Photovoltaic system

Abstract

A photoelectric system includes a plate, a support, and a photoelectric plate. The plate has a base plate and two side walls. The side walls are opposite to each other and connected to the base plate. The base plate and the side walls form an accommodating space. The support is located in the accommodating space. The support includes a main portion, a first side portion, and a second side portion. The first side portion extends from a first side of the main portion along one of the side walls and is coupled to said one of the side walls. The second side portion extends from a second side of the main portion. The first side is adjacent to the second side. The photoelectric plate is located in the accommodating space and above the main portion of the support.

Description

[Technical Field]

[0001] This disclosure relates to a photoelectric system, and more particularly to a photoelectric system comprising a building-integrated photovoltaic (BIPV) module. [Previous Technology]

[0002] With the rapid advancement of manufacturing technology, the costs associated with the production of solar photovoltaic panels and the power generation costs of solar photovoltaic panels are gradually decreasing. Therefore, building-integrated photovoltaic (BIPV) modules, which combine solar photovoltaic panels with the building envelope, have gradually become an attractive option for integrating power generation systems into buildings.

[0003] However, most commonly used building-integrated photovoltaic (BIPV) modules currently utilize brackets and frames to install solar photovoltaic panels on rooftops. These brackets and frames typically require significant manpower, time, and cost for installation and maintenance. For example, traditional installation structures use tracks to integrate photovoltaic panels into the roof structure to form a photovoltaic array. This process requires skilled workers to erect the tracks and install the photovoltaic panels onto the roof structure. This work usually needs to be done at considerable heights, thus requiring substantial labor and maintenance costs.

[0004] Therefore, how to propose an optoelectronic system that can solve the above problems is one of the problems that the industry is eager to invest R&D resources to solve. [Summary of the Invention]

[0005] In view of this, one object of this disclosure is to propose an optoelectronic system that can solve the above-mentioned problems.

[0006] One aspect of this disclosure relates to a photoelectric system comprising a plate, a support, and a photoelectric plate. The plate has a base plate and two side walls. The side walls are opposite to each other and connected to the base plate. The base plate and the side walls form an accommodating space. The support is located in the accommodating space. The support includes a main portion, a first side portion, and a second side portion. The first side portion extends from a first side of the main portion along one of the side walls and is coupled to said one of the side walls. The second side portion extends from a second side of the main portion. The first side is adjacent to the second side. The photoelectric plate is located in the accommodating space and above the main portion of the support.

[0007] In some embodiments, the support is made of a single-piece continuous material.

[0008] In some embodiments, the top surface of the photoelectric plate is lower than the multiple top surfaces of the side walls.

[0009] In some embodiments, the second side portion of the bracket extends from the second side of the main portion toward the bottom plate of the plate body by a distance greater than 1 mm.

[0010] In some embodiments, the second side portion separates from the plate.

[0011] In some embodiments, the first side portion is separated from the second side portion.

[0012] In some embodiments, the first side portion is connected to the second side portion.

[0013] In some embodiments, the first side portion extends along one of the two side walls to the base plate and is attached to the base plate.

[0014] In some embodiments, the ratio between the area of ​​the main part of the bracket and the area of ​​the photoelectric plate is between 1% and 40%.

[0015] In some embodiments, the ratio between the area of ​​the first side portion of the bracket and the area of ​​the photoelectric plate is between 0.3% and 10%.

[0016] In some embodiments, the support further includes a third side portion. The third side portion is connected to one side of the first side portion. The one side is relative to the first side of the main portion. The third side portion extends away from one of the two side walls.

[0017] In some embodiments, the optoelectronic system further includes a cable electrically connected to the optoelectronic board. The cable is located within an accommodating space. The cable is mounted on a bracket via a third side portion.

[0018] Another aspect of this disclosure relates to a photoelectric system including a plate, a support, and a photoelectric plate. The plate has a base plate and two side walls. The side walls are opposite to each other and connected to the base plate. The base plate and the side walls form an accommodating space. The support is located in the accommodating space. The support includes two first side portions and a second side portion. The two first side portions are respectively attached to a plurality of inner surfaces of the side walls. The second side portion is located between the two first side portions. The photoelectric plate is located in the accommodating space. The photoelectric plate is mounted on the support. The top surface of the photoelectric plate is lower than the plurality of top surfaces of the side walls.

