Resin composition, cured product, laminate, transparent antenna and manufacturing method thereof, and image display device

Abstract

A resin composition comprising an elastomer, a (meth)acrylic acid compound, and a thermal polymerization initiator. A cured product of the resin composition. A laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, the transparent resin layer comprising the aforementioned resin composition or the aforementioned cured product. A transparent antenna (110) comprising a transparent substrate (110a) and a mesh conductive member (110b) disposed on the transparent substrate (110a), the transparent substrate (110a) comprising the aforementioned cured product. An image display device (100) comprising the transparent antenna (110).

Description

Technical Field

[0001] This disclosure relates to a resin composition, a cured product, a laminate, a transparent antenna and its manufacturing method, an image display device, etc. Prior Technology

[0002] Image display devices are used in various electronic devices such as personal computers, car navigation systems, mobile phones, clocks, and electronic dictionaries. An image display device includes: an image display section for displaying images; and a frame section (border section) located around the image display section. A transparent antenna is disposed on the image display section and connected to the frame section via a circuit. Various components for obtaining the transparent antenna have been studied (for example, see Patent Document 1 below).

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2011-091788

[0004] A transparent antenna comprises a transparent substrate and conductive components disposed on the transparent substrate. Sometimes, the transparent substrate is formed by curing a resin composition. From the viewpoint of achieving good color reproduction in image display devices, a low yellow tint is required for such cured material. Summary of the Invention

[0005] One objective of this disclosure is to provide a resin composition capable of producing a cured product with low yellowness. Another objective of this disclosure is to provide a cured product of the resin composition. Another objective of this disclosure is to provide a laminate using the resin composition or the cured product. Another objective of this disclosure is to provide a transparent antenna using the cured product. Another objective of this disclosure is to provide an image display device using the transparent antenna. Another objective of this disclosure is to provide a method for manufacturing a transparent antenna using the aforementioned laminate.

[0006] One aspect of this disclosure relates to a resin composition containing an elastomer, a (meth)acrylic acid compound, and a thermal polymerization initiator. With this resin composition, a cured product with low yellowness can be obtained.

[0007] Another aspect of this disclosure relates to a cured product of the aforementioned resin composition. Another aspect of this disclosure relates to a laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, the transparent resin layer comprising the aforementioned resin composition or the aforementioned cured product. Another aspect of this disclosure relates to a transparent antenna comprising a transparent substrate and a conductive member disposed on the transparent substrate, the transparent substrate comprising the aforementioned cured product. Another aspect of this disclosure relates to an image display device equipped with the aforementioned transparent antenna.

[0008] Another aspect of this disclosure relates to a method for manufacturing a transparent antenna by depositing the aforementioned transparent resin layer in a laminate onto a transparent member. This other aspect relates to a method for manufacturing a transparent antenna, wherein the laminate is a laminate in which a conductive member has a first conductive member disposed on the aforementioned transparent resin layer; and a second conductive member disposed on the first conductive member. If the first conductive member and the second conductive member contain copper, the second conductive member is removed while the aforementioned transparent resin layer and the aforementioned conductive member are deposited on the transparent member in the laminate. [Invention Effects]

[0009] According to one aspect of the present invention, a resin composition capable of producing a cured product with low yellowness can be provided. According to another aspect of the present invention, a cured product of the resin composition can be provided. According to another aspect of the present invention, a laminate using the resin composition or the cured product can be provided. According to another aspect of the present invention, a transparent antenna using the cured product can be provided. According to another aspect of the present invention, an image display device using the transparent antenna can be provided. According to another aspect of the present invention, a method for manufacturing a transparent antenna using the aforementioned laminate can be provided. Simple Explanation of the Diagram

[0010] Figure 1 is a schematic cross-sectional view showing an example of a laminate. Figure 2 is a schematic cross-sectional view showing an example of a laminated body. Figure 3 is a schematic cross-sectional view of an example of an image display device. Figure 4 is a schematic cross-sectional view of an example of an image display device. Implementation

[0011] The following provides a detailed description of the embodiments disclosed herein. However, this disclosure is not limited to the following embodiments.

[0012] In this specification, "above A" in a numerical range refers to A and the range exceeding A. "Below A" in a numerical range refers to A and the range less than A. Within the numerical ranges described in stages in this specification, the upper or lower limit of a certain stage's numerical range can be arbitrarily combined with the upper or lower limit of other stages' numerical ranges. Within the numerical ranges described in this specification, the upper or lower limit of the numerical range can be replaced with the values ​​shown in the embodiments. "A or B" can include either A or B, or both. The materials illustrated in this specification are not particularly limited and can be used alone or in combination of two or more. In this specification, regarding the content of each component in the composition, if there are multiple substances conforming to each component in the composition, unless otherwise specified, it refers to the total amount of the multiple substances present in the composition. Regarding the terms "layer" and "film," in addition to the shape and structure formed on the entire surface when viewed in a top view, it also includes the shape and structure formed on a portion of the surface. The term "step" does not only include independent steps, but also includes steps that cannot be clearly distinguished from others, as long as the desired effect of the step is achieved. "(meth)acrylate" refers to at least one of acrylates and their corresponding methacrylates. The same applies to other similar expressions such as "(meth)acrylic acid". The content of (meth)acrylic acid compounds refers to the total amount of acrylate compounds and methacrylic acid compounds.

[0013] The resin composition of this embodiment contains an elastomer, a (meth)acrylic acid compound, and a thermal polymerization initiator. The resin composition of this embodiment is a thermosetting resin composition. The cured product of this embodiment is obtained by curing (thermosetting) the resin composition of this embodiment, and is a cured product (thermosetting product) of the resin composition of this embodiment. For example, in the resin composition of this embodiment, a cured product is obtained by curing (thermosetting) the resin composition at 170°C for 1 hour. The cured product of this embodiment can be in a semi-cured state or a fully cured state.

[0014] The resin composition according to this embodiment can produce a cured product with low yellowness.

[0015] Image display devices can be used in high-frequency band communication equipment used to achieve high-speed, high-capacity communication. In high-frequency band communication, there is a tendency for high transmission loss. Therefore, components constituting transparent antennas are required to have excellent dielectric properties. According to one sample of the resin composition of this embodiment, a cured product with an excellent relative permittivity (low relative permittivity) can be obtained. Furthermore, according to one sample of the resin composition of this embodiment, a cured product with an excellent dielectric loss tangent (low dielectric loss tangent) can be obtained.

[0016] A sample of the resin composition according to this embodiment can obtain a cured product with excellent transmittance. A sample of the resin composition according to this embodiment can obtain a cured product with excellent haze. A sample of the resin composition according to this embodiment can obtain a cured product with excellent elongation. A sample of the resin composition according to this embodiment can obtain a cured product with an excellent modulus of elasticity (e.g., tensile modulus of elasticity) (with a low modulus of elasticity).

[0017] The resin composition of this embodiment contains an elastomer. Examples of elastomers include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, and silicone-based elastomers. From the viewpoint of easily obtaining cured products with low yellowness and of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, the elastomer may include a styrene-based elastomer.

[0018] Styrene-based elastomers have styrene compounds as monomer units, and can also have monomer units derived from styrene compounds. Examples of styrene compounds include styrene; alkylstyrene such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, propylstyrene, butylstyrene, hexylstyrene, heptylstyrene, and octylstyrene; halogenated styrene such as fluorostyrene, chlorostyrene, bromostyrene, dibromostyrene, and iodostyrene; nitrostyrene; acetyrene; and methoxystyrene. From the viewpoint of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, styrene-based elastomers can have styrene as a monomer unit.

