Resin composition and prepreg and metal clad laminate including the same
Patent Information
- Application Number
- TW114148015
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-12-08
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2045-12-07
Smart Images

Figure TWG2TB001909119_001 
Figure TWG2TB001909119_002
Abstract
Claims
1. A resin composition comprising: A resin mixture, wherein, based on the total weight of the resin mixture, the resin mixture comprises: 10% to 50% by weight of polyindene resin; 10% to 40% by weight of benzocyclobutene hydrocarbon resin, wherein the number average molecular weight of the benzocyclobutene hydrocarbon resin is 2,100 to 3,600; 10% to 30% by weight of divinylbenzene resin; and 10% to 30% by weight of benzocyclobutene crosslinking agent, wherein the number average molecular weight of the benzocyclobutene crosslinking agent is 335 to 500; a phosphate ester flame retardant having a phosphorus content of 1.0 to 4.0 parts by weight per 100 parts by weight of the resin mixture; and a filler comprising spherical boron nitride, based on the total weight of the resin composition and greater than 35% by weight and less than 50% by weight.
2. The resin composition as claimed in claim 1, wherein the spherical boron nitride is vinyl-surface modified.
3. The resin composition as described in claim 1, further comprising: A phosphorus oxide flame retardant with a phosphorus content of less than 1.0 parts by weight per 100 parts by weight of the resin mixture.
4. The resin composition as claimed in claim 1, wherein the polyindim resin has two or more independently selected reactive functional groups selected from acrylic, styrene, maleimide, and combinations thereof, and the polyindim resin has a number average molecular weight of 300 to 1,000.
5. The resin composition as claimed in claim 1, wherein the benzocyclobutene hydrocarbon resin has the structure shown in Formula 1: (Formula 1) where n is 1 to 10, m is 1 to 10, and o is 1 to 15.
6. The resin composition as claimed in claim 1, wherein the benzocyclobutene crosslinking agent has the structure shown in Formula 2: (Formula 2) where R is hydrogen or a C1 to C4 alkyl group.
7. The resin composition as claimed in claim 1, wherein, Based on the total weight of the resin mixture, the resin mixture comprises: 25% to 40% by weight of the polyindene resin; 20% to 30% by weight of the benzocyclobutene hydrocarbon resin; 10% to 25% by weight of the polyvinylbenzene resin; and 15% to 25% by weight of the benzocyclobutene crosslinking agent; based on 100 parts by weight of the resin mixture, the resin composition further comprises: a phosphorus oxide flame retardant with a phosphorus content of less than 1.0 part by weight; 0.1 to 5.0 parts by weight of a peroxide accelerator; and 0.1 to 5.0 parts by weight of a siloxane coupling agent; and based on the total weight of the resin composition, the resin composition comprises 38% to 48% by weight of the spherical boron nitride.
8. A prepreg comprising a resin composition as described in any one of claims 1 to 7 and a fibrous substrate.
9. A metal-clad laminate comprising a prepreg as described in claim 8 and a metal foil.
10. The metal-clad laminate as claimed in claim 9, wherein the metal-clad laminate simultaneously has a dielectric loss tangent of less than 0.0006, a dielectric constant of 3.10 to 3.20, and a thermal conductivity of greater than 1.30 W / m°C.
Citation Information
Patent Citations
Organic semiconductor formulations
CN104685649A
Block copolymers and uses thereof
CN111875759A
Preparation method of low-dielectric and low-thermal-conductivity benzocyclobutene side group crosslinked type polyimide film with intrinsic micropores
CN113336998A
Polyimides
TW201823313A