[0019] In some embodiments, the two first side portions extend along the plurality of inner surfaces of the two side walls, respectively.

[0020] In some embodiments, the second side portion of the bracket extends toward the bottom plate of the plate and separates from the plate.

[0021] In some embodiments, each of the two first side portions is separated from the second side portion.

[0022] In some embodiments, each of the two first side portions is connected to the second side portion.

[0023] In some embodiments, at least one of the two first side portions extends below the second side portion and is attached to the base plate.

[0024] In some embodiments, the ratio between the area of ​​one of the two first side portions of the bracket and the area of ​​the photoelectric plate is between 0.3% and 10%.

[0025] In some embodiments, the photoelectric plate is mounted on the bracket via the mounting surface of the bracket, and the ratio between the area of ​​the mounting surface and the area of ​​the photoelectric plate is between 1% and 40%.

[0026] In summary, in the optoelectronic systems of some embodiments of this disclosure, the optoelectronic panel is embedded in the receiving space of the roof thin panel by a bracket to form a module before the roof thin panel is installed. In this way, the module can be installed using the same method as conventional roof thin panels. Therefore, fewer assembly steps are required on the building roof after the module is formed. Compared to common optoelectronic systems, the optoelectronic systems of some embodiments of this disclosure can reduce the time and cost associated with high-altitude operations.

[0027] These and other aspects of this disclosure will become apparent from the following description of preferred embodiments in conjunction with the drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concept of this disclosure.

Implementation Method

[0029] The following disclosure will be described more fully herein through drawings and references, some exemplary embodiments of which are illustrated in the drawings. This disclosure may be implemented in different forms and should not be limited to the embodiments mentioned below. However, these embodiments are provided to aid in a more complete understanding of the contents of this disclosure and to fully convey the scope of this disclosure to those skilled in the art.

[0030] In the drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals refer to similar elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, no intermediate elements are present. As used in this disclosure, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0031] It should be understood that although the terms "first," "second," "third," etc., may be used in this disclosure to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, the "first element," "component," "region," "layer," or "part" discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this disclosure.

[0032] The terminology used herein is for the purpose of describing particular embodiments only and is not restrictive. As used in this disclosure, unless the content clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms, including "at least one." "Or" means "and / or." As used in this disclosure, the term "and / or" includes any and all combinations of one or more of the associated listed items. It should also be understood that, when used in this specification, the terms "comprising" and / or "comprising" specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or combinations thereof.

[0033] Furthermore, relative terms such as "below" or "bottom" and "above" or "top" may be used in this disclosure to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in a figure is flipped, an element described as being "below" to another element will be oriented "above" to that element. Thus, the exemplary term "below" can include both "below" and "above" orientations, depending on the specific orientation of the figure. Similarly, if a device in a figure is flipped, an element described as being "below" or "below" to another element will be oriented "above" to that element. Thus, the exemplary term "below" or "below" can include both "above" and "below" orientations.

[0034] As used in this disclosure, "about," "approximately," or "substantially" includes the value and the average of the values ​​within an acceptable range of deviations from a particular value as determined by one of skill in the art, taking into account the measurement in question and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used in this disclosure, "about," "approximately," or "substantially" may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etched, or other properties, and not necessarily apply to all properties with a single standard deviation.

[0035] Unless otherwise defined, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined in this disclosure.

[0036] This disclosure describes exemplary embodiments with reference to cross-sectional views as schematic diagrams of idealized embodiments. Therefore, shape variations in the illustrations can be anticipated as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to specific shapes of the regions shown in this disclosure, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0037] Figure 1A is a schematic diagram of an optoelectronic system 10 according to some embodiments of the present disclosure. Figure 1B is a side view of an optoelectronic system 10 according to some embodiments of the present disclosure. Figures 1C, 1D, 1E and 1F are enlarged views of a portion of an optoelectronic system 10 according to some embodiments of the present disclosure.