[0019] Examples of styrene-based elastomers include styrene-butadiene random copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-ethylene-butene-styrene block copolymers, styrene-ethylene-propylene-styrene block copolymers, and hydrogenated elastomers of these.

[0020] From the perspective of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, based on the total mass of the elastomer (the total amount of elastomer contained in the resin composition), the content of styrene-based elastomers can be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, or 99% by mass or more. The elastomers contained in the resin composition can be substantially composed of styrene-based elastomers (based on the total mass of elastomers contained in the resin composition, the content of styrene-based elastomers is substantially 100% by mass).

[0021] From the perspective of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product, the weight-average molecular weight (Mw) or number-average molecular weight (Mn) of the elastomer can be within the following ranges: The weight-average molecular weight or number-average molecular weight of the elastomer can be 1000 or more, 3000 or more, 4000 or more, 5000 or more, 10000 or more, 30000 or more, 50000 or more, 80000 or more, or 100000 or more. The weight-average molecular weight or number-average molecular weight of the elastomer can be 500000 or less, 300000 or less, 200000 or less, 150000 or less, or 100000 or less. From these perspectives, the weight-average molecular weight or number-average molecular weight of the elastomer can be 1000~500000, 3000~300000, 4000~200000, or 5000~150000. The weight-average molecular weight and number-average molecular weight (Mn) can be measured under the following conditions by gel permeation chromatography (GPC) and obtained by conversion using standard polystyrene measurement lines.

[0022] Pump: L-6200 model [Manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 RI [Manufactured by Hitachi High-Technologies Corporation] Column Oven: L-655A-52 [Manufactured by Hitachi High-Technologies Corporation] Protective tubing and tubing: TSK Guardcolumn HHR-L + TSKgel G4000HHR + TSKgel G2000HHR [all manufactured by TOSOH CORPORATION, product names] Tubing string dimensions: 6.0×40mm (protective tubing string), 7.8×300mm (tubing string) Eluent: Tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20μL Flow rate: 1.00 mL / min Temperature measured: 40℃

[0023] According to ISO 1133, the MFR (melt flow rate, 230°C, 5 kgf, unit: g / 10 min) of an elastomer can be within the following ranges: From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining an excellent relative permittivity in the cured product, the MFR of the elastomer can be 1 or more, 2 or more, 3 or more, 4 or more, 5 or more, or 6 or more. From the viewpoint of easily obtaining excellent haze and further excellent relative permittivity in the cured product, the MFR of the elastomer can be 7 or more. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent transmittance in the cured product, the MFR of the elastomer can be 10 or less, 9 or less, 8 or less, 7 or less, or 6 or less. From the viewpoint of easily obtaining excellent haze and further excellent transmittance in the cured product, the MFR of the elastomer can be 5 or less. From these viewpoints, the MFR of the elastomer can be 1~10, 3~8, 5~7, 4~6, or 6~8.

[0024] The Fica softening temperature of elastomers, measured according to ISO 306 (test load 10 N, heating rate 50 °C / h), can be within the following ranges. From the viewpoint of easily obtaining excellent haze, dielectric loss tangent, and elongation in the cured product, the Fica softening temperature of the elastomer can be 50 °C or higher, 60 °C or higher, 70 °C or higher, 72 °C or higher, 75 °C or higher, 80 °C or higher, 81 °C or higher, or 83 °C or higher. From the viewpoint of easily obtaining cured products with low yellowness, the Fica softening temperature of the elastomer can be 100 °C or lower, 90 °C or lower, 85 °C or lower, or 83 °C or lower. From the viewpoint of easily obtaining excellent elongation in the cured product, the Fica softening temperature of the elastomer can be 81 °C or lower, 80 °C or lower, 75 °C or lower, or 72 °C or lower. From these viewpoints, the Fica softening temperature of the elastomer can be 50–100 °C, 60–90 °C, or 70–85 °C.

[0025] The elastomer in the resin composition of this embodiment can be an elastomer component in a single film (a film composed of the target elastomer component) that imparts a tensile modulus of elasticity (25°C) within the following ranges. From the viewpoint of easily obtaining excellent haze and modulus of elasticity in the cured product, the tensile modulus of elasticity can be 1 MPa or more, 5 MPa or more, 10 MPa or more, 50 MPa or more, 100 MPa or more, 150 MPa or more, 200 MPa or more, 250 MPa or more, 300 MPa or more, 310 MPa or more, 320 MPa or more, 350 MPa or more, or 380 MPa or more. From the viewpoint of easily obtaining a cured product with low yellowness, the tensile modulus of elasticity can be 500 MPa or less, 450 MPa or less, 400 MPa or less, 380 MPa or less, 350 MPa or less, 320 MPa or less, or 310 MPa or less. From these perspectives, the tensile modulus can be 1~500MPa, 100~400MPa, 200~400MPa, 300~400MPa, 200~350MPa, or 310~400MPa.

[0026] From the perspective of easily obtaining cured products with low yellowness and from the perspective of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured products, based on the total mass of the resin composition (excluding the mass of the organic solvent), or the total amount of elastomer, (meth)acrylic acid compounds, and thermal polymerization initiator, the elastomer content can be within the following ranges: The elastomer content can be 50% by mass or more, more than 50% by mass, 60% by mass or more, 65% by mass or more, 70% by mass or more, 75% by mass or more, or 78% by mass or more. The elastomer content can be 95% by mass or less, 90% by mass or less, 85% by mass or less, or 80% by mass or less. From these perspectives, the elastomer content can be 50-95% by mass, 60-90% by mass, or 70-85% by mass.

[0027] From the perspective of easily obtaining cured products with low yellowness and from the perspective of easily obtaining excellent dielectric properties (relative permittivity, dielectric loss tangent, etc.) in the cured product, the elastomer content, based on the total amount of elastomer and (meth)acrylic acid compounds, can be within the following ranges: The elastomer content can be 50% by mass or more, more than 50% by mass, 60% by mass or more, 65% by mass or more, 70% by mass or more, 75% by mass or more, or 80% by mass or more. The elastomer content can be 95% by mass or less, 90% by mass or less, 85% by mass or less, or 80% by mass or less. From these perspectives, the elastomer content can be 50-95% by mass, 60-90% by mass, or 70-85% by mass.

[0028] The resin composition of this embodiment may contain (meth)acrylic acid compounds. (Meth)acrylic acid compounds are compounds having a (meth)acrylic group. (Meth)acrylic acid compounds may or may not have epoxy groups.

[0029] (Meth)acrylic compounds may include at least one selected from the group consisting of monofunctional (meth)acrylic compounds and polyfunctional (meth)acrylic compounds (difunctional (meth)acrylic compounds or trifunctional or more functional (meth)acrylic compounds). For example, "difunctional (meth)acrylic compound" refers to a compound in which the total number of acrylonitrile and methacrylic groups in one molecule is two. From the viewpoint of easily obtaining cured products with low yellowness, (meth)acrylic compounds may include difunctional (meth)acrylic compounds.

