Wafer dicing machine for improving working precision

Abstract

A wafer dicing machine for improving work precision includes a wafer dicing section, a wafer placement platform, a wafer gripping arm, a first cement base, a second cement base, and a third cement base. The wafer dicing section includes a first base and a dicing device, the dicing device being mounted on the first base. The wafer placement platform includes a second base and a support portion, the support portion being mounted on the second base. The wafer gripping arm includes a third base and a robotic arm, the robotic arm being mounted on the third base. The first base, second base, and third base are separate entities. The first cement base has a first bearing surface, the first base being mounted on the first bearing surface, with the wafer dicing section mounted on the first cement base. The second cement base has a second bearing surface, the second base being mounted on the second bearing surface, with the wafer placement platform mounted on the second cement base. The third cement base has a third bearing surface, the third base being mounted on the third bearing surface, with the wafer gripping arm mounted on the third cement base. The present invention separates the wafer dicing section, the wafer placement platform and the wafer gripping arm on the first cement base, the second cement base and the third cement base, thereby reducing the mutual influence of vibration during machine operation and effectively improving the precision of finished products.

Claims

1. A wafer dicing machine for improving working precision, comprising: A wafer dicing unit, comprising a first base and a dicing device, the dicing device being disposed on the first base; a wafer placement platform, comprising a second base and a support portion, the support portion being disposed on the second base; a wafer gripping arm, comprising a third base and a robotic arm, the robotic arm being disposed on the third base, the first base, the second base, and the third base being separate entities; a first cement base, the first cement base having a first bearing surface, the first base being disposed on the first bearing surface, such that the wafer dicing unit is disposed on the first cement base; A second cement base, the second cement base having a second bearing surface, the second base being disposed on the second bearing surface, such that the wafer placement platform is disposed on the second cement base; And a third cement base, the third cement base having a third bearing surface, the third base being disposed on the third bearing surface, such that the wafer gripping arm is disposed on the third cement base.

2. The wafer dicing machine for improving working precision as described in claim 1, wherein the first cement base, the second cement base, and the third cement base are fixed on a cement foundation, the first cement base, the second cement base, and the third cement base are separately disposed on the cement foundation, a plurality of first studs are provided on the first bearing surface of the first cement base for locking the first base of the wafer dicing section, a plurality of second studs are provided on the second bearing surface of the second cement base for locking the second base of the wafer placement platform, and a plurality of third studs are provided on the third bearing surface of the third cement base for locking the third base of the wafer gripping arm.

3. The wafer dicing machine for improving working precision as described in claim 1, wherein a buffer layer is provided around the periphery of the first cement base, the periphery of the second cement base and the periphery of the third cement base, and the buffer layer is a foamed material.

4. The wafer dicing machine for improving working precision as described in claim 3, wherein an anti-slip plate is provided on the buffer layer.

5. The wafer dicing machine for improving working precision as claimed in claim 3, wherein the buffer layer has a first frame portion and two first spacer portions, the first frame portion being disposed outside the first cement base, the second cement base and the third cement base, the two first spacer portions being disposed inside the first frame portion, the two ends of the two first spacer portions being respectively connected to the two sides of the first frame portion, and the two first spacer portions being disposed between the first cement base, the second cement base and the third cement base.

6. The wafer dicing machine for improving working precision as described in claim 5, wherein an anti-slip plate is provided on the buffer layer, the anti-slip plate having a second frame portion and two second spacer portions, the second frame portion being disposed outside the first cement base, the second cement base and the third cement base, the two second spacer portions being disposed inside the second frame portion, the two ends of the two second spacer portions being respectively connected to the two sides of the second frame portion, and the two second spacer portions being disposed between the first cement base, the second cement base and the third cement base.

7. The wafer dicing machine for improving working precision as claimed in claim 1, wherein the first cement base, the second cement base and the third cement base are in the form of square blocks.

8. The wafer dicing machine for improving working precision as claimed in claim 1, wherein the second cement base is disposed between the first cement base and the third cement base, such that the wafer placement platform is disposed between the wafer dicing section and the wafer gripping arm, wherein the first cement base and the third cement base are respectively provided with a first recess and a second recess on the side near the second cement base, and the two ends of the second cement base correspond to the first recess and the second recess respectively.

9. The wafer dicing machine for improving working precision as described in claim 1, wherein the wafer dicing unit and the wafer placement platform can operate in coordination to process the same wafer simultaneously.

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