[0038] The optoelectronic system 10 includes multiple modules. Each module includes a board 100, a bracket 200, and an optoelectronic board 300, as shown in Figures 1A and 1B.

[0039] The panel 100 has a base plate 110 and two side walls 120, as shown in Figure 1B. The base plate 110 may be a corrugated sheet or a box profile sheet to provide structural strength and versatility. The two side walls 120 are connected to the base plate 110. The two side walls 120 are opposite to each other. The base plate 110 and the two side walls 120 together form an accommodating space S. In some embodiments, the panel 100 serves as a roof slab. The two side walls 120 each have a C-shaped structure at their top. In this way, multiple panels 100 can be hinged together through the C-shaped structure. Detailed features of the C-shaped structure will be described in subsequent paragraphs. In some embodiments, the panel 100 may be made of a single-piece continuous material. For example, the panel 100 may be a substantially U-shaped panel formed by a metal rolling process. This substantially U-shaped design is particularly advantageous for roofing applications because it allows for drainage and increases load-bearing capacity. In some embodiments, the thickness of the plate 100 can be between 0.2 mm and 4.6 mm.

[0040] Please refer to Figures 1C to 1F, which illustrate the hinged arrangement of the C-shaped structures of the sidewalls of two adjacent modules in different embodiments of this disclosure. In some embodiments, as shown in Figures 1C and 1D, the C-shaped structure of sidewall 120-1 of one module and the C-shaped structure of sidewall 120-2 of another module have complementary profiles and are configured to engage tightly together. In other embodiments, as shown in Figures 1E and 1F, the C-shaped structure of sidewall 120-1 of one module and the C-shaped structure of sidewall 120-2 of another module have interlocking curved sections and a gap therebetween.

[0041] Please refer again to Figure 1B. The bracket 200 is located in the accommodating space S. The bracket 200 has a main portion 210 and two side portions 211. The main portion 210 spans over the base plate 110 of the plate body 100. The two side portions 211 extend from opposite sides of the main portion 210 along the two side walls 120 of the plate body 100. The bracket 200 is coupled to the two side walls 120 via the two side portions 211. In some embodiments, the two side portions 211 are secured to the inner surfaces of the two side walls 120 using mechanical fasteners such as rivets and screws (not shown). These fasteners provide a strong and reliable connection to ensure the stability of the bracket 200. In other embodiments, the two side portions 211 are adhered to the inner surfaces of the two side walls 120 using silicone, VHB tape, a combination thereof, or the like. In some other embodiments, a cold forming process may be performed to form a riveted joint between the side portion 211 and the side wall 120, further enhancing the structural strength of the bracket 200.

[0042] In addition, the support 200 also includes two side portions 212 (one of which is not fully shown in the drawing due to the angle of the illustration) to enhance the load-bearing capacity of the support 200. The two side portions 212 extend downwards toward the base plate 110 of the plate body 100 from other opposite sides of the main portion 210 (different from the opposite sides where the aforementioned side portions 211 are located). In some embodiments, the two side portions 212 extend from the main portion 210 by a distance D. The distance D can be greater than 1 mm. For example, the distance D can be between 3 mm and 15 mm. Such extension ensures that the support 200 effectively distributes the load and maintains its structural strength under various conditions.

[0043] The photovoltaic panel 300 is located in the accommodating space S and above the main portion 210 of the support 200, as shown in Figure 1B. The photovoltaic panel 300 may include multiple individual solar cells (not shown) interconnected, but this disclosure is not limited thereto. In some embodiments, the photovoltaic panel 300 is mounted to the mounting surface of the main portion 210 of the support 200 using an adhesive 220 such as silicone or acrylic foam double-sided tape to ensure that the photovoltaic panel 300 is securely held in place. The top surface of the photovoltaic panel 300 is lower than the top surface of the sidewall 120. In other words, the photovoltaic panel 300 is not higher than the sidewall 120, making the module of the photovoltaic system 10 an embedded structure. This embedded structure has several advantages, including enhanced protection of the photovoltaic panel 300 from environmental impacts and a more streamlined appearance. In some embodiments, two to ten supports 200 may be attached to the plate 100 before the photoelectric plate 300 is installed, so that the load of the photoelectric plate 300 is evenly distributed on the supports 200 and the overall durability of the photoelectric system 10 is enhanced.