[0030] Examples of monofunctional (meth)acrylate compounds include methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, tributyl methacrylate, butoxyethyl methacrylate, isoamyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, heptyl methacrylate, octylheptyl methacrylate, nonyl methacrylate, decyl methacrylate, undecyl methacrylate, lauryl methacrylate, tridecyl methacrylate, tetradecyl methacrylate, pentadecyl methacrylate, and so on. Hexadecyl acrylate, stearyl acrylate, behenyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-chloro-2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, methoxy polyethylene glycol acrylate, ethoxy polyethylene glycol acrylate, methoxy polyethylene glycol acrylate, ethoxy polyethylene glycol acrylate, mono(2-(meth)acryloxyethyl)succinate, and other aliphatic (meth)acrylates; cyclopentyl acrylate, cyclohexyl acrylate, cyclopentyl acrylate, dicyclopentyl acrylate. Esters, dicyclopentenyl (meth)acrylate, isoborneol (meth)acrylate, mono(2-(meth)acryloxyethyl)tetrahydrophthalic acid, mono(2-(meth)acryloxyethyl)hexahydrophthalic acid, etc., alicyclic (meth)acrylates; benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, 1-naphthyl (meth)acrylate, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-isopropylphenylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, 1-naphthyl (meth)acrylate, 2-naphthyl (meth)acrylate, meth)acrylate, acrylic acid Aromatic (meth)acrylates such as phenoxy polyethylene glycol ester, nonylphenoxy polyethylene glycol ester (meth)acrylate, phenoxy polyethylene glycol ester (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl (meth)acrylate, and 2-hydroxy-3-(2-naphthoxy)propyl (meth)acrylate; heterocyclic (meth)acrylates such as 2-tetrahydrofurfuryl (meth)acrylate, N-(meth)acryloxyethylhexahydrophthalimide, and 2-(meth)acryloxyethyl-N-carbazole; and caprolactone-modified forms of these.

[0031] Examples of difunctional (meth)acrylate compounds include ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, propylene glycol dimethacrylate, dipropylene glycol dimethacrylate, tripropylene glycol dimethacrylate, tetrapropylene glycol dimethacrylate, polypropylene glycol dimethacrylate, ethoxylated polypropylene glycol dimethacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, neopentyl glycol dimethacrylate, 3-methyl-1,5-pentanediol dimethacrylate, and 1... Aliphatic (meth)acrylates (e.g., alkyl glycol dimethacrylate), such as 6-hexanediol dimethacrylate, 2-butyl-2-ethyl-1,3-propanediol dimethacrylate, nonanediol dimethacrylate (e.g., 1,9-nonanediol dimethacrylate), decanediol dimethacrylate (e.g., 1,10-decanediol dimethacrylate), dodecanediol dimethacrylate (e.g., 1,12-decanediol dimethacrylate), glycerol dimethacrylate, ethoxylated 2-methyl-1,3-propanediol dimethacrylate, etc. (e.g., alkyl glycol dimethacrylate); cyclohexanediethanol dimethacrylate, ethoxylated cyclohexanediethanol dimethacrylate. Ester, propoxylated cyclohexanediethanol di(meth)acrylate, ethoxylated propoxylated cyclohexanediethanol di(meth)acrylate, tricyclodecanediethanol di(meth)acrylate, ethoxylated tricyclodecanediethanol di(meth)acrylate, propoxylated tricyclodecanediethanol di(meth)acrylate, ethoxylated propoxylated tricyclodecanediethanol di(meth)acrylate, ethoxylated hydrogenated bisphenol A di(meth)acrylate, propoxylated hydrogenated bisphenol A di(meth)acrylate, ethoxylated propoxylated hydrogenated bisphenol A di(meth)acrylate, ethoxylated hydrogenated bisphenol F di(meth)acrylate, propoxylated hydrogenated bisphenol F di(meth)acrylate, ethoxylated propoxylated hydrogenated bisphenol F di(meth)acrylate Alicyclic (meth)acrylates such as acrylates; aromatic (meth)acrylates such as ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, ethoxylated propoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, propoxylated bisphenol F di(meth)acrylate, ethoxylated propoxylated bisphenol F di(meth)acrylate, ethoxylated bisphenol AF di(meth)acrylate, propoxylated bisphenol AF di(meth)acrylate, ethoxylated propoxylated bisphenol AF di(meth)acrylate, ethoxylated eponymous di(meth)acrylate, propoxylated eponymous di(meth)acrylate, ethoxylated propoxylated eponymous di(meth)acrylate, etc.Heterocyclic methacrylates such as ethoxylated di(meth)acrylate, propoxylated di(meth)acrylate, and ethoxylated propoxylated di(meth)acrylate; caprolactone-modified forms of these; aliphatic epoxy (meth)acrylates such as neopentyl glycol-type epoxy (meth)acrylates; alicyclic epoxy (meth)acrylates such as cyclohexanediol-type epoxy (meth)acrylate, hydrogenated bisphenol A-type epoxy (meth)acrylate, and hydrogenated bisphenol F-type epoxy (meth)acrylate; aromatic epoxy (meth)acrylates such as resorcinol-type epoxy (meth)acrylate, bisphenol A-type epoxy (meth)acrylate, bisphenol F-type epoxy (meth)acrylate, bisphenol AF-type epoxy (meth)acrylate, and epoxide-type epoxy (meth)acrylate.

[0032] Examples of trimethylolpropane tri(meth)acrylate compounds with three or more functions include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, ethoxylated propoxylated trimethylolpropane tri(meth)acrylate, neopentyltetrol tri(meth)acrylate, ethoxylated neopentyltetrol tri(meth)acrylate, propoxylated neopentyltetrol tri(meth)acrylate, ethoxylated propoxylated neopentyltetrol tri(meth)acrylate, neopentyltetrol tetra(meth)acrylate, ethoxylated neopentyltetrol tetra(meth)acrylate, propoxylated neopentyltetrol tetra(meth)acrylate, and propoxylated neopentyltetrol tetra(meth)acrylate. Aliphatic (meth) acrylates such as tetraol tetra(meth)acrylate, ethoxylated propoxylated neopentyl tetraol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dinepentyl tetraol hexa(meth)acrylate; heterocyclic (meth) acrylates such as ethoxylated isocyanurate tri(meth)acrylate, propoxylated isocyanurate tri(meth)acrylate, and ethoxylated propoxylated isocyanurate tri(meth)acrylate; caprolactone-modified forms of these; and aromatic epoxy (meth) acrylates such as phenolic varnish-type epoxy (meth)acrylate and cresolic varnish-type epoxy (meth)acrylate.

[0033] From the viewpoint of easily obtaining cured products with low yellowness, (meth)acrylic compounds may include aliphatic (meth)acrylates. From the viewpoint of easily obtaining cured products with low yellowness, (meth)acrylic compounds may include alkyl glycol di(meth)acrylate. From the viewpoint of easily obtaining cured products with excellent elastic modulus, (meth)acrylic compounds may include at least one selected from the group consisting of nonanediol di(meth)acrylate, decanediol di(meth)acrylate, dodecanediol di(meth)acrylate, and tricyclodecanediethanol di(meth)acrylate; may include at least one selected from the group consisting of nonanediol di(meth)acrylate, decanediol di(meth)acrylate, and dodecanediol di(meth)acrylate; may also include nonanediol di(meth)acrylate. From the viewpoint of easily obtaining excellent elongation in the cured product, (meth)acrylic compounds may include acrylic compounds. From the perspective of easily obtaining cured products with low yellowness and easily obtaining excellent dielectric loss tangent in cured products, (meth)acrylic acid compounds may include methacrylic acid compounds.

[0034] From the viewpoints of easily obtaining cured products with low yellowness and easily obtaining excellent elastic modulus, (meth)acrylic acid compounds may include compounds represented by the following general formula (I).

[0035] [Chemistry 1] [In formula (I), R1 represents a group containing 9 or fewer carbon atoms and 2 or more oxygen atoms, and R2a and R2b independently represent a hydrogen atom or a methyl group, respectively.]

[0036] The carbon atoms in R1 range from 1 to 9. From the viewpoint of easily obtaining a cured product with low yellowness, the carbon atoms in R1 can be 2 or more, 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more. From the viewpoint of easily obtaining a cured product with low yellowness, the oxygen atoms in R1 can be 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less. R1 can be a hydrocarbon group with oxygen atoms bonded at both ends, or it can be a "-OC nH 2n-O-" group (n=1~9).

