3D interposer with through glass vias – method of increasing adhesion between copper and glass surfaces and articles therefrom

Abstract

In some embodiments, the method includes forming a pilot hole or damage track through a laminated glass structure using a laser. The laminated glass structure includes a first layer and a second layer adjacent to the first layer. The first layer is formed of a first glass composition. The second layer is formed of a second glass composition different from the first glass composition. After forming the pilot hole, the laminated glass structure is exposed to etching conditions in which the first glass composition is etched at a first etch rate and the second glass composition is etched at a second etch rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.

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