Liquid multi-nozzle jet-impingement cooling device

Abstract

A liquid multi-nozzle jet impact cooling device may include a micro-jet multi-nozzle plate, an outlet plate, an inlet plate, an outlet flow plate, and a cover plate. The cover plate is coupled to the outlet flow plate, which in turn is coupled to the inlet plate, the outlet plate, and the micro-jet multi-nozzle plate. A first inlet port of the cover plate is fluidly coupled to the outlet ports of one or more sub-outlet portions of the cover plate, which are respectively fluidly coupled to the cavities of the micro-jet multi-nozzle plate. The cavities are hermetically mountable to the surface of a processor. A plurality of third inlet arrays of the micro-jet multi-nozzle plate guide the coolant to the surface of the processor, and a plurality of first outlet arrays of the micro-jet multi-nozzle plate guide the coolant away from the surface of the processor.

Description

Technical Field

[0001] This invention relates to a heat transfer element and assembly, particularly but not limited to a liquid multi-nozzle jet impact cooling device. Prior Technology

[0002] Direct liquid cooling (DLC), cold plate cooling, or direct-to-chip (DTC) circulates coolant through a cavity containing a flat metal plate, such as a cold plate. The flat metal plate comes into thermal contact with a heat source, such as a CPU or GPU, and the coolant absorbs heat generated by the heat source as it flows through the cavity. The heated coolant then leaves the cavity and is either cooled in a heat exchanger or discharged.

[0003] Thermal resistance is the ratio of the temperature difference (in degrees Celsius) between the heat source and the coolant temperature to a given heat load (in watts). The lower the thermal resistance, the better the cooling performance of a flat metal plate and heat source layer.

[0004] Generally, the interface between a heat source and a flat metal plate has microscopic irregularities and roughness. Air gaps between the interfaces hinder heat conduction, thus increasing thermal resistance. Typically, thermal interface materials (TIMs) are used to fill these air gaps to improve heat transfer between the interfaces. Among various TIMs, thermal paste and thermal grease allow the flat metal plate to be disassembled for maintenance, repair, or component replacement.

[0005] However, improper application, thickness, and pressure can lead to poor thermal performance of the thermal interface material. In addition, natural degradation over time or pump-out during direct die contact can also prevent the thermal interface material from effectively removing heat from the heat source.

[0006] Therefore, how to reduce thermal resistance between the flat metal plate and the heat source layer, eliminate natural degradation, and avoid pumping out when the thermal interface material directly contacts the grains, while also ensuring that the flat metal plate can be effectively disassembled during maintenance, repair, or component replacement, remains a challenge. Summary of the Invention

[0007] This invention provides a liquid multi-nozzle jet impact cooling device with a high heat transfer rate.

[0008] A first-structured multi-nozzle jet impingement cooling device for cooling a processor includes a micro-jet multi-nozzle plate, an outlet plate, an inlet plate, an outlet flow plate, and a cover plate. The micro-jet multi-nozzle plate includes a cavity with a top. The top includes multiple third inlet arrays, multiple first outlet arrays, and a bottom opening. The bottom opening is opposite to the top. The outlet plate is coupled to the micro-jet multi-nozzle plate. The outlet plate includes an outlet setting portion and one or more first outlet channels. The outlet setting portion includes an outlet bottom having multiple guide wall structures and multiple second outlet arrays. Each guide wall structure includes a second inlet array. The inlet plate is coupled to the outlet plate. The inlet plate includes an inlet setting portion and one or more second outlet channels. The outlet flow plate is coupled to the inlet plate. The outlet flow plate includes a second inlet through-hole and one or more third outlet channels. The cover plate is coupled to the outlet flow plate. The cover plate includes a first inlet through-hole and one or more sub-outlet settings portions. Each sub-outlet configuration includes a liquid outlet through-hole. A first liquid inlet through-hole is centrally located within a cover plate. One or more sub-outlet configurations are disposed within the cover plate on one side of the first liquid inlet through-hole. The first liquid inlet through-hole is fluidly coupled to the cavity through a second liquid inlet through-hole, an inlet configuration, each of the second inlet arrays of the guide wall structure, and a third inlet array. The liquid outlet through-hole is fluidly coupled to the cavity through one or more sub-outlet configurations, one or more third liquid outlet channels, one or more second liquid outlet channels, and the first outlet array. The cavity is hermetically mountable on a surface of the processor, and the third inlet array guides a coolant downwards toward the surface of the processor. The first outlet array guides the coolant upwards in a direction away from the surface of the processor.

[0009] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the inlet configuration includes an inlet bottom. The inlet bottom includes a plurality of first inlet arrays. Second liquid inlet orifices are fluidly coupled to each of the second inlet arrays of a guide wall structure through the first inlet arrays.

[0010] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein a first inlet of each first inlet array includes a first inlet diameter. A second inlet of each second inlet array includes a second inlet diameter. A third inlet of a third inlet array includes a third inlet diameter, and wherein a first outlet of each first outlet array includes a first outlet diameter. A second outlet of each second outlet array includes a second outlet diameter. The first, second, and third inlet diameters correspond to inlet sizes. The first and second outlet diameters correspond to outlet sizes. The first, second, and third inlet diameters are smaller than the first and second outlet diameters.

[0011] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein each first outlet array is located between each adjacent third inlet array, and each second outlet array is located between each adjacent guide wall structure.

[0012] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the outlet plate further comprises multiple flow channels. The flow channels are defined between each adjacent flow wall structure. One or more first outlet channels are fluidly coupled to a second outlet array through the flow channels.

[0013] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the microjet multi-nozzle plate further comprises multiple needle-like fins. Each needle-like fin is located between each adjacent first outlet array and third inlet array.

[0014] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein a cavity is centrally located within a micro-jet multi-nozzle plate. An outlet portion is centrally located within an outlet plate, and an inlet portion is centrally located within an inlet plate. One or more first outlet channels are located on an outlet periphery of the outlet portion, one or more second outlet channels are located on an inlet periphery of the inlet portion, and one or more third outlet channels are aligned with one or more second outlet channels.