[0037] From the viewpoint of easily obtaining cured products with low yellowness, based on the total mass of (meth)acrylic compounds (the total amount of (meth)acrylic compounds contained in the resin composition), the content of the compound represented by general formula (I) can be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, or 99% by mass or more. The (meth)acrylic compounds contained in the resin composition are substantially composed of compounds represented by general formula (I) (based on the total mass of (meth)acrylic compounds contained in the resin composition, the content of the compound represented by general formula (I) is substantially 100% by mass).

[0038] From the viewpoint of easily obtaining cured products with low yellowness, the molecular weight of (meth)acrylic acid compounds can be within the following ranges: The molecular weight of (meth)acrylic acid compounds can be 80 or more, 100 or more, 120 or more, 150 or more, 180 or more, 200 or more, 220 or more, 250 or more, 260 or more, 280 or more, 290 or more, 300 or more, or 320 or more. The molecular weight of (meth)acrylic acid compounds can be less than 1000, less than 800, less than 600, less than 550, less than 500, less than 450, less than 400, less than 350, less than 320, less than 300, or less than 280. From these viewpoints, the molecular weight of (meth)acrylic acid compounds can be 80-1000, 100-600, 100-500, 250-600, or 200-400.

[0039] From the viewpoint of easily obtaining cured products with low yellowness, based on the total mass of the resin composition (excluding the mass of the organic solvent) or the total amount of elastomer, (meth)acrylic compounds, and thermal polymerization initiator, the content of (meth)acrylic compounds can be within the following ranges: The content of (meth)acrylic compounds can be less than 50% by mass, less than 50% by mass, less than 40% by mass, less than 35% by mass, less than 30% by mass, less than 25% by mass, or less than 20% by mass. The content of (meth)acrylic compounds can be more than 1% by mass, more than 5% by mass, more than 10% by mass, more than 15% by mass, or more than 18% by mass. From these viewpoints, the content of (meth)acrylic compounds can be 1 to 50% by mass, 10 to 40% by mass, or 15 to 25% by mass.

[0040] From the viewpoint of easily obtaining cured products with low yellowness, the content of (meth)acrylic compounds, based on the total amount of elastomer and (meth)acrylic compounds, can be within the following ranges: The content of (meth)acrylic compounds can be less than 50% by mass, less than 50% by mass, less than 40% by mass, less than 35% by mass, less than 30% by mass, less than 25% by mass, or less than 20% by mass. The content of (meth)acrylic compounds can be more than 1% by mass, more than 5% by mass, more than 10% by mass, more than 15% by mass, or more than 20% by mass. From these viewpoints, the content of (meth)acrylic compounds can be 1 to 50% by mass, 10 to 40% by mass, or 15 to 25% by mass.

[0041] The resin composition of this embodiment contains a thermal polymerization initiator. The thermal polymerization initiator is a compound that begins polymerization upon heating; it may include thermal free radical polymerization initiators or thermal cationic polymerization initiators.

[0042] Examples of ketone peroxides that can be used as thermal polymerization initiators include methyl ethyl ketone peroxide, cyclohexanone peroxide, and methyl cyclohexanone peroxide; peroxy ketals such as 1,1-bis(tertiary butylperoxy)cyclohexane, 1,1-bis(tertiary butylperoxy)-2-methylcyclohexane, 1,1-bis(tertiary butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tertiary hexylperoxy)cyclohexane, and 1,1-bis(tertiary hexylperoxy)-3,3,5-trimethylcyclohexane; hydrogen peroxide such as p-menthane hydrogen peroxide; and α,α'-bis(tertiary butylperoxy)diisopropylbenzene, diisopropylbenzene peroxide, tertiary butylisopropylbenzene peroxide, and di-tertiary butyl... Dialkyl peroxides, such as peroxides; dialkyl peroxides such as octyl peroxide, lauryl peroxide, stearyl peroxide, and benzoyl peroxide; peroxycarbonates such as bis(4-tert-butylcyclohexyl)peroxydicarbonate, di-2-ethoxyethyl ester peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and di-3-methoxybutyl peroxycarbonate; tert-butyl peroxypentanate, tert-hexyl peroxypentanate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexylperoxy)hexane, tert-hexyl peroxy-2-ethylhexanoate, and tert-butyl peroxy-2- Ethylhexanoate, tertiary butyl peroxide isobutyrate, tertiary hexyl peroxide isopropyl monocarbonate, tertiary butyl peroxide-3,5,5-trimethylhexanoate, tertiary butyl peroxide lauryl ester, tertiary butyl peroxide isopropyl monocarbonate, tertiary butyl peroxide-2-ethylhexyl monocarbonate, tertiary butyl peroxide benzoate, tertiary hexyl peroxide benzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, tertiary butyl peroxide acetate and other peroxide esters; phthalic anhydride, maleic anhydride, 1,2,4-benzenetricarboxylic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, glutaric anhydride, dimethylglutaric anhydride, di Anhydrides such as ethyl glutaric anhydride, succinic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, 1,2,3,4-cyclobutanetetracarboxylic anhydride, 4,4'-diphthalic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 4,4'-oxobisphthalic anhydride, 9,9-bis(3,4-dicarboxyphenyl) dianhydride, and 2,3,6,7-naphthalenetetracarboxylic anhydride; and azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanitrile), and 2,2'-azobis(4-methoxy-2'-dimethylpentanitrile).

[0043] From the viewpoint of easily obtaining cured products with low yellowness, thermal polymerization initiators can contain peroxides, dialkyl peroxides, or α,α'-bis(tert-butylperoxy)diisopropylbenzene.

[0044] Based on the total mass of the resin composition (excluding the mass of the organic solvent) or the total amount of the elastomer, (meth)acrylic acid compounds, and thermal polymerization initiator, the content of the thermal polymerization initiator can be within the following ranges. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent curability, the content of the thermal polymerization initiator can be 0.01% by mass or more, 0.03% by mass or more, 0.05% by mass or more, 0.08% by mass or more, or 0.09% by mass or more. From the viewpoint of easily obtaining a cured product with low yellowness, the content of the thermal polymerization initiator can be 10% by mass or less, 5% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.2% by mass or less, or 0.1% by mass or less. From these viewpoints, the content of the thermal polymerization initiator can be 0.01 to 10% by mass, 0.03 to 1% by mass, or 0.05 to 0.5% by mass.

[0045] Based on the total amount of elastomer and (meth)acrylic acid compounds, the content of the thermal polymerization initiator can be within the following ranges. From the viewpoint of easily obtaining a cured product with low yellowness and from the viewpoint of easily obtaining excellent curability, the content of the thermal polymerization initiator can be 0.01% by mass or more, 0.03% by mass or more, 0.05% by mass or more, 0.08% by mass or more, or 0.1% by mass or more. From the viewpoint of easily obtaining a cured product with low yellowness, the content of the thermal polymerization initiator can be 10% by mass or less, 5% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.2% by mass or less, or 0.1% by mass or less. From these viewpoints, the content of the thermal polymerization initiator can be 0.01 to 10% by mass, 0.03 to 1% by mass, or 0.05 to 0.5% by mass.

[0046] The resin composition of this embodiment may contain additives other than elastomers, (meth)acrylic acid compounds, and thermal polymerization initiators. Examples of such additives include polymerizable compounds (excluding compounds corresponding to (meth)acrylic acid compounds), curing accelerators, antioxidants, ultraviolet absorbers, visible light absorbers, colorants, plasticizers, stabilizers, and fillers. Examples of polymerizable compounds include vinyl halides, vinyl ethers, vinyl esters, vinylpyridines, vinylamides, and arylethylenes.

