Base material cleaning apparatus

Abstract

The purpose of this disclosure is to provide a substrate cleaning apparatus that can shorten the cleaning time for removing substances adhering to the cleaning surface of a substrate. The substrate cleaning apparatus (71) includes an internal confluence nozzle (25) having a gas containing space (S25) inside. Within the gas containing space (S25), the spray gas outlet (15a) of the spray gas supply pipe (15) and the air gas outlet (16a) of the air gas supply pipe (16) are arranged opposite each other across a collision area (80), and the gas outlet surface (F25) of the internal confluence nozzle (25) is located below the collision area (80). The cleaning spray gas (MG1) and the air gas (AG1) converge due to collision in the collision area (80), and a substrate supply gas (MG3) is obtained within the gas containing space (S25).

Description

Technical Field

[0001] This disclosure relates to a substrate cleaning apparatus for cleaning substrates, for example, to a substrate cleaning apparatus used in a plating process apparatus for forming a metal film in the manufacture of electronic components. Prior Technology

[0002] As for conventional cleaning devices used in plating processes that form metal films in the manufacture of electronic components, examples of cleaning devices include the closed-type cleaning device disclosed in Patent Document 1, the substrate liquid treatment device disclosed in Patent Document 2, the substrate cleaning device disclosed in Patent Document 3, the cleaning device disclosed in Patent Document 4, and the cleaning device disclosed in Patent Document 5.

[0003] The cleaning apparatuses disclosed in Patent Documents 1 to 3 essentially clean the object by directly spraying the cleaning liquid onto it. The cleaning apparatus disclosed in Patent Document 4 performs cleaning under a spray atmosphere. The cleaning apparatus disclosed in Patent Document 5 cleans the object by directly spraying the cleaning liquid onto it placed in a spray atmosphere.

[0004] Figure 10 is a schematic diagram illustrating the configuration of a conventional substrate cleaning apparatus 78. Figure 10 shows the XYZ rectangular coordinate system. Furthermore, the substrate cleaning apparatus 78, like the cleaning apparatus disclosed in Patent Document 5, utilizes sprayed gas.

[0005] As shown in the figure, the ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside, causing it to generate a cleaning liquid spray MT. The transport gas TG is supplied to the ultrasonic atomizer 11 via the transport gas supply pipe 13.

[0006] Therefore, the cleaning liquid spray MT generated within the ultrasonic atomizer 11 is transported by the transport gas TG and formed into a cleaning spray gas MG9. This cleaning spray gas MG9 is supplied to the spray nozzle 61 via the spray supply pipe 62. Thus, the cleaning spray gas MG9 includes the cleaning liquid spray MT generated within the ultrasonic atomizer 11 and is supplied to the spray nozzle 61 via the spray supply pipe 62.

[0007] The spray nozzle 61 is disposed above the substrate 1 along the conveying path T1 of the substrate. The spray nozzle 61 supplies cleaning spray gas MG9 downward from a spray outlet (not shown) provided on the bottom surface, for example, in the form of a slit.

[0008] Therefore, by supplying a cleaning spray gas MG9 containing a cleaning liquid spray MT to the cleaning surface, i.e., surface 1s, of the substrate 1, the substances to be removed or decomposed on the surface 1s of the substrate 1 can be removed or decomposed. As a result, the substances to be removed that are the objects to be cleaned can be cleaned. [Previous Technical Documents] [Patent Literature]

[0009] Patent Document 1: Japanese Patent Application Publication No. 11-76962 Patent Document 2: Japanese Patent Publication No. 2018-501665 Patent Document 3: Japanese Patent Application Publication No. 2009-136742 Patent Document 4: Japanese Patent Application Publication No. 2020-18993 Patent Document 5: Japanese Patent Application Publication No. 2007-33730 Summary of the Invention

[0010] [The problem that the invention aims to solve] The conventional substrate cleaning apparatus 78 supplies cleaning spray gas MG9 from spray nozzle 61 to the surface 1 of substrate 1 in a fixed direction for a period of 1 second. Figure 10 shows the case where the supply direction of cleaning spray gas MG9 is the -Z direction.

[0011] On the other hand, in the conventional substrate cleaning apparatus 78, as shown in FIG10, the substrate 1, which is to be cleaned, is conveyed along the substrate conveying direction T1 (X direction) orthogonal to the supply direction (-Z direction) of the cleaning spray gas MG9.

[0012] Therefore, the supply area of ​​the cleaning spray gas MG9 supplied to the surface 1s of the substrate 1 becomes narrower, and the cleaning time for removing the entire amount of the removed material adhering to the surface 1s of the substrate 1 becomes relatively longer, which is the first problem.

[0013] Furthermore, consider the case shown in Figure 10, where a plurality of uneven regions 18 are provided on the surface 1s of the substrate 1. Each of the plurality of uneven regions 18 is composed of a combination of a recess 1a and a protrusion 1b, and each is formed to extend along the Y direction. The plurality of uneven regions 18 are arranged along the X direction. That is, the formation direction of each of the plurality of uneven regions 18, i.e., the unevenness formation direction D18, is the Y direction, and the arrangement direction of the plurality of uneven regions 18 is the X direction.

[0014] When cleaning a substrate 1 having a plurality of uneven regions 18 on its surface 1s using the substrate cleaning apparatus 78, the plurality of uneven regions 18 can become obstacles. As a result, there is a higher probability that the cleaning spray gas MG9 cannot be supplied to the entire cleaning surface of the substrate 1, i.e., the surface 1s. In particular, as shown in FIG10, this probability becomes even higher when the unevenness formation direction D18 of each of the plurality of uneven regions 18 is orthogonal to the substrate conveying direction T1 of the substrate 1.

[0015] Thus, in a conventional substrate cleaning device 78 that supplies cleaning spray gas MG9 from a single direction to the cleaning surface 1s of substrate 1, it is impossible to clean and remove the substances adhering to the surface 1s of substrate 1 without omission. This is the second problem.

