Transition tube component and semiconductor processing equipment

Abstract

This application provides a transition tube assembly and semiconductor process equipment. The transition tube assembly includes: a transition tube; an inlet pipe inserted through the transition tube, with a first end located outside the transition tube and a second end located inside the transition tube; and a vaporization mechanism disposed at the second end of the inlet pipe. The vaporization mechanism has a heating device and a liquid collection chamber, with the second end of the inlet pipe located inside the liquid collection chamber, which communicates with the interior of the transition tube. The liquid collection chamber is used to collect condensate from the inlet pipe, and the heating device is used to heat and vaporize the condensate. By incorporating a vaporization mechanism to collect condensate through the liquid collection chamber and using a heating device to vaporize the collected condensate, this application's transition tube assembly effectively solves the problem of excessive particle counts within the reaction chamber, thereby improving product quality.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a transition transistor assembly and semiconductor process equipment. Prior Technology

[0002] In the current semiconductor manufacturing field, during the operation of wet oxidation process equipment, the ignition device can realize the combustion of hydrogen and oxygen, thereby providing pure high-temperature water vapor to the reaction chamber. As process requirements become more stringent, it is necessary to grow thinner and more uniform film layers on the surface of the wafer. To achieve this, an appropriate amount of process gas (such as nitrogen) can be introduced during the combustion process to adjust the proportion of water vapor.

[0003] Current ignition systems mainly consist of an ignition device and a transition tube, with the ignition device connected to the reaction chamber via the transition tube. During operation, the ignition device ignites the introduced hydrogen and oxygen to form high-temperature water vapor, which is then transported to the reaction chamber through the transition tube. The transition tube is equipped with an inlet pipe for introducing process gases. When process gases are not required to be introduced through the inlet pipe, the high-temperature water vapor enters the transition tube and flows towards a lower temperature region as it passes through the inlet pipe. This cooled water vapor condenses into condensate. When nitrogen is introduced again through the process gas inlet pipe, this condensate is blown into the reaction chamber, and the droplets from this condensate can cause excessive particulate matter.

[0004] While related technologies can prevent water vapor from entering the intake pipe and thus prevent the formation of condensate, thereby solving the problem of excessive particles, the actuators inside the control valve will generate impurity particles due to friction, impact, and repeated expansion and contraction of materials during the opening and closing process. These impurity particles will enter the transition pipe with the process gas and enter the reaction chamber with the high-temperature water vapor. Therefore, the problem of excessive particles still exists. Summary of the Invention

[0005] This application aims to at least solve the problem in the prior art that the need to fill the transition tube with process gas can easily lead to excessive particles in the reaction chamber, and proposes a transition tube assembly and semiconductor process equipment.

[0006] To achieve the purpose of this application, a transition tube assembly is provided for connecting a reaction chamber and an ignition device in a semiconductor process equipment. The transition tube assembly includes: a transition tube, the two ends of which are respectively connected to the reaction chamber and the ignition device; an inlet pipe, which passes through the transition tube, with a first end located outside the transition tube and a second end located inside the transition tube, for introducing process gas into the transition tube; and a vaporization mechanism disposed at the second end of the inlet pipe, the vaporization mechanism having a heating device and a liquid collection chamber, the second end of the inlet pipe being located inside the liquid collection chamber, the liquid collection chamber communicating with the interior of the transition tube, the liquid collection chamber for collecting condensate on the inlet pipe, and the heating device for heating and vaporizing the condensate.

[0007] In some embodiments, the vaporization mechanism includes: a housing having a first end and a second end in a direction perpendicular to the axis of the transition tube, the first end of the housing being connected to the wall of the transition tube, the second end of the housing being located inside the transition tube, and the air inlet pipe passing through the inner wall of the first end of the housing;

[0008] A liquid collection tank is disposed inside the housing and connected to the inner wall of the first end of the housing. The inner wall of the liquid collection tank and the inner wall of the first end of the housing form the liquid collection cavity.

[0009] In some embodiments, the transition tube has an installation port on its wall that connects its interior to the exterior, the outer peripheral wall of the first end of the housing is connected to the inner peripheral wall of the installation port, and the end face of the first end of the housing is flush with the outer peripheral surface of the transition tube.

[0010] In some embodiments, an installation cavity is formed between the outer wall of the liquid collection tank and the inner peripheral wall of the housing and the inner wall of the second end of the housing, and the heating device is located in the installation cavity.

[0011] In some embodiments, the vaporization mechanism further includes a connecting pipe, which passes through the housing and the liquid collection tank, with one end of the connecting pipe communicating with the liquid collection chamber and the other end communicating with the interior of the transition pipe.

[0012] In some embodiments, the connecting pipe is located on the outer periphery of the intake pipe, and the axis of the connecting pipe is parallel to the axis of the transition pipe.

[0013] In some embodiments, the vaporization mechanism further includes a flow guide, disposed within the liquid collection chamber, for guiding the flow direction of the process gas to extend the travel distance of the process gas within the liquid collection chamber.

[0014] In some embodiments, the flow guide divides the inside of the liquid collection chamber into multiple annular flow guide chambers. All the annular flow guide chambers are distributed around the air inlet pipe from the inside out, and adjacent annular flow guide chambers are interconnected. The outermost annular flow guide chamber is connected to the inside of the transition pipe, and the innermost annular flow guide chamber is connected to the air inlet pipe.

[0015] In some embodiments, there are multiple flow guides, which are spaced apart from the inside to the outside. Each flow guide has a flow guide hole, and adjacent annular flow guide cavities on both sides of the flow guide are connected through the flow guide hole. In any two adjacent flow guides, the flow guide hole on one flow guide is staggered from the flow guide hole on the other flow guide.

[0016] In some embodiments, in any two adjacent guide sections, the guide hole on one guide section and the guide hole on the other guide section are respectively located on both sides of the intake pipe axis.

[0017] In some embodiments, the second end of the air inlet pipe abuts against the inner wall of the liquid collection chamber, and an air outlet is provided on the outer peripheral wall of the second end of the air inlet pipe. The air outlet is offset from the guide hole on the guide portion closest to the air inlet pipe.

[0018] In some embodiments, the air outlet and the guide hole on the innermost guide portion are located on opposite sides of the air intake pipe axis.

