System and method for manufacturing large-area polishing pad including sub-pad

Abstract

This invention provides a large-area polishing pad manufacturing system and method that can attach a top pad to a sub-pad during the manufacturing process of a top pad. The large-area polishing pad manufacturing system includes: a conveyor belt moving in one direction; a roller assembly arranged above the conveyor belt and providing a sub-pad onto the conveyor belt; a discharge device discharging a mixture onto the sub-pad; a curing device curing the mixture to form a top pad including a polished surface; and a thickness control device spaced a certain distance from the discharge device along the one direction for controlling the thickness of the mixture; wherein the upper surface of the top pad is a polished surface, and the lower surface of the top pad is attached to the upper surface of the sub-pad.

Claims

1. A manufacturing system for a large-area polishing pad, comprising: conveyor, Move in one direction; A roller assembly is arranged above the conveyor belt and provides a sub-pad onto the conveyor belt; A discharge device discharges a mixture onto the sub-pad; a curing device cures the mixture to form a top pad including a polished surface; and a thickness control device, spaced a certain distance from the discharge device along the one direction, for controlling the thickness of the mixture; wherein the upper surface of the top pad is a polished surface, and the lower surface of the top pad is attached to the upper surface of the sub-pad.

2. A manufacturing system for a large-area polishing pad, comprising: conveyor, Move in one direction; A discharge device discharges a mixture onto the conveyor belt; a roller device is arranged above the mixture and provides a sub-pad onto the mixture; a curing device cures the mixture to form a top pad including a polished surface; and a thickness control device is spaced a certain distance from the discharge device along the one direction for controlling the thickness of the mixture; wherein the lower surface of the top pad is a polished surface, and the upper surface of the top pad is attached to the lower surface of the sub-pad.

3. The manufacturing system for the large-area polishing pad according to claim 1 or 2 further includes: A pair of guides are arranged on both sides of the conveyor belt and extend along the one direction; The width of the mixture corresponds to the distance between the pair of guides.

4. The manufacturing system for the large-area polishing pad according to claim 3, wherein, The thickness control device contacts the pair of guides.

5. The manufacturing system for the large-area polishing pad according to claim 3, wherein, The lateral diffusion of the mixture is limited by the pair of guides.

6. A manufacturing system for a large-area polishing pad according to claim 1 or 2, wherein, The conveying speed of the conveyor belt is directly proportional to the discharge speed of the mixture discharged by the discharge device; the conveying speed of the conveyor belt is negatively correlated with at least one of the density of the mixture, the thickness of the mixture, and the width of the mixture.

7. A manufacturing system for a large-area polishing pad according to claim 1 or 2, wherein, The conveying speed of the conveyor belt is determined by the following [Mathematical Formula 1]: [Mathematical Formula 1] Where, X: conveying speed of the conveyor belt (m / min); S: discharge speed of the mixture (kg / min); B: width of the mixture layer (m); C: thickness of the mixture layer (m); D: density of the mixture (kg / m³).

8. A manufacturing system for a large-area polishing pad according to claim 1 or 2, wherein, The conveyor belt has a conveying speed of 0.1 m / min or higher and 17.8 m / min or lower.

9. A manufacturing system for a large-area polishing pad according to claim 1 or 2, wherein, The discharge rate of the mixture is above 0.2 kg / min and below 40 kg / min.

10. The manufacturing system for the large-area polishing pad according to claim 1, wherein, The front end of the sub-pad is conveyed together with the mixture by the conveyor belt; the sub-pad is rolled out from the roller device as the conveyor belt moves.

11. The manufacturing system for the large-area polishing pad according to claim 3, wherein, At the point where the mixture diffuses after being discharged from the discharge device and comes into contact with the thickness control device, the mixture contacts the inner surface of each of the pair of guides.

12. A method for manufacturing a large-area polishing pad, comprising: Sub-pads are supplied on a conveyor belt moving in one direction; A mixture is discharged onto the sub-pad; as the discharged mixture passes through the thickness control device, the thickness of the mixture is controlled to a size corresponding to the arrangement height of the thickness control device; the mixture moves and solidifies together with the conveyor belt and the sub-pad in one direction to form a top pad; wherein the upper surface of the top pad is a polished surface, and the lower surface of the top pad is attached to the upper surface of the sub-pad.

13. A method for manufacturing a large-area polishing pad, comprising: A mixture is discharged on a conveyor belt moving in one direction; as the discharged mixture passes through a thickness control device, the thickness of the mixture is controlled to a size corresponding to the arrangement height of the thickness control device; a sub-pad is supplied on the mixture; and the mixture moves and solidifies together with the conveyor belt in the one direction to form a top pad; wherein the lower surface of the top pad is a polished surface, and the upper surface of the top pad is attached to the lower surface of the sub-pad.

14. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The width of the mixture corresponds to the distance between a pair of guides arranged on both sides of the conveyor belt.

15. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The lateral diffusion of the mixture is limited by a pair of guides arranged on both sides of the conveyor belt.

16. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The conveying speed of the conveyor belt is directly proportional to the discharge speed of the mixture discharged by the discharge device; the conveying speed of the conveyor belt is negatively correlated with at least one of the density of the mixture, the thickness of the mixture, and the width of the mixture.

17. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The conveying speed of the conveyor belt is determined by the following [Mathematical Formula 1]: [Mathematical Formula 1] Where, X: conveying speed of the conveyor belt (m / min); S: discharge speed of the mixture (kg / min); B: width of the mixture layer (m); C: thickness of the mixture layer (m); D: density of the mixture (kg / m³).

18. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The conveyor belt has a conveying speed of 0.1 m / min or higher and 17.8 m / min or lower.

19. A method for manufacturing a large-area polishing pad according to claim 12 or 13, wherein, The discharge rate of the mixture is above 0.2 kg / min and below 40 kg / min.

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