[0016] The purpose of this disclosure is to provide a substrate cleaning apparatus that can solve at least the first problem among the first and second problems mentioned above, and can shorten the cleaning time for removing the material adhering to the surface of the substrate by 1 second. [Methods for solving problems]

[0017] The substrate cleaning apparatus disclosed herein includes: a spray gas supply unit for supplying cleaning spray gas containing a spray of cleaning liquid atomized into a cleaning liquid for cleaning the cleaning surface of the substrate; an air gas supply unit for supplying air gas; and an internal confluence nozzle having a gas containing space for containing the aforementioned cleaning spray gas and the aforementioned air gas. When the aforementioned cleaning spray gas and the aforementioned air gas are supplied into the aforementioned gas containing space, the aforementioned air gas is confluenced with the aforementioned cleaning spray gas to generate substrate supply gas, and the aforementioned substrate supply gas is output from an opening on a gas output surface opposite to the aforementioned cleaning surface of the substrate. [Benefits of the Invention]

[0018] The internal manifold nozzle in the substrate cleaning apparatus disclosed herein can supply substrate supply gas to a relatively wide area opposite the substrate cleaning surface by outputting the substrate supply gas from the opening of the gas output surface opposite the substrate cleaning surface.

[0019] As a result, the substrate cleaning apparatus disclosed herein can shorten the cleaning time for removing substances adhering to the cleaning surface of the substrate.

[0020] The purpose, features, features and advantages of this disclosure will become clearer from the following detailed description and accompanying drawings. Simple Explanation of the Diagram

[0021] Figure 1 is a schematic diagram showing the configuration of the substrate cleaning apparatus of Embodiment 1. Figure 2 is a schematic diagram showing the cross-sectional structure of the gas containing space in the internal manifold nozzle shown in Figure 1. Figure 3 is a schematic diagram showing the basic state of the substrate cleaning apparatus of Embodiment 1. Figure 4 is a schematic cross-sectional view showing the structure of the rotating mechanism. Figure 5 is an explanatory diagram showing the planar structure of the spray plate of the first state sample. Figure 6 is an explanatory diagram showing the planar structure of the spray plate of the second state. Figure 7 is an explanatory diagram showing the planar structure of the spray plate of the third state sample. Figure 8 is an explanatory diagram showing the planar structure of the spray plate of the fourth state sample. Figure 9 is a schematic diagram illustrating the composition of the substrate cleaning apparatus in Embodiment 2. Figure 10 is a schematic diagram illustrating the structure of a conventional substrate cleaning apparatus. Implementation

[0022] <Implementation Type 1> Figure 1 is a schematic diagram showing the configuration of the substrate cleaning apparatus 71, which is an embodiment 1 of the substrate cleaning apparatus disclosed herein. The XYZ rectangular coordinate system is shown in Figure 1.

[0023] As shown in the figure, the substrate cleaning device 71 of Embodiment 1 has a spray gas supply unit, an air gas supply unit, and a rotating mechanism 30 (not shown in Figure 1) as its main components.

[0024] The spray gas supply system includes an ultrasonic atomizer 11, a conveying gas supply pipe 13 and a spray gas supply pipe 15 as its main components, and the air gas supply system includes an air gas supply pipe 16.

[0025] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside, causing it to generate a cleaning liquid spray MT. The transport gas TG is supplied to the ultrasonic atomizer 11 via the transport gas supply pipe 13.

[0026] Therefore, the cleaning liquid spray MT generated within the ultrasonic atomizer 11 is transformed into cleaning spray gas MG1 by being transported by the transport gas TG. This cleaning spray gas MG1 is supplied to the internal manifold nozzle 25 via the spray gas supply pipe 15. The spray gas supply pipe 15 is arranged such that it extends from the outside of the internal manifold nozzle 25 through the upper surface of the internal manifold nozzle 25 to the gas containing space S25 described later.

[0027] Thus, the cleaning spray gas MG1 contains the cleaning liquid spray MT generated in the ultrasonic atomizer 11, and is supplied to the gas containment space S25 of the internal manifold nozzle 25 via the spray gas supply pipe 15.

[0028] The air supply pipe 16 is installed in such a way that it passes through the upper surface of the internal manifold nozzle 25 from the outside of the internal manifold nozzle 25 and extends into the gas containing space S25. Therefore, air AG1 is supplied to the gas containing space S25 of the internal manifold nozzle 25 via the air supply pipe 16.

[0029] Figure 2 is a schematic diagram showing the cross-sectional structure of the internal space of the internal manifold nozzle 25, i.e., the gas containing space S25. The figure illustrates the XYZ rectangular coordinate system.

[0030] The internal manifold nozzle 25 has a cylindrical structure and an internal gas containing space S25. As shown in Figure 2, the spray gas supply pipe 15 is arranged to extend from the outside through the upper surface of the internal manifold nozzle 25 into the gas containing space S25, and supplies the cleaning spray gas MG1 into the gas containing space S25. The spray gas supply pipe 15 is arranged to extend in the -Z direction within the gas containing space S25 and bend at the midpoint so that the front end extends in the +X direction.

[0031] On the other hand, the air supply pipe 16 is installed in such a way that it extends from the outside through the upper surface of the internal manifold nozzle 25 into the gas containing space S25, and supplies air AG1 into the gas containing space S25. The air supply pipe 16 is installed in such a way that it extends in the -Z direction within the gas containing space S25 and is bent at the midpoint so that the front end extends in the -X direction.

[0032] The spray gas supply piping 15 outputs the cleaning spray gas MG1 from the spray gas outlet 15a along the +X direction, and the air gas supply piping 16 outputs the air gas AG1 from the air gas outlet 16a along the -X direction.

[0033] The spray gas outlet 15a and the air gas outlet 16a are configured to face each other across the collision area 80 within the gas containing space S25, and the gas outlet surface F25, which is the bottom surface of the internal confluence nozzle 25, is located below the collision area 80.

[0034] Therefore, when the cleaning spray gas MG1 is supplied to the gas containing space S25 via the spray gas supply pipe 15, and the air gas AG1 is supplied to the gas containing space S25 via the air gas supply pipe 16, the cleaning spray gas MG1 and the air gas AG1 merge due to collision in the collision area 80, and a substrate supply gas MG3 mixed with the cleaning spray gas MG1 and the air gas AG1 is obtained.

[0035] Furthermore, the distances between the spray gas outlet 15a and the collision zone 80, the distances between the air gas outlet 16a and the collision zone 80, the flow rate VA1 of the air gas AG1, and the flow rate VM1 of the cleaning spray gas MG1 are set so that the cleaning spray gas MG1 and the air gas AG1 will inevitably collide in the collision zone 80. In addition, the flow rate VM1 of the cleaning spray gas MG1 is determined by the flow rate of the transport gas TG.