[0015] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein one or more first liquid outlet channels comprise a first extended elliptical shape and two first liquid outlet channels. One or more second liquid outlet channels comprise a second extended elliptical shape and two second liquid outlet channels. One or more third liquid outlet channels comprise a third extended elliptical shape and two third liquid outlet channels. One or more sub-outlet configurations comprise a quadrilateral shape and two sub-outlet configurations. Each pair of first liquid outlet channels is located on a plurality of opposing first peripheral sides in the outlet configuration. Each pair of second liquid outlet channels is located on a plurality of opposing second peripheral sides in the inlet configuration. Each pair of third liquid outlet channels is aligned with one or more second liquid outlet channels. Each pair of third liquid outlet channels is aligned with each pair of sub-outlet configurations.

[0016] In some cases, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein one or more second liquid outlet channels are not fluidly coupled to the inlet setting.

[0017] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, further comprising an inlet pipe and one or more outlet pipes. The inlet pipe passes through a first inlet port and a second inlet port. One or more outlet pipes pass through each outlet port of one or more sub-outlet configurations. The inlet pipe is fluidly coupled to the inlet configuration. The one or more outlet pipes are fluidly coupled to one or more sub-outlet configurations.

[0018] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the inlet pipe has an input diameter and each or more outlet pipes has an output diameter. The input diameter is larger than the output diameter.

[0019] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device. One or more outlet pipes comprise two outlet pipes. One or more sub-outlet configurations comprise two sub-outlet configurations.

[0020] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the micro-jet multi-nozzle plate further includes a groove and a seal. A bottom opening defines a periphery of a cavity, and the groove surrounds the periphery of the cavity. The seal is disposed in the groove to sealably mount the cavity to the surface of the processor.

[0021] In some cases, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, wherein the processor includes a semiconductor device mounted on a printed circuit board.

[0022] In some embodiments, the technology described herein relates to a liquid multi-nozzle jet impingement cooling device, further comprising a plurality of fasteners for securing the liquid multi-nozzle jet impingement cooling device to a printed circuit board. The cover plate further comprises a plurality of cover plate securing through holes configured to surround a periphery of one or more sub-outlet settings. The liquid outlet flow plate further comprises a plurality of flow plate securing through holes configured to surround a third periphery including one or more third liquid outlet channels. The liquid inlet plate further comprises a plurality of liquid inlet plate securing through holes configured to surround a second periphery including an inlet setting and one or more second liquid outlet channels. The liquid outlet plate further comprises a plurality of liquid outlet plate securing through holes configured to surround a first periphery including an outlet setting and the one or more first liquid outlet channels. The micro-jet multi-nozzle plate further comprises a plurality of nozzle plate securing through holes configured to surround a periphery of a cavity. The cover plate fastening through holes are aligned with the flow plate fastening through holes, the flow plate fastening through holes are aligned with the liquid inlet plate fastening through holes, the liquid outlet plate fastening through holes, and the nozzle plate fastening through holes. Simple Explanation of the Diagram

[0023] Unless otherwise stated, the relevant diagrams are illustrated herein to depict the state of the innovative subject matter. Please refer to the diagrams, where similar reference numerals in various diagrams refer to similar components, and various examples of liquid multi-nozzle jet impact cooling devices in accordance with the principles disclosed herein are presented by way of example only and are not intended to be limiting. Figure 1A illustrates a perspective view of a liquid multi-nozzle jet impact cooling device according to various embodiments of the present invention. Figure 1B illustrates an exploded view of the liquid multi-nozzle jet impact cooling device in Figure 1A according to various embodiments of the present invention. Figure 2 is a perspective view of the cover plate of the liquid multi-nozzle jet impact cooling device in Figure 1A according to various embodiments of the present invention. Figure 3 illustrates the inner edge of the cover plate and the liquid outlet plate in Figure 2 according to various embodiments of the present invention. Figure 4 illustrates the inner edge of the inlet plate of the liquid multi-nozzle jet impact cooling device in Figure 1A and another perspective view of the outlet plate in Figure 3, according to various embodiments of the present invention. Figure 5 is a perspective view of the liquid outlet plate of the liquid multi-nozzle jet impacting the cooling device in Figure 1A according to various embodiments of the present invention. Figure 6 is a perspective view of the micro-jet multi-nozzle plate of the liquid multi-nozzle jet impact cooling device in Figure 1A according to various embodiments of the present invention. Figure 7A illustrates the inner edge and cleavage line A-A' of the liquid multi-nozzle jet impact cooling device in Figure 1A according to various embodiments of the present invention. Figure 7B illustrates a side sectional view of the liquid multi-nozzle jet impact cooling device in Figure 7A along line A-A' according to various embodiments of the present invention. Figure 8A illustrates the inner edge and cleavage line B-B' of the liquid multi-nozzle jet impact cooling device in Figure 1A according to various embodiments of the present invention. Figure 8B illustrates a side sectional view of the liquid multi-nozzle jet impact cooling device in Figure 8A along line B-B' according to various embodiments of the present invention. Figure 9A is a perspective view of another micro-jet multi-nozzle plate of the liquid multi-nozzle jet impact cooling device in Figure 1A, according to various embodiments of the present invention. Figure 9B illustrates another perspective view of another microjet multi-nozzle plate in Figure 9A according to various embodiments of the present invention. Figure 10A illustrates the inner edge and cleavage line C-C' of another liquid multi-nozzle jet impact cooling device in Figure 9A according to various embodiments of the present invention. Figure 10B illustrates a side cross-section along line C-C' of the liquid multi-nozzle jet impact cooling device in Figure 10A according to various embodiments of the present invention. Figure 11A illustrates a perspective view of another liquid multi-nozzle jet impact cooling device according to various embodiments of the present invention. Figure 11B illustrates another perspective view of the liquid multi-nozzle jet impact cooling device in Figure 11A according to various embodiments of the present invention. Figure 11C is an exploded view of the liquid multi-nozzle jet impact cooling device in Figure 11A according to various embodiments of the present invention. Figure 12 is a perspective view of the cover plate of the liquid multi-nozzle jet impact cooling device in Figure 11A according to various embodiments of the present invention. Figure 13 illustrates the inner edge of the cover plate and the perspective view of the liquid outlet plate in Figure 12 according to various embodiments of the present invention. Figure 14A illustrates the inner edge and cleavage line D-D' of the liquid multi-nozzle jet impact cooling device in Figure 11A according to various embodiments of the present invention. Figure 14B illustrates a side sectional view along line D-D' of the liquid multi-nozzle jet impact cooling device in Figure 14A according to various embodiments of the present invention. Figure 15A illustrates the inner edge and sectional line E-E' of another liquid multi-nozzle jet impact cooling device according to various embodiments of the present invention. Figure 15B illustrates a side sectional view along line E-E' of the liquid multi-nozzle jet impact cooling device in Figure 15A according to various embodiments of the present invention. Implementation

