Camera module and optical instrument including the same

Abstract

An embodiment provides a camera module comprising: a fixed portion including a magnet; and a movable portion including: a first circuit board spaced apart from the fixed portion; a position sensor disposed on the first circuit board; a coil disposed facing the magnet; and a spacer disposed between the first circuit board and the coil, wherein the spacer has a hole, and the position sensor is disposed such that at least a portion thereof is disposed in the hole in the spacer and overlaps with the magnet in an optical axis direction.

Description

[Technical Field]

[0001] Cross-reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10-2020-0073349, filed in Korea on June 17, 2020, and Korean Patent Application No. 10-2020-0074226, filed in Korea on June 18, 2020, pursuant to 35 USC § 119, which are hereby incorporated in their entirety as fully set forth herein.

[0002] The embodiments relate to a camera module and an optical device including the camera module. [Previous Technology]

[0003] It is difficult to apply the voice coil motor (VCM) technology used in existing general-purpose camera modules to ultra-small, low-power camera modules, and therefore, research on this topic has been actively conducted.

[0004] The demand for and production of electronic products (such as smartphones and mobile phones equipped with cameras) has increased. Cameras used in mobile phones tend to have higher resolution and smaller size. As a result, actuators have also become smaller, larger in diameter, and more multifunctional. In order to realize high-resolution cameras for mobile phones, it is necessary to improve the performance of cameras used in mobile phones and their additional functions, such as autofocus, handshake correction, and zoom. [Summary of the Invention]

[0005] An embodiment provides a camera module and an optical device including the camera module, which can perform accurate OIS feedback operation and thus ensure the reliability of OIS operation.

[0006] In one embodiment, a camera module includes: a fixed portion including a magnet; and a movable portion including: a first circuit board spaced apart from the fixed portion; a position sensor disposed on the first circuit board; a coil disposed to face the magnet; and a spacer disposed between the first circuit board and the coil, wherein the spacer has a hole, and the position sensor is disposed such that at least a portion thereof is disposed in the hole in the spacer and overlaps with the magnet in an optical axis direction.

[0007] The hole in the spacer may overlap with at least a portion of the coil in the optical axis direction. The position sensor may not overlap with the coil in the optical axis direction. The coil may have a hole formed at its center, and the hole in the spacer may overlap with the hole in the coil in the optical axis direction. The position sensor may overlap with both the hole in the coil and the hole in the spacer in the optical axis direction.

[0008] A space may be defined between the magnet and the position sensor. The camera module may further include a resilient support member coupled to both the fixed portion and the movable portion. The fixed portion may include a second circuit board, and the resilient support member may electrically connect the first circuit board to the second circuit board. The coil may be coupled to the spacer and may electrically connect to the first circuit board.

[0009] In another embodiment, a camera module includes: a lens; an image sensor disposed at a position corresponding to the lens; a drive unit configured to move the image sensor; a circuit board disposed spaced apart from the lens; a position sensor disposed on the circuit board; and a spacer disposed on the circuit board, wherein the drive unit includes a magnet and a coil facing the magnet, wherein the spacer is disposed between the circuit board and the coil to space the coil apart from the position sensor, and wherein the image sensor moves in a direction perpendicular to an optical axis.

[0010] In another embodiment, a camera module includes: a fixed portion including a magnet; a movable portion including: a first circuit board disposed spaced apart from the fixed portion; a holder disposed on the first circuit board; a coil disposed on the holder facing the magnet; a position sensor disposed on the first circuit board facing the magnet; and a support member coupled to both the fixed portion and the movable portion, wherein the movable portion moves in a direction perpendicular to an optical axis by the interaction between the magnet and the coil, and the coil does not overlap with the coil in the direction perpendicular to the optical axis.

[0011] The position sensor may be mounted on the first circuit board and may not overlap with the coil in the optical axis direction. The fixing portion may include a second circuit board positioned to be spaced apart from the first circuit board. The support member may be coupled to the second circuit board at one end and to the first circuit board at the other end. The support member may connect the first circuit board to the second circuit board.

[0012] The coil may have a hole formed in its center, and the position sensor may be placed below the hole in the coil and may overlap with the hole in the coil in the optical axis direction.

[0013] The holder may have a through hole corresponding to the position sensor in the optical axis direction, and the position sensor may be disposed in the through hole in the holder. The holder may include a coupling protrusion protruding from its upper surface, and the coil may be coupled to the coupling protrusion.

[0014] The movable part may include an image sensor mounted on the first circuit board. The four corners of the first circuit board may have protrusions that protrude from the lateral side surface of the first circuit board, and the lower surface of the holder may have a mounting groove in which the protrusions of the first circuit board are disposed.

[0015] The coil may include a first coil unit to a fourth coil unit respectively disposed at a first corner to a fourth corner of the holder. The magnet may include a first magnet corresponding to one of the first coil units, a second magnet corresponding to one of the second coil units, a third magnet corresponding to one of the third coil units, and a fourth magnet corresponding to one of the fourth coil units. The position sensor may include a first sensor disposed below the first coil unit, a second sensor disposed below the second coil unit, and a third sensor disposed below the third coil unit. The first coil unit to the fourth coil unit may be activated individually.

[0016] The first coil unit to the third coil unit can be started individually, and the fourth coil unit can be started together with one of the first coil unit to the third coil unit.

[0017] In another embodiment, a camera module includes: a fixed portion including a magnet; and a movable portion including: a first circuit board disposed spaced apart from the fixed portion; a coil disposed facing the magnet; a holder disposed between the first circuit board and the coil; and a position sensor disposed on the first circuit board facing the magnet, wherein the coil has a first hole, the holder has a second hole formed at a position corresponding to one of the first holes, and at least a portion of the position sensor is disposed in the second hole in the holder. [Simplified Explanation of the Diagram]

[0018] The configuration and embodiments can be described in detail with reference to the following figures, in which the same reference numerals are the same and similar elements and wherein:

[0019] Figure 1 is a perspective view of a camera module according to an embodiment of the present invention;

[0020] Figure 2 is an exploded perspective view of the camera module shown in Figure 1;

[0021] Figure 3 is an assembled perspective view of the camera module shown in Figure 1, with the covering parts removed;

[0022] Figure 4 is an exploded perspective view of the AF operation unit shown in Figure 2;

[0023] Figure 5 is a perspective view of the spool, sensing magnet, balancing magnet, first coil, circuit board, first position sensor and capacitor shown in Figure 4;

[0024] Figure 6 is a perspective view of the spool, housing, circuit board and upper elastic component;

[0025] Figure 7 is a bottom perspective view of the outer casing, spool, lower elastic component, magnet and circuit board;

[0026] Figure 8 is a plan view of the image sensor unit;

[0027] Figure 9 is an exploded perspective view of the image sensor unit;

[0028] Figure 10 is a perspective view of the second circuit board and housing shown in Figure 9;

[0029] Figure 11 is a perspective view of the second circuit board, housing and magnet shown in Figure 9;

[0030] Figure 12A is an exploded perspective view of the holder, the second coil, the first circuit board, the second position sensor, the image sensor, the support component, and the connecting elastic component;

[0031] Figure 12B is a perspective view of the holder, second coil, first circuit board, second position sensor, filter holder and filter shown in Figure 12A;

[0032] Figure 13A is a bottom perspective view of the retainer shown in Figure 12A;

[0033] Figure 13B is a bottom view of the holder and the first circuit board;

[0034] Figure 14 is an exploded perspective view of the holder, image sensor, first circuit board, support component and connecting elastic component;

[0035] Figure 15 is a bottom view of the retainer, the first circuit board and the connecting elastic component;

[0036] Figure 16 is a bottom view of the retainer, the first circuit board, the connecting elastic component and the insulating component;

[0037] Figure 17 is a partial enlarged view of the connecting elastic component;

[0038] Figure 18 is a perspective view of a connecting spring and a supporting component;

[0039] Figure 19A is a cross-sectional view of the camera module shown in Figure 1 taken along line AB;

[0040] Figure 19B is a cross-sectional view of the camera module shown in Figure 1 taken along line CD;

[0041] Figure 20 is a cross-sectional view of the camera module shown in Figure 1 taken along line IJ;

[0042] Figure 21 is a cross-sectional view of the image sensor unit shown in Figure 8 taken along line EF;

[0043] Figure 22 is a view illustrating a connecting elastic member according to another embodiment;

[0044] FIG23 is an exploded perspective view of a camera module according to another embodiment of the present invention;

[0045] FIG24 is a view illustrating the configuration of a magnet, an OIS coil unit, an OIS position sensor, a holder, and a first circuit board according to an embodiment;

[0046] Figure 25 is a view illustrating the configuration of a magnet, an OIS coil unit, an OIS position sensor, a first circuit board, and a holder according to a comparative example.

[0047] Figure 26 is a view illustrating the frequency response characteristics relative to the drive signal input to the OIS coil unit and the output of the OIS position sensor;

[0048] FIG27 is a view illustrating the frequency response characteristics of the drive signal input to the OIS coil unit and the output of the OIS position sensor according to the embodiment shown in FIG24;

[0049] Figure 28 is a perspective view of a camera module according to an embodiment;

[0050] Figure 29 is an exploded perspective view of the camera module shown in Figure 28;

[0051] Figure 30 is an assembled perspective view of the camera module shown in Figure 28, with the covering parts removed;

[0052] Figure 31 is an exploded perspective view of the AF operation unit shown in Figure 29;

[0053] Figure 32 is a perspective view of the spool, sensing magnet, balancing magnet, first coil, circuit board, first position sensor and capacitor shown in Figure 31;

[0054] Figure 33 is a perspective view of the spool, housing, and circuit board;

[0055] Figure 34 is a bottom perspective view of the outer casing, spool, lower elastic component, magnet and circuit board;

[0056] Figure 35 is a plan view of the image sensor unit shown in Figure 29;

[0057] Figure 36 is an exploded perspective view of the image sensor unit shown in Figure 35;

[0058] Figure 37 is a perspective view of the first circuit board and its casing;

[0059] Figure 38 is a perspective view of the first circuit board, housing and magnet shown in Figure 36;

[0060] Figure 39A is an exploded perspective view of the second circuit board, the second coil, the second position sensor, the image sensor, the support component and the holder;

[0061] Figure 39B is a plan view of the third circuit board, the second coil and the second position sensor shown in Figure 39A;

[0062] Figure 40 is an exploded perspective view of the second circuit board, image sensor, support component, holder and connecting elastic component shown in Figure 36;

[0063] Figure 41 is a bottom view of the image sensor unit shown in Figure 35, with the bottom cover removed therefrom;

[0064] Figure 42 is a partial enlarged view of the connecting elastic component;

[0065] Figure 43 is a view illustrating the connecting spring of the connecting elastic component;

[0066] Figure 44A is a cross-sectional view of the camera module shown in Figure 28 taken along line AB;

[0067] Figure 44B is a cross-sectional view of the camera module shown in Figure 28 taken along line CD;

[0068] Figure 45 is a cross-sectional view of the camera module shown in Figure 28 taken along line IJ;

[0069] Figure 46 is a cross-sectional view of the image sensor unit shown in Figure 35 taken along line EF;

[0070] Figure 47 is a cross-sectional view of the image sensor shown in Figure 35 taken along line GH;

[0071] Figure 48 is a perspective view of the camera module, with the bottom cover removed from the camera module and the camera module cut open;

[0072] Figure 49 is a view illustrating the process of mounting the image sensor, filter holder and filter to the fourth circuit board;

[0073] Figure 50 is a view illustrating a controller according to an embodiment;

[0074] Figure 51 is a view illustrating one embodiment of the correction value stored in memory;

[0075] Figure 52 is a view illustrating the method of setting the correction value shown in Figure 51;

[0076] Figure 53 illustrates another embodiment of the correction value stored in memory;

[0077] Figure 54 is a view illustrating the method of setting the correction value shown in Figure 53;

[0078] Figure 55 is a view illustrating the placement of an OIS position sensor according to another embodiment;

[0079] Figure 56 is a view illustrating a controller according to one embodiment;

[0080] Figure 57 is a flowchart illustrating the operation of a controller according to an embodiment;

[0081] Figure 58 is a table illustrating an embodiment of calibrating the output of an OIS position sensor;

[0082] Figure 59 is a table illustrating another embodiment of the output of the OIS position sensor;

[0083] Figure 60 is a view illustrating the code value of the output of the first sensor, which corresponds to or matches the displacement of the movable part of the OIS in the x-axis direction;

[0084] Figure 61 is a view illustrating the frequency response characteristics relative to the drive signal input to the OIS coil unit and the output of the OIS position sensor;

[0085] Figure 62 is a perspective view illustrating an optical device according to an embodiment; and

[0086] Figure 63 is a view illustrating the configuration of the optical device described in Figure 62.

Implementation Method

[0087] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0088] The technical concept of the present invention can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. One or more of the components of the embodiments may be selectively combined or substituted with each other without departing from the spirit and scope of the invention.

[0089] Unless otherwise specifically defined, the terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by those skilled in the art to which this invention pertains. It will be further understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field.

[0090] The terminology used in the embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in the present invention and the appended claims, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. The phrase "at least one (or one or more) of A, B and C" can be interpreted as including one or more of all combinations of A, B and C.

[0091] Furthermore, when describing components of the present invention, terms such as "first," "second," "A," "B," "(a)," or "(b)" may be used. Since these terms are provided merely to distinguish the components from each other, they do not limit the nature, order, or sequence of the components.

[0092] It should be understood that when an element is referred to as "linked," "coupled," or "connected" to another element, the element may be directly "linked," "coupled," or "connected" to the other element, or may be "linked," "coupled," or "connected" to the other element via another element inserted therein. Furthermore, it will be understood that when an element is referred to as being "on" or "below" another element, it may be directly "on" or "below" the other element, or may be indirectly disposed relative to it, with one or more intervening elements therein. Furthermore, it will also be understood that "on" or "below" an element may mean based on the upward or downward direction of the element.

[0093] In the following text, the AF operating unit may be referred to as a "lens moving unit", "voice coil motor (VCM)", "actuator" or "lens moving device". In the following text, the term "coil" may be used interchangeably with "coil unit", and the term "elastic member" may be used interchangeably with "elastic unit" or "spring".

[0094] In the following description, "terminal" may be referred to alternatively as "pad", "electrode", "conductive layer" or "joint portion".

[0095] In the following text, “code value” may be referred to as “data value” or “digital value”.

[0096] In the following text, "camera module" may be referred to as "camera", "imaging device" or "camera assembly".

[0097] For ease of description, although a rectangular coordinate system (x, y, Z) is used to describe a camera module according to one embodiment, other coordinate systems may be used to describe the lens moving device, and the embodiments are not limited thereto. In various figures, the X-axis direction and the Y-axis direction mean directions perpendicular to the optical axis (i.e., the Z-axis). The Z-axis direction, which is the direction of the optical axis OA, may be referred to as the "first direction," the X-axis direction may be referred to as the "second direction," and the Y-axis direction may be referred to as the "third direction."

[0098] The camera module according to an embodiment of the present invention is capable of performing an "autofocus function". Here, the "autofocus function" is used to automatically focus the image of the object onto the surface of the image sensor.

[0099] Furthermore, the camera module according to the embodiment can perform a "handshake correction" function. Here, the "handshake correction" function can be used to prevent the outline of the captured image from becoming blurred due to vibration caused by shaking of the user's hand when capturing still images.

[0100] FIG1 is a perspective view of a camera module 10 according to an embodiment of the present invention. FIG2 is an exploded perspective view of the camera module 10 shown in FIG1. ​​FIG3 is an assembled perspective view of the camera module shown in FIG1, with the cover component 300 removed therefrom. FIG4 is an exploded perspective view of the AF operation unit 100 shown in FIG2. FIG5 is a perspective view of the spool 110, sensing magnet 180, balancing magnet 185, first coil 120, circuit board 190, first position sensor 170 and capacitor 195 shown in FIG4. FIG6 is a perspective view of the spool 110, housing 140, circuit board 190 and upper elastic member 150. FIG7 is a bottom perspective view of the housing 140, spool 110, lower elastic member 160, magnet 130 and circuit board 190.

[0101] Referring to Figures 1 to 7, the camera module 10 may include an AF operation unit 100 and an image sensor unit 350.

[0102] The camera module 10 may further include at least one of a cover member 300, a lens module 400, a base 210, and a bottom cover plate 219. The cover member 300, the base 210, and the bottom cover plate 219 define the housing.

[0103] The AF operation unit 100 can be coupled to the lens module 400 and can move the lens module 400 in the direction of the optical axis OA or in a direction parallel to the optical axis in order to perform the autofocus function of the camera module 10.

[0104] The image sensor unit 350 may include an image sensor 810, and the image sensor 810 may be moved in a direction perpendicular to the optical axis or may be tilted or rotated relative to the optical axis. The image sensor unit 350 may perform a handshake correction function.

[0105] For example, the image sensor 810 can rotate about at least one of the x-axis, y-axis and z-axis.

[0106] For example, the image sensor 810 can move in at least one of the x-axis direction, y-axis direction and z-axis direction.

[0107] For example, the image sensor 810 may be tilted relative to at least one of the x-axis, y-axis and z-axis.

[0108] The AF operation unit 100 may alternatively be referred to as a "lens moving unit" or "lens moving device". Alternatively, the AF operation unit 100 may alternatively be referred to as a "first actuator" or "AF operation drive unit".

[0109] For optical image stabilization (OIS) motion, the image sensor 810, rather than the lens module 400, can be moved in a direction perpendicular to the optical axis by means of the image sensor unit 350.

[0110] The image sensor unit 350 may alternatively be referred to as an "image sensor moving unit" or "image sensor shifting unit", "sensor moving unit" or "sensor shifting unit". Alternatively, the image sensor unit 350 may alternatively be referred to as a "second actuator" or "OIS driving unit".

[0111] Referring to Figure 4, the AF operation unit 100 may include a bobbin 110, a first coil 120, a magnet 130, and a housing 140.

[0112] The AF operation unit 100 may further include an upper elastic member 150 and a lower elastic member 160.

[0113] The AF operation unit 100 may include a first position sensor 170, a circuit board 190, and a sensing magnet 180 for AF feedback operation. The AF operation unit 100 may further include at least one of a balancing magnet 185 and a capacitor 195.

[0114] The spool 110 may be housed in the housing 140 so that it may be moved in the direction of the optical axis OA or in a first direction (e.g., the Z-axis direction) by means of the electromagnetic interaction between the first coil 120 and the magnet 130.

[0115] The spool 110 may have a hole to which the lens module 400 is coupled or mounted. For example, the hole in the spool 110 may be a through hole formed through the spool 110 in the optical axis direction, and may have a circular shape, an elliptical shape or a polygonal shape, but is not limited thereto.

[0116] The lens module 400 may include at least one lens and / or lens barrel.

[0117] For example, the lens module 400 may include at least one lens and a lens barrel for housing the at least one lens. However, the configuration of the lens module is not limited to the lens barrel, and the lens module may have any configuration as long as the configuration can support at least one lens.

[0118] For example, the lens module 400 can be threaded into the spool 110. Alternatively, the lens module 400 can be coupled to the spool 110 using, for example, an adhesive (not shown). Light that has passed through the lens module 400 can be radiated to the image sensor 810 via the filter 610.

[0119] The spool 110 may include a protrusion 111 disposed on its outer surface.

[0120] For example, although the protrusion 111 may protrude in a direction parallel to a line perpendicular to the optical axis OA, the present invention is not limited thereto.

[0121] The protrusion 111 of the spool 110 may correspond to the groove 25a in the housing 140 and may be placed in the groove 25a in the housing 140 in order to minimize or prevent the rotation of the spool 110 about the optical axis from exceeding a predetermined range.

[0122] Furthermore, the protrusion 111 may serve as a stop that is configured to allow the spool 110 to move within a predetermined range in the optical axis direction (e.g., in the direction from the upper elastic member 150 toward the lower elastic member 160) in response to external impacts, etc.

[0123] The spool 110 may have a first outflow groove 112a formed in its upper surface to avoid spatial interference with the first frame connector 153 of the upper elastic member 150. The spool 110 may have a second outflow groove 112b formed in its lower surface to avoid spatial interference with the second frame connector 163 of the lower elastic member 160.

[0124] The spool 110 may include a first coupler 116a configured to be coupled to and secured to the upper elastic member 150. For example, although the first coupler 116a of the spool 110 may have a flat shape, the invention is not limited thereto. In another embodiment, the first coupler 116a of the spool 110 may have a protruding or recessed shape.

[0125] The spool 110 may include a second coupler 116b configured to be coupled and secured to the lower resilient member 160. For example, although the second coupler 116b may have a flat shape, the invention is not limited thereto. In another embodiment, the second coupler 116b may have a protruding or recessed shape.

[0126] Referring to FIG5, a groove may be formed therein on the outer surface of the bobbin 110, in which the first coil 120 is placed, fitted, or disposed. The groove in the bobbin 110 may have a shape corresponding to the shape of the first coil 120, that is, a closed curve shape (e.g., a ring shape).

[0127] The spool 110 may have a first mounting groove therein, in which the sensing magnet 180 is mounted, fitted, fixed, or placed. Furthermore, the spool 110 may have a second mounting groove on its outer surface, in which the balancing magnet 185 is mounted, fitted, fixed, or placed. For example, the first and second mounting grooves in the spool 110 may be formed on opposite outer surfaces of the spool 110.

[0128] The first coil 120 may be disposed at or coupled to the spool 110. For example, the first coil 120 may be disposed on the outer surface of the spool 110.

[0129] The first coil 120 may be around the outer surface of the spool 110 around the optical axis OA in the winding direction, but is not limited thereto.

[0130] Although the first coil 120 may be directly wound around the outer surface of the spool 110, the invention is not limited thereto. In another embodiment, the first coil 120 may be implemented as a coil loop wound around the spool 110, or wound as a coil block having an angled shape.

[0131] Power or drive signal can be supplied to coil 120.

[0132] The power or drive signal supplied to the first coil 120 may be a DC signal, an AC signal, or a signal containing both DC and AC components, and may be of voltage type or current type.

[0133] When a drive signal (e.g., drive current) is supplied to the first coil 120, an electromagnetic force may be generated by the electromagnetic interaction with the first magnet, thereby causing the spool 110 to move in the direction of the optical axis OA by means of the generated electromagnetic force.

[0134] At the initial position of the AF operating unit, the spool 110 can move upward or downward, which is called bidirectional drive of the AF operating unit. Alternatively, at the initial position of the AF operating unit, the spool 110 can move upward (or forward), which is called unidirectional drive.

[0135] At the initial position of the AF operation unit, the first coil 120 may be positioned to correspond to the magnet 130 located on the housing 140 in a direction parallel to and perpendicular to the optical axis OA and extending through the optical axis.

[0136] For example, the AF operation unit may include a spool 110 and components coupled to the spool 110 (e.g., a first coil 120, a sensing magnet 180, and a balancing magnet 185). The AF operation unit may further include a lens module 400.

[0137] The initial position of the AF operating unit may be the original position of the AF operating unit when no power is applied to the first coil 120, or the position where the AF operating unit is located due to the elastic deformation of the upper elastic member 150 and the lower elastic member 160 only due to the weight of the AF operating unit.

[0138] In addition, the initial position of the spool 110 may be the position of the AF operation unit when gravity acts in the direction from the spool 110 to the base 210 or when gravity acts in the direction from the base 210 to the spool 110.

[0139] The sensing magnet 180 can provide a magnetic field detected by the first position sensor 170, and the balancing magnet 185 can be used to counteract the influence of the magnetic field of the sensing magnet 180 and establish a weight balance relative to the sensing magnet 180.

[0140] The sensing magnet 180 may alternatively be referred to as the "sensor magnet".

[0141] The sensing magnet 180 may be placed at the spool 110 or may be coupled to the spool 110.

[0142] The sensing magnet 180 may be positioned to face the first position sensor 170.

[0143] The balancing magnet 185 may be placed at or coupled to the spool 110. For example, the balancing magnet 185 may be positioned opposite the sensing magnet 180.

[0144] Although each of the sensing magnet 180 and the balancing magnet 185 may be a unipolar magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet 180 and the balancing magnet 185 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0145] The sensing magnet 180 can move together with the spool 110 in the optical axis direction, and the first position sensor 170 can detect the strength or magnetic force of the magnetic field of the sensing magnet 180 (which moves in the optical axis direction) and output an output signal corresponding to the detection result.

[0146] For example, the strength or force of the magnetic field detected by the first position sensor 170 may change depending on the displacement of the spool 110 in the optical axis direction. Therefore, the first position sensor 170 can output an output signal proportional to the detected strength of the magnetic field, and the displacement of the spool 110 in the optical axis direction can be detected using the output signal from the first position sensor 170.

[0147] The housing 140 houses the spool 110 and supports the magnet 130, the first position sensor 170 and the circuit board 190.

[0148] Referring to Figures 4, 6 and 7, the housing 140 may be configured to have a hollow column overall. For example, the housing 140 may have a polygonal (e.g., rectangular or octagonal) or circular hole, and the hole in the housing 140 may be a through hole that is formed through the housing 140 in the optical axis direction.

[0149] The housing 140 may include a side portion corresponding to or facing the side plate 302 of the cover member 300, and a corner corresponding to or facing the corner of the cover member 300.

[0150] In order to prevent direct collision with the inner surface of the upper plate 301 of the cover member 300, the housing 140 may include a stop 145 disposed on its upper portion, upper surface or upper end.

[0151] To prevent the lower surface of the housing 140 from colliding with the circuit board 800 of the image sensor 350, the housing 140 may further include a stop protruding from its lower surface. Here, the stop 145 may be alternatively referred to as a "boss" or "protrusion".

[0152] Referring to FIG4, the housing 140 may have a mounting recess (or placement recess) 14a configured to house the circuit board 190 therein. The mounting recess 14a may have a shape corresponding to the shape of the circuit board 190.

[0153] Referring to FIG6, the housing 140 may have an opening 141 through which terminals B1 to B6 of the terminal components 95 of the circuit board 190 are exposed. The opening 141 may be formed in a side portion of the housing 140.

[0154] The upper portion, upper end or upper surface of the housing 140 may have at least one first coupler coupled to the first outer frame 152 of the upper elastic member 150.

[0155] The lower portion, lower end, or lower surface of the housing 140 may have a second coupler that is coupled to and fixed to the second outer frame 162 of the lower elastic member 160. For example, each of the first coupler and the second coupler of the housing 140 may have the shape of a protrusion, a groove, or a flat surface.

[0156] The magnet 130 may be disposed at the housing 140. For example, the magnet 130 may be disposed at the side portion of the housing 140. The magnet 130 may be an AF operating magnet for AF operation.

[0157] For example, although the magnet 130 may include a first magnet 130-1 and a second magnet 130-2 disposed on two side portions positioned opposite each other, the invention is not limited thereto. In another embodiment, the magnet 130 may be disposed at a corner of the housing 140.

[0158] Magnet 130 may include two or more magnets.

[0159] At the initial position of the AF operation unit, the first magnet 130 may be placed on the housing so as to partially overlap with the first coil 120 in a direction parallel to the line perpendicular to the optical axis OA and extending through the optical axis OA.

[0160] Although each of the first magnet 130-1 and the second magnet 130-2 may be a unipolar magnetized magnet, the present invention is not limited thereto. In another embodiment, each of the first magnet 130-1 and the second magnet 130-2 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0161] The circuit board 190 may be disposed at the housing 140, and the first position sensor 170 may be disposed at the circuit board 190 or mounted to the circuit board. For example, the circuit board 190 may be disposed in a mounting recess 14a in the housing 140, and the terminals of the circuit board 190 may be exposed to the outside of the housing 140 through an opening 141 in the housing 140.

[0162] The circuit board 190 may include a terminal component (or terminal unit) 95, which includes a plurality of terminals B1 to B6 to be conductively connected to an external terminal or external device, and the plurality of terminals B1 to B6 may be conductively connected to the first position sensor 170.

[0163] A first position sensor 170 may be disposed on a first surface of circuit board 190, and a plurality of terminals B1 to B6 may be disposed on a second surface of circuit board 190. Here, the second surface of circuit board 190 may be the surface opposite to the first surface of circuit board 190. For example, the first surface of circuit board 190 may be the surface of circuit board 190 facing the spool 110 or the sensing magnet 180.

[0164] For example, the circuit board 190 may be implemented as a printed circuit board or an FPCB.

[0165] The circuit board 190 may include circuit patterns or wires (not shown) for conductively connecting the first terminal B1 to the sixth terminal B6 to the first position sensor 170.

[0166] The first position sensor 170 can detect the magnetic field or the strength of the magnetic field of the sensing magnet 180 mounted on the linear shaft 110 during the movement of the linear shaft 110, and can output an output signal corresponding to the detection result.

[0167] The first position sensor 170 may be implemented as a single Hall sensor. The first position sensor 170 may include two input terminals to which a drive signal or power is supplied and two output terminals to which a sense voltage (or output voltage) is output.

[0168] For example, the drive signal can be supplied to the first position sensor 170 via the first terminal B1 and the second terminal B2 of the circuit board 190, and the output of the first position sensor 170 can be output to the outside via the third terminal B3 and the fourth terminal B4.

[0169] The fifth terminal B5 and the sixth terminal B6 of the circuit board 190 can be electrically connected to at least one of the upper elastic member 150 and the lower elastic member 160 so as to supply a drive signal to the first coil 120.

[0170] For example, the fifth terminal B5 and the sixth terminal B6 of the circuit board 190 can be electrically connected to the first elastic member 150-1 and the second elastic member 150-2 of the upper elastic member 150 so that the drive signal can be supplied to the first coil 120 via the first elastic member 150-1 and the second elastic member 150-2.

[0171] In another embodiment, the first position sensor 170 may be implemented as a driver IC including a Hall sensor. For example, the first position sensor 170 may include a Hall sensor and a driver. Here, the first position sensor 170 may include first terminals to fourth terminals (data is transmitted to and received from the outside via data communication using a protocol such as I2C communication through the first terminals to fourth terminals) and fifth and sixth terminals, and drive signals are directly supplied to the first coil 120 via the fifth and sixth terminals. The first terminals to fourth terminals of the first position sensor 170 may be electrically connected to the first terminals B1 to fourth terminals B4 of the circuit board 190.