[0036] The substrate supply gas MG3 diffuses further down from the collision region 80 along the diffusion direction DR3, and is supplied from the opening provided on the gas output surface F25 (not shown in Figure 2) to the surface 1s of the substrate 1 below.

[0037] Thus, in the substrate cleaning apparatus 71 of Embodiment 1, the internal manifold nozzle 25 has a gas containing space S25 for containing cleaning spray gas MG1 and air gas AG1. When the cleaning spray gas MG1 and air gas AG1 are supplied into the gas containing space S25, the air gas AG1 is drawn into the cleaning spray gas MG1 to generate substrate supply gas MG3. Furthermore, the internal manifold nozzle 25 outputs the substrate supply gas MG3 from the opening of the gas output surface F25, which is opposite to the cleaning surface of the substrate 1, i.e., surface 1s.

[0038] Therefore, the substrate supply gas MG3 diffused within the gas containment space S25 of the internal confluence nozzle 25 can be output from the opening of the gas output surface F25 to a relatively wide area of ​​the substrate 1 surface 1s.

[0039] For example, by setting the shape of the opening of the gas output surface F25 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0040] Figure 3 is a schematic diagram showing the basic form of the substrate cleaning apparatus 71 of Embodiment 1, which includes an internal confluence nozzle 25 with a spray plate 40. The figure illustrates the XYZ rectangular coordinate system.

[0041] As shown in the figure, the internal confluence nozzle 25 has a spray plate 40 as a gas output surface F25, and the spray plate 40 is provided with a plurality of spray holes 50 as openings. The plurality of spray holes 50, each circular, are arranged discretely around the entire spray plate 40.

[0042] Therefore, the basic form of the substrate cleaning device 71 of embodiment 1 can output the substrate supply gas MG3, which diffuses in the gas containing space S25 of the internal confluence nozzle 25, from a plurality of ejection holes 50 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0043] For example, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1 by setting the shape of the plurality of ejector holes 50 to be the same as the shape of the surface 1s of the substrate 1. In addition, the shape of the plurality of ejector holes 50 is formed such that the circumference is approximately circular by a line connecting a predetermined number of ejector holes 50 that are located on the outermost periphery of the plurality of ejector holes 50.

[0044] The substrate 1 is rotated along either rotation direction R1 or rotation direction R2 by the rotation action of the rotation mechanism 30 described later. The surface 1s of this substrate 1 serves as a cleaning surface. Rotation direction R1 is the first rotation direction, and rotation direction R2 is the second rotation direction, which is the opposite of rotation direction R1.

[0045] Figure 4 is a schematic cross-sectional view showing the structure of the rotating mechanism 30 that rotates the substrate 1 along the rotation direction R1 or the rotation direction R2. The figure illustrates the XYZ rectangular coordinate system. System.

[0046] As shown in the figure, the rotating mechanism 30 includes a mounting platform 31, a plurality of vibration absorbing members 32, a rotating platform 33, a vibration motor 34, a rotation motor 35, and a motor control unit 36 ​​as its main components. The plurality of vibration absorbing members 32 are preferably arranged at equal intervals on the relatively outer regions of the substrate mounting portion 31a and the support surface 33a. Furthermore, Figure 4 shows two vibration absorbing members 32 as a plurality of vibration absorbing members 32.

[0047] The mounting platform 31 has a substrate mounting portion 31a and a vibration transmission portion 31b. The substrate mounting portion 31a has a surface for supporting the substrate 1 from the back side, and the vibration transmission portion 31b is provided to extend downward from the center of the back side of the substrate mounting portion 31a. The mounting platform 31 supports the substrate 1 from the back side with good stability on the surface of the substrate mounting portion 31a.

[0048] The rotating platform 33 has a support surface 33a, a motor housing 33b, and a rotating shaft member 33c. The motor housing 33b houses most of the vibration motor 34 and the vibration transmission part 31b. The rotating shaft member 33c is provided at the bottom of the vibration transmission part 31b, and the rotating platform 33 is configured to rotate with the rotating shaft member 33c as the rotating axis.

[0049] The vibration motor 34 is connected to the lower part of the vibration transmission unit 31b and performs a platform vibration operation that imparts vibration to the substrate mounting part 31a and the substrate 1 via the vibration transmission unit 31b.

[0050] The substrate mounting part 31a of the mounting platform 31 and the support surface 33a of the rotating platform 33 are connected by a plurality of vibration absorbing members 32. The plurality of vibration absorbing members 32 connect the mounting platform 31 and the rotating platform 33 so that they can rotate relative to each other and have vibration absorption function. As vibration absorbing members 32, elastic members such as springs can be considered, for example.

[0051] The rotary motor 35 is located below the rotary platform 33 and is connected to the rotary shaft member 33c, and performs a platform rotation action that rotates the rotary platform 33 with the rotary shaft member 33c as the rotation center.

[0052] The motor control unit 36 ​​controls the platform rotation operation performed by the rotary motor 35. When the rotary motor 35 performs the platform rotation operation under the control of the motor control unit 36, the rotary platform 33 rotates, and the mounting platform 31 connected to the rotary platform 33 via a plurality of vibration absorption members 32 rotates in conjunction with the rotation of the rotary platform 33, and rotates while mounting the substrate 1.

[0053] Thus, when the platform rotates, the mounting platform 31, which is connected to the rotating platform 33 via a plurality of vibration absorbing components 32, rotates while the substrate 1 is mounted on it.

[0054] As shown in Figures 1 and 3, the rotation direction of the substrate 1 includes rotation directions R1 and R2 that are opposite to each other. Rotation directions R1 and R2 are the first and second rotation directions, respectively.

[0055] The motor control unit 36, which functions as a motor rotation control unit, executes the platform rotation action. The platform rotation action includes rotation direction control processing and rotation speed control processing. The rotation direction control processing and rotation speed control processing are processes that can be performed during the execution of the platform rotation action.

[0056] The rotation direction control process allows switching between rotation directions R1 and R2. The rotation speed control process changes the rotation speed along the rotation direction (rotation direction R1 or rotation direction R2).

