Resin composition

Abstract

This invention provides a resin composition. The resin composition includes a resin (A), a filler (B), and an organically modified clay (C). The organically modified clay (C) includes CT-APA, MP-250, GM-1958, SD-1, or a combination thereof.

Description

Technical Field

[0001] This invention relates to a resin composition. Prior Technology

[0002] With the development of semiconductor technology, advanced packaging places high demands on the dimensional stability and heat resistance of substrate materials. However, the high filler content of currently used substrate materials makes them prone to sedimentation, leading to problems in transportation and storage, which in turn affects production efficiency and product yield. Therefore, a solution to these problems is urgently needed. Summary of the Invention

[0003] The present invention provides a resin composition that can form a substrate with good heat resistance and dielectric properties.

[0004] One resin composition of the present invention includes a resin (A), a filler (B), and an organically modified clay (C). The organically modified clay (C) includes CT-APA, MP-250, GM-1958, SD-1, or a combination thereof.

[0005] In one embodiment of the present invention, based on the total amount of the above-mentioned resin composition used being 100 parts by weight, the amount of organic modified clay (C) used is 0.1 to 2 parts by weight.

[0006] In one embodiment of the present invention, the resin (A) includes epoxy resin, bismaleimide resin, benzoxazine resin or a combination thereof.

[0007] In one embodiment of the present invention, based on the total amount of the above-mentioned resin components used being 100 parts by weight, the amount of epoxy resin used is 5 to 15 parts by weight, the amount of bismaleimide resin used is 10 to 25 parts by weight, and the amount of benzoxazine resin used is 10 to 25 parts by weight.

[0008] In one embodiment of the present invention, the filler (B) comprises silicon dioxide, zinc molybdate, or a combination thereof.

[0009] In one embodiment of the invention, the filler (B) comprises spherical silica. The median particle size of the spherical silica is 0.3 micrometers to 3.0 micrometers.

[0010] In one embodiment of the invention, the filler (B) comprises silicon dioxide with a surface modified acrylic or vinyl structure.

[0011] In one embodiment of the present invention, based on the total amount of the above-mentioned resin composition used being 100 parts by weight, the amount of resin (A) used is 20 to 40 parts by weight, and the amount of filler (B) used is 50 to 70 parts by weight.

[0012] In one embodiment of the present invention, the resin composition further includes an additive (D). The additive (D) includes a catalyst, a silicone coupling agent, or a combination thereof.

[0013] In one embodiment of the present invention, the amount of the above-mentioned resin (A) used is 100 parts by weight, the amount of the catalyst used is 0.1 parts by weight to 2 parts by weight, and the amount of the siloxane coupling agent used is 0.1 parts by weight to 5 parts by weight.

[0014] Based on the above, the resin composition of the present invention includes organic modified clay (C). This allows the substrate made from the resin composition to possess good heat resistance and dielectric properties, making it suitable for semiconductor devices.

[0015] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described in detail below. Simple Explanation of the Diagram

[0016] none Implementation

[0017] The following are embodiments that describe the contents of this invention in detail. The implementation details presented in the embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this invention. Anyone skilled in the art can modify or change these implementation details according to the needs of actual implementation. [<] [Resin Composition] [>]

[0018] This invention provides a resin composition comprising a resin (A), a filler (B), and an organically modified clay (C). Furthermore, the resin composition of this invention may, if desired, include additives (D). The various components described above will be described in detail below. [resin()] [A] [)]

[0019] There are no particular limitations on the resin (A), and an appropriate resin can be selected according to requirements. In this embodiment, resin (A) may include epoxy resin, bismaleimide (BMI) resin, benzoxazine (BX) resin, combinations thereof, or other suitable resins, preferably a combination of epoxy resin, bismaleimide resin, and benzoxazine resin.

[0020] Specific examples of epoxy resins may include PN-442K80 (trade name, epoxy equivalent weight (EEW) of 155 to 175; manufactured by Nan Ya Plastics Industrial Co., Ltd.), PN-431A70 (trade name, EEW of 200 to 240; manufactured by Nan Ya Plastics Industrial Co., Ltd.), PN-438K80 (trade name, EEW of 190 to 210; manufactured by Nan Ya Plastics Industrial Co., Ltd.) or other suitable epoxy resins, preferably PN-442K80 (trade name). The EEW of the epoxy resin may be 150 to 250, preferably 150 to 190.

[0021] Specific examples of bismaleimide resins may include BMI-50P (trade name, weight average molecular weight 568; manufactured by KI Chemical Industry Co., Ltd.), BMI-2300 (trade name, weight average molecular weight 568; manufactured by Yamato Chemical Co., Ltd.), BMI-70 (trade name, weight average molecular weight 578; manufactured by KI Chemical Co., Ltd.) or other suitable bismaleimide resins, preferably BMI-50P (trade name). The weight average molecular weight of the bismaleimide resin may be from 300 to 1000, preferably from 400 to 600.