[0172] The fifth and sixth terminals of the first position sensor 170 can be electrically connected to the first coil 120 via at least one of the upper elastic member 150 and the lower elastic member 160 to supply a drive signal to the first coil 120. For example, the fifth and sixth terminals of the first position sensor 170 can be electrically connected to the first elastic member 150-1 and the second elastic member 150-2 to supply a drive signal to the first coil 120. The capacitor 195 can be disposed or mounted on the first surface of the circuit board 190.

[0173] The capacitor 195 may be configured to have a wafer shape. Here, the wafer may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195. The capacitor 195 may also be referred to as a "capacitive element" or a "phase modulator".

[0174] The capacitor 195 can be connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 190 in a conductive manner, and power (or drive signal) is supplied from the outside to the position sensor 170 through the first terminal and the second terminal. Alternatively, the capacitor 195 can be connected in parallel to the terminals of the first position sensor 170 in a conductive manner, and the first position sensor is conductively connected to the first terminal B1 and the second terminal B2 of the circuit board 190.

[0175] Since the capacitor 195 is connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 190 in a conductive manner, the capacitor 195 can act as a smoothing circuit for eliminating the ripple components in the power signals GND and VDD supplied from the outside to the first position sensor 170, and thus can supply a stable and consistent power signal to the first position sensor 170.

[0176] The upper elastic member 150 may be coupled to the upper portion, upper end or upper surface of the spool 110 and the upper portion, upper end or upper surface of the housing 140, and the lower elastic member 160 may be coupled to the lower portion, lower end or lower surface of the spool 110 or the upper portion, upper end or upper surface of the housing 140.

[0177] The upper elastic member 150 and the lower elastic member 160 can elastically support the spool 110 relative to the housing 140.

[0178] For example, the upper elastic member 150 may include a first elastic member 150-1 and a second elastic member 150-2. Although the lower elastic member 160 is implemented as a single unit or a single structure in FIG4, the present invention is not limited thereto.

[0179] In another embodiment, at least one of the upper elastic member and the lower elastic member may include a plurality of elastic units or springs that are electrically isolated or spaced apart from each other.

[0180] The upper elastic member 150 may further include: a first inner frame 151 coupled or fixed to the upper portion, upper surface or upper end of the spool 110; a first outer frame 152 coupled or fixed to the upper portion, upper surface or upper end of the housing 140; and a first frame connector 153 connecting the first inner frame 151 to the first outer frame 152.

[0181] The lower elastic member 160 may include a second inner frame 161 coupled or fixed to the lower portion, lower surface or lower end of the spool 110, a second outer frame 162 coupled or fixed to the lower portion, lower surface or lower end of the housing 140, and a second frame connector 163 connecting the second inner frame 161 to the second outer frame 162.

[0182] Each of the first frame connector 153 and the second frame connector 163 may be bent or flexed (or may be formed into a curve) at least once to define a predetermined pattern.

[0183] Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material.

[0184] Referring to Figures 4 and 5, the circuit board 190 may include two pads 5a and 5b. For example, although the first pad 5a may be disposed on the second surface of the circuit board 190 and the second pad 5b may be disposed on the first surface of the circuit board 190, the invention is not limited thereto. In another embodiment, both the first pad and the second pad may be formed on only one of the first surface and the second surface of the circuit board 190.

[0185] The first pad 5a and the second pad 5b can be electrically connected to the fifth terminal B5 and the sixth terminal B6 of the circuit board 190. For example, the first pad 5a can be coupled to the first elastic member 150-1, and the second pad 5b can be coupled to the second elastic member 150-2.

[0186] For example, the first outer frame of the first elastic member 150-1 may include a first coupler 4a configured to be coupled to the first pad 5a, and the first outer frame of the second elastic member 150-2 may include a second coupler 4b configured to be coupled to the second pad 5b.

[0187] For example, one end of the first coil 120 may be coupled to the first elastic member 150-1, and the other end of the first coil 120 may be coupled to the second elastic member 150-2.

[0188] In another embodiment, the upper elastic member 150 may be coupled to the first pad 5a of the circuit board 190 for conductive connection to the circuit board, and the lower elastic member 160 may be coupled to the second pad 5b of the circuit board 190 for conductive connection to the circuit board. In another embodiment, the lower elastic member 160 may include two lower elastic members, and each of the two lower elastic members may be coupled to or conductively connected to a corresponding one of the first pad 5a and the second pad 5b of the circuit board 190. The first coil 120 may be conductively connected to the two lower elastic members.

[0189] Figure 8 is a plan view of the image sensor unit 350. Figure 9 is an exploded perspective view of the image sensor unit 350. Figure 10 is a perspective view of the second circuit board 800 and housing 450 shown in Figure 9. Figure 11 is a perspective view of the second circuit board 800, housing 450 and magnet 23 shown in Figure 9. Figure 12A is an exploded perspective view of the holder 270, second coil 230, first circuit board 250, second position sensor 240, image sensor 810, support member 220 and connecting elastic member 280. Figure 12B is a perspective view of the holder 270, second coil 230, first circuit board 250, second position sensor 240, filter holder 600 and filter 610 shown in Figure 12A. Figure 13A is a bottom perspective view of the holder 270 shown in Figure 12A. Figure 13B is a bottom view of the holder 270 and first circuit board 250. Figure 14 is an exploded perspective view of the holder 270, image sensor 810, first circuit board 250, support member 220, and connecting elastic member 280. Figure 15 is a bottom view of the holder 270, first circuit board 250, and connecting elastic member 280. Figure 16 is a bottom view of the holder 270, first circuit board 250, connecting elastic member 280, and insulating member 285. Figure 17 is a partial enlarged view of the connecting elastic member 280. Figure 18 is a perspective view of a connecting spring 281 and a support member 220. Figure 19A is a cross-sectional view of the camera module shown in Figure 1 taken along line AB. Figure 19B is a cross-sectional view of the camera module 10 shown in Figure 1 taken along line CD. Figure 20 is a cross-sectional view of the camera module 10 shown in Figure 1 taken along line IJ. Figure 21 is a cross-sectional view of the image sensor unit 350 shown in Figure 8 taken along line EF.

[0190] Referring to Figures 8 to 21, the image sensor unit 350 may include: a fixed portion including a magnet 23; and a movable portion including: a first circuit board 250 spaced apart from the fixed portion; a second position sensor 240 disposed on the first circuit board 250; a second coil 230 disposed to face the magnet 23; and a spacer disposed between the first circuit board 250 and the second coil 230.

[0191] The spacer may be, for example, a retainer 270. The retainer 270 may also be used interchangeably with the spacer. The spacer may include one or more holes 41A to 41C.

[0192] At least a portion of the second position sensor 240 may be disposed in holes 41A to 41C in the spacer and may overlap with the magnet 23 in the optical axis direction.

[0193] The holes 41A to 41C in the spacer may overlap with at least a portion of the second coil 230 in the optical axis direction.

[0194] The second position sensor 240 may not overlap with the second coil 230 in the optical axis direction.

[0195] The second coil 230 may have a hole 11A formed in its center, and each of the holes 41A to 41C in the spacer may overlap with the hole 11A in the second coil 230 in the optical axis direction.

[0196] The second position sensor 240 may overlap with each of the holes 11A in the second coil 230 and the holes 41A to 41C in the spacer in the optical axis direction.

[0197] The space may be defined between the magnet 130 and the second position sensor 240. For example, at least a portion of the second coil 230 and / or at least a portion of the spacer may not be inserted into or disposed in the space between the magnet 130 and the second position sensor 240.

[0198] The image sensor unit 250 may include resilient support members 220 and 280, which are coupled to both the fixed portion and the movable portion. The resilient support members 220 and 280 can flexibly support the movable portion relative to the fixed portion. The resilient support members 220 and 280 may alternatively be referred to as "support members" or "resilient members".

[0199] The fixing part may include a second circuit board 800 spaced apart from the first circuit board 250, and the elastic support members 220 and 280 may electrically connect the first circuit board 250 to the second circuit board 800.

[0200] The second coil 230 can be coupled to the spacer and can be electrically connected to the first circuit board 250.

[0201] A camera module according to an embodiment of the present invention may include a lens module (or lens) 400, an image sensor 810 disposed at a position corresponding to the lens, a drive unit configured to move the image sensor 810, a first circuit board 250 spaced apart from the lens, a second position sensor 240 disposed on the first circuit board 250, and a spacer disposed on the first circuit board 250. For example, the drive unit may include a magnet 23 and a second coil 230 disposed to face the magnet 23, and the spacer may be disposed between the first circuit board 250 and the second coil 230 to space the second coil 230 from the second position sensor 240. The image sensor 810 may be movable in a direction perpendicular to the optical axis.

[0202] Alternatively, an image sensor unit according to one embodiment of the present invention may include: a fixed portion including a magnet 23; a movable portion spaced apart from the fixed portion, including: a first circuit board 250; a holder 270 disposed on the first circuit board 250; a second coil 230 disposed on the holder 270 to face the magnet 23; a second position sensor 240 disposed on the first circuit board 250 to face the magnet 23; and elastic support members 220 and 280 coupled to both the fixed portion and the movable portion.

[0203] The movable part can move in a direction perpendicular to the optical axis by the interaction between the magnet 23 and the second coil 230, and the second coil 230 may not overlap with the second position sensor 240 in a direction perpendicular to the optical axis.

[0204] The elastic support members 220 and 280 may be coupled to the second circuit board 800 at one end and to the first circuit board 250 at the other end. In other words, the elastic support members 220 and 280 may connect the first circuit board 250 to the second circuit board 800.

[0205] The second coil 230 may have a hole 11A formed in its center, and the second position sensor 240 may be disposed below the hole 11A in the second coil 230 so as to overlap with the hole 11A in the optical axis direction.

[0206] The holder 270 may have a through hole corresponding to the second position sensor 240, and the second position sensor 240 may be disposed in the through hole in the holder 270. For example, the second position sensor 240 may overlap with the holder 270 in a direction perpendicular to the optical axis.

[0207] The four corners of the first circuit board 260 may have protrusions 52A to 52D protruding from the lateral side surface of the first circuit board, and the lower surface of the retainer 270 may have mounting grooves 53A to 53D formed therein, and the protrusions 52A to 52D of the first circuit board 250 are placed in the mounting grooves.

[0208] The second coil 230 may include a first coil unit 230-1 to a fourth coil unit 230-4 disposed at a first corner to a fourth corner of the holder 270, and the magnet 23 may include a first magnet 23A corresponding to the first coil unit 230-1, a second magnet 23B corresponding to the second coil unit 230-2, a third magnet 23C corresponding to the third coil unit 230-3, and a fourth magnet 23D corresponding to the fourth coil unit 230-4.

[0209] The second position sensor 240 may include a first sensor 240a disposed below the first coil unit 230-1, a second sensor 240b disposed below the second coil unit 230-2, and a third sensor 240c disposed below the third coil unit 230-3.

[0210] For example, each of the first coil unit 230-1 to the fourth coil unit 230-4 can be started independently. In other words, the first coil unit 230-1 to the fourth coil unit 230-4 can be started by individual drive signals.

[0211] In another embodiment, the first coil unit 230-1 to the third coil unit 230-3 can be started independently, and the fourth coil unit 230-4 can be started together with one of the first coil unit 230-1 to the third coil unit 230-3. For example, the first coil unit 230-1 to the third coil unit 230-3 can be started by different drive signals, and the fourth coil unit 230-4 can be started together with one of the first coil unit 230-1 to the third coil unit 230-3 by the same drive signal.

[0212] For example, the image sensor unit 350 may include a second circuit board 800, a magnet 23, a holder 270, a first circuit board 250, a second coil 230, a second position sensor 240, and an image sensor 810. The image sensor unit 350 may further include a connecting elastic member 280 and a support member 220.

[0213] The image sensor unit 350 may further include a housing 450 configured to house at least a portion of the second circuit board 800.

[0214] The second circuit board 800 can be used to supply signals from the outside to the image sensor unit 350, or to output signals from the image sensor unit 350 to the outside.

[0215] The second circuit board 800 can be alternatively referred to as a fixed circuit board, auxiliary circuit board, fixed board, etc.

[0216] Referring to Figures 9 and 10, the second circuit board 800 may include a first region 801 corresponding to the AF operation unit 100, a second region 802 housing the connector 840, and a third region 803 connecting the first region 801 to the second region 802. The connector 840 may be electrically connected to the second region 802 of the second circuit board 800, and may include a port configured to be electrically connected to an external device.

[0217] Although each of the first region 801 and the second region 802 of the second circuit board 800 may include a flexible substrate and a rigid substrate, and the third region 803 may include a flexible substrate, the present invention is not limited thereto. In another embodiment, at least one of the first region 801 to the third region 803 of the second circuit board 800 may include at least one of a rigid substrate and a flexible substrate.

[0218] The first region 801 can be alternatively referred to as the first substrate, the second region 802 can be alternatively referred to as the second substrate, and the third region 803 can be alternatively referred to as the third substrate.

[0219] The second circuit board 800 may have holes 800A corresponding to the holes in the spool 110, the lens module 400, and / or the image sensor 810. For example, the holes 800A in the second circuit board 800 may be formed in the first region 801.

[0220] Referring to Figures 10, 11 and 19A, at least a portion of the lens module 400 may extend through a hole 800A in the second circuit board 800 and may be positioned below the second surface 44B of the second circuit board 800.

[0221] The lens module 400 may be mounted on the first circuit board 250. For example, the lens module 400 may be positioned on the filter 610 mounted on the filter holder 600.

[0222] For example, the lower portion, lower end or lower surface of the lens or lens barrel of the lens module 400 may extend through the hole 800A in the second circuit board 800 and may be positioned below the second surface 44B of the second circuit board 800.

[0223] For example, the lower portion, lower end or lower surface of the lens or lens barrel of the lens module 400 may be positioned above the first surface 60A of the first circuit board 250.

[0224] In addition, the lower part, lower end or lower surface of the lens or lens barrel of the lens module 400 may be positioned above the hole 70 in the holder 270.

[0225] Although the second circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral, rectangular, or square shape) when viewed from above, the invention is not limited thereto. In another embodiment, the second circuit board 800 may be configured to have another shape, such as a circular shape. Furthermore, although the hole 800A in the second circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral, square, or rectangular shape), the invention is not limited thereto. In another embodiment, the hole 800A may be configured to have another shape, such as a circular shape.

[0226] The second circuit board 800 may include at least one pad corresponding to the support member 220. For example, at least one of the second circuit boards 800 may include a plurality of pads 800B. Here, pads 800B may alternatively be referred to as "lead pattern", "lead member" or "hole".

[0227] The second circuit board 800 may have at least one hole corresponding to the support member 220, and the hole may be formed through the second circuit board 800. For example, the second circuit board 800 may include a plurality of through holes corresponding to a plurality of support members.

[0228] For example, each of the plurality of pads 800B may have a hole formed through the second circuit board 800 in the optical axis direction.

[0229] Each of the plurality of pads 800B may be formed to surround a hole in the second circuit board 800, and may further include a lead pattern or a conductive layer.

[0230] With the support member 220 extending through the hole in the second circuit board 800, it can be soldered to the pad 800B and can be electrically connected to the lead pattern placed around the pad 800B.

[0231] For example, a plurality of pads 800B may be spaced apart from each other by a predetermined interval to surround a hole 800A in the second circuit board 800. For example, a plurality of pads 800B may be disposed between the hole 800A in the second circuit board 800 and the side of the second circuit board 800.

[0232] The second circuit board 800 may have at least one coupling hole 800C configured to couple to a coupling protrusion 45B of the housing 450. Although the coupling hole 800C may be a through-hole formed through the second circuit board 800, the invention is not limited thereto. In another embodiment, the coupling hole 800C may be a recess.

[0233] For example, although the coupling hole 800C may be implemented as a plurality of coupling holes formed in diagonally opposite corners of the second circuit board 800, the present invention is not limited thereto. The coupling hole may be located near the side of the second circuit board 800 or between the side of the second circuit board 800 and the hole 800A.

[0234] The second circuit board 800 may include at least one terminal, such as a plurality of terminals 7A to 7F.

[0235] The plurality of terminals 7A to 7F may be formed on a first surface (e.g., upper surface) 44A of the second circuit board 800. For example, the plurality of terminals 7A to 7F may be disposed on a side of the second circuit board 800 adjacent to a corner of the second circuit board 800.

[0236] Each of the plurality of terminals 7A to 7F can be electrically connected to a corresponding terminal B1 to B6 of the circuit board 190 via a conductive adhesive component or solder.

[0237] For example, the second circuit board 800 may include a terminal component 80A, at which a plurality of terminals 7A to 7F are formed. Although the terminal component 80A protrudes from one side of the second circuit board 800 in a direction perpendicular to the optical axis, the invention is not limited thereto. In another embodiment, the terminal component 80A may not protrude from one side of the second circuit board 800.

[0238] The image sensor unit 350 may further include a housing 450 for placing, mounting or storing the second circuit board 800.

[0239] The housing 450 may be coupled to at least a portion of the second circuit board 800. The housing 450 may house the magnet 23 and may alternatively be referred to as a "magnet holder".

[0240] For example, the second circuit board 800 may be disposed below the AF operation unit 100 and may be coupled to the AF operation unit 100. For example, the adhesive component 310 may be disposed between the second circuit board 800 and the AF operation unit 100 to couple them to each other.

[0241] For example, the adhesive component 310 may be disposed between the first surface 44A of the second circuit board 800 and the lower portion, lower surface or lower end of the housing 140 of the AF operation unit 100 in order to couple them to each other.

[0242] In another embodiment, the housing 140 of the AF operation unit 100 may also be coupled to the housing 450 of the image sensor unit 350. For example, the upper portion, upper end, or upper surface of the image sensor unit 350 may also be coupled to the lower portion, lower end, or lower surface of the housing 140 of the AF operation unit 100 via an adhesive member or coupling structure.

[0243] The housing 450 may be positioned below the second circuit board 800. For example, the AF operation unit 100 may be positioned above the second circuit board 800, and the housing 450 may be positioned below the second circuit board 800.

[0244] The housing 450 may have a shape corresponding to or consistent with the first region 801 of the second circuit board 800. Although the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the invention is not limited thereto. In another embodiment, the housing 450 may be configured to have a circular shape or an elliptical shape.

[0245] The housing 450 may have a hole 450A formed therein. At least a portion of the hole 450A in the housing 450 may correspond to or overlap with the hole 800A in the second circuit board 800.

[0246] Although the hole 450A in the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral or octagonal shape), a circular shape, or a cross shape when viewed from above, the present invention is not limited thereto. The hole 450A in the housing 450 may be a through hole formed through the housing 450 in the optical axis direction.

[0247] The housing 450 may include at least one coupling protrusion 45B that protrudes from the upper surface of the body 42 of the housing. For example, the coupling protrusion 45B may protrude from the upper surface of the housing 450 in a direction toward the second surface (e.g., the lower surface) 44B of the second circuit board 800.

[0248] The housing 450 may include an escape region 45 corresponding to a plurality of gaskets 800B. The escape region 45 may be formed at a location corresponding to the support member 220 in order to avoid spatial interference between the housing 450 and the support member 220.

[0249] Referring to Figures 1 to 10, the second circuit board 800 may include terminals 7A to 7F corresponding to terminals B1 to B6 of the circuit board 190 of the AF operation unit 100.

[0250] Each of terminals 7A to 7F of the second circuit board 800 can be electrically connected to a corresponding terminal B1 to B6 of the circuit board 190 of the AF operation unit 100. A drive signal or power can be supplied to the first position sensor 170 via the second circuit board 800, and the output of the first position sensor 170 can be output to the second circuit board 800. Furthermore, a drive signal or power can be supplied to the first coil 120 via the second circuit board 800.

[0251] Referring to FIG11, the second circuit board 800 may include a connector 840 disposed in the second region 802. For example, the connector 840 may be disposed on a surface (e.g., the lower surface or the upper surface) of the second region 802 of the second circuit board 800.

[0252] The housing 450 may include a placement portion 8A in which the magnet 23 is housed, placed, or positioned. The placement portion 8A may be formed in the lower surface of the housing 450.

[0253] For example, the placement portion 8A may be a recessed groove from the lower surface of the housing 450, and may have a shape corresponding to the shape of the magnet 23.

[0254] For example, although the placement portion 8A may be formed in the corner of the housing 450, the present invention is not limited thereto. In another embodiment, the placement portion 8A may be formed in the side of the housing 450.

[0255] For example, although the housing 450 may include four placement portions 8A respectively formed at its four corners, the invention is not limited thereto. In another embodiment, the housing 450 may include a plurality of placement portions corresponding to the number of magnets 23.

[0256] The magnet 23 may be attached or coupled to the mounting portion 8A of the housing 450 via an adhesive component. Here, a guide groove 9A may be formed in the mounting portion 8A of the housing 450 to guide the adhesive component. The guide groove 9A can be used to evenly distribute the adhesive component in the mounting portion 8A.

[0257] The magnet 23 may be disposed at the housing 450. For example, although the magnet 23 may be disposed at a corner of the housing 140, the invention is not limited thereto. In another embodiment, the magnet 23 may be disposed at a side portion of the housing 450.

[0258] The magnet 23 can be used to provide a magnetic field that interacts with the second coil 230 to perform optical image stabilization (OIS) for the purpose of interlocking correction.

[0259] For example, magnet 23 may include a plurality of magnets 23A to 23D. Each of magnets 23A to 23D may be positioned at a corresponding corner of the housing 450.

[0260] Although each of magnets 23A to 23D may be a unipolar magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of magnets 23A to 23D may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0261] When each of the magnets 23A to 23D is a bipolar magnet, each of the magnets 23A to 23D may include a first magnet portion, a second magnet portion, and a partition wall disposed between the first magnet portion and the second magnet portion. Here, the partition wall may also be alternatively referred to as a "non-magnetic partition wall".

[0262] For example, each of the first magnet portion and the second magnet portion may include an N pole, a S pole, and an interface portion between the N pole and the S pole. The interface portion may be a portion that is substantially non-magnetic and has a region that is almost non-polar, and may be a portion that is naturally formed to form a magnet consisting of an N pole and an S pole.

[0263] The partition wall can separate or isolate the first magnetic portion from the second magnetic portion, and can be a portion that is substantially non-magnetic or non-polar. For example, the partition wall can be a non-magnetic material, air, etc. The non-magnetic partition wall can be regarded as a "neutral region" or "neutral portion".

[0264] The partition wall may be a portion artificially formed when the first magnet portion and the second magnet portion are magnetized, and the width of the partition wall may be greater than the width of the interface portion.

[0265] For example, although the partition walls of each of the magnets 23A to 23D may be oriented in a direction parallel to the second circuit board 800 or the first circuit board 250, the invention is not limited thereto. In another embodiment, the partition walls may be oriented in a direction perpendicular to the second circuit board 800 or the first circuit board 250.

[0266] For example, each of the four magnets 23A to 23D may be positioned at a corresponding one of the four corners of the housing 450. For example, although two magnets (e.g., 23A and 23B) positioned at two adjacent corners of the housing 450 may be oriented perpendicular to each other, and two magnets (e.g., 23A and 23C; 23B and 23D) positioned at two corners of the housing 450 facing each other diagonally may be oriented parallel to each other, the invention is not limited thereto.

[0267] For example, the internal portions of magnets 23A to 23D may have the same polarity. In addition, the external portions of magnets 23A to 23D may have the same polarity.

[0268] For example, the internal portion of each of magnets 23A to 23D may be magnetized as the N pole, and the external portion of each of magnets 23A to 23D may be magnetized as the S pole. In a modification, the internal portion of each of magnets 23A to 23D may be magnetized as the S pole, and the external portion of each of magnets 23A to 23D may be magnetized as the N pole.

[0269] The retainer 270 may be disposed below the second circuit board 800. The retainer 270 may be spaced apart from the second circuit board 800 and may be coupled to the first circuit board 250.

[0270] The holder 270 can house or support the second coil 230. The holder 270 can be used to support the second coil 230, thereby spacing the second coil 230 from the circuit board 250.

[0271] For example, the lower portion, lower surface or lower end of the retainer 270 may be coupled to the upper portion, upper surface or upper end of the first circuit board 250.

[0272] Referring to Figures 13A and 13B, the lower surface 42B of the holder 270 may include a first surface 36A and a second surface 36B. The second surface 36B may have a height difference relative to the first surface 36A in the optical axis direction. For example, the second surface 36B may be positioned above the first surface 36A. For example, the second surface 36B may be positioned closer to the upper surface 42A of the holder 270 than the first surface 36A. For example, the distance between the upper surface 42A and the second surface 36B of the holder 270 may be smaller than the distance between the upper surface 42A and the first surface 36A of the holder 270.

[0273] The retainer 270 may include a third surface 36C connecting the first surface 36A to the second surface 36B. For example, although the first surface 36A and the second surface 36B may be parallel to each other and the third surface 36C may be perpendicular to the first surface 36A and / or the second surface 36B, the invention is not limited thereto. In another embodiment, the included angle defined between the third surface 36C and the first surface 36A (or the second surface 36B) may be an acute angle or an obtuse angle.

[0274] The first surface 36A may be located at the periphery of the lower surface 42B of the retainer 270, and the second surface 36B may be located in the central area of ​​the retainer 270.

[0275] The holder 270 may have a hole 70 corresponding to the area of ​​the upper surface of the circuit board 250.

[0276] Although the hole 70 in the retainer 270 may have a polygonal shape, such as a quadrilateral, circular, or elliptical shape, when viewed from above, the invention is not limited thereto. The hole 70 may have any of the various shapes.

[0277] For example, the hole 70 in the holder 270 may be configured to have a shape or size that exposes the image sensor 810 and some components mounted on the first circuit board 250. For example, the surface area of ​​the hole 70 in the holder 270 may be smaller than the surface area of ​​the first surface 60A of the first circuit board 250.

[0278] For example, the hole 70 may be formed through the second surface 36B of the lower surface 42B of the retainer 270.

[0279] The holder 270 may have holes 41A, 41B and 41C corresponding to the second position sensor 240. For example, the holder 270 may have holes 41A, 41B and 41C formed at positions corresponding to the first to third sensors 240a, 240b and 240c respectively.

[0280] For example, holes 41A, 41B, and 41C may be positioned adjacent to a corner of holder 270. Holder 270 may further have a dummy hole 41D formed adjacent to a corner of holder 270, which does not correspond to any of the second position sensors 240. Dummy hole 41D may be intended to achieve weight balance of the OIS movable unit during OIS operation. In another embodiment, dummy hole 41D may not be formed.

[0281] Holes 41A, 41B, and 41C may be formed through the holder 270 in the optical axis direction. For example, although holes 41A, 41B, and 41C may be formed in the second surface 36B of the lower surface 42B of the holder 270, the present invention is not limited thereto. In another embodiment, holes 41A, 41B, and 41C in the holder 270 may be omitted.

[0282] An injection hole 33A may be formed in the lower surface 42B of the retainer 270 to correspond to an injection hole in the mold configured to inject material for forming the retainer 270.

[0283] The first circuit board 250 may be disposed on the second surface 36B of the lower surface 42B of the holder 270. The first circuit board 250 may also be referred to as a "sensor board", "main board", "main circuit board", "sensor circuit board" or "removable circuit board".

[0284] In all embodiments, the first circuit board 250 may alternatively be referred to as the "second board" or "second circuit board", and the second circuit board 800 may alternatively be referred to as the "first board" or "first circuit board".

[0285] The first surface 60A of the first circuit board 250 may be coupled or attached to the second surface 36B of the lower surface 42B of the retainer 270 via an adhesive component.

[0286] Here, the first surface 60A of the circuit board 250 may be a surface facing the second circuit board 800 or the AF operation unit 100 and on which the image sensor 810 is mounted. The second surface 60B of the circuit board 250 may be a surface opposite to the first surface 60A of the circuit board 250.

[0287] The lower surface 42B of the retainer 270 may have recesses 53A to 53D, in which at least a portion of the circuit board 250 is adapted and placed.

[0288] The mounting grooves 53A to 53D can be formed in the four corners of the lower surface 42B of the retainer 270, respectively, so as to correspond to the protrusions 52A to 52D of the first circuit board 250.

[0289] For example, the first surface 36A of the lower surface 42B of the retainer 270 may surround the protrusions 52A to 52D of the circuit board 250, and the lateral side surfaces 52A to 52D of the first circuit board 250 may face the third surface 36C of the retainer 270. An adhesive component may be disposed between the protrusions 52A to 52D of the first circuit board 250 and the mounting recesses 53A to 53D in the retainer 270 to couple the protrusions to the mounting recesses.

[0290] The protrusions 52A to 52D of the first circuit board 250 can be used to increase the coupling force between the retainer 2170 and the first circuit board 250, and to prevent the circuit board 250 from rotating and thus becoming misaligned.

[0291] The protrusions 52A to 52D of the first circuit board 250 may overlap with the mounting grooves 51A to 51D in the holder 270 in the optical axis direction. Furthermore, the holes 41A, 41B, and 41C may at least partially overlap with the mounting grooves 53A, 53B, and 53C in the holder 270 in the optical axis direction. Additionally, the holes 41A, 41B, and 41C may at least partially overlap with the protrusions 52A to 52C on the first circuit board 250.

[0292] At least one groove 272 may be formed in the first surface 36A of the lower surface 42B of the retainer 270 so as to be recessed therefrom. For example, the retainer 270 may have a plurality of grooves (e.g., four grooves) corresponding to a plurality of sides (e.g., four sides) of the lower surface 42B.

[0293] The groove 272 may include a bottom 72A and a transverse sidewall 72B, the bottom being recessed from the first surface 36A of the lower surface 42B of the holder 270 so as to have a height difference therebetween in the optical axis direction, and the transverse sidewall connecting the bottom 72A to the first surface 36A.

[0294] For example, the bottom 72A of the groove 272 may be positioned closer to the upper surface 42A of the holder 270 than the first surface 36A of the lower surface 42B of the holder 270. In addition, the bottom 72A of the groove 272 may be positioned between the first surface 36A and the second surface 36B of the lower surface 42B of the holder 270.

[0295] The retainer 270 may have at least one hole 270A through which the support member 220 extends. For example, the retainer 270 may have a plurality of holes 270A corresponding to a plurality of support members 220. The holes 270A can be used to avoid spatial interference with the support members. In another embodiment, the retainer 270 may have an outward recess or outward portion instead of a hole to avoid spatial interference with the support members.

[0296] For example, a plurality of holes 270A may be arranged or configured to surround the hole 70 in the retainer 270 and be spaced apart from each other at regular intervals. For example, a plurality of holes 270A may be arranged in the area between the hole 70 in the retainer 270 and the side of the retainer 270.