[0019] In some embodiments, the vaporization mechanism further includes: a connecting pipe, which passes through the inner wall of the liquid collection chamber, one end of the connecting pipe is connected to the outermost annular guide cavity, and the other end is connected to the interior of the transition pipe, and the connecting pipe is offset from the guide hole on the nearest guide portion.

[0020] In some embodiments, the connecting pipe and the guide hole on the outermost guide portion are located on opposite sides of the intake pipe axis.

[0021] In some embodiments, the transition tube assembly further includes a detection device disposed on the vaporization mechanism for detecting the temperature within the liquid collection chamber.

[0022] According to a second aspect of this application, a semiconductor manufacturing apparatus is also disclosed, comprising: an ignition device, a reaction chamber, and the aforementioned transition tube assembly, wherein the transition tube assembly is connected between the reaction chamber and the ignition device.

[0023] The transition tube assembly of this application has the following technical advantages: First, by setting up a vaporization mechanism to collect condensate through a liquid collection chamber and then vaporizing the collected condensate using a heating device, the problem of excessive particles in the reaction chamber can be effectively solved. Compared with existing technologies, there is no structure similar to a control valve. Instead, the condensate is vaporized through a liquid collection chamber and a heating device. Therefore, there is no particle generation due to friction, impact, or repeated expansion and contraction of materials in the internal actuators of a control valve, which can effectively avoid the problem of excessive particles in the reaction chamber and improve product quality. Secondly, the outer wall of the transition tube assembly housing in this application is flush with the outer wall of the transition tube, which makes it easier to wrap the heating band. Moreover, the exposed area is smaller, which can improve the heat preservation effect. Third, the transition tube assembly of this application places the heating device in an installation cavity isolated from the liquid collection chamber, so that during the heating process of the condensate, impurity particles on the surface of the heating device will not enter the reaction chamber with the process gas, thereby improving product quality. Fourth, the heating device of the transition tube assembly of this application can heat the condensate from the top and bottom of the liquid collection chamber respectively, thereby heating the condensate from all directions, causing the condensate to vaporize rapidly and effectively preventing condensate droplets from entering the reaction chamber. Fifth, the heating device of the transition tube assembly of this application has sufficient expansion space between the heating device and the liquid collection tank and the shell, which can prevent the heating device from damaging the shell and the liquid collection tank after expansion. Sixth, the connecting pipe of the transition pipe assembly in this application is arranged in a horizontal direction and is located on the outer periphery of the air inlet pipe, which can prevent condensate dripping onto the second base plate from flowing out of the connecting pipe, thereby avoiding the generation of particles. Seventh, the transition tube assembly of this application, by providing a flow guide, can extend the travel distance of the process gas to the outside of the liquid collection chamber. Therefore, even if some condensate flows with the process gas, it can vaporize before reaching the outside of the liquid collection chamber, thereby preventing condensate from entering the reaction chamber. Moreover, the flow guide holes on the adjacent flow guides not only extend the travel distance of the process gas but also allow the process gas to collide with the sidewall of the flow guide, forming smaller droplets, thereby increasing the vaporization rate of the condensate. Simple Explanation of the Diagram

[0024] Figure 1 is a schematic diagram of the structure of semiconductor manufacturing equipment in related technologies; Figure 2 is a schematic diagram of the structure of the transition tube in semiconductor manufacturing equipment in related technologies; Figure 3 is a schematic diagram of the transition tube assembly according to an embodiment of this application; Figure 4 is a schematic diagram of the vaporization mechanism of the transition tube assembly according to an embodiment of this application; Figure 5 is a schematic diagram of the housing of the transition tube assembly according to an embodiment of this application; Figure 6 is a schematic diagram of the liquid collection tank of the transition tube assembly according to an embodiment of this application; Figure 7 is a schematic diagram of the structure of a semiconductor manufacturing apparatus according to an embodiment of this application. Implementation

[0025] To enable those skilled in the art to better understand the technical solutions of this application, the transition tube assembly, ignition device, and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0026] In the current semiconductor manufacturing field, during the operation of wet oxidation process equipment, the ignition device can realize the combustion of hydrogen and oxygen, thereby providing pure high-temperature water vapor to the reaction chamber. As process requirements become more stringent, it is necessary to grow thinner and more uniform film layers on the surface of the wafer. To achieve this, an appropriate amount of process gases such as nitrogen can be introduced during the combustion process to adjust the proportion of water vapor.

[0027] Current semiconductor manufacturing equipment mainly includes an ignition device, a transition tube assembly, and a reaction chamber. The ignition device is connected to the reaction chamber via the transition tube assembly, thereby delivering high-temperature water vapor into the reaction chamber. Taking the introduction of nitrogen to adjust the water vapor ratio as an example, the transition tube assembly has a nitrogen inlet pipe for introducing nitrogen. When nitrogen is not needed in the inlet pipe, the high-temperature water vapor entering the transition tube flows towards a lower temperature region along the nitrogen inlet pipe. This portion of water vapor condenses into condensate as its temperature decreases. When nitrogen is introduced again through the nitrogen inlet pipe, this condensate is blown into the reaction chamber, causing excessive particle content.

[0028] To avoid the aforementioned problems, as shown in Figure 1, the related technology discloses a semiconductor manufacturing apparatus, including: a reaction chamber 700, an ignition device, and a transition tube 500. The ignition device is connected to the reaction chamber 700 through the transition tube 500, so that the high-temperature water vapor generated by the ignition device enters the reaction chamber 700 through the transition tube 500.

[0029] The ignition device includes a heater 100, an ignition chamber 200, an insulation layer 300, and a cooling device 400. The ignition chamber 200 is installed inside the heater 100, the insulation layer 300, and the cooling device 400. The transition pipe 500 is sealed to both ends of the ignition chamber 200 and the reaction chamber 700, respectively. During the wet oxygen process, hydrogen and oxygen, heated to a high temperature by the heater 100, enter the ignition chamber 200. When they meet, the hydrogen burns to form a flame, simultaneously generating high-temperature water vapor. The high-temperature water vapor passes through the transition pipe 500 and enters the reaction chamber 700 to participate in the process reaction. The insulation layer 300 is located outside the ignition chamber 200 to prevent excessive heat loss and ensure the water vapor remains at a high temperature. The cooling device 400 prevents lost heat from being released into the surrounding environment, thus preventing damage to other components due to increased ambient temperature.