[0044] Please refer to Figure 2. Figure 2 is a perspective view of a bracket 200 according to some embodiments of the present disclosure. In these embodiments, the main portion 210 is substantially rectangular. As previously described, two side portions 211 extend from two opposite sides of the main portion 210, and two side portions 212 extend from two other opposite sides of the main portion 210. For example, one side portion 211 extends from a first side 210a of the main portion 210, and one side portion 212 extends from a second side 210b of the main portion 210. The first side 210a is adjacent to the second side 210b. In some embodiments, each side portion 212 is located between and separate from the two side portions 211. In this configuration, the bracket 200 can be made of a single continuous material. For example, the bracket 200 can be made of a sheet metal formed by metal stamping or casting. In some embodiments, the thickness of the metal plate forming the support 200 can be between 0.6 mm and 3 mm. Furthermore, referring again to Figure 1B, the side portion 212 is separated from the side wall 120 of the plate body 100, and the side portion 212 is separated from the bottom plate 110 of the plate body 100. Also, the support 200 is separated from the bottom plate 110 of the plate body 100.

[0045] To ensure that the bracket 200 provides sufficient support for the photoelectric plate 300, the ratio of the area of ​​the mounting surface of the main part 210 to the area of ​​the photoelectric plate 300 is between 1% and 40%. Meanwhile, to ensure sufficient structural strength to fix the bracket 200 and the photoelectric plate 300 to the plate body 100, the ratio of the area of ​​the side part 211 of the bracket 200 to the area of ​​the photoelectric plate 300 is between 0.3% and 10%.

[0046] By integrating the photovoltaic panel 300 into the accommodating space S of the panel body 100 using the bracket 200, an embedded building-integrated photovoltaic (BIPV) module is formed. This embedded module can serve as a support structure when the photovoltaic panel 300 is connected. The embedded module can be installed on the roof in a manner similar to that of a conventional roof panel. Furthermore, since the bracket 200 and the photovoltaic panel 300 are pre-installed before the embedded module is installed on the roof, the assembly steps performed on the building roof after the embedded module is in place can be simplified. This pre-assembly not only simplifies installation but also reduces the risks associated with working at heights.

[0047] Please refer to Figure 3. Figure 3 is a perspective view of a bracket 200A according to some embodiments of this disclosure. The difference between bracket 200A and bracket 200 is that bracket 200A has multiple slots. The slots serve a dual purpose: they reduce the overall weight of bracket 200A and facilitate the installation of rivets or cinch processes. Specifically, the slots are strategically placed to ensure that the required structural strength is maintained despite the reduced material usage of bracket 200A. Furthermore, the slots allow riveting or cinch tools to access the side portion 211 from above, making it easier to rivet or cold-form the side portion 211 to the sidewall 120. This design simplifies the assembly process and ensures that bracket 200A can be attached more easily and securely.

[0048] Please refer to Figure 4. Figure 4 is a perspective view of a bracket 200B according to some embodiments of this disclosure. The difference between bracket 200B and bracket 200 is that side portions 211 and 212 of bracket 200B are interconnected to improve the structural strength of bracket 200B. In detail, bracket 200B can be an integrally formed sheet metal box. The sheet metal box has two opposing inclined sidewalls and two opposing vertical sidewalls. The two opposing inclined sidewalls correspond to the aforementioned side portion 211, and the two opposing vertical sidewalls correspond to the aforementioned side portion 212. This configuration ensures that bracket 200B can better withstand various stresses and loads.

[0049] Please refer to Figures 5 and 6. Figure 5 is a perspective view of the bracket 200C according to some embodiments of the present disclosure. Figure 6 is a schematic diagram of the optoelectronic system 10' according to some embodiments of the present disclosure.