[0047] The resin composition of this embodiment may contain an organic solvent. The resin composition of this embodiment can be used as a resin varnish by diluting it with an organic solvent. Examples of organic solvents include aromatic hydrocarbons such as toluene, xylene, symmetrical trimethylbenzene, cumene, and p-isopropyltoluene; cyclic ethers such as tetrahydrofuran and 1,4-dimethylalkanes; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; carbonates such as ethyl carbonate and propylene carbonate; and amides such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0048] The laminate of this embodiment includes a substrate film (support film) and a transparent resin layer disposed on the substrate film. The transparent resin layer includes the resin composition of this embodiment or the cured product of this embodiment.

[0049] Examples of materials that can be used to construct the substrate film include polyesters (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefins (polyethylene, polypropylene, etc.), polycarbonate, polyamide, polyimide, polyamide-imide, polyether-imide, polyether sulfide, polyether sulfide, polyether ketone, polyphenylene ether, and polyphenylene sulfide. The thickness of the substrate film can be 1~200μm, 10~100μm, or 20~50μm.

[0050] From the perspective of easily achieving excellent transmittance and facilitating the thin-film fabrication of image display devices, the thickness of the transparent resin layer can be less than 1000 μm, less than 800 μm, less than 500 μm, less than 300 μm, less than 250 μm, less than 200 μm, less than 150 μm, or less than 100 μm. From the perspective of reducing transmission loss and easily improving antenna characteristics, the thickness of the transparent resin layer can be more than 1 μm, more than 5 μm, more than 10 μm, more than 20 μm, more than 30 μm, more than 50 μm, more than 80 μm, or more than 100 μm. From these perspectives, the thickness of the transparent resin layer can be 1~1000 μm, 10~500 μm, 20~200 μm, or 50~200 μm.

[0051] The first embodiment of the laminate may include a protective film disposed on a transparent resin layer. The second embodiment of the laminate may include a conductive component disposed on a transparent resin layer.

[0052] The aforementioned materials can be used as constituent materials for the substrate film, serving as the constituent material for the protective film. The protective film can be the same as the substrate film or a different film. The thickness of the protective film can be 1~200μm, 10~100μm, or 20~50μm.

[0053] Conductive components can be solid or have patterned portions (which can be patterned). In conductive components with patterned portions (hereinafter referred to as "patterned conductive components"), part or all of the conductive component can be patterned. Examples of patterns include mesh-like or vortex-like shapes. In the case of using a transparent antenna with a solid conductive component, the conductive component can be patterned (e.g., mesh fabrication). Patterned (e.g., mesh) conductive components can be composed of lines (e.g., metal wires). Examples of materials used to construct conductive components include metallic materials, carbon materials (e.g., graphene), and conductive polymers. Examples of metallic materials include copper, silver, and gold. From the viewpoint of easily obtaining excellent conductivity and easily reducing manufacturing costs, conductive components may contain copper.

[0054] The conductive component can be a single layer or multiple layers. For example, a multiple-layer conductive component may have a first conductive component (e.g., a metal component) disposed on a transparent resin layer, and a second conductive component (e.g., a metal component) disposed on the first conductive component. At least one selected from the group consisting of the first conductive component and the second conductive component can be solid or patterned (e.g., mesh). The second conductive component can serve as a protective layer to suppress contamination, damage, etc., of the first conductive component, thereby improving the operability of the laminate. At least one selected from the group consisting of the first conductive component and the second conductive component may contain copper, and both the first and second conductive components may contain copper.

[0055] The thickness of the conductive component (total thickness when there are multiple conductive components), the thickness of the first conductive component, or the thickness of the second conductive component can be within the following ranges. From the viewpoint that the conductive component is less prone to breakage and that solid conductive components are easy to pattern (e.g., mesh processing), the thickness can be 50 μm or less, 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 15 μm or less, 10 μm or less, 8 μm or less, 5 μm or less, 3 μm or less, 2 μm or less, or 1.5 μm or less. From the viewpoint that excellent elongation can be easily obtained, the thickness can be 0.1 μm or more, 0.3 μm or more, 0.5 μm or more, 0.8 μm or more, 1 μm or more, or 1.2 μm or more. From this perspective, the thickness can be 0.1~50μm, 0.1~30μm, 0.1~20μm, 0.1~10μm, 0.5~5μm or 1~3μm.

[0056] The thickness of the first conductive member can be less than the thickness of the second conductive member. When there are multiple conductive members, the thickness of the conductive members (total thickness) or the thickness of the second conductive member can be 1.5 μm or more, 2 μm or more, 3 μm or more, 5 μm or more, 8 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more.

[0057] Figures 1 and 2 are schematic cross-sectional views showing an example of a laminate. The laminate 10 in Figure 1(a) includes a substrate film 10a, a transparent resin layer 10b disposed on the substrate film 10a, and a protective film 10c disposed on the transparent resin layer 10b. The transparent resin layer 10b is composed of a resin composition of this embodiment or a cured product of this embodiment. The laminate 20 in Figure 1(b) includes a substrate film 20a, a transparent resin layer 20b disposed on the substrate film 20a, and a conductive member 20c disposed on the transparent resin layer 20b. The transparent resin layer 20b is composed of a resin composition of this embodiment or a cured product of this embodiment. The laminate 30 in Figure 2 includes a substrate film 30a, a transparent resin layer 30b disposed on the substrate film 30a, a conductive member 30c disposed on the transparent resin layer 30b, and a conductive member 30d disposed on the conductive member 30c. The transparent resin layer 30b is composed of the resin composition of this embodiment or the cured product of this embodiment.

[0058] The transparent antenna of this embodiment includes a transparent substrate and a conductive member disposed on the transparent substrate. The transparent substrate contains the cured product of this embodiment. The conductive member can be a single layer. As for the configuration of the conductive member, the above-described configuration can be used for the conductive member in the laminate of the second embodiment. For example, the conductive member can contain copper. Furthermore, the conductive member can be solid or patterned (e.g., mesh). As for the thickness of the transparent substrate, the above-described thickness can be used for the transparent resin layer of the laminate of this embodiment.

[0059] The transparent antenna of this embodiment may have a transparent component supporting a transparent substrate, that is, it may have a transparent component, a transparent substrate disposed on the transparent component, and a conductive component disposed on the transparent substrate.

[0060] The shape of the transparent component is not particularly limited and can be film-like (transparent film), substrate-like (transparent substrate), or irregularly shaped. Examples of materials used to construct the transparent component include resin materials and inorganic materials. Examples of resin materials include polyesters (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefins (polyethylene, polypropylene, cyclic olefin polymers, etc.), polycarbonate, polyamide, polyimide, polyamide-imide, polyether-imide, polyether sulfide, polyether sulfide, polyether ketone, polyphenylene ether, polyphenylene sulfide, etc. Examples of inorganic materials include glass. The transparent component can be formed from a material with a total light transmittance of 90% or more. From a low dielectric perspective, the transparent component can include polyolefins.

[0061] The first aspect of the method for manufacturing a transparent antenna according to this embodiment includes a processing step of patterning (e.g., processing into a mesh) a conductive member (solid conductive member) disposed on a transparent substrate including the cured material of this embodiment. In this processing step, a patterned (e.g., mesh) conductive member is obtained by etching the conductive member while a patterned resist layer is disposed on the conductive member of a laminate containing a transparent substrate and conductive members disposed on the transparent substrate. The resist layer can be removed after etching the conductive member. A patterned resist layer is obtained by irradiating (exposing) a photosensitive layer disposed on the conductive member with active light (e.g., ultraviolet light) and then removing (developing) the unexposed or exposed portions of the resist layer.

