2 shows an exploded view of a motherboard module according to some embodiments of the present invention. Figure 3 shows a cross-sectional view of a portion of the motherboard and a first cold plate according to some embodiments of the present invention. Figure 4 shows a cross-sectional view of the first cold plate according to some embodiments of the present invention. Figure 5 shows a cross-sectional view of a portion of the motherboard and a second cold plate according to some embodiments of the present invention. Figure 6 shows a cross-sectional view of the second cold plate according to some embodiments of the present invention. Figure 7 shows a side view of a motherboard module according to some embodiments of the present invention. Figure 8 shows a cross-sectional view of the cold plate according to some embodiments of the present invention. Figure 9 shows a cross-sectional view of the cold plate according to some embodiments of the present invention from another perspective. Figure 10 shows a cross-sectional view of the cold plate according to some embodiments of the present invention from another perspective.

Claims

1. A cold plate, comprising: a main inlet channel having a cold liquid inlet and a cold liquid outlet; a sub-inlet channel connected to the main inlet channel; a heat exchange chamber connected to the sub-inlet channel; a sub-outlet channel connected to the heat exchange chamber; and a main outlet channel connected to the sub-outlet channel, having a hot liquid inlet and a hot liquid outlet; wherein, The cold plate has a first side and a second side opposite to each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side of the cold plate, and the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side of the cold plate.

2. The cold plate as described in claim 1, wherein, The cold plate forms a thermal coupling surface corresponding to the heat exchange chamber. In the direction perpendicular to the thermal coupling surface, the main inlet channel and the main outlet channel do not overlap the central part of the heat exchange chamber.

3. The cold plate as described in claim 2, wherein, In the direction perpendicular to the thermal coupling surface, the main inlet channel and the main outlet channel do not overlap with the heat exchange chamber at all.

4. The cold plate as described in claim 2, wherein, In the direction perpendicular to the thermal coupling surface, the sub-outlet channel and the sub-inlet channel overlap the heat exchange chamber.

5. The cold plate as described in claim 1, wherein the sub-inlet channel includes a first inlet section and a second inlet section, the first inlet section being connected to the main inlet channel, the second inlet section being connected to the first inlet section, and the second inlet section being not parallel to the first inlet section.

6. The cold plate as described in claim 5, wherein the width of the main inlet channel is greater than the width of the first inlet section and the second inlet section.

7. The cold plate as claimed in claim 5, wherein the second inlet section includes a wide portion, a tapered portion and a narrow portion, the tapered portion being located between and communicating with the wide portion and the narrow portion, the width of the wide portion being greater than the width of the narrow portion, the wide portion communicating with the first inlet section, and the narrow portion communicating with the heat exchange chamber.

8. The cold plate as claimed in claim 7, wherein the cold plate forms a thermal coupling surface opposite to the heat exchange chamber, and the narrow portion communicates with the side of the heat exchange chamber away from the thermal coupling surface.

9. The cold plate as claimed in claim 7, wherein the narrow portion communicates with the central portion of the heat exchange chamber.

10. The cold plate as claimed in claim 5, wherein the sub-outlet channel comprises two outlet sections and a converging section, the two outlet sections connecting to the heat exchange chamber, one end of the converging section connecting to the two outlet sections, and the other end of the converging section connecting to the main outlet channel.

11. The cold plate as claimed in claim 10, wherein a portion of the second inlet section is located between the two outlet sections, one of the two outlet sections is located partially between the main inlet channel and the second inlet section, and the other of the two outlet sections is located partially between the main outlet channel and the second inlet section.

12. The cold plate as described in claim 5, wherein the first inlet section is perpendicular to the main inlet channel and the second inlet section is perpendicular to the first inlet section.

13. The cold plate as claimed in claim 2, wherein the connection between the sub-inlet channel and the main inlet channel is located at the boundary of one side of the central portion of the heat exchange chamber.

14. The cold plate as claimed in claim 1, wherein the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are respectively connected in series to another cold plate through a first connecting pipe and a second connecting pipe, wherein the first connecting pipe and the second connecting pipe are flexible hoses.

15. A cold plate assembly, comprising: a first cold plate and a second cold plate, each comprising: a main inlet channel having a cold liquid inlet and a cold liquid outlet; a sub-inlet channel communicating with the main inlet channel; a heat exchange chamber communicating with the sub-inlet channel; a sub-outlet channel communicating with the heat exchange chamber; and a main outlet channel communicating with the sub-outlet channel, having a hot liquid inlet and a hot liquid outlet; wherein, The first cold plate and the second cold plate each have a first side and a second side opposite to each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side, and the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side. The main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate.

16. The cold plate assembly as claimed in claim 15 further includes a main liquid inlet pipe and a main liquid outlet pipe, the main liquid inlet pipe being connected to the main inlet channel of the first cold plate, and the main liquid outlet pipe being connected to the main outlet channel of the first cold plate.

17. The cold plate assembly as claimed in claim 16, wherein the minimum width of the sub-inlet channel of the first cold plate is less than the minimum width of the sub-inlet channel of the second cold plate.

18. The cold plate assembly as claimed in claim 15 further includes a first connecting pipe and a second connecting pipe, wherein the main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate through the first connecting pipe, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate through the second connecting pipe.

19. A motherboard module, comprising: a motherboard including a circuit board and a first heat source and a second heat source disposed on the circuit board; and a cold plate assembly including: a first cold plate and a second cold plate thermally coupled to the first heat source and the second heat source, respectively, and each of the first cold plate and the second cold plate including: a main inlet channel having a cold liquid inlet and a cold liquid outlet; a sub-inlet channel communicating with the main inlet channel; a heat exchange chamber communicating with the sub-inlet channel; a sub-outlet channel communicating with the heat exchange chamber; and a main outlet channel communicating with the heat exchange chamber, having a hot liquid inlet and a hot liquid outlet; wherein, The first cold plate and the second cold plate each have a first side and a second side opposite to each other. The cold liquid inlet of the main inlet channel and the hot liquid outlet of the main outlet channel are located on the first side, and the cold liquid outlet of the main inlet channel and the hot liquid inlet of the main outlet channel are located on the second side. The main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate.

20. The motherboard module as claimed in claim 19, wherein the cold plate assembly further includes a first connecting pipe and a second connecting pipe, wherein the main inlet channel of the first cold plate is connected to the main inlet channel of the second cold plate through the first connecting pipe, and the main outlet channel of the first cold plate is connected to the main outlet channel of the second cold plate through the second connecting pipe.

21. The motherboard module as described in claim 20, wherein the first heat source and the second heat source are disposed on the same surface of the circuit board.

22. The motherboard module as claimed in claim 20, wherein the first heat source and the second heat source are respectively disposed on two opposite surfaces of the circuit board.

23. The motherboard module as described in claim 22, wherein the first connecting pipe and the second connecting pipe are flexible hoses.

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