[0297] For example, hole 270A may be a through hole formed through retainer 270. A plurality of holes 270A in retainer 270 may overlap with grooves 272 in retainer 270 in the optical axis direction. For example, each of the plurality of holes 270A may be open at the bottom 72A of groove 272. The ends of the plurality of holes 270A that are open at the bottom 72A of groove 272 may be positioned to have a height difference relative to a first surface 36A of the lower surface 42B of retainer 270 in the optical axis direction.

[0298] For example, a plurality of holes 270A may be formed by passing through the bottom 72A of the groove 272 in the retainer 270.

[0299] The groove 272 in the retainer 270 is intended to avoid spatial interference between the retainer 270 and the connecting elastic member 280 when the connecting elastic member 280 is elastically deformed during OIS operation, thereby allowing the connecting elastic member 280 to easily deform elastically.

[0300] The lower surface 42B of the retainer 270 may have a protrusion 275. For example, the protrusion 275 may be formed on the first surface 36A of the lower surface 42B of the retainer 270.

[0301] The protrusion 275 of the retainer 270 can protrude from the first surface 36A of the lower surface 42B of the retainer 270 in the direction toward the bottom of the base 210.

[0302] The protrusion 275 of the retainer 270 may protrude further in the direction toward the bottom of the substrate 210 than the connecting elastic member 280. Alternatively, the protrusion 275 of the retainer 270 may protrude further in the direction toward the bottom of the substrate 210 than the solder 902 that couples the connecting elastic member 280 to the support member 220.

[0303] For example, the first distance in the optical axis direction between the protrusion 275 of the retainer 270 and the bottom of the substrate 210 may be less than the second distance between the connecting elastic member 280 and the bottom of the substrate 210. For example, the first distance may be less than the third distance between the solder 902 and the bottom of the substrate 210.

[0304] The protrusion 275 can serve as a stop to prevent the first surface 36A of the lower surface 42B of the retainer 270, the connecting elastic member 280 and / or the solder 902 from colliding with the bottom of the substrate 210 in the event of an external impact.

[0305] For example, although the protrusion 275 may be located at the corner of the lower surface 42B of the retainer 270, the present invention is not limited thereto. In another embodiment, the protrusion 275 may be located on the side of the lower surface 42B of the retainer 270 or between the side of the lower surface 42B of the retainer 270 and the hole 70.

[0306] The first circuit board 250 can be placed below the second circuit board 800.

[0307] For example, the first circuit board 250 may be placed below the holder 270.

[0308] Although the first circuit board 250 where the image sensor 810 is housed is a single board in FIG. 12A, the present invention is not limited thereto. In another embodiment, the first circuit board 250 may include a third board where the image sensor 810 is housed and a fourth board electrically connected to the third board. The fourth board may be electrically connected to the second circuit board 800 via a support member 220 and a connecting elastic member 280.

[0309] Although the first circuit board 250 (e.g., the periphery of the first circuit board 250) may have a shape that is consistent with or corresponds to the lower surface 42B of the holder 270 when viewed from above, the present invention is not limited thereto.

[0310] The first circuit board 250 may include one or more protrusions 52A to 52D protruding from its lateral side surface 21A.

[0311] For example, protrusions 52A to 52D may be formed at the four corners of the first circuit board 250, respectively.

[0312] Referring to FIG13B, the first circuit board 250 may include first to fourth protrusions 52A to 52D respectively formed at its four corners.

[0313] Each of the first to fourth protrusions 52A to 52D may protrude from the lateral side surface 21A of the first circuit board 250 in at least one of the x-axis direction, -x-axis direction, y-axis direction and -y-axis direction.

[0314] For example, each of the first protrusion 52A and the third protrusion 52C may protrude from the lateral side surface 21A of the first circuit board 250 in both the x-axis direction and the y-axis direction. Each of the second protrusion 52B and the fourth protrusion 52D may each protrude in the y-axis direction and may protrude in opposite directions relative to each other.

[0315] The first circuit board 250 may include at least one terminal 262 corresponding to a connecting spring 281 of the support member 220 or the connecting elastic member 280.

[0316] For example, the first circuit board 250 may include a plurality of terminals 262 disposed or arranged on the second surface 60B of the first circuit board 250 and spaced apart from each other. For example, the terminals 262 may be disposed adjacent to the lateral side surface 21A of the first circuit board 250. The number of terminals 262 is not limited to the number shown in FIG. 14, and may be greater than or less than the number of terminals 262 shown in FIG. 14.

[0317] For example, the terminal 262 of the first circuit board 250 can be electrically connected to the support member 220. For example, the terminal 262 of the first circuit board 250 can be electrically connected to the connecting spring 281.

[0318] The first circuit board 250 may include terminals E1 to E8 configured to be conductively connected to the second coil 230. Here, terminals E1 to E8 may alternatively be referred to as "pads" or "joint portions". Terminals E1 to E8 of the first circuit board 250 may be disposed or configured on a first surface 60A of the first circuit board 250.

[0319] The first circuit board 250 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0320] The first circuit board 250 may have a placement area 260A in which the image sensor 810 is disposed. For example, the placement area 260A may be disposed on a first surface (e.g., the upper surface) 60A of the first circuit board 250. For example, the hole 70 in the holder 270 may be open or exposed through the image sensor 810 disposed in the placement area 260A.

[0321] The second coil 230 can be placed at the holder 270.

[0322] For example, the second coil 230 may be mounted on the upper surface 42A of the holder 270.

[0323] The second coil 230 may be placed below the outer casing 450. The second coil 230 may be placed below the magnet 23.

[0324] For example, the second coil 230 may be disposed on the upper surface 42A of the holder 270 so as to correspond to, face or overlap with the magnet 23 disposed on the housing 450 in the direction of the optical axis OA.

[0325] The second coil 230 may be coupled to the holder 270. For example, the second coil 230 may be coupled to the upper surface 42A of the holder 270. The upper surface 42A of the holder 270 may have at least one coupling protrusion configured to be coupled to the second coil 230.

[0326] The coupling protrusion 51 may protrude from the upper surface 42A of the holder 270 in a direction toward the second circuit board 800. For example, the coupling protrusion 51 may be formed adjacent to each of the holes 41A to 41D in the holder 270.

[0327] For example, two coupling protrusions 51A and 51B may be positioned or configured at the retainer 270 to correspond to each of the holes 41A to 41D, and a hole (e.g., 41A) may be formed between the two coupling protrusions 51A and 51B.

[0328] For example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. For example, although the second coil 230 may include four coil units, the invention is not limited thereto.

[0329] Each of the plurality of coil units 230-1 to 230-4 may be arranged facing or overlapping one of the corresponding magnets 23A to 23D at the housing 450 in the direction of the optical axis (OA).

[0330] Although each of the coil units 230-1 to 230-4 can be configured to have coil blocks having a closed curve shape or a loop shape, the invention is not limited thereto. For example, each of the coil units 230-1 to 230-4 can be composed of fine patterned (FP) coils. In another embodiment, the coil units 230-1 to 230-4 can be formed at additional circuit components other than the first circuit board 250.

[0331] For example, each of the four coil units 230-1 to 230-4 may be placed at the corresponding one of the four corners of the holder 270.

[0332] Each of the coil units 230-1 to 230-4 may be coupled to the two corresponding coupling protrusions 51A and 51B of the holder 270. For example, each of the coil units 230-1 to 230-4 may be directly wound around the two corresponding coupling protrusions 51A and 51B of the holder 270.

[0333] Coil units 230-1 to 230-4 may correspond to or face the respective protrusions 52A to 52D of the circuit board 250 in the optical axis direction. For example, at least a portion of each of the coil units 230-1 to 230-4 may overlap with a corresponding one of the protrusions 52A to 42D of the circuit board 250 in the optical axis direction.

[0334] The second coil 230 can be electrically connected to the first circuit board 250, so that power or drive signal is supplied to the second coil 230 via the first circuit board 250.

[0335] The power or drive signal supplied to the second coil 230 may be a DC signal, an AC signal, or a signal containing both DC and AC components, and may be of voltage type or current type.

[0336] Here, current can be applied independently to at least three of the four coil units.

[0337] In the first embodiment, the second coil 230 can be controlled via three channels.

[0338] For example, only the first to third coil units among the first to fourth coil units are electrically isolated from each other, and the fourth coil unit can be electrically connected in series with one of the first to third coil units. Here, three pairs of leads (i.e., a total of six leads) can be drawn from the second coil 230.

[0339] In the second embodiment, the second coil 230 can be controlled via four individual channels. Here, the four coil units can be electrically isolated from each other. One of a forward current and a reverse current can be selectively applied to each of the coil units. Here, four pairs of leads (i.e., a total of eight leads) can be drawn from the second coil 230.

[0340] For example, two coil units 230-1 and 230-3 facing each other diagonally may extend or be oriented in a first axial direction (e.g., in the y-axis direction), and two other coil units 230-2 and 230-4 facing each other diagonally may extend or be oriented in a second axial direction (e.g., in the x-axis direction). Here, the first axial direction may be perpendicular to the second axial direction.

[0341] The long side of the first coil unit 230-1 and the long side of the third coil unit 230-3 may be arranged parallel to each other. The long side of the second coil unit 230-2 and the long side of the fourth coil unit 230-4 may be arranged parallel to each other. The long side of the first coil unit 230-1 and the long side of the second coil unit 230-2 may not be arranged parallel to each other. Here, the long side of the first coil unit 230-1 and the long side of the second coil unit 230-2 may be arranged such that imaginary lines extending from them intersect each other. For example, the direction oriented by the first coil unit 230-1 and the direction oriented by the second coil unit 230-2 may be perpendicular to each other.

[0342] In another embodiment, at least one of the four coil units may be driven independently of the remaining coil units. In another embodiment, the four coil units may be driven individually.

[0343] For example, one end of the first coil unit 230-1 may be connected to a first terminal E1, and the other end of the first coil unit 230-1 may be connected to a second terminal E2. A first drive signal for activating the first coil unit 230-1 may be provided to the first terminal E1 and the second terminal E2. The first terminal E1 and the second terminal E2 may be configured to be spaced apart from each other in a direction parallel to the long side of the first coil unit 230-1 (e.g., in the y-axis direction).

[0344] One end of the second coil unit 230-2 may be connected to the third terminal E3, and the other end of the second coil unit 230-2 may be connected to the fourth terminal E4. A second drive signal for activating the second coil unit 230-2 may be provided to the third terminal E3 and the fourth terminal E4. The third terminal E3 and the fourth terminal E4 may be configured to be spaced apart from each other in a direction parallel to the long side of the second coil unit 230-2 (e.g., in the x-axis direction).

[0345] One end of the third coil unit 230-3 may be connected to the fifth terminal E5, and the other end of the third coil unit 230-3 may be connected to the sixth terminal E6. A third drive signal for activating the third coil unit 230-3 may be provided to the fifth terminal E5 and the sixth terminal E6. The fifth terminal E5 and the sixth terminal E6 may be configured to be spaced apart from each other in a direction parallel to the long side of the third coil unit 230-3 (e.g., in the y-axis direction).

[0346] One end of the fourth coil unit 230-4 may be connected to the seventh terminal E7, and the other end of the fourth coil unit 230-4 may be connected to the eighth terminal E8. A fourth drive signal for activating the fourth coil unit 230-4 may be provided to the seventh terminal E7 and the eighth terminal E8. The seventh terminal E7 and the eighth terminal E8 may be configured to be spaced apart from each other in a direction parallel to the long side of the fourth coil unit 230-4 (e.g., in the x-axis direction).

[0347] The first terminal E1 to the eighth terminal E8 may be disposed in a region between the coil units 230-1 to 230-4 and the image sensor 810 on the upper surface 60A of the first circuit board 250.

[0348] The hole 70 in the holder 270 can expose the terminals E1 to E8 of the first circuit board 250. The lower surface of the coil units 230-1 to 230-4 can be positioned above the terminals E1 to E8 of the first circuit board 250.

[0349] For example, terminals E1 to E8 of the first circuit board 250 may be positioned below the upper surface 60A of the retainer 270.

[0350] In one embodiment, two coil units (e.g., 230-1 and 230-3) facing each other diagonally can be directly connected in series and can be started by a single drive signal. At the same time, two coil units (e.g., coil unit 230-2 and coil unit 230-4) facing each other diagonally can be electrically isolated from each other and can be started individually by different drive signals.

[0351] In another embodiment, the four coil units 230-1 to 230-4 may be electrically isolated from each other and may be individually activated by different individual drive signals.

[0352] Each of the coil units 230-1 to 230-4 may have an opening or hole formed at its center, and two coupling protrusions 51A and 51B may be adapted to and coupled to the opening 11A in each of the coil units 230-1 to 230-4 (FIG. 12A).

[0353] For example, at least a portion of each of the coil units 230-1 to 230-4 may overlap with a corresponding one of the magnets 23A to 23D disposed at the housing 450.

[0354] The OIS movable unit, including the image sensor 810, can move in a second and / or third direction (e.g., in the x-axis direction and / or the y-axis direction) by means of the interaction between magnets 23A to 23D and coil units 230-1 to 230-4 (to which a drive signal is applied), thereby performing handshake correction. A description of the OIS movable unit will be given later.

[0355] The second position sensor 240 may be disposed, coupled, or mounted to a first surface (e.g., upper surface) 60A of the first circuit board 250. The second position sensor 240 may detect the displacement of the OIS movable unit in a direction perpendicular to the optical axis OA, such as displacement or tilting of the OIS movable unit in a direction perpendicular to the optical axis, or rotation of the OIS movable unit about the optical axis.

[0356] Here, the first position sensor 170 may be alternatively referred to as "AF position sensor" and the second position sensor 240 may be alternatively referred to as "OIS position sensor".

[0357] For example, the second position sensor 240 may be disposed at each of the protrusions 52A to 52C of the first circuit board 250.

[0358] The second position sensor 240 may be placed below the second coil 230.

[0359] The second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. For example, the sensing element of the second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. The sensing element may be an element configured to detect a magnetic field.

[0360] For example, the center of the second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. For example, the center of the second position sensor 240 may be the spatial center in the x-axis and y-axis directions perpendicular to the optical axis in the xy coordinate plane. Alternatively, the center of the second position sensor 240 may be the spatial center in the x-axis, y-axis, and z-axis directions.

[0361] In another embodiment, at least a portion of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis. For example, at least a portion of the upper region 2A of the second position sensor 240 (see FIG. 26) may overlap with the second coil 230 in a direction perpendicular to the optical axis. The lower region 2B of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis. The upper region 2A may be the region between the midpoint of the length of the second position sensor 240 and the upper surface of the second position sensor 240, and the lower region 2B may be the remaining region of the second position sensor 240 located below the upper region 2A.

[0362] For example, the second position sensor 240 may overlap with holes 41A to 41C in the holder 270 in the optical axis direction. For example, the second position sensor 240 may overlap with opening 11A or hole in the second coil 230 in the optical axis direction. For example, at least a portion of holes 41A to 41C in the holder 270 may overlap with opening 11A or hole in the second coil 230 in the optical axis direction.

[0363] The second position sensor 240 may include one or more sensors 240a, 240b and 240c. For example, the second position sensor 230 may include three sensors 240a, 240b and 240c.

[0364] Each of the first to third sensors 240a, 240b and 240c may be implemented as a single Hall sensor or as a driver IC including a Hall sensor. The description of the first position sensor 170 may be applied to the first to third sensors 240a, 240b and 240c with or without modification.

[0365] Each of the first to third sensors 240a, 240b, and 240c can be electrically connected to a predetermined corresponding terminal in the terminal 262 of the first circuit board 250. For example, each drive signal can be applied to each of the first to third sensors 240a, 240b, and 240c via the terminal 262, and the output signal of each of the first to third sensors can be output to other predetermined terminals in the terminal 262.

[0366] For example, six or four different terminals of the terminals 262 of the first circuit board 250 may be assigned to each of the first to third sensors 240a, 240b and 240c.

[0367] For example, when each of the first to third sensors 240a, 240b and 240c is a Hall sensor, the four terminals can be assigned to each of the first to third sensors 240a, 240b and 240c. For example, the four terminals can be two input terminals and two output terminals.

[0368] For example, when each of the first to third sensors 240a, 240b, and 240c is a driver IC including a Hall sensor, six terminals can be assigned to each of the first to third sensors 240a, 240b, and 240c. The description of the position sensor 170 can be applied, with or without modification, to the conductive connections between each of the first to third sensors 240a, 240b, and 240c and terminals 262 of the first circuit board 250, and to the relationship between the drive signal and the output of the position sensor.

[0369] For example, since the four coil units 230-1 to 230-4 are controlled via three channels, each of the first to third sensors 240a, 240b and 240c can be placed in one of the corresponding three coil units 230-1 to 230-3, and the remaining coil unit 230-4 may not have a sensor.

[0370] For example, each of the coil units 230-1 to 230-4 may be configured as a ring having an opening 11A (see FIG. 12A), a hole, or a cavity therein. For example, each of the first to third sensors 240a, 240b, and 240c may be disposed below the opening 11A, hole, or cavity in a corresponding one of the coil units 230-1 to 230-3.

[0371] For example, each of the first to third sensors 240a, 240b and 240c may be disposed in a corresponding one of the holes 41A to 41C in the holder 270.

[0372] For example, each of the first to third sensors 240a, 240b and 240c may not overlap with a corresponding one of the coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240a, 240b and 240c may overlap with the holder 270 in a direction perpendicular to the optical axis.

[0373] For example, coil units 230-1 to 230-4 may be mounted on the upper surface 42A of the holder 270, and the first to third sensors 240a, 240b and 240c may be mounted on the first surface 60A of the first circuit board 250. The upper surface 42A of the holder 270 may be positioned higher than the first surface 60A of the first circuit board 250.

[0374] For example, the upper surface 42A of the holder 270 may have a height difference relative to the first surface 60A of the first circuit board 250.

[0375] For example, the height difference in the optical axis direction between the upper surface 42a of the holder 270 and the first surface 60A of the first circuit board 250 may be greater than the length in the optical axis direction of each of the first to third sensors 240a, 240b and 240c. In another embodiment, the height difference in the optical axis direction between the upper surface 42a of the holder 270 and the first surface 60A of the first circuit board 250 may be equal to the length in the optical axis direction of each of the first to third sensors 240a, 240b and 240c.

[0376] All movement of the image sensor 810 in the x-axis and y-axis directions and rotation of the image sensor 810 about the z-axis can be detected by three sensors 240a, 240b and 240c.

[0377] One of the three sensors 240a, 240b, and 240c (e.g., 240a) can detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction. Another of the three sensors 240a, 240b, and 240c (e.g., 240b) can detect the amount of movement and / or displacement of the OIS movable unit in the y-axis direction. The remaining one of the three sensors 240a, 240b, and 240c can detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction and / or in the y-axis direction. It is possible to use the output of two or more of the three sensors 240a, 240b, and 240c to detect the rotational movement of the OIS movable unit about the z-axis.

[0378] Referring to FIG12B, when a drive signal (e.g., drive current) is applied to the first coil unit 230-1 and the third coil unit 230-3 but not to the second coil unit 230-2 or the fourth coil unit 230-4, the direction of the first electromagnetic force obtained by the interaction between the first coil unit 230-1 and the first magnet 23A and the direction of the third electromagnetic force obtained by the interaction between the third coil unit 230-3 and the third magnet 23C can be the same, for example, the x-axis direction (e.g., the +x-axis direction or the -x-axis direction), and the OIS movable unit can move (displace) in the x-axis direction (e.g., in the +x-axis direction or the -x-axis direction).

[0379] For example, when a drive signal (e.g., drive current) is applied to the second coil unit 230-2 and the fourth coil unit 230-4 but not to the first coil unit 230-1 or the third coil 230-3, the direction of the second electromagnetic force obtained by the interaction between the second coil unit 230-2 and the second magnet 23B and the direction of the fourth electromagnetic force obtained by the interaction between the fourth coil unit 230-4 and the fourth magnet 23D can be the same, for example, the y-axis direction (e.g., the +yy axis direction or the -y axis direction), and the OIS movable unit can move (displace) in the y-axis direction (e.g., in the +y axis direction or the -y axis direction).

[0380] For example, when a drive signal is applied to each of the first to fourth coil units 230-1 to 230-4, the direction of the first electromagnetic force is opposite to the direction of the third electromagnetic force, the direction of the second electromagnetic force is opposite to the direction of the fourth electromagnetic force, and the rotation direction of the OIS movable unit due to the first and third electromagnetic forces is the same as the rotation direction of the OIS movable unit due to the second and fourth electromagnetic forces. The OIS movable unit can rotate or roll about the optical axis or the z-axis.

[0381] When the second coil 230 is controlled via three channels, it is possible to use the first coil unit 230-1 and the third coil unit 230-3 or the second coil unit 230-2 and the fourth coil unit 230-4 to make the OIS movable unit sway.

[0382] In the embodiments shown in FIG12A and FIG12B, the second position sensor 240 may include three sensors 240a, 240b and 240c.

[0383] For example, a first sensor 240a may be disposed at a first corner of a first surface 60A of a first circuit board 250, a second sensor 240b may be disposed at a second corner of a first surface 60A of a first circuit board 250, and a third sensor 240c may be disposed at a third corner of a first surface 60A of a first circuit board 250. No sensor may be disposed at a fourth corner of a first surface 60A of a first circuit board 250.

[0384] The first corner and the third corner of the first surface 60A of the first circuit board 250 can face each other in the diagonal direction, and the second corner and the fourth corner of the first surface 60A can face each other in the diagonal direction.

[0385] For example, the first sensor 240a may be placed on the first surface (or upper surface) 60A of the first protrusion 52A of the first circuit board 250 and may overlap with the first protrusion 52A in the optical axis direction.

[0386] The second sensor 240b may be placed on the first surface (or upper surface) 60A of the second protrusion 52B of the first circuit board 250, and may overlap with the second protrusion 52B in the optical axis direction.

[0387] The third sensor 240c can be placed on the first surface (or upper surface) 60A of the third protrusion 52C of the first circuit board 250, and can overlap with the third protrusion 52C in the optical axis direction.

[0388] For example, although the first sensor 240a may not overlap with the first coil unit 230-1 in the direction of the optical axis OA, the second sensor 240b may not overlap with the second coil unit 230-2 in the direction of the optical axis OA, and the third sensor 240c may not overlap with the third coil unit 230-3 in the direction of the optical axis OA, the present invention is not limited thereto. In another embodiment, at least a portion of each of the first to third sensors may overlap with a corresponding one of the first to third coil units in the direction of the optical axis.

[0389] The first sensor 240a may overlap with the first magnet 23A in the optical axis direction, the second sensor 240b may overlap with the second magnet 23B in the optical axis direction, and the third sensor 240c may overlap with the third magnet 23C in the optical axis direction.

[0390] Although the second position sensor 240 includes three sensors, in another embodiment, the second position sensor 240 may include two sensors. For example, in another embodiment, one of the first sensor 240a and the third sensor 240c may be omitted.

[0391] The image sensor unit 350 may include a motion sensor 820, a controller 830, a memory 512, and at least one of capacitors 81A and 81B.

[0392] The motion sensor 820, controller 830, memory 512, and capacitors 81A and 81B may be placed or installed in one of the second circuit board 800 and the first circuit board 250.

[0393] For example, the motion sensor 820, memory 512 and capacitor 81A may be mounted on the second surface 44B of the second circuit board 800.

[0394] The controller 830 and the capacitor 81B may be disposed on the first surface 60A of the first circuit board 250. For example, the controller 830 may be disposed in the first area S1 of the first circuit board 250 (see FIG12A). The first area S1 may be the area located between the image sensor 810 and the first lateral side surface or the first side surface of the first circuit board 250.

[0395] The second region S2 of the first circuit board 250 may have wires or data lines, through which data from the image sensor 810 is transmitted to the second circuit board 800. The first region S1 may be the region opposite to the image sensor 810 and the second region S2. The second region S2 may be the region adjacent to the third region 803 of the second circuit board 800. The image sensor 810 may be sensitive to noise generated by the wires or data lines, and the operation and performance of the image sensor 810 may be degraded due to noise.

[0396] When the controller 830 is placed in the second area S2 of the first circuit board 250, noise may be generated by the wires or data lines due to the presence of the controller 830, thereby degrading the operation and performance of the image sensor 810.

[0397] For example, the motion sensor 820 disposed on the second circuit board 800 can be electrically connected to the controller 830 disposed on the first circuit board 250 via the support member 220 and the connecting elastic member 280.

[0398] The motion sensor 820 can output information about the rotational angular velocity caused by the motion of the camera module 10. The motion sensor 820 can be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0399] The memory 512 can store code values ​​based on the displacement of the spool 110 in the optical axis direction for use in AF feedback operation. Furthermore, the memory 512 can store code values ​​based on the displacement of the OIS movable unit in the direction perpendicular to the optical axis direction for use in OIS feedback operation. Additionally, the memory 512 can store algorithms or programs for the operation of the controller 830.

[0400] For example, although memory 512 may be, for example, electrically erasable programmable read-only memory (EEPROM), the present invention is not limited thereto.

[0401] The controller 830 can be electrically connected to the first position sensor 170 and the second position sensor 240.

[0402] The controller 830 can control the output signal of the first position sensor 170 and the drive signal supplied to the first coil 120 using the first code value stored in the memory 512, thereby performing a feedback autofocus operation.

[0403] In addition, the controller 830 can control the output signal supplied from the second position sensor 240 and the drive signal supplied to the second coil 230 using the second code value stored in the memory 512, thereby performing feedback OIS operation.

[0404] Although the controller 830 may be a type of driver IC, the present invention is not limited thereto. For example, the controller 830 may be electrically connected to terminal 262 of the first circuit board 250.

[0405] Referring to FIG14, the first circuit board 250 may include a terminal 262 electrically connected to the connecting elastic member 280. The second terminal 262 may alternatively be referred to as a "second terminal portion" or a "second terminal unit".

[0406] For example, the terminals 262 of the first circuit board 250 may be coupled to the connecting elastic member 270 via solder or conductive adhesive. For example, the terminals 262 may be implemented as a plurality of terminals.

[0407] For example, the second terminal 262 of the first circuit board 250 may be disposed on the second surface (e.g., the lower surface) 60B of the first circuit board 250 and may correspond to or face the connecting spring 281 of the connecting elastic member 270 in the optical axis direction.

[0408] The second terminal 262 of the first circuit board 250 may overlap with at least a portion of the corresponding connecting spring 281. Although the first circuit board 250 may be a printed circuit board or a flexible printed circuit board (FPCB), the present invention is not limited thereto.

[0409] The first circuit board 250 may be placed between the retainer 270 and the connecting elastic member 280.

[0410] The connecting elastic member 280 can be coupled to the holder 270. The connecting elastic member 280 can be used to allow movement of the OIS movable unit and to allow conductive transmission of signals. In other words, the connecting elastic member 280 can conductively connect the support member 220 to the terminal 262 of the first circuit board 250.

[0411] For example, the connecting elastic member 280 may be located below the retainer 270.

[0412] For example, the connecting elastic member 280 may be coupled to the lower surface 42B of the retainer 270 via an adhesive member. For example, the connecting elastic member 280 may be coupled to the first surface 36A of the lower surface 42B of the retainer 270.

[0413] The connecting elastic member 280 can electrically connect the support member 220 to the first circuit board 250, and may include an elastically deformable portion. The elastically deformable portion of the connecting elastic member 280 may be coupled to the support member 220.

[0414] The connecting elastic member 280 may include a connecting spring 281 corresponding to the support member 220.

[0415] For example, the connecting elastic member 280 may include a plurality of connecting springs 281. The plurality of connecting springs 281 may correspond to individual support members in the support member 220.

[0416] A plurality of connecting springs 281 may be arranged to be electrically isolated from or electrically spaced from each other.

[0417] The connecting spring 281 may be made of a conductive material, such as a metal (e.g., copper or copper alloy).

[0418] For example, the connecting spring 281 may be made of at least one of the following: gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Furthermore, the connecting elastic component 280 may be made of paste or solder paste, which includes at least one of the following: gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), possessing excellent bonding strength.

[0419] For example, the connecting spring 281 may be made of a metallic material having a tensile strength of 1000 MPa or higher. For example, the connecting spring 281 may be made of a binary alloy or a ternary alloy including copper.

[0420] Referring to Figures 15 to 18, the connecting spring 281 may include: a first coupler 31 coupled to a terminal 262 of the first circuit board 250, a second coupler 32 coupled to a support member 220, and a connector 33 connecting the first coupler 31 to the second coupler 32.

[0421] The first coupler 31 connecting the spring 281 may be supported by the retainer 270. For example, the first coupler 31 may be disposed on the first surface 36A of the lower surface 42B of the retainer 270 and may be supported by the lower surface 42B of the retainer 270.

[0422] For example, the first coupler 31 may be disposed on the first surface 36A of the lower surface 42B of the retainer 270, which is adjacent to at least one recess 272 in the retainer 270.

[0423] For example, the first coupler 31 may include: a first portion 31a, which is supported by the retainer 270 and connected to the connector 33; and a second portion 31b, which is connected to the first portion 31a and coupled to the terminal 262 of the first circuit board 250.

[0424] For example, the first portion 31a of the first coupler 31 may overlap with the first surface 36A of the lower surface 42B of the holder 270 in the optical axis direction and may be coupled to the first surface 36A.

[0425] The second portion 31b of the first coupler 31 may not overlap with the lower surface 42B of the holder 270 in the optical axis direction. At least a portion of the second portion 31b of the first coupler 31 may overlap with the terminal 262 of the first circuit board 250 in the optical axis direction.

[0426] For example, the second part 31b may protrude from the inner surface of the retainer 270 in the direction toward the terminal 262 of the first circuit board 250.

[0427] For example, the second portion 31b of the first coupler 31 may be positioned relative to the portion 19A of the first coupler 31 that is connected to the connector 33.

[0428] The first portion 31a of the first coupler 31 may have a width greater than that of the other portions 31b and 33 in order to increase the engagement force with the insulating member 285 and the retainer 270.

[0429] For example, the width W1 of the first portion 31a of the first coupler 31 may be greater than the width W2 of the second portion 31b. In other words, the surface area of ​​the first portion 31a of the first coupler 31 may be greater than the surface area of ​​the second portion 31b. This is because the width W1 (or surface area) of the first portion 31 is relatively increased, thereby increasing the surface area of ​​the first portion 31a supported by the holder 270, so that the first portion 31a can be stably supported by the holder 270.