[0030] A heating belt 600 is wrapped around the outside of the transition tube 500. The heating belt 600 heats the water vapor flowing through the transition tube 500 to prevent the temperature from dropping and forming condensate.

[0031] As shown in Figure 2, in the related technology, the transition pipe 500 is also provided with a nitrogen inlet pipe 502, a ball bearing sealing seat 503, a ball head 504, a guide rod 505 and a guide seat 506, a sealing ring groove 507, a sealing ring 508, a spring 509 and a guide channel 510.

[0032] When the process requires nitrogen to be introduced, nitrogen is introduced through the nitrogen inlet pipe 502. The pressure of the nitrogen acts on the surface of the ball head 504. At this time, the pressure is transmitted to the spring 509 through the guide rod 505. When the pressure is greater than the clamping force of the spring 509, the spring 509 is compressed. At this time, the surface of the ball head 504 separates from the ball bearing sealing seat 503, forming a channel. Nitrogen enters the internal channel 501 of the transition pipe 500 through this channel, mixes with high-temperature water vapor, and then enters the reaction chamber 700 to participate in the reaction. When the guide rod 505 moves vertically, the guide channel 510 inside the guide seat 506 provides guidance for the guide rod 505, so that the guide rod 505 moves vertically without deviating. The sealing ring 508 is set inside the sealing ring groove 507 to achieve a sealing effect, preventing water vapor from entering the space where the spring 509 is located through the gap between the guide channel 510 and the guide rod 505 and causing accumulation and residue.

[0033] The heating band 600 includes a main heating band 601 and a local heating band 602. The main heating band 601 heats the transverse portion of the transition tube 500, keeping the internal channel 501 of the transition tube 500 at a high temperature at all times, thus preventing the formation of condensate. The local heating band 602 heats the protruding portion of the guide seat 506, maintaining it at a high temperature, and preventing the high-temperature water vapor in the internal channel 501 of the transition tube 500 from being affected by the low temperature of the guide seat 506.

[0034] It can be seen that by setting the ball bearing sealing seat 503 and the ball head 504 to form a control valve, high-temperature water vapor can be prevented from entering the nitrogen inlet pipe 502, thereby avoiding the generation of condensate.

[0035] However, during use, it was found that even with the control valve formed by the aforementioned ball bearing seal 503 and ball head 504, the problem of excessive particles in the reaction chamber still occurred. Even by improving the sealing performance of the ball bearing seal 503 and ball head 504, the problem of excessive particles in the reaction chamber could not be avoided.

[0036] The inventors of this application discovered through research that the problem of excessive particles in the reaction chamber in related technologies is not caused by condensate. Rather, it is caused by the following three factors: First, the ball head 504 and the ball bearing sealing seat 503 are in hard contact, and long-term frequent opening and closing or excessive pressure will cause impact and friction on the contact surface, resulting in falling particles; Second, the up-and-down movement of the guide rod 505 and its contact and friction with the sealing ring 508 will also generate particles; Third, the long-term frequent compression and extension of the spring 509 will cause material fatigue, and the surface is prone to peeling particles; the particles generated in these three places will enter the chamber with the airflow, causing excessive particles on the wafer surface.

[0037] To address the aforementioned problems, as shown in Figures 3, 4, and 7, this application discloses a transition tube assembly for connecting the reaction chamber 70 and the ignition device 60 of a semiconductor process equipment. The transition tube assembly includes a transition tube 10, an inlet pipe 20, and a vaporization mechanism 30. The two ends of the transition tube 10 are used to connect the reaction chamber 70 and the ignition device 60, respectively. The inlet pipe 20 passes through the transition tube 10, with its first end located outside the transition tube 10 and its second end located inside the transition tube 10, for introducing process gas into the transition tube 10. The vaporization mechanism 30 is disposed at the second end of the inlet pipe 20, and has a heating device 33 and a liquid collection chamber 34. The second end of the inlet pipe 20 is located inside the liquid collection chamber 34, which communicates with the interior of the transition tube 10. The liquid collection chamber 34 is used to collect condensate from the inlet pipe 20, and the heating device 33 is used to heat and vaporize the condensate.

[0038] Since the vaporization mechanism 30 is located at the second end of the inlet pipe 20, and the second end of the inlet pipe 20 is located inside the liquid collection chamber 34, which is connected to the inside of the transition pipe 10, the process gas in the inlet pipe 20 can enter the inside of the transition pipe 10 through the liquid collection chamber 34 and finally enter the reaction chamber 70. During this process, the liquid collection chamber 34 can collect the condensate dripping from the inlet pipe 20 and vaporize it into water vapor under the heating of the heating device 33, preventing the condensate droplets from entering the inside of the transition pipe 10, thereby solving the problem of excessive particles in the reaction chamber 70.

[0039] The transition tube assembly disclosed in this application effectively solves the problem of excessive particles in the reaction chamber 70 by setting a vaporization mechanism 30, collecting condensate through a liquid collection chamber 34 within the vaporization mechanism 30, and vaporizing the collected condensate through a heating device 33. Compared with related technologies, there is no structure similar to a control valve. Instead, the condensate is vaporized through the liquid collection chamber 34 and the heating device 33. Therefore, there is no particle generation due to friction, impact, or repeated expansion and contraction of the actuators in the control valve, thus effectively avoiding the problem of excessive particles in the reaction chamber 70 and improving product quality.

[0040] It should be noted that the inventive concept in the related technology is to seal high-temperature water vapor outside the nitrogen inlet pipe to avoid the generation of condensate. However, the inventive concept of this application is not to prevent the generation of condensate, but to vaporize the generated condensate by the cooperation of the liquid collection chamber 34 and the heating device 33. Therefore, there is no need for a structure similar to a control valve, thus avoiding the generation of impurity particles from the source.

[0041] In this embodiment, the process gas can be nitrogen or other process gases that can be used to adjust the proportion of water vapor.