[0024] The following describes various principles relating to elements and assemblies of a processor cooled by a liquid multi-nozzle jet impingement cooling device, including specific arrangements and examples of plates and channels implementing innovative concepts. Specifically, but not limited to, such innovative principles are described in relation to selected examples of an array of inlets that guides the coolant downward toward the processor surface and an array of outlets that guides the coolant upward toward a direction away from the processor surface, and conventional functions or constructions are not described in detail here for the sake of brevity and clarity. Nevertheless, one or more of the principles disclosed herein can be incorporated into various other embodiments of different inlet and outlet arrays to achieve any various desired results, characteristics, and / or performance standards.

[0025] Therefore, plates and channels with properties different from the specific examples discussed herein can implement one or more innovative principles and can be used in applications not described in detail herein. Thus, those skilled in the art will recognize upon reviewing the invention that embodiments of inlet and outlet arrays not described in detail herein also fall within the scope of the invention.

[0026] The exemplary embodiments disclosed herein relate to a liquid multi-nozzle jet impact cooling device that can be used as part of a cooling loop in a cooling system to dissipate a large amount of heat circulated through the coolant inside a metal plate. The liquid multi-nozzle jet impact cooling device can be used to cool electronic components, such as high-performance processors used in data center servers or other electronic components that generate high heat loads during operation. Processors can include central processing units (CPUs), graphics processing units (GPUs), neural network processing units (NPUs), tensor processing units (TPUs), etc. The coolant is typically a mixture of water and ethylene glycol, but other fluids such as oils, dielectric fluids, or custom heat transfer fluids can also be used. The cooling system can include liquid cooling plates, cooling pipes (lines and piping), fans, one or more pumps, and additional heat transfer devices (e.g., radiators). Some cooling systems may also include manifolds, one or more expansion tanks, and cooling distribution units.

[0027] Figures 1A to 8B illustrate a liquid multi-nozzle jet impingement cooling device 100 according to various embodiments of the present invention. A first-construction liquid multi-nozzle jet impingement cooling device 100 for a cooling processor 140 includes a micro-jet multi-nozzle plate 150, a liquid outlet plate 130, a liquid inlet plate 120, a liquid outlet flow plate 160, and a cover plate 170. The micro-jet multi-nozzle plate 150 includes a cavity 155 having a top. The top includes a plurality of third inlet arrays 153, a plurality of first outlet arrays 158, and a bottom opening 157. The bottom opening 157 is opposite to the top. The liquid outlet plate 130 is coupled to the micro-jet multi-nozzle plate 150. The liquid outlet plate 130 includes an outlet setting portion 136 and one or more first liquid outlet channels 135. The outlet setting portion 136 includes a liquid outlet bottom having a plurality of guide wall structures 133 and a plurality of second outlet arrays 138. Each guide wall structure 133 includes a second inlet array 134. An inlet plate 120 is coupled to an outlet plate 130. The inlet plate 120 includes an inlet portion 127 and one or more second outlet channels 125. An outlet plate 160 is coupled to the inlet plate 120. The outlet plate 160 includes a second inlet through-hole 161 and one or more third outlet channels 165. A cover plate 170 is coupled to the outlet plate 160. The cover plate 170 includes a first inlet through-hole 171 and one or more sub-outlet portions 175. Each of the one or more sub-outlet portions 175 includes an outlet through-hole 178. The first inlet through-hole 171 passes centrally through the cover plate 170. The one or more sub-outlet portions 175 are disposed on one side of the first inlet through-hole 171 and within the cover plate 170. The first inlet port 171 is fluidly coupled to the cavity 155 through the second inlet port 161, the inlet setting 127, the various second inlet arrays 134 of the flow guide wall structures 133, and the third inlet arrays 153. The outlet port 178 is fluidly coupled to the cavity 155 through one or more sub-outlet settings 175, one or more third outlet channels 165, one or more second outlet channels 125, and the first outlet arrays 158. The cavity 155 is hermetically mounted on the surface of the processor 140, and the third inlet arrays 153 guide the coolant downwards toward the surface of the processor 140. The first outlet arrays 158 guide the coolant upwards in a direction away from the processor 140.

[0028] The microjet multi-nozzle plate 150, liquid outlet plate 130, liquid inlet plate 120, liquid outlet flow plate 160, and cover plate 170 can be made of metal. For example, the material forming the microjet multi-nozzle plate 150, liquid outlet plate 130, liquid inlet plate 120, liquid outlet flow plate 160, and cover plate 170 can include metals with high thermal conductivity, such as aluminum, copper, and their alloys. Any combination of the microjet multi-nozzle plate 150, liquid outlet plate 130, liquid inlet plate 120, liquid outlet flow plate 160, and cover plate 170 can be integrally molded. For example, the liquid outlet plate 130, liquid inlet plate 120, liquid outlet flow plate 160, and cover plate 170 can be integrally formed, and the micro-jet multi-nozzle plate 150 can be replaced with a new or customized micro-jet multi-nozzle plate. Alternatively, for example, the liquid outlet plate 130 and liquid inlet plate 120 can be integrally formed, the liquid outlet flow plate 160 and cover plate 170 can be integrally formed, and the liquid outlet flow plate 160 / cover plate 170 and the micro-jet multi-nozzle plate 150 can be replaced with new or customized liquid outlet flow plates / cover plates and micro-jet multi-nozzle plates, respectively. The surface of the processor 140 can be a processor die or a heat spreader processor cover plate, or an integrated heat spreader (IHS). The processor 140 can include a central processing unit (CPU), a graphics processing unit (GPU), a neural network processing unit (NPU), or a tensor processing unit (TPU). In some embodiments, the processor 140 includes semiconductor elements mounted on a printed circuit board (PCB).