[0057] The vibration motor 34 performs platform vibration by transmitting vibration to the substrate mounting portion 31a via the vibration transmission unit 31b. The motor control unit 36 ​​also functions as a motor vibration control unit to control the aforementioned platform vibration performed by the vibration motor 34.

[0058] The motor control unit 36, which also functions as a motor vibration control unit, controls the vibration motor 34 and the rotation motor 35 in a manner that executes the platform vibration action in parallel with the platform rotation action. In addition, the platform vibration action includes vibration number variation processing, which changes the number of vibrations applied to the substrate 1 per unit time.

[0059] Thus, the motor control unit 36 ​​serves as both a motor rotation control unit and a motor vibration control unit, controlling the execution of the platform rotation action performed by the rotation motor 35 and the platform vibration action performed by the vibration motor 34.

[0060] The substrate cleaning apparatus 71 configured in this way performs a substrate cleaning process, as shown below, to clean the surface of the substrate 1, which is to be cleaned, in 1 second.

[0061] The spray gas supply unit supplies cleaning spray gas MG1 from the spray gas supply pipe 15 to the internal manifold nozzle 25, and the air gas supply unit supplies air gas AG1 from the air gas supply pipe 16 to the internal manifold nozzle 25.

[0062] The internal confluence nozzle 25 causes air gas AG1 to converge into cleaning spray gas MG1 within the gas containment space S25 to generate substrate supply gas MG3, and outputs substrate supply gas MG3 from a plurality of spray holes 50 (openings) of the spray plate 40 (gas output surface F25) which is opposite to the cleaning surface, i.e., surface 1s of the substrate 1.

[0063] As a result, the substrate supply gas MG3 obtained by the convergence of the cleaning spray gas MG1 and the air gas AG1 is supplied to the surface of the substrate 1 for 1s.

[0064] On the other hand, the rotating mechanism 30, under the control of the motor control unit 36 ​​which functions as a motor rotation control unit, causes the rotating motor 35 to perform a platform rotation action, and causes the substrate 1 to rotate in the rotation direction R1 or the rotation direction R2.

[0065] Thus, during the execution of the platform rotation action performed by the rotation mechanism 30, the substrate supply gas MG3 obtained in the gas containment space S25 of the internal confluence nozzle 25 is supplied to the cleaning surface of the substrate 1, i.e., the surface 1s.

[0066] The motor control unit 36 ​​enables the rotary motor 35 to perform platform rotation operations that include the aforementioned rotation direction control processing and rotation speed control processing.

[0067] For example, during the supply period of the substrate supply gas MG3 to the surface of the substrate 1 for 1 second, the rotation direction of the substrate 1 can be changed sequentially to rotation direction R1, rotation direction R2, rotation direction R1 and rotation direction R2, and the rotation speed can also be changed.

[0068] Furthermore, the rotating mechanism 30, under the control of the motor control unit 36 ​​which functions as a motor vibration control unit, causes the vibration motor 34 to perform platform vibration, thereby imparting vibration to the substrate 1. Thus, the rotating mechanism 30 has the vibration function of imparting vibration to the substrate 1 in an indeterminate direction.

[0069] Therefore, the substrate cleaning apparatus 71 of this embodiment can perform the supply process of supplying substrate gas MG3 to the surface of substrate 1 for 1 second, the platform rotation operation, and the platform vibration operation in parallel. Furthermore, the platform rotation operation includes rotation direction control processing and rotation speed control processing, and the platform vibration operation includes vibration number variation processing to change the number of vibrations applied to substrate 1 per unit time.

[0070] In addition, the substrate mounting part 31a of the mounting platform 31 and the support surface 33a of the rotating platform 33 are connected by a plurality of vibration absorbing members 32. Each of the plurality of vibration absorbing members 32 has a vibration absorption function, so the vibration of the substrate mounting part 31a caused by the vibration of the platform can be absorbed by the plurality of vibration absorbing members 32.

[0071] Therefore, the vibration transmission from the substrate mounting part 31a of the mounting platform 31 to the support surface 33a of the rotating platform 33 can be effectively suppressed by a plurality of vibration absorbing components 32, so that the platform rotation will not be affected by the platform vibration.

[0072] (effect) In the basic form of the substrate cleaning apparatus 71 of Embodiment 1, the internal confluence nozzle 25 can supply substrate supply gas MG3 to a relatively wide area facing the surface 1s of the substrate 1 by outputting the substrate supply gas MG3 from a plurality of ejection holes 50 (openings) of the spray plate 40 (gas output surface F25) which is opposite to the cleaning surface 1s of the substrate 1.

[0073] As a result, the substrate cleaning apparatus 71 of Embodiment 1 can shorten the cleaning time for removing the material adhering to the surface of the substrate 1 by 1 second.

[0074] In the substrate cleaning apparatus 71 of Embodiment 1, the spray gas outlet 15a of the spray gas supply pipe 15 and the air gas outlet 16a of the air gas supply pipe 16 are configured to face each other across the collision area 80 within the gas containing space S25.

[0075] Therefore, when the cleaning spray gas MG1 and the air gas AG1 are supplied to the gas containing space S25, the cleaning spray gas MG1 output from the spray gas outlet 15a and the air gas AG1 output from the air gas outlet 16a merge due to collision in the collision area 80 to obtain the substrate supply gas MG3.

[0076] The substrate supply gas MG3 diffuses further downwards when mixed with the cleaning spray gas MG1 and the air gas AG1.

[0077] Furthermore, a substrate supply gas MG3, which is mixed with cleaning spray gas MG1 and air gas AG1 and is in a diffused state, is supplied to the cleaning surface of the substrate 1, i.e., the surface 1s, from a plurality of spray holes 50 (openings) of the spray plate 40 (gas output surface F25) located below the collision area 80.

[0078] Therefore, the substrate cleaning apparatus 71 of embodiment 1 can supply a substrate supply gas MG3 containing the cleaning spray gas MG1 to a relatively wide area of ​​the surface 1s of the substrate 1 while supplying the cleaning spray gas MG1 from the spray gas supply pipe 15.

[0079] Furthermore, the substrate cleaning device 71 of Embodiment 1 rotates the substrate 1 by rotating the rotating mechanism 30. Therefore, even if there is an uneven area 18 on the surface 1s of the substrate 1, it can effectively suppress the spray dead zone area where the substrate supply gas MG3 cannot be supplied. It can cover the entire surface 1s and supply the substrate supply gas MG3 with good precision.