[0062] Regarding the laminate having conductive members disposed on a transparent substrate, it can be obtained by forming conductive members on a transparent substrate containing the cured product of this embodiment. For example, it can be obtained by forming conductive members on a transparent resin layer after removing the protective film of the laminate of the first state sample. The laminate having conductive members disposed on a transparent substrate can be the laminate of the second state sample.

[0063] The second aspect of the method for manufacturing a transparent antenna according to this embodiment includes a forming step of forming a patterned (e.g., mesh) metal component while a patterned resist layer is disposed on a transparent substrate containing the cured product of this embodiment. In the forming step, the resist layer can be used as a photomask, and the patterned (e.g., mesh) metal component can be formed by plating or sputtering. The resist layer can be removed after the forming step.

[0064] The third embodiment of the transparent antenna manufacturing method includes a removal step for removing the substrate film in the laminate when the conductive member in the laminate of the second embodiment is patterned (e.g., mesh). If the transparent resin layer of the laminate contains cured material during the removal step, a laminate containing a transparent substrate (transparent resin layer) and patterned (e.g., mesh) conductive member can be obtained as a transparent antenna by performing the removal step. If the transparent resin layer of the laminate is not cured during the removal step, a laminate containing a transparent substrate (transparent resin layer) and patterned (e.g., mesh) conductive member can be obtained as a transparent antenna by curing the transparent resin layer (resin composition of the transparent resin layer) after the removal step.

[0065] The fourth embodiment of the transparent antenna manufacturing method includes a lamination step of depositing a transparent resin layer from the laminate of this embodiment onto a transparent member. The transparent member described above can be used as the transparent member for the transparent antenna. In the lamination step, the transparent resin layer can be deposited onto the transparent member while the substrate film in the laminate of this embodiment has been removed, or the transparent resin layer can be deposited onto the transparent member while the protective film in the laminate of the first embodiment has been removed. The fourth embodiment of the transparent antenna manufacturing method can include a removal step A of removing the substrate film in the laminate of this embodiment, or a removal step B of removing the protective film in the laminate of the first embodiment.

[0066] When using the laminate of the second state sample, in the lamination step, the transparent resin layer and the conductive member can be laminated onto the transparent member while the transparent resin layer is positioned closer to the transparent member than the conductive member, or the transparent resin layer and the conductive member can be laminated onto the transparent member while the transparent resin layer is in contact with the transparent member. In the lamination step, the transparent resin layer and the conductive member can be laminated onto the transparent member while the substrate film in the laminate of the second state sample has been removed.

[0067] In the case of a laminate containing a transparent component and a conductive component disposed on the transparent component, where the transparent component and conductive component are laminated with good adhesion, surface treatment (plasma treatment, corona treatment, etc.) is sometimes applied to the transparent component, which may complicate the manufacturing process of the laminate. For example, when polyolefin is used as the constituent material of the transparent component, the adhesion between the polyolefin and the conductive component (e.g., a metal material such as copper) is low, so surface treatment is sometimes required to obtain sufficient adhesion. On the other hand, according to the manufacturing method of the transparent antenna of the fourth state, sufficient adhesion between the transparent component and the conductive component can be obtained without surface treatment of the transparent component, and a laminate containing a transparent component and a conductive component (a laminate containing a transparent component, a transparent resin layer, and a conductive component) can be obtained as a transparent antenna. For example, sufficient adhesion between a transparent component containing polyolefin and a conductive component containing copper can be obtained, and a transparent antenna can be obtained at the same time. Furthermore, according to the manufacturing method of the transparent antenna of the fourth embodiment, by laminating the bulk layer of this embodiment onto the transparent member, the transparent resin layer and the conductive member can be supplied together onto the transparent member, and a transparent antenna can be obtained in a simple way. In addition, according to the manufacturing method of the transparent antenna of the fourth embodiment, by using a material with excellent dielectric properties (dielectric constant, dielectric loss tangent, etc.) as the constituent material of the transparent resin layer, a transparent antenna with excellent antenna characteristics can be obtained.

[0068] In the manufacturing method of the transparent antenna of the fourth state, the transparent resin layer removed in step A, step B, and the lamination step may be uncured or cured. If the transparent resin layer is uncured, the manufacturing method of the transparent antenna of the fourth state may include a curing step after the lamination step to cure the transparent resin layer (the resin composition of the transparent resin layer).

[0069] In the manufacturing method of the transparent antenna of the fourth state, the conductive components removed in steps A, B, and the stacking step can be solid or patterned (e.g., mesh). When the conductive components are solid, the manufacturing method of the transparent antenna of the fourth state can include a processing step of patterning the conductive components (e.g., processing them into a mesh) after the stacking step.

[0070] In the manufacturing method of the transparent antenna of the fourth state, the conductive members in the removal steps A, B, and the stacking step can be multiple layers, and can include a first conductive member disposed on a transparent resin layer and a second conductive member disposed on the first conductive member. At least one selected from the group consisting of the first conductive member and the second conductive member can be solid or patterned (e.g., mesh). At least one selected from the group consisting of the first conductive member and the second conductive member can contain copper, and the first conductive member and the second conductive member can also contain copper. When the conductive member includes the first conductive member and the second conductive member, in the stacking step, the transparent resin layer and the conductive member can be stacked on the transparent member with the first conductive member positioned closer to the transparent member than the second conductive member. The manufacturing method of the transparent antenna of the fourth state can include a removal step C that removes the second conductive member after the stacking step. In the removal step C, the second conductive member can be peeled off from the first conductive member. The manufacturing method of the fourth-state transparent antenna may include a processing step of patterning the first conductive member (e.g., processing it into a mesh) after removing step C. In this processing step, for example, the first conductive member may be etched while a patterned resist layer is disposed on it. If the transparent resin layer is not cured, the manufacturing method of the fourth-state transparent antenna may include a curing step of curing the transparent resin layer (the resin composition of the transparent resin layer) before, after, or before and after removing step C.

[0071] The fifth embodiment of the transparent antenna manufacturing method is a method for manufacturing a transparent antenna using a laminate having the above-mentioned substrate film, the above-mentioned transparent resin layer, and the above-mentioned conductive member having a first conductive member and a second conductive member. The method includes a removal step C in which the second conductive member is removed while the transparent resin layer in the laminate is located on the transparent member side closer than the conductive member.

[0072] The manufacturing method of the transparent antenna of the fifth state can include a curing step of curing a transparent resin layer (a resin composition of the transparent resin layer) while the transparent resin layer and the conductive member are deposited on the transparent member, either before, after, or before and after removing the second conductive member. In the curing step, the transparent resin layer can be cured while the transparent resin layer and the conductive member are deposited on the transparent member and the transparent resin layer is located closer to the transparent member than the conductive member. The manufacturing method of the transparent antenna of the fifth state can also include a processing step of patterning the first conductive member (e.g., processing it into a mesh) after removing the second conductive member (after removal step C). An example of the manufacturing method of the transparent antenna of the fifth state is a manufacturing method using a laminate containing the aforementioned substrate film, the aforementioned transparent resin layer (uncured transparent resin layer), and the aforementioned conductive members having the first and second conductive members. This method includes the aforementioned removal step A (first removal step), lamination step, curing step, and removal step C (second removal step). In the manufacturing method of the transparent antenna of the fifth state, at least one of the first conductive member and the second conductive member may contain copper, and the first conductive member and the second conductive member may also contain copper. Furthermore, the first conductive member in the laminate may be solid or patterned (e.g., mesh).

[0073] In the manufacturing methods of the transparent antennas of the first to fifth states described above, the steps and configurations described above can be combined with each state. For example, in the manufacturing method of the transparent antenna of the fifth state, the manufacturing method of the transparent antenna of the fourth state can utilize the steps and configurations described above.