[0022] Specific examples of benzoxazine resins may include KB-610F (trade name; manufactured by Kun Meng Chemical Industry Co., Ltd.), EU-237 (trade name; manufactured by Nan Ya Plastics Industry Co., Ltd.) or other suitable benzoxazine resins, preferably KB-610F (trade name). The weight average molecular weight of the benzoxazine resin may be from 200 to 1000, preferably from 500 to 700.

[0023] Based on a total usage of 100 parts by weight of resin components, the amount of epoxy resin used is 5 to 15 parts by weight (e.g., 5 parts by weight, 10 parts by weight, 15 parts by weight, or any value within the range of 5 to 15 parts by weight), preferably 8 to 12 parts by weight; the amount of bismaleimide resin used is 10 to 25 parts by weight (e.g., 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, or any value within the range of 10 to 25 parts by weight), preferably 12 to 20 parts by weight; and the amount of benzoxazine resin used is 10 to 25 parts by weight (e.g., 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, or any value within the range of 10 to 25 parts by weight), preferably 12 to 20 parts by weight.

[0024] Based on the total amount of resin components used being 100 parts by weight, the amount of resin (A) used is 20 to 40 parts by weight, preferably 30 to 38 parts by weight. [filler(] [B] [)]

[0025] There are no particular limitations on the filler (B), and appropriate fillers can be selected according to requirements. For example, filler (B) may include organic fillers, inorganic fillers, or combinations thereof, preferably inorganic fillers. In this embodiment, the inorganic filler may include silica, zinc molybdate, combinations thereof, or other suitable inorganic fillers. Silica may be spherical silica or other suitable shaped silica. The median particle size (D50) of the spherical silica may be from about 0.3 micrometers to 3.0 micrometers, preferably from 0.6 micrometers to 2 micrometers; the maximum particle size (D99) may be less than about 10 micrometers, preferably from 4 micrometers to 8 micrometers. Silica may be silica with acrylic or vinyl surface modification or silica with other suitable surface modification groups. For example, silica may be spherical silica with acrylic or vinyl surface modification or other suitable silica.

[0026] Based on the total amount of resin components used being 100 parts by weight, the amount of filler (B) used is 50 to 70 parts by weight, preferably 55 to 65 parts by weight. [Organic modified clay()] [C] [)]

[0027] Organic modified clay (C) includes CT-APA (trade name, manufactured by BYK), MP-250 (trade name, manufactured by BYK), GM-1958 (trade name, manufactured by BYK), SD-1 (trade name, manufactured by Elementis) or combinations thereof.

[0028] Based on the total amount of resin components used being 100 parts by weight, the amount of organic modified clay (C) used is 0.1 to 2 parts by weight, preferably 0.5 to 1 part by weight.

[0029] When the resin composition includes organic modified clay (C), the suspension properties of the resin composition can be improved, allowing it to be stored statically for a long time while maintaining good heat resistance and dielectric properties. When the amount of organic modified clay (C) used is within the above-mentioned preferred range, the resin composition can have better suspension properties while maintaining good heat resistance and dielectric properties. [additive(] [D] [)]

[0030] There are no particular limitations on the additive (D), and appropriate additives can be selected according to requirements. In this embodiment, additive (D) may include catalysts, siloxane coupling agents, combinations thereof, or other suitable additives. Additive (D) may be used alone or in combination.

[0031] There are no particular limitations on the catalyst; an appropriate catalyst can be selected based on requirements. Specific examples of catalysts may include DCP (trade name; manufactured by Arkema), 1B2PZ (trade name; manufactured by Shikoku Chemical Co., Ltd.), PercotaP (trade name; manufactured by Nippon Yusen Co., Ltd.), or other suitable catalysts. A single catalyst can be used, or multiple catalysts can be used in combination. Based on 100 parts by weight of resin (A), the amount of catalyst used is 0.1 to 2 parts by weight, preferably 0.5 to 1 part by weight. When a catalyst is included in the resin composition, the curing speed of the resin composition and the degree of cross-linking between the components in the resin composition can be improved.