[0080] As a result, the substrate cleaning apparatus 71 of embodiment 1 can improve the cleaning efficiency of cleaning the removed material adhering to the surface 1s of the substrate 1.

[0081] (The appearance of the spray plate) (First state sample) Figure 5 is an explanatory diagram showing the planar structure of the spray plate 41 in the first embodiment. The figure illustrates the XYZ rectangular coordinate system. The first embodiment of the substrate cleaning apparatus 71 has the spray plate 41 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0082] As shown in Figure 5, the injection plate 41, which serves as the gas output surface F25, is circular in the XY plane. The injection plate 41 has a plurality of ejection holes 51 as openings of the gas output surface F25. The plurality of ejection holes 51 are at least three first-type ejection holes, each circular in shape.

[0083] For example, the nozzles 51a to 51c in Figure 5 are not on the same straight line on the spray plate 41. That is, the nozzles 51a to 51c are not on the same straight line when viewed from above.

[0084] Thus, the plurality of ejection holes 51 include at least three first-type ejection holes (e.g., ejection holes 51a to 51c) on the ejection plate 41 that are not on the same straight line when viewed from above.

[0085] The first embodiment of the substrate cleaning apparatus 71 can supply the substrate gas MG3 to the surface 1s of the substrate 1 by outputting the substrate supply gas MG3 from a plurality of ejection holes 51 including at least 3 first type ejection holes, and supplying the substrate supply gas MG3 to the surface 1s of the substrate 1 in a relatively wide area including a plane with at least 3 first type ejection holes as vertices.

[0086] As a result, the first state of the substrate cleaning device 71 of embodiment 1 can supply substrate supply gas MG3 to a relatively wide area of ​​the surface of substrate 1 within 1 second.

[0087] For example, by setting the shape of a plurality of ejection holes 51 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0088] Furthermore, in Figure 5, the shape of the plurality of ejection holes 51 is formed such that the circumference is approximately circular, with a line connecting a predetermined number of ejection holes 51 located on the outermost periphery. In this case, it is preferable that the surface 1s of the substrate 1 is circular.

[0089] (Second-state sample) Figure 6 is an explanatory diagram showing the planar structure of the spray plate 42 in the second embodiment. The figure illustrates the XYZ rectangular coordinate system. The second embodiment of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 42 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0090] As shown in Figure 6, the injection plate 42, which serves as the gas output surface F25, is circular in the XY plane. The injection plate 42 has a plurality of ejection holes 52 as openings of the gas output surface F25. The plurality of ejection holes 52 are a plurality of second-type ejection holes, each being a slit-shaped elongated rectangle with a predetermined direction as its long side.

[0091] With the predetermined direction (long side direction) of each of the plurality of second-type ejection holes 52 aligned with the radial direction starting from the center point C42 of the spray plate 42, the plurality of ejection holes 52 are arranged radially from the center point C42 of the spray plate 42. Furthermore, the plurality of ejection holes 52 are evenly arranged along the circumferential direction centered on the center point C42. Figure 6 shows the state in which eight ejection holes 52 are arranged radially at equal intervals along the circumferential direction.

[0092] In the second embodiment of the substrate cleaning device 71 of embodiment type 1, the substrate supply gas MG3 is output to the surface 1s of the substrate 1 from a plurality of nozzles 52, each of which is slit-shaped and arranged radially.

[0093] Therefore, the second embodiment of the substrate cleaning device 71 of embodiment 1 can supply substrate supply gas MG3 to a relatively wide area of ​​the surface 1 of the substrate 1.

[0094] For example, by setting the shape of a plurality of ejection holes 52 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0095] Furthermore, in Figure 6, the plurality of ejection holes 52 are arranged at relatively close intervals, so that the shape of the plurality of ejection holes 52 is approximately circular with the center point C42 as the center. In this case, it is preferable that the surface 1s of the substrate 1 is circular.

[0096] (Third state) Figure 7 is an explanatory diagram showing the planar structure of the spray plate 43 in the third embodiment. The figure illustrates the XYZ rectangular coordinate system. The third embodiment of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 43 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0097] As shown in Figure 7, the injection plate 43, which serves as the gas output surface F25, is circular in the XY plane. The injection plate 43 has a plurality of ejection holes 51 and a plurality of ejection holes 52 as openings of the gas output surface F25. The plurality of ejection holes 51 are a plurality of first-type ejection holes, each circular in shape. The plurality of ejection holes 52 are a plurality of second-type ejection holes, each slit-shaped with a predetermined direction as its long side.

[0098] The plurality of ejector holes 51, being a plurality of first-type ejector holes, are classified into different predetermined groups according to each predetermined quantity. In the configuration shown in Figure 7, the plurality of ejector holes 51 are classified into groups of 8 (predetermined groups) in groups of "3" (predetermined quantity). Group.

[0099] In a configuration where a predetermined number of nozzles 51 are arranged in a radial direction from the center point C43 of the spray plate 43 when viewed from above, the plurality of nozzles 51 are arranged radially from the center point C43 according to a predetermined number of groups.

[0100] In the configuration shown in Figure 7, the three ejector holes 51 in the same group are arranged on the same straight line when viewed from above, along the radial direction starting from the center point C43. They are evenly arranged radially with the center point C43 as the center in eight group units.

[0101] On the other hand, with each of the plurality of second-type ejection holes 52 having its predetermined direction (long side direction) aligned with the radial direction starting from the center point C43 of the ejection plate 43, the plurality of ejection holes 52 are arranged radially from the center point C43 of the ejection plate 43. Furthermore, the plurality of ejection holes 52 are evenly arranged along the circumferential direction centered on the center point C43. Figure 7 shows the state in which eight ejection holes 52 are evenly spaced along the circumferential direction.

[0102] Furthermore, as shown in Figure 7, among the plurality of ejector holes 51 and the plurality of ejector holes 52, the three ejector holes 51 and the one ejector hole 52 that are classified into eight groups and are located on the same straight line when viewed from above are arranged alternately along the circumferential direction.

[0103] The third embodiment of the substrate cleaning device 71 of embodiment type 1 can output substrate supply gas MG3 from a plurality of spray holes 51 and a plurality of spray holes 52 arranged radially in a predetermined group unit, thereby outputting substrate supply gas MG3 from the plurality of spray holes 51 and a plurality of spray holes 52 to the surface 1s of substrate 1.