[0074] The image display device of this embodiment includes a transparent antenna. The image display device may have an image display section for displaying images and a frame section (border section) surrounding the image display section, and the transparent antenna may be disposed on the image display section. The image display device can be used in various electronic devices such as personal computers, car navigation systems, mobile phones, clocks, and electronic dictionaries.

[0075] Figures 3 and 4 are schematic cross-sectional views showing an example of an image display device, and illustrate the image display section of the device. The image display device 100 in Figure 3 includes a transparent antenna 110, a protective layer 120 disposed on the transparent antenna 110, and a transparent covering member 130 disposed on the protective layer 120. The transparent antenna 110 includes a transparent substrate 110a and a mesh conductive member 110b disposed on the transparent substrate 110a. The image display device 200 in Figure 4 includes a transparent antenna 210, a protective layer 220 disposed on the transparent antenna 210, and a transparent covering member 230 disposed on the protective layer 220. The transparent antenna 210 includes a transparent member 210a, a transparent substrate 210b disposed on the transparent member 210a, and a mesh conductive member 210c disposed on the transparent substrate 210b. The transparent substrates 110a and 210b are made of a cured material according to this embodiment. The conductive members 110b and 210c are formed of copper. The transparent component 210a is formed of polyolefin. Protective layers 120 and 220 cover the transparent substrates 110a and 210b and the conductive components 110b and 210c. The protective layers 120 and 220 can be formed from the resin composition or cured product of this embodiment, or from a material having a total light transmittance of 90% or more. The covered components 130 and 230 can be glass plates. [Example]

[0076] The present disclosure will now be described in more detail with reference to embodiments and comparative examples, but the present disclosure is not limited to the following embodiments.

[0077] <Preparation of Resin Varnish> (Example 1) A resin varnish was obtained by mixing 80 parts by weight of elastomer 1 (styrene-based elastomer, hydrogenated styrene-butadiene rubber, manufactured by JSR Corporation, product name: DYNARON 2324P, weight average molecular weight: 1.0×10⁵), 20 parts by weight of acrylic compound 1 (acrylic monomer, 1,9-nonanediol diacrylate, manufactured by Showa Denko Materials Co., Ltd., product name: FA-129AS, molecular weight 268), 0.1 parts by weight of thermal polymerization initiator (thermal free radical polymerization initiator, α,α'-bis(tert-butylperoxy)diisopropylbenzene, manufactured by NOF CORPORATION, product name: PERBUTYL P), and 125 parts by weight of solvent (toluene) while stirring.

[0078] The elastic modulus (tensile elastic modulus) of a single film (a film composed of elastomer 1) was measured using the following steps. First, a toluene solution of elastomer 1 (solid content concentration: 40% by mass) was prepared and then coated onto the release surface of a surface-treated PET film (manufactured by YASUI SEIKI CO.,LTD., product name: SNC-300) using a doctor blade coater. Then, the PET film was removed after drying at 100°C for 20 minutes in a dryer (manufactured by FUTABA KAGAKU IBARAKI co.,ltd., product name: MSO-80TPS), thereby obtaining a single film (length: 50 mm, width: 10 mm, thickness: 100 μm). The stress-strain curve of a single membrane was measured using an AUTOGRAPH instrument (manufactured by Shimadzu Corporation, product name: EZ-S) at 25°C, and the elastic modulus was determined from the stress-strain curve. The clamping distance was set to 20 mm, and the stretching speed was set to 50 mm / min. Values ​​from 0.5 N to 1.0 N were measured as the elastic modulus. The elastic modulus of the single membrane of elastomer 1 was 10 MPa. The elastic modulus of the following single membranes were measured using the same procedure as for the single membrane of elastomer 1.

[0079] (Examples 2-5) Except for replacing elastomer 1, using elastomers 2 to 5 (styrene-based elastomers, styrene-butadiene rubber) as shown in Table 1, the process was carried out in the same manner as in Example 1, thereby obtaining a resin varnish.

[0080] Elastomer 2: Manufactured by CRAY VALLEY, product name "Ricon 100", quantity average molecular weight 4500 Elastomer 3: Manufactured by ASAHI KASEI CORPORATION, product name "Asaflex 810", MFR (ISO 1133, 200℃, 5kgf) 5g / 10min, Fica softening temperature (ISO 306, 10N, 50℃ / h) 83℃, elastic modulus of a single film 314MPa Elastomer 4: Manufactured by ASAHI KASEI CORPORATION, product name "Asaflex 830", MFR (ISO 1133, 200℃, 5kgf) 6g / 10min, Fica softening temperature (ISO 306, 10N, 50℃ / h) 72℃, elastic modulus of a single film 301MPa Elastomer 5: Manufactured by ASAHI KASEI CORPORATION, product name "Asaflex 840", MFR (ISO 1133, 200℃, 5kgf) 7g / 10min, Fica softening temperature (ISO 306, 10N, 50℃ / h) 81℃, elastic modulus of a single film 387MPa

[0081] (Examples 6-11) Except for replacing acrylic compound 1, using acrylic compounds 2-3 or methacrylic compounds 1-4 as shown in Table 1, the process was carried out in the same manner as in Example 1, thereby obtaining a resin varnish.

[0082] Acrylic compound 2: 1,10-Decanediol diacrylate, manufactured by Tokyo Chemical Industry Co., Ltd., product name "1,10-Bis(acryloyloxy)decane:1,10-bis(acryloyloxy)decane" Acrylic compound 3: Tricyclodecanediethanol diacrylate, manufactured by SHIN-NAKAMURA CHEMICAL CO.,LTD., product name "A-DCP" 1:1,9-Nonanediol dimethacrylate, a methacrylate compound, is manufactured by SHIN-NAKAMURA CHEMICAL CO.,LTD., and its product name is "NOD-N". Methacrylate compound 2: 1,10-decanediol dimethacrylate, manufactured by SHIN-NAKAMURA CHEMICAL CO.,LTD., product name "DOD-N". Methacrylate compound 3: 1,12-Dodecanediol Dimethacrylate, manufactured by Tokyo Chemical Industry Co., Ltd., product name "1,12-Dodecanediol Dimethacrylate:1,12-Dodecanediol Dimethacrylate". Methacrylate compound 4: Tricyclodecanediethanol dimethacrylate, manufactured by SHIN-NAKAMURA CHEMICAL CO.,LTD., product name "DCP"

[0083] (Comparative Example 1) Except for replacing 0.1 parts by weight of the thermal polymerization initiator, 1.5 parts by weight of the photopolymerization initiator (photoradical generator, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, manufactured by BASF, product name: IRGACURE 819) was used, and the amount of solvent was adjusted to make the total amount of resin varnish equal to that in Example 1, the process was carried out in the same manner as in Example 1, thereby obtaining the resin varnish.

[0084] <Evaluation of membrane fabrication> As the substrate film, a surface-release treated PET film (manufactured by Teijin Dupont Film Japan Limited, product name: PUREX A31, thickness: 38μm) was prepared. The aforementioned resin varnish was applied to the release-treated surface of this PET film using a doctor blade coater (manufactured by YASUI SEIKI CO.,LTD., product name: SNC-300). Then, a resin film was formed by drying at 100°C for 20 minutes in a dryer (manufactured by FUTABA KAGAKU IBARAKI co.,ltd., product name: MSO-80TPS). The thickness of the dried resin film was adjusted to 100μm by adjusting the gap of the coater. After preparing a surface-release treated PET film identical to the substrate film as a protective film, the release-treated surface of the protective film was attached to the resin film, thereby obtaining a laminated film.