[0032] There are no particular limitations on the silicone coupling agent; an appropriate silicone coupling agent can be selected according to requirements. Specific examples of silicone coupling agents may include Z-6030 (trade name; manufactured by Dow Chemical Company), KBM-403 (trade name; manufactured by Shin-Etsu Chemical Industry), Z-6020 (trade name; manufactured by Dow Chemical Company), or other suitable silicone coupling agents, with Z-6030 being preferred. Silicone coupling agents can be used alone or in combination. Based on 100 parts by weight of resin (A), the amount of silicone coupling agent used is 0.1 to 5 parts by weight, preferably 0.1 to 2 parts by weight. When a silicone coupling agent is included in the resin composition, the compatibility and crosslinking degree between the components in the resin composition can be improved. [<] [Preparation method of resin composition] [>]

[0033] There are no particular limitations on the preparation method of the resin composition. For example, the components of the resin composition are placed in a stirrer and stirred until they are uniformly mixed into a solution. A solvent may be added if necessary. After mixing evenly, the resin composition is obtained.

[0034] The invention will be described in detail below with reference to examples. The following examples are provided to illustrate the invention, and the scope of the invention includes the scope described in the following claims, as well as their substitutions and modifications, but is not limited to the scope of the examples. [Examples of Resin Compositions]

[0035] Examples 1 to 8 of the resin composition and Comparative Example 1 are described below: [Example] [1] [To the Example] [8] [And comparative examples] [1]

[0036] Based on the contents of Table 1, the resin compositions of each experimental example were mixed with methyl ethyl ketone (MEK) to form varnishes. The prepared resin varnishes were evaluated using the following evaluation methods, and the results are shown in Table 1.

[0037] [Table 1] Ingredients (Unit: parts by weight) Example 1 2 3 4 5 6 Resin (A) Epoxy resin 9.7 9.8 9.7 9.8 9.7 9.8 BMI resin 14 14 14 14 14 14 BX resin 14 14 14 14 14 14 Packing material (B) Spherical silicon dioxide 61.7 61.9 61.7 61.9 61.7 61.9 Organic-modified clay (C) CT-APA 0.6 0.3 - - - - MP-250 - - 0.6 0.3 - - GM-1958 - - - - 0.6 0.3 SD-1 - - - - - - evaluate result Tg (Unit: °C) Before standing 291 299 282 289 288 287 After standing 290 295 284 289 289 290 Dielectric constant (Dk) Before standing 4.1 4.2 4.15 4.14 4.2 4.1 After standing 4.12 4.2 4.16 4.16 4.12 4.15 Dielectric loss (Df) Before standing 0.0089 0.0091 0.0085 0.0090 0.0092 0.0094 After standing 0.0090 0.0092 0.0087 0.0093 0.0090 0.0092 CTE (unit: ppm / ℃) Before standing 5.1 5.5 6.3 6.1 6.1 5.4 After standing 5.2 5.6 6.0 6.0 5.7 5.6 Water absorption rate (unit:%) Before standing 0.35 0.47 0.61 0.51 0.44 0.47 After standing 0.36 0.48 0.57 0.50 0.36 0.48 Static suspension time (unit: hours) 400 380 370 360 350 340

[0038] [Table 1] (continued) Ingredients (Unit: parts by weight) Example Comparative example 7 8 1 Resin (A) Epoxy resin 9.7 9.8 10 BMI resin 14 14 14 BX resin 14 14 14 Packing material (B) Spherical silicon dioxide 61.7 61.9 62 Organic-modified clay (C) CT-APA - - - MP-250 - - - GM-1958 - - - SD-1 0.6 0.3 - evaluate result Tg (Unit: °C) Before standing 290 292 298 After standing 291 289 - Dielectric constant (Dk) Before standing 4.08 4.15 4.15 After standing 4.09 4.18 - Dielectric loss (Df) Before standing 0.0088 0.0095 0.0093 After standing 0.0091 0.0097 - CTE (unit: ppm / ℃) Before standing 6.3 6.1 6.8 After standing 6.5 6.5 - Water absorption rate (unit:%) Before standing 0.51 0.54 0.45 After standing 0.54 0.55 - Static suspension time (unit: hours) 345 335 1 Epoxy resin: PN-442K80 (trade name) BMI Resin: BMI-50P (Product Name) BX Resin: KB-610F (Product Name) Spherical silicon dioxide: median particle size (D50) is about 0.95 micrometers, and maximum particle size (D99) is about 5 micrometers. [<] [Evaluation Method] [>] [a.] Glass transfer temperature () [glass transition temperature] [,] [Tg] [)]

[0039] The glass transition temperature (Tg) of the sample was measured using a dynamic mechanical analyzer (DMA). A higher Tg indicates that the resin composition has a good ability to resist phase changes, i.e., good heat resistance. Heating rate: 10℃ / min Temperature range: 25℃~350℃ (heating, cooling, heating) [b.] [Dielectric constant ()] [dielectric constant] [,] [Dk] [)]

[0040] The dielectric constant (Dk) of the sample was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). A smaller dielectric constant indicates that the resin composition has good dielectric properties. [c.] Dielectric loss () [dissipation factor] [,] [Df] [)]