[0104] As a result, the third state of the substrate cleaning device 71 of embodiment 1 can supply substrate supply gas MG3 to a relatively wide area of ​​the surface of substrate 1 within 1 second.

[0105] For example, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1 by setting the combined shape formed by the plurality of ejection holes 51 and the plurality of ejection holes 52 to be the same as the shape of the surface 1s of the substrate 1.

[0106] Furthermore, in Figure 7, the combined shape is approximately circular with the center point C43 as the center by arranging a plurality of ejection holes 51 and a plurality of ejection holes 52 at relatively close intervals. In this case, it is preferable that the surface 1s of the substrate 1 is circular.

[0107] (Fourth-state pattern) Figure 8 is an explanatory diagram showing the planar structure of the spray plate 44 in the fourth embodiment. The figure illustrates the XYZ rectangular coordinate system. The fourth embodiment of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 44 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0108] As shown in Figure 8, the injection plate 44, which serves as the gas output surface F25, is circular in the XY plane. The injection plate 44 has a plurality of ejection holes 53 that serve as openings for the gas output surface F25. department.

[0109] Each of the plurality of third-type ejection holes 53 is annular, and its size (radius) varies among the plurality of ejection holes 53.

[0110] A plurality of ejector holes 53, which are a plurality of third-type ejector holes, are arranged such that their respective centers coincide with the center point C44 of the spray plate 44. In the configuration shown in Figure 8, the three ejector holes 53 are arranged such that they do not overlap with each other, with the center point C44 as the center.

[0111] In the fourth embodiment of the substrate cleaning device 71, the substrate supply gas MG3 is output to the surface 1s of the substrate 1 from a plurality of annular nozzles 53 arranged in a manner that makes their centers aligned.

[0112] As a result, the fourth state of the substrate cleaning device 71 of embodiment 1 can supply substrate supply gas MG3 to a relatively wide area of ​​the surface 1 of the substrate 1 in 1s.

[0113] For example, by setting the shape of a plurality of ejection holes 53 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0114] Furthermore, in Figure 8, the plurality of ejection holes 53 are arranged at relatively close intervals, so that the shape of the plurality of ejection holes 53 is approximately circular with the center point C44 as the center. In this case, it is preferable that the surface 1s of the substrate 1 is circular.

[0115] <Implementation Type 2> Figure 9 is a schematic diagram illustrating the configuration of the substrate cleaning apparatus 72, which is embodiment 2 of the substrate cleaning apparatus disclosed herein. The XYZ rectangular coordinate system is shown in Figure 9.

[0116] As shown in the figure, the substrate cleaning apparatus 72 of Embodiment 2 includes a spray gas supply unit, an air gas supply unit, and a rotating mechanism 30 (not shown), which will be described later, as its main components. white.

[0117] In addition to the ultrasonic atomizer 11, the conveying gas supply piping 13, and the atomizing gas supply piping 15, the spray gas supply system also includes a flow regulator 5 as a main component. In addition to the air gas supply piping 16, the air gas supply system also includes a flow regulator 6 as a main component.

[0118] Hereinafter, the same symbols will be added to the same components as those of the substrate cleaning apparatus 71 of Embodiment 1 shown in Figures 1 to 8, and the description will be omitted as appropriate. The description will focus on the features of the substrate cleaning apparatus 72 of Embodiment 2.

[0119] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside, causing it to generate a cleaning liquid spray MT. The transport gas TG is supplied to the ultrasonic atomizer 11 via the flow regulator 5 and the transport gas supply piping 13.

[0120] The flow regulator 5, which functions as a spray gas supply control unit, has the function of adjusting the flow rate of the transport gas TG within the range of "0" to a first maximum adjustment value (>0). Therefore, the flow rate of the transport gas TG, that is, the flow rate VM1 of the cleaning spray gas MG1, is adjusted by the flow regulator 5.

[0121] The flow regulator 5 of the spray gas supply control unit can perform: spray gas efficiency control processing, which controls whether to supply the cleaning spray gas MG1 to the internal manifold nozzle 25 by adjusting the flow rate of the transport gas TG to "0" or a flow rate other than "0" that has an effective meaning. That is, when the flow rate is set to "0" by the flow regulator 5, the supply of cleaning spray gas MG1 to the internal manifold nozzle 25 is blocked; when a flow rate other than "0" that has an effective meaning is set, the supply of cleaning spray gas MG1 to the internal manifold nozzle 25 is executed. Give.

[0122] Therefore, when the flow regulator 5 sets the flow rate of the transport gas TG to a valid flow rate that is not "0", the cleaning liquid spray MT generated in the ultrasonic atomizer 11 will be formed into cleaning spray gas MG1 due to being transported by the transport gas TG.

[0123] The cleaning spray gas MG1 is supplied to the gas containing space S25 of the internal manifold nozzle 25 via the spray gas supply pipe 15.

[0124] The flow regulator 6, which functions as an air supply control unit, has the function of adjusting the flow rate of air AG1 within the range of "0" to the second maximum flow rate value (>0). Therefore, the flow rate of air AG1, that is, the flow velocity VA1 of air AG1, is adjusted by the flow regulator 6.

[0125] The flow regulator 6 of the air supply control unit can perform: air gas efficiency control processing, which controls whether air gas AG1 supplies air gas to the internal manifold nozzle 25 by adjusting the flow rate of air gas AG1 to "0" or a flow rate other than "0" that has an effective meaning. That is, when the flow rate is set to "0" by the flow regulator 6, the supply of air gas AG1 to the internal manifold nozzle 25 is blocked; when a flow rate other than "0" that has an effective meaning is set, the supply of air gas AG1 to the internal manifold nozzle 25 is enabled.

[0126] Therefore, when the flow regulator 6 sets the flow rate of air gas AG1 to a valid flow rate that is not "0", air gas AG1 is supplied to the gas receiving space S25 of the internal manifold nozzle 25 via the air gas supply pipe 16.

[0127] The substrate cleaning device 72 of Embodiment 2, in addition to the functions of the substrate cleaning device 71 of Embodiment 1, also achieves the following functions.

[0128] The substrate cleaning apparatus 72 of Embodiment 2 can perform spray gas efficiency control processing by the flow regulator 5 of the spray gas supply control unit and air gas efficiency control processing by the flow regulator 6 of the air gas supply control unit.