[0430] Here, the widths W1 and W2 can be the lengths of the first coupler 31 in the direction perpendicular to the direction toward the terminal 262 of the first circuit board 250.

[0431] In another embodiment, the width W1 of the first portion 31a may be equal to or less than the width W2 of the second portion 31b.

[0432] The second coupler 32 may be coupled to one end (e.g., the lower end) of the support member 220 via solder 902 or conductive adhesive.

[0433] For example, the second coupler 32 may be positioned to overlap with the hole 270a in the holder 270 in the optical axis direction.

[0434] The second coupler 32 may have a hole 32A through which the support member 220 extends.

[0435] The end of the support member 220 that has passed through the hole 32A in the second coupler 32 can be directly coupled to the second coupler 32 via a conductive adhesive member or solder 902, and the second coupler 32 can be electrically connected to the support member 220.

[0436] For example, the second coupler 32 may include a hole 32A and an area surrounding the hole 32A, which serves as the area where solder 902 is placed to couple the coupler 32 to the support member 220. Although the second coupler 32 is configured to have a circular shape in FIG. 16, the invention is not limited thereto. In another embodiment, the second coupler 32 may be configured to have a polygonal shape (e.g., a quadrilateral shape) or an elliptical shape.

[0437] For example, the diameter K of the second coupler 32 may be smaller than the width W1 of the first portion 31a of the first coupler 31. In another embodiment, the diameter K of the second coupler 32 may be equal to or greater than the width W1 of the first portion 31a of the first coupler 31.

[0438] Connector 33 can connect the first portion 31a of the first coupler 31 to the second coupler 32, and may include at least one linear portion and at least one curved portion.

[0439] For example, the curved portion can be configured to extend to the left or right from the linear portion perpendicular to the optical axis. For example, although the connector 33 can be configured to have a spiral shape, the invention is not limited thereto.

[0440] For example, connector 33 may include a bent portion that extends in a clockwise or counterclockwise bend. In other words, connector 33 may be bent in a direction corresponding to the rotation of the image sensor in the z-axis direction. Therefore, connector 33 can minimize damage to connecting spring 281 when the image sensor rotates in the z-axis direction, potentially preventing cracks in connecting spring 281 and preventing connecting spring 281 from separating from insulating member 285.

[0441] For example, connector 33 may include: a first linear portion 33-1 connected to a first coupler 31; a first bent portion 34-1 extending bently from the first linear portion 33-1 in a first lateral direction; a second linear portion 33-2 connected to the first bent portion 34-1; a second bent portion 34-2 extending bently from the second linear portion 33-2 in a second lateral direction; a third linear portion 33-3 connected to the second bent portion 34-2; a third bent portion 34-3 extending bently from the third linear portion 33-3 in a third lateral direction; a fourth linear portion 33-3 connected to the third bent portion 34-3; a fourth bent portion 34-4 extending bently from the fourth linear portion 33-4 in a fourth lateral direction; and a fifth linear portion 33-5 connecting the fourth bent portion 34-4 to the second coupler 32. For example, although each of the first to fourth lateral directions may be to the left, the invention is not limited thereto. In another embodiment, at least one of the first to fourth lateral directions may be a rightward direction.

[0442] At least one of the bent portions 34-1 to 34-5 of connector 33 may be configured to have a circular shape.

[0443] The width of each of the first linear portions 33-1 to the fifth linear portions 33-5 may be different from the width of each of the first curved portions 34-1 to the fourth curved portions 34-4. For example, because stress is concentrated in the curved portions, the width of each of the first curved portions 34-1 to the fourth curved portions 34-4 may be greater than the width of each of the first linear portions 33-1 to the fifth linear portions 33-5, thereby preventing damage to the connector 33 caused by the stress applied to the connector 33.

[0444] The connecting spring 281 may have different widths at different parts of its structure.

[0445] Connector 33 may have a width smaller than that of the first part 31a in order to apply elastic force.

[0446] The width W3 of connector 33 may be less than any one of the width W1 of the first portion 31a of the first coupler 31, the width W2 of the second portion 31b of the first coupler 31, and the diameter K of the second coupler 32. Therefore, the connecting spring 281 can flexibly support the OIS movable unit and allows the OIS movable unit to move easily in a direction perpendicular to the optical axis.

[0447] For example, connector 33 may have a width of 20 μm to 1000 μm.

[0448] For example, if the width of connector 33 is less than 20 μm, the overall stiffness of connecting spring 281 may decrease, and therefore the reliability of connecting spring 281 may decrease. At the same time, if the width of connector 33 is greater than 100 μm, the elastic force of connecting spring 281 may decrease, and therefore the voltage required to activate the second coil 230 configured to shift the OIS movable unit may increase, thereby increasing power consumption.

[0449] In another embodiment, the width of connector 33 may be equal to or greater than the diameter K of second coupler 32.

[0450] The thickness t1 of the first coupler 31, the thickness t2 of the connector 33, and the thickness of the second coupler 32 may be the same. In another embodiment, at least one of the thickness t1 of the first coupler 31, the thickness t2 of the connector 33, and the thickness of the second coupler 32 may be different from the others. For example, the thickness t2 of the connector 33 may be less than the thickness of the first coupler 31 and the thickness of the second coupler 32.

[0451] The second coupler 32 and connector 33 may overlap with the groove 272 in the holder 270 in the optical axis direction. For example, the second coupler 32 and connector 33 may be disposed in the groove 272 in the holder 270. For example, the second coupler 32 and / or connector 33 may be disposed to be spaced apart from the holder 270.

[0452] Referring to Figures 15 and 16, the connecting elastic member 280 may include a plurality of connecting springs. The plurality of connecting springs may be classified into a plurality of groups. For example, the plurality of groups may alternatively be referred to as "a plurality of connectors", "a plurality of elastic portions" or "a plurality of connecting elastic members".

[0453] For example, the connecting elastic member 280 may include four groups 1A to 4A corresponding to the four side portions (four lateral side surfaces) of the first circuit board 250 or the four side portions (or four lateral side surfaces) of the retainer 270.

[0454] Each of the plurality of groups 1A to 4A may include a plurality of connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 or 4-1 to 4-9.

[0455] Furthermore, the terminals 262 of the first circuit board 250 may be classified into a plurality of groups corresponding to groups 1A to 4A of the connecting elastic members 280. Each of the plurality of groups of the first circuit board 250 may include a plurality of terminals P1 to P9, S1 to S9, R1 to R9 or Q1 to Q9.

[0456] For example, each of the plurality of terminals P1 to P9, S1 to S9, R1 to R9 and Q1 to Q9 of the first circuit board 250 can be coupled to a corresponding one of the plurality of connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9 via solder.

[0457] For example, the number of connecting springs included in the plurality of groups 1A to 4A may be the same.

[0458] In another embodiment, the number of connecting springs included in two groups positioned opposite each other may be the same.

[0459] In another embodiment, the number of connecting springs included in two adjacent groups of the connecting elastic member 280 may be different from each other. In another embodiment, the number of connecting springs included in at least one of the plurality of groups 1A to 4A may be different from the number of connecting springs included in each of the remaining groups.

[0460] For example, in order to flexibly support the OIS movable unit in a balanced state, a plurality of groups 1A to 4A of the connecting elastic members 280 may be arranged to be biradially symmetrical about the center point 403.

[0461] In another embodiment, a plurality of groups 1A to 4A of the connecting elastic members 280 may be arranged to be tetra-radial symmetrical about the center point 403.

[0462] For example, the retainer 270 may include four corners 30A to 30D. The first group 1A and the third group 3A may be positioned opposite each other in the lateral direction, and the second group 2A and the fourth group 4A may be positioned opposite each other in the longitudinal direction. The lateral and longitudinal directions may be opposite each other.

[0463] The first group 1A can be disposed in the first region of the second surface 70B of the retainer 270 between the first corner 30A and the second corner 30B, and the second group 2A can be disposed in the second region of the second surface 70B of the retainer 270 between the second corner 30B and the third corner 30C. The third group 3A can be disposed in the third region of the second surface 70B of the retainer 270 between the third corner 30C and the fourth corner 30D, and the fourth group 4A can be disposed in the fourth region of the second surface 70B of the retainer 270 between the fourth corner 30D and the first corner 30A.

[0464] The first corner 30A and the third corner 30C of the retainer 270 can be positioned relative to each other in the first diagonal direction, and the second corner 30B and the fourth corner 30D of the retainer 270 can be positioned relative to each other in the second diagonal direction. The first diagonal direction and the second diagonal direction can be perpendicular to each other.

[0465] The centers of the first group 1A and the third group 3A may be positioned to deviate in the opposite direction relative to the first center line 401, and the centers of the second group 2A and the fourth group 4A may be positioned to deviate in the opposite direction relative to the second center line 402.

[0466] Here, the center of each of the groups may be the spatial center of the total length of each of the groups in the direction in which the connecting springs included in the group are arranged. The total length may be the distance between the first connecting spring and the last connecting spring of each of the groups.

[0467] For example, the first center line 401 may be a line extending through the center 403 and parallel to the direction of the first region of the self-holding device 270 where the first group 1A is disposed toward the third region of the holding device 270 where the third group 3A is disposed. Alternatively, the first center line 401 may be a line extending through the center 403 and parallel to the first outer surface of the holding device 270.

[0468] For example, the second center line 402 may be a line extending through the center 403 and parallel to the direction from the second region of the retainer 270 where the second group is disposed toward the fourth region of the retainer 270 where the fourth group is disposed. Alternatively, the second center line 402 may be a line extending through the center 403 and perpendicular to the first outer surface of the retainer 270.

[0469] For example, center 403 may be the center of hole 70 in retainer 270, the center of first circuit board 250 or the spatial center of connecting elastic component.

[0470] For example, the number of connecting springs of the first group 1A (or the third group 3A) located on one side (e.g., the right side) of the first centerline 401 may be different from the number of connecting springs of the first group 1A (or the third group 3A) located on the other side (e.g., the left side) of the first centerline 401.

[0471] For example, the number of connecting springs of the second group 2A (or the fourth group 4A) located on one side (e.g., the right side) of the second centerline 402 may be different from the number of connecting springs of the second group 2A (or the fourth group 4A) located on the other side (e.g., the left side) of the second centerline 402.

[0472] Referring to FIG16, the resilient connecting member 280 may further include an insulating member 285. The insulating member 285 may alternatively be referred to as an "insulating layer". For example, the insulating member 285 may include polyimide.

[0473] The insulating member 285 may surround at least a portion of the connecting spring 281. For example, the insulating member 285 may surround at least a portion of the first portion 31a of the connecting spring 281. For example, the upper surface of the first portion 31a of the connecting spring 281 may be coupled to the first surface 36A of the lower surface 42A of the retainer 270, and the insulating member 285 may cover the lower surface of the first portion 31a of the connecting spring 281.

[0474] The adhesive component may be inserted or placed between the insulating component 285 and the connecting spring 281, and between the insulating component 285 and the dummy components 28-1 to 28-4, so as to attach them to each other.

[0475] For example, the second part 31b of the first coupler 31 of the connecting spring 281, the second coupler 32 and the connector 33 may be exposed from the insulating part 285.

[0476] Insulating component 285 can connect the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9 of groups 1A to 4A to each other.

[0477] The insulating component 285 can support the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9 of the connecting elastic component 280, and can be coupled or attached to the first surface 36A of the lower surface 42B of the retainer 270.

[0478] The connecting elastic member 280 may further include one or more dummy members 28-1 to 28-4.

[0479] For example, the dummy components 28-1 to 28-4 may be spaced apart from the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9, and may be placed on the lower surface 42B of the retainer 270.

[0480] The insulating member 285 may surround or cover at least a portion of the dummy members 28-1 to 28-4. As a result, it is possible to firmly maintain the shape of the insulating member 285 in order to improve the adhesion between the insulating member 285 and the retainer 270.

[0481] The dummy parts 28-1 to 28-4 may be alternatively referred to as "reinforcing parts" or "reinforcing patterns" because they enhance the stiffness of the connecting elastic parts 280.

[0482] Each of the dummy components 28-1 to 28-4 may be coupled to the lower surface 42B of the retainer 270 via an adhesive and may have at least one through hole 28A or groove to increase the coupling force between the dummy component and the retainer 270.

[0483] The dummy components 28-1 to 28-4 may not be electrically connected to the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9, and 4-1 to 4-9. Although the dummy components 28-1 to 28-4 are not electrically connected to each other, the invention is not limited thereto. In another embodiment, the dummy components may be connected to each other.

[0484] For example, the insulating member 285 may have holes or cavities. For example, although the insulating member 285 may be configured to have a polygonal shape when viewed from above, such as an overall quadrilateral annular shape, the invention is not limited thereto.

[0485] For example, although the connecting elastic member 280 may include four dummy members 28-1 to 28-4, the number of dummy members is not limited thereto. In another embodiment, the number of dummy members may be any number greater than or equal to one.

[0486] For example, each of the dummy components 28-1 to 28-4 may be placed between two adjacent groups 1A and 2A, 2A and 3A, 3A and 4A or 4A and 1A of the connecting elastic component 280.

[0487] For example, the connecting elastic member 280 may include a dummy member 28-3 disposed on the insulating member 285 at a first corner or first corner area between the first group 1A and the second group 2A, a dummy member 28-2 disposed on the insulating member 285 at a second corner or second corner area between the second group 2A and the third group 3A, a dummy member 28-1 disposed on the insulating member 285 at a third corner or third corner area between the third group 3A and the fourth group 4A, and a dummy member 28-4 disposed on the insulating member 285 at a fourth corner or fourth corner area between the fourth group 4A and the first group 1A.

[0488] Each of the dummy components 28-1 to 28-4 may have an extended portion configured to avoid spatial interference with the protrusion 275 of the retainer 270. Although the extended portion 27A may be configured to have a groove or a hole, the invention is not limited thereto.

[0489] Referring to FIG16, the insulating member 285 may include: a body 85A disposed on a first portion 31a of the first coupler 31 connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9, a portion of the lower surface 43B of the retainer 270 and portions of the dummy members 28-1 to 28-4; and an extension 85B extending toward other portions of the dummy members 28-1 to 28-4.

[0490] For example, the body 85A of the insulating member 285 may be disposed adjacent to the hole 70 in the retainer 270 on the first surface 36A of the lower surface 42B of the retainer 270, and may be configured to have a ring with a closed curve shape. For example, although the body 85A may be configured to have a quadrilateral ring, the invention is not limited thereto. In another embodiment, the body 85A may be configured to have a circular or polygonal ring.

[0491] For example, the body 85A may have holes or cavities that correspond to, overlap or align with the holes 800A in the second circuit board 800 and the holes in the holder 270 in the optical axis direction.

[0492] Although the extension 85B can be configured to have a linear shape, the invention is not limited thereto. In another embodiment, the extension 85B can be configured to have at least one of a linear shape and a curved shape. For example, the extension 85B may include a plurality of extensions that can be arranged to be spaced apart from each other. For example, the extension 85B may extend from the body 85A toward the outer surface of the retainer 270. For example, the extension may be arranged to surround a groove 272 in the retainer 270.

[0493] The extension 85B can be used to increase the contact area with each of the dummy components 28-1 to 28-4, thereby further increasing the stiffness of the connecting elastic component 280.

[0494] The support member 220 can electrically connect the second circuit board 800 to the connecting elastic member 280.

[0495] The support member 220 may include a plurality of support member groups corresponding to groups 1A to 4A of the connecting elastic member 280. Each of the plurality of groups may include a plurality of support members (or wires).

[0496] For example, the support member 220 may include a plurality of support members corresponding to a plurality of connecting springs. The support member may also be referred to as a "wire".

[0497] The support member 220 may be coupled to the second circuit board 800 at one end and to the second coupler 32 of the connecting spring 281 at the other end.

[0498] For example, one end of the support member 220 may be coupled to a first surface (e.g., upper surface) 44A of the second circuit board 800 via a hole 800A in the second circuit board 800 through a first solder 901. For example, one end of the support member 220 may be coupled to and conductively connected to a terminal 800B of the second circuit board 800.

[0499] The other end of the support member 220 may be coupled to the lower part or lower surface of the second coupler 32 of the connecting spring 281 via the second solder 902 through the hole 32A in the second coupler 32.

[0500] The support member 220 can extend through the outlet area 45 in the housing 450 and the hole 270a in the retainer 270, thereby avoiding spatial interference with the housing 450 and the retainer 270.

[0501] Each of the support members 220 may be implemented as a conductive member that provides elastic support, such as a sling, leaf spring, or disc spring.

[0502] The image sensor unit 350 may further include a filter 610. The image sensor unit 350 may further include a filter holder 600 for placing, mounting, or housing the filter 610. The filter holder 600 may alternatively be referred to as a "sensor substrate".

[0503] Filter 610 can be used to prevent light within a certain frequency band passing through the lens barrel 400 from being introduced into the image sensor 810.

[0504] The filter 610 may be, for example, an infrared light blocking filter, but is not limited thereto. For example, the filter 610 may be oriented parallel to the XY plane perpendicular to the optical axis OA.

[0505] The filter 610 can be placed below the lens module 400.

[0506] The filter holder 600 may be located below the AF operation unit 100. For example, the filter holder 600 may be located on the first circuit board 250.

[0507] The filter holder 600 may be coupled to the area surrounding the image sensor 810 on the first surface 60A of the first circuit board 250, and may be exposed through holes 800A in the second circuit board 800 and holes 70 in the holder 270. For example, the filter holder 600 may be exposed through holes 800A in the second circuit board 800 and holes 70 in the holder 270.

[0508] For example, the filter holder 600 may be coupled to a region of the first surface (e.g., the upper surface) surrounding a placement area 260A of the first circuit board 250. Although the placement area 260A is the same surface as the first surface 60A of the first circuit board 250 in FIG. 12A, the invention is not limited thereto. In another embodiment, the placement area 260A may be a recess or a protrusion.

[0509] In another embodiment, the filter holder 600 may be coupled to the holder 270 or the AF operation unit 100.

[0510] The hole 70 in the holder 270 can expose the filter holder 600 disposed at the first circuit board 250 and the filter 610 disposed therethrough at the filter holder 600.

[0511] The filter holder 600 may have an aperture 61A formed in the area where the filter 610 is mounted or placed, so as to allow light passing through the filter 610 to enter the image sensor 810. The aperture 61A in the filter holder 600 may be configured to have a through-hole formed through the filter holder 600 in the optical axis direction. For example, the aperture 61A in the filter holder 600 may be formed through the center of the filter holder 600 and may be positioned to correspond to or face the image sensor 810.

[0512] The filter holder 600 may have a mounting portion 500 in which a filter 610 is mounted. The filter 610 may be disposed, placed, or mounted in the mounting portion 500. The mounting portion 500 may be formed to surround the aperture 61A. In another embodiment, the mounting portion 500 of the filter holder 600 may be configured to have a protrusion projecting from the upper surface of the filter 610.

[0513] The image sensor unit 350 may further include an adhesive member 612 disposed between the filter 610 and the placement portion 500, and the filter 610 may be coupled or attached to the filter holder 600 via the adhesive member 612.

[0514] The image sensor unit 350 may further include an adhesive component 61 disposed between the filter holder 600 and the first circuit board 250, and the filter holder 600 may be coupled or attached to the first circuit board 260 via the adhesive component 61.

[0515] For example, the adhesive components 612 and 61 may be epoxy resin, thermosetting adhesive or UV-curing adhesive.

[0516] The camera module 10 may further include at least one of the cover member 300, the base 210 and the bottom cover plate 219 to house the AF operation unit 100 and the image sensor unit 350 therein, so as to protect the AF operation unit 100 and the image sensor unit 350 from external impact and prevent the introduction of external foreign matter.

[0517] The cover component 300 can be configured to have a box-like form, which is open at the bottom and includes a top plate 301 and a side plate 302. The side plate 302 of the cover component 300 can be coupled to the outer surface of the housing 140 of the AF operation unit 100. In another embodiment, the lower portion of the side plate 302 of the cover component 300 can be coupled to the base 210.

[0518] The upper plate 301 of the cover member 300 may be configured to have a polygonal shape, such as a quadrilateral shape, an octagonal shape, etc. The cover member 300 may have a hole 303 formed through the upper plate 301 to expose a lens (not shown) coupled to the spool 110 to external light. One of the side plates 302 of the cover member 300 may have a groove 304 through which the terminal component 95 of the circuit board 910 is exposed.

[0519] The substrate 210 may be disposed below the retainer 270. The substrate 210 may be configured to have a shape, for example, a quadrilateral shape, which is consistent with or corresponds to the shape of the cover 300, the housing 450 or the retainer 270.

[0520] For example, the substrate 210 may include a lower plate 210A disposed below the holder 270 and a side plate 210B extending from the lower plate 210A toward the second circuit board 800. The substrate 210 may have a hole 210C formed through the lower plate 210A.

[0521] The hole 210C in the substrate 210 may be a through hole formed through the substrate 210 in the optical axis direction. In another embodiment, the substrate 210 may not have a hole 210C therein.

[0522] For example, the side plate 210B of the base 210 may be coupled to the housing 450. In another embodiment, the side plate 210B of the base 210 may be coupled to the side plate 302 of the cover member 300.

[0523] The bottom cover plate 219 may be disposed below the base 210 to close the hole 210C in the base 210. In another embodiment, the bottom cover plate 219 may be omitted.

[0524] In the following text, the fixed part (e.g., "OIS fixed part") and the movable part (e.g., "OIS movable part") of the image sensor unit 350 will be described in relation to OIS operation.

[0525] The image sensor unit 350 may include an OIS fixed portion, an OIS movable portion, and elastic support members 220 and 280, which are coupled to the two portions to connect the two portions to each other. The OIS movable portion is movable relative to the OIS fixed portion in a direction perpendicular to the optical axis OA. The elastic support members 220 and 280 may alternatively be referred to as "support members" or "elastic members".

[0526] The movable part of the OIS, which is located below the fixed part of the OIS, can be spaced apart from the fixed part of the OIS by a predetermined distance by means of the elastic support members 220 and 280. Specifically, the movable part of the OIS can be moved relative to the fixed part of the OIS by means of the electromagnetic force generated by the interaction between the magnet 23 and the coil 230 via the support member 220 and the connecting elastic member 280.

[0527] One end of the elastic support members 220 and 280 (e.g., one end of the support member 220) may be coupled to the second circuit board 800, and the other end of the elastic support members 220 and 280 (e.g., the first coupler 31 connecting the spring 281) may be coupled to the first circuit board 250.

[0528] The second circuit board 800 and the first circuit board 250 can be electrically connected to each other via elastic support members 220 and 280.

[0529] The movable part of the OIS can move relative to the fixed part of the OIS in a direction perpendicular to the optical axis by means of the electromagnetic force generated by the interaction between the second coil 230 and the magnet 23.

[0530] For example, through the interaction between the magnet 23 and the second coil 230, the image sensor 810 can be displaced or tilted in a direction perpendicular to the optical axis OA, or can be rotated around the optical axis OA. For example, the optical axis direction can be a direction perpendicular to one surface of the image sensor 810. For example, the one surface of the image sensor 810 can be the upper surface of the image sensor 810. Alternatively, the one surface of the image sensor 810 can be a surface corresponding to or facing the lower surface of the lens module 400 or the filter 610. For example, the one surface of the image sensor 810 can be the active area.

[0531] With the help of the support member 220 and the connecting elastic member 280, the movable part of the OIS can be elastically supported and can move in a direction perpendicular to the optical axis.

[0532] The OIS fixing part may include a second circuit board 800, a housing 450, and a magnet 23. Furthermore, the OIS fixing part may include at least one of a base 210, a cover member 300, and a bottom cover plate 219. Additionally, the OIS fixing part may include components coupled to the second circuit board 800, such as a motion sensor 820 and a capacitor 81A.

[0533] The movable part of the OIS may include a first circuit board 250, a holder 270, a second coil 230 and an image sensor 810.

[0534] In addition, the movable part of the OIS may include components coupled to the first circuit board 250, such as the second position sensor 240, the controller 830, the memory 512, and the capacitor 81B. In addition, the movable part of the OIS may include a filter holder 600 and a filter 610.

[0535] For example, the movable part of the OIS may include: a first circuit board 250 coupled to a connecting elastic member 280; a holder 270 coupled to the first circuit board 260; and an image sensor 810 disposed at the first circuit board 250 and elastically supported by a support member 220 and a connecting elastic member 280.

[0536] The magnet 23 may be placed at the fixed part of the OIS, and the second coil 230 may be placed at the movable part of the OIS. By means of the interaction between the magnet 23 and the second coil 230, the movable part of the OIS may move or tilt relative to the fixed part of the OIS.

[0537] Referring to Figure 19A, in order to use the electromagnetic force generated by the interaction between the magnet 23 and the second coil 230 to move and tilt the movable part of the OIS relative to the fixed part of the OIS, the movable part of the OIS may be spaced apart from the fixed part of the OIS.

[0538] For example, the first circuit board 250 and the image sensor 801 may be spaced apart from the second circuit board 800, the housing 450 and the substrate 210.

[0539] For example, at the initial position of the movable part of the OIS, the outer surface of the retainer 270 may be spaced apart from the inner surface of the substrate 210 by a predetermined distance d1.

[0540] Furthermore, for example, at the initial position of the movable part of the OIS, the lower surface of the holder 270 and the lower surface of the first circuit board 250 may be spaced apart from the front surface (or upper surface) of the substrate 210 by a predetermined distance H1. Furthermore, at the initial position of the movable part of the OIS, the lower surface of the holder 270 and the lower surface of the first circuit board 250 may be spaced apart from the front surface (or upper surface) of the bottom cover 219.

[0541] Furthermore, at the initial position of the OIS movable portion, the solder 902 may be spaced apart from the front surface (or upper surface) of the substrate 210 by a predetermined distance.

[0542] The initial position of the OIS movable part can be the original position of the OIS movable part when no power is applied to the second coil 230, or the position where the OIS movable part is located due to the elastic deformation of the support member 220 and the connecting elastic member 280 only due to the weight of the OIS movable part.

[0543] In addition, the initial position of the movable part of the OIS can be the position where the movable part of the OIS is located when gravity acts in the direction from the second circuit board 800 to the first circuit board 250 or when gravity acts in the direction from the first circuit board 250 to the second circuit board 800.

[0544] The image sensor 810 may be any of a charge-coupled device (CCD), a metal-oxide-semiconductor (MOS), a CPD image sensor, and a CID image sensor, but is not limited thereto.

[0545] Although in one embodiment the first circuit board 250 may be implemented as a single board, the invention is not limited thereto. In another embodiment, the first circuit board may include a third board and a fourth board, each of the third board and the fourth board may include additional terminals configured to be electrically connected to each other, and the first coupler 31 of the connectivity resilient member 280 may be electrically connected to one of the third board and the fourth board.

[0546] Figure 22 illustrates a connecting elastic member 280-1 according to another embodiment.

[0547] Referring to FIG22, the connecting elastic member 280-1 may include a plate portion 280A and an elastic portion 280B. The plate portion 280A may also be referred to as a "plate component", "circuit board", "board" or "circuit component".

[0548] Board portion 280A may include a plurality of terminals 41 corresponding to terminals 262 of the first circuit board 250.

[0549] The plate portion 280A may have a hole 79 corresponding to the hole 70 in the retainer 270. The hole 79 in the plate portion 280A may be a through hole formed through the plate portion 280A in the optical axis direction.

[0550] For example, the hole 79 in the board portion 280A can expose the second surface 60B of the first circuit board 250 and expose the terminal 262 of the first circuit board 250.

[0551] The terminal 41 of the board portion 280A may include a first portion 41a and a second portion 41b. The first portion 41a of the terminal 41 may be disposed in the board portion 280A, and the second portion 41b of the terminal 41 may be exposed to the outside from the board portion 280A and may be coupled to the terminal 262 of the first circuit board 250 via solder.

[0552] The plate portion 280A can be placed on the first surface 36A of the lower surface 42B of the retainer 270, and can be coupled or attached to the first surface 36A of the lower surface 42B of the retainer 270 via an adhesive member.

[0553] For example, the board portion 280A can be implemented as a printed circuit board or an FPCB.

[0554] The elastic portion 280B can be exposed from the plate portion 280A and can be connected to the terminal 41 of the plate portion 280A.

[0555] The flexible portion 280B may include a coupler 32A coupled to the support member 220 and a connector 33A connecting the coupling portion 32A to the terminal 41.

[0556] The terminal 41 of the elastic part 280B and the plate part 280A can correspond to the connecting spring 281 shown in FIG18.

[0557] For example, the first portion 41a of terminal 41 may correspond to the first portion 31a of connecting spring 281 shown in FIG. 18, and the second portion 41b of terminal 41 may correspond to the second portion 31b of connecting spring 281 shown in FIG. 18. The description of the first portion 31a and the second portion 31b of connecting spring 281 may be applied to the first portion 41a and the second portion 41b of terminal 41 with or without modification.

[0558] Furthermore, the coupler 32A of the elastic portion 280B may correspond to the second coupler 32 of the connecting spring 281 shown in FIG. 18, and the connector 33A of the elastic portion 280B may correspond to the connector 33 of the connecting spring 281 shown in FIG. 18. The description of the second coupler 32 and the connector 33 of the connecting spring 281 may be applied to the coupler 32A and connector 33A of the elastic portion 280B with or without modification.

[0559] The description of groups 1A to 4A of the connecting elastic member 280 shown in Figures 15 and 16 may be applied to the connecting elastic member 280-1 shown in Figure 24 with or without modification.

[0560] The board portion 280A may include the dummy components 28-1 to 28-4 shown in Figures 15 and 16, and the description of the dummy components 28-1 to 28-4 may be applied to the dummy components of the board portion 280A with or without modifications.

[0561] FIG23 is an exploded perspective view of a camera module 20 according to another embodiment of the present invention. The same reference numerals as those in FIG2 are used to identify the same components in FIG23, and descriptions of the same components are simply given or omitted.

[0562] Referring to FIG23, the camera module 20 may include a lens module 400 and an image sensor unit 350.

[0563] The lens module 400 of the camera module 20 shown in Figure 23 may or may not move in the optical axis direction, and may be fixed in the optical axis direction.

[0564] Furthermore, the lens module 400 shown in FIG23 may or may not move in the direction perpendicular to the optical axis OA, and may be fixed in the direction perpendicular to the optical axis OA.

[0565] The camera module 20 may further include the cover component 300 shown in FIG2.