[0041] The dielectric loss (Df) of the sample was measured at a frequency of 10 GHz using a dielectric analyzer (model E4991A, manufactured by Agilent Technologies). The lower the dielectric loss, the better the dielectric properties of the resin composition. [d.] Coefficient of thermal expansion () [coefficient of thermal expansion] [,] [CTE] [)]

[0042] The coefficient of thermal expansion (CTE) of the prepared resin composition was measured using a thermomechanical analyzer (model Q400, manufactured by TA Instruments). The smaller the CTE, the better the resin composition's ability to resist phase changes, i.e., good heat resistance. Heating rate: 10℃ / min Temperature range: 25℃~300℃ [e.] Water absorption rate

[0043] The prepared resin composition was placed in a constant temperature and humidity chamber, and the water absorption rate was measured when the temperature reached 121℃ and the humidity reached 100%. The lower the water absorption rate, the better the moisture resistance of the resin composition. [f.] [Stillness / Floating Time]

[0044] 500 cm³ of the prepared resin composition varnish was placed in a glass settling tube with a diameter of 5 cm and a length of 35 cm. It was then allowed to stand at room temperature (approximately 25°C). The formation of resin aggregates indicated the end of the suspension period. A longer suspension time demonstrated good suspension resistance of the resin composition. [<] [Evaluation Results] [>]

[0045] As shown in Table 1, when the resin composition includes a specific organic modified clay (C) (Examples 1-8), the varnish formed by the resin composition can still have good heat resistance and dielectric properties after being left to stand for a long time. That is, the values ​​of glass transition temperature (Tg), dielectric constant (Dk), dielectric loss (Df) and coefficient of thermal expansion (CTE) change little before and after standing.

[0046] Furthermore, when the resin composition does not include the specific organic modified clay (C) (Comparative Example 1), the varnish formed by the resin composition gradually forms lumps during standing. In other words, the resin composition that does not include the specific organic modified clay (C) has poor suspension properties and cannot be stored for a long time.

[0047] Furthermore, compared to resin compositions containing a smaller amount of organic modified clay (C) (Examples 2, 4, 6, 8), resin compositions containing a larger amount of organic modified clay (C) (Examples 1, 3, 5, 7) have a longer standing suspension time, i.e. better suspension properties, while maintaining good heat resistance and dielectric properties.

[0048] In summary, when the resin composition of the present invention includes a specific organic modified clay (C), the resin composition and the varnish formed therefrom can exhibit good suspending properties while maintaining good heat resistance and dielectric properties. Consequently, the substrate made from the resin composition can also exhibit good suspending properties while maintaining good heat resistance and dielectric properties, thus providing excellent applicability. Furthermore, the resin composition including the specific organic modified clay (C) can be stirred when needed to return from a high viscosity state to a low viscosity state for subsequent processing, further enhancing its applicability.

[0049] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0050] none

Claims

1. A resin composition comprising: Resin (A) includes a combination of epoxy resin, bismaleimide resin and benzoxazine resin; Packing material (B); And organic modified clay (C), including CT-APA, MP-250, GM-1958, SD-1 or combinations thereof.

2. The resin composition as claimed in claim 1, wherein the amount of the organic modified clay (C) used is from 0.1 to 2 parts by weight, based on a total amount of 100 parts by weight of the resin composition.

3. The resin composition as claimed in claim 1, wherein, based on a total usage of 100 parts by weight of the resin composition, the amount of the epoxy resin used is 5 to 15 parts by weight, the amount of the bismaleimide resin used is 10 to 25 parts by weight, and the amount of the benzoxazine resin used is 10 to 25 parts by weight.

4. The resin composition as claimed in claim 1, wherein the filler (B) comprises silicon dioxide, zinc molybdate, or a combination thereof.

5. The resin composition as claimed in claim 1, wherein the filler (B) comprises spherical silica with a mean particle size of 0.3 micrometers to 3.0 micrometers.

6. The resin composition as claimed in claim 1, wherein the filler (B) comprises silicon dioxide with a surface modified acrylic or vinyl structure.

7. The resin composition as claimed in claim 1, wherein, based on a total usage of 100 parts by weight of the resin composition, the amount of resin (A) used is from 20 to 40 parts by weight, and the amount of filler (B) used is from 50 to 70 parts by weight.

8. The resin composition as claimed in claim 1 further includes additive (D), said additive (D) including catalysts, siloxane coupling agents or combinations thereof.

9. The resin composition as claimed in claim 8, wherein the amount of the resin (A) used is 100 parts by weight, the amount of the catalyst used is from 0.1 parts by weight to 2 parts by weight, and the amount of the siloxane coupling agent used is from 0.1 parts by weight to 5 parts by weight.