Server device

Abstract

A server device includes a housing, a support frame, a motherboard, expansion components, a liquid cooling assembly, and a bus assembly. The housing includes a base plate, two side plates, and a top plate. The base plate and top plate are connected to the two side plates. The base plate, side plates, and top plate together surround an accommodating space. The support frame is located in the accommodating space and fixed to the two side plates. The support frame has a support surface that divides the accommodating space into a lower subspace and an upper subspace. The motherboard is located in the lower subspace and has a heat source. The expansion components are located in the upper subspace. The liquid cooling assembly includes a distributor, a cold plate, and a first flow tube. The distributor is located in the upper subspace. The cold plate is thermally coupled to the heat source and communicates with the distributor through the first flow tube. The expansion components are connected to the distributor. The bus assembly is located in the upper subspace and is electrically connected to the motherboard and the expansion components.

Claims

1. A server device, comprising: a housing including a base plate, two side plates, and a top plate, the base plate and the top plate being respectively connected to opposite sides of the two side plates, and the base plate, the two side plates, and the top plate together surrounding an accommodating space; a support frame located in the accommodating space and fixed to the two side plates, the support frame having a support surface facing the top plate, an extension surface of the support surface dividing the accommodating space into a lower sub-space and an upper sub-space, and the lower sub-space being closer to the base plate than the upper sub-space; a motherboard located in the lower sub-space and having multiple heat sources; and multiple expansion components, at least some of which are... The expansion components are located in the upper subspace, and at least another portion of the expansion components are located in the lower subspace; a liquid cooling assembly includes a distributor, multiple cold plates, multiple first flow tubes, and multiple second flow tubes, the distributor is located in the upper subspace, the cold plates are thermally coupled to the heat sources and are in fluid communication with the distributor through the first flow tubes, and the expansion components are in fluid communication with the distributor through the second flow tubes; and a bus assembly is located at least partially in the upper subspace and is electrically connected to the motherboard and the expansion components.

2. The server device as described in claim 1 further includes an adapter board located in the lower subspace, through which the bus assembly is electrically connected to the motherboard.

3. The server device as described in claim 1 further includes a power supply component located in the upper subspace and electrically connected to the bus component.

4. The server device as claimed in claim 1 further includes a hard disk assembly located in the lower subspace and electrically connected to the bus assembly.

5. The server device as claimed in claim 1 further includes a data processing component located in the lower subspace and electrically connected to the bus assembly.

6. The server device as claimed in claim 1 further includes an output / input component located in the lower subspace and electrically connected to the bus assembly.

7. The server device as claimed in claim 1 further includes a fan assembly located in the lower subspace and electrically connected to the bus assembly.

8. The server device as described in claim 1, wherein the height of the housing is 8U.

9. The server device as described in claim 8, wherein the height of the lower subspace and the height of the upper subspace are each 4U.

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