[0566] For example, the lens module 400 may be coupled, attached or fixed to the holder 600 and the second circuit board 800. For example, the lower portion, lower end or lower surface of the lens module 400 may be coupled, attached or fixed to the upper surface of the holder 600 or the upper surface of the second circuit board 800.

[0567] In addition, the lens module 400 may be coupled, attached or fixed to the cover component 300.

[0568] With the development of camera technology, image resolution has increased, and therefore the size of image sensors has increased. Because the size of image sensors has increased, the size of lens modules and the actuators used to move the lens modules have also increased. Therefore, not only the weight of the lens modules but also the weight of other actuator components used to move the lens modules has increased.

[0569] According to an embodiment of the present invention, an AF operation unit (or a first actuator) 100 operating in a lens shift manner is used to perform autofocus, and an image sensor unit (or a second actuator) 350 operating in an image sensor shift manner is used to perform optical image stabilization (OIS), thereby improving the reliability of the camera device.

[0570] This embodiment can perform 5-axis grip correction using sensor shifting. For example, 5-axis grip may include two angular grips (e.g., pitch and yaw), two shift grips (e.g., x-axis shift and y-axis shift), and one rotational grip (e.g., roll).

[0571] FIG24 illustrates the configuration of magnet 23A, OIS coil unit 230-1, OIS position sensor 240a, holder 270 and first circuit board 250 according to one embodiment. FIG25 illustrates the configuration of magnet 60, OIS coil unit 40, OIS position sensor 50, first circuit board 30 and holder 30 according to a comparative example.

[0572] In the comparative example shown in FIG25, the OIS coil unit 40 and the OIS position sensor 50 may be disposed or mounted on a first surface (e.g., the upper surface) of the first circuit board 30. The holder 20 may be disposed below the first circuit board 30.

[0573] The OIS coil unit 40 may have an opening or hole formed in its center, and the OIS position sensor 50 may be disposed in the opening or holder in the OIS coil unit 40. The OIS position sensor 50 may overlap with the OIS coil unit 40 in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the first circuit board 30. In other words, the OIS coil unit 50 and the OIS position sensor 50 may be disposed adjacent to the first surface (e.g., the upper surface) of the first circuit board 30.

[0574] When a drive signal is applied to the OIS coil unit 40 for OIS operation, a magnetic field can be generated from the OIS coil unit 40. In order to perform accurate OIS feedback operation, the OIS position sensor 50 must output an output corresponding to the result of detecting only the magnetic field generated by the magnet 60 fixed to the OIS fixed part. However, because the OIS coil unit 40 and the OIS position sensor 50 are placed close to each other in the comparative example shown in FIG. 25, the output of the OIS position sensor 50 can be greatly affected by the magnetic field generated from the OIS coil unit 40, thereby degrading the accuracy and reliability of the OIS feedback operation.

[0575] Furthermore, since the OIS position sensor 50 and the OIS coil unit 40 overlap each other in a direction perpendicular to the optical axis, the output of the OIS position sensor 50 can be greatly affected by the magnetic field generated by the OIS coil unit 40, thereby degrading the accuracy and reliability of the OIS feedback operation.

[0576] Figure 26 illustrates the frequency response characteristics relative to the drive signal input to the OIS coil unit 40 and the output of the OIS position sensor 50. In Figure 26, the x-axis indicates the frequency, and the y-axis indicates the gain. g1 indicates the frequency response characteristics with gain.

[0577] Referring to Figure 26, due to the influence of the magnetic field generated by the OIS coil unit 40, phenomenon 38A may occur, in which the output of the OIS position sensor 50 is abnormally reduced in a certain frequency range (e.g., 200Hz to 300Hz). Due to this phenomenon 38A, the reliability of OIS feedback operation may be degraded.

[0578] In contrast, in the embodiment shown in FIG24, the OIS position sensor (e.g., 240a) may be positioned below the OIS coil unit (e.g., 230-1), and the OIS position sensor (e.g., 240a) and the OIS coil unit (e.g., 230-1) may not overlap each other in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the first circuit board 250.

[0579] For example, the distance D12 between magnet 23A and OIS coil unit 230-1 in the optical axis direction can be in the range of 0.05mm to 0.2mm. For example, D12 can be in the range of 0.1mm to 0.18mm. Specifically, D12 can be in the range of 0.12mm to 0.15mm.

[0580] Furthermore, for example, the length D13 of the OIS coil unit 230-1 in the optical axis direction can be in the range of 0.1 mm to 0.5 mm. Specifically, D13 can be in the range of 0.2 mm to 0.4 mm. More specifically, D13 can be in the range of 0.25 mm to 0.3 mm.

[0581] For example, the distance D11 between the magnet 23A and the OIS position sensor (e.g., 240a) in the optical axis direction can be in the range of 0.25 mm to 0.8 mm. Specifically, D11 can be in the range of 0.3 mm to 0.5 mm. More specifically, D11 can be in the range of 0.35 mm to 0.47 mm.

[0582] If D11 is greater than 0.8 mm, the strength of the magnetic field of the magnet 23A detected by the OIS position sensor 240a may be attenuated, and therefore the sensitivity of the OIS position sensor 240a may be degraded.

[0583] If D11 is less than 0.25 mm, the length D13 of the OIS coil unit 230-1 in the optical axis direction must be reduced to prevent the OIS coil unit and the OIS position sensor from overlapping each other in the direction perpendicular to the optical axis. In this case, the electromagnetic force generated by the interaction between the OIS coil unit and the magnet may be reduced.

[0584] Meanwhile, the thickness D14 of the PIS position sensor 240a can be in the range of 0.2 mm to 0.4 mm. Specifically, D14 can be in the range of 0.23 mm to 0.3 mm.

[0585] For example, the thickness D15 of the upper plate of the retainer 270 can be in the range of 0.2 mm to 0.3 mm. Specifically, D15 can be in the range of 0.2 mm to 0.25 mm. For example, D15 can be the distance between the upper surface 42A of the retainer 270 and the second surface 36B of the lower surface 42B of the retainer 270.

[0586] For example, the distance between the lower surface (or end) of the OIS coil unit 230-1 and the upper surface of the OIS position sensor 240a (hereinafter referred to as the "first distance") may be in the range of 0.01 mm to 0.2 mm. Specifically, the first distance may be in the range of 0.02 mm to 0.1 mm. More specifically, the first distance may be in the range of 0.02 mm to 0.05 mm.

[0587] If the first distance is greater than 0.2 mm, the distance between the OIS position sensor 240a and the magnet 23A may increase excessively, and the output of the OIS position sensor 240a may decrease, thereby reducing sensitivity. If the first distance is less than 0.01 mm, the degree to which the output of the OIS position sensor 240a is affected by the magnetic field of the OIS coil unit 230-1 may increase with the increase of the first distance. However, the degree to which the output of the OIS position sensor 240a is affected by the magnetic field of the OIS coil unit 230-1 may be less than the degree of influence shown in the comparative example in FIG26.

[0588] In another embodiment, the lower surface (or lower end) of the OIS coil unit 230-1 and the upper surface of the OIS position sensor 240a may be flush with each other, and the first distance may be zero.

[0589] Compared to the comparative example, the OIS position sensor 240a can be spaced further apart from the OIS coil unit 230-1 and can avoid overlapping with the OIS coil unit 230-1 in a direction perpendicular to the optical axis. Therefore, according to the embodiments of the present invention, it is possible to suppress or reduce the influence of the magnetic field of the OIS coil unit 40 on the output of the OIS position sensor, and it is possible to ensure the accuracy and reliability of the OIS feedback operation.

[0590] Figure 27 illustrates the frequency response characteristics of the embodiment shown in Figure 24 relative to the drive signal input to the OIS coil unit 230-1 and the output of the OIS position sensor 240a. In Figure 27, the x-axis indicates the frequency, and the y-axis indicates the gain. g2 indicates the frequency response characteristics with increasing gain. In the following text, the frequency response in Figure 26 is referred to as "CASE1", and the frequency response characteristics in Figure 27 are referred to as "CASE2".

[0591] In CASE2, the phenomenon 38A that appeared in CASE1 is weakened or does not occur (38B).

[0592] In CASE1, due to the influence of the magnetic field of OIS coil unit 40, an abnormal decrease in gain was found in the range of 200Hz to 300Hz (a decrease of approximately -47dB). Therefore, the reliability of OIS feedback operation may be degraded.

[0593] In contrast, because the influence of the magnetic field of the OIS coil unit 230-1 is weakened or attenuated, the gain in the 200Hz to 300Hz range is found to be greater than that in CASE1 (approximately -37dB). In other words, because the influence of the magnetic field of the OIS coil unit 230-1 is weakened or attenuated, it is possible to obtain normal frequency response characteristics.

[0594] According to an embodiment of the present invention, because the influence of the magnetic field of the OIS coil unit 230-1 on the output of the OIS position sensor 240a is reduced, it is possible to improve the recognition rate of the OIS position sensor 240a relative to the magnetic field of the magnet 23A. Therefore, it is possible to prevent the occurrence of phenomenon 38A shown in FIG. 26, and it is possible to perform OIS feedback operation with high accuracy and reliability. As a result, it is possible to ensure the reliability of the handshake correction performed by the camera module.

[0595] The description of Figures 23 to 27 may be applied to coil units 230-2 to 230-4, OIS position sensors 240b and 240c, and magnets 23B to 23D, with or without modifications.

[0596] FIG28 is a perspective view of a camera module 1010 according to an embodiment. FIG29 is an exploded perspective view of the camera module 1010 shown in FIG28. FIG30 is an assembled perspective view of the camera module shown in FIG28, with the cover component 1300 removed therefrom. FIG31 is an exploded perspective view of the AF operation unit 1100 shown in FIG29. FIG32 is a perspective view of the spool 1110, sensing magnet 1180, balancing magnet 1185, first coil 1120, circuit board 1190, first position sensor 1170 and capacitor 1195 shown in FIG31. FIG33 is a perspective view of the spool 1110, housing 1140 and circuit board 1190. FIG34 is a bottom perspective view of the housing 1140, spool 1110, lower elastic member 1160, magnet 1130 and circuit board 1190.

[0597] Referring to Figures 28 to 34, the camera module 1010 may include an AF operation unit 1100 and an image sensor unit 1350.

[0598] The camera module 1010 may include at least one of a cover member 1300, a lens module 1400, and a base 1210. The cover member 1300 and the base 1210 may define a housing.

[0599] The AF operation unit 1100 can be coupled to the lens module 1400 so that the lens module 1400 can be moved in the direction of the optical axis OA or in the direction parallel to the optical axis OA, and can perform the autofocus function of the camera module 1010.

[0600] The image sensor unit 1350 may include an image sensor 1810. The image sensor unit 1350 may move the image sensor 1810 in a direction perpendicular to the optical axis, and may tilt or rotate the image sensor 1810 about the optical axis. It is possible to use the image sensor unit 1350 to perform interlocking correction of the camera module 1010.

[0601] For example, the image sensor 1810 can rotate about at least one of the x-axis, y-axis and z-axis.

[0602] For example, the image sensor 1810 can move in at least one of the x-axis direction, y-axis direction and z-axis direction.

[0603] For example, the image sensor 1810 may be tilted relative to at least one of the x-axis, y-axis and z-axis.

[0604] The AF operation unit 1100 may alternatively be referred to as a "lens moving unit" or "lens moving device". Alternatively, the AF operation unit 1100 may alternatively be referred to as a "first actuator" or "AF drive unit".

[0605] For optical image stabilization (OIS) operation, the image sensor 1810, rather than the lens module 1400, can be moved in a direction perpendicular to the optical axis by means of the image sensor unit 1350.

[0606] The image sensor unit 1350 may alternatively be referred to as an "image sensor moving unit", "image sensor shifting unit", "sensor moving unit" or "sensor shifting unit". Alternatively, the image sensor unit 1350 may alternatively be referred to as a "second actuator" or "OIS driving unit".

[0607] Referring to Figure 31, the AF operation unit 1100 may include a bobbin 1110, a first coil 1120, a magnet 1130 and a housing 1140.

[0608] The AF operation unit 1100 may further include an upper elastic member 1150 and a lower elastic member 1160.

[0609] For AF feedback operation, the AF operation unit 1100 may include a first position sensor 1170, a circuit board 1190, and a sensing magnet 1180. The AF operation unit 1100 may further include at least one of a balancing magnet 1185 and a capacitor 1195.

[0610] The spool 1110 can be housed in the housing 1140 and can be moved in the direction of the optical axis OA or in a first direction (e.g., the z-axis direction) by means of the electromagnetic interaction between the first coil 1120 and the magnet 1130.

[0611] The spool 1110 may have a hole to which the lens module 1400 is coupled or mounted. For example, the hole in the spool 1110 may be a through hole formed through the spool 1110 in the optical axis direction, and may have a circular shape, an elliptical shape or a polygonal shape, but is not limited thereto.

[0612] The lens module 1400 may include at least one lens and / or lens barrel.

[0613] For example, the lens module 1400 may include one or more lenses and a lens barrel for housing the one or more lenses. However, the construction of the lens module is not limited to a lens barrel. The lens module may have any construction as long as it can support one or more lenses.

[0614] For example, the lens module 1400 may engage with the spool 1110 via a thread. Alternatively, the lens module 1400 may be coupled to the spool 1110 via an adhesive (not shown). Light that has passed through the lens module 1400 may be radiated to the image sensor 1810 via the filter 1610.

[0615] The spool 1110 may include a protrusion 1111 formed on its outer surface.

[0616] For example, although the protrusion 1111 may protrude in a direction parallel to a line perpendicular to the optical axis OA, the present invention is not limited thereto.

[0617] The protrusion 1111 of the spool 1110 may correspond to the recessed portion 1025a in the housing 1140, and may be adapted or disposed in the recessed portion 1025a in the housing 1140 to suppress or prevent the spool 1110 from rotating beyond a predetermined range around the optical axis. In addition, the protrusion 1111 may act as a stop that is configured so that the spool 1110 moves within a predetermined range in the optical axis direction (e.g., in the direction from the upper elastic member 1150 toward the lower elastic member 1160) in response to external impacts, etc.

[0618] The spool 1110 may have a first outflow groove 1112a formed in its upper surface to avoid spatial interference with the first connector 1153 of the upper elastic member 1150. In addition, the spool 1110 may have a second outflow groove 1112b formed in its lower surface to avoid spatial interference with the second frame connector 1163 of the lower elastic member 1160.

[0619] The spool 1110 may include a first coupler 1116a, which is configured to be coupled and secured to the upper elastic member 1150. For example, although the first coupler 1116a of the spool 1110 may have a flat shape, the invention is not limited thereto. In another embodiment, the first coupler 1116a may be in the form of a protrusion or a groove.

[0620] The spool 1110 may include a second coupler 1116b configured to be coupled to and fixed to the lower elastic member 1160. For example, although the second coupler 1116b may be configured to have a flat shape, the invention is not limited thereto. In another embodiment, the second coupler 1116b may be in the form of a protrusion or a groove.

[0621] Referring to FIG32, a groove may be formed therein on the outer surface of the bobbin 1110, in which the first coil 1120 is placed, fitted, or disposed. The groove in the bobbin 1110 may have a shape corresponding to the shape of the first coil 1120, i.e., a closed curve shape (e.g., a ring shape).

[0622] The spool 1110 may have a first mounting groove therein, in which the sensing magnet 1180 is mounted, fitted, fixed, or placed. Furthermore, the outer surface of the spool 1110 may have a second mounting groove, in which the balancing magnet 1185 is mounted, fitted, fixed, or placed. For example, the first and second mounting grooves in the spool 1110 may be formed on the outer surfaces of the spool 1110 facing each other.

[0623] The first coil 1120 may be disposed at or coupled to the spool 1110. For example, the first coil 1120 may be disposed on the outer surface of the spool 1110.

[0624] For example, although the first coil 1120 may be around the outer surface of the spool 1110 in the rotational direction around the optical axis OA, the present invention is not limited thereto.

[0625] Although the first coil 1120 may be directly wound around the outer surface of the spool 1110, the invention is not limited thereto. In another embodiment, the first coil 1120 may be implemented as a coil loop or a corner loop and may be provided around the spool 1110.

[0626] Power or drive signal can be supplied to the first coil 1120.

[0627] The power or drive signal supplied to the first coil 1120 may be a DC signal, an AC signal, or a signal containing both DC and AC components, and may be of voltage type or current type.

[0628] When a drive signal (e.g., drive current) is supplied to the first coil 1120, an electromagnetic force can be generated by the electromagnetic interaction between the first coil 1120 and the magnet 1130, and the spool 1110 can move in the optical axis direction OA by the generated electromagnetic force.

[0629] The spool 1110 can move up or down from the initial position of the AF operating unit, which is called bidirectional drive of the AF operating unit. Alternatively, the spool 1110 can move up (or forward) from the initial position of the AF operating unit, which is called unidirectional drive of the AF operating unit.

[0630] At the initial position of the AF operation unit, the first coil 1120 may correspond to or overlap with the magnet 1130 placed at the housing 1140 in a direction parallel to and perpendicular to the optical axis OA and extending along the optical axis.

[0631] For example, the AF operation unit may include a spool 1110 and components coupled to the spool 1110 (e.g., a first coil 1120, a sensing magnet 1180, and a balancing magnet 1185). The AF operation unit may further include a lens module 1400.

[0632] The initial position of the AF operating unit may be the original position of the AF operating unit when no power is applied to the coil 120, or the position where the AF operating unit is located due to the elastic deformation of the upper elastic member 150 and the lower elastic member 160 only due to the weight of the AF operating unit.

[0633] In addition, the initial position of the spool 110 may be the position of the AF operation unit when gravity acts in the direction from the spool 110 to the base 210 or when gravity acts in the direction from the base 210 to the spool 110.

[0634] The sensing magnet 1180 can provide a magnetic field detected by the first position sensor 1170, and the balancing magnet 1185 can be used to counteract the influence of the magnetic field of the sensing magnet 1180 and establish a weight balance relative to the sensing magnet 1180.

[0635] The sensing magnet 1180 may alternatively be referred to as the "sensor magnet".

[0636] The sensing magnet 1180 may be placed at the spool 1110 or may be coupled to the spool 1110.

[0637] The sensing magnet 1180 may be positioned to face the first position sensor 1170.

[0638] The balancing magnet 1185 may be placed at or coupled to the spool 1110. For example, the balancing magnet 1185 may be positioned opposite the sensing magnet 1180.

[0639] Although each of the sensing magnet 1180 and the balancing magnet 1185 may be a unipolar magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet 1180 and the balancing magnet 1185 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0640] The sensing magnet 1180 can move together with the spool 1110 in the optical axis direction, and the first position sensor 1170 can detect the strength or magnetic force of the magnetic field of the sensing magnet 1180 (which moves in the optical axis direction) and output an output signal corresponding to the detection result.

[0641] For example, the strength or force of the magnetic field detected by the first position sensor 1170 may change depending on the displacement of the spool 1110 in the optical axis direction. Therefore, the first position sensor 1170 can output an output signal proportional to the detected strength of the magnetic field, and the displacement of the spool 1110 in the optical axis direction can be detected using the output signal from the first position sensor 1170.

[0642] The housing 1140 houses the spool 1110 and supports the magnet 1130, the first position sensor 1170 and the circuit board 1190.

[0643] Referring to Figures 31, 33 and 34, the housing 1140 may be configured to have a hollow column overall. For example, the housing 1140 may have a polygonal (e.g., rectangular or octagonal) or circular hole, and the hole in the housing 1140 may be a through hole that is formed through the housing 1140 in the optical axis direction.

[0644] The housing 1140 may include a side portion corresponding to or facing the side plate 1302 of the cover member 1300, and a corner corresponding to or facing the corner of the cover member 1300.

[0645] In order to prevent direct collision with the inner surface of the upper plate 1301 of the cover member 1300, the housing 1140 may include a stop 1145 disposed on its upper portion, upper surface or upper end.

[0646] To prevent the lower surface of the housing 1140 from colliding with the circuit board 1800 of the image sensor 1350, the housing 1140 may further include a stop 1147 protruding from its lower surface. Here, the stop 1147 may alternatively be referred to as a "boss" or "protrusion".

[0647] Referring to FIG31, the housing 1140 may have a mounting recess (or placement recess) 1014a configured to house the circuit board 1190 therein. The mounting recess 1014a may have a shape corresponding to the shape of the circuit board 1190.

[0648] Referring to FIG33, the housing 1140 may have an opening 141 through which terminals K1 to K6 of the terminal components 1195 of the circuit board 1190 are exposed. The opening 1141 may be formed in the side portion of the housing 1140.

[0649] The upper portion, upper end or upper surface of the housing 1140 may have at least one first coupler coupled to the first outer frame 1152 of the upper elastic member 1150.

[0650] The lower portion, lower end, or lower surface of the housing 1140 may have a second coupler that is coupled to and fixed to the second outer frame 1162 of the lower elastic member 1160. For example, each of the first coupler and the second coupler of the housing 1140 may have the shape of a protrusion, a groove, or a flat surface.

[0651] The magnet 1130 may be disposed at the housing 1140. For example, the magnet 1130 may be disposed at the side portion of the housing 1140. The magnet 1130 may be an AF operating magnet for AF operation.

[0652] For example, although magnet 1130 may include a first magnet and a second magnet disposed on two side portions positioned opposite each other, the invention is not limited thereto. In another embodiment, magnet 1130 may be disposed at a corner of housing 1140.

[0653] Magnet 1130 may include two or more magnets.

[0654] At the initial position of the AF operation unit, the first magnet 1130 may be placed on the housing 1140 so as to partially overlap with the first coil 1120 in a direction parallel to the line perpendicular to the optical axis OA and extending through the optical axis OA.

[0655] Although each of the first magnet 1130-1 and the second magnet 1130-2 may be a unipolar magnetized magnet, the present invention is not limited thereto. In another embodiment, each of the first magnet 1130-1 and the second magnet 1130-2 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0656] The circuit board 1190 may be disposed at the housing 1140, and the first position sensor 1170 may be disposed at or mounted to the circuit board 1190. For example, the circuit board 1190 may be disposed in a mounting recess 1014a in the housing 1140, and the terminals of the circuit board 1190 may be exposed to the outside of the housing 1140 through an opening 1141 in the housing 1140.

[0657] The circuit board 1190 may include a terminal component (or terminal unit) 1095, which includes a plurality of terminals K1 to K6 to be conductively connected to an external terminal or external device, and the plurality of terminals K1 to K6 may be conductively connected to the first position sensor 1170.

[0658] A first position sensor 1170 may be disposed on a first surface of circuit board 1190, and a plurality of terminals K1 to K6 may be disposed on a second surface of circuit board 1190. Here, the second surface of circuit board 1190 may be the surface opposite to the first surface of circuit board 1190. For example, the first surface of circuit board 1190 may be the surface of circuit board 1190 facing the spool 1110 or the sensing magnet 1180.

[0659] For example, circuit board 1190 may be implemented as a printed circuit board or an FPCB.

[0660] The circuit board 1190 may include a circuit pattern or wires (not shown) for conductively connecting the first terminal K1 to the sixth terminal K6 to the first position sensor 1170.

[0661] The first position sensor 1170 can detect the magnetic field or the strength of the magnetic field of the sensing magnet 1180 mounted on the linear shaft 1110 during the movement of the linear shaft 1110, and can output an output signal corresponding to the detection result.

[0662] The first position sensor 1170 may be implemented as a single Hall sensor. The first position sensor 1170 may include two input terminals to which a drive signal or power is supplied and two output terminals to which a sense voltage (or output voltage) is output.

[0663] For example, the drive signal can be supplied to the first position sensor 1170 via the first terminal K1 and the second terminal K2 of the circuit board 1190, and the output of the first position sensor 1170 can be output to the outside via the third terminal K3 and the fourth terminal K4.

[0664] The fifth terminal K5 and the sixth terminal K6 of the circuit board 1190 can be electrically connected to at least one of the upper elastic member 1150 and the lower elastic member 1160 so as to supply a drive signal to the first coil 1120.

[0665] In another embodiment, the first position sensor 1170 may be implemented as a driver IC including a Hall sensor. For example, the first position sensor 1170 may include a Hall sensor and a driver. Here, the first position sensor 1170 may include first terminals to fourth terminals (data is transmitted to and received from the outside via data communication using a protocol such as I2C communication through the first terminals to fourth terminals) and fifth and sixth terminals, through which drive signals are directly supplied to the first coil 1120. The first terminals to fourth terminals of the first position sensor 1170 may be electrically connected to the first terminals K1 to fourth terminals K4 of the circuit board 1190. The fifth and sixth terminals of the first position sensor 1170 may be electrically connected to the first coil 1120 via at least one of the upper elastic member 1150 and the lower elastic member 1160 in order to supply drive signals to the first coil 1120.

[0666] Capacitor 1195 may be disposed or mounted on a first surface of circuit board 1190. Capacitor 1195 may be configured to have a wafer shape. Here, the wafer may include a first terminal corresponding to one end of capacitor 1195 and a second terminal corresponding to the other end of capacitor 1195. Capacitor 1195 may alternatively be referred to as a "capacitive element" or a "phase modulator".

[0667] Capacitor 1195 can be connected in parallel to the first terminal K1 and the second terminal K2 of circuit board 1190 in a conductive manner, and power (or drive signal) is supplied from the outside to position sensor 1170 via the first terminal and the second terminal. Alternatively, capacitor 1195 can be connected in parallel to the terminals of the first position sensor 1170 in a conductive manner, and the first position sensor is conductively connected to the first terminal K1 and the second terminal K2 of circuit board 1190.

[0668] Since the capacitor 1195 is connected in parallel to the first terminal K1 and the second terminal K2 of the circuit board 1190 in a conductive manner, the capacitor 1195 can act as a smoothing circuit for eliminating the ripple components in the power signals GND and VDD supplied from the outside to the first position sensor 1170, and thus can supply a stable and consistent power signal to the first position sensor 1170.

[0669] The upper elastic member 1150 may be coupled to the upper portion, upper end or upper surface of the spool 1110 and the upper portion, upper end or upper surface of the housing 1140, and the lower elastic member 1160 may be coupled to the lower portion, lower end or lower surface of the spool 1110 or the upper portion, upper end or upper surface of the housing 1140.

[0670] The upper elastic member 1150 and the lower elastic member 1160 can elastically support the spool 1110 relative to the housing 1140.

[0671] Although each of the upper elastic member 1150 and the lower elastic member 1160 is implemented as a single unit or a single structure in FIG31, the present invention is not limited thereto.

[0672] In another embodiment, at least one of the upper elastic member and the lower elastic member may include a plurality of elastic units or springs that are electrically isolated or spaced apart from each other.

[0673] The upper elastic member 1150 may further include: a first inner frame 1151, which is coupled or fixed to the upper portion, upper surface or upper end of the spool 1110; a first outer frame 1152, which is coupled or fixed to the upper portion, upper surface or upper end of the housing 1140; and a first frame connector 1153, which connects the first inner frame 1151 to the first outer frame 1152.

[0674] The lower elastic member 1160 may include a second inner frame 1161 coupled or fixed to the lower portion, lower surface or lower end of the spool 1110, a second outer frame 1162 coupled or fixed to the lower portion, lower surface or lower end of the housing 1140, and a second frame connector 1163 connecting the second inner frame 1161 to the second outer frame 1162.

[0675] Each of the first frame connector 1153 and the second frame connector 1163 of the upper elastic member 150 and the lower elastic member 160 may be bent or flexed (or may be formed into a curve) at least once to define a predetermined pattern.

[0676] Each of the upper elastic member 1150 and the lower elastic member 1160 may be made of a conductive material.

[0677] Referring to Figures 31 and 32, the first surface of the circuit board 1190 may have two pads 1005a and 1005b, which are connected to the fifth terminal K5 and the sixth terminal K6 of the circuit board 1190 in a connected manner. The upper elastic member 1150 may include a first engagement portion 1004a coupled to or conductively connected to the first pad 1005a, and the lower elastic member 1160 may include a second engagement portion 1004b conductively connected to the second pad 1005b. The first coil 1120 may be coupled to the upper elastic member 1150 at one end and to the lower elastic member 1160 at the other end.

[0678] In another embodiment, the upper elastic member 1150 or the lower elastic member 1160 may include two elastic members, and each of the two elastic members may be coupled or electrically connected to a corresponding one of the first pad and the second pad of the circuit board 1190. The first coil 1120 may be electrically connected to the two elastic members.

[0679] Figure 35 is a plan view of the image sensor unit 1350 shown in Figure 29. Figure 36 is an exploded perspective view of the image sensor unit 1350 shown in Figure 35. Figure 37 is a perspective view of the first circuit board 1800 and the housing 1450. Figure 38 is a perspective view of the first circuit board 1800, the housing 1450, and the magnet 1023 shown in Figure 36. Figure 39A is an exploded perspective view of the second circuit board 1900, the second coil 1230, the second position sensor 1240, the image sensor 1810, the support member 1220, and the holder 1270. Figure 39B is a plan view of the third circuit board 1250, the second coil 1230, and the second position sensor 1240 shown in Figure 39A. Figure 40 is an exploded perspective view of the second circuit board 1900, the image sensor 1810, the support member 1220, the holder 1270, and the connecting elastic member 1280 shown in Figure 36. Figure 41 is a bottom view of the image sensor unit 1350 shown in Figure 35, with the bottom cover 1219 removed. Figure 42 is a partially enlarged view of the connecting elastic member 1280 shown in Figure 42. Figure 43 is a view illustrating the connecting springs 1001A, 1002A, 1003A, and 1004A of the connecting elastic member 1280. Figure 44A is a cross-sectional view of the camera module 1010 shown in Figure 28 taken along line AB. Figure 44B is a cross-sectional view of the camera module 1010 shown in Figure 28 taken along line CD. Figure 45 is a cross-sectional view of the camera module 1010 shown in Figure 28 taken along line IJ. Figure 46 is a cross-sectional view of the image sensor unit 1350 shown in Figure 35 taken along line EF. Figure 47 is a cross-sectional view of the image sensor 1801 shown in Figure 35 taken along line GH. Figure 48 is a perspective view of camera module 1010, with bottom cover 1219 removed from the camera module and the camera module cut open.

[0680] Referring to Figures 35 to 48, the image sensor unit 1350 may include a first circuit board 1800, a magnet 1023, a second circuit board 1900, a second coil 1230, an image sensor 1810, a connecting elastic member 1280, and a support member 1220.

[0681] The image sensor unit 1350 may further include a housing 1450 configured to house at least a portion of the first circuit board 1800.