[0029] In some embodiments, the inlet configuration 127 includes a liquid inlet bottom. The liquid inlet bottom includes a plurality of first inlet arrays 123. Second liquid inlet through-holes 161 are fluidly coupled to each of the second inlet arrays 134 of the flow guide wall structures 133 through these first inlet arrays 123.

[0030] In some embodiments, each first outlet array 158 is situated between each of the adjacent third inlet arrays 153, and each second outlet array 138 is situated between each of the adjacent flow-guiding wall structures 133. In some embodiments, the liquid outlet plate 130 further includes a plurality of flow-guiding channels 137. These flow-guiding channels 137 are defined between each of the adjacent flow-guiding wall structures 133. One or more first liquid outlet channels 135 are fluidly coupled to the second outlet arrays 138 through these flow-guiding channels 137.

[0031] In some embodiments, the cavity 155 is centrally disposed in the microjet multi-nozzle plate 150, the outlet portion 136 is centrally disposed in the liquid outlet plate 130, and the inlet portion 127 is centrally disposed in the liquid inlet plate 120. One or more first liquid outlet channels 135 are disposed on the outlet periphery side of the outlet portion 136, one or more second liquid outlet channels 125 are disposed on the inlet periphery side of the inlet portion 127, and one or more third liquid outlet channels 165 are aligned with one or more second liquid outlet channels 125. In some embodiments, one or more first liquid outlet channels 135 include a first extended elliptical shape and two first liquid outlet channels 135. One or more second liquid outlet channels 125 include a second extended elliptical shape and two second liquid outlet channels 125. One or more third liquid outlet channels 165 include a third extended elliptical shape and two third liquid outlet channels 165. One or more sub-outlet configurations 175 include a quadrilateral shape and two sub-outlet configurations 175. Two first liquid outlet channels 135 are each located on opposite first peripheral sides of the outlet configuration 136. Two second liquid outlet channels 125 are each located on opposite second peripheral sides of the inlet configuration 127. Two third liquid outlet channels 165 are each aligned with one or more second liquid outlet channels 125. Each of the two third liquid outlet channels 165 is aligned within each of the two sub-outlet configurations 175. In some embodiments, one or more second liquid outlet channels 125 are not fluidly coupled to the inlet configuration 127.

[0032] In some embodiments, the first inlet of each first inlet array 123 includes a first inlet diameter, the second inlet of each second inlet array 134 includes a second inlet diameter, and the third inlet of each third inlet array 153 includes a third inlet diameter; wherein the first outlet of each first outlet array 158 includes a first outlet diameter, and the second outlet of each second outlet array includes a second outlet diameter. The first inlet diameter, second inlet diameter, and third inlet diameter correspond to inlet sizes. The first outlet diameter and second outlet diameter correspond to outlet sizes. The first inlet diameter, second inlet diameter, and third inlet diameter are smaller than the first outlet diameter and the second outlet diameter. Each first inlet diameter, second inlet diameter, and third inlet diameter can include diameters between 0.05 mm and 0.1 mm (inclusive). The diameters of each first outlet diameter and second outlet diameter can include diameters between 0.05 mm and 0.1 mm (inclusive).

[0033] In some embodiments, the first inlet diameter, the second inlet diameter, and the third inlet diameter are equal to the first outlet diameter and the second outlet diameter. In some embodiments, the first inlet diameter, the second inlet diameter, and the third inlet diameter are greater than the first outlet diameter and the second outlet diameter.

[0034] In some embodiments, the liquid multi-nozzle jet impact cooling device 100 further includes an inlet pipe 110 and one or more outlet pipes 180. The inlet pipe 110 passes through a first inlet port 171 and a second inlet port 161 to supply coolant from components or devices of the cooling system to the surface of the processor 140. One or more outlet pipes 180 pass through respective outlet ports 178 of one or more sub-outlet locations 175 to transfer coolant from the surface of the processor 140 to components or devices in the cooling system for cooling. The inlet pipe 110 is fluidly coupled to an inlet location 127. The one or more outlet pipes 180 are fluidly coupled to one or more sub-outlet locations 175. In some embodiments, the inlet pipe 110 includes an input diameter, and each outlet pipe 180 includes an output diameter. The input diameter is larger than the output diameter. In some embodiments, the one or more outlet pipes 180 include two outlet pipes 180. One or more sub-outlet setting units 175 include two sub-outlet setting units 175.

[0035] In some embodiments, the input diameter is equal to the output diameter. In some embodiments, the input diameter is smaller than the output diameter.

[0036] In some embodiments, the microjet multi-nozzle plate 150 further includes a groove 156 and a seal 151. The seal 151 is disposed on the side of the microjet multi-nozzle plate 150 away from the liquid outlet plate 130. A bottom opening 157 defines a periphery of a cavity, and the groove 156 surrounds the periphery of the cavity. The seal 151 is disposed within the groove 156 to sealably mount the cavity 155 to the surface of the processor 140. When viewed facing the groove 156, the groove 156 can be square or rectangular, and can be columnar, with its external dimensions (width and length) smaller than the corresponding dimensions of the surface of the processor 140 having the same shape, and its internal dimensions larger than the corresponding dimensions of the inner wall surface of the cavity 155 having the same shape. When viewed from above, the microjet multi-nozzle plate 150, liquid outlet plate 130, liquid inlet plate 120, liquid outlet flow plate 160 and cover plate 170 together can form a square or rectangle, and are prismatic in shape.

[0037] In some embodiments, the groove and seal can be further configured to surround the periphery of the inlet pipe 110, each of one or more outlet pipes 180, each of one or more sub-outlet portions 175, the inlet portion 127, each of one or more second outlet channels 125, the outlet portion 136, and each of one or more first outlet channels 135, and are disposed on opposite sides of the periphery of the bottom opening 157. In one example, the seal 151 can be a gasket or any form of seal that impinges a liquid multi-nozzle jet onto the surface of the processor 140.