[0085] By heat-curing the resin film obtained by using the resin varnishes of Examples 1 to 11 in a dryer (manufactured by FUTABA KAGAKU IBARAKI co.,ltd., product name: MSO-80TPS), an evaluation film with cured film was obtained.

[0086] By using an ultraviolet exposure machine (MIKASA CO.,LTD, product name: ML-320FSAT), a laminated film having a resin film obtained using the resin varnish of Comparative Example 1 was photocured by irradiating the film with ultraviolet light (wavelength 365nm) at 2000mJ / cm2, thereby obtaining an evaluation film with a cured film.

[0087] <Characteristic Evaluation> (YI, total light transmittance, and haze) Test pieces were obtained by cutting 30mm long and 30mm wide laminates from the aforementioned evaluation film, removing the substrate film and protective film from the laminates. The YI (Yellow Index), total light transmittance, and haze of the test pieces were measured using a spectrophotometer (NIPPON DENSHOKU INDUSTRIES Co., Ltd., product name: SH7000) at 25°C. The results are shown in Table 1.

[0088] (Relative permittivity and dielectric loss tangent) After cutting a laminate with a length of 80 mm and a width of 80 mm from the aforementioned evaluation film as a test piece, the relative permittivity and dielectric loss tangent of the test piece were measured using a vector network analyzer (manufactured by Agilent Technologies Japan, Ltd., product name: E8364B) and a 10 GHz resonator (manufactured by Kanto Electronics Application and Development, Inc., product name: CP531) at 25°C using the separated column dielectric resonator method (SPDR method). Furthermore, after fabricating a laminate containing only the aforementioned substrate film and protective film (length: 80 mm, width: 80 mm), the relative permittivity and dielectric loss tangent of this laminate were measured using the same method. The relative permittivity and dielectric loss tangent of the cured film were obtained by subtracting the measurement results of the laminate from the measurement results of the test piece. The results are shown in Table 1.

[0089] (Elongation and elastic modulus) Test pieces were obtained by cutting a 40mm long and 10mm wide laminate from the aforementioned evaluation film, removing the substrate film and protective film from the laminate. The stress-strain curves of the test pieces were measured using an AUTAGRAPH (manufactured by Shimadzu Corporation, product name: EZ-S) at 25°C, and the elongation and elastic modulus (tensile elastic modulus) were determined from the stress-strain curves. The clamping distance was set to 20mm, and the tensile speed was set to 50mm / min. The elongation at break was measured as the elongation. The elastic modulus was measured under loads ranging from 0.5N to 1.0N. The results are shown in Table 1.

[0090] [Table 1] unit Example Comparative example 1 2 3 4 5 6 7 8 9 10 11 1 composition Elastomer 1 Quality 80 80 80 80 80 80 80 80 Elastomer 2 80 Elastomer 3 80 Elastomer 4 80 Elastomer 5 80 Acrylic compound 1 20 20 20 20 20 20 Acrylic compound 2 20 Acrylic compound 3 20 Methacrylic acid compounds 1 20 Methacrylic acid compound 2 20 Methacrylic acid compounds 3 20 Methacrylic acid compounds 4 20 Thermal polymerization initiator 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Photopolymerization initiator 1.5 Feature Evaluation YI - 0.55 0.40 0.54 0.52 0.61 0.51 0.55 0.43 0.45 0.43 0.37 0.75 Total light transmittance % 92.12 90.98 90.50 90.38 90.33 92.08 92.01 92.09 92.08 92.11 92.18 92.02 Haze % 1.37 1.82 1.49 1.57 1.49 1.81 1.73 1.46 1.70 1.90 1.48 1.76 Relative permittivity - 2.23 2.25 2.26 2.24 2.23 2.22 2.22 2.19 2.32 2.21 2.31 2.20 Dielectric loss tangent - 0.0038 0.0040 0.0038 0.0039 0.0039 0.0040 0.0043 0.0023 0.0024 0.0041 0.0031 0.0035 elongation % 899 7 86 48 71 785 888 686 534 554 667 800 Elasticity coefficient MPa 0.8 182.1 226.1 245.6 201.3 0.9 7.4 0.9 0.8 1.3 0.6 1.7

[0091] 10, 20, 30: Laminated bodies 10a, 20a, 30a: Substrate film 10b, 20b, 30b: Transparent resin layer 10c: Protective film 20C, 30C, 30D, 110B, 210C: Conductive components 100, 200: Image display device 110, 210: Transparent Antenna 110a, 210b: Transparent substrate 120, 220: Protective layer 130, 230: Covered components 210a: Transparent component

Claims

1. A resin composition comprising an elastomer, a (meth)acrylic acid compound, and a thermal polymerization initiator, wherein the elastomer content is 50% by mass or more based on the total amount of the elastomer and the (meth)acrylic acid compound, and the (meth)acrylic acid compound comprises alkyl diol di(meth)acrylate.

2. The resin composition as claimed in claim 1, wherein the aforementioned (meth)acrylic acid compound comprises a compound represented by the following general formula (I), [Chemical 1] In formula (I), R1 represents a group comprising 9 or fewer carbon atoms and 2 or more oxygen atoms, and R2a and R2b represent hydrogen atoms or methyl groups, respectively.

3. The resin composition as described in claim 1 or claim 2, wherein the aforementioned thermal polymerization initiator comprises a peroxide.

4. The resin composition as described in claim 1 or claim 2, wherein the aforementioned thermal polymerization initiator comprises a dialkyl peroxide.

5. The resin composition as described in claim 1 or claim 2, wherein the aforementioned elastomer comprises a styrene-based elastomer.

6. A cured resin composition, wherein the cured resin composition is described in any one of claims 1 to 5.

7. A laminate comprising a substrate film and a transparent resin layer disposed on the substrate film, wherein the transparent resin layer comprises a resin composition as described in any one of claims 1 to 5 or a cured product as described in claim 6.

8. The laminate as described in claim 7, further comprising a conductive member disposed on the aforementioned transparent resin layer.

9. The laminate as described in claim 8, wherein the aforementioned conductive member contains copper.

10. The laminate as described in claim 8 or claim 9, wherein the thickness of the aforementioned conductive member is 2 μm or less.

11. The laminate as claimed in claim 8, wherein the aforementioned conductive member has a first conductive member disposed on the aforementioned transparent resin layer and a second conductive member disposed on the first conductive member, the first conductive member and the second conductive member containing copper.

12. A transparent antenna having a transparent substrate and a conductive member disposed on the transparent substrate, wherein the transparent substrate comprises the cured material described in claim 6.

13. The transparent antenna as described in claim 12, wherein the aforementioned conductive member is a mesh.

14. The transparent antenna as described in claim 12 or claim 13, wherein the aforementioned conductive component contains copper.

15. An image display device comprising a transparent antenna as described in any one of claims 12 to 14.

16. A method for manufacturing a transparent antenna, wherein the aforementioned transparent resin layer in any one of claims 7 to 11 is deposited on a transparent member.

17. A method for manufacturing a transparent antenna, wherein, in the laminated body described in claim 11, the aforementioned transparent resin layer is located on the transparent member side closer than the aforementioned conductive member, and the aforementioned transparent resin layer and the aforementioned conductive member are laminated on the aforementioned transparent member, the aforementioned second conductive member is removed.

18. A method for manufacturing a transparent antenna as claimed in claim 17, wherein the transparent resin layer is cured while the transparent resin layer and the conductive member are deposited on the transparent member before the second conductive member is removed.

19. A method for manufacturing a transparent antenna as described in claim 17 or claim 18, wherein the first conductive member is processed into a mesh after the second conductive member is removed.

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