[0042] In some embodiments, the vaporization mechanism 30 includes a housing 31 and a collection tank 32. The housing 31 has a first end and a second end in a direction perpendicular to the axis of the transition pipe 10. The first end of the housing 31 is connected to the wall of the transition pipe 10, and the second end of the housing 31 is located inside the transition pipe 10. An air inlet pipe 20 passes through the inner wall of the first end of the housing 31. The collection tank 32 is disposed inside the housing 31 and connected to the inner wall of the first end of the housing 31. The inner wall of the collection tank 32 and the inner wall of the first end of the housing 31 form a collection cavity 34. In other words, the first end of the housing 31 is connected to the wall of the transition pipe 10, thereby fixing the housing 31 relative to the transition pipe 10, and the second end of the housing 31 is located inside the transition pipe 10. The intake pipe 20 passes through the inner wall of the first end of the housing 31, so that the second end of the intake pipe 20 is located inside the housing 31. The liquid collection tank 32 is located inside the housing 31, and its opening is fixedly connected to the inner wall of the first end of the housing 31. Thus, the inner wall of the liquid collection tank 32 and the inner wall of the first end of the housing 31 form a liquid collection cavity 34, allowing the second end of the intake pipe 20 to extend into the liquid collection tank 32 through the opening. By setting up the liquid collection tank 32, the condensate dripping from the wall of the intake pipe 20 can be collected and vaporized by the heating device 33, thereby preventing the condensate from entering the reaction chamber 70 and avoiding the generation of particles.

[0043] Understandably, in order to collect the dripping condensate, the axis of the air inlet pipe 20 is aligned with the direction of gravity, the first end of the housing 31 faces upward in the direction of gravity (i.e., the top of the housing 31), and the second end of the housing 31 faces downward in the direction of gravity (i.e., the bottom of the housing 31). The opening of the liquid collection tank 32 also faces the top of the housing 31, thereby collecting the condensate dripping from the air inlet pipe 20 and heating and vaporizing it using the heating device 33.

[0044] For example, as shown in Figure 5, the housing 31 includes a top plate 311, a first bottom plate 312, and a first side wall 313. The first side wall 313 is a cylindrical structure arranged along the direction of gravity. The top plate 311 and the first bottom plate 312 are respectively connected to the two ends of the first side wall 313 to form the housing 31. A first insertion hole 3111 is provided on the top plate 311, and the air intake pipe 20 passes through the first insertion hole 3111 and is sealed to the wall of the first insertion hole 3111.

[0045] As shown in Figure 6, the liquid collection tank 32 includes a second sidewall 321 and a second bottom plate 322. The second sidewall 321 is also a cylindrical structure arranged along the direction of gravity and is located inside the first sidewall 313. The second bottom plate 322 is connected to the bottom end of the second sidewall 321 to form the liquid collection tank 32. The top end of the second sidewall 321 is sealed to the top plate 311. The top plate 311, the second sidewall 321 and the second bottom plate 322 form the liquid collection cavity 34.

[0046] As shown in Figure 4, the transition tube assembly also includes a heating belt 40, which wraps around the outside of the transition tube 10 to heat the water vapor flowing through the transition tube 10 and prevent it from cooling down and forming condensate. At the same time, the heating belt 40 can directly heat the top end (i.e., the first end) of the shell 31, making it easier for the condensate inside the liquid collection chamber 34 to vaporize.

[0047] As shown in Figure 4, the transition tube 10 has an installation port 11 on its wall, which connects its interior to the exterior. The outer peripheral wall of the first end of the housing 31 is connected to the inner peripheral wall of the installation port 11, and the end face of the first end of the housing 31 is flush with the outer peripheral surface of the transition tube 10. That is, the outer peripheral wall of the first side wall 313 is fixedly connected to and sealed with the inner peripheral wall of the installation port 11. The top of the housing 31 passes through the installation port 11, and the outer wall surface of the top plate 311 of the housing 31 is flush with the outer wall surface of the transition tube 10, so that the top of the housing 31 does not protrude from the surface of the transition tube 10. When wrapping the heating band 40, since the outer wall surface of the top plate 311 of the housing 31 is flush with the outer wall surface of the transition tube 10, it is more convenient to wrap the heating band 40 compared with the method in related technologies where the guide seat protrudes from the outer wall surface of the transition tube. In addition, since only the outer wall surface of the top plate 311 is outside the transition tube 10, the exposed area is smaller, which improves the heat preservation effect.

[0048] As shown in Figure 4, an installation cavity 35 is formed between the outer wall of the liquid collection tank 32, the inner peripheral wall of the housing 31, and the inner wall of the second end of the housing 31. The installation cavity 35 is isolated from the liquid collection cavity 34, and the heating device 33 is located inside the installation cavity 35. In other words, the installation cavity 35 is formed between the outer peripheral surface of the second side wall 321 and the inner peripheral surface of the first side wall 313, and between the outer surface of the second base plate 322 and the inner surface of the first base plate 312. By setting the liquid collection tank 32, the interior of the housing 31 is divided into the non-communicating liquid collection cavity 34 and the installation cavity 35, and the heating device 33 is located inside the installation cavity 35, thus isolating the heating device 33 from nitrogen and condensate. Therefore, during the heating process of the condensate, impurity particles on the surface of the heating device 33 will not enter the reaction chamber 70 with the nitrogen, thereby improving product quality.

[0049] It should be noted that in the above embodiments, the housing 31 and the liquid collection tank 32 cooperate to form the liquid collection cavity 34. However, this is not limiting. In some other embodiments not shown in the figure, the liquid collection tank 32 can also be replaced by components such as a partition plate. The partition plate can be used to divide the interior of the housing 31 vertically or horizontally into the liquid collection cavity 34 and the mounting cavity 35. Such a partition structure is also feasible. Without violating the inventive concept and inventive principle of this application, the above situations are all within the protection scope of this application.

[0050] For example, as shown in FIG4, the heating device 33 includes a sidewall heater 331 and a bottom heater 332. As shown in FIG4, the bottom heater 332 is located between the first bottom plate 312 and the second bottom plate 322 and is connected to the first bottom plate 312. The sidewall heater 331 surrounds the second sidewall 321 and is located between the first sidewall 313 and the second sidewall 321. The sidewall heater 331 is connected to the bottom heater 332. By setting the sidewall heater 331 and the bottom heater 332, the condensate can be heated from the circumference of the liquid collection chamber 34 by the sidewall heater 331, and the condensate can be heated from the bottom and top of the liquid collection chamber 34 by the bottom heater 332 in conjunction with the heating belt 40, thereby heating the condensate from all directions, causing the condensate to vaporize rapidly and effectively preventing condensate droplets from entering the reaction chamber 70.