[0038] In some embodiments, the liquid multi-nozzle jet impact cooling device 100 further includes a plurality of fasteners 199 for mechanically securing the liquid multi-nozzle jet impact cooling device 100 to a printed circuit board along the thickness direction. The cover plate 170 further includes a plurality of cover plate securing through holes 179 configured to surround the periphery of one or more sub-outlet settings 175. The liquid outlet flow plate 160 further includes a plurality of flow plate securing through holes 169 configured to surround a third periphery including one or more third liquid outlet channels 165. The liquid inlet plate 120 further includes a plurality of liquid inlet plate securing through holes 129 configured to surround a second periphery including an inlet setting 127 and one or more second liquid outlet channels 125. The liquid outlet plate 130 further includes a plurality of liquid outlet plate securing through holes 139 configured to surround a first periphery including an outlet setting 136 and one or more first liquid outlet channels 135. The microjet multi-nozzle plate 150 further includes a plurality of nozzle plate fastening through holes 159 configured to surround the periphery of the cavity 155. These cover plate fastening through holes 179 are aligned with these flow plate fastening through holes 169, with these liquid inlet plate fastening through holes 129, with these liquid outlet plate fastening through holes 139, and with these nozzle plate fastening through holes 159.

[0039] Figures 9A to 10B illustrate another liquid multi-nozzle jet impingement cooling device 104 according to various embodiments of the present invention. This other liquid multi-nozzle jet impingement cooling device 104 may be similar in some respects to the liquid multi-nozzle jet impingement cooling device 100 in Figures 1A to 8B, and therefore can be best understood with reference to it, with similar reference numerals indicating similar elements, which will not be described further. In some embodiments, the microjet multi-nozzle plate 152 further includes a plurality of pin fins 154. Each pin fin 154 is located between each of the adjacent first outlet arrays 158 and third inlet arrays 153. These pin fins 154 are substantially perpendicular to the processor 140 and are used to achieve low thermal resistance. For example, the cross-sectional shape of one or more pin fins may include circular, elliptical, prismatic, square, and triangular shapes. These pin fins 154 enhance heat transfer and support a cavity 155 of a predetermined height above the surface of the processor 140.

[0040] During operation, coolant is pumped through inlet pipe 110, via first inlet port 171 and second inlet port 161, into the center of inlet configuration 127 and across the bottom surface of inlet configuration 127. The coolant is then forced through the third inlet arrays 153 via the respective second inlet arrays 134 of the guide wall structures 133 aligned with these third inlet arrays 153, and a first group of inlet arrays aligned with the respective second inlet arrays 134 of these guide wall structures 133. The coolant then enters cavity 155 and converges on the surface of processor 140, thereby absorbing heat from processor 140. In some embodiments including pin-shaped fins 154, the coolant flows through these pin-shaped fins 154, increasing their thermal conductivity surface area and promoting fluid mixing, thereby enhancing heat transfer. The heated coolant is then forced through the second outlet arrays 138 aligned with these second outlet arrays 138. The heated coolant then flows through these guide channels 137 to one or more first outlet channels 135, and then through one or more second outlet channels 125 aligned with one or more first outlet channels 135 and one or more third outlet channels 165 aligned with one or more second outlet channels 125 to one or more sub-outlet locations 175. Through one or more outlet pipes 180, the heated coolant flows out from the liquid multi-nozzle jet impact cooling device 100 / 104 through one or more outlet orifices 178.

[0041] Figures 11A to 14B illustrate another liquid multi-nozzle jet impingement cooling device 100A according to various embodiments of the present invention. This other liquid multi-nozzle jet impingement cooling device 100A may be similar in some respects to the liquid multi-nozzle jet impingement cooling device 100 in Figures 1A to 8B, and therefore can be understood in the best manner by reference thereto, with similar reference numerals indicating similar elements, which will not be described again. The second configuration of the liquid multi-nozzle jet impingement cooling device 100A for a cooling processor 140 includes a micro-jet multi-nozzle plate 150, an outlet plate 130, an inlet plate 120, an outlet flow plate 160, and a modified cover plate 170A. The micro-jet multi-nozzle plate 150 includes a cavity 155 having a top. The top includes these third inlet arrays 153, these first outlet arrays 158, and a bottom opening 157. The bottom opening 157 is relative to the top. The outlet plate 130 is coupled to the micro-jet multi-nozzle plate 150. The liquid outlet plate 130 includes an outlet setting 136 and one or more first liquid outlet channels 135. The outlet setting 136 includes an outlet bottom having these guide wall structures 133 and these second outlet arrays 138. Each guide wall structure 133 includes a second inlet array 134. The liquid inlet plate 120 is coupled to the liquid outlet plate 130. The liquid inlet plate 120 includes an inlet setting 127 and one or more second liquid outlet channels 125. The liquid outlet flow plate 160 is coupled to the liquid inlet plate 120. The liquid outlet flow plate 160 includes a second liquid inlet through-hole 161 and one or more third liquid outlet channels 165. A modified cover plate 170A is coupled to the liquid outlet flow plate 160. The modified cover plate 170A includes a converging through-hole 173 and a modified sub-outlet setting 177. The converging through-hole 173 centrally passes through the modified cover plate 170A and the modified sub-outlet setting 177. The modified sub-outlet setting 177 is centrally located in the modified cover plate 170A. Through the various second inlet arrays 134 of these guide wall structures 133 and through these third inlet arrays 153, the converging through-hole 173 is fluidly coupled to the cavity 155 and the inlet setting 127 via a liquid pipe 110 passing through the converging through-hole 173 and the second liquid inlet through-hole 161. The converging through-hole 173 is fluidly coupled to the cavity 155 via a modified outlet pipe 180A configured to surround the inlet pipe 110, and is fluidly coupled to the modified sub-outlet setting 177 via the converging through-hole 173, through one or more third liquid outlet channels 165, through one or more second liquid outlet channels 125, i.e., through these first outlet arrays 158. The inlet pipe 110 passes through the converging through-hole 173 and the second liquid inlet through-hole 161 to supply coolant from components or devices of the cooling system to the surface of the processor 140. The modified outlet pipe 180A passes through the converging through-hole 173 to transfer coolant from the surface of the processor 140 to components or devices of the cooling system for cooling. The inlet pipe 110 is fluidly coupled to the inlet setting 127. The modified outlet pipe 180A is fluidly coupled to the modified sub-outlet setting 177.Cavities 155 are hermetically mounted on the surface of processor 140, and the third inlet arrays 153 guide coolant downwards towards the surface of processor 140. The first outlet arrays 158 guide coolant upwards in a direction away from the surface of processor 140. In some embodiments, processor 140 includes semiconductor devices mounted on a printed circuit board.