[0682] The first circuit board 1800 can be used to supply signals from the outside to the image sensor unit 1350, or to output signals from the image sensor unit 1350 to the outside.

[0683] Referring to Figures 36 and 37, the first circuit board 1800 may include a first region 1801 corresponding to the AF operation unit 1100, a second region 1802 for housing a connector, and a third region 1803 connecting the first region 1801 to the second region 1802. The connector may be electrically connected to the second region 1802 of the second circuit board 1800, and may include a port configured to be electrically connected to an external device.

[0684] Although each of the first region 1801 and the second region 1802 of the second circuit board 1800 may include a flexible substrate and a rigid substrate, and the third region 803 may include a flexible substrate, the present invention is not limited thereto. In another embodiment, at least one of the first region 1801 to the third region 1803 of the first circuit board 1800 may include at least one of a rigid substrate and a flexible substrate.

[0685] The first circuit board 1800 may include a hole 1800A, which corresponds to a hole in the spool 1110 of the AF operation unit 1100, the lens module 1400, and / or the image sensor 1810. For example, the hole 1800A in the first circuit board 1800 may be formed in a first region 1801.

[0686] Referring to FIG44A, at least a portion of the lens module 1400 may extend through the hole 1800A in the first circuit board 1800 and may be positioned below the second surface 1044B of the first circuit board 1800.

[0687] The lens module 1400 may be mounted on the second circuit board 1900. For example, the lens module 1400 may be positioned on the third circuit board 1250. For example, the lens module 1400 may be positioned above the hole 1501 in the third circuit board 1250.

[0688] For example, the lower portion, lower end or lower surface of the lens or lens barrel of the lens module 1400 may extend through the hole 1800A in the first circuit board 1800 and may be positioned below the second surface 1044B of the first circuit board 1800.

[0689] In addition, the lower portion, lower end or lower surface of the lens or lens barrel of the lens module 1400 may extend through the first surface (e.g., upper surface) 1051A of the second circuit board 1900 (or the third circuit board 1250).

[0690] In addition, the lower portion, lower end or lower surface of the lens or lens barrel of the lens module 1400 may be positioned above the hole 1501 in the third circuit board 1250.

[0691] Although the first circuit board 1800 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the present invention is not limited thereto. In another embodiment, the first circuit board 1800 may be configured to have a circular shape, etc. Although the hole 1800A in the first circuit board 1800 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the present invention is not limited thereto. In another embodiment, the hole 1800A may be configured to have a circular shape, etc.

[0692] The first circuit board 1800 may include at least one pad corresponding to the support member 1220. For example, at least one pad of the first circuit board 1800 may include a plurality of pads 1800B. Here, pad 1800B may alternatively be referred to as a "lead pattern", "lead member" or "hole".

[0693] The first circuit board 1800 may have at least one hole corresponding to the support member 1220, and the hole may be formed through the first circuit board 1800. For example, the first circuit board 1800 may have a plurality of through holes corresponding to a plurality of support members.

[0694] For example, each of the plurality of pads 1800B may have a hole formed through the first circuit board 1800 in the direction of the optical axis OA. Each of the plurality of pads 1800B may surround the hole and may further include a lead pattern or conductive layer.

[0695] The support member 1220 may extend through the hole in the pad 1800B and may be soldered to it so as to be electrically connected to the lead pattern disposed around the hole in the pad 1800B.

[0696] For example, a plurality of pads 1800B may be regularly spaced apart from each other to surround a hole 1800A in the first circuit board 1800. For example, a plurality of pads 1800B may be disposed in the area between the hole 1800A in the first circuit board 1800 and the side of the first circuit board 1800.

[0697] The first circuit board 1800 may have at least one coupling hole 1800C configured to couple to the housing 1450 via a coupling protrusion 1045B. Although the coupling hole 1800C may be a through hole formed through the first circuit board 1800 in the optical axis direction, the invention is not limited thereto. In another embodiment, the coupling hole 1800C may be in the form of a recess.

[0698] For example, although the coupling hole 1800C may be formed in a corner of the first circuit board 1800 that is diagonally opposite to each other, the invention is not limited thereto. In another embodiment, the coupling hole may be positioned adjacent to the side of the circuit board 1800 or between the side of the circuit board and the hole 1800A.

[0699] The first circuit board 1800 may include at least one terminal, such as a plurality of terminals 1080A.

[0700] The plurality of terminals 1080A may be formed on a first surface (e.g., upper surface) 44A of the first circuit board 1800. For example, the plurality of terminals 1080A may be disposed on a side of the first circuit board 1800 adjacent to a corner of the first circuit board 1800.

[0701] Each of the plurality of terminals 1080A can be electrically connected to a corresponding terminal K1 to K6 of the circuit board 1190 via a conductive adhesive component or solder.

[0702] For example, the first circuit board 1800 may include a terminal component 1085 on which a plurality of terminals 1080A are formed. The terminal component 1085 may protrude from one side of the first circuit board 1800 in a direction perpendicular to the optical axis.

[0703] The image sensor unit 1350 may further include a housing 1450 for placing, mounting or storing the first circuit board 1800.

[0704] At least a portion (e.g., a first region) of the first circuit board 1800 may be housed in the housing 1450. The housing 1450 may house the magnet 1023 and may alternatively be referred to as a "magnet holder".

[0705] The housing 1450 may be disposed below the housing 1140 of the AF operation unit 1100 and may be coupled to the housing 1140 of the image sensor unit 1350. For example, the upper portion, upper end or upper surface of the housing 1450 may be coupled to the lower portion, lower end or lower surface of the housing 1140 of the AF operation unit 1100 via adhesive members or coupling structures.

[0706] Here, the coupling structure may include: a first coupler provided at the lower portion, lower end, or lower surface of the housing 1140 of the AF operation unit 1100; and a second coupler provided at the upper portion, upper end, or upper surface of the housing 1450 of the image sensor unit 1350. The first coupler may be configured to have a protruding shape or a groove (or hole) shape, and the second coupler may be configured to have a groove (or hole) shape or a protruding shape.

[0707] In another embodiment, the housing 1140 of the AF operation unit 1100 may be coupled to the first circuit board 1800 via an adhesive component.

[0708] The housing 1450 may be positioned below the first circuit board 1800. For example, the AF operation unit 1100 may be positioned above the first circuit board 1800, and the housing 1450 may be positioned below the first circuit board 1800.

[0709] The housing 1450 may have a shape corresponding to or consistent with the first region 1801 of the first circuit board 1800. Although the housing 1450 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the invention is not limited thereto. In another embodiment, the housing 1450 may be configured to have a circular shape or an elliptical shape.

[0710] The housing 1450 may have a hole 1450A. At least a portion of the hole 1450A in the housing 1450 may correspond to or overlap with the hole 1800A in the first circuit board 1800.

[0711] Although the hole 1450A in the housing 1450 may be configured to have a polygonal shape (e.g., a quadrilateral or octagonal shape), a circular shape, or a cross shape when viewed from above, the present invention is not limited thereto. The hole 1450A in the housing 1450 may be a through hole formed through the housing 1450 in the optical axis direction.

[0712] For example, the housing 1450 may include a body 1042 configured to support at least a portion (e.g., the first region 1801) of the first circuit board 1800, a protrusion 1043 protruding from the body 1042 in the direction of the optical axis OA, and a hole 1450A formed through the body 1042.

[0713] The housing 1450 may include at least one coupling protrusion 1045B that protrudes from the upper surface of the body 1042. For example, the coupling protrusion 1045B may protrude from the upper surface of the body 1042 in a direction toward the second surface (e.g., the lower surface) 1044B of the first circuit board 1800.

[0714] The housing 1450 may include an escape region 1041 corresponding to a plurality of gaskets 1800B. The escape region 1041 may be formed at a location corresponding to the support member 1220 in order to avoid spatial interference between the housing 1450 and the support member 1220.

[0715] The protrusion 1043 of the housing 1450 may include a first opening 1046 configured to expose a portion of the first region 1801 of the first circuit board 1800 to the outside, and a second opening 1047 configured to expose a terminal 1080A formed at the terminal member 1085 to the outside.

[0716] For example, the second opening 1047 in the housing 1450 may be formed in the direction of the optical axis OA at the position of the opening 1141 in the housing 1140 corresponding to the AF operation unit 1100.

[0717] Referring to Figures 28 and 37, the first circuit board 1800 may include terminals 1080A of terminals K1 to K6 of the circuit board 1190 corresponding to the AF operation unit 1100.

[0718] Each of the terminals 1080A of the first circuit board 1800 can be coupled to one of the corresponding terminals K1 to K6 of the circuit board 1190 of the AF operation unit 1100 via solder or conductive components.

[0719] Each of the terminals 1080A of the first circuit board 1800 can be electrically connected to a corresponding terminal K1 to K6 of the circuit board 1190 of the AF operation unit 1100. A drive signal or power can be supplied to the first position sensor 1170 via the first circuit board 1800, and the output of the first position sensor 1170 can be output to the first circuit board 1800. Furthermore, a drive signal or power can be supplied to the first coil 1120 via the first circuit board 1800.

[0720] Referring to FIG28, the first circuit board 1800 may include a connector disposed in the second region 1802. For example, the connector may be disposed on a surface (e.g., the lower surface or the upper surface) of the second region 1802 of the first circuit board 1800.

[0721] The housing 1450 may include a placement portion 1008A in which the magnet 1023 is housed, placed, or positioned. The placement portion 1008A may be located at the body 1042 of the housing 1450.

[0722] For example, the placement portion 1008A may be formed in a corner of the housing 1450. For example, the placement portion 1008A may be configured to have a groove recessed from the lower surface of the housing 1042, and may have a shape corresponding to the magnet 1023. For example, although the housing 1450 may include placement portions 1008A respectively formed in the four corners of the housing 1450, the present invention is not limited thereto. In another embodiment, the housing 1450 may include a plurality of placement portions corresponding to the number of magnets 1023.

[0723] The magnet 1023 may be disposed at the housing 1450. For example, although the magnet 1023 may be disposed at a corner of the housing 1140, the invention is not limited thereto. In another embodiment, the magnet 1023 may be disposed at a side portion of the housing 1450.

[0724] The magnet 1023 can be used to supply a magnetic field that interacts with the second coil 1230 to perform optical image stabilization (OIS) for the purpose of interlocking correction.

[0725] For example, magnet 1023 may include a plurality of magnets 1023A to 1023D. Each of magnets 1023A to 1023D may be positioned at a corresponding corner of housing 1450.

[0726] Although each of magnets 1023A to 1023D may be a unipolar magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of magnets 1023A to 1023D may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0727] For example, each of the four magnets 1023A to 1023D may be positioned at a corresponding one of the four corners of the housing 1450. For example, although two magnets (e.g., 1023A and 1023B) positioned at two adjacent corners of the housing 1450 may be oriented to be perpendicular to each other, and two magnets (e.g., 1023A and 1023C; 1023B and 1023D) positioned at two corners of the housing 1450 facing each other diagonally may be oriented to be parallel to each other, the invention is not limited thereto.

[0728] For example, the internal portions of magnets 1023A to 1023D may have the same polarity. In addition, the external portions of magnets 1023A to 1023D may have the same polarity.

[0729] For example, the internal portion of each of magnets 1023A to 1023D may be magnetized as the N pole, and the external portion of each of magnets 1023A to 1023D may be magnetized as the S pole. In a modification, the internal portion of each of magnets 1023A to 1023D may be magnetized as the S pole, and the external portion of each of magnets 1023A to 1023D may be magnetized as the N pole.

[0730] Referring to Figures 36 to 40, the second circuit board 1900 may be disposed below the first circuit board 1800. The second circuit board 1900 may include a third circuit board 1250 and a fourth circuit board 1260. The fourth circuit board 1260 may alternatively be referred to as a "connector board".

[0731] For example, the third circuit board 1250 may be placed below the first circuit board 1800.

[0732] The third circuit board 1250 may have a hole 1501 corresponding to or facing the hole in the spool 1110, the hole in the housing 1450 and / or the hole 1800A in the first circuit board 1800.

[0733] ​​For example, the hole 1501 in the third circuit board 1250 can be a through hole, which is formed by passing through the third circuit board 1250 in the optical axis direction and can be located at the center of the third circuit board 1250.

[0734] Although the shape of the third circuit board 1250 (e.g., the outer peripheral shape) may be the same as or correspond to the upper surface of the substrate 1210 when viewed from above, the present invention is not limited thereto.

[0735] Furthermore, although the hole 1501 in the third circuit board 1250 may have a polygonal shape, such as a quadrilateral shape, a circular shape or an elliptical shape, the present invention is not limited thereto.

[0736] The third circuit board 1250 may have a plurality of holes 1250A corresponding to a plurality of pads 1800B of the first circuit board 1800. Although the plurality of holes 1250A in the third circuit board 1250 may be through holes formed through the third circuit board 1250 in the direction of the optical axis OA, the present invention is not limited thereto. In another embodiment, the plurality of holes in the third circuit board 1250 may be outgoing grooves or outgoing portions configured to avoid spatial interference with the support member 1220.

[0737] For example, a plurality of holes 1250A in the third circuit board 1250 may be configured to surround the holes 1501 in the third circuit board 1250 and be spaced apart from each other at regular intervals. For example, a plurality of holes 1250A may be formed in the holes 1501 in the third circuit board 1250 and in the side of the third circuit board 1250.

[0738] The third circuit board 1250 may have at least one coupling hole 1025A configured to couple to the protrusion 1273 of the holder 1270. Although the coupling hole 1025A in the third circuit board 1250 may be a through hole formed through the third circuit board 1250 in the optical axis direction, the present invention is not limited thereto. In another embodiment, the coupling hole 1025A may be in the form of a recess.

[0739] For example, although the coupling hole 1025A may be formed in at least one of the corners of the third circuit board 1250, the present invention is not limited thereto. The coupling hole 1025A may also be positioned adjacent to the side of the third circuit board 1250 or between the side of the third circuit board 1250 and the hole 1501.

[0740] Referring to FIG. 40, the third circuit board 1250 may include a plurality of terminals 1251. For example, the plurality of terminals 1251 may be disposed on a second surface 1051B (e.g., a lower surface) of the third circuit board 1250 and spaced apart from each other. The second surface 1051B may be a surface opposite to the first surface 1051A. The number of terminals 1251 is not limited to the number shown in FIG. 40, and may be greater than or less than the number of terminals shown in FIG. 40.

[0741] For example, a plurality of terminals 1251 may be disposed in the area between a hole 1501 in the third circuit board 1250 and one side of the third circuit board 1250. For example, a plurality of terminals 1251 may be disposed closer to the hole 1501 in the third circuit board 1250 than a plurality of holes 1250A.

[0742] The third circuit board 1250 may include pads 1009A to 1009H configured to be conductively connected to the second coil 1230. Here, the pads may be alternatively referred to as "terminals" or "connection portions". The pads 1009A to 1009H of the third circuit board 1250 may be conductively connected to a plurality of terminals 1251 of the third circuit board 1250.

[0743] The third circuit board 1250 may be a printed circuit board or a flexible printed circuit board (FPCB).

[0744] The second coil 1230 may be disposed or mounted on the first surface (e.g., the upper surface) 1051A of the third circuit board 1250.

[0745] The second coil 1230 may be placed below the outer casing 1450. The second coil 1230 may be placed below the magnet 1023.

[0746] For example, the second coil 1230 may be mounted on the circuit board 1250 so as to correspond to, face or overlap with the magnet 1023 mounted on the housing 1450 in the direction of the optical axis OA.

[0747] For example, the second coil 1230 may include a plurality of coil units 1230-1 to 1230-4. For example, the second coil 1230 may include four coil units.

[0748] Each of the plurality of coil units 1230-1 to 1230-4 may be arranged facing or overlapping one of the magnets 1023A to 1023D at the housing 1450 in the direction of the optical axis OA.

[0749] Although each of the coil units may have the form of a coil block having a closed curve shape or a loop shape, the invention is not limited thereto. For example, each of the coil units may consist of a fine pattern (FP) coil. In another embodiment, the coil unit may be formed at an additional circuit component other than the third circuit board 1250. In another embodiment, the coil unit may be formed directly in the circuit board 1250.

[0750] For example, four coil units 1230-1 to 1230-4 may be placed or formed at the corners or corner areas of the quadrilateral circuit board 1250.

[0751] The second coil 1230 can be electrically connected to the third circuit board 1250, and therefore power or drive signals can be supplied to the second coil 1230 via the third circuit board 1250. The power or drive signals supplied to the second coil 1230 can be DC signals, AC signals, or signals containing both DC and AC components, and can be voltage or current type.

[0752] Here, current can be applied independently to at least three of the four coil units.

[0753] In the first embodiment, the second coil 1230 can be controlled via three channels.

[0754] For example, only the first to third coil units among the first to fourth coil units are electrically isolated from each other, and the fourth coil unit can be electrically connected in series with one of the first to third coil units. Here, three pairs of leads (i.e., a total of six leads) can be drawn from the second coil 1230.

[0755] In the second embodiment, the second coil 1230 can be controlled via four individual channels. Here, the four coil units can be electrically isolated from each other. One of a forward current and a reverse current can be selectively applied to each of the coil units. Here, four pairs of leads (i.e., a total of eight leads) can be drawn from the second coil 1230.

[0756] For example, two coil units 1230-1 and 1230-3 facing each other diagonally may extend or be oriented in a first axial direction (e.g., in the y-axis direction), and two other coil units 1230-2 and 1230-4 facing each other diagonally may extend or be oriented in a second axial direction (e.g., in the x-axis direction). Here, the first axial direction may be perpendicular to the second axial direction.

[0757] The long side of the first coil unit 1230-1 and the long side of the third coil unit 1230-3 may be arranged parallel to each other. The long side of the second coil unit 1230-2 and the long side of the fourth coil unit 1230-4 may be arranged parallel to each other. The long side of the first coil unit 1230-1 and the long side of the second coil unit 1230-2 may not be arranged parallel to each other. Here, the long side of the first coil unit 1230-1 and the long side of the second coil unit 1230-2 may be arranged such that imaginary lines extending from them intersect each other. For example, the direction oriented by the first coil unit 1230-1 and the direction oriented by the second coil unit 1230-2 may be perpendicular to each other.

[0758] In another embodiment, at least one of the four coil units may be driven independently of the remaining coil units. In another embodiment, the four coil units may be driven individually.

[0759] For example, the first coil unit 1230-1 may be connected at one end to the first pad 1009A and at the other end to the second pad 1009B. A first drive signal may be supplied to the first pad 1009A and the second pad 1009B to activate the first coil unit 1230-1.

[0760] The third coil unit 1230-3 may be connected at one end to the third pad 1009C and at the other end to the fourth pad 1009D. A second drive signal may be supplied to the third pad 1009C and the fourth pad 1009D to start the third coil unit 1230-3.

[0761] The second coil unit 1230-2 may be connected at one end to the fifth pad 1009E and at the other end to the sixth pad 1009F. A third drive signal may be supplied to the fifth pad 1009E and the sixth pad 1009F to start the second coil unit 1230-2.

[0762] The fourth coil unit 1230-4 may be connected at one end to the seventh pad 1009G and at the other end to the eighth pad 1009H. A fourth drive signal may be supplied to the seventh pad 1009G and the eighth pad 1009H to start the fourth coil unit 1230-4.

[0763] In one embodiment, two coil units (e.g., 1230-1 and 1230-3) facing each other diagonally can be directly connected in series and can be started by a single drive signal. At the same time, two coil units (e.g., coil unit 1230-2 and coil unit 1230-4) facing each other diagonally can be electrically isolated from each other and can be started individually by different drive signals.

[0764] In another embodiment, the four coil units 1230-1 to 1230-4 may be electrically isolated from each other and may be individually activated by different individual drive signals.

[0765] By means of the interaction between magnets 1023A to 1023D and coil units 1230-1 to 1230-4 to which the drive signal is applied, the OIS movable unit including the image sensor 1810 can be moved in a second direction and / or a third direction (e.g., in the x-axis direction and / or in the y-axis direction), thereby performing handshake correction. A description of the OIS movable unit will be given later.

[0766] The image sensor unit 1350 may further include a second position sensor 1240 for feedback on OIS operation.

[0767] The second position sensor 1240 may be disposed, coupled, or mounted to the first surface (e.g., the upper surface) 1051A of the third circuit board 1250. The second position sensor 1240 may detect the displacement of the OIS movable unit in a direction perpendicular to the optical axis OA, such as displacement or tilting of the OIS movable unit in a direction perpendicular to the optical axis, or rotation of the OIS movable unit about the optical axis.

[0768] Here, the first position sensor 1170 may be alternatively referred to as "AF position sensor" and the second position sensor 1240 may be alternatively referred to as "OIS position sensor".

[0769] The second position sensor 1240 may include one or more sensors 1240a, 1240b and 1240c.

[0770] For example, the second position sensor 1240 may include three sensors 1240a, 1240b and 1240c.

[0771] Each of the first to third sensors 1240a, 1240b and 1240c may be implemented as a single Hall sensor or as a driver IC including a Hall sensor. The description of the first position sensor 1170 may be applied to the first to third sensors 1240a, 1240b and 1240c with or without modifications.

[0772] Each of the first to third sensors 1240a, 1240b, and 1240c can be electrically connected to a predetermined corresponding terminal in the terminal 262 of the first circuit board 1250. For example, a drive signal can be applied to each of the first to third sensors 1240a, 1240b, and 1240c via terminal 1251, and the output signal of each of the first to third sensors can be output to other predetermined terminals in terminal 1251.

[0773] For example, since the four coil units 1230-1 to 1230-4 are controlled via three channels, each of the first to third sensors 1240a, 1240b and 1240c can be placed in one of the corresponding three coil units 1230-1 to 1230-3, and the remaining coil unit 1230-4 may not have a sensor.

[0774] For example, each of the coil units 1230-1 to 1230-4 can be configured as a ring having an opening, hole, or cavity therein. For example, each of the first to third sensors 1240a, 1240b, and 1240c can be disposed in an opening, hole, or cavity in a corresponding one of the coil units 1230-1 to 1230-3.

[0775] For example, coil units 1230-1 to 1230-4 and sensors 1240a, 1240b and 1240c may be mounted on the same flat surface as the first surface of the first circuit board 1900.

[0776] All movement of the image sensor 1810 in the x-axis and y-axis directions and rotation of the image sensor 1810 about the z-axis can be detected by three sensors 1240a, 1240b and 1240c.

[0777] One of the three sensors 1240a, 1240b, and 1240c (e.g., 1240a) can detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction. Another of the three sensors 1240a, 1240b, and 1240c (e.g., 1240b) can detect the amount of movement and / or displacement of the OIS movable unit in the y-axis direction. The remaining one of the three sensors 1240a, 1240b, and 1240c can detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction and / or in the y-axis direction. It is possible to use the output of two or more of the three sensors 1240a, 1240b, and 1240c to detect the rotational movement of the OIS movable unit about the z-axis.

[0778] When a drive signal (e.g., drive current) is applied to the first coil unit 1230-1 and the third coil unit 1230-3 but not to the second coil unit 1230-2 or the fourth coil unit 1230-4, the direction of the first electromagnetic force obtained by the interaction between the first coil unit 1230-1 and the first magnet 1023A and the direction of the third electromagnetic force obtained by the interaction between the third coil unit 1230-3 and the third magnet 1023C can be the same direction, for example, the x-axis direction (e.g., the +x-axis direction or the -x-axis direction), and the OIS movable unit can move (displace) in the x-axis direction (e.g., in the +x-axis direction or the -x-axis direction).

[0779] For example, when a drive signal (e.g., drive current) is applied to the second coil unit 1230-2 and the fourth coil unit 1230-4 but not to the first coil unit 1230-1 or the third coil 1230-3, the direction of the second electromagnetic force obtained by the interaction between the second coil unit 1230-2 and the second magnet 1023B and the direction of the fourth electromagnetic force obtained by the interaction between the fourth coil unit 1230-4 and the fourth magnet 1023D can be the same direction, for example, the y-axis direction (e.g., the +y-axis direction or the -y-axis direction), and the OIS movable unit can move (displace) in the y-axis direction (e.g., in the +y-axis direction or the -y-axis direction).

[0780] For example, when a drive signal is applied to each of the first to fourth coil units 1230-1 to 1230-4, the direction of the first electromagnetic force is opposite to the direction of the third electromagnetic force, the direction of the second electromagnetic force is opposite to the direction of the fourth electromagnetic force, and the rotation direction of the OIS movable unit due to the first and third electromagnetic forces is the same as the rotation direction of the OIS movable unit due to the second and fourth electromagnetic forces. The OIS movable unit can rotate or roll about the optical axis or the z-axis.

[0781] When the second coil 1230 is controlled via three channels, it is possible to use the first coil unit 1230-1 and the third coil unit 1230-3 or the second coil unit 1230-2 and the fourth coil unit 1230-4 to make the OIS movable unit sway.

[0782] In the embodiments shown in Figures 39A and 39B, the second position sensor 1240 may include three sensors 1240a, 1240b and 1240c.

[0783] For example, the first sensor 1240a may be disposed on the first surface (e.g., the upper surface) 1051A of the circuit board 1250 in the first coil unit 1230-1, the third sensor 1240c may be disposed on the first surface (e.g., the upper surface) 1051A of the circuit board 1250 in the third coil unit 1230-3, and the second sensor 1240b may be disposed on the upper surface of the circuit board 1250 in the second coil unit 1230-2.

[0784] For example, although the first sensor 1240a may not overlap with the first coil unit 1230-1 in the direction of the optical axis OA, the third sensor 1240c may not overlap with the third coil unit 1230-3 in the direction of the optical axis OA, and the second sensor 1240b may not overlap with the second coil unit 1230-2 in the direction of the optical axis OA, the present invention is not limited thereto. In another embodiment, the sensors and coil units may at least partially overlap each other in the direction of the optical axis.

[0785] The first sensor 1240a may overlap with the magnet 1023A in the optical axis direction, the third sensor 1240c may overlap with the magnet 1023C in the optical axis direction, and the second sensor 1240b may overlap with the magnet 1023B in the optical axis direction.

[0786] Furthermore, the first sensor 1240a may overlap with the first coil unit 1230-1 in a direction perpendicular to the optical axis OA, the third sensor 1240c may overlap with the third coil unit 1230-3 in a direction perpendicular to the optical axis OA, and the second sensor 1240b may overlap with the second coil unit 1230-2 in a direction perpendicular to the optical axis OA. In another embodiment, the sensors and coil units may not overlap each other in a direction perpendicular to the optical axis OA.

[0787] In another embodiment, the second position sensor 1240 may include a first sensor and a second sensor. In another embodiment, one of the first sensor 1240a and the third sensor 1240c may be omitted.

[0788] The image sensor unit 1350 may include at least one of a motion sensor 1820, a controller 1830, a memory 1512, and a capacitor 1514.

[0789] The motion sensor 1820, controller 1830, memory 1512 and capacitor 1514 may be disposed or installed in one of the first circuit board 1800 and the third circuit board 1250.

[0790] For example, motion sensor 1820 and memory 1512 may be mounted on the second surface 1044B of first circuit board 1800, and controller 1830 and capacitor 1514 may be mounted on the first surface 1051A of third circuit board 1250.

[0791] The motion sensor 1820 can be electrically connected to the controller 1830 via wires or circuit patterns formed on the third circuit board 1250.

[0792] The motion sensor 1820 can output information about the rotational angular velocity caused by the motion of the camera module 1010. The motion sensor 1820 can be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0793] The memory 1512 can store code values ​​for AF feedback operation based on the displacement of the spool 1110 in the optical axis direction. Furthermore, the memory 1512 can store code values ​​for OIS feedback operation based on the displacement of the OIS movable unit in the direction perpendicular to the optical axis direction. Additionally, the memory 1512 can store algorithms or programs for the operation of the controller 1830.

[0794] In addition, memory 1512 can store a correction value CV. The correction value CV may also be referred to as an "error correction value". A description of the correction value CV will be given later.

[0795] For example, although memory 1512 may be, for example, electrically erasable programmable read-only memory (EEPROM), the present invention is not limited thereto.

[0796] The controller 1830 can be electrically connected to the first position sensor 1170 and the second position sensor 1240.

[0797] The controller 1830 can control the output signal of the first position sensor 1170 and the drive signal supplied to the first coil 1120 using the first code value stored in the memory 1512, thereby performing a feedback autofocus operation.

[0798] In addition, the controller 1830 can control the output signal supplied from the second position sensor 1240 and the drive signal supplied to the second coil 1230 using the second code value stored in the memory 1512, thereby performing feedback OIS operation.

[0799] Although the controller 1830 may be a type of driver IC, the present invention is not limited thereto. For example, the controller 1830 may be electrically connected to terminal 1251 of the first circuit board 1250.

[0800] The fourth circuit board 1260 may be placed below the third circuit board 1250. The fourth circuit board 1260 may alternatively be referred to as the "third circuit board".

[0801] Although the fourth circuit board 1260 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the invention is not limited thereto. In another embodiment, the fourth circuit board 1260 may be formed to have a circular or elliptical shape.

[0802] For example, the surface area of ​​the front surface of the fourth quadrilateral circuit board 1260 may be greater than the surface area of ​​the hole 1501 in the third circuit board 1250. For example, the lower side of the hole 1501 in the third circuit board 1250 may be closed or blocked by the fourth circuit board 1260.

[0803] When viewed from above or below, the outer surface (or outer side) of the fourth circuit board 1260 may be positioned between the outer surface (or outer side) of the third circuit board 1250 and the hole 1501 in the third circuit board 1250.

[0804] The fourth circuit board 1260 may include a mounting area 1260A for housing the image sensor 1810. For example, a first surface (e.g., the upper surface) 1060A of the fourth circuit board 1260 may have a mounting area 1260A in which the image sensor 1810 is mounted or coupled. For example, the mounting area 1260A may be positioned to align with a hole 1501 in the third circuit board 1250.

[0805] Referring to Figures 39A and 39B, the fourth circuit board 1260 may include a first terminal 1261 configured to be conductively connected to a terminal 1251 of the third circuit board 1250. The first terminal 1261 may alternatively be referred to as a "first terminal portion" or a "first terminal unit". For example, the first terminal 1261 may include a plurality of first terminals.

[0806] For example, the first terminal 1261 of the fourth circuit board 1260 may be coupled to the terminal 1251 of the third circuit board 1250 via solder or conductive adhesive.