[0129] Therefore, by means of effective control of spray gas and effective control of air gas, the substrate supply gas MG3 generated in the gas containment space S25 of the internal manifold nozzle 25 can be set to three gas types: a combination of cleaning spray gas and air gas, only cleaning spray gas, and only air gas.

[0130] Therefore, the substrate cleaning apparatus 72 of embodiment 2 can supply the surface 1s of the substrate 1 with a mixed gas obtained by combining the cleaning spray gas MG1 and the air gas AG1, or with only the cleaning spray gas MG1 and only the air gas AG1 as the substrate supply gas MG3.

[0131] For example, when applying a cleaning agent to the surface 1s of the substrate 1, which is to be cleaned, and dissolving and removing the coating on the cleaned surface (i.e., surface 1s) through a chemical reaction with the agent, it is preferable to supply a substrate supply gas MG3, which is only of the type of cleaning spray gas MG1, to the surface 1s of the substrate 1. Therefore, the supply of cleaning spray gas MG1 is set to be active by the spray gas activation control process of the flow regulator 5, and the supply of air gas AG1 is set to be inactive by the air gas activation control process of the flow regulator 6.

[0132] Furthermore, when removing oil, fine particulate matter, rust, etc., adhering to the surface 1 of the substrate 1, it is preferable to supply a substrate supply gas MG3, which is a mixed gas obtained by combining the cleaning spray gas MG1 and the air gas AG1, to the surface 1 of the substrate 1 for 1 second. Therefore, the supply of the cleaning spray gas MG1 is set to be effective by the spray gas optimization control process of the flow regulator 5, and the supply of the air gas AG1 is set to be effective by the air gas optimization control process of the flow regulator 6.

[0133] Furthermore, during the drying process following the washing of the surface of the substrate 1 to be cleaned for 1 second, it is preferable to supply the substrate supply gas MG3, which is only of the air gas AG1 type, to the surface of the substrate 1 for 1 second. Therefore, the supply of the cleaning spray gas MG1 is set to be disabled by the spray gas activation control process of the flow regulator 5, and the supply of air gas AG1 is set to be enabled by the air gas activation control process of the flow regulator 6.

[0134] Thus, the substrate cleaning device 72 of embodiment type 2 can select any one of the three gas types as the substrate supply gas MG3 output, so the substrate supply gas MG3 can be used according to the cleaning purpose.

[0135] When the supply of cleaning spray gas MG1, which is performed by spray gas efficiency control treatment, and the supply of air gas AG1, which is performed by air gas efficiency control treatment, are both set to be effective, the substrate cleaning apparatus 72 of Embodiment 2 achieves the following additional effects.

[0136] That is, implementation type 2 achieves the following additional effect: by adjusting the flow rate VM1 of the cleaning spray gas MG1 by the flow regulator 5, and by adjusting the flow rate VA1 of the air gas AG1 by the flow regulator 6, it can be adjusted so that the substrate supply gas MG3 is output from the opening of the gas output surface F25.

[0137] Alternatively, the first on / off valve can be used instead of the flow regulator 5 as a first modification of the spray gas supply control unit. In the first modification, the effective control process of controlling whether or not the supply of cleaning spray gas MG1 to the internal manifold nozzle 25 is performed by setting the first on / off valve to an "open" / "closed" state.

[0138] Similarly, a second on / off valve can be used instead of the flow regulator 6 as a second modification of the air supply control unit. In the second modification, the air supply efficiency control process of the air supply AG1 to the internal manifold nozzle 25 can be performed by setting the second on / off valve to an "open" / "closed" state.

[0139] <Other> In the above-described embodiment, although an ultrasonic atomizer 11 using ultrasonic vibration is shown as an atomizer for generating the cleaning spray gas MG1, other atomizers that generate the cleaning spray gas MG1 from the cleaning liquid by methods other than ultrasonic vibration can be used instead of the ultrasonic atomizer 11.

[0140] In the above embodiments, although the internal manifold nozzle 25 with a cylindrical structure is shown, the internal manifold nozzle can also be constructed as a conical structure with a circular bottom surface (gas output surface F25) and a conical top surface, a prismatic structure with both the top and bottom surfaces being polygonal, or a pyramidal structure with a polygonal bottom surface and a conical top surface. However, the following requirements for the generation of the substrate supply gas MG3 must be met.

[0141] Generation conditions: When both cleaning spray gas MG1 and air gas AG1 are supplied, the cleaning spray gas MG1 and air gas AG1 merge due to collision in the gas containing space, and the supply gas MG3, which is a base gas mixed with the cleaning spray gas MG1 and air gas AG1, diffuses more and more as it goes down.

[0142] In addition, when the internal confluence nozzle is constructed with a conical or pyramidal structure, the spray gas supply pipe 15 and the air gas supply pipe 16 are configured to extend into the gas containment space by passing through the side of the internal confluence nozzle.

[0143] Furthermore, the spray plates 41 to 44 of the first to fourth states shown in Figures 5 to 8 are each circular, but they can also be configured as a three-dimensional structure that is recessed into a hemispherical or conical shape. A hemispherical three-dimensional structure refers to a hemispherical structure that is circular when viewed from above, with its center point being the highest point on the +Z direction side. A conical structure refers to a conical structure that is circular when viewed from above, with its center point being the highest point on the +Z direction side.

[0144] Thus, spray plates that are actually circular in shape (41 to 44) can be replaced by a three-dimensional structure that is circular in shape when viewed from above, or a three-dimensional structure that is circular in shape when viewed from above, and is recessed into a conical shape. That is, the spray plates with the three-dimensional structure that is recessed into a hemispherical shape and the three-dimensional structure that is recessed into a conical shape appear circular when viewed from above, which is the same characteristic as spray plates 41 to 44.

[0145] Furthermore, in the aforementioned variations, although the top view shape is circular, it can also be changed to a polygonal shape, forming a concave pyramidal three-dimensional structure. A concave pyramidal three-dimensional structure refers to a pyramidal structure that is polygonal in top view and whose center point is the highest point on the +Z direction side.

[0146] Furthermore, in the above-described embodiment, the substrate 1 is rotated by the rotating mechanism 30, but it can also be configured such that the substrate 1, which is to be cleaned, is kept stationary while the substrate 1 is supplied with substrate supply gas MG3 from the internal confluence nozzle 25.