[0042] In some embodiments, the inlet configuration 127 includes an inlet bottom. The inlet bottom includes the first inlet arrays 123. The second liquid inlet through-holes 161 are fluidly coupled to the respective second inlet arrays 134 of the flow guide wall structures 133 through the first inlet arrays 123.

[0043] In some embodiments, each first outlet array 158 is situated between each adjacent third inlet array 153, and each second outlet array 138 is situated between each adjacent flow barrier structure 133. In some embodiments, the outlet plate 130 further includes flow channels 137. These flow channels 137 are defined between each adjacent flow barrier structure 133. One or more first outlet channels 135 are fluidly coupled to the second outlet arrays 138 through these flow channels 137.

[0044] In some embodiments, the cavity 155 is centrally disposed in the microjet multi-nozzle plate 150, the outlet portion 136 is centrally disposed in the liquid outlet plate 130, and the inlet portion 127 is centrally disposed in the liquid inlet plate 120. One or more first liquid outlet channels 135 are disposed on the outlet periphery side of the outlet portion 136, one or more second liquid outlet channels 125 are disposed on the inlet periphery side of the inlet portion 127, and one or more third liquid outlet channels 165 are aligned with one or more second liquid outlet channels 125. In some embodiments, one or more first liquid outlet channels 135 include a first extended elliptical shape and two first liquid outlet channels 135. One or more second liquid outlet channels 125 include a second extended elliptical shape and two second liquid outlet channels 125. One or more third liquid outlet channels 165 include a third extended elliptical shape and two third liquid outlet channels 165. The modified sub-outlet configuration 177 includes a quadrilateral shape and two modified sub-outlet configurations 177. Two first liquid outlet channels 135 are each located on opposite first peripheral sides of the outlet configuration 136. Two second liquid outlet channels 125 are each located on opposite second peripheral sides of the inlet configuration 127. Two third liquid outlet channels 165 are each aligned with one or more of the second liquid outlet channels 125. Each of the two third liquid outlet channels 165 is aligned within each of the two modified sub-outlet configurations 177. In some embodiments, one or more second liquid outlet channels 125 are not fluidly coupled to the inlet configuration 127.

[0045] In some embodiments, the first inlet of each first inlet array 123 includes a first inlet diameter, the second inlet of each second inlet array 134 includes a second inlet diameter, and the third inlet of each third inlet array 153 includes a third inlet diameter; wherein the first outlet of each first outlet array 158 includes a first outlet diameter, and the second outlet of each second outlet array includes a second outlet diameter. The first inlet diameter, second inlet diameter, and third inlet diameter correspond to inlet dimensions. The first inlet diameter and second inlet diameter correspond to inlet dimensions. The first inlet diameter, second inlet diameter, and third inlet diameter are smaller than the first outlet diameter and the second outlet diameter.

[0046] In some embodiments, the first inlet diameter, the second inlet diameter, and the third inlet diameter are equal to the first outlet diameter and the second outlet diameter. In some embodiments, the first inlet diameter, the second inlet diameter, and the third inlet diameter are greater than the first outlet diameter and the second outlet diameter.

[0047] In some embodiments, the microjet multi-nozzle plate 150 further includes a groove 156 and a seal 151. A bottom opening 157 defines the periphery of the cavity, and the groove 156 surrounds the periphery of the cavity. The seal 151 is disposed within the groove 156 to sealably mount the cavity 155 to the surface of the processor 140.

[0048] In some embodiments, the liquid multi-nozzle jet impingement cooling device 100 further includes fasteners 199 for mechanically securing the liquid multi-nozzle jet impingement cooling device 100 to a printed circuit board. The modified cover plate 170A further includes a plurality of modified cover plate securing through holes 179 configured to surround the periphery of the sub-outlet of the modified sub-outlet configuration 177. The outlet flow plate 160 further includes these flow plate securing through holes 169 configured to surround a third periphery including one or more third outlet channels 165. The inlet plate 120 further includes these inlet plate securing through holes 129 configured to surround a second periphery including the inlet configuration 127 and one or more second outlet channels 125. The outlet plate 130 further includes these outlet plate securing through holes 139 configured to surround a first periphery including the outlet configuration 136 and one or more first outlet channels 135. The microjet multi-nozzle plate 150 further includes nozzle plate fastening through holes 159 configured to surround the periphery of the cavity 155. These modified cover plate fastening through holes 179 are aligned with the flow plate fastening through holes 169, with the inlet plate fastening through holes 129, with the outlet plate fastening through holes 139, and with the nozzle plate fastening through holes 159.

[0049] Figures 15A and 15B illustrate another liquid multi-nozzle jet impingement cooling device 104A according to various embodiments of the present invention. This other liquid multi-nozzle jet impingement cooling device 104A may be similar in some respects to the liquid multi-nozzle jet impingement cooling device 104 in Figures 9A to 10B, and therefore can be best understood with reference to it, and similar reference numerals refer to similar elements, which will not be described again. In some embodiments, the microjet multi-nozzle plate 152 further includes these needle-like fins 154. Each needle-like fin 154 is located between each of the adjacent first outlet arrays 158 and third inlet arrays 153.

[0050] During operation, coolant is pumped through inlet pipe 110, via converging throughlet 173 and second inlet throughlet 161, into the center of inlet configuration 127 and across the bottom surface of inlet configuration 127. The coolant is then forced through the third inlet array 153 via the respective second inlet arrays 134 of the guide wall structures 133 aligned with the third inlet arrays 153, and a first group of inlet arrays aligned with the respective second inlet arrays 134 of the guide wall structures 133. The coolant then enters cavity 155 and converges on the surface of processor 140, thereby absorbing heat from processor 140. In some embodiments including pin-shaped fins 154, the coolant flows through these pin-shaped fins 154, increasing their thermal conductivity surface area and promoting fluid mixing, thereby enhancing heat transfer. The heated coolant is then forced through the second outlet arrays 138 aligned with the first outlet arrays 138. The heated coolant then flows through these guide channels 137 to one or more first outlet channels 135, and then through one or more second outlet channels 125 aligned with one or more first outlet channels 135 and one or more third outlet channels 165 aligned with one or more second outlet channels 125 to the modified sub-outlet setting 177. Through the modified outlet pipe 180A, the heated coolant flows out from the liquid multi-nozzle jet impact cooling device 104A through the converging through-hole 173.