[0051] As shown in Figure 4, gaps are reserved between the side wall heater 331 and the first side wall 313, between the side wall heater 331 and the second side wall 321, and between the side wall heater 331 and the first top plate 311; gaps are also reserved between the bottom heater 332 and the second bottom plate 322, and between the bottom heater 332 and the first side wall 313. This is because the materials of the side wall heater 331 and the bottom heater 332 are different from the materials of the shell 31 and the liquid collection tank 32, and sufficient expansion space needs to be reserved to avoid expansion that could damage the shell 31 and the liquid collection tank 32.

[0052] For example, the side wall heater 331 and the bottom heater 332 are configured to be set to a higher temperature, such as 300°C to 400°C, so that the efficiency of heating and vaporizing condensate can be improved under the same conditions.

[0053] As shown in Figure 4, the vaporization mechanism 30 also includes a connecting pipe 36. The connecting pipe 36 passes through the housing 31 and the liquid collection tank 32. One end of the connecting pipe 36 is connected to the liquid collection chamber 34, and the other end is connected to the interior of the transition pipe 10. By providing the connecting pipe 36, the liquid collection chamber 34 can be connected to the interior of the transition pipe 10, and then connected to the reaction chamber 70, allowing nitrogen gas to enter the reaction chamber 70.

[0054] For example, as shown in Figure 5, a first through hole 3131 is provided on the first sidewall 313. As shown in Figure 6, a second through hole 3211 is provided on the second sidewall 321, and a third through hole 3311 is provided on the sidewall heater 331. As shown in Figure 4, the first through hole 3131, the second through hole 3211, and the third through hole 3311 correspond to each other. The connecting pipe 36 passes through the first through hole 3131, the second through hole 3211, and the third through hole 3311. The first end of the connecting pipe 36 is fixedly connected to the first through hole 3131 and communicates with the transition pipe 10 outside the housing 31. The second end of the connecting pipe 36 is fixedly connected to the second through hole 3211 and communicates with the liquid collection chamber 34.

[0055] It should be noted that, as shown in Figure 4, in this embodiment, there are three connecting pipes 36. However, this is not limiting. In some other embodiments not shown in the figure, the number of connecting pipes 36 can also be one, two, four, etc. Without departing from the principles and inventive concept of this application, the above situations are all within the protection scope of this application.

[0056] As shown in Figure 4, the connecting pipe 36 is located on the outer periphery of the intake pipe 20, and the axis of the connecting pipe 36 is parallel to the axis of the transition pipe 10. That is to say, the connecting pipe 36 is arranged in the horizontal direction and is located on the outer periphery of the intake pipe 20. Therefore, the connecting pipe 36 is a certain distance from the second base plate 322 in the vertical direction, which can prevent condensate dripping on the second base plate 322 from flowing out of the connecting pipe 36, thereby avoiding the generation of particles.

[0057] As shown in Figure 4, the vaporization mechanism 30 further includes a flow guide 37. The flow guide 37 is disposed within the liquid collection chamber 34 to guide the flow direction of the process gas, thereby extending the travel distance of the process gas within the liquid collection chamber 34. By providing the flow guide 37, the travel distance of the process gas to the outside of the liquid collection chamber 34 can be extended. Therefore, even if some condensate flows with the process gas, it can be vaporized before the process gas reaches the outside of the liquid collection chamber 34, further preventing condensate from entering the reaction chamber 70.

[0058] Furthermore, the guide section 37 divides the interior of the liquid collection chamber 34 into multiple annular guide chambers. All annular guide chambers are distributed around the air intake pipe 20 from the inside out, and adjacent annular guide chambers are interconnected. The outermost annular guide chamber is connected to the interior of the transition pipe 10, and the innermost annular guide chamber is connected to the air intake pipe 20. It can be understood that there are multiple guide sections 37, which are distributed from the inside out, thereby dividing the liquid collection chamber 34 into multiple annular guide chambers from the inside out.

[0059] For example, as shown in FIG4, the flow guiding section 37 includes: a first flow guiding cylinder 371 and a second flow guiding cylinder 372. Both the first flow guiding cylinder 371 and the second flow guiding cylinder 372 are arranged around the air inlet pipe 20. The first flow guiding cylinder 371 is located between the second flow guiding cylinder 372 and the air inlet pipe 20. The first flow guiding cylinder 371 and the second flow guiding cylinder 372 divide the interior of the liquid collecting chamber 34 into three annular flow guiding chambers, namely the first flow guiding chamber 341, the second flow guiding chamber 342 and the third flow guiding chamber 343, and the first flow guiding chamber 341, the second flow guiding chamber 342 and the third flow guiding chamber 343 are connected sequentially. The first guide cavity 341 is located between the first guide tube 371 and the air inlet pipe 20 and is connected to the interior of the air inlet pipe 20. The second guide cavity 342 is located between the first guide tube 371 and the second guide tube 372. The third guide cavity 343 is located between the second guide tube 372 and the second side wall 321 and is connected to the interior of the transition pipe 10 through the connecting pipe 36.

[0060] The flow guide section 37 is provided with a flow guide hole 38, and the adjacent annular flow guide cavities on both sides of the flow guide section 37 are connected by the flow guide hole 38. The flow guide holes 38 on adjacent flow guide sections 37 are staggered. In other words, in any two adjacent flow guide sections 37, the flow guide hole 38 on one flow guide section 37 is staggered from the flow guide hole 38 on the other flow guide section 37.

[0061] For example, both the first guide tube 371 and the second guide tube 372 are provided with guide holes 38. The first guide cavity 341 and the second guide cavity 342 are connected through the guide holes 38 on the first guide tube 371, and the second guide cavity 342 and the third guide cavity 343 are connected through the guide holes 38 on the second guide tube 372. As shown in Figure 4, the guide hole 38 on the first guide tube 371 and the guide hole 38 on the second guide tube 372 are located on different sides of the intake pipe 20. For example, the guide hole 38 on the first guide tube 371 is located on the left side of the intake pipe 20 in Figure 4, while the guide hole 38 on the second guide tube 372 is located on the right side of the intake pipe 20 in Figure 4. The axes of the guide hole 38 on the first guide tube 371 and the guide hole 38 on the second guide tube 372 form a 180° angle. In other words, the guide hole 38 on the first guide tube 371 and the guide hole 38 on the second guide tube 372 are located on both sides of the axis of the intake pipe 20. Therefore, when nitrogen enters the second guide cavity 342 from the first guide cavity 341, it enters the second guide cavity 342 through the guide hole 38 on the first guide cylinder 371 on the left side of the inlet pipe 20 in Figure 4. Then, the nitrogen needs to flow within the second guide cavity 342 to the right side of the inlet pipe 20 in Figure 4, and then enter the third guide cavity 343 through the guide hole 38 on the second guide cylinder 372, thereby extending the nitrogen's travel distance. During this process, the condensate in the nitrogen is continuously heated by the side wall heater 331 and the bottom heater 332, causing the condensate to be heated and vaporized into water vapor.

