Substrate treatment apparatus having substrate-heating part

Abstract

This invention relates to a substrate processing apparatus equipped with a substrate heating section, comprising: a substrate support unit for supporting and rotating a substrate; a processing liquid supply unit for supplying processing liquid to an upper or lower surface of the substrate supported by the substrate support unit; a substrate heating section disposed at the lower part of the substrate and equipped with a plurality of light-emitting diodes for heating the substrate; and a partition disposed above the substrate heating section and capable of transmitting light toward the substrate, disposed in the substrate support unit to prevent processing liquid from flowing into the substrate heating section. The substrate heating section is composed of a plurality of heating areas for heating the substrate. The domain is radially divided relative to the center of the substrate and forms concentric rings. Multiple independently controlled light-emitting diodes are set in each heating region. Some of the independently controlled light-emitting diodes set in the heating regions that are adjacent to each other are mixed and set on the boundary line between the adjacent heating regions. When the power of the light-emitting diodes is gradually increased radially in order to compensate for the heat loss at the edge, since the high-power light-emitting diodes and low-power light-emitting diodes are mixed and set on the boundary line between the adjacent heating regions, the power value is between high power and low power. Therefore, the substrate temperature on the boundary line can be prevented from dropping sharply.

Claims

1. A substrate processing apparatus equipped with a substrate heating section, comprising: Substrate support unit, used to support and rotate the substrate; The processing liquid supply unit is used to supply processing liquid to the upper or lower surface of the substrate supported by the substrate support unit. A substrate heating section is provided at the lower part of the substrate and is equipped with a plurality of light-emitting diodes for heating the substrate; and a partition is provided on the upper side of the substrate heating section and is capable of transmitting light toward the substrate, and is provided in the substrate support unit to prevent processing liquid from flowing into the substrate heating section. The substrate heating section is composed of a plurality of heating regions for heating the substrate. The plurality of heating regions are radially divided relative to the center of the substrate and form concentric rings. A plurality of independently controlled light-emitting diodes are provided in each heating region. A portion of the independently controlled light-emitting diodes provided in each adjacent heating region are mixed and disposed on the boundary line between adjacent heating regions.

2. The substrate processing apparatus with a substrate heating section as described in claim 1, wherein, Multiple independently controlled light-emitting diodes, located in the aforementioned heating zones, are arranged separately on multiple concentric circles.

3. The substrate processing apparatus equipped with a substrate heating unit as described in claim 2, wherein, In each heating zone, the radially arranged concentric circles are spaced at the same intervals.

4. The substrate processing apparatus equipped with a substrate heating unit as described in claim 2, wherein, The number of independently controlled light-emitting diodes set in each of the above heating zones is the same.

5. The substrate processing apparatus equipped with a substrate heating unit as described in claim 4, wherein, Multiple light-emitting diodes located in the aforementioned heating zones are each controlled by the same light-emitting diode driver.

6. The substrate processing apparatus equipped with a substrate heating unit as described in any one of claims 1 to 5, wherein, The radial width of the aforementioned multiple heating zones gradually decreases from the center of the substrate toward the edge.

7. The substrate processing apparatus equipped with a substrate heating unit as described in any one of claims 1 to 5, wherein, A dome-shaped diffuser is provided on the upper part of the aforementioned light-emitting diode.

8. The substrate processing apparatus equipped with a substrate heating unit as described in any one of claims 1 to 5, wherein, The aforementioned substrate heating section includes: a printed circuit board; and the aforementioned light-emitting diode disposed on the printed circuit board, a heat sink disposed at the lower part of the printed circuit board, and at least one temperature sensor disposed in each of the aforementioned plurality of heating areas on the printed circuit board.

9. The substrate processing apparatus equipped with a substrate heating unit as described in claim 8, wherein, The temperature sensor is used to detect the temperature of the printed circuit board. When the detected temperature value is higher than the set temperature, the control unit reduces or cuts off the power supplied to the light-emitting diode.

10. The substrate processing apparatus equipped with a substrate heating unit as described in claim 8, wherein, The surface of the aforementioned printed circuit board has been treated with a white color scheme.

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