[0051] The heat transfer efficiency of the liquid multi-nozzle jet impact cooling device 100 / 100A / 104 / 104A of the present invention is high because there is no additional layer between the surface of the processor 140 and the cooling pad. The liquid multi-nozzle jet impact cooling device 100 / 100A / 104 / 104A is directly mounted on the surface of the processor 140 without using TIMs and / or additional layers that reduce heat transfer efficiency. The hermetically sealed cavity 155 creates a fluid path that allows the coolant jet to converge downwards toward the surface of the processor 140, while preventing coolant leakage to the processor 140 or any electrical connections of the electronic system containing the processor 140 (such leakage would cause electrical short circuits or damage). Furthermore, through the centrally located inlet pipe 110, the highest flow rate of the converging jet is directed toward the center of the surface of the processor 140 with the highest heat flux. Therefore, the heat transfer efficiency in the region of highest heat flux of the processor 140 is increased, resulting in more efficient heat transfer. Furthermore, the two outlet pipes 180 further increase the flow rate of the liquid multi-nozzle jet impact cooling device 100 / 100A / 104 / 104A. In addition, these needle-like fins 154 further enhance cooling efficiency and the ability to absorb heat from the processor 140 and transfer it to the coolant. Moreover, the liquid multi-nozzle jet impact cooling device 100 / 100A / 104 / 104A allows for quick, simple, and safe assembly and disassembly through the tightening and loosening of these fasteners 199. Furthermore, any combination of the micro-jet multi-nozzle plate 152, outlet plate 130, inlet plate 120, outlet flow plate 160, and cover plate 170 can be individually formed to facilitate maintenance, repair, and / or replacement of new or customized plates. Without using TIMs and / or additional layers, and with an increased coolant flow rate, the heat transfer rate is increased, thus improving the efficiency of the liquid multi-nozzle jet impact cooling device 100 / 100A / 104 / 104A of the present invention.

[0052] Therefore, the embodiments disclosed herein are well adapted to obtain the results and advantages described herein, as well as the results and advantages implied herein. The specific embodiments disclosed above are merely exemplary, and thus, those skilled in the art will be able to modify and implement the embodiments disclosed herein in different but equivalent ways with the assistance of the teachings herein. Furthermore, the details of the constructions or designs presented herein, except as described in the following claims, are not intended to limit the invention. Therefore, the specific exemplary embodiments disclosed above may be substituted, combined, or modified, and all such changes are considered to fall within the scope and spirit of the invention. The exemplary embodiments disclosed herein can be adapted to be implemented without using any elements not specifically disclosed herein and / or any optional elements disclosed herein. Although the composition and methods of various elements or steps are described using terms such as "comprising," "containing," or "including," the composition and methods of elements or steps may also be described using terms such as "substantially containing," "comprising." All the quantities and ranges disclosed above may be changed by certain numbers or quantities. When the lower and upper limits of numerical ranges are disclosed, any included ranges and any quantities falling within the range are specifically disclosed. Specifically, each numerical range disclosed herein (in the form "from about a to about b" or equivalently "from about a to b") should be understood as being used to describe every numerical value and range covered by this broad range. Furthermore, unless otherwise stated and clearly defined, the terminology used in the claims has its common, original meaning. Additionally, the indefinite article "a" used in the claims is hereby defined only as indicating the introduction of one or more elements.

[0053] 100, 104, 100A, 104A: Liquid multi-nozzle jet impact cooling device 110: Inlet pipe 120: Liquid entry plate 123: First Entry Array 125: Second liquid outlet channel 127: Entrance Setting Department 129: Liquid inlet plate fastening through hole 130: Liquid outlet plate 133: Deflector Wall Structure 134: Second Entry Array 135: First liquid outlet channel 136: Export Setup Department 137: Flow diversion channel 138: Second Exit Array 139: Liquid outlet plate fastening through hole 140: Processor 150: Microjet Multi-Nozzle Plate 151: Seals 152: Microjet Multi-Nozzle Plate 153: Third Entry Array 154: Needle-shaped fins 155: Cavity 156: Trench 157: Bottom opening 158: First Exit Array 159: Nozzle plate fastening through hole 160: Liquid outlet plate 161: Second liquid inlet port 165: Third liquid outlet channel 169: Flow plate fastening through hole 170, 170A: Cover plate 171: First liquid inlet hole 173: Converging Through Hole 175, 177: Sub-exit setting section 178: Liquid outlet orifice 179: Cover plate fastening through hole 180, 180A: Discharge pipe 199: Fasteners

Claims

1. A liquid multi-nozzle jet impingement cooling device for cooling a processor and comprising: a micro-jet multi-nozzle plate including a cavity, the cavity including a top, the top including a plurality of third inlet arrays, a plurality of first outlet arrays and a bottom opening, the bottom opening being opposite to the top; a liquid outlet plate coupled to the micro-jet multi-nozzle plate, the liquid outlet plate including an outlet setting portion and one or more first liquid outlet channels, the outlet setting portion including an outlet bottom, the outlet bottom including a plurality of guide wall structures and a plurality of second outlet arrays, each of the guide wall structures including a second inlet. An array; an inlet plate coupled to an outlet plate, the inlet plate including an inlet portion and one or more second outlet channels; an outlet plate coupled to the inlet plate, the outlet plate including a second inlet through-hole and one or more third outlet channels; and a cover plate coupled to the outlet plate, the cover plate including a first inlet through-hole and one or more sub-outlet portions, each of the one or more sub-outlet portions including an outlet through-hole, the first inlet through-hole being centrally disposed in the cover plate, and the one or more sub-outlet portions being disposed in the cover plate on one side of the first inlet through-hole, wherein... The first liquid inlet is fluidly coupled to the cavity through the second liquid inlet, the inlet setting, each of the second inlet arrays of the guide wall structures, and the third inlet arrays. The liquid outlet is fluidly coupled to the cavity through one or more sub-outlet settings, one or more third liquid outlet channels, one or more second liquid outlet channels, and the first outlet arrays. The cavity is hermetically mounted on a surface of the processor. The third inlet arrays guide a coolant downward toward the surface of the processor, and the first outlet arrays guide the coolant upward in a direction away from the surface of the processor.