[0050] The difference between bracket 200C and bracket 200 is that bracket 200C also includes two side portions 213. The two side portions 213 correspond to two side portions 211. Each side portion 213 is connected to the side of the corresponding side portion 211 away from the main portion 210 (e.g., the side of side portion 211 opposite to the first side 210a of the main portion 210). Each side portion 213 extends toward the main portion 210 and is located below side portion 212, forming a V-shape.

[0051] The difference between optoelectronic system 10' and optoelectronic system 10 is that optoelectronic system 10' includes a bracket 200C as shown in Figure 5 and a cable 400 electrically connected to the optoelectronic board 300. As shown in Figure 6, after the bracket 200C is coupled to the board 100, each side portion 213 extends away from its adjacent sidewall 120 and toward the main portion 210. The cable 400 is located on one of the side portions 213, thereby being mounted to the bracket 200C. Furthermore, the cable 400 is located between the main portion 210 and the aforementioned side portions 213. In this way, the cable 400 is housed below the optoelectronic board 300 and within the housing space S, which prevents the cable 400 from becoming tangled with other cables. This configuration facilitates more efficient cable management for large optoelectronic systems, thereby reducing maintenance requirements during the service life of the optoelectronic system.

[0052] Please refer to Figures 7 and 8. Figure 7 is a perspective view of the bracket 200D according to some embodiments of the present disclosure. Figure 8 is a side view of the optoelectronic system 10” according to some embodiments of the present disclosure.

[0053] The difference between bracket 200D and bracket 200 is that the side portion 211 of bracket 200D extends further away from the main portion 210 and extends below the side portion 212. In some embodiments, as shown in Figure 7, the extended portion of the side portion 211 bends inward to form a C-shape.

[0054] The difference between optoelectronic system 10” and optoelectronic system 10 is that optoelectronic system 10” includes a bracket 200D as shown in Figure 7. The side portion 211 of bracket 200D extends and bends along the inner surface of sidewall 120, reaching downwards to base plate 110. Furthermore, the portion of side portion 211 along sidewall 120 is attached to sidewall 120 using adhesive 130, and the portion of side portion 211 above base plate 110 is attached to base plate 110 using adhesive 140. In some embodiments, adhesive 130 and adhesive 140 can be silicone resin, acrylic foam double-sided tape, combinations thereof, or the like. In these embodiments, the structural strength of bracket 200D is further enhanced.

[0055] As can be clearly seen from the detailed description of the specific embodiments disclosed above, in some embodiments of the optoelectronic system disclosed herein, before installing the roof thin panel, the optoelectronic panel is embedded in the receiving space of the roof thin panel by a bracket to form a module. In this way, the module can be installed using the same method as conventional roof thin panels. Therefore, fewer assembly steps are required on the building roof after the module is formed. Compared to common optoelectronic systems, some embodiments of the optoelectronic system disclosed herein can reduce the time and cost associated with high-altitude operations.

[0056] The foregoing description is only intended to illustrate and describe exemplary embodiments of the present disclosure and is not intended to exhaustively describe or limit the precise form of the invention disclosed herein. The above teachings may be modified or varied.

[0057] The selected and illustrated embodiments are intended to explain the content of this disclosure and their practical application, thereby inspiring those skilled in the art to utilize this disclosure and various embodiments, and to make various modifications to suit a particular intended use. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure is determined by the claims of the appended invention claims, and not by the foregoing specification and the exemplary embodiments described therein. [Simplified Explanation of the Diagram]

[0028] The drawings illustrate one or more embodiments of the present disclosure and, together with the written description, serve to explain the principles of the present disclosure. Throughout the drawings, the same reference numerals are used as much as possible to refer to similar or identical elements of the embodiments, wherein: Figure 1A is a schematic diagram of an optoelectronic system according to some embodiments of the present disclosure. Figure 1B is a side view of an optoelectronic system according to some embodiments of the present disclosure. Figures 1C, 1D, 1E, and 1F are partial enlarged views of an optoelectronic system according to some embodiments of the present disclosure. Figure 2 is a perspective view of a support for an optoelectronic system according to some embodiments of the present disclosure. Figure 3 is a perspective view of a support for an optoelectronic system according to some embodiments of the present disclosure. Figure 4 is a perspective view of a support for an optoelectronic system according to some embodiments of the present disclosure. Figure 5 is a perspective view of a support for an optoelectronic system according to some embodiments of the present disclosure. Figure 6 is a schematic diagram of an optoelectronic system according to some embodiments of the present disclosure. Figure 7 is a perspective view of a support for an optoelectronic system according to some embodiments of the present disclosure. Figure 8 is a side view of an optoelectronic system according to some embodiments of the present disclosure. [Biomaterial Storage]