[0062] It should be noted that in this embodiment, the flow guide 37 includes two flow guide tubes. However, this is not limiting. In some other embodiments not shown in the figures, the flow guide tubes can be one, three, four, etc. In other embodiments not shown in the figures, the flow guide 37 can also adopt other flow guide plates or other structures. That is to say, as long as the structure can extend the process gas flow, the above situations are all within the protection scope of this application without violating the principles and inventive concept of this application.

[0063] It should also be noted that in this embodiment, the guide hole 38 on the first guide tube 371 and the guide hole 38 on the second guide tube 372 form a 180° angle. In other words, in any two adjacent guide sections 37, the guide hole 38 on one guide section 37 and the guide hole 38 on the other guide section 37 are located on opposite sides of the axis of the intake pipe 20. However, this is not limiting. In some other embodiments not shown in the figure, the angle between the axes of the guide hole 38 on the first guide tube 371 and the guide hole 38 on the second guide tube 372 may not be equal to 180°. For example, it may also be equal to 30°, 45°, 60°, 90°, 120°, 150°, etc. That is to say, as long as the guide holes 38 on adjacent guide sections 37 are offset from each other. The offset can be circumferential or axial.

[0064] As shown in Figure 4, the second end of the air inlet pipe 20 abuts against the inner wall of the liquid collection chamber 34. An air outlet 21 is provided on the outer peripheral wall of the second end of the air inlet pipe 20. The air outlet 21 is offset from the guide hole 38 on the guide section 37 closest to the air inlet pipe 20. For example, as shown in Figure 4, the second end of the air inlet pipe 20 abuts against the second base plate 322. An air outlet 21 is provided on the outer peripheral wall of the air inlet pipe 20. The air outlet 21 and the guide hole 38 on the first guide cylinder 371 are located on different sides of the air inlet pipe 20. For example, the air outlet 21 and the guide hole 38 on the innermost guide section 37 are located on opposite sides of the axis of the air inlet pipe 20. That is, the axis of the air outlet 21 forms a 180° angle with the axis of the guide hole 38 on the first guide cylinder 371, as shown on the right side of the air inlet pipe 20 in Figure 4. Therefore, after nitrogen enters the first guide chamber 341 from the inlet pipe 20, it needs to bypass the inlet pipe 20 before entering the second guide chamber 342, thus extending the nitrogen's travel distance.

[0065] It should be noted that in this example, the air outlet 21 and the guide hole 38 on the first guide tube 371 are located on opposite sides of the air inlet pipe 20. That is, the axis of the air outlet 21 and the axis of the guide hole 38 on the first guide tube 371 form a 180° angle. However, this is not limiting. In some other embodiments not shown in the figure, the angle between the axis of the air outlet 21 and the axis of the guide hole 38 on the first guide tube 371 may not be equal to 180°. For example, it may also be equal to 30°, 45°, 60°, 90°, 120°, 150°, etc. In other words, as long as the air outlet 21 and the guide hole 38 on the guide section 37 closest to the air inlet pipe 20 are offset from each other, the offset can be offset circumferentially or axially.

[0066] As shown in Figure 4, one end of the connecting pipe 36 is connected to the outermost annular guide cavity, and the other end is connected to the interior of the transition pipe 10. The connecting pipe 36 and the guide hole 38 on the nearest guide section 37 are offset from each other. For example, the axis of the connecting pipe 36 forms a 180° angle with the axis of the guide hole 38 on the second guide cylinder 372. That is, the connecting pipe 36 and the guide hole 38 on the outermost guide section 37 are located on opposite sides of the axis of the air inlet pipe 20. That is, the connecting pipe 36 is located on the left side of the air inlet pipe 20 in Figure 4, and the guide hole 38 on the second guide cylinder 372 is located on the right side of the air inlet pipe 20 in Figure 4. After the nitrogen enters the second guide cavity 342 from the first guide cavity 341, it needs to bypass the second guide cylinder 372 before it can flow through the connecting pipe 36 and exit from the liquid collection cavity 34, thereby extending the nitrogen's travel distance.

[0067] It should be noted that in this example, the axis of the connecting pipe 36 forms a 180° angle with the axis of the guide hole 38 on the second guide tube 372. However, this is not limiting. In some other embodiments not shown in the figure, the angle between the axis of the connecting pipe 36 and the axis of the guide hole 38 on the second guide tube 372 may not be equal to 180°. For example, it may also be equal to 30°, 45°, 60°, 90°, 120°, 150°, etc. That is to say, as long as the connecting pipe 36 and the guide hole 38 on the nearest guide part 37 are offset from each other, the offset can be offset circumferentially or axially.

[0068] As shown in Figure 4, the first end of the intake pipe 20 is located outside the transition pipe 10. Because it is far away from the heating area, the temperature is relatively low. At this time, the second end of the intake pipe 20 has a higher temperature, while the first end has a lower temperature. Therefore, a gradient region of high temperature and low temperature is formed at both ends of the intake pipe 20.