2. The liquid multi-nozzle jet impact cooling device as claimed in claim 1, wherein the inlet setting includes an inlet bottom, the inlet bottom includes a plurality of first inlet arrays, and the second liquid inlet through-holes are fluidly coupled to each of the second inlet arrays of the guide wall structures through the first inlet arrays.

3. The liquid multi-nozzle jet impact cooling device as described in claim 2, wherein a first inlet of each of the first inlet arrays includes a first inlet diameter, a second inlet of each of the second inlet arrays includes a second inlet diameter, and a third inlet of each of the third inlet arrays includes a third inlet diameter, and wherein a first outlet of each of the first outlet arrays includes a first outlet diameter, and a second outlet of each of the second outlet arrays includes a second outlet diameter, wherein the first inlet diameter, the second inlet diameter, and the third inlet diameter correspond to inlet sizes, and the first outlet diameter and the second outlet diameter correspond to outlet sizes, wherein the first inlet diameter, the second inlet diameter, and the third inlet diameter are smaller than the first outlet diameter and the second outlet diameter.

4. The liquid multi-nozzle jet impact cooling device as claimed in claim 1, wherein each of the first outlet arrays is located between each of the adjacent third inlet arrays, and each of the second outlet arrays is located between each of the adjacent guide wall structures.

5. The liquid multi-nozzle jet impact cooling device as claimed in claim 4, wherein the liquid outlet plate further includes a plurality of flow channels defined between each adjacent flow wall structure, and the one or more first liquid outlet channels are fluidly coupled to the second outlet array through the flow channels.

6. The liquid multi-nozzle jet impact cooling device as claimed in claim 4, wherein the microjet multi-nozzle plate further comprises a plurality of needle-like fins, and wherein each of the needle-like fins is located between each adjacent first outlet array and third inlet array.

7. The liquid multi-nozzle jet impact cooling device as described in claim 1, wherein the cavity is centrally located in the micro-jet multi-nozzle plate, the outlet is centrally located in the liquid outlet plate, and the inlet is centrally located in the liquid inlet plate, wherein one or more first liquid outlet channels are located on an outlet periphery side of the outlet, one or more second liquid outlet channels are located on an inlet periphery side of the inlet, and one or more third liquid outlet channels are aligned with the one or more second liquid outlet channels.

8. The liquid multi-nozzle jet impact cooling device as claimed in claim 1, wherein the one or more first liquid outlet channels include a first extended elliptical shape and two such first liquid outlet channels, wherein the one or more second liquid outlet channels include a second extended elliptical shape and two such second liquid outlet channels, wherein the one or more third liquid outlet channels include a third extended elliptical shape and two such third liquid outlet channels, and wherein the one or more sub-outlet settings include a quadrilateral shape and two such sub-outlet settings, each of the two first liquid outlet channels is located on a plurality of opposing first peripheral sides of the outlet settings, each of the two second liquid outlet channels is located on a plurality of opposing second peripheral sides of the inlet settings, each of the two third liquid outlet channels is aligned with the one or more second liquid outlet channels, and each of the two third liquid outlet channels is aligned with each of the two sub-outlet settings.

9. The liquid multi-nozzle jet impingement cooling device as described in claim 1, wherein the one or more second liquid outlet channels are not fluidly coupled to the inlet setting.

10. The liquid multi-nozzle jet impact cooling device as described in claim 1, further comprising an inlet pipe and one or more outlet pipes, the inlet pipe passing through the first inlet through hole and the second inlet through hole, the one or more outlet pipes passing through each of the outlet through holes of the one or more sub-outlet settings, the inlet pipe being fluidly coupled to the inlet setting, and the one or more outlet pipes being fluidly coupled to the one or more sub-outlet settings.

11. The liquid multi-nozzle jet impact cooling device as claimed in claim 10, wherein the inlet pipe includes an input diameter and each of the one or more outlet pipes includes an output diameter, the input diameter being larger than the output diameter.

12. The liquid multi-nozzle jet impact cooling device as claimed in claim 10, wherein the one or more liquid outlet pipes comprise two of the liquid outlet pipes, and wherein the one or more sub-outlet settings comprise two of the sub-outlet settings.

13. The liquid multi-nozzle jet impact cooling device as claimed in claim 1, wherein the micro-jet multi-nozzle plate further includes a groove and a seal, wherein the bottom opening defines a periphery of a cavity, the groove surrounds the periphery of the cavity, and the seal is disposed in the groove to sealably mount the cavity to the surface of the processor.

14. The liquid multi-nozzle jet impact cooling device as claimed in claim 1, wherein the processor includes a semiconductor device mounted on a printed circuit board.

15. The liquid multi-nozzle jet impact cooling device as claimed in claim 14, further comprising a plurality of fasteners for securing the liquid multi-nozzle jet impact cooling device to the printed circuit board, wherein the cover plate further comprises a plurality of cover plate fastening through holes configured to surround a periphery of a sub-outlet of the one or more sub-outlet locations, the liquid outlet flow plate further comprises a plurality of flow plate fastening through holes configured to surround a third periphery including the one or more third liquid outlet channels, and the liquid inlet plate further comprises a plurality of flow plate fastening through holes configured to surround a second periphery including the inlet location and one or more second liquid outlet channels. The liquid outlet plate further includes multiple liquid inlet plate fastening through holes, and the liquid outlet plate further includes multiple liquid outlet plate fastening through holes configured to surround a first periphery including the outlet setting portion and the one or more first liquid outlet flow channels. The micro-jet multi-nozzle plate further includes multiple nozzle plate fastening through holes configured to surround a cavity periphery of the cavity. The cover plate fastening through holes are aligned with the flow plate fastening through holes, the flow plate fastening through holes are aligned with the liquid inlet plate fastening through holes, the liquid inlet plate fastening through holes are aligned with the liquid outlet plate fastening through holes, and the liquid outlet plate fastening through holes are aligned with the nozzle plate fastening through holes.

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