[0059] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A photoelectric system comprising: a plate having a base plate and two side walls, wherein the two side walls are opposite to each other and connected to the base plate, and the base plate and the two side walls form an accommodating space; a bracket in the accommodating space including a main portion, a first side portion and a second side portion, wherein the first side portion extends from a first side of the main portion along an inner surface of one of the two side walls toward the base plate and is coupled to the one of the two side walls, the second side portion extends from a second side of the main portion and the first side is adjacent to the second side; and a photoelectric plate in the accommodating space and above the main portion of the bracket.

2. The optoelectronic system as claimed in claim 1, wherein the support is made of a single-piece continuous material.

3. The photoelectric system as claimed in claim 1, wherein a top surface of the photoelectric plate is lower than a plurality of top surfaces of the two side walls.

4. The optoelectronic system as claimed in claim 1, wherein the second side portion of the bracket extends from the second side of the main portion toward the base plate of the plate by a distance greater than 1 mm.

5. The optoelectronic system as claimed in claim 1, wherein the second side portion is separated from the plate.

6. The optoelectronic system as claimed in claim 1, wherein the first side portion is separated from the second side portion.

7. The optoelectronic system as claimed in claim 1, wherein the first side portion is connected to the second side portion.

8. The optoelectronic system as claimed in claim 1, wherein the first side portion extends along one of the two side walls to the base plate and is attached to the base plate.

9. The optoelectronic system as claimed in claim 1, wherein the ratio between the area of ​​the main portion of the bracket and the area of ​​the optoelectronic panel is between 1% and 40%.

10. The photoelectric system as claimed in claim 1, wherein the ratio between an area of ​​the first side portion of the bracket and an area of ​​the photoelectric plate is between 0.3% and 10%.

11. The optoelectronic system as claimed in claim 1, wherein the bracket further includes a third side portion connected to one side of the first side portion, the third side portion being relative to the first side of the main portion, and the third side portion extending away from the two side walls.

12. The photoelectric system as claimed in claim 11 further includes a cable electrically connected to the photoelectric panel, wherein the cable is in the receiving space and mounted on the bracket through the third side portion.

13. A photoelectric system comprising: a plate having a base plate and two side walls, wherein the side walls are opposite to each other and connected to the base plate, and the base plate and the side walls form an accommodating space; a support in the accommodating space including two first side portions and a second side portion, wherein the two first side portions are respectively attached to a plurality of inner surfaces of the side walls and extend along the inner surfaces of the side walls, and the second side portion is located between the two first side portions; and a photoelectric plate in the accommodating space, wherein the photoelectric plate is mounted on the support, and a top surface of the photoelectric plate is lower than a plurality of top surfaces of the side walls.

14. The optoelectronic system as claimed in claim 13, wherein the second side portion of the bracket extends toward and separates from the base plate of the plate.

15. The optoelectronic system as claimed in claim 13, wherein each of the two first side portions is separated from the second side portion.

16. The optoelectronic system as claimed in claim 13, wherein each of the two first side portions is connected to the second side portion.

17. The optoelectronic system as claimed in claim 13, wherein at least one of the two first side portions extends below the second side portion and is attached to the base plate.

18. The photoelectric system as claimed in claim 13, wherein the ratio between the area of ​​one of the two first side portions of the bracket and the area of ​​the photoelectric plate is between 0.3% and 10%.

19. The optoelectronic system as claimed in claim 13, wherein the optoelectronic panel is mounted on the bracket via a mounting surface of the bracket, and the ratio between an area of ​​the mounting surface and an area of ​​the optoelectronic panel is between 1% and 40%.

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