[0069] When nitrogen injection stops, high-temperature water vapor diffuses sequentially through the connecting pipe 36, the second guide cavity 342, the first guide cavity 341, and the outlet 21 of the inlet pipe 20, eventually reaching the first end of the inlet pipe 20. Because the temperature at the first end of the inlet pipe 20 is lower, the high-temperature water vapor condenses into liquid water droplets, adhering to the inner wall of the inlet pipe 20. Over time, the condensed water droplets gradually increase in size; when the weight of the droplets exceeds the adhesion force, they slide down the inner wall of the inlet pipe 20 onto the second bottom plate 322 of the collection tank 32. Since the outlet 21 closest to the second end of the inlet pipe 20 is still higher than the second bottom plate 322, the condensate will not immediately flow out from the outlet 21. The condensate will remain inside the inlet pipe 20, and under the heating action of the bottom heater 332, the second bottom plate 322 is at a high temperature, rapidly heating the condensate to a water vapor state. The higher the temperature, the faster the vaporization rate, and the less likely water droplets are to accumulate. At this time, the first end of the intake pipe 20 is still at a low temperature. Water vapor will diffuse upwards to the low temperature area, condense, and repeat the above steps until an equilibrium state is reached. Condensed water droplets form on the inner wall of the first end of the intake pipe 20, while the bottom of the intake pipe 20 is at a high temperature. During this stage, the condensate will never enter the area outside the intake pipe 20, will not pass through the first guide tube 371, the second guide tube 372, and the connecting pipe 36 into the channel of the transition pipe 10, and will not enter the reaction chamber 70, thus preventing particle problems caused by the condensate.

[0070] When nitrogen needs to be introduced from the intake pipe 20 into the reaction chamber 70 for membrane conditioning, some condensate droplets accumulate on the inner wall of the first end of the intake pipe 20 during the combustion step. Under the action of the nitrogen flow, the condensate droplets will follow the flow into the interior of the intake pipe 20. At this time, some of the condensate droplets will be swept along the inner wall of the intake pipe 20 by the nitrogen flow and onto the second bottom plate 322 at the second end of the intake pipe 20. Here, the condensate is rapidly vaporized by the bottom heater 332, becoming water vapor. It then flows with the nitrogen flow through the channels of the first guide cavity 341, the second guide cavity 342, the third guide cavity 343, and the transition pipe 10, and finally enters the reaction chamber 70. It will never exist in the form of liquid water. Another portion of the condensate droplets will be ejected from the vent 21 under the purging action of the nitrogen gas flow. Since the guide hole 38 of the first guide tube 371 is misaligned with the vent 21, the condensate droplets ejected from the vent 21 first impact the right inner wall of the first guide tube 371 in Figure 4, and the condensate droplets will break into smaller droplets.

[0071] During the impact, the condensate droplets contact the inner wall of the first guide tube 371 and absorb heat. Some of the condensate droplets absorb heat and vaporize into water vapor. The remaining condensate droplets move with the nitrogen gas flow inside the first guide tube 371 to the guide hole 38 on the left side of the first guide tube 371 in Figure 4. They are then ejected from the guide hole 38 with the nitrogen gas flow and impact the inner wall of the left side of the second guide tube 372 in Figure 4. The condensate droplets break into smaller droplets again. During the impact, the condensate droplets contact the inner wall of the second guide tube 372 and absorb heat. Some of the liquid condensate droplets vaporize again, and the droplets become smaller and their diameter decreases continuously. Next, the condensate droplets, now smaller, move with the nitrogen gas flow from the left side of the second guide tube 372 in Figure 4 to the right guide hole 38. They are then ejected from the guide hole 38 and impact the second sidewall 321, further breaking up the droplets and reducing their diameter. Since the second sidewall 321 is closer to the sidewall heater 331, its inner wall temperature is relatively higher, making the vaporization of the small-diameter condensate droplets more pronounced. A very small amount of the remaining, extremely small-diameter condensate droplets move again with the gas flow to the left connecting pipe 36. At this point, the connecting pipe 36 is also heated by the sidewall heater 331, and the very small amount of condensate droplets here are completely vaporized into water vapor, which then enters the reaction chamber 70 with the nitrogen gas flow to participate in the reaction. From the first end of the inlet pipe 20 to the connecting pipe 36, the condensate droplets undergo multiple stages of breaking up and heating, ultimately achieving complete vaporization, thus preventing condensate from entering the chamber and avoiding particulate problems.

[0072] The initial diameter of the condensate droplets is 3-4 mm. The diameter of the air outlet 21 of the air inlet pipe 20 can be set to 2-3 mm, the diameter of the guide hole 38 on the first guide tube 371 can be set to 1-2 mm, the diameter of the guide hole 38 on the second guide tube 372 can be set to 0.5-1 mm, and the diameter of the connecting pipe 36 can be set to 0.1-0.5 mm. Through the step-by-step segmentation of the air outlet 21, guide hole 38, and connecting pipe 36, the condensate droplets with a diameter of 3-4 mm are finally segmented into a range of 0.1-0.5 mm. Because the air outlet 21 is smaller, the larger diameter condensate droplets will be segmented into smaller diameter condensate droplets, thus making it easier for the condensate to vaporize.

[0073] It is understandable that there are multiple air outlets 21, guide holes 38, and connecting pipes 36. For example, there are three air outlets 21, which are spaced apart along the axis of the air inlet pipe 20, and the distance between adjacent air outlets 21 can be set to 5-6 mm. There are also three guide holes 38 on the first guide tube 371 and the second guide tube 372, which are also spaced apart along the axis of the air inlet pipe 20, and the distance between adjacent guide holes 38 can be set to 5-6 mm. This extends the movement path of the condensate droplets and increases the contact time between the condensate droplets and the air inlet pipe 20, the first guide tube 371, and the second guide tube 372, thereby absorbing more heat. In addition, the distance between the air inlet pipe 20 and the first guide tube 371 can be set to 4~5mm. Similarly, the distance between the first guide tube 371 and the second guide tube 372, and the distance between the second guide tube 372 and the second side wall 321 can also be set to 4~5mm. In this way, the condensate water droplets ejected from the air outlet 21 or the guide tube 38 can impact the inner surfaces of the first guide tube 371, the second guide tube 372, and the second side wall 321 at a high speed. Under the action of the large impact force, the condensate water droplets break more thoroughly and have a smaller diameter. The smaller diameter condensate water droplets absorb more heat, so the condensate water droplets are more easily vaporized.

[0074] As shown in Figure 4, the transition tube assembly also includes a detection device 50, which is mounted on the vaporization mechanism 30 and is used to detect the temperature inside the liquid collection chamber 34.