[0807] For example, the first terminal 1261 of the fourth circuit board 1260 may be disposed on the first surface (e.g., the upper surface) 1060A of the fourth circuit board 1260, and may correspond to, face or overlap the terminal 1251 of the third circuit board 1250 in the optical axis direction.

[0808] Referring to FIG40, the fourth circuit board 1260 may include a second terminal 1262 electrically connected to the connecting elastic member 1280. The second terminal 1262 may alternatively be referred to as a "second terminal portion" or a "second terminal unit".

[0809] For example, the second terminal 1262 of the fourth circuit board 1260 may be coupled to the connecting elastic member 1280 via solder 1038 (see FIG. 41) or conductive adhesive. For example, the second terminal 1262 may include a plurality of second terminals.

[0810] For example, the second terminal 1262 of the fourth circuit board 1260 may be disposed on the second surface (e.g., the lower surface) 1060B of the fourth circuit board 1260, and may correspond to, face or overlap the connecting spring 1281 of the connecting elastic member 1280 in the optical axis direction. The second surface 1060B may be the surface opposite to the first surface 1060A.

[0811] Although the fourth circuit board 1260 may be a printed circuit board or an FPCB, the present invention is not limited thereto.

[0812] The retainer 1270 may be positioned below the third circuit board 1250 to support the third circuit board 1250. For example, the second surface 1051B of the third circuit board 1250 may contact the upper surface of the retainer 1270.

[0813] For example, the retainer 1270 may be positioned between the third circuit board 1250 and the connecting elastic member 1280.

[0814] The retainer 1270 may include a protrusion 1276 that protrudes from its upper surface toward the third circuit board 1250. The protrusion 1276 may be used to support the lateral side surfaces of the third circuit board 1250, or may serve as an assembly guide configured to allow the third circuit board 1250 to be easily placed or positioned at the retainer 1270. The protrusion 1276 may alternatively be referred to as a "guide portion" or "guide protrusion".

[0815] With the third circuit board 1250 placed on the holder 1270, the protrusion 1276 may contact the outer surface of the third circuit board 1250. For example, the protrusion 1276 may include a plurality of (e.g., four) protrusions, and the plurality of protrusions 1276 may contact all four outer surfaces of the third circuit board 1250.

[0816] For example, although the protrusion 1276 is shown in FIG39A as being formed on the outer surface of the sides of the retainer 1270 facing each other, the invention is not limited thereto.

[0817] When viewed from above, although the outer periphery of the retainer 1270 may have a quadrilateral shape, such as a square or rectangular shape, the invention is not limited thereto. In another embodiment, the outer periphery of the retainer 1270 may have a circular or elliptical shape.

[0818] The retainer 1270 may include a protrusion 1273 corresponding to or facing a coupling hole 1025A in the third circuit board 1250. The protrusion 1273 on the retainer 1270 may protrude from a first surface 1070A of the retainer 1270 and may be coupled to the coupling hole 1025A in the third circuit board 1250. The retainer 1270 and the third circuit board 1250 may be coupled to each other. The first surface 1070A of the retainer 1270 may be a surface facing a second surface 1060B of the third circuit board 1250.

[0819] The holder 1270 may have a hole 1071 corresponding to the fourth circuit board 1260.

[0820] Although the hole 1071 in the retainer 1270 may have a quadrilateral shape, such as a square or rectangular shape, the present invention is not limited thereto. In another embodiment, the hole 1071 may have a circular or elliptical shape.

[0821] For example, although the hole 1071 in the holder 1270 may have a shape that is consistent with or the same as the shape of the fourth circuit board 1260, the present invention is not limited thereto. The size or surface area of ​​the hole 1071 in the holder 1270 may be larger than the size or surface area of ​​the first surface 1060A or the second surface 1060B of the fourth circuit board 1260. The fourth circuit board 1260 may be disposed inside the hole 1071 in the holder 1270.

[0822] For example, the retainer 1270 may be shaped to surround the fourth circuit board 1260.

[0823] The holder 1270 may have a plurality of holes 1270A corresponding to a plurality of holes 1250A in the third circuit board 1250. Although the plurality of holes 1270A in the holder 1270 may be through holes formed in the holder 1270 in the direction of the optical axis OA, the present invention is not limited thereto. In another embodiment, the plurality of holes 1270A in the holder 1270 may be recesses or portions to avoid spatial interference with the support member 1220.

[0824] For example, a plurality of holes 1270A in the retainer 1270 may be configured to surround the hole 1071 in the retainer 1270 and be spaced apart from each other at regular intervals. For example, the plurality of holes 1270A may be located in the area between the hole 1071 in the retainer 1270 and the side of the retainer 1270.

[0825] Referring to FIG40, the second surface 1070B of the retainer 1270 may have a protrusion 1275. The protrusion 1275 of the retainer 1270 may protrude from the second surface 1070B of the retainer 1270 toward the bottom of the substrate 1210.

[0826] The protrusion 1275 of the retainer 1270 may protrude further than the connecting elastic member 1280 in the direction toward the bottom of the substrate 1210. Alternatively, the protrusion 1275 of the retainer 1270 may protrude further than the solder 1902 that couples the connecting elastic member 1280 to the support member 1220 in the direction toward the bottom of the substrate 1210.

[0827] For example, the first distance in the optical axis direction between the protrusion 1275 of the retainer 1270 and the bottom of the substrate 1210 may be less than the second distance between the connecting elastic member 1280 and the bottom of the substrate 120. For example, the first distance may be less than the third distance between the solder 1902 and the bottom of the substrate 120.

[0828] The protrusion 1275 can act as a stop, which is configured to prevent the second surface 1070B of the retainer 1270, the connecting elastic member 1280 and / or the solder 1902 from directly colliding with the bottom of the substrate 1210.

[0829] For example, although the protrusion 1275 may be located at the corner of the second surface 1070B of the retainer 1270, the present invention is not limited thereto. In another embodiment, the protrusion 1275 may be located on the side of the second surface 1070B of the retainer 1270 or between the side of the second surface 1070B of the retainer 1270 and the hole 1071.

[0830] Referring to FIG42, the retainer 1270 may have at least one groove 1272 recessed from the second surface 1070B of the retainer.

[0831] For example, the retainer 1270 may have a plurality of grooves (e.g., four grooves) corresponding to a plurality of sides (e.g., four sides) of the second surface 1070B.

[0832] Each of the grooves 1272 may include a bottom 1272a and a sidewall 1272b, the bottom having a height difference relative to the second surface 1070B in the direction of the optical axis OA, and the sidewall connecting the bottom 1272a to the second surface 1070B.

[0833] For example, the bottom 1272a of the groove 1272 may be positioned closer to the first surface 1070A of the holder 1270 than to the second surface 1070B of the holder 1270.

[0834] A plurality of holes 1270A in the retainer 1270 may overlap with a groove 1272 in the retainer 1270 in the optical axis direction. For example, each of the plurality of holes 1270A may have an opening formed in the bottom 1272a of the groove 1272. The opening of each of the plurality of holes 1270A formed in the bottom 1272a may have a height difference relative to the second surface 1070B of the retainer 1270 in the optical axis direction.

[0835] For example, a plurality of holes 1270A may be formed by passing through the bottom 1272a of the groove 1272 in the retainer 1270.

[0836] Here, the groove 1272 in the retainer 1270 can be used to avoid spatial interference between the connecting elastic member 1280 and the retainer 1270, so as to allow easy elastic deformation when the connecting elastic member 1280 elastically deforms during OIS operation.

[0837] The connecting elastic member 1280 may be coupled to the holder 1270. The connecting elastic member 1280 may be used to allow movement of the OIS movable unit and to allow the transmission of conductive signals. For example, the connecting elastic member 1280 may conductively connect the support member 1220 to the terminal 1262 of the fourth circuit board 1260.

[0838] For example, the connecting elastic member 1280 may be located below the retainer 1270.

[0839] The connecting elastic member 1280 can be coupled to the second surface 1070B of the retainer 1270 via an adhesive member or the like.

[0840] The connecting elastic member 1280 can electrically connect the support member 1220 to the fourth circuit board 1260, and may include an elastically deformable portion. The elastically deformable portion of the connecting elastic member 1280 may be coupled to the support member 1220.

[0841] The connecting elastic member 1280 may include a connecting spring 1281 corresponding to the support member 1220 (see FIG. 40). The description of the connecting spring 1281 shown in FIG. 18 may be applied to the connecting spring 1281 with or without modifications.

[0842] For example, the connecting elastic member 1280 may include a plurality of connecting springs 1281. The plurality of connecting springs 1281 may correspond to individual support members 1220. The plurality of connecting springs 1281 may be arranged to be electrically isolated from or electrically spaced from each other.

[0843] Each of the connecting springs 1281 may include a first coupler 31 coupled to a second terminal 1262 of a fourth circuit board 1260, a second coupler 32 coupled to a support member 1220, and a connector 33 connecting the first coupler 31 to the second connector 32.

[0844] The first coupler 31 of the connecting spring 1281 may be supported by the retainer 1270. For example, the first coupler 31 may be disposed on the second surface 1070B of the retainer 1270 and may be supported by the second surface 1070B of the retainer 1270.

[0845] For example, the first coupler 31 may be disposed on the second surface 1070B of the holder 1270 adjacent to at least one recess 1272 in the holder 1270.

[0846] For example, the first coupler 31 may include: a first portion 31a, which is supported by the retainer 1270 and connected to the connector 33; and a second portion 31b, which is connected to the first portion 31a and coupled to the second terminal 1262 of the fourth circuit board 1260.

[0847] For example, a first portion 31a of the first coupler 31 may overlap with the second surface 1070B of the holder 1270 in the optical axis direction, and a second portion 31b may not overlap with the second surface 1070B of the holder 1270 in the optical axis direction. At least a portion of the second portion 31b of the first coupler 31 may overlap with the second terminal 1252 of the fourth circuit board 1260 in the optical axis direction. For example, the second portion 31b may protrude from the inner surface of the holder 1270 in the direction toward the second terminal 1252 of the fourth circuit board 1260.

[0848] The second coupler 32 may be coupled to one end (e.g., the lower end) of the support member 1220 via solder 1902 or a conductive adhesive component. For example, the second coupler 32 may be positioned to overlap with a hole 1270A in the holder 1270 in the optical axis direction. The second coupler 32 may have a hole 32A through which the support member 1220 extends.

[0849] The end of the support member 1220 that has passed through the hole 32A in the second coupler 32 can be directly coupled to the second coupler 32 via a conductive adhesive member or solder 1902, thereby the second coupler 32 can be electrically connected to the support member 1220.

[0850] For example, the second coupler 32 (which is the area for housing solder 1902 for coupling to the support member 1220) may include a hole 32A and an area surrounding the hole 32A. Although the second coupler 32 may be configured to have a circular shape, the invention is not limited thereto. In another embodiment, the second coupler 32 may be configured to have a polygonal shape (e.g., a quadrilateral shape) or an elliptical shape.

[0851] The second coupler 32 and connector 33 may overlap with the groove 1272 in the holder 1270 in the optical axis direction. For example, the second coupler 32 and connector 33 may be disposed in the groove 1272 in the holder 1270. For example, the second coupler 32 and / or connector 33 may be disposed to be spaced apart from the holder 1270.

[0852] For example, the connecting elastic member 1280 may include four groups 1001A, 1002A, 1003A and 1004A corresponding to the four side portions (lateral side surfaces) of the first circuit board 1260 or the four side portions (or lateral side surfaces) of the retainer 1270.

[0853] Each of the plurality of groups 1001A, 1002A, 1003A and 1004A may include a plurality of connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9.

[0854] Furthermore, the terminals 262 of the fourth circuit board 1260 can be classified into a plurality of groups corresponding to groups 1001A to 1004A of the connecting elastic member 1280. Each of the plurality of groups of the fourth circuit board 1260 may include a plurality of terminals P1 to P9, S1 to S9, R1 to R9 or Q1 to Q9.

[0855] For example, each of the plurality of terminals P1 to P9, S1 to S9, R1 to R9 and Q1 to Q9 of the fourth circuit board 1260 can be coupled via solder to a corresponding one of the plurality of connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9.

[0856] The description of groups 1A, 2A, 3A and 4A of the connecting elastic member 280 shown in FIG15 may be applied to groups 1001A, 1002A, 1003A and 1004A of the connecting elastic member 1280 shown in FIG43 with or without modification.

[0857] Referring to FIG41, the connecting elastic member 1280 may further include a body 1085A and an insulating member 1285 including an extension 1085B. The connecting elastic member 1280 may further include one or more dummy members (or dummy patterns) 1028-1 to 1028-4. The description of the insulating member 285 and the dummy members 28-1 to 28-4 may be applied to the insulating member 1285 and the dummy members 1028-1 to 1028-4 with or without modifications.

[0858] For example, the insulating component 1285 may support the connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9, and may be coupled or attached to the second surface 1070B of the retainer 1270.

[0859] For example, the insulating component 1285 may have holes or cavities. The holes or cavities in the insulating component 1285 may correspond to, overlap or align with the holes 1800A in the first circuit board 1800, the holes 1501 in the third circuit board 1250 and the holes 1071 in the holder 1270 in the optical axis direction.

[0860] For example, the body 1085A may have a hole or cavity that corresponds to, overlaps with or aligns with at least one of the holes 1800A in the first circuit board 1800, 1501 in the third circuit board 1250 and 1071 in the holder 1270 in the optical axis direction.

[0861] The extension 1085B may extend from the body 1085A toward the outer surface of the retainer 1270. For example, the extension 1085B may be positioned to surround the groove 1272 in the retainer 1270.

[0862] The support member 1220 can electrically connect the first circuit board 1800 to the connecting elastic member 1280.

[0863] The support member 1220 may include a plurality of groups corresponding to groups 1001A, 1002A, 1003A and 1004A of the connecting elastic member 1280. Each of the plurality of groups of the support member may include a plurality of support members (or wires).

[0864] For example, the support member 1220 may include a plurality of support members corresponding to a plurality of connecting springs. The support member 1220 may alternatively be referred to as a "wire".

[0865] The support member 1220 may be coupled to the first circuit board 1800 at one end and to the second coupler 32 of the connecting spring 1281 at the other end.

[0866] For example, one end of the support member 1220 may extend through a hole 1800B in the first circuit board 1800 and may be coupled to a first surface (e.g., upper surface) 1044A of the first circuit board 1800 via a first solder 1901, and the other end of the support member 1220 may extend through a hole 32A in a second coupler 32 connecting the spring 1281 and may be coupled to a lower portion or lower surface of the second coupler 32 via the first solder 1901. For example, one end of the support member 1220 may be coupled and electrically connected to a terminal 1800B of the first circuit board 1800.

[0867] The support member 1220 can extend through the exit area 1041 of the housing 1450, the hole 1250A in the third circuit board 1250 and the hole 270A in the holder 1270, and can avoid spatial interference with the housing 1450, the second circuit board 1250 and the holder 1270.

[0868] The support member 1220 may be implemented as a conductive member that provides elastic support, such as a sling, leaf spring or disc spring.

[0869] The image sensor unit 1350 may further include a filter 1610. The image sensor unit 1350 may further include a filter holder 1600 for placing, mounting, or housing the filter 1610. The filter holder 1600 may alternatively be referred to as a "sensor substrate".

[0870] Filter 1610 is used to prevent light in a certain frequency range from passing through the lens barrel 1400 from incident on the image sensor 1810. The description of the filter shown in FIG9 can be applied to filter 1610 with or without modification.

[0871] For example, the filter holder 1600 may be positioned below the AF operation unit 1100. For example, the filter holder 1600 may be positioned above the fourth circuit board 1260.

[0872] The filter holder 1600 may be coupled to the area surrounding the image sensor 1810 of the fourth circuit board and may be exposed via a hole 1800A in the first circuit board 1800 and a hole 1501 in the third circuit board 1250. For example, the filter holder 1600 may be visible via a hole 1800A in the first circuit board 1800 and a hole 1501 in the third circuit board 1250.

[0873] For example, the filter holder may be coupled to a region of the first surface (e.g., the upper surface) surrounding a placement area 1260A of the fourth circuit board 1260. Although the placement area 1260A is the same surface as the first surface of the fourth circuit board 1260 in FIG. 39A, the invention is not limited thereto. In another embodiment, the placement area 1260A may be a recess or a protrusion.

[0874] The hole 1501 in the third circuit board 1250 can expose the filter holder 1600 disposed at the fourth circuit board 1260 and the filter 1610 disposed at the filter holder 1600 through it.

[0875] The filter holder 1600 may have an aperture 1061A formed in the area where the filter 1610 is mounted or placed, so as to allow light passing through the filter 1610 to be incident on the image sensor 1810. The aperture 1061A in the filter holder 1600 may be in the form of a through-hole formed through the filter holder 1600 in the optical axis direction. For example, the aperture 1061A in the filter holder 1600 may be formed through the center of the filter holder 1600 so as to correspond to or face the image sensor 1810. The filter holder 1600 may have a mounting portion 1500 recessed from the upper surface of the filter holder to receive the filter 1610 therein. The filter 1610 may be placed, mounted, or installed in the mounting portion 1500. The mounting portion 1500 may be configured to surround the aperture 1061A. In another embodiment, the placement portion 1500 of the filter holder 1600 may be configured to have a protrusion extending from the upper surface of the filter 1610.

[0876] The image sensor 1350 may further include an adhesive member 1612 disposed between the filter 1610 and the mounting portion 1500. Therefore, the filter 1610 may be coupled to or attached to the filter holder 1600 via the adhesive member 1612. For example, the adhesive members 1612 and 1061 may be epoxy resin, thermosetting adhesive, or UV-curing adhesive.

[0877] The camera module 1010 may further include a cover 1300 and a base 1210 to house the AF operation unit 1100 and the image sensor unit 1350 therein, protect the AF operation unit 1100 and the image sensor unit 1350 from external impacts, and prevent the introduction of foreign substances from the outside.

[0878] The cover member 1300 can be configured to have the form of a box, which is open at its lower surface and includes a top plate 1301 and a side plate 1302. The lower portion of the side plate 1302 of the cover member 1300 can be coupled to the base 1210. The top plate 1301 of the cover member 1300 can be configured to have a polygonal shape, such as a quadrilateral or an octagonal shape.

[0879] The cover member 1300 may have a hole 1303 formed in its upper plate 1301 through which a lens (not shown) coupled to the spool 1110 is exposed to external light. One of the side plates 1302 of the cover member 1300 may have a hole 1304 through which a terminal member 1905 of the circuit board 1190 is exposed.

[0880] The base 1210 may be positioned below the retainer 1270. The base 1210 may have a shape that is consistent with or corresponds to the cover member 1300, such as a quadrilateral shape.

[0881] For example, although the substrate 1210 may have a hole in the form of a through hole formed through the substrate 1210 in an optical direction, the hole may be omitted in another embodiment.

[0882] The substrate 1210 may have steps 1211 (see FIG. 44A) to which adhesive is applied when the cover member 1300 is adhesively fixed. Here, the steps 1211 may guide the side plate 1302 of the cover member 1300 coupled thereto. The steps 1211 of the substrate 1210 may be attached or fixed to the lower end of the side plate 1302 of the cover member 1300 using adhesives or the like.

[0883] Although the lower portion or lower side of the base 1210 can be closed or blocked by the bottom cover 1219, the present invention is not limited thereto. In another embodiment, the bottom cover 1219 may be omitted.

[0884] The fixed portion and movable portion of the image sensor unit 1350 according to an embodiment will be described with respect to OIS operation.

[0885] The image sensor unit 1350 may include a fixed portion, a movable portion (or a resilient part), and resilient support members 1220 and 1280 configured to couple the fixed portion to and connect to the movable portion. The movable portion may alternatively be referred to as the "OIS movable portion" (or "OIS resilient part"). The OIS movable portion is movable relative to the fixed portion in a direction perpendicular to the optical axis OA.

[0886] With the aid of elastic support members 1220 and 1280, the movable part of the OIS, which is disposed below the fixed part of the OIS, can be positioned at a predetermined distance from the fixed part. In other words, the movable part can move relative to the fixed part by means of the electromagnetic force generated by the interaction between the magnet 1023 and the coil when the movable part is suspended from the fixed part via the support member 1220.

[0887] One end of the elastic support members 1220 and 1280 (e.g., one end of support member 1220) may be coupled to the first circuit board 1800, and the other end of the elastic support members 1220 and 1280 (e.g., the first coupler 31 connecting spring 1281) may be coupled to the second circuit board 1900, such as the fourth circuit board 1260.

[0888] The first circuit board 1800 can be electrically connected to the second circuit board 1900, such as the fourth circuit board 1260, via the elastic support members 1220 and 1280.

[0889] The movable part of the OIS can move relative to the fixed part in a direction perpendicular to the optical axis by means of the electromagnetic force generated by the interaction between the second coil 1230 and the magnet 1023.

[0890] For example, by means of the interaction between the magnet 1023 and the coil 1230, the image sensor 1810 can be displaced or tilted in a direction perpendicular to the optical axis OA, or can be rotated around the optical axis OA. For example, the optical axis direction can be a direction perpendicular to one surface of the image sensor 1810. For example, one surface of the image sensor 1810 can be the upper surface of the image sensor 1810. Alternatively, the one surface of the image sensor 1810 can be a surface corresponding to or facing the lower surface of the lens module 1400 or the filter 1610. For example, the one surface of the image sensor 1810 can be the active area.

[0891] With the aid of the support member 1220 and the connecting elastic member 1280, the OIS movable unit can be elastically supported and can move in a direction perpendicular to the optical axis.

[0892] The fixing portion may include a first circuit board 1800, a housing 1450, and a magnet 1023. Furthermore, the fixing portion may include at least one of a base 1210, a cover member 1300, and a bottom cover plate 1219. Additionally, the fixing portion may include elements coupled to the second circuit board 1800, such as a motion sensor 1820 and a capacitor.

[0893] The movable part of the OIS may include a third circuit board 1250, a second coil 1230, a fourth circuit board 1260, and an image sensor 1810. In addition, the movable part of the OIS may include a holder 1270.

[0894] In addition, the movable part of the OIS may include components coupled to the third circuit board 1250, such as the second position sensor 1240, motion sensor 1820, controller 1830, memory 1512, and capacitor 1514. In addition, the movable part of the OIS may include filter holder 1600 and filter 1610.

[0895] For example, the movable part of the OIS may include: a fourth circuit board 1260 coupled to a connecting elastic member 1280; an image sensor 1810; a third circuit board 1260 coupled to the fourth circuit board 1260; and a holder 1270 coupled to the third circuit board 1250 and elastically supported by a support member 1220 and a connecting elastic member 1280.

[0896] The magnet 1023 may be placed at the fixed part, and the second coil 1230 may be placed at the OIS movable unit. The OIS movable part may move or tilt relative to the fixed part by means of the electromagnetic force generated by the interaction between the magnet 1023 and the second coil 1230.

[0897] Referring to Figures 46 and 47, in order to allow the movable part of the OIS to move or tilt relative to the fixed part by means of the electromagnetic force generated by the interaction between the magnet 1023 and the second coil 1230, the movable part of the OIS may be spaced apart from the fixed part of the OIS.

[0898] For example, the holder 1270, the second circuit board 1900 and the image sensor 1810 may be spaced apart from the first circuit board 1800, the housing 1450 and the substrate 1210.

[0899] For example, at the initial position of the movable part of the OIS, the outer surface of the retainer 1270 may be spaced apart from the inner surface of the substrate 1210 by a predetermined distance d1.

[0900] Furthermore, at the initial position of the movable part of the OIS, the lower surface of the holder 1270 and the lower surface of the fourth circuit board 1260 may be spaced apart from the front surface (or upper surface) of the base 1210 by a predetermined distance H1. Furthermore, at the initial position of the movable part of the OIS, the lower surface of the holder 1270 and the lower surface of the fourth circuit board 1260 may be spaced apart from the front surface (or upper surface) of the bottom cover 1219.

[0901] For example, at the initial position of the OIS movable portion, the solder 1902 may be spaced apart from the front surface (or upper surface) of the bottom cover plate 1219 by a predetermined distance H2. In addition, at the initial position of the OIS movable portion, the solder 1902 may be spaced apart from the front surface (or upper surface) of the substrate 1210.

[0902] The initial position of the OIS movable unit may be the original position of the OIS movable part when no power is applied to the second coil 1230, or the position where the OIS movable unit is located due to the elastic deformation of the support member 1220 and the connecting elastic member 1280 only due to the weight of the OIS movable part.

[0903] In addition, the initial position of the movable part of the OIS can be the position where the movable part of the OIS is located when gravity acts in the direction from the first circuit board 1800 to the third circuit board 1250 or when gravity acts in the direction from the third circuit board 1250 to the first circuit board 1800.

[0904] Figure 49 illustrates the process of mounting the image sensor 1810, filter holder 1600 and filter 1610 onto the fourth circuit board 1260.

[0905] Referring to FIG49, the image sensor 1810 may first be coupled, fixed or attached to the placement area 1260A (S110) of the fourth circuit board 1260 via die bonding.

[0906] Although the image sensor 1810 may be one of a charge-coupled device (CCD), a metal-oxide-semiconductor MOS, a CPD image sensor, and a CID image sensor, the present invention is not limited thereto.

[0907] Subsequently, the image sensor 1810 may be connected to the fourth circuit board 1260 via wire 1088, so that the image sensor 1810 is electrically connected to the fourth circuit board 1260 (S120).

[0908] Subsequently, the filter holder 1600, on which the filter 1601 is mounted, can be mounted on the third circuit board 1260 via the adhesive member 1061 (S130). For example, the filter 1610 can be coupled to the filter holder 1600 via the adhesive member 1612, and then the filter holder 1600 can be coupled to the fourth circuit board 1260. In another embodiment, the filter holder 1600 can be coupled to the fourth circuit board 1260, and then the filter 1610 can be coupled to the filter holder 1600.

[0909] In a comparative example, the image sensor may be mounted on an additional sensor board, and then the sensor board may be connected to a fourth circuit board.

[0910] In this comparative example, the sensor board can be connected to the fourth circuit board via soldering. Soldering is an additional process and makes it difficult to connect the sensor board to the fourth circuit board. Furthermore, in this comparative example, noise can be generated at the image sensor, and the image sensor can be affected by noise during the process of soldering the sensor board to the fourth circuit board. In addition, in this comparative example, due to the tolerance stacking during the soldering process of the sensor board, alignment between the lens module and the image sensor, and between the lens module and the cover component, may be difficult.

[0911] In this embodiment, the sensor board in the comparative example is fused to the fourth circuit board to achieve a single integrated fourth circuit board 1260. In the example, the image sensor 1810 moves from above the image sensor unit 1350 to the fourth circuit board and is then bonded to the fourth circuit board 1260 via die bonding, and the image sensor is conductively connected to the fourth circuit board via wire bonding. Subsequently, the filter holder 1600 and the filter 1610 move from above the image sensor unit 1350 to the fourth circuit board 1260 and are coupled to the fourth circuit board 1260.

[0912] Compared to the comparative example, this embodiment simplifies the camera assembly process. Furthermore, it may reduce the number of solder joints in the signal path of the image sensor and may prevent the image sensor from becoming inoperable or suppress image noise.

[0913] Furthermore, compared to the comparative example, this embodiment simplifies the assembly process and thus eliminates tolerance stacking. Therefore, it is also advantageous for managing the alignment of the lens module 1400.

[0914] Furthermore, compared with the comparative example, this embodiment can provide the effect of reducing material costs and manufacturing costs by reducing the number of components and processes.

[0915] Although Figures 39A and 40 illustrate one embodiment in which the third circuit board 1250 and the fourth circuit board 1260 are separately arranged and the terminals 1251 of the third circuit board 1250 and the terminals 1261 of the fourth circuit board 1260 are coupled to each other to electrically connect the third circuit board 1250 to the fourth circuit board 1260, embodiments of the present invention are not limited thereto. In another embodiment, the third circuit board and the fourth circuit board may be integrally formed as a single board. Here, the terminals 1262 of the fourth circuit board may be formed on the rear surface of the single board and may be coupled to the connecting elastic member 1280.

[0916] The connecting elastic member 280-1 shown in FIG22 may be another embodiment of the connecting elastic member 1280. Therefore, the description of the connecting elastic member 280-1 shown in FIG22 may be applied to the connecting elastic member 1280 with or without modifications.

[0917] For example, the surface area of ​​the hole 79 in the board portion 280A may be greater than the surface area of ​​the second surface 1060B of the fourth circuit board 1260. For example, the hole in the board portion 280A may expose the second surface 1060B of the fourth circuit board 1260 and the terminal 262 of the fourth circuit board 1260.

[0918] The plate portion 280A can be placed on the second surface 1070B of the retainer 1270, and can be coupled or attached to the second surface 1070B of the retainer 1270 via adhesive components or the like.

[0919] In another embodiment, the image sensor unit 1350 shown in FIG29 may be used instead of the image sensor unit 250 shown in FIG23. For example, the camera module 20 according to another embodiment may include a lens module 1400 and an image sensor unit 1350, and the description of FIG23 may be applied with or without modifications.

[0920] For example, according to another embodiment, the lens module 1400 of the camera module 20 may not be movable in the optical axis direction, but may be fixed in the optical axis direction. For example, in another embodiment, the lens module 1400 may not be movable in the direction perpendicular to the optical axis and may be held in the direction perpendicular to the optical axis. The camera module 20 may further include the cover member 1300 shown in FIG. 29. For example, the lens module 1400 may be coupled, attached, or fixed to the holder 1600 or the first circuit board 1800. For example, the lower portion, lower end, or lower surface of the lens module 1400 may be coupled, attached, or fixed to the upper surface of the holder 1600 or the upper surface of the first circuit board 1800. Alternatively, for example, the lens module 1400 may be coupled, attached, or fixed to the cover member 1300.

[0921] With the development of camera technology, image resolution has increased, and therefore the size of image sensors has increased. Because the size of image sensors has increased, the size of lens modules and the actuators used to move the lens modules have also increased. As a result, not only the weight of the lens modules but also the weight of other actuator components used to move the lens modules has increased.

[0922] According to an embodiment of the present invention, an AF operation unit (or a first actuator) 1100 operating in a lens shift manner is used to perform autofocus, and an image sensor unit (or a second actuator) 1350 operating in an image sensor shift manner is used to perform optical image stabilization (OIS), thereby improving the reliability of the camera device.

[0923] This embodiment can perform 5-axis grip correction using sensor shifting. For example, 5-axis grip may include two angular grips (e.g., pitch and yaw), two shift grips (e.g., x-axis shift and y-axis shift), and one rotational grip (e.g., roll).