[0147] This disclosure has provided detailed explanations, but the above explanations are illustrative in all cases, and this disclosure is not limited thereto. It can be understood that numerous variations not illustrated can be considered without departing from the scope of this disclosure.

[0148] 1: Substrate 1a: concave part 1b:convex part 1s: surface 5,6: Flow regulator 11: Ultrasonic Atomizer 13: Gas supply piping 15: Spray gas supply piping 15a: Spray gas outlet 16: Air and gas supply piping 16a: Air outlet 18: Concave and convex areas 23: Side view 25: Internal manifold nozzle 30: Rotating mechanism 31: Platform 31a: Substrate mounting section 31b: Vibration Transmission Section 32: Vibration Absorbing Components 33: Rotating Platform 33a: Support surface 33b: Motor Housing Section 33c: Rotating shaft component 34: Vibration motor 35: Rotary motor 36: Motor Control Unit 40, 41, 42, 43, 44: Spraying plates 50, 51, 52, 53, 51a to 51c: Ejector holes 61: Spray nozzle 62: Spray supply piping 71, 72, 78: Substrate cleaning device 80: Collision Zone AG1: Air gas C42, C43, C44: Center point D18: Direction of Concavity / Convexity Formation DR3: Diffusion direction F25: Gas outlet surface MG1, MG9: Cleaning spray gas MG3: Gas for supplying substrate MT: Cleaning solution spray R1, R2: Rotation direction S25: Gas containment space T1:Substrate conveying direction TG: Gas Transport

Claims

1. A substrate cleaning apparatus comprising: a spray gas supply unit for supplying a cleaning spray gas containing a cleaning liquid atomized into a spray for cleaning the cleaning surface of a substrate; an air gas supply unit for supplying air gas; and an internal confluence nozzle having a gas containing space for containing the cleaning spray gas and the air gas, wherein when the cleaning spray gas and the air gas are supplied into the gas containing space, the air gas is confluenced with the cleaning spray gas to generate a substrate supply gas, and the substrate supply gas is output from an opening of a gas output surface opposite to the cleaning surface of the substrate; the spray gas supply unit includes a spray gas supply pipe that is provided to extend from the outside of the internal confluence nozzle into the gas containing space, and supplies the cleaning spray gas into the gas containing space; The aforementioned air supply unit includes an air supply pipe that extends from the outside of the aforementioned internal manifold nozzle into the aforementioned gas containment space and supplies the aforementioned air into the aforementioned gas containment space.

2. The substrate cleaning apparatus as described in claim 1, wherein, The aforementioned spray gas supply piping system outputs the aforementioned cleaning spray gas from the spray gas outlet; the aforementioned air gas supply piping system outputs the aforementioned air gas from the air gas outlet; the aforementioned spray gas outlet and the aforementioned air gas outlet are configured to face each other across the collision area within the aforementioned gas containing space; the aforementioned gas outlet surface is located below the aforementioned collision area.

3. The substrate cleaning apparatus as described in claim 1 or 2, wherein, The aforementioned gas output surface has at least three first-type ejection holes, each of which is circular, and the opening of the aforementioned gas output surface includes the aforementioned at least three first-type ejection holes; the aforementioned at least three first-type ejection holes are not located on the same straight line when viewed from above.

4. The substrate cleaning apparatus as described in claim 1 or 2, wherein, The aforementioned gas output surface is circular when viewed from above; the aforementioned gas output surface has a plurality of second-type ejection holes, each of the aforementioned plurality of second-type ejection holes being a slit with a predetermined direction as its long side, and the opening of the aforementioned gas output surface includes the aforementioned plurality of second-type ejection holes; with the aforementioned predetermined direction of each of the aforementioned plurality of second-type ejection holes aligned with the radial direction from the center of the aforementioned gas output surface, the aforementioned plurality of second-type ejection holes are arranged radially from the center of the aforementioned gas output surface.

5. The substrate cleaning apparatus as described in claim 1 or 2, wherein, The aforementioned gas output surface is circular when viewed from above; the aforementioned gas output surface has a plurality of first-type ejection holes and a plurality of second-type ejection holes, and the opening of the aforementioned gas output surface includes the aforementioned plurality of first-type ejection holes and the aforementioned plurality of second-type ejection holes; the aforementioned plurality of first-type ejection holes are each circular and are classified into different predetermined groups according to each predetermined number; the aforementioned plurality of second-type ejection holes are each slit-shaped with a predetermined direction as the long side direction; in the case that the aforementioned predetermined number of first-type ejection holes are arranged on the same straight line from the center of the aforementioned gas output surface along the radial direction according to each of the aforementioned predetermined groups, the aforementioned plurality of first-type ejection holes are arranged radially from the center of the aforementioned gas output surface according to the aforementioned predetermined group units; With the predetermined direction of each of the aforementioned plurality of second-type ejector holes aligned with the radial direction from the center of the aforementioned gas output surface, the aforementioned plurality of second-type ejector holes are arranged radially from the center of the aforementioned gas output surface.

6. The substrate cleaning apparatus as described in claim 1 or 2, wherein, The aforementioned gas output surface is circular when viewed from above; the aforementioned gas output surface has a plurality of third-type ejection holes, each of the aforementioned plurality of third-type ejection holes being annular in shape, and their sizes differing among the aforementioned plurality of third-type ejection holes; the opening of the aforementioned gas output surface includes the aforementioned plurality of third-type ejection holes; the aforementioned plurality of third-type ejection holes are arranged such that the center of each of the aforementioned plurality of third-type ejection holes coincides with the center of the aforementioned gas output surface.

7. The substrate cleaning apparatus as described in claim 1 or 2, wherein, The aforementioned spray gas supply unit includes a spray gas supply control unit, which performs: spray gas efficiency control processing, which controls whether to supply the aforementioned cleaning spray to the aforementioned internal manifold nozzle; the aforementioned air gas supply unit includes an air gas supply control unit, which performs: air gas efficiency control processing, which controls whether to supply the aforementioned air gas to the aforementioned internal manifold nozzle.

8. The substrate cleaning apparatus as described in claim 1 or 2 further includes a rotating mechanism that performs a rotating action to rotate the aforementioned substrate along the rotation direction.

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