[0075] As exemplarily shown in Figures 4 and 5, the top plate 311 of the housing 31 is provided with an outlet mounting hole 3112. The detection device 50 includes a thermocouple, which is inserted into the outlet mounting hole 3112 so that the detection end of the thermocouple is located between the air inlet pipe 20 and the first guide tube 371, thereby detecting the temperature of the liquid collecting chamber 34. When the detected temperature is too low, the side wall heater 331 and the bottom heater 332 increase their output power to raise the temperature; when the detected temperature is too high, they reduce their output power; ultimately, the liquid collecting chamber 34 is always kept at a high set temperature, thereby ensuring the vaporization effect of the condensate.

[0076] According to a second aspect of this application, as shown in FIG7, a semiconductor process apparatus is also disclosed, comprising: an ignition device 60, a reaction chamber 70 and the aforementioned transition tube assembly, wherein the transition tube assembly is connected between the reaction chamber 70 and the ignition device 60.

[0077] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

[0078] 10: Transition pipe 11: Installation port 20: Intake pipe 21: Vent 30: Vaporization mechanism 31: Shell 32: Liquid collection tank 33: Heating device 34: Liquid collecting chamber 35: Installation cavity 36: Connecting pipe 37: Airflow guide 38: Flow guide hole 40: Heating belt 50: Detection device 60: Ignition device 70: Reaction Chamber 311: Top Plate 312: First base plate 313: First sidewall 321: Second sidewall 322: Second base plate 331: Sidewall heater 332: Bottom heater 341: First guide cavity 342: Second guide cavity 343: Third guide cavity 371: First guide tube 372: Second guide tube 3111: First Socket 3112: Mounting hole 3131: First through hole 3211: Second through hole 3311: Third through hole

Claims

1. A transition tube assembly for connecting a reaction chamber and an ignition device in a semiconductor manufacturing apparatus, wherein, The transition tube assembly includes: a transition tube, the two ends of which are respectively connected to the reaction chamber and the ignition device; an inlet pipe, which passes through the transition tube, with a first end located outside the transition tube and a second end located inside the transition tube, for introducing process gas into the transition tube; and a vaporization mechanism, which is disposed at the second end of the inlet pipe, the vaporization mechanism having a heating device and a liquid collection chamber, the second end of the inlet pipe being located inside the liquid collection chamber, the liquid collection chamber communicating with the interior of the transition tube, the liquid collection chamber for collecting condensate on the inlet pipe, and the heating device for heating and vaporizing the condensate.

2. The transition tube assembly as described in claim 1, wherein, The vaporization mechanism includes: a housing having a first end and a second end in a direction perpendicular to the axis of the transition tube, the first end of the housing being connected to the wall of the transition tube, the second end of the housing being located inside the transition tube, and an air inlet pipe passing through the inner wall of the first end of the housing; and a liquid collection tank disposed inside the housing and connected to the inner wall of the first end of the housing, the inner wall of the liquid collection tank and the inner wall of the first end of the housing forming the liquid collection cavity.

3. The transition tube assembly as described in claim 2, wherein, The transition tube has an installation port on its wall that connects its interior to the exterior. The outer peripheral wall of the first end of the housing is connected to the inner peripheral wall of the installation port, and the end face of the first end of the housing is flush with the outer peripheral surface of the transition tube.

4. The transition tube assembly as described in claim 2, wherein, An installation cavity is formed between the outer wall of the liquid collection tank and the inner peripheral wall of the housing and the inner wall of the second end of the housing. The installation cavity is isolated from the liquid collection cavity, and the heating device is located in the installation cavity.

5. The transition tube assembly as described in claim 4, wherein, The vaporization mechanism also includes a connecting pipe, which passes through the housing and the liquid collection tank. One end of the connecting pipe is connected to the liquid collection chamber, and the other end is connected to the interior of the transition pipe.

6. The transition tube assembly as claimed in claim 5, wherein, The connecting pipe is located on the outer periphery of the intake pipe, and the axis of the connecting pipe is parallel to the axis of the transition pipe.

7. The transition tube assembly as described in claim 1, wherein, The vaporization mechanism also includes a flow guide, disposed within the liquid collection chamber, for guiding the flow direction of the process gas to extend the travel distance of the process gas within the liquid collection chamber.

8. The transition tube assembly as described in claim 7, wherein, The flow guide divides the inside of the liquid collection chamber into multiple annular flow guide chambers. All the annular flow guide chambers are distributed from the inside to the outside around the air inlet pipe. Adjacent annular flow guide chambers are interconnected. The outermost annular flow guide chamber is connected to the inside of the transition pipe, and the innermost annular flow guide chamber is connected to the air inlet pipe.

9. The transition tube assembly as claimed in claim 8, wherein, There are multiple flow guides, which are distributed at intervals from the inside to the outside. Each flow guide has a flow guide hole, and the adjacent annular flow guide cavities on both sides of the flow guide are connected through the flow guide hole. In any two adjacent flow guides, the flow guide hole on one flow guide is staggered from the flow guide hole on the other flow guide.

10. The transition tube assembly as claimed in claim 9, wherein, In any two adjacent air guides, the air guide hole on one air guide and the air guide hole on the other air guide are respectively located on both sides of the intake pipe axis.

11. The transition tube assembly as claimed in claim 9, wherein, The second end of the air inlet pipe abuts against the inner wall of the liquid collection chamber. An air outlet is provided on the outer peripheral wall of the second end of the air inlet pipe. The air outlet is offset from the guide hole on the guide part closest to the air inlet pipe.

12. The transition tube assembly as claimed in claim 11, wherein, The air outlet and the guide hole on the innermost guide section are located on opposite sides of the intake pipe axis.

13. The transition tube assembly as claimed in claim 9, wherein, The vaporization mechanism also includes: a connecting pipe, which passes through the inner wall of the liquid collection chamber. One end of the connecting pipe is connected to the outermost annular guide cavity, and the other end is connected to the interior of the transition pipe. The connecting pipe is offset from the guide hole on the nearest guide section.

14. The transition tube assembly as claimed in claim 13, wherein, The connecting pipe and the guide hole on the outermost guide section are located on opposite sides of the intake pipe axis.

15. The transition tube assembly as claimed in claim 9, further comprising: A detection device is installed on the vaporization mechanism to detect the temperature inside the liquid collection chamber.

16. A semiconductor manufacturing apparatus, comprising: An ignition device, a reaction chamber, and a transition tube assembly as described in any one of claims 1 to 15, the transition tube assembly being connected between the reaction chamber and the ignition device.

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