[0924] Figure 50 illustrates a controller 820 according to one embodiment. Figure 51 illustrates one embodiment of a correction value stored in memory 1512. Figure 52 is a view illustrating a method for setting the correction value shown in Figure 51.

[0925] Referring to Figures 50 to 52, the controller 830 may include a correction unit 812 and a drive unit 813. The controller 830 may further include an analog-to-digital converter 811.

[0926] The controller 830 may receive the output of the OIS position sensor. The controller 830 may receive the correction value CV stored in the memory 1512. For example, the OIS position sensor may be a first sensor 1240a, a second sensor 1240b, or a third sensor 1240c.

[0927] For example, the output of an OIS position sensor can be an analog signal or a digital signal.

[0928] For example, when the OIS position sensor consists only of a Hall sensor, the output of the OIS position sensor may be an analog signal, and the controller 830 may further include an analog-to-digital converter 811 configured to convert the output of the OIS position sensor (which is an analog signal) into a digital signal (or digital value). In the following, the digital value may be alternatively referred to as a "digital code".

[0929] For example, when the OIS position sensor is a driver IS that includes a Hall sensor, the output of the OIS position sensor can be a digital signal or a digital value, and the analog-to-digital converter 811 can be omitted.

[0930] The calibration unit 812 can calibrate the output of the OIS position sensor based on the calibration value CV received from the memory 1512.

[0931] For example, the correction unit 812 may output a result CS obtained by subtracting the correction value CV from the output of the OIS position sensor. In another embodiment, the correction unit 812 may output a result obtained by adding the correction value CV to the output of the OIS position sensor. This is done to eliminate the output of the OIS position sensor caused by the influence or interference of the magnetic field of the OIS coil 1230. Here, the OIS coil 1230 may be a coil corresponding to the OIS position sensor. For example, the first OIS coil unit 1230-1 may correspond to the first sensor 1240a, the second OIS coil unit 1230-2 may correspond to the second sensor 1240b, and the third OIS coil unit 1230-3 may correspond to the third sensor 1240c.

[0932] For example, although the correction unit 812 may include at least one of a logic gate, a comparator, a subtractor, and an adder, the present invention is not limited thereto. The correction unit 812 may have any other configuration, as long as it has a circuit configuration capable of changing or correcting the output of the OIS position sensor based on the correction value CV.

[0933] The drive unit 813 can receive the output CS of the correction unit 812, control the drive signal DS for driving the OIS coil 1230 corresponding to the OIS position sensor based on the output received by the correction unit 812, and supply the controller drive signal DS to the OIS coil 1230.

[0934] Referring to Figure 51, the memory 1512 can store correction values ​​corresponding to the drive values ​​used to drive the OIS coils 1230-1, 1230-2, and 1230-3. The correction values ​​can be stored in the form of a lookup table. Here, the drive values ​​can be alternatively referred to as "drive code values", "code values", or "control values".

[0935] The driving values ​​used to drive OIS coils 1230-1, 1230-2, and 1230-3 may include driving code values ​​(A1 to An, where n is a natural number or a rational number greater than 1) corresponding to the OIS stroke range. For example, the driving value may be a bit value or bit code, which consists of K bits (K, for example, a natural number or a rational number greater than 1). Here, the OIS stroke may be the displacement of the OIS movable part in a direction perpendicular to the optical axis, and the OIS stroke range may be the range (or area) of movement of the OIS movable part in a direction perpendicular to the optical axis.

[0936] The correction value may include the correction code value (C1 to Cn) corresponding to the driving code value (A1 to An, where n is a natural number or a rational number greater than 1).

[0937] When a drive current is applied to an OIS coil (e.g., 1230-1) corresponding to drive values ​​A1 to An under conditions where a magnet (e.g., 1023A to 1023D) is absent, a magnetic field can be generated from the OIS coil (e.g., 1230-1) by the applied drive current. The OIS position sensor (e.g., 1240a) can output an output (or output signal) corresponding to the detection result of the magnetic field of the OIS coil (e.g., 1230-1).

[0938] Here, the output of the first sensor 1240a can be caused by a magnetic field generated by the applied drive current. Since the magnetic field is an undesirable factor that hinders proper OIS operation, it is preferable to eliminate the magnetic field for the purpose of proper OIS operation.

[0939] The correction values ​​C1 to Cn can be set based on the output of the first sensor 1240a. For example, the correction values ​​C1 to Cn can be the output of the position sensor corresponding to the detection result of the magnetic field of the OIS coil (e.g., 1230-1), and can be digital values.

[0940] Although FIG52 illustrates the first sensor 1240a and the first OIS coil 1230-1 corresponding to the first sensor 1240a, its description can be applied to the second sensor 1240b and the second OIS coil 1230-2 corresponding to the second sensor 1240b, as well as the third sensor 1240c and the third OIS coil 1230-3 corresponding to the third sensor 1240c.

[0941] For example, although memory 1512 may include lookup tables storing correction values ​​corresponding to the first to third OIS position sensors 1240a, 1240b, and 1240c respectively, the invention is not limited thereto. In another embodiment, it is possible to use a single lookup table as shown in FIG52 to correct the individual outputs of the first to third sensors 1240a, 1240b, and 1240c.

[0942] FIG53 illustrates another embodiment of the correction value CV1 stored in memory 1512. FIG54 is a view illustrating a method for setting the correction value CV1 shown in FIG53. Although the correction value CV is set to a state where magnets 1023A to 1023D are removed from the camera module 1010 in FIG52, the correction value CV1 can be set to a state where magnets 1023A to 1023D are provided in the camera module 1010 in FIG54.

[0943] First, at the initial position of the OIS movable part, the OIS position sensor (e.g., 1240a) can detect the strength of the magnetic field of the magnet (e.g., 1023A) corresponding to the OIS position sensor (e.g., 1240a) and can output an output corresponding to the detection result. The digital value M1 or digital code corresponding to the output of the OIS position sensor (e.g., 1240a) at the initial position of the OIS movable part can be stored in memory 1512.

[0944] M1 can be the output of the OIS position sensor (e.g., 1240a) caused by the magnetic field of the magnet (e.g., 1023A) when no driving signal is applied to the OIS coils 1230-1 to 1230-4.

[0945] For example, the output of the OIS position sensor at the initial position of the OIS movable part can be a digital value, and the digital value can be converted from an analog signal.

[0946] For example, the correction value CV1 can be called the "first correction value", and M1 can be called the "second correction value". The memory 1512 can store the first correction value CV1 and the second correction value M1 therein. The first correction value CV1 and the second correction value M1 can be digital values ​​or digital codes, and can be stored in the memory 1512 in the form of a lookup table.

[0947] Subsequently, the magnet (e.g., 1023A) provided in the camera module 1010 can be fixed so that it cannot be moved by means of a fixing device such as a clamp. When a drive current corresponding to the drive value A1 to An is applied to the OIS coil (e.g., 1230-1), a magnetic field can be generated from the OIS coil by the drive current applied to the OIS coil (e.g., 1230-1).

[0948] The position sensor (e.g., 1240a) can output an output (or output signal) corresponding to the detection results of the first magnetic field and the second magnetic field.

[0949] For example, the first magnetic field may be the magnetic field of a magnet (e.g., 1023A) at the initial position of the movable part of the OIS, and the second magnetic field may be the magnetic field of the OIS coil (e.g., 1230-1) generated by the drive current corresponding to the drive values ​​A1 to An.

[0950] The first correction value CV1 can be set based on the output of the first sensor 1240a. For example, the first correction value CV1 can be the output of the OIS position sensor (e.g., 1240a) corresponding to the detection result of the magnetic field of the magnet (e.g., 23A) at the initial position of the OIS movable part and the magnetic field of the OIS coil (e.g., 1230-1) generated by the drive current corresponding to the drive values ​​A1 to An, and can be a digital value.

[0951] For example, the first correction values ​​B1 to Bn may be values ​​obtained by adding the output of the OIS position sensor (e.g., 1240a) caused by the first magnetic field to the output of the OIS position sensor (e.g., 1240a) caused by the second magnetic field.

[0952] In another embodiment, memory 1512 may store a third correction value therein. The third correction value may be one of the values ​​(B1-M1 to Bn-M1) obtained by subtracting the second correction value M1 from the first correction value CV1.

[0953] Although FIG53 illustrates the first sensor 1240a and the first OIS coil 1230-1 corresponding to the first sensor 1240a, its description may be applied to the second sensor 1240b and the second OIS coil 1230-2 corresponding to the second sensor 1240b, and the third sensor 1240c and the third OIS coil 1230-3 corresponding to the third sensor 1240c, with or without modifications.

[0954] FIG55 illustrates the placement of an OIS position sensor 1240a according to another embodiment. The description of the OIS position sensor 1240a shown in FIG55 may be applied to other sensors 1240b and 1230c with or without modifications.

[0955] Referring to Figure 55, the OIS position sensor (e.g., 1240a) may be positioned below the corresponding OIS coil (e.g., 1230-1). This is done to reduce the influence of the magnetic field of the OIS coil unit (e.g., 1230-1) on the output of the position sensor.

[0956] For example, the OIS position sensor 1240a may not overlap with the OIS coil unit 1230-1 in the direction perpendicular to the optical axis. For example, the OIS position sensor (e.g., 1240a) may be placed below the second circuit board 1900 and may not overlap with the OIS coil unit (e.g., 1230-1) in the direction perpendicular to the optical axis.

[0957] The embodiment shown in FIG55 may include a retainer 1270-1 instead of the retainer 1270 shown in FIG39A.

[0958] The holder 1270-1 may be disposed below the first circuit board 1800. The holder 1270-1 may be disposed to be spaced apart from the first circuit board 1800, and the holder 1270 may be coupled to the second circuit board 1900.

[0959] The holder 1270-1 can accommodate or support the second coil 1230. The holder 1270-1 can be used to support the second coil 1240 so that the second coil 1230 is spaced apart from the second circuit board 1900.

[0960] For example, the lower portion, lower surface or lower end of the retainer 1270-1 may be coupled to the upper portion, upper surface or upper end of the second circuit board 1900.

[0961] The holder 1270-1 may have a hole 1041A corresponding to the OIS position sensor 1240. For example, the holder 1270-1 may have a hole 1041A formed at a position corresponding to each of the first sensor 1240a, the second sensor 1240b, and the third sensor 1240c. For example, the hole 1041A may be a through hole formed through the holder 1270-1. The OIS position sensor 1240 may be disposed in the hole 1041A in the holder 1270-1.

[0962] Although the effect of the magnetic field of the OIS coil unit (e.g., 1230-1) on the output of the OIS position sensor is reduced in the embodiment shown in FIG. 55, the output may still be affected by the magnetic field. Therefore, for more accurate OIS feedback operation, the descriptions of FIG. 50 to FIG. 54 and FIG. 56 to FIG. 58 can also be applied to the embodiment shown in FIG. 55.

[0963] In another embodiment, the descriptions of Figures 50 to 54 and Figures 54 to 58 may be applied to the embodiments shown in Figures 1 to 27 with or without modifications.

[0964] Figure 56 illustrates a controller 830A according to another embodiment.

[0965] Referring to FIG56, the controller 830A may include a correction unit 812A, an analog-to-digital converter (ADC) 811A, a drive unit 813, and a digital-to-analog converter (DAC) 814.

[0966] When the output of the first sensor 1240a is an analog signal (e.g., analog voltage or current), the correction unit 812A can receive the output of the OIS position sensor 1240a, which is an analog signal.

[0967] The digital-to-analog converter (DAC) 814 can receive correction values ​​CV and CV1 from memory 1512 and can use the received correction values ​​CV and CV1 to generate an analog signal AS.

[0968] The calibration unit 812A can receive the output of the OIS position sensor (e.g., 1240a) and the output of the digital-to-analog converter 814, which correspond to the drive values ​​(e.g., A1 to An).

[0969] For example, the correction unit 812A can output the difference between the output of the OIS position sensor (e.g., 1240a) and the output of the digital-to-analog converter 814.

[0970] For example, the correction unit 812A can output the result CS1 obtained by subtracting the output AS of the digital-to-analog converter 814 from the output HT of the OIS position sensor (e.g., 1240a). For example, the correction unit 812A can be implemented as a comparator, a differential amplifier, an operational amplifier, etc.

[0971] For example, the correction unit 812A can perform differential amplification of the output HT of the OIS position sensor (e.g., 1240a) and the output AS of the digital-to-analog converter 814, and can output a differential amplified signal CS1.

[0972] The analog-to-digital converter 811A can perform analog-to-digital conversion on the output CS1 of the correction unit 812A, and can output a digital value DCS or digital code corresponding to the result of the analog-to-digital conversion.

[0973] The drive unit 813 can receive the output DCS of the analog-to-digital converter 811A, and can control the drive signal DS for activating the OIS coil 230 corresponding to the OIS position sensor based on the received output DCS, and can supply the controlled drive signal DS to the OIS coil 230.

[0974] The descriptions in Figures 50 and 56 can be applied to other position sensors 1240b and 1240c.

[0975] Figure 57 is a flowchart illustrating the operation of controllers 830, 830A according to one embodiment.

[0976] Referring to FIG57, controllers 830 and 830A apply or supply a drive signal corresponding to a drive value (e.g., A2) for moving the OIS drive unit (e.g., image sensor 1810) to a target position within the OIS stroke range to the OIS coil unit (e.g., 1230-1) (S1110).

[0977] Controllers 830 and 830A receive the output of the OIS position sensor (e.g., 1240a) corresponding to the OIS coil unit (e.g., 1230-1) (S1120).

[0978] The controllers 830 and 830A receive a correction value (e.g., C2) corresponding to the drive value (e.g., A2) from the memory 1512 (S1130).

[0979] Controllers 830 and 830A correct the output of the OIS position sensor (e.g., 1240a) based on the correction value (e.g., H2) (S1140).

[0980] For example, controllers 830 and 830A can subtract a correction value (e.g., C2) from the output of an OIS position sensor (e.g., 1240a) and can output the result of the subtraction.

[0981] Figure 58 is a table illustrating an embodiment of correcting the output of an OIS position sensor (e.g., 1240a). Figure 58 can be obtained using the lookup table shown in Figure 51.

[0982] Referring to Figure 58, controllers 830 and 830A can subtract correction values ​​C1 to Cn stored in a lookup table from the outputs H1 to Hn of the OIS position sensors (e.g., 1240a) corresponding to drive values ​​A1 to An, and can output the result of the subtraction (H1-C1 to Hn-Cn).

[0983] Figure 59 is a table illustrating another embodiment of the output of a calibrated OIS position sensor (e.g., 1240a). Figure 59 can utilize the lookup table shown in Figure 53.

[0984] Referring to FIG59, controllers 830 and 830A can use the first correction values ​​B1 to Bn and the second correction value stored in the lookup table to correct the outputs H1 to Hn of the OIS position sensor (e.g., 1240a) corresponding to the drive values ​​A1 to An, and can output the correction result.

[0985] For example, controllers 830 and 830A can subtract first correction values ​​B1 to Bn from the outputs H1 to Hn of OIS position sensors (e.g., 1240a) corresponding to drive values ​​A1 to An, and can output values ​​H1-B1+M1 to Hn-Bn+M1 obtained by adding the second correction value M1 to the result of the subtraction.

[0986] In another embodiment, controllers 830, 830A may use the third correction value shown in FIG53 to correct the outputs H1 to Hn of the OIS position sensors (e.g., 1240a) corresponding to drive values ​​A1 to An, and may output the correction result.

[0987] For example, controllers 830 and 830A can subtract third correction values ​​B1 to Bn from the outputs H1 to Hn of OIS position sensors (e.g., 1240a) corresponding to drive values ​​A1 to An, and can output the result of the subtraction.

[0988] Controllers 830 and 830A use the calibrated output of the OIS position sensor (e.g., 1240a) to control the drive value or drive signal used to start the OIS coil (S1150).

[0989] Memory 1512 can store the code value of the output of the OIS position sensor corresponding to or matching the displacement of the movable part of OIS for use in OIS feedback operation.

[0990] For example, memory 1512 may store the code value of the output of the OIS position sensor (which corresponds to or matches the displacement of the OIS movable part in the x-axis direction) and the code value of the output of the OIS position sensor (e.g., the second sensor 1240b) (which corresponds to or matches the displacement of the OIS movable part in the y-axis direction).

[0991] Alternatively, for example, memory 1512 may store code values ​​of the output of an OIS position sensor (e.g., a third sensor 1240c) that correspond to or match the displacement of the movable part of the OIS in the x-axis direction or in the y-axis direction.

[0992] Figure 60 illustrates a view of the code values ​​Code_1 to Code_n output by the first sensor 1240a, which correspond to or match the displacements DP1 to DPn of the movable part of the OIS in the x-axis direction.

[0993] When a drive signal is supplied to the coil unit (e.g., 1230-1) via drive values ​​A1 to An through simulation or experiment, the movable part of the OIS moves, and a code value (or "coordinate code value") is obtained from the output of the first sensor 1240a that matches the displacement of the movable part of the OIS. This procedure is called "calibration".

[0994] Furthermore, through calibration, it is possible to obtain the code value of the output of the second sensor 1240b, which corresponds to or matches the displacement of the movable part of the OIS in the y-axis direction.

[0995] The displacement of the movable part of the OIS can be defined or determined by the coordinate code values ​​generated through calibration, and the reliability of the coordinate code values ​​can be ensured through repeated simulations and experiments. OIS feedback operations can be performed based on reliable coordinate code values.

[0996] For example, controllers 830 and 830A can compare the output of an OIS position sensor (e.g., 1240a) calibrated in the manner illustrated in Figures 51 to 53 with the coordinate code values ​​Code_1 to Code_n shown in Figure 60, and can control the drive value or drive signal used to start the OIS coil based on the comparison result.

[0997] In another embodiment, the correction value CV shown in FIG51 or the first, second, or third correction value shown in FIG53 can be applied to the coordinated code value generated via calibration. In other words, it is possible to correct or adjust the coordinate code value generated via calibration, and it is possible to use the calibrated coordinate code value to control the drive value or drive signal used to start the OIS coil.

[0998] For example, it is possible to set a new coordinate code value by subtracting the correction value CV (or the third correction value) from the coordinate code values ​​Code_1 to Code_n generated by calibration, and use the newly set coordinate code value to control the drive value or drive signal used to start the OIS coil.

[0999] As illustrated in Figures 39A, 39B and 45, the OIS coil units 1230-1 to 1230-4 and the OIS position sensors 1240a to 1240c can be placed or mounted on the first surface 1051A of the third circuit board 1250.

[1000] For example, an OIS coil unit (e.g., 1230-1) may have an opening or hole formed in its center, and an OIS position sensor (e.g., 1240a) may be disposed in the OIS coil unit (e.g., 1230-1) in an opening or hole corresponding to the OIS position sensor (e.g., 1240a).

[1001] For example, the OIS position sensor (e.g., 1240a) may overlap with the OIS coil unit (e.g., 1230-1) corresponding to the OIS position sensor (e.g., 1240a) in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the second circuit board 1900.

[1002] As described above, OIS coil units 1230-1 to 1230-4 and OIS position sensors 1240a to 1240c corresponding to OIS coil units 1230-1 to 1230-4 respectively may be placed adjacent to the first surface 1051A of the third circuit board 1250.

[1003] When a drive signal is applied to the OIS coil unit (e.g., 1230-1) for OIS operation, a magnetic field can be generated from the OIS coil unit (e.g., 1230-1). In order to perform accurate OIS feedback operation, the output of the OIS position sensor 1240a must correspond only to the detection result of the magnetic field generated by the magnet 1023A fixed to the OIS fixed part. However, because the OIS coil unit 1230-1 and the OIS position sensor 1240a are placed close to each other, the output of the OIS position sensor 1240a can be greatly affected by the magnetic field generated by the OIS coil unit 1230-1, and therefore the accuracy and reliability of the OIS feedback operation may be degraded.

[1004] Figure 61 illustrates the frequency response characteristics relative to the drive signal input to the OIS coil unit (e.g., 1230-1) and the output of the OIS position sensor (e.g., 1240a). In Figure 61, the X-axis indicates the frequency, and the Y-axis indicates the gain.

[1005] Referring to Figure 61, in an OIS coil unit (e.g., 1230-1), due to the influence of the magnetic field, phenomenon 1038A (referred to as the "cabri phenomenon") may occur, in which the output of the OIS position sensor abnormally increases or decreases in the frequency range between 200 Hz and 300 Hz.

[1006] In an embodiment, by correcting or eliminating the effect of the magnetic field generated from the OIS coil unit on the output of the OIS position sensor (e.g., 1240a) during OIS operation, it is possible to prevent the occurrence of the aforementioned cabri phenomenon and to perform OIS feedback operation accurately and reliably, thereby potentially ensuring the reliability of the handshake correction performed by the camera module.

[1007] Furthermore, since it is possible to ensure the reliability of OIS feedback operation by means of the technology used to calibrate the output of the OIS position sensor (even when the OIS position sensor and the OIS coil unit are placed close to each other), it is possible to improve the freedom of placing the OIS position sensor and the OIS coil unit, reduce the mechanical height of the camera module, and ensure sufficient space for placing other components on the third circuit board 1250.

[1008] The camera module 10 or 20 according to this embodiment may be included in an optical instrument designed to form an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc. (which are properties of light), to expand vision, record or reproduce images obtained through a lens, perform optical measurements, or transmit or propagate images. For example, although the optical instrument according to the embodiment may be a mobile phone, a cell phone, a smartphone, a portable smart device, a digital camera, a laptop computer, a digital broadcast terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation device, etc., the present invention is not limited thereto. Furthermore, any device capable of capturing images or photographs is possible.

[1009] FIG62 is a perspective view illustrating an optical device 200A according to an embodiment. FIG63 is a view illustrating the configuration of the optical device illustrated in FIG62.

[1010] Referring to Figures 62 and 63, the optical device 200A may include a body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a controller 780, and a power supply unit 790.

[1011] The body 850 illustrated in Figure 62 has a rod shape, but is not limited thereto, and can be any of various types, such as sliding type, folding type, swinging type or rotating type, wherein two or more sub-bodies are coupled so that they can move relative to each other.

[1012] The body 850 may include a housing (cover, shell, plate, etc.) that defines the external appearance of the terminal. For example, the body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be accommodated in the space defined between the front housing 851 and the rear housing 852.

[1013] The wireless communication unit 710 may include one or more modules that enable wireless communication between the optical device 200A and the wireless communication system or between the optical device 200A and the network in which the optical device 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[1014] The A / V input unit 720 is used to input audio or video signals and may include, for example, a camera 721 and a microphone 722.

[1015] According to this embodiment, camera 721 may include camera module 10, 20 or 1010.

[1016] The sensing unit 740 can sense the current state of the optical device 200A, such as whether the optical device 200A is on or off, the position of the optical device 200A, the presence of user touch, the orientation of the optical device 200A, or the acceleration / deceleration of the optical device 200A, and can generate sensing signals to control the operation of the optical device 200A. When the optical device 200A is, for example, a slider cellular phone, the sensing unit 740 can sense whether the slider cellular phone is on or off. In addition, the sensing unit 740 can sense the power supply from the power supply unit 790, the coupling from the interface unit 770 to external devices, etc.

[1017] The input / output unit 750 is used to generate, for example, visual, audible, or tactile inputs or outputs. The input / output unit 750 can generate input data to control the operation of the optical device 200A, and can display information processed in the optical device 200A.

[1018] The input / output unit 750 may include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 can generate input data in response to input on the keypad.

[1019] The display module 751 may include a plurality of pixels whose colors vary depending on the electrical signals applied thereto. For example, the display module 751 may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display.

[1020] The audio output module 752 can output audio data received from the wireless communication unit 710 in, for example, call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or can output audio data stored in the memory unit 760.

[1021] The touch screen panel 753 can convert the capacitance change caused by a user touching a specific area of ​​the touch screen into an electrical input signal.

[1022] The memory unit 760 may temporarily store programs and input / output data (e.g., telephone numbers, messages, audio data, fixed images, moving images, etc.) used for processing and controlling the controller 780. For example, the memory unit 760 may store images captured by the camera 721, such as images or moving images.

[1023] The interface unit 770 acts as a path for the lens moving device to connect to an external device connected to the optical device 200A. The interface unit 770 can receive power or data from external components and can transmit power or data to individual components inside the optical device 200A, or can transmit data inside the optical device 200A to external components. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, an earphone port, etc.

[1024] The controller 780 can control the general operation of the optical device 200A. For example, the controller 780 can perform control and processing related to, for example, voice calls, data communications, and video calls.

[1025] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the controller 780 or may be implemented separately from the controller 780.

[1026] The controller 780 can perform a pattern recognition process that can recognize write input or drawing input on the touch screen as characters and images, respectively.

[1027] The power supply unit 790 can supply the power required to operate each component when receiving external or internal power under the control of the controller 780.

[1028] The features, configurations, effects, etc., described in the embodiments above are included in at least one embodiment, but the present invention is not limited to these embodiments. In addition, the features, configurations, effects, etc., illustrated in other embodiments may be combined with other embodiments or modified by those skilled in the art. Therefore, the contents related to such combinations and modifications should be considered to fall within the scope of the present invention.

[1029] As is apparent from the above description, since the embodiments are constructed such that the OIS position sensor is positioned to avoid overlapping with the OIS coil unit in a direction perpendicular to the optical axis, it is possible to red...

Claims

1. A camera module comprising: a fixed portion including a magnet; and a movable portion including: A first circuit board spaced apart from the fixed portion; A position sensor is mounted on the first circuit board; A coil is positioned to face the magnet; and a spacer is positioned between the first circuit board and the coil; wherein the movable portion moves in a direction perpendicular to an optical axis by the interaction between the magnet and the coil; wherein the spacer has a hole, and the position sensor is positioned such that at least a portion of it is disposed in the hole in the spacer and overlaps with the magnet in an optical axis direction; wherein the coil is disposed on an upper surface of the spacer; and wherein the coil does not overlap with the hole in the spacer in the direction perpendicular to the optical axis direction.

2. The camera module of claim 1, wherein the hole in the spacer overlaps with at least a portion of the coil in the optical axis direction.

3. The camera module of claim 1, wherein the position sensor does not overlap with the coil in the optical axis direction.

4. The camera module of claim 1, wherein the coil has a hole formed in a center therein, and the hole in the spacer overlaps with the hole in the coil in the optical axis direction.

5. The camera module of claim 1, wherein the position sensor overlaps with both the hole in the coil and the hole in the spacer in the optical axis direction.

6. The camera module of claim 1, wherein a space is defined between the magnet and the position sensor.

7. The camera module of claim 1 further includes a resilient support member coupled to both the fixed portion and the movable portion.

8. The camera module of claim 7, wherein the fixed portion includes a second circuit board, and the resilient support member electrically connects the first circuit board to the second circuit board.

9. The camera module of claim 1, wherein the coil is coupled to the spacer and electrically connected to the first circuit board.

10. A camera module comprising: a lens; an image sensor disposed at a position corresponding to the lens; a drive unit configured to move the image sensor; a circuit board disposed spaced apart from the lens; a position sensor disposed on the circuit board; and a spacer disposed on the circuit board, wherein the drive unit includes a magnet and a coil facing the magnet, wherein the spacer is disposed between the circuit board and the coil to space the coil apart from the position sensor, and wherein the image sensor moves in a direction perpendicular to an optical axis by an interaction between the magnet and the coil; the coil is disposed on an upper surface of the spacer; and the coil does not overlap with the position sensor in the direction perpendicular to the optical axis.

11. A camera module comprising: a fixed portion including a magnet; A movable portion includes: a first circuit board disposed spaced apart from the fixed portion; a holder disposed on the first circuit board; a coil disposed on the holder to face the magnet; a position sensor disposed on the first circuit board to face the magnet; and a support member coupled to both the fixed portion and the movable portion, wherein the movable portion moves in a direction perpendicular to an optical axis by means of the interaction between the magnet and the coil, and the coil does not overlap with the coil in the direction perpendicular to the optical axis.

12. The camera module of claim 11, wherein the position sensor is mounted on the first circuit board and does not overlap with the coil in the optical axis direction.

13. The camera module of claim 11, wherein the fixed portion includes a second circuit board positioned to be spaced apart from the first circuit board.

14. The camera module of claim 13, wherein the support member is coupled to the second circuit board at one end and to the first circuit board at the other end.

15. The camera module of claim 14, wherein the support member connects the first circuit board to the second circuit board.

16. The camera module of claim 11, wherein the coil has a hole formed in its center, and the position sensor is disposed below the hole in the coil and overlaps with the hole in the coil in the optical axis direction.

17. The camera module of claim 11, wherein the holder has a through hole corresponding to the position sensor in the optical axis direction, and the position sensor is disposed in the through hole in the holder.

18. The camera module of claim 11, wherein the holder includes a coupling protrusion projecting from its upper surface, and the coil is coupled to the coupling protrusion.

19. The camera module of claim 11, wherein the movable part includes an image sensor mounted on the first circuit board.

20. The camera module of claim 11, wherein the four corners of the first circuit board have protrusions that protrude from the lateral side surface of the first circuit board, and the lower surface of the holder has a mounting groove in which the protrusions of the first circuit board are placed.

21. The camera module of claim 11, wherein the coil includes first coil units to fourth coil units respectively disposed at a first corner to a fourth corner of the holder, wherein the magnet includes: A first magnet, corresponding to the first coil unit; a second magnet, corresponding to the second coil unit; A third magnet, which corresponds to the third coil unit; and a fourth magnet corresponding to the fourth coil unit, wherein the position sensor includes: a first sensor disposed below the first coil unit; a second sensor disposed below the second coil unit; and a third sensor disposed below the third coil unit.

22. The camera module of claim 21, wherein the first coil unit through the fourth coil unit are individually activated.

23. The camera module of claim 21, wherein the first coil unit to the third coil unit are individually activated, and the fourth coil unit is activated together with one of the first coil unit to the third coil unit.

24. A camera module comprising: a fixed portion including a magnet; And a movable portion comprising: a first circuit board disposed spaced apart from the fixed portion; a coil disposed facing the magnet; a holder disposed between the first circuit board and the coil; and a position sensor disposed on the first circuit board facing the magnet, wherein the coil has a first hole, and wherein the holder has a second hole formed at a position corresponding to one of the first holes, and at least a portion of the position sensor is disposed in the